WO2016115897A1 - 一种高效散热的led陶瓷灯杯及其制备方法 - Google Patents

一种高效散热的led陶瓷灯杯及其制备方法 Download PDF

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WO2016115897A1
WO2016115897A1 PCT/CN2015/087752 CN2015087752W WO2016115897A1 WO 2016115897 A1 WO2016115897 A1 WO 2016115897A1 CN 2015087752 W CN2015087752 W CN 2015087752W WO 2016115897 A1 WO2016115897 A1 WO 2016115897A1
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heat
heat dissipation
dissipating
ceramic
lamp cup
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PCT/CN2015/087752
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English (en)
French (fr)
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华仁喜
朱启年
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江苏翠钻照明有限公司
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Publication of WO2016115897A1 publication Critical patent/WO2016115897A1/zh

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3208Calcium oxide or oxide-forming salts thereof, e.g. lime
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/349Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Definitions

  • the invention relates to the field of lighting technology, and more particularly to an LED ceramic lamp cup for efficient heat dissipation and a preparation method thereof.
  • LED has the characteristics of energy saving, environmental protection, safety, long service life, high brightness, easy dimming, etc. It can be widely used in various indications, displays, devices, backlights and general lighting fields. In the early stage of LED development, it is mainly used in low-power lighting or decoration, and its heat dissipation performance is matched with the power, and there is no heat dissipation problem. However, LEDs are now more and more used in high-power fields. Therefore, heat dissipation is a major goal of LED development.
  • the heat dissipation performance of LED ceramic lamps is an important indicator for evaluating the performance of LED ceramic lamps, and its heat dissipation performance mainly determines the service life of LED ceramic lamps. Therefore, LED ceramic lamp radiators are an important component of LED ceramic lamps. Therefore, the development direction of LED ceramic lamps is how to improve its heat dissipation efficiency.
  • the traditional LED heat sink mainly uses aluminum as the heat sink, and the heat sink is stuck with the lamp cover.
  • the heat dissipation effect of the aluminum material as the LED ceramic lamp heat sink is good, the aluminum material has high cost, and the aluminum material is further The processing cost is also high, resulting in a relatively high price of high-power LED products.
  • copper radiators or some auxiliary means such as water cooling or air cooling to dissipate heat, but these radiators are either complicated in structure or high in cost, and can not be applied to LED ceramics under the premise of reducing cost and improving heat dissipation performance. In the light.
  • the object of the present invention is to provide an LED ceramic lamp cup with good heat dissipation effect and high efficiency heat dissipation and a preparation method thereof.
  • an LED ceramic lamp cup with high heat dissipation comprising a body and a plurality of heat dissipating ribs disposed on the body, wherein the heat dissipating ribs are arranged in a whirlwind manner.
  • the heat dissipating rib includes three heat dissipating surfaces, the heat dissipating surface is recessed on an outer surface of the body, one end of the heat dissipating rib is a heat dissipating hole, and the other end of the heat dissipating rib is exposed to the body The outer surface.
  • one end of the heat sink that is engaged with the lamp cover is recessed inward to form a placement surface, and the placement surface forms a flange with the inner wall of the body for engaging the lamp cover.
  • the placement surface is provided with a through hole through which the wire is bored.
  • the heat sink has a cup-shaped structure, and one end of the body having a small cross-sectional area is detachably and fixedly connected with the lamp cap.
  • the end of the body having a small cross-sectional area is a fixing portion, the fixing portion is provided with a thread, and the lamp cap is screwed with the fixing portion.
  • the fixing portion is provided with a wire hole for preventing the wire from being broken.
  • the method of preparing an LED ceramic lamp of the claims comprises the steps of:
  • the components are prepared according to the ceramic material formulation for the ceramic heat sink, and the ceramic material comprises: 85-90% alumina, 0.5-1.5% silica, 1.5-3.5% carbonic acid by mass percentage. Calcium, 1.0-3.0% kaolin, 5-7% pore former;
  • Processing material drying each component material prepared in the step (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material;
  • step (2) The material in the step (2) is dried in a 300-400 degree oven after being grouted in the grouting machine and the mold to form a ceramic lamp cup.
  • the ceramic material described in the step (1) comprises: 90% alumina, 1.5% silica, 3.0% calcium carbonate, 1.0% kaolin, 5% pore former.
  • step (2) the material is dried to a moisture content of less than 0.05% and the material has a ground particle size of less than 20 ⁇ m.
  • the heat dissipation rib of the invention directly communicates with the cavity between the lamp cover and the heat sink, and the heat dissipation ribs take away the high hot air in the cavity, thereby cooling the temperature and having a good heat dissipation effect. At the same time, it increases the contact area between the radiator and the air, and improves the dispersion of the radiator. Thermal efficiency.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is a partial cross-sectional view of the present invention.
  • FIGS. 1 through 2 Embodiments of the present invention will be further described with reference to FIGS. 1 through 2.
  • an LED ceramic lamp cup with high heat dissipation includes a body 0.
  • the body 0 has a cup shape, and the body 0 has two end faces of a large and a small cross-sectional area, and the large end is recessed downward to form a placement surface. 2, the central position of the placement surface 2 is downwardly formed with a through hole 21, and the through hole 21 is disposed along the axial direction of the body 0.
  • the ceramic lamp cup uses an LED as a light source, and the LED is generally soldered or attached to the PCB.
  • the PCB board provided with the LED light source is disposed on the placement surface 2, and is fixed to the placement surface 2 by means of gluing or the like; the end of the heat sink and the lamp cover is recessed inward to form the placement surface 2, the placement surface 2 and the body 0
  • the inner wall is formed with a flange 22 for the lamp cover to be engaged; and the through hole 21 is for the wire of the PCB board, and one end of the wire is connected with the PCB board disposed on the placement surface 2, and most of the wire is worn.
  • the through hole 21 is disposed to be connected with the lamp cap disposed under the through hole 21; at the same time, the end of the body 0 having a small cross-sectional area is provided with the thread 3, and the lamp cap is matched with the thread 3 of the body 0, so that the lamp cap is fixedly connected with the body 0,
  • the lamp cap structure in the invention is as invented by the application number "201110264489.X"
  • the lamp cap and the base are fixed by a dot, and the dot fixing is a fixing method similar to glue or riveting, because the glue melts after being heated, and the fixing effect is deteriorated, so the body is horizontally crossed.
  • the end of the smaller cross-sectional area is provided with a thread 3, and the body 0 is connected with the lamp cap through the thread 3, and does not need to be glued, and has a fixed effect by mechanical means, and is not affected by the heat of the lamp hair, and the connection is more stable.
  • one end of the body 0 having a small cross-sectional area having a thread 3 is a fixing portion 4 , and the thread 3 is disposed on the fixing portion 4 , and the fixing portion 4 is further provided with a wire hole 31 , and the wire hole 31 is located at the thread
  • the wire hole 31 has a mirror-shaped zigzag shape, and the bottom of the lamp cap is connected with the fire wire of the PCB board.
  • the side of the lamp head is connected to the neutral line on the PCB.
  • the body 0 is made of ceramic, and the ceramic is non-conductive, so the zero line of the PCB board cannot be electrically connected to the side wall of the lamp cap, so the wire hole is provided.
  • the wire is passed through the wire hole 31 and can be electrically connected to the side wall of the lamp cap, thereby generating a current loop, but the lamp cap must be welded to the wire at the time of installation. If the lamp cap is screwed into the body 0, the wire will be caused. The connection position with the lamp cap is broken, so that the wire hole 31 is provided at the smaller end of the body 0, and the wire hole 31 is inclined upward along the rotation direction of the hole of the screw 3, so that when the lamp head rotates, the wire also follows. Rotation within the wire hole 31 does not cause a breakage problem.
  • One end of the heat dissipating rib 1 is a heat dissipating hole 11, and the other end of the heat dissipating rib 1 is exposed to the outer surface of the main body 0, and the wind flowing through the main body 0 is introduced into the lamp cover through the whirl-shaped heat dissipating rib 1
  • the cyclone-shaped heat dissipating rib 1 accelerates the flow speed of the air, and then the air is carried into the lamp cover by the heat dissipation hole 11, so that the heat generated by the LED in the lamp cover is taken out from the wind continuously entering the lamp cover, thereby lowering the lamp cover The heat inside.
  • the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises the following steps:
  • the components are prepared according to the ceramic material formulation for the ceramic heat sink.
  • the above ceramic materials include: 85% alumina, 0.5% silica, 3.5% calcium carbonate, 1.0% kaolin, 1.0. % of pore former.
  • Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking
  • the moisture content of the dried material is less than 0.03%, and the particle size of the material after grinding is 18 ⁇ m.
  • step (2) The material in the step (2) is injection-molded in the grouting machine and the mold, and then dried in a 300-degree oven to form a ceramic heat sink.
  • the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises The following steps:
  • the components are prepared according to the ceramic material formulation for the ceramic heat sink. According to the mass percentage, the above ceramic materials include: 87% alumina, 0.5% silica, 1.5% calcium carbonate, 3% kaolin, 6 % pore former.
  • Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking The moisture content of the dried material was 0.01, and the particle diameter of the material after grinding was 19 ⁇ m.
  • the material in the step (2) is formed by grouting in the grouting machine and the mold, and then dried in a 350 degree oven to form a ceramic heat sink.
  • the method for preparing the above-mentioned high-efficiency heat-dissipating LED ceramic heat sink comprises the following steps:
  • the components are prepared according to the ceramic material formulation for the ceramic heat sink. According to the mass percentage, the above ceramic materials include: 90% alumina, 1.5% silica, 2.5% calcium carbonate, 1% kaolin, 5 % of pore former.
  • Treating materials drying each component material prepared in (1), then weighing and mixing according to the content in the formula, and uniformly grinding the uniformly mixed material; in this step, measuring and baking The moisture content of the dried material was 0.01, and the particle diameter of the material after grinding was 19 ⁇ m.
  • Step (2) The material in the step (2) is molded into a grouting machine and a mold, and then dried in a 400-degree oven to form a ceramic heat sink.
  • the content of alumina when the content of alumina is higher than 90%, the specific heat capacity of the body becomes large, which is disadvantageous for heat dissipation, and the heat dissipation effect is deteriorated.
  • the content of alumina is less than 85%, the structure of the body is caused. The strength is greatly reduced; when the content of silica is higher than 1.5%, the heat dissipation performance of the body will be deteriorated.
  • the content of silica When the content of silica is less than 0.5%, the temperature resistance effect of the body will be deteriorated; -3.0% kaolin; when the content of kaolin is less than 1%, the bonding property between the components is deteriorated, and after a long time of use, the powder of silica or alumina is dropped on the body, and at the same time, kaolin When the content is higher than 3.0%, the kaolin will be excessively shrunk and the yield will be low during the drying and sintering.
  • the pore-forming agent is vaporized in the low-temperature sintering of 300-400 degrees, and then pores are generated inside the body, and the pores can increase the contact area between the body and the air, which is favorable for heat dissipation.
  • the addition of alumina to the ceramic material can improve the heat dissipation efficiency, and a cyclone-shaped heat dissipation lattice is provided on the outer circumference of the heat sink body, which increases the heat dissipation surface area and improves the heat dissipation efficiency.

Abstract

一种高效散热的LED陶瓷灯杯及其制备方法,高效散热的LED陶瓷灯杯包括本体(0)和设置在所述本体(0)上若干散热格棱(1),所述散热格棱(1)呈旋风状排布,所述散热格棱(1)包括三个散热面,所述散热面内陷于所述本体(0)的外表面,所述散热格棱(1)的一端为散热孔(11),所述散热格棱(1)的另一端露出所述本体(0)的外表面。通过散热棱格(1)直接与灯罩和散热器之间的空腔连通,散热棱格(1)将空腔中的高热空气带走,起到了降温的作用,具有良好的散热效果,同时其增加了散热器与空气的接触面积,提高了散热器的散热效率。

Description

一种高效散热的LED陶瓷灯杯及其制备方法 技术领域
本发明涉及一种照明技术领域,更具体地说,它涉及一种高效散热的LED陶瓷灯杯及其制备方法。
背景技术
LED具有节能、环保、安全、使用寿命长、高亮度、易调光等优良特点,可以广泛应用于各种指示、显示、装置、背光源和普通照明领域中。在LED发展初期,主要用于小功率照明或者装饰中,其散热性能跟跟功率匹配,不会出现散热问题。但是,现在LED越来越多的应用在大功率领域中,因此,散热问题是LED发展的一个主要目标。
LED陶瓷灯的散热性能是评价LED陶瓷灯性能的一个重要指标,并且其散热性能也主要决定LED陶瓷灯的使用寿命长短,因此,LED陶瓷灯散热器是LED陶瓷灯的一个重要部件。因此,现在LED陶瓷灯的发展方向都是怎样提高它的散热效率。
传统的LED散热器主要采用铝才来作为散热器,同时散热器是与灯罩卡接的,虽然铝材作为LED陶瓷灯散热器的散热效果较好,但是铝材料成本高,再者铝材料的加工成本也高,导致目前大功率LED产品价格相对较高。随着技术的发展,现在也有铜散热器或者采用水冷或风冷等一些辅助手段来散热,但是这些散热器要么结构复杂,要么成本高,无法适应降低成本提高散热性能的前提下来应用到LED陶瓷灯中。
发明内容
针对现有技术存在的不足,本发明的目的在于提供一种散热效果好的高效散热的LED陶瓷灯杯及其制备方法。
为实现上述目的,本发明提供了如下技术方案:一种高效散热的LED陶瓷灯杯,其包括本体和设置在所述本体上若干散热格棱,所述散热格棱呈旋风状排布,所述散热格棱包括三个散热面,所述散热面内陷于所述本体的外表面,所述散热格棱的一端为散热孔,所述散热格棱的另一端露出所述本体 的外表面。
作为优选,所述散热器与灯罩卡接的一端向内凹陷形成放置面,所述放置面与本体的内壁形成有供灯罩卡接的翻边。
作为优选,所述放置面沿本体的轴向贯穿设置有供导线穿设的通孔。
作为优选,所述散热器呈杯状结构,所述本体横截面积较小的一端可拆卸固定连接有灯头。
作为优选,所述本体横截面积较小的一端为固定部,所述固定部上设置有螺纹,所述灯头与固定部螺纹连接。
作为优选,所述固定部上设置避免导线压断的导线孔。
作为优选,制备权利要求LED陶瓷灯的方法,包括以下步骤:
(1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,所述陶瓷材料包括:85-90%的氧化铝,0.5-1.5%二氧化硅,1.5-3.5%碳酸钙,1.0-3.0%高岭土,5-7%的造孔剂;
(2)处理材料:将步骤(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;
(3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆后在300-400度的烘箱中烘干成型,制成陶瓷灯杯。
作为优选,步骤(1)中所述所述陶瓷材料包括:90%的氧化铝,1.5%二氧化硅,3.0%碳酸钙,1.0%高岭土,5%的造孔剂。
作为优选,步骤(2)中将材料烘干至含水率低于0.05%,将材料研磨粒径低于20μm。
通过采用上述技术方案,本发明中散热棱格直接与灯罩和散热器之间的空腔连通,散热棱格将空腔中的高热空气带走,起到了降温的作用,具有良好的散热效果,同时其增加了散热器与空气的接触面积,提高了散热器的散 热效率。
附图说明
图1为本发明的结构示意图;
图2为本发明的局部剖面示意图。
图中:0、本体;1、散热格棱;11、散热孔;2、放置面;21、通孔;22、翻边;3、螺纹;31、导线孔;4、固定部。
具体实施方式
参照图1至图2对本发明的实施例做进一步说明。
如图1所示,一种高效散热的LED陶瓷灯杯,包括其本体0,该本体0呈杯型,本体0具有横截面积一大一小两个端面,大端向下凹陷形成放置面2,放置面2的中心位置向下形成通孔21,通孔21是沿本体0的轴向贯穿设置的,该种陶瓷灯杯采用LED作为发光源,LED一般是焊接或贴在PCB板上的,设置有LED光源的PCB板设置在放置面2上,且通过胶粘等方式与放置面2固定;散热器与灯罩卡接的一端向内凹陷形成放置面2,放置面2与本体0的内壁形成有供灯罩卡接的翻边22;而通孔21是用于供PCB板上的导线穿设的,导线的一端与设置在放置面2上的PCB板连接,导线的大部分穿设过通孔21,从而与设置在通孔21下方的灯头连接;同时本体0横截面积较小的一端设置有螺纹3,灯头与本体0螺纹3配合,从而灯头与本体0固定连接,本发明中的灯头结构如申请号为“201110264489.X”的发明专利中公开的灯头,该专利中,灯头与底座通过打点固定,打点固定是一种类似于胶粘或者铆接的固定方式,因为胶水在受热后会发生融化,固定效果会变差,所以在本体0横截面积较小的一端设置有螺纹3,本体0通过螺纹3与灯头连接,无需胶粘,通过机械的方式起到了固定效果,不会受到灯头发热的影响,连接的更加稳定。
如图1所示,本体0横截面积较小的具有螺纹3的一端为固定部4,螺纹3设置在固定部4上,固定部4上还设置有导线孔31,导线孔31位于螺纹的范围内,该导线孔31呈镜像的Z字形状,灯头的底部与PCB板的火线连 接,灯头的侧面与PCB上的零线连接,然而本体0是由陶瓷制成的,而且陶瓷是不导电的,所以PCB板的零线无法与灯头的侧壁导通,故设置有导线孔31解决该问题,导线穿设过导线孔31后即可与灯头的侧壁导通,从而产生电流回路,但是灯头在安装时候须先与导线焊接,如果将灯头旋入本体0将会导致导线与灯头的连接位置的断裂,所以在本体0较小的一端设置有导线孔31,导线孔31的走向是沿着螺纹3孔的旋转方向倾斜向上的,从而当灯头发生旋转时,导线也跟随在导线孔31内旋转不会发生折断问题。
如图1和图2所示,本体0上若干散热格棱1,散热格棱1呈旋风状排布,散热格棱1包括三个散热面,所述散热面内陷于所述本体0的外表面,散热格棱1的一端为散热孔11,散热格棱1的另一端露出所述本体0的外表面,流经本体0上的风经过旋风状的排布的散热格棱1被引入灯罩内,旋风状的散热格棱1加快了空气的流动速度,然后空气被散热孔11带入灯罩内,从而LED在灯罩内产生的热量又被从不断进入灯罩内的风带出,从而降低灯罩内的热量。
实施例1
本实施例中,制备以上上述的高效散热的LED陶瓷散热器的方法,包括以下几步:
(1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,上述陶瓷材料包括:85%的氧化铝,0.5%二氧化硅,3.5%碳酸钙,1.0%高岭土,1.0%的造孔剂。
(2)处理材料:将(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;在该步骤中,测量烘干后的材料的含水率,含水率要低于0.03%,研磨后材料的粒径为18μm。
(3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆成型,然后在300度的烘箱中烘干成型,制成陶瓷散热器。
实施例2
本实施例中,制备以上上述的高效散热的LED陶瓷散热器的方法,包括 以下几步:
(1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,上述陶瓷材料包括:87%的氧化铝,0.5%二氧化硅,1.5%碳酸钙,3%高岭土,6%造孔剂。
(2)处理材料:将(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;在该步骤中,测量烘干后的材料的含水率,含水率为0.01,研磨后材料的粒径为19μm。
(3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆成型,然后放入350度的烘箱中烘干成型,制成陶瓷散热器。
实施例3
本实施例中,制备以上上述的高效散热的LED陶瓷散热器的方法,包括以下几步:
(1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,上述陶瓷材料包括:90%的氧化铝,1.5%二氧化硅,2.5%碳酸钙,1%高岭土,5%的造孔剂。
(2)处理材料:将(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;在该步骤中,测量烘干后的材料的含水率,含水率为0.01,研磨后材料的粒径为19μm。
(3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆成型,然后放入400度的烘箱中烘干成型,制成陶瓷散热器。
按以上三种配方和实施步骤,各制作100个进行检测,其测试结果如下表所示:
Figure PCTCN2015087752-appb-000001
Figure PCTCN2015087752-appb-000002
本发明中,当氧化铝的含量高于90%时,将会导致本体的比热容变大,不利于散热,散热效果变差,当氧化铝的含量低于85%时,将会导致本体的结构强度大大降低;当二氧化硅的含量高于1.5%时,将会导致本体的散热性能变差,当二氧化硅的含量低于0.5%时,将会导致本体的耐温效果变差;1.0-3.0%高岭土;当高岭土的含量低于1%时,各组分之间的粘结性能变差,长时间使用后,本体上会掉落二氧化硅或者氧化铝的粉料,同时当高岭土的含量高于3.0%时,将会导致本体在烘干烧结时,高岭土过度收缩,成品率变低。同时,造孔剂在300-400度的低温烧结中发生气化,然后在本体内部产生气孔,气孔能增加本体与空气的接触面积,利于散热。
本发明的陶瓷散热器,在陶瓷材料中添加氧化铝能够提高散热效率,并且在散热器本体的外周设有旋风状的散热格棱,增加了散热表面积,提高了散热效率。
以上所述仅是本发明的优选实施方式,本发明的保护范围并不仅局限于上述实施例,凡属于本发明思路下的技术方案均属于本发明的保护范围。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理前提下的若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。

Claims (9)

  1. 一种高效散热的LED陶瓷灯杯,其包括本体和设置在所述本体上若干散热格棱,其特征在于:所述散热格棱呈旋风状排布,所述散热格棱包括三个散热面,所述散热面内陷于所述本体的外表面,所述散热格棱的一端为散热孔,所述散热格棱的另一端露出所述本体的外表面。
  2. 根据权利要求1所述的高效散热的LED陶瓷灯杯,其特征在于:所述散热器与灯罩卡接的一端向内凹陷形成放置面,所述放置面与本体的内壁形成有供灯罩卡接的翻边。
  3. 根据权利要求2所述的高效散热的LED陶瓷灯杯,其特征在于:所述放置面沿本体的轴向贯穿设置有供导线穿设的通孔。
  4. 根据权利要求1所述的高效散热的LED陶瓷灯杯,其特征在于:所述散热器呈杯状结构,所述本体横截面积较小的一端可拆卸固定连接有灯头。
  5. 根据权利要求4所述的高效散热的LED陶瓷灯杯,其特征在于:所述本体横截面积较小的一端为固定部,所述固定部上设置有螺纹,所述灯头与固定部螺纹连接。
  6. 根据权利要求5所述的高效散热的LED陶瓷灯杯,其特征在于:所述固定部上设置避免导线压断的导线孔。
  7. 制备权利要求1-6任意一项中所述的高效散热的LED陶瓷灯杯的方法,其特征在于,包括:
    (1)备料:按照陶瓷散热器用的陶瓷材料配方准备各组分,按质量百分比计,所述陶瓷材料包括:85-90%的氧化铝,0.5-1.5%二氧 化硅,1.5-3.5%碳酸钙,1.0-3.0%高岭土,5-7%的造孔剂;
    (2)处理材料:将步骤(1)中准备的各个组分材料烘干,然后再按照配方中的含量称取和混合到一起,再将混合均匀的材料研磨均匀;
    (3)成型:将步骤(2)中的材料在注浆机中和模具配合注浆后在300-400度的烘箱中烘干成型,制成陶瓷灯杯。
  8. 根据权利要求7所述的制备高效散热的LED陶瓷散热器的方法,其特征在于:步骤(1)中所述所述陶瓷材料包括:90%的氧化铝,1.5%二氧化硅,2.5%碳酸钙,1.0%高岭土,5%的造孔剂。
  9. 根据权利要求7所述的制备高效散热的LED陶瓷散热器的方法,其特征在于:步骤(2)中将材料烘干至含水率低于0.05%,将材料研磨粒径低于20μm。
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