WO2012075633A1 - Led灯及其散热控制电路 - Google Patents

Led灯及其散热控制电路 Download PDF

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Publication number
WO2012075633A1
WO2012075633A1 PCT/CN2010/079585 CN2010079585W WO2012075633A1 WO 2012075633 A1 WO2012075633 A1 WO 2012075633A1 CN 2010079585 W CN2010079585 W CN 2010079585W WO 2012075633 A1 WO2012075633 A1 WO 2012075633A1
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WO
WIPO (PCT)
Prior art keywords
led lamp
led
heat dissipation
control circuit
temperature
Prior art date
Application number
PCT/CN2010/079585
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English (en)
French (fr)
Inventor
陈复兴
彭青林
Original Assignee
深圳市蓝旗照明有限公司
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Application filed by 深圳市蓝旗照明有限公司 filed Critical 深圳市蓝旗照明有限公司
Priority to PCT/CN2010/079585 priority Critical patent/WO2012075633A1/zh
Publication of WO2012075633A1 publication Critical patent/WO2012075633A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/10—Safety devices structurally associated with lighting devices coming into action when lighting device is overloaded, e.g. thermal switch
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the utility model relates to the technical field of illumination, in particular to an LED lamp and a heat dissipation control circuit thereof.
  • high-power white LEDs convert only a small fraction of the electrical energy into light, and most of the energy is converted into heat.
  • the power demand for LED lamps is increasing, and the amount of heat generated by them is correspondingly increased, while the heat resistance of LEDs is low, and once the temperature exceeds a limit temperature, the LEDs The resulting brightness will attenuate and will not achieve the desired results, even reducing its normal service life.
  • the existing LED lamp mainly radiates heat through the heat sink, the heat dissipation effect is not good, and the temperature of the LED lamp is not well controlled to the limit. Below the temperature.
  • Utility model content
  • the technical problem to be solved by the embodiments of the present invention is to provide an LED lamp and a heat dissipation control circuit, the LED lamp not only has a heat dissipation device, but also can control the working current of the LED lamp, thereby reducing the heat emitted by the LED, effectively Improved heat dissipation.
  • an embodiment of the present invention provides a heat dissipation control circuit for an LED lamp, the heat dissipation control circuit includes: an LED for illumination; and a control for controlling the magnitude of the LED current a module; an AC/DC conversion power supply unit for providing power to the control module; a temperature detecting unit for detecting the temperature of the LED lamp in real time; for processing the temperature detecting unit to detect parameters and issuing control to the control module The processing unit of the signal.
  • the temperature detecting unit is an NTC thermistor.
  • the processing unit includes a register that registers a very high temperature value that is greater than or equal to the temperature, that is, controls the reduced current, and a register that is less than or equal to the temperature, that is, the extremely low temperature value that controls the increased current.
  • an embodiment of the present invention provides an LED lamp, including: a cylindrical heat sink; an upper cover fixed to a top end of the heat sink; and at least one LED light strip disposed on the outer surface of the heat dissipation body; a middle cover fixed to the bottom end of the heat dissipating body; a lower cover screwed to the middle cover; a lamp cap fixed to the other end of the lower cover; and fixed in the lamp cap and electrically connected to the LED light bar
  • a circuit board provided with a heat dissipation control circuit, the heat dissipation control circuit being the heat dissipation control circuit described in any of the above three paragraphs.
  • the LED lamp further includes a disk-shaped fixing body that is received in the middle cover for fixing the LED light bar, and the temperature detecting unit is disposed on the fixed body and on the heat sink Or on the circuit board.
  • the heat dissipating body is provided with a plurality of heat dissipating holes at an axial interval; the heat dissipating body extends from the inner side toward the axis to form a plurality of fins.
  • the heat dissipating body is axially spaced apart from a plurality of grooves adapted to the LED strip, and the recess is coated with a thermal paste.
  • the heat dissipating body is provided with a plurality of heat dissipating holes at an axial interval; the heat dissipating body extends from the inner side toward the axis to form a plurality of fins.
  • the heat dissipating body is axially spaced apart from a plurality of grooves adapted to the LED strip, and the recess is coated with a thermal paste.
  • the lamp head side is provided with a plurality of holes that are transparent in the axial direction.
  • a center of the upper cover is provided with a circular first through hole.
  • a center of the middle cover is provided with a circular second through hole corresponding to the first through hole.
  • the heat dissipation structure has good heat dissipation performance, thereby enabling high-power LED illumination, reducing the operating temperature of the LED lamp and extending
  • the service life of the LED lamp can be conveniently controlled by the heat dissipation control circuit provided in the lamp head, thereby achieving the purpose of convenient use, energy saving and environmental protection.
  • FIG. 1 is a perspective view of an LED lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded view of an LED lamp of an embodiment of the present invention.
  • the LED lamp of the embodiment of the present invention includes a heat sink 10 , an upper cover 20 , an LED light bar 30 , and a middle cover 40 .
  • the heat dissipating body 10 is substantially cylindrical, and may be a hollow regular hexagonal prism or a hollow cylinder, and is integrally formed of a metal or an alloy such as iron, copper, aluminum, silver, or gold having good thermal conductivity.
  • the heat dissipating body 10 includes a top end 11 , a bottom end 12 , a plurality of heat dissipation holes 13 axially spaced along the heat dissipating body 10 , and a plurality of fins 14 extending from the inner side of the heat dissipating body 10 .
  • the heat dissipation holes 13 are used for ventilation inside and outside the heat dissipation body 10, and the fins 14 are used for heat dissipation.
  • the heat dissipating body 10 further includes a plurality of axially spaced apart grooves 15 adapted to the length, width and thickness of the LED light bar 30 for firmly clamping the LED light bar 30.
  • the recess 15 is coated with a thermal paste (not shown) for conducting the heat generated by the LEDs on the LED strip 30 to the heat sink 10.
  • the upper cover 20 is substantially pan-shaped and is fixed to the top end of the heat dissipating body 10.
  • the center of the upper cover 20 is provided with a circular first through hole 22 for ventilation and heat dissipation.
  • the LED light bar 30 includes an elongated substrate 31 and an LED 32.
  • the substrate 31 is provided with the LED 32 embedded thereon, and the heat generated when the LED 32 emits light is transmitted to the heat sink 10 through the substrate 31 to utilize heat dissipation.
  • the material of the substrate 31 may be a metal substrate having a good thermal conductivity, for example, a material such as aluminum or copper.
  • the substrate 31 is embedded with at least one of the LEDs 32.
  • the middle cover 40 is substantially in the shape of a pan, and is fixed to the bottom end 12 of the heat dissipating body 10.
  • the center of the middle cover 40 is provided with a circular second through hole 42 corresponding to the first through hole 22. It is used to keep the top end and the low end of the heat sink 10 unobstructed to facilitate ventilation and heat dissipation.
  • the inner side of the rim of the middle cover 20 is provided with an internal thread 44.
  • the LED lamp further includes a lower cover 50, a base 60 and a circuit board 70.
  • the lower cover 50 is also substantially cylindrical, and one end is provided with an external thread 51 adapted to the internal thread 44 for screwing the lower cover 50 to the middle cover 40 for convenient assembly and disassembly of the LED. light.
  • the base 60 is substantially umbrella-shaped, and a plurality of holes 62 are formed in the axial direction to facilitate the upward flow of hot air in the LED lamp.
  • the bottom of the base 60 is provided with a tab 64 for nesting in the other end of the lower cover 50 in the circumferential direction. When assembled, the lower cover 50 is first nested and then fixed together.
  • the top of the base 60 is provided with an external thread 66 for fixing the entire LED lamp.
  • the circuit board 70 is fixed in the lamp cap 60 and electrically connected to the LED light bar 30.
  • the circuit board 70 is provided with a heat dissipation control circuit 80 (see FIG. 3).
  • the heat dissipation control circuit 80 mainly detects the internal temperature of the LED lamp. If the temperature exceeds a preset temperature, the LED current is reduced by the control module to reduce the degree of heat generation to indirectly control the temperature of the lamp body.
  • the heat dissipation control circuit 80 includes an LED 32 for illumination, a control module 81, an AC/DC conversion power supply unit 82, a temperature detecting unit 83, and a processing unit 84 as described above.
  • the control module 81 controls the magnitude of the current of the LED 32.
  • the control module 81 is a transistor that can control the magnitude of the current, and the transistors are not commonly described.
  • the AC/DC conversion power supply unit 82 is configured to convert mains power to DC power and provide power to the control module 81.
  • the temperature detecting unit 83 is specifically a NTC (Negative Temperature Coefficient) thermistor, and has at least two. Further, the LED lamp further includes a fixing body 90 (see Fig. 2). The fixing body 90 has a disk shape and is received in the middle cover 40. The LED light bar 30 vertically passes through and is fixed to the fixing body 90.
  • the temperature detecting unit 83 is disposed on the circuit board 70. In the second embodiment, the temperature detecting unit 83 is fixed to the heat sink 10 by screws. In the third embodiment, The temperature detecting unit 83 is disposed on the fixed body 90.
  • the processing unit 84 is a microprocessor for processing the temperature detecting unit 83 to detect parameters and send a control signal to the control module 81.
  • the processing unit 84 includes a register (not shown).
  • the register is used to store two limit temperature values, that is, an extremely high temperature value that is greater than or equal to the temperature, that is, the control current is reduced, which is 50. Celsius, a very low temperature value that is less than or equal to the temperature, that is, the control of the increased current, is 40 degrees Celsius, and the NTC thermistor is four.
  • the operation process of the heat dissipation control circuit 80 is: the processing unit 84 calculates the average temperature of the four points by the temperature detecting unit 83 in real time, and the processing unit 84 compares and determines that the average temperature reaches 50. At Celsius, a control signal is generated to reduce the average operating current of the LEDs 32.
  • the control module 81 reduces the average operating current of the LEDs 32 according to the control signal, and the temperature of the LED lamps begins to decrease; when the processing unit 84 When it is determined that the average temperature drops to 40 degrees Celsius, a control signal for increasing the average operating current of the LED 32 is generated, and the control module 81 increases the average operating current of the LED 32 according to the control signal, so as to cycle
  • the LED lamp never exceeds the limit temperature to which it is damaged, and enhances the current when the temperature is below a certain value, ensuring that the brightness of the LED 32 is not reduced too much.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

说 明 书
LED灯及其散热控制电路
技术领域
本实用新型涉及照明技术领域，特别涉及一种 LED灯及其散热控制电路。 背景技术
通常， 大功率白光 LED只能将少部分的电能转化为光能， 而大部分的能 量则转化成了热能。 随着近年 LED灯的日益普及， 人们对 LED灯的功率需 求是越来越大， 其产生的热量也相应增多， 而 LED耐热程度较低， 且一但温 度超过一极限温度时， 该 LED所产生的亮度就会发生衰减的现象而无法达到 预期的效果， 甚至缩减其正常的使用寿命。
发明人在实施本实用新型过程中，发现现有技术至少存在如下技术问题: 现有的 LED灯主要通过散热器散热， 散热效果并不好， 也不能很好地将 LED 灯的温度控制在极限温度之下。 实用新型内容
本实用新型实施例所要解决的技术问题在于， 提供一种 LED灯及散热控 制电路， 所述 LED灯不仅具有散热装置， 而且还可以控制 LED灯的工作电 流， 从而降低 LED散发的热量， 有效地提高了散热效果。
为解决上述技术问题， 一方面， 本实用新型实施例提供了一种用于 LED 灯的散热控制电路， 所述散热控制电路包括： 用于照明的 LED; 用于控制所 述 LED电流大小的控制模块； 用于为所述控制模块提供电源的交直流转换供 电单元； 用于实时检测所述 LED灯温度的温度检测单元； 用于处理所述温度 检测单元检测参数并向所述控制模块发出控制信号的处理单元。
进一步地， 所述温度检测单元为 NTC热敏电阻。
进一步地， 所述处理单元包括一寄存有一个大于等于该温度即控制减小 电流的极高温度值和一个小于等于该温度即控制增加电流的极低温度值的寄 存器。
另一方面， 本实用新型实施例提供了一种 LED灯， 包括： 筒状散热体； 固定 于所述散热体顶端的上盖；紧贴于所述散热体外表面设置的至少一 LED灯条; 固定于所述散热体底端的中盖； 一端螺合于所述中盖的下盖； 固定于所述下 盖另一端的灯头； 及固定于所述灯头内与所述 LED灯条电连接且设置有散热 控制电路的电路板， 所述散热控制电路为如上三段中任一段所述的散热控制 电路。
进一步地， 所述 LED灯还包括用于固定所述 LED灯条的收容于所述中 盖内的圆盘状固定体， 所述温度检测单元设置于所述固定体上、 所述散热体 上或所述电路板上。
进一步地， 所述散热体沿轴向间隔设有多个散热孔； 所述散热体由内侧 面向轴心延伸出多个鳍片。
进一步地，所述散热体沿轴向间隔设有多个与所述 LED灯条适应的凹槽， 所述凹槽内涂有导热膏。
进一步地， 所述散热体沿轴向间隔设有多个散热孔； 所述散热体由内侧 面向轴心延伸出多个鳍片。
进一步地，所述散热体沿轴向间隔设有多个与所述 LED灯条适应的凹槽， 所述凹槽内涂有导热膏。
进一步地， 所述灯头侧面设有多个沿轴向通透的孔。
进一步地， 所述上盖的中心设有一圆形第一通孔。
进一步地， 所述中盖的中心设有一与所述第一通孔对应的圆形的第二通 孔。
上述技术方案至少具有如下有益效果：
因为采用了设有多个鳍片的散热体及多个散热孔的 LED灯， 所述散热结 构具有良好的散热性能， 从而使大功率的 LED 照明成为可能， 降低了 LED 灯的工作温度， 延长其使用寿命； 且通过所述灯头内设的散热控制电路， 可 以方便地对 LED灯的温度进行控制， 从而达到方便使用和节能环保的目的。 附图说明
图 1是本实用新型实施例的 LED灯的立体图。
图 2是本实用新型实施例的 LED灯的爆炸图。
图 3是本实用新型实施例的 LED灯的电路原理图。 具体实施方式 请参考图 1-图 2， 本实用新型实施例的 LED灯， 包括散热体 10、 上盖 20、 LED灯条 30及中盖 40。
所述散热体 10大致呈筒状， 可为空心正六棱柱或空心的圆柱体， 由导热 性能好的铁、 铜、 铝、 银、 以及金等金属或合金一体成型地制成。 所述散热体 10包括顶端 11、 底端 12、 沿所述散热体 10轴向间隔设置的多个散热孔 13 及由所述散热体 10 内侧面向轴心延伸的多个鳍片 14。 所述散热孔 13用于 所述散热体 10内外通风， 所述鳍片 14用于散热。
所述散热体 10还包括沿轴向间隔设设置的多个与所述 LED灯条 30的长、 宽及厚度适应的凹槽 15， 用于牢固地卡住所述 LED灯条 30。 所述凹槽 15内 涂有导热膏 （图中未示）， 用于将所述 LED灯条 30上的 LED产生的热量很 好地传导至所述散热体 10上。
所述上盖 20大致呈平底锅状， 固定于所述散热体 10的顶端 11， 所述上 盖 20中心设有一圆形第一通孔 22， 用于进行通风散热。
所述 LED灯条 30包括长条形基板 31和 LED32。 所述基板 31—方面是 提供所述 LED32嵌设于其上， 另一方面所述 LED32发光时所产生的热量通 过所述基板 31传递给所述散热体 10以利用散热。所述基板 31的材质可以是 导热性较佳的金属基板， 例如:铝、 铜等材质所构成。 其中， 一所述基板 31 至少嵌设一所述 LED32。
所述中盖 40大致也呈平底锅状， 固定于所述散热体 10的底端 12， 所述 中盖 40中心设有一与所述第一通孔 22对应的圆形的第二通孔 42， 用于保持 所述散热体 10顶端和低端的通畅， 以利于通风散热。 所述中盖 20的边沿内 侧面设有内螺紋 44。
所述 LED灯还包括下盖 50、 灯头 60及电路板 70。
所述下盖 50大致也呈筒状， 一端设有与所述内螺紋 44相适应的外螺紋 51， 用于使所述下盖 50螺合于所述中盖 40， 方便拆装所述 LED灯。
所述灯头 60大致呈伞状， 侧面设有多个沿轴向通透的孔 62， 以便于所 述 LED灯内的热空气向上涌出。 所述灯头 60底部沿周向设有用于嵌套于所 述下盖 50另一端的凸片 64， 组装时先嵌套入所述下盖 50再一并点胶固定。 所述灯头 60顶部设有用于固定整个所述 LED灯的外螺紋 66。
所述电路板 70固定于所述灯头 60内， 且与所述 LED灯条 30电连接。 所述电路板 70上设置有散热控制电路 80 (见图 3 )。所述散热控制电路 80主 要是通过检测所述 LED灯内部温度， 若超过一预设温度， 则通过控制模块减 小 LED电流， 减少发热程度， 以间接控制灯体的温度。
请参考图 3， 所述散热控制电路 80包括如上所述用于照明的 LED32、 控 制模块 81、 交直流转换供电单元 82、 温度检测单元 83及处理单元 84。
所述控制模块 81控制所述 LED32电流大小， 具体地所述控制模块 81为 可控制电流大小的晶体管， 所述晶体管为常用零件不在赘述。
所述交直流转换供电单元 82 用于将市电转换为直流电并为所述控制模 块 81提供电源。
所述温度检测单元 83具体为 NTC (Negative Temperature Coefficient, 负 温度系数） 热敏电阻， 且至少有两个。 进一步地， 所述 LED灯还包括固定体 90 (见图 2 )。 所述固定体 90呈圆盘状， 收容于所述中盖 40内， 所述 LED灯 条 30垂直穿过并固定于所述固定体 90。 第一实施方式中， 所述温度检测单 元 83设置于所述电路板 70上； 第二实施方式中， 所述温度检测单元 83通过 螺丝固定于所述散热体 10上； 第三实施方式中， 所述温度检测单元 83设置 于所述固定体 90上。
所述处理单元 84为以微处理器， 用于处理所述温度检测单元 83检测参 数并向所述控制模块 81发出控制信号。 所述处理单元 84包括一寄存器 （图 中未示）， 本实施方式中， 该寄存器用于存储两个极限温度值， 即一个大于等 于该温度即控制减小电流的极高温度值， 为 50摄氏度， 一个小于等于该温度 即控制增加电流的极低温度值， 为 40摄氏度， 所述 NTC热敏电阻为 4个。
所述散热控制电路 80工作过程为： 所述处理单元 84通过所述温度检测 单元 83实时的采集 4个点的温度， 计算出平均温度， 当所述处理单元 84比 较判断所述平均温度达到 50摄氏度时， 产生一降低所述 LED32的平均工作 电流的控制信号， 所述控制模块 81根据该控制信号降低所述 LED32的平均 工作电流， 所述 LED灯的温度开始下降； 当所述处理单元 84比较判断所述 平均温度下降至 40摄氏度时， 产生一增加所述 LED32的平均工作电流的控 制信号， 所述控制模块 81根据该控制信号增加所述 LED32的平均工作电流， 如此循环， 以使所述 LED灯始终不会超过对其有损害的所述极限温度， 并且 在温度低于一定值时增强电流， 保证所述 LED32的亮度不至于减少太多。 以上所述是本实用新型的具体实施方式， 应当指出， 对于本技术领域的 普通技术人员来说， 在不脱离本实用新型原理的前提下， 还可以做出若干改 进和润饰， 这些改进和润饰也视为本实用新型的保护范围。

Claims

权 利 要 求 书
1. 一种用于 LED灯的散热控制电路， 其特征在于， 所述散热控制电路包括： 用于照明的 LED;
用于控制所述 LED电流大小的控制模块；
用于为所述控制模块提供电源的交直流转换供电单元；
用于实时检测所述 LED灯温度的温度检测单元；
用于处理所述温度检测单元检测参数并向所述控制模块发出控制信号的处理 单元。
2. 如权利要求 1所述的散热控制电路，其特征在于，所述温度检测单元为 NTC 热敏电阻。
3. 如权利要求 1所述的散热控制电路， 其特征在于， 所述处理单元包括一寄 存有一个大于等于该温度即控制减小电流的极高温度值和一个小于等于该温 度即控制增加电流的极低温度值的寄存器。
4. 一种 LED灯， 其特征在于， 所述 LED灯包括：
筒状散热体；
固定于所述散热体顶端的上盖；
紧贴于所述散热体外表面设置的至少一 LED灯条；
固定于所述散热体底端的中盖；
一端螺合于所述中盖的下盖；
固定于所述下盖另一端的灯头； 及
固定于所述灯头内与所述 LED灯条电连接且设置有散热控制电路的电路板， 所述散热控制电路为如权利要求 1~3中任一项所述的散热控制电路。
5. 如权利要求 4所述的 LED灯， 其特征在于， 所述 LED灯还包括用于固定 所述 LED灯条的收容于所述中盖内的圆盘状固定体， 所述温度检测单元设置 于所述固定体上、 所述散热体上或所述电路板上。
6. 如权利要求 4所述的 LED灯， 其特征在于，所述散热体沿轴向间隔设有多 个散热孔； 所述散热体由内侧面向轴心延伸出多个鳍片。
7. 如权利要求 4所述的 LED灯， 其特征在于，所述散热体沿轴向间隔设有多 个与所述 LED灯条适应的凹槽， 所述凹槽内涂有导热膏。
8. 如权利要求 4所述的 LED灯， 其特征在于，所述灯头侧面设有多个沿轴向 通透的孔。
9. 如权利要求 4所述的 LED灯， 其特征在于，所述上盖的中心设有一圆形第 一通孔。
10. 如权利要求 9所述的 LED灯， 其特征在于， 所述中盖的中心设有一与所 述第一通孔对应的圆形的第二通孔。
PCT/CN2010/079585 2010-12-08 2010-12-08 Led灯及其散热控制电路 WO2012075633A1 (zh)

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CN101173757A (zh) * 2007-09-25 2008-05-07 东莞勤上光电股份有限公司 Led路灯过热保护方法
CN201345764Y (zh) * 2009-01-09 2009-11-11 四川省桑瑞光辉标识系统制造有限公司 Led温态智能保护照明电路
CN201363589Y (zh) * 2009-03-16 2009-12-16 林峻毅 一种花式led柱形灯
CN201373358Y (zh) * 2009-03-11 2009-12-30 四川九洲铭伟半导体照明有限公司 Led射灯
CN201388315Y (zh) * 2008-04-01 2010-01-20 刘光宇 Led路灯驱动器
CN201462466U (zh) * 2009-08-05 2010-05-12 陈展新 Led管灯
CN201507826U (zh) * 2009-09-28 2010-06-16 林峻毅 内散热led柱形灯
CN201651908U (zh) * 2010-04-03 2010-11-24 黄海斌 Led照明灯
CN201887992U (zh) * 2010-12-08 2011-06-29 深圳市蓝旗照明有限公司 Led灯及其散热控制电路

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101173757A (zh) * 2007-09-25 2008-05-07 东莞勤上光电股份有限公司 Led路灯过热保护方法
CN201388315Y (zh) * 2008-04-01 2010-01-20 刘光宇 Led路灯驱动器
CN201345764Y (zh) * 2009-01-09 2009-11-11 四川省桑瑞光辉标识系统制造有限公司 Led温态智能保护照明电路
CN201373358Y (zh) * 2009-03-11 2009-12-30 四川九洲铭伟半导体照明有限公司 Led射灯
CN201363589Y (zh) * 2009-03-16 2009-12-16 林峻毅 一种花式led柱形灯
CN201462466U (zh) * 2009-08-05 2010-05-12 陈展新 Led管灯
CN201507826U (zh) * 2009-09-28 2010-06-16 林峻毅 内散热led柱形灯
CN201651908U (zh) * 2010-04-03 2010-11-24 黄海斌 Led照明灯
CN201887992U (zh) * 2010-12-08 2011-06-29 深圳市蓝旗照明有限公司 Led灯及其散热控制电路

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