WO2012077558A1 - 電子放出素子、電子放出装置、帯電装置、画像形成装置、電子線硬化装置自発光デバイス、画像表示装置、送風装置、冷却装置、および電子放出素子の製造方法 - Google Patents
電子放出素子、電子放出装置、帯電装置、画像形成装置、電子線硬化装置自発光デバイス、画像表示装置、送風装置、冷却装置、および電子放出素子の製造方法 Download PDFInfo
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- H—ELECTRICITY
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- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
- H01J1/312—Cold cathodes, e.g. field-emissive cathode having an electric field perpendicular to the surface, e.g. tunnel-effect cathodes of Metal-Insulator-Metal [MIM] type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/385—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material
- B41J2/39—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material using multi-stylus heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/385—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material
- B41J2/41—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material for electrostatic printing
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/02—Apparatus for electrographic processes using a charge pattern for laying down a uniform charge, e.g. for sensitising; Corona discharge devices
- G03G15/0291—Apparatus for electrographic processes using a charge pattern for laying down a uniform charge, e.g. for sensitising; Corona discharge devices corona discharge devices, e.g. wires, pointed electrodes, means for cleaning the corona discharge device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
- H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
- H01J31/123—Flat display tubes
- H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
- H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J63/00—Cathode-ray or electron-stream lamps
- H01J63/02—Details, e.g. electrode, gas filling, shape of vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J63/00—Cathode-ray or electron-stream lamps
- H01J63/06—Lamps with luminescent screen excited by the ray or stream
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
- H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133625—Electron stream lamps
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K5/00—Irradiation devices
- G21K5/02—Irradiation devices having no beam-forming means
Definitions
- the present invention relates to an electron-emitting device that emits electrons by applying a voltage.
- Field electron emission applies a voltage between two electrodes to emit electrons. This is a method in which electrons are emitted from one electrode (emitter) by a tunnel effect by forming a high electric field between both electrodes by this applied voltage.
- field electron emission devices such as Spindt type and carbon nanotube (CNT) type are known.
- an electron-emitting device using field electron emission is generally used after being sealed in a vacuum.
- an electron transmission window that separates the vacuum layer from the atmosphere so that the electrons are transmitted from the vacuum layer to the atmosphere.
- an electron-emitting device called an MIM type or an MIS type is known as an electron-emitting device that can be stably operated in the atmosphere (see Patent Document 1).
- the MIM type electron-emitting device is composed of three layers: a thin film metal electrode, an insulator layer, and a metal electrode substrate.
- the MIS type electron-emitting device is composed of three layers: a thin film metal electrode, an insulator layer, and a semiconductor electrode substrate.
- the insulator layer is hereinafter referred to as an electron acceleration layer.
- MIM-type and MIS-type electron-emitting devices and electron-emitting devices using field electron emission are the same in that electrons are accelerated by an electric field formed between electrodes and electrons are emitted outside the device. .
- it differs greatly from an electron-emitting device using field electron emission in that the electric field formed is limited within the device.
- the fact that the electric field generated during operation is limited within the device enables stable operation of the MIM type and MIS type electron-emitting devices in the atmosphere.
- the MIM type and MIS type electron-emitting devices can operate stably in the atmosphere and are surface-emitting type electron-emitting devices.
- An object of the present invention is to provide an electron-emitting device having a high electron-emitting efficiency, in which the amount of current in the device is small even when the amount of electron emission is large.
- An electron-emitting device includes an electrode substrate and a thin film electrode, and a voltage is applied between the electrode substrate and the thin film electrode, whereby electrons are generated between the electrode substrate and the thin film electrode.
- An electron-emitting device that is accelerated and emitted from the thin-film electrode, Between the electrode substrate and the thin film electrode, an electron acceleration layer composed of at least insulating fine particles is provided, The surface on which the electron acceleration layer of the electrode substrate is provided has irregularities, An opening is formed in the thin film electrode on the convex portion of the electrode substrate.
- the electron-emitting device having the above configuration, when a voltage is applied between the electrode substrate and the thin film electrode, an electric field is formed in the electron acceleration layer, and at the same time, electrons flow as a current bearer. A part of the electrons are accelerated by the electric field formed by the applied voltage, emitted as ballistic electrons from the electron acceleration layer, pass through the opening formed in the thin film electrode, or tunnel through the thin film electrode. From the side to the outside of the device.
- Ballistic electrons emitted from the electron acceleration layer are emitted to the outside of the device through one of two processes of passing through the opening of the thin film electrode or tunneling with the thin film electrode.
- the amount of electron emission to the outside of the device is significantly reduced depending on the tunnel probability depending on the thickness of the thin film electrode.
- a flat electron acceleration layer is formed on an electrode substrate having irregularities during the manufacture of the electron-emitting device
- a thick electron acceleration layer is formed on the concave portion of the electrode substrate.
- a thin electron acceleration layer is formed on the convex portion of the electrode substrate.
- This electron field causes dielectric breakdown of the electron acceleration layer on the convex portion of the electrode substrate.
- an opening corresponding to the shape of the convex portion of the electrode substrate is formed in the thin film electrode. Since the electrode substrate can be formed with irregularities in any shape, the shape of the opening formed in the thin film electrode can also be arbitrarily formed.
- the opening can be easily formed in the thin film electrode with good controllability. Further, by providing an opening in the thin film electrode of the electron-emitting device, the electron emission efficiency can be improved as compared with a conventional electron-emitting device that does not have an opening.
- Electron emission comprising an electrode substrate and a thin film electrode, and accelerating electrons between the electrode substrate and the thin film electrode by applying a voltage between the electrode substrate and the thin film electrode and emitting the electron from the thin film electrode
- a method for manufacturing an element comprising: Forming an electron acceleration layer comprising at least insulating fine particles on the electrode substrate; Forming a thin film electrode on the electron acceleration layer; Forming an opening in the thin film electrode,
- the substrate electrode has irregularities on the surface on which the electron acceleration layer is provided,
- an opening is formed in the thin film electrode on the convex portion of the electrode substrate by applying a voltage between the substrate electrode having the unevenness and the thin film electrode. It is characterized by doing.
- a flat electron acceleration layer is formed on an electrode substrate having irregularities when an electron-emitting device is manufactured
- a thick electron acceleration layer is formed on the recess of the electrode substrate.
- a thin electron acceleration layer is formed on the convex portion of the electrode substrate.
- This electron field causes dielectric breakdown of the electron acceleration layer on the convex portion of the electrode substrate.
- an opening corresponding to the shape of the convex portion of the electrode substrate is formed in the thin film electrode. Since the electrode substrate can be formed with irregularities in any shape, the shape of the opening formed in the thin film electrode can also be arbitrarily formed.
- an opening can be easily formed in the thin film electrode with good controllability.
- an electron-emitting device with improved electron emission efficiency can be manufactured.
- the electron-emitting device according to the present invention has an opening in the thin film electrode, and is effective in improving electron emission efficiency.
- the opening of the thin film electrode can be easily formed with good controllability.
- FIG. 1 is a cross-sectional view showing a configuration of an electron emission device 10 using an electron emission element 1 according to an embodiment of the present invention.
- FIG. 2 is a top view showing a configuration of an electron emission apparatus 10 using the electron emission element 1 of one embodiment according to the present invention.
- an electron emission device 10 includes an electron emission element 1 according to an embodiment of the present invention and a power source 7 (power source unit).
- the electron-emitting device 1 includes an electrode substrate 2 serving as a lower electrode, a thin film electrode 3 serving as an upper electrode, and an electron acceleration layer 4 sandwiched therebetween.
- the electrode substrate 2 has an uneven shape shown in FIG.
- the electron acceleration layer 4 is composed of a layer in which monodispersed insulating fine particles are aligned and filled, that is, an insulating fine particle layer.
- the electron-emitting device 1 having the above structure exhibits semiconductive transport characteristics.
- the power source 7 is a power source for applying a voltage between the electrode substrate 2 and the thin film electrode 3.
- a voltage is applied between the electrode substrate 2 and the thin film electrode 3
- electrons flow in the electron acceleration layer 4 as a current bearer.
- a high electric field is formed in the electron acceleration layer 4 sandwiched between the electrode substrate 2 and the thin film electrode 3 by the applied voltage.
- Electrons flowing between the electrode substrate 2 and the thin film electrode 3 are accelerated by this high electric field, and some of the electrons are emitted from the electron acceleration layer 4 as ballistic electrons.
- Ballistic electrons emitted from the electron acceleration layer 4 pass through the opening 6 formed in the thin film electrode 3 on the convex portion of the electrode substrate 2 or are tunneled through the thin film electrode 3 and emitted outside the device.
- the electron acceleration layer 4 has a thick portion formed on the concave portion of the electrode substrate 2 and a thickness formed on the convex portion of the electrode substrate 2. A thin portion.
- the film thickness of the electron acceleration layer 4 is defined as the thickness of the electron acceleration layer 4 formed on the concave portion of the electrode substrate 2.
- the electrode substrate 2 is an electrode for applying a voltage in the electron acceleration layer 4 in a pair with the thin film electrode 3. In addition to this, it also serves as a support for the electron-emitting device 1. Therefore, the substance used as the electrode substrate 2 is required to have a certain level of strength, good adhesion with a substance that is in direct contact with the substance, and appropriate conductivity. Specific examples of the electrode substrate 2 include metal substrates such as stainless steel, aluminum, titanium, and copper, and semiconductor substrates such as silicon, germanium, and gallium arsenide.
- the height (depth) of the irregularities formed on the surface of the electrode substrate 2 is preferably 50 to 80% with respect to the film thickness of the electron acceleration layer 4.
- the height (depth) of the unevenness on the surface of the electrode substrate 2 is preferably 50 to 80% of the film thickness of the electron acceleration layer 4, so that the electrode substrate can be formed when the opening 6 is formed in the thin film electrode 3. The risk of a short circuit between 2 and the thin film electrode 3 is avoided.
- the shape of the opening 6 is determined in a self-forming manner corresponding to the uneven shape formed on the electrode substrate 2. Therefore, by patterning a pattern desired to be formed as the opening 6 as a convex portion of the electrode substrate 2, the opening 6 having an arbitrary shape, size, and density can be realized.
- the shape and size of the electrode substrate 2 are not limited. However, since there are a large number of openings 6, electrons can be efficiently emitted from the electron-emitting device 1. It is preferable to form a large number in the substrate surface.
- an insulating substrate such as a glass substrate or a plastic substrate can be used as the electrode substrate 2.
- the insulator substrate having a concavo-convex shape formed on the surface functions as a support for the electron-emitting device 1. Therefore, when an insulator substrate is used as the electrode substrate 2, it is necessary to form a conductive substance such as a metal as a thin film electrode on the surface of the concavo-convex insulator substrate (interface with the electron acceleration layer 4).
- the substance to be formed as a thin film electrode is not particularly limited as long as it has excellent conductivity and can form a thin film.
- a conductor having a high antioxidant power as the material for film formation, and it is more preferable to use a noble metal.
- a tin-added indium oxide (ITO) thin film that is widely used for transparent electrodes as an oxide conductive material is also useful.
- a metal thin film in which a titanium film having a thickness of 200 nm and a copper film having a thickness of 1000 nm are stacked may be used as the electrode thin film.
- a metal thin film in which a titanium film having a thickness of 200 nm and a copper film having a thickness of 1000 nm are stacked may be used as the electrode thin film.
- the thin film electrode 3 is an electrode that is paired with the electrode substrate 2 and applies a voltage to the electron acceleration layer 4. Accordingly, the substance used for the conductive electrode 3 is not particularly limited as long as it is conductive and can be applied with voltage. However, in the case where the operating environment of the electron-emitting device 1 is assumed to be in the atmosphere, gold having no oxide and sulfide forming reaction is the optimum material for the thin film electrode 3. In addition, silver, palladium, tungsten, and the like, which have a relatively small oxide formation reaction, are materials that can withstand actual use without problems.
- the thin film electrode 3 is provided with an opening 6 shown in FIGS. Due to the opening 6, ballistic electrons accelerated in the electron acceleration layer 4 are emitted to the outside of the device without having to tunnel through the thin film electrode 3. Therefore, providing the opening 6 in the thin film electrode 3 improves the electron emission efficiency of the electron-emitting device.
- the film thickness of the thin-film electrode 3 is important as a condition for efficiently emitting electrons from the electron-emitting device 1 to the outside, and is preferably in the range of 10 to 55 nm.
- the minimum film thickness for causing the thin film electrode 3 to function as a planar electrode is 10 nm.
- the maximum film thickness of the thin-film electrode 3 allowed to enable electron emission from the electron-emitting device 1 to the outside is 55 nm.
- the film thickness of the thin film electrode 3 is larger than 55 nm, the tunnel probability of ballistic electrons is remarkably reduced, or recapture to the electron acceleration layer 4 occurs due to reflection at the interface with the electron acceleration layer 4. The efficiency of electron emission from the emitter 1 to the outside is reduced.
- the electron acceleration layer 4 only needs to include at least the insulating fine particles 5.
- the diameter (average diameter) of the insulating fine particles 5 is preferably 5 to 1000 nm, and more preferably 15 to 500 nm.
- silicon oxide, aluminum oxide, titanium oxide, and the like are practical.
- colloidal silica manufactured and sold by Nissan Chemical Industries, Ltd. can be used.
- the layer thickness of the electron acceleration layer 4 is preferably 8 to 3000 nm. Thereby, the surface of the electron acceleration layer 4 can be flattened and the resistance value of the electron acceleration layer 4 in the layer thickness direction can be controlled.
- the layer thickness of the electron acceleration layer 4 is more preferably 30 to 1000 nm.
- the manufacturing process of the electron-emitting device 1 includes the formation of uneven shapes on the surface of the electrode substrate 2, the hydrophilic treatment of the electrode substrate 2, the formation of the electron acceleration layer 4, the formation of the thin film electrode 3, and the thin film electrode 3.
- the opening 6 is formed.
- the electrode substrate 2 one of a metal substrate, a semiconductor substrate, and an insulator substrate is used. (Formation of uneven shape on the surface of the electrode substrate 2) An uneven shape is formed on the surface of the electrode substrate 2.
- RIE reactive ion etching
- an electrode substrate 2 is formed by forming a conductive material after forming an uneven shape on the substrate surface.
- the electron acceleration layer 4 is formed on the surface of the electrode substrate 2.
- the electron acceleration layer 4 includes an insulating fine particle layer formed of at least the insulating fine particles 5, and may include conductive fine particles in addition to the insulating fine particles 5.
- the electron-emitting device 1 illustrated in Embodiment 1 includes only an insulating fine particle layer made of the insulating fine particles 5 as the electron acceleration layer 4. The hydrophilic treatment of the electrode substrate 2 and the formation of the insulating fine particle layer will be described below.
- a thin film of insulating fine particles 5 is formed on the electrode substrate 2 using an insulating fine particle dispersion.
- the insulating fine particle dispersion is obtained by dispersing monodispersed insulating fine particles 5 in a solvent such as water.
- a spin coating method is used.
- the electrode substrate 2 is hydrophobic, and the insulating fine particle dispersion is hydrophilic. Since the polarities of the electrode substrate 2 and the insulating fine particle dispersion are different, when the insulating fine particle dispersion is applied onto the bare electrode substrate 2, the insulating fine particle dispersion becomes water repellent on the surface of the electrode substrate 2. Become. Even if spin coating is performed in this state, the insulating fine particles 5 are not deposited on the electrode substrate 2.
- the surface of the electrode substrate 2 is subjected to ultraviolet treatment.
- ultraviolet treatment for example, the surface of the electrode substrate 2 is irradiated with ultraviolet rays for 10 minutes under a degree of vacuum of 20 Pa.
- the solid content concentration of the insulating fine particle dispersion used for spin coating for forming the insulating fine particle layer is preferably 10 wt% or more and 50 wt% or less. If the solid content concentration is less than 10 wt%, the clay of the insulating fine particle dispersion is too low to deposit the insulating fine particles 5 on the electrode substrate 2. On the other hand, when the solid content concentration is higher than 50 wt%, the insulating fine particle dispersion liquid is too high, and the insulating fine particles 5 aggregate. As a result, it is not possible to form a thin film of flat insulating fine particles 5 on the electrode substrate 2.
- the conditions for spin coating the insulating fine particle dispersion on the electrode substrate 2 are not limited. For example, after rotating for 5 seconds at a rotation speed of 500 rotations / minute (rpm), the rotation speed of 3000 to 4500 rpm is maintained for 10 seconds. To do. There is no limitation on the coating amount of the insulating fine particle dispersion, but it may be 0.2 mL / cm 2 or more, for example.
- the film thickness of the insulating fine particle layer formed under these conditions is appropriate for use as the electron-emitting device 1. Further, since the insulator particles 5 are filled flat on the electrode substrate 2, the electron acceleration layer 4 is formed thick in the concave portion and thin in the convex portion of the electrode substrate 2. The surface of the electron acceleration layer 4 has flatness necessary and sufficient for producing the electron-emitting device 1.
- Examples of the insulating fine particle dispersion used for forming the insulating fine particle layer include colloidal silica MP-4540 (average particle size 450 nm, 40 wt%), which is a dispersion of hydrophilic silica manufactured by Nissan Chemical Industries, Ltd., MP -3040 (average particle size 300 nm, 40 wt%), MP-1040 (average particle size 100 nm, 40 wt%), Snowtex 20 (average particle size 15 nm, 20 wt%), and Snowtex SX (average particle size 5 nm, 20 wt%) ).
- colloidal silica MP-4540 average particle size 450 nm, 40 wt%)
- MP-1040 average particle size 100 nm, 40 wt%)
- Snowtex 20 average particle size 15 nm, 20 wt%)
- Snowtex SX Snowtex SX
- the thin film electrode 3 is formed on the surface of the electron acceleration layer 4 by using, for example, a magnetron sputtering method, and the element before the opening is formed is completed.
- a cross-sectional view of the element before the opening is formed is shown in FIG.
- the method for forming the thin film electrode 3 is not limited to the magnetron sputtering method, and for example, an ink jet method, a spin coating method, a vapor deposition method, or the like can be used.
- the thickness of the electron acceleration layer 4 on the convex portion is thinner than the thickness of the electron acceleration layer 4 on the concave portion. Therefore, the electric field strength formed in the electron acceleration layer 4 on the convex portion is stronger than the electric field strength formed on the electron acceleration layer 4 on the concave portion. For this reason, the electron acceleration layer 4 on the convex portion breaks down, and the opening 6 is self-formed in the thin film electrode 3 corresponding to the shape of the convex portion of the substrate electrode 2.
- the opening 6 can be easily formed at any place with good controllability. Therefore, the electron-emitting device 1 in which ballistic electrons are efficiently emitted from the opening 6 can be manufactured.
- Example 1 Examples of the electron-emitting device 1 according to the present invention will be described below.
- the electrode substrate 2 a 25 mm ⁇ 25 mm square aluminum substrate was used. Aluminum was etched by an RIE method using a mixed gas of BCl 3 gas and Cl 2 gas to form an uneven shape with a depth of 600 nm on the surface of the electrode substrate 2. The planar shape of the convex portion was a square and the area was 0.01 mm 2 . Furthermore, as a hydrophilic treatment of the substrate electrode 2, ultraviolet rays were irradiated for 10 minutes under a degree of vacuum of 20 Pa.
- colloidal silica MP-1040 (average particle diameter: 100 nm, 40 wt%) manufactured by Nissan Chemical Industries, Ltd. was dropped onto the electrode substrate 2 as an insulating fine particle dispersion, and applied by spin coating.
- the spin coating conditions are as follows. The number of revolutions was increased from 0 revolutions / minute (rpm) to 3000 rpm over 5 seconds, and then held at 3000 rpm for 10 seconds.
- an electron acceleration layer 4 having an insulating particle layer in which monodispersed insulating fine particles 5 are aligned and filled is obtained.
- the film thickness of the electron acceleration layer 4 formed here was 900 nm.
- a thin film electrode 3 was formed on the surface of the electron acceleration layer 4 using a magnetron sputtering apparatus. Gold was used as a film forming material for the thin film electrode 3, the film thickness of the thin film electrode 3 was 40 nm, and the area was 0.01 cm 2 .
- the electron-emitting device 1 manufactured by the method described above includes a large number of openings 6 in the thin film electrode 3 and a flat surface of the electron acceleration layer 4 in association with a large number of irregularities on the surface of the electrode substrate 2. By providing, it was confirmed that electrons were efficiently emitted from any position on the entire surface of the electron-emitting device with good controllability. That is, in the electron-emitting device 1, good electron emission characteristics were realized over the entire surface of the device.
- FIG. 4 shows an example of a charging device according to the present invention including the electron emission device 10 according to the embodiment described in the first embodiment.
- the charging device 90 includes an electron emission device 10 including the electron emission element 1 and a power source 7 for applying a voltage thereto, and a photosensitive drum 11.
- the image forming apparatus according to the present invention includes the charging device 90.
- the electron-emitting device 1 in the charging device 90 is installed to face the photosensitive drum 11 that is a member to be charged.
- the electron-emitting device 1 emits electrons and charges the surface of the photosensitive drum 11.
- the electron-emitting devices 1 provided in the charging device 90 are arranged with an interval of, for example, 3 to 5 mm from the surface of the photosensitive drum 11.
- the applied voltage to the electron-emitting device 1 is preferably about 25V.
- the electron acceleration layer 4 in the electron-emitting device 1 may be configured to emit electrons of 1 ⁇ A / cm 2 per unit time when a voltage of 25 V is applied from the power source 7, for example.
- constituent members other than the charging device 90 may be conventionally known ones. Since the electron emission element 1 has a high electron emission efficiency, the charging device 90 charges the photosensitive drum 11 efficiently.
- the electron-emitting device 1 used as the charging device 90 does not form an electric field outside the device, it does not discharge even if it operates in the atmosphere. Therefore, ozone is not generated even when the charging device 90 is used in the atmosphere. Ozone is harmful to the human body and is regulated by various environmental standards. Therefore, the fact that the charging device 90 is not accompanied by the generation of ozone is effective for increasing the degree of freedom in the design of the image forming apparatus.
- the conventional charging device is designed to have a structure in which ozone is not released outside the device, the ozone generated in the device oxidizes and deteriorates organic materials in the device, such as the photosensitive drum 11 and the belt.
- the problem relating to ozone generation in the image forming apparatus can be solved by using the electron emitting device 10 including the electron emitting element 1 according to the present invention for the charging device 90.
- the electron-emitting device 1 provided in the charging device 90 is a surface electron emission source that emits electrons from the entire surface of the device. Therefore, the charging device 90 can be charged with a width with respect to the rotation direction of the photosensitive drum 11. This means that there are many opportunities to charge a specific portion of the photosensitive drum 11.
- the charging device 90 including the surface electron emission source realizes more uniform charging as compared with a wire charger that charges linearly.
- the applied voltage required by the electron-emitting device 1 is about 10V.
- an applied voltage of several kV is required to charge the photosensitive drum.
- the charging device 90 including the electron-emitting device 1 realizes an operation with a remarkably low applied voltage as compared with a wire charger including a corona discharger.
- FIG. 5 shows an example of an electron beam curing device including the electron emission device 10 according to an embodiment of the present invention described in the first embodiment.
- the electron beam curing device 100 includes an electron emission device 10 including an electron emission element 1 and a power source 7 that applies a voltage to the electron emission device 1, and an acceleration electrode 21 that accelerates the emitted electrons.
- the electron beam curing apparatus 100 includes the electron-emitting device 1 as an electron emission source, and accelerates the emitted electrons by the acceleration electrode 21 to collide with the resist 22. As a result, the resist 22 is cured by absorbing the energy of the electron beam.
- the energy required for curing a general resist is 10 eV or less. Since the emitted electrons have an energy of 10 eV or more, it is not necessary to further accelerate the electrons in terms of simply curing the resist. However, it is known that the penetration depth of the electron beam into the resist depends on the energy of the electrons. For example, in order to completely cure the resist 22 having a thickness of 1 ⁇ m in the thickness direction, an acceleration voltage of about 5 kV is required. As described above, the acceleration electrode 21 is required to give necessary and sufficient energy to the emitted electrons according to the film thickness of the resist 22.
- a conventional general electron beam curing apparatus discharges electrons by vacuum-sealing an electron emission source and applying a high voltage (50 to 100 kV) to the electron emission source.
- a high voltage 50 to 100 kV
- the resist is cured in the atmosphere, it is necessary to separately install an electron transmission window that separates the vacuum phase from the atmosphere. Then, after the electrons are transmitted from the vacuum to the atmosphere through the electron transmission window, the irradiated object is irradiated with the electrons.
- this electron irradiation method when emitted electrons are transmitted through the electron transmission window, a large amount of energy is absorbed by the electron transmission window.
- a field emission type element is used as the electron emission source, the electrons reaching the resist have higher energy than necessary.
- the field emission type electron-emitting device is a point electron emission source, the range that can be irradiated at one time is narrow and the throughput is low.
- the electron beam curing device 100 according to the present invention using the electron emission device 10 can operate in the atmosphere and does not need to be vacuum sealed. Moreover, since the electron emission element 1 has high electron emission efficiency, the electron beam curing device 100 can efficiently irradiate the electron beam. Further, since the electron transmission window is not passed, there is no energy loss, and the acceleration voltage for the emitted electrons can be lowered. Further, since it is a surface electron emission source, the throughput is remarkably increased. Further, if electrons are emitted according to the pattern, maskless exposure can be performed.
- FIGS. 6 to 8 show examples of the self-luminous devices 31, 31a, and 31b according to the present invention each including the electron emission apparatus 10 according to the embodiment described in the first embodiment.
- a self-luminous device 31 shown in FIG. 6 includes an electron emitting device 10 including an electron emitting element 1 and a power source 7 that applies a voltage to the electron emitting element 1, and a base material at a position facing the electron emitting element 1 with a predetermined distance.
- a light emitting unit 36 including a glass substrate 34, an ITO thin film 33, and a phosphor 32 (light emitter), and a power source 35 are provided.
- the power source 35 is provided in the self-luminous device 31 in order to apply a voltage between the electrode substrate 2 in the electron-emitting device 1 and the ITO thin film 33.
- an electron excitation type material corresponding to red, green and blue light emission is suitable.
- Y 2 O 3 Eu and (Y, Gd) BO 3 : Eu as red phosphors
- Zn 2 SiO 4 Mn as green phosphors
- BaAl 12 O 19 Mn
- BaMgAl 10 O 17 as blue phosphors : Eu 2+ or the like can be used.
- the thickness of the phosphor 32 formed in the light emitting part 36 is preferably about 1 ⁇ m.
- the thickness of the ITO thin film 33 is no problem as long as the conductivity can be ensured, and is 150 nm in this embodiment.
- a coating liquid made of a kneaded product of an epoxy resin serving as a binder and finely divided phosphor particles is prepared. Using this coating solution, a film may be formed on the ITO thin film 33 by a known method such as a bar coater method or a dropping method.
- a voltage is applied between the electrode substrate 2 and the ITO thin film 33 using the power source 35 to accelerate the electrons emitted from the electron-emitting device 1.
- the distance between the phosphor 32 and the electron-emitting device 1 is preferably 0.3 to 1 mm.
- the voltage applied from the power source 7 to the electron-emitting device 1 is preferably 18V, and the voltage applied from the power source 35 to the electrode substrate 2 and the ITO thin film 33 is preferably 500 to 2000V.
- a self-luminous device 31a shown in FIG. 7 includes an electron-emitting device 1, a power source 7 that applies a voltage to the electron-emitting device 1, and a phosphor 32.
- the phosphor 32 has a planar shape and is disposed on the surface of the upper electrode of the electron-emitting device 1.
- the layer of the phosphor 32 is formed on the surface of the upper electrode of the electron-emitting device 1 using a coating liquid composed of finely divided phosphor particles and an epoxy resin as a binder.
- the electron-emitting device 1 itself has a structure that is weak against external force, there is a risk that the device may be broken if a film forming means using a bar coater method is used. For this reason, as a method for forming the phosphor layer 32, a dropping method, a spin coating method, or the like is suitable.
- a self-luminous device 31b shown in FIG. 8 includes an electron-emitting device 1 and a power source 7 that applies a voltage to the electron-emitting device 1, and this configuration is the same as that of the electron-emitting device 10.
- the self-luminous device 31 is mixed with phosphor fine particles in the electron acceleration layer 4 of the electron-emitting device 1.
- fluorescent fine particles may be mixed instead of part of the insulating fine particles 5.
- the mixing ratio is limited with a certain upper limit for the following reasons.
- the phosphor fine particles have a low resistivity. Therefore, when the mixing ratio of the phosphor fine particles in the electron acceleration layer 4 increases, the resistivity of the electron acceleration layer 4 decreases.
- the electron acceleration layer 4 In order for the electron acceleration layer 4 to function as an electron acceleration layer, it is necessary to have a resistivity higher than a predetermined resistivity.
- the phosphor fine particles are mixed instead of a part of the insulator fine particles 5 in the electron acceleration layer 4, there is an optimum value for the mixing ratio.
- the weight mixing ratio is optimally about 3: 1.
- the self-light-emitting devices 31 and 31a the electrons emitted from the electron-emitting device 1 collide with the phosphor 32 to become self-light-emitting devices.
- the self-light-emitting device 31b becomes a self-light-emitting device when electrons accelerated in the electron acceleration layer 4 collide with the phosphor fine particles.
- the self-light emitting devices 31, 31a, 31b can emit light efficiently. Since the self-luminous devices 31, 31a and 31b use the electron-emitting device 1 as an electron-emitting source, they can be operated in the atmosphere, but the electron-emitting current is increased by vacuum-sealing, and the efficiency is higher. Realize light emission.
- An image display device 140 shown in FIG. 9 includes a self-luminous device 31b and a liquid crystal panel 330.
- the self-luminous device 31b is installed behind the liquid crystal panel 330 and used as a backlight.
- the voltage applied to the self light emitting device 31b by the power source 7 is preferably 20 to 35V.
- the self-luminous device 31b may be configured to emit, for example, 10 ⁇ A / cm 2 of electrons per unit time when a voltage of 20 to 35 V is applied.
- the distance between the self light emitting device 31b and the liquid crystal panel 330 is preferably about 0.1 mm.
- an image display apparatus By arranging the self-light emitting devices 31 shown in FIG. 6 in a matrix, an image display apparatus is realized.
- This image display device utilizes light emission of a phosphor by electrons emitted from an electron-emitting device, and can be said to be a field emission display (FED) in a broad sense.
- the voltage applied to the self-light emitting device 31 by the power source 6 is preferably 20 to 35V.
- the self-luminous device 31 may be configured to emit, for example, 10 ⁇ A / cm 2 of electrons per unit time when a voltage of 20 to 35 V is applied.
- Embodiment 5 10 and 11 show an example of a blower device according to the present invention provided with the electron emission device 10 according to the present invention described in the first embodiment. Below, the case where the air blower which concerns on this invention is used as a cooling device is demonstrated. However, the use of the blower is not limited to the cooling device.
- blower 150 blower 150, Blower 160
- the flow velocity of air on the surface of the object to be cooled becomes zero. That is, the air that can take most heat from the object to be cooled is not replaced and the cooling efficiency is poor.
- it is effective to blow air containing charged particles such as electrons and ions instead of normal air to the object to be cooled. This is because the air containing charged particles blown in the vicinity of the object to be cooled is attracted to the surface of the object to be cooled by electrostatic force, and is replaced with the air already existing on the surface of the object to be cooled. .
- blower device 10 An example of a blower device according to the present invention provided with the electron emission device 10 according to the present invention is shown below.
- a blower 150 shown in FIG. 10 includes an electron-emitting device 10 including the electron-emitting device 1 and a power source 7 that applies a voltage thereto.
- the electron emission device 10 emits electrons toward the cooled object 41 that is electrically grounded.
- the applied voltage to the electron-emitting device 1 is preferably about 18V.
- the electron-emitting device 1 is preferably configured to emit, for example, 1 ⁇ A / cm 2 of electrons per unit time when a voltage of 18 V is applied.
- a blower 160 shown in FIG. 11 is a combination of the blower 150 shown in FIG. 10 and a blower fan 42.
- the electron emission device 10 emits electrons toward the cooled object 41 that is electrically grounded to generate an ion wind. Further, when the blower fan 42 blows air toward the body 41 to be cooled, the blower 160 cools the body 41 to be cooled.
- the air volume by the blower fan 42 is preferably 0.9 to 2 L / (min ⁇ cm 2 ).
- the air blower 150 and the air blower 160 since the charged air such as electrons and ions is contained in the air to be blown, the cooling efficiency is remarkably improved as compared with the cooling device using only air blowing. . Furthermore, since the electron emission element 1 has high electron emission efficiency, the air blower 150 and the air blower 160 can be further efficiently cooled. Moreover, the air blower 150 and the air blower 160 can operate for a long time in the atmosphere.
- the insulating fine particles are preferably monodispersed and aligned and filled.
- the contacts and conduction paths between the insulating fine particles are uniformly formed in the electron acceleration layer. Therefore, it is possible to conduct electrons while efficiently trapping electrons in the entire plane of the electron acceleration layer. As a result, ballistic electrons are increased under the thin film electrode, and a large amount of electrons can be emitted. Therefore, the electron emission efficiency of the electron emitter can be further increased.
- the insulating fine particles constituting the electron acceleration layer include at least one of silicon oxide, aluminum oxide, and titanium oxide.
- the resistance value of the electron acceleration layer can be controlled within an arbitrary range.
- the average particle diameter of the insulating fine particles is preferably 5 to 1000 nm. Further, the average diameter of the insulating fine particles is more preferably 15 to 500 nm.
- Joule heat generated when a current flows in the element can be efficiently released, and the electron emitting element can be prevented from being destroyed by heat generated during operation. Furthermore, the resistance value in the electron acceleration layer can be easily controlled.
- the electron acceleration layer preferably has a thickness of 8 to 3000 nm. Thereby, the surface of the electron acceleration layer can be flattened and the resistance value of the electron acceleration layer in the layer thickness direction can be controlled.
- the layer thickness of the electron acceleration layer is more preferably 30 to 1000 nm.
- the height of the unevenness of the electrode substrate is preferably 50 to 80% of the layer thickness of the electron acceleration layer.
- the height of the unevenness of the electrode substrate is preferably 50 to 80% of the thickness of the electron acceleration layer, thereby avoiding the risk of short-circuiting the electrode substrate and the thin film electrode when forming the opening. be able to.
- An electron-emitting device includes any one of the electron-emitting devices described above and a power supply unit that applies a voltage between the electrode substrate and the thin-film electrode.
- a self-luminous device includes the above-described electron emission device and a light emitter, and emits electrons from the electron emission device to cause the light emitter to emit light.
- An image display device includes the above-described self-light-emitting device.
- the electron-emitting device is used for a self-luminous device and an image display device including the self-luminous device, thereby realizing stable operation and long-life surface light emission.
- a self-luminous device and an image display apparatus can be provided.
- a blower device includes the above-described electron emission device, and emits electrons from the electron emission device to blow air.
- a cooling device includes the above-described electron emission device, and emits electrons from the electron emission device to cool an object to be cooled.
- a charging device includes the above-described electron emission device, and discharges electrons from the electron emission device to charge the photosensitive member.
- An image forming apparatus includes the above-described charging device.
- the electron-emitting device is used in a charging device and an image forming apparatus including the charging device, so that ozone and nitrogen oxides can be used without discharge.
- the object to be charged can be stably charged for a long period of time without generating harmful substances.
- An electron beam curing apparatus includes any one of the electron-emitting devices described above.
- the electron-emitting device is characterized by being a surface electron emission source.
- a conventional field electron emission device is a point electron emission source
- the electron emission device can irradiate a wide range of electrons at once. Therefore, an electron beam curing apparatus including the electron-emitting device according to one embodiment of the present invention enables two-dimensional irradiation with an electron beam to cure the resist.
- masklessness can be achieved at the time of resist curing, realizing low cost and high throughput.
- the step of forming the electron acceleration layer further includes a step of forming an insulating fine particle layer made of the insulating fine particles on the electrode substrate,
- the step of forming the insulating fine particle layer is performed by applying an insulating fine particle dispersion obtained by dispersing the insulating fine particles in a solvent onto the substrate electrode using a spin coating method. It is preferable to form a fine particle layer.
- the spin coating method is used in the step of applying the insulating fine particle dispersion.
- the insulator fine particles can be applied over a wide range very easily. Therefore, an electron-emitting device that can be applied to a device that needs to emit electrons in a wide range can be easily manufactured.
- the electron-emitting device can ensure electrical continuity, flow a sufficient current in the device, and emit ballistic electrons from the thin film electrode. Therefore, for example, it can be applied to a charging device of an image forming apparatus such as an electrophotographic copying machine, a printer, and a facsimile. Further, the present invention can be applied to an electron beam curing device, an image display device by combining with a phosphor, a cooling device using ion wind generated by emitted electrons, and the like.
- Electron emission apparatus 1 Electron emission element 2 Electrode substrate 3 Thin film electrode 4 Electron acceleration layer 5 Insulator fine particle 6 Aperture 7 Power supply (power supply part) DESCRIPTION OF SYMBOLS 10 Electron emission apparatus 11 Photosensitive drum 21 Acceleration electrode 22 Resist 31,31a, 31b Self-light-emitting device 32 Phosphor (light-emitting body) 33 ITO thin film 34 Glass substrate 35 Power source 36 Light emitting part 41 Cooled body 42 Blower fan 90 Charging device 100 Electron beam curing device 140 Image display device 150 Blower device 160 Blower device 330 Liquid crystal panel
Abstract
Description
上記電極基板と上記薄膜電極との間には、少なくとも絶縁体微粒子からなる電子加速層が設けられており、
上記電極基板の電子加速層が設けられる面に凹凸を備えており、
上記電極基板の凸部上の上記薄膜電極に開口部が形成されていることを特徴としている。
電極基板と薄膜電極とを備え、当該電極基板と薄膜電極との間に電圧を印加することによって、当該電極基板と薄膜電極との間で電子を加速させて、当該薄膜電極から放出させる電子放出素子の製造方法であって、
上記電極基板上に、少なくとも絶縁体微粒子からなる電子加速層を形成する工程と、
上記電子加速層上に、薄膜電極を形成する工程と、
上記薄膜電極に開口部を形成する工程とを含み、
上記基板電極は、電子加速層が設けられる面に凹凸を備えており、
上記薄膜電極に開口部を形成する工程において、上記凹凸を備えた基板電極と、上記薄膜電極との間に電圧を印加することによって、当該電極基板の凸部上の薄膜電極に開口部を形成することを特徴としている。
図1は、本発明に係る一実施形態の電子放出素子1を用いた電子放出装置10の構成を示す断面図である。図2は、本発明に係る一実施形態の電子放出素子1を用いた電子放出装置10の構成を示す上面図である。
図1に示すように、電子放出素子1は、下部電極となる電極基板2と、上部電極となる薄膜電極3と、その間に挟まれた電子加速層4とを備えている。電極基板2は、図1に示す凹凸形状を備えている。また、電子加速層4は、図1に示すように、単分散の絶縁体微粒子が整列して充填した層、すなわち絶縁体微粒子層からなる。上記の構造からなる電子放出素子1は、半導電性の輸送特性を示す。
電極基板2は、薄膜電極3と対になり電子加速層4内に電圧を印加するための電極である。これに加え、電子放出素子1の支持体としての役割も担う。したがって、電極基板2として用いる物質には、ある程度の強度を有すること、直に接する物質との接着性が良好なこと、および適度な導電性を有することが求められる。電極基板2の具体的な例としては、ステンレス、アルミニウム、チタン、および銅などの金属基板、ならびにシリコン、ゲルマニウム、およびガリウム砒素などの半導体基板を挙げることができる。
薄膜電極3は、電極基板2と対になり電子加速層4内に電圧を印加するための電極である。したがって、導電電極3に用いる物質は、導電性を有し電圧印加が可能となる物質であれば特に制限されない。ただし、電子放出素子1の動作環境として大気中を想定する場合は、薄膜電極3として、酸化物および硫化物形成反応のない金が最適な物質となる。また、酸化物形成反応の比較的小さい銀、パラジウム、タングステンなども問題なく実使用に耐える物質である。
電子加速層4は、少なくとも絶縁体微粒子5を含んでいればよい。絶縁体微粒子5の直径(平均径)は5~1000nmであることが好ましく、15~500nmがより好ましい。これによって、電子加速層4内を電流が流れる際に発生するジュール熱を効率よく逃がす。したがって、電子放出素子1が動作時の発熱により破壊されることを防止する。さらに、電子加速層4の膜厚を変更することにより、電子放出素子1の抵抗値を任意かつ容易に調整することが可能となる。
次に、電子放出素子1の製造方法の一実施形態について説明する。電子放出素子1の製造工程は、電極基板2表面への凹凸形状の形成と、電極基板2の親水性処理と、電子加速層4の形成と、薄膜電極3の形成と、薄膜電極3への開口部6の形成とからなる。
(電極基板2表面への凹凸形状の形成)
電極基板2表面へ凹凸形状を形成する。例えば、電極基板2としてアルミニウム金属基板を用いる場合、BCl3ガスとCl2ガスとの混合ガスを用いた反応性イオンエッチング(RIE)法によりアルミニウムのエッチングが可能である。エッチングする部分としない部分をパターニングすることによって、電極基板2の表面に任意の凹凸形状を形成する。
電極基板2の表面に、電子加速層4を形成する。電子加速層4は少なくとも絶縁体微粒子5によって形成される絶縁体微粒子層からなり、絶縁体微粒子5に加えて導電微粒子を備えてもよい。実施の形態1において例示する電子放出素子1は、電子加速層4として絶縁体微粒子5からなる絶縁体微粒子層のみを備える。電極基板2の親水性処理、および絶縁体微粒子層の形成について以下に示す。
電極基板2上に、絶縁体微粒子分散液を用いて、絶縁体微粒子5の薄膜を形成する。絶縁体微粒子分散液は、単分散の絶縁体微粒子5を水などの溶媒中に分散させたものである。絶縁体微粒子分散液を電極基板2上に塗布し、絶縁体微粒子5を層状に堆積するためにはスピンコート法を用いる。
電子加速層4の表面に、例えばマグネトロンスパッタリング法を用いて薄膜電極3を成膜し、開口部形成前の素子が完成する。開口部形成前の素子の断面図を図3に示す。
上記の方法にて製造した開口部形成前の電子放出素子において、開口部6を形成するために、電極基板2と薄膜電極3との間に電圧印加する。開口部6が形成される機構は、次の通りである。
以下、本発明に係る電子放出素子1の実施例について説明する。
(帯電装置90)
図4に、実施の形態1において説明した本発明に係る一実施形態の電子放出装置10を備えた本発明に係る帯電装置の一例を示す。帯電装置90は、電子放出素子1とこれに電圧を印加するための電源7とを備える電子放出装置10と、感光体ドラム11とからなる。本発明に係る画像形成装置は、この帯電装置90を備えている。
(電子線硬化装置100)
図5に、実施形態1において説明した本発明に係る一実施形態の電子放出装置10を備えた電子線硬化装置の一例を示す。電子線硬化装置100は、電子放出素子1とこれに電圧を印加する電源7とをからなる電子放出装置10と、放出された電子を加速させる加速電極21とを備えている。
図6~8に、実施の形態1において説明した本発明に係る一実施形態の電子放出装置10を備えた本発明に係る自発光デバイス31、31a、31bの例をそれぞれ示す。
図6に示す自発光デバイス31は、電子放出素子1とこれに電圧を印加する電源7とを備える電子放出装置10と、電子放出素子1から所定の間隔を有し対向した位置に、基材となるガラス基板34、ITO薄膜33、および蛍光体32(発光体)を備える発光部36と、電源35とを備える。電源35は、電子放出素子1における電極基板2と、ITO薄膜33との間に電圧を印加するために自発光デバイス31に備えられる。
図7に示す自発光デバイス31aは、電子放出素子1とこれに電圧を印加する電源7とさらに蛍光体32とを備えている。自発光デバイス31aでは、蛍光体32は平面状であり、電子放出素子1の上部電極表面に配置されている。ここで、蛍光体32の層は、微粒子化した蛍光体粒子とバインダーであるエポキシ系樹脂とからなる塗布液を用いて、電子放出素子1の上部電極表面に成膜される。ただし、電子放出素子1そのものは外力に対して弱い構造なので、バーコーター法による成膜手段を利用すると素子が壊れる恐れがある。このため、蛍光体32の層を成膜する方法としては、滴下法またはスピンコート法などが適している。
図8に示す自発光デバイス31bは、電子放出素子1とこれに電圧を印加する電源7とを備えており、この構成は電子放出装置10と同様である。これに加えて、自発光デバイス31には、電子放出素子1の電子加速層4に蛍光体微粒子を混合している。この場合、絶縁体微粒子5の一部を代替して、蛍光体微粒子を混合してもよい。
上記自発光デバイス31,31aにおいては、電子放出素子1より放出させた電子が蛍光体32に衝突することにより自発光デバイスとなる。上記自発光デバイス31bにおいては、電子加速層4内において加速された電子が蛍光体微粒子に衝突することによって自発光デバイスとなる。
本発明に係る自発光デバイスを備えた本発明に係る画像表示装置の一例を示す。図9に示す画像表示装置140は、自発光デバイス31bと液晶パネル330とを備えている。画像表示装置140においては、自発光デバイス31bを液晶パネル330の後方に設置し、バックライトとして用いる。自発光デバイス31bを画像表示装置140に用いる場合、電源7による自発光デバイス31bへの印加電圧は、20~35Vが好ましい。また、自発光デバイス31bは、20~35Vの電圧を印加された際に、例えば単位時間当たり10μA/cm2の電子が放出されるように構成されていればよい。また、自発光デバイス31bと液晶パネル330との距離は、0.1mm程度が好ましい。
また、図6に示す自発光デバイス31をマトリックス状に配置することによって、画像表示装置を実現する。この画像表示装置は、電子放出素子より放出された電子による蛍光体の発光を利用しており、広義の意味において電界放出ディスプレイ(FED)といえる。この場合、電源6による自発光デバイス31への印加電圧は、20~35Vが好ましい。自発光デバイス31は、20~35Vの電圧を印加された際に、例えば単位時間当たり10μA/cm2の電子が放出されるように構成されていればよい。
図10及び図11に、実施の形態1において説明した本発明に係る電子放出装置10を備えた本発明に係る送風装置の例を示す。以下において、本願発明に係る送風装置を、冷却装置として用いた場合について説明する。しかし、送風装置の利用は冷却装置に限定されることはない。
従来の送風装置あるいは冷却装置のように、送風のみを用いて被冷却体を冷却する場合、被冷却体の表面における空気の流速が0となる。すなわち、被冷却体から最も熱を奪える部分の空気が置換されず冷却効率が悪い。この問題を解消するためには、被冷却体に通常の空気ではなく、電子やイオンといった荷電粒子を含んだ空気を送風することが効果的である。なぜなら、被冷却体近傍に送風された荷電粒子を含んだ空気は、静電的な力によって被冷却体表面に引き寄せられ、すでに被冷却体表面に存在していた空気と置換されるからである。
上記絶縁体微粒子層を形成する工程は、溶媒中に上記絶縁体微粒子を分散させて得られる絶縁体微粒子分散液を、スピンコート法を用いて上記基板電極上に塗布することによって、上記絶縁体微粒子層を形成することをが好ましい。
2 電極基板
3 薄膜電極
4 電子加速層
5 絶縁体微粒子
6 開口部
7 電源(電源部)
10 電子放出装置
11 感光体ドラム
21 加速電極
22 レジスト
31,31a,31b 自発光デバイス
32 蛍光体(発光体)
33 ITO薄膜
34 ガラス基板
35 電源
36 発光部
41 被冷却体
42 送風ファン
90 帯電装置
100 電子線硬化装置
140 画像表示装置
150 送風装置
160 送風装置
330 液晶パネル
Claims (16)
- 電極基板と薄膜電極とを備え、当該電極基板と薄膜電極との間に電圧を印加することによって、当該電極基板と薄膜電極との間において電子を加速させて、当該薄膜電極から放出させる電子放出素子であって、
上記電極基板と上記薄膜電極との間には、少なくとも絶縁体微粒子からなる電子加速層が設けられており、
上記電極基板の電子加速層が設けられる面には凹凸を備えており、
上記電極基板の凸部上の上記薄膜電極に開口部が形成されていることを特徴とする電子放出素子。 - 上記絶縁体微粒子は単分散であり、かつ整列して充填していることを特徴とする請求項1に記載の電子放出素子。
- 上記絶縁体微粒子は、酸化シリコン、酸化アルミニウム、および酸化チタンの少なくとも1つを含んでいることを特徴とする、請求項1または2に記載の電子放出素子。
- 上記絶縁体微粒子の平均径は、5~1000nmであることを特徴とする、請求項1から3のいずれか1項に記載の電子放出素子。
- 上記電子加速層の層厚は、8~3000nmであることを特徴とする、請求項1から4のいずれか1項に記載の電子放出素子。
- 上記電極基板の凹凸の高さは、上記電子加速層の層厚の、50~80%であることを特徴とする、請求項1から5のいずれか1項に記載の電子放出素子。
- 請求項1~6のいずれか1項に記載の電子放出素子と、上記電極基板と上記薄膜電極との間に電圧を印加する電源部とを備えたことを特徴とする電子放出装置。
- 請求項7に記載の電子放出装置と発光体とを備え、該電子放出装置から電子を放出して該発光体を発光させることを特徴とする自発光デバイス。
- 請求項8に記載の自発光デバイスを備えたことを特徴とする画像表示装置。
- 請求項7に記載の電子放出装置を備え、該電子放出装置から電子を放出して送風することを特徴とする送風装置。
- 請求項7に記載の電子放出装置を備え、該電子放出装置から電子を放出して被冷却体を冷却することを特徴とする冷却装置。
- 請求項7に記載の電子放出装置を備え、該電子放出装置から電子を放出して感光体を帯電することを特徴とする帯電装置。
- 請求項12に記載の帯電装置を備えたことを特徴とする画像形成装置。
- 請求項7に記載の電子放出装置を備えたことを特徴とする電子線硬化装置。
- 電極基板と薄膜電極とを備え、当該電極基板と薄膜電極との間に電圧を印加することによって、当該電極基板と薄膜電極との間で電子を加速させて、当該薄膜電極から放出させる電子放出素子の製造方法であって、
上記電極基板上に、少なくとも絶縁体微粒子からなる電子加速層を形成する工程と、
上記電子加速層上に、薄膜電極を形成する工程と、
上記薄膜電極に開口部を形成する工程とを含み、
上記電極基板は、上記電子加速層が設けられる面に凹凸を備えており、
上記薄膜電極に開口部を形成する工程において、上記凹凸を備えた基板電極と、上記薄膜電極との間に電圧を印加することによって、当該電極基板の凸部上の薄膜電極に開口部を形成することを特徴とする電子放出素子の製造方法。 - 上記電子加速層を形成する工程が、上記絶縁体微粒子からなる絶縁体微粒子層を上記電極基板上に形成する工程をさらに含んでおり、
上記絶縁体微粒子層を形成する工程は、溶媒中に上記絶縁体微粒子を分散させて得られる絶縁体微粒子分散液を、スピンコート法を用いて上記電極基板上に塗布することによって、上記絶縁体微粒子層を形成することを特徴とする請求項15に記載の電子放出素子の製造方法。
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