WO2016115897A1 - 一种高效散热的led陶瓷灯杯及其制备方法 - Google Patents
一种高效散热的led陶瓷灯杯及其制备方法 Download PDFInfo
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- WO2016115897A1 WO2016115897A1 PCT/CN2015/087752 CN2015087752W WO2016115897A1 WO 2016115897 A1 WO2016115897 A1 WO 2016115897A1 CN 2015087752 W CN2015087752 W CN 2015087752W WO 2016115897 A1 WO2016115897 A1 WO 2016115897A1
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- heat
- heat dissipation
- dissipating
- ceramic
- lamp cup
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/349—Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Definitions
- the invention relates to the field of lighting technology, and more particularly to an LED ceramic lamp cup for efficient heat dissipation and a preparation method thereof.
- LED has the characteristics of energy saving, environmental protection, safety, long service life, high brightness, easy dimming, etc. It can be widely used in various indications, displays, devices, backlights and general lighting fields. In the early stage of LED development, it is mainly used in low-power lighting or decoration, and its heat dissipation performance is matched with the power, and there is no heat dissipation problem. However, LEDs are now more and more used in high-power fields. Therefore, heat dissipation is a major goal of LED development.
- the heat dissipation performance of LED ceramic lamps is an important indicator for evaluating the performance of LED ceramic lamps, and its heat dissipation performance mainly determines the service life of LED ceramic lamps. Therefore, LED ceramic lamp radiators are an important component of LED ceramic lamps. Therefore, the development direction of LED ceramic lamps is how to improve its heat dissipation efficiency.
- the traditional LED heat sink mainly uses aluminum as the heat sink, and the heat sink is stuck with the lamp cover.
- the heat dissipation effect of the aluminum material as the LED ceramic lamp heat sink is good, the aluminum material has high cost, and the aluminum material is further The processing cost is also high, resulting in a relatively high price of high-power LED products.
- copper radiators or some auxiliary means such as water cooling or air cooling to dissipate heat, but these radiators are either complicated in structure or high in cost, and can not be applied to LED ceramics under the premise of reducing cost and improving heat dissipation performance. In the light.
- the object of the present invention is to provide an LED ceramic lamp cup with good heat dissipation effect and high efficiency heat dissipation and a preparation method thereof.
- an LED ceramic lamp cup with high heat dissipation comprising a body and a plurality of heat dissipating ribs disposed on the body, wherein the heat dissipating ribs are arranged in a whirlwind manner.
- the heat dissipating rib includes three heat dissipating surfaces, the heat dissipating surface is recessed on an outer surface of the body, one end of the heat dissipating rib is a heat dissipating hole, and the other end of the heat dissipating rib is exposed to the body The outer surface.
- one end of the heat sink that is engaged with the lamp cover is recessed inward to form a placement surface, and the placement surface forms a flange with the inner wall of the body for engaging the lamp cover.
- the placement surface is provided with a through hole through which the wire is bored.
- the heat sink has a cup-shaped structure, and one end of the body having a small cross-sectional area is detachably and fixedly connected with the lamp cap.
- the end of the body having a small cross-sectional area is a fixing portion, the fixing portion is provided with a thread, and the lamp cap is screwed with the fixing portion.
- the fixing portion is provided with a wire hole for preventing the wire from being broken.
- the method of preparing an LED ceramic lamp of the claims comprises the steps of:
- the components are prepared according to the ceramic material formulation for the ceramic heat sink, and the ceramic material comprises: 85-90% alumina, 0.5-1.5% silica, 1.5-3.5% carbonic acid by mass percentage. Calcium, 1.0-3.0% kaolin, 5-7% pore former;
- Processing material drying each component material prepared in the step (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material;
- step (2) The material in the step (2) is dried in a 300-400 degree oven after being grouted in the grouting machine and the mold to form a ceramic lamp cup.
- the ceramic material described in the step (1) comprises: 90% alumina, 1.5% silica, 3.0% calcium carbonate, 1.0% kaolin, 5% pore former.
- step (2) the material is dried to a moisture content of less than 0.05% and the material has a ground particle size of less than 20 ⁇ m.
- the heat dissipation rib of the invention directly communicates with the cavity between the lamp cover and the heat sink, and the heat dissipation ribs take away the high hot air in the cavity, thereby cooling the temperature and having a good heat dissipation effect. At the same time, it increases the contact area between the radiator and the air, and improves the dispersion of the radiator. Thermal efficiency.
- Figure 1 is a schematic view of the structure of the present invention
- Figure 2 is a partial cross-sectional view of the present invention.
- FIGS. 1 through 2 Embodiments of the present invention will be further described with reference to FIGS. 1 through 2.
- an LED ceramic lamp cup with high heat dissipation includes a body 0.
- the body 0 has a cup shape, and the body 0 has two end faces of a large and a small cross-sectional area, and the large end is recessed downward to form a placement surface. 2, the central position of the placement surface 2 is downwardly formed with a through hole 21, and the through hole 21 is disposed along the axial direction of the body 0.
- the ceramic lamp cup uses an LED as a light source, and the LED is generally soldered or attached to the PCB.
- the PCB board provided with the LED light source is disposed on the placement surface 2, and is fixed to the placement surface 2 by means of gluing or the like; the end of the heat sink and the lamp cover is recessed inward to form the placement surface 2, the placement surface 2 and the body 0
- the inner wall is formed with a flange 22 for the lamp cover to be engaged; and the through hole 21 is for the wire of the PCB board, and one end of the wire is connected with the PCB board disposed on the placement surface 2, and most of the wire is worn.
- the through hole 21 is disposed to be connected with the lamp cap disposed under the through hole 21; at the same time, the end of the body 0 having a small cross-sectional area is provided with the thread 3, and the lamp cap is matched with the thread 3 of the body 0, so that the lamp cap is fixedly connected with the body 0,
- the lamp cap structure in the invention is as invented by the application number "201110264489.X"
- the lamp cap and the base are fixed by a dot, and the dot fixing is a fixing method similar to glue or riveting, because the glue melts after being heated, and the fixing effect is deteriorated, so the body is horizontally crossed.
- the end of the smaller cross-sectional area is provided with a thread 3, and the body 0 is connected with the lamp cap through the thread 3, and does not need to be glued, and has a fixed effect by mechanical means, and is not affected by the heat of the lamp hair, and the connection is more stable.
- one end of the body 0 having a small cross-sectional area having a thread 3 is a fixing portion 4 , and the thread 3 is disposed on the fixing portion 4 , and the fixing portion 4 is further provided with a wire hole 31 , and the wire hole 31 is located at the thread
- the wire hole 31 has a mirror-shaped zigzag shape, and the bottom of the lamp cap is connected with the fire wire of the PCB board.
- the side of the lamp head is connected to the neutral line on the PCB.
- the body 0 is made of ceramic, and the ceramic is non-conductive, so the zero line of the PCB board cannot be electrically connected to the side wall of the lamp cap, so the wire hole is provided.
- the wire is passed through the wire hole 31 and can be electrically connected to the side wall of the lamp cap, thereby generating a current loop, but the lamp cap must be welded to the wire at the time of installation. If the lamp cap is screwed into the body 0, the wire will be caused. The connection position with the lamp cap is broken, so that the wire hole 31 is provided at the smaller end of the body 0, and the wire hole 31 is inclined upward along the rotation direction of the hole of the screw 3, so that when the lamp head rotates, the wire also follows. Rotation within the wire hole 31 does not cause a breakage problem.
- One end of the heat dissipating rib 1 is a heat dissipating hole 11, and the other end of the heat dissipating rib 1 is exposed to the outer surface of the main body 0, and the wind flowing through the main body 0 is introduced into the lamp cover through the whirl-shaped heat dissipating rib 1
- the cyclone-shaped heat dissipating rib 1 accelerates the flow speed of the air, and then the air is carried into the lamp cover by the heat dissipation hole 11, so that the heat generated by the LED in the lamp cover is taken out from the wind continuously entering the lamp cover, thereby lowering the lamp cover The heat inside.
- the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises the following steps:
- the components are prepared according to the ceramic material formulation for the ceramic heat sink.
- the above ceramic materials include: 85% alumina, 0.5% silica, 3.5% calcium carbonate, 1.0% kaolin, 1.0. % of pore former.
- Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking
- the moisture content of the dried material is less than 0.03%, and the particle size of the material after grinding is 18 ⁇ m.
- step (2) The material in the step (2) is injection-molded in the grouting machine and the mold, and then dried in a 300-degree oven to form a ceramic heat sink.
- the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises The following steps:
- the components are prepared according to the ceramic material formulation for the ceramic heat sink. According to the mass percentage, the above ceramic materials include: 87% alumina, 0.5% silica, 1.5% calcium carbonate, 3% kaolin, 6 % pore former.
- Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking The moisture content of the dried material was 0.01, and the particle diameter of the material after grinding was 19 ⁇ m.
- the material in the step (2) is formed by grouting in the grouting machine and the mold, and then dried in a 350 degree oven to form a ceramic heat sink.
- the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises the following steps:
- the components are prepared according to the ceramic material formulation for the ceramic heat sink. According to the mass percentage, the above ceramic materials include: 90% alumina, 1.5% silica, 2.5% calcium carbonate, 1% kaolin, 5 % of pore former.
- Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking The moisture content of the dried material was 0.01, and the particle diameter of the material after grinding was 19 ⁇ m.
- Step (2) The material in the step (2) is molded into a grouting machine and a mold, and then dried in a 400-degree oven to form a ceramic heat sink.
- the content of alumina when the content of alumina is higher than 90%, the specific heat capacity of the body becomes large, which is disadvantageous for heat dissipation, and the heat dissipation effect is deteriorated.
- the content of alumina is less than 85%, the structure of the body is caused. The strength is greatly reduced; when the content of silica is higher than 1.5%, the heat dissipation performance of the body will be deteriorated.
- the content of silica When the content of silica is less than 0.5%, the temperature resistance effect of the body will be deteriorated; -3.0% kaolin; when the content of kaolin is less than 1%, the bonding property between the components is deteriorated, and after a long time of use, the powder of silica or alumina is dropped on the body, and at the same time, kaolin When the content is higher than 3.0%, the kaolin will be excessively shrunk and the yield will be low during the drying and sintering.
- the pore-forming agent is vaporized in the low-temperature sintering of 300-400 degrees, and then pores are generated inside the body, and the pores can increase the contact area between the body and the air, which is favorable for heat dissipation.
- the addition of alumina to the ceramic material can improve the heat dissipation efficiency, and a cyclone-shaped heat dissipation lattice is provided on the outer circumference of the heat sink body, which increases the heat dissipation surface area and improves the heat dissipation efficiency.
Abstract
Description
Claims (9)
- 一种高效散热的LED陶瓷灯杯,其包括本体和设置在所述本体上若干散热格棱,其特征在于:所述散热格棱呈旋风状排布,所述散热格棱包括三个散热面,所述散热面内陷于所述本体的外表面,所述散热格棱的一端为散热孔,所述散热格棱的另一端露出所述本体的外表面。
- 根据权利要求1所述的高效散热的LED陶瓷灯杯,其特征在于:所述散热器与灯罩卡接的一端向内凹陷形成放置面,所述放置面与本体的内壁形成有供灯罩卡接的翻边。
- 根据权利要求2所述的高效散热的LED陶瓷灯杯,其特征在于:所述放置面沿本体的轴向贯穿设置有供导线穿设的通孔。
- 根据权利要求1所述的高效散热的LED陶瓷灯杯,其特征在于:所述散热器呈杯状结构,所述本体横截面积较小的一端可拆卸固定连接有灯头。
- 根据权利要求4所述的高效散热的LED陶瓷灯杯,其特征在于:所述本体横截面积较小的一端为固定部,所述固定部上设置有螺纹,所述灯头与固定部螺纹连接。
- 根据权利要求5所述的高效散热的LED陶瓷灯杯,其特征在于:所述固定部上设置避免导线压断的导线孔。
- 制备权利要求1-6任意一项中所述的高效散热的LED陶瓷灯杯的方法,其特征在于,包括:(1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,所述陶瓷材料包括:85-90%的氧化铝,0.5-1.5%二氧 化硅,1.5-3.5%碳酸钙,1.0-3.0%高岭土,5-7%的造孔剂;(2)处理材料:将步骤(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;(3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆后在300-400度的烘箱中烘干成型,制成陶瓷灯杯。
- 根据权利要求7所述的制备高效散热的LED陶瓷散热器的方法,其特征在于:步骤(1)中所述所述陶瓷材料包括:90%的氧化铝,1.5%二氧化硅,2.5%碳酸钙,1.0%高岭土,5%的造孔剂。
- 根据权利要求7所述的制备高效散热的LED陶瓷散热器的方法,其特征在于:步骤(2)中将材料烘干至含水率低于0.05%,将材料研磨粒径低于20μm。
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CN111642947A (zh) * | 2020-05-08 | 2020-09-11 | 醴陵佳盈家居陶瓷有限公司 | 一种抗摔型陶瓷碗及其加工方法 |
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CN104613448A (zh) * | 2015-01-19 | 2015-05-13 | 江苏翠钻照明有限公司 | 一种高效散热的led陶瓷灯杯及其制备方法 |
CN106969297A (zh) * | 2017-03-24 | 2017-07-21 | 成都佰思汇信科技有限责任公司 | 一种led天花灯 |
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