WO2012070842A2 - 태양 전지의 밀봉재용 시트 및 그 제조 방법 - Google Patents
태양 전지의 밀봉재용 시트 및 그 제조 방법 Download PDFInfo
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- WO2012070842A2 WO2012070842A2 PCT/KR2011/008919 KR2011008919W WO2012070842A2 WO 2012070842 A2 WO2012070842 A2 WO 2012070842A2 KR 2011008919 W KR2011008919 W KR 2011008919W WO 2012070842 A2 WO2012070842 A2 WO 2012070842A2
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000007789 sealing Methods 0.000 title claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 72
- 239000004840 adhesive resin Substances 0.000 claims abstract description 62
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 238000004519 manufacturing process Methods 0.000 claims abstract description 43
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 17
- 230000008018 melting Effects 0.000 claims abstract description 17
- 239000003566 sealing material Substances 0.000 claims description 99
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 29
- 239000005977 Ethylene Substances 0.000 claims description 29
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 17
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 17
- -1 crosslinking aids Substances 0.000 claims description 15
- 229920005672 polyolefin resin Polymers 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 9
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 8
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 239000011148 porous material Substances 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 239000004611 light stabiliser Substances 0.000 claims description 4
- 238000003892 spreading Methods 0.000 claims description 3
- 230000007480 spreading Effects 0.000 claims description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 229920005678 polyethylene based resin Polymers 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 abstract description 2
- 238000010298 pulverizing process Methods 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 34
- 230000008569 process Effects 0.000 description 23
- 229920001577 copolymer Polymers 0.000 description 17
- 230000004927 fusion Effects 0.000 description 8
- 230000008901 benefit Effects 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 239000002671 adjuvant Substances 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003017 thermal stabilizer Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- NHEUUFQZSIJBCY-UHFFFAOYSA-N butylperoxy 2-ethylhexyl carbonate Chemical group CCCCOOOC(=O)OCC(CC)CCCC NHEUUFQZSIJBCY-UHFFFAOYSA-N 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005606 polypropylene copolymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- HJIAMFHSAAEUKR-UHFFFAOYSA-N (2-hydroxyphenyl)-phenylmethanone Chemical class OC1=CC=CC=C1C(=O)C1=CC=CC=C1 HJIAMFHSAAEUKR-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- VNFXPOAMRORRJJ-UHFFFAOYSA-N (4-octylphenyl) 2-hydroxybenzoate Chemical compound C1=CC(CCCCCCCC)=CC=C1OC(=O)C1=CC=CC=C1O VNFXPOAMRORRJJ-UHFFFAOYSA-N 0.000 description 1
- AQSGIPQBQYCRLQ-UHFFFAOYSA-N (6,6-dihydroxy-4-methoxycyclohexa-2,4-dien-1-yl)-phenylmethanone Chemical compound C1=CC(OC)=CC(O)(O)C1C(=O)C1=CC=CC=C1 AQSGIPQBQYCRLQ-UHFFFAOYSA-N 0.000 description 1
- UONCERAQKBPLML-UHFFFAOYSA-N (6-ethoxypyridin-3-yl)boronic acid Chemical compound CCOC1=CC=C(B(O)O)C=N1 UONCERAQKBPLML-UHFFFAOYSA-N 0.000 description 1
- QTUVVCHBBGEBAD-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane;2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1.CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C QTUVVCHBBGEBAD-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical group CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- CAMBAGZYTIDFBK-UHFFFAOYSA-N 3-tert-butylperoxy-2-methylpropan-1-ol Chemical compound CC(CO)COOC(C)(C)C CAMBAGZYTIDFBK-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- FETUUKHOLDNMQO-UHFFFAOYSA-N 6-benzoyl-1-hydroxy-3-methoxycyclohexa-2,4-diene-1-carboxylic acid Chemical compound C1=CC(OC)=CC(O)(C(O)=O)C1C(=O)C1=CC=CC=C1 FETUUKHOLDNMQO-UHFFFAOYSA-N 0.000 description 1
- QLZINFDMOXMCCJ-UHFFFAOYSA-N 7-(7-hydroxyheptylperoxy)heptan-1-ol Chemical compound OCCCCCCCOOCCCCCCCO QLZINFDMOXMCCJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- FSRYENDEMMDKMT-UHFFFAOYSA-N butoxy ethaneperoxoate Chemical group CCCCOOOC(C)=O FSRYENDEMMDKMT-UHFFFAOYSA-N 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- MASNVFNHVJIXLL-UHFFFAOYSA-N ethenyl(ethoxy)silicon Chemical compound CCO[Si]C=C MASNVFNHVJIXLL-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229940038597 peroxide anti-acne preparations for topical use Drugs 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920005670 poly(ethylene-vinyl chloride) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007573 shrinkage measurement Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell sealing material sheet and a method of manufacturing the same, and more particularly, to a solar cell sealing material sheet having a significantly low heat shrinkage rate, excellent flexibility, and excellent bubble discharge capability at the manufacturing stage.
- solar cells are in the spotlight as clean and depleted energy sources.
- solar cells When solar cells are used outdoors, such as the roof of a building, it is common to use solar cells in the form of solar cell modules.
- the solar cell is formed of a sealing material sheet 4 made of a heat-adhesive resin on the surface of the surface-side protection member 1 made of glass or transparent resin, and a plurality of solar cell elements thereon. (3) up. Moreover, the sheet
- FIG. 2 shows a solar cell module in which the sealing sheets 4 and 4 are melted and integrated with other members, and the sealing sheets 4 and 4 are integrated as a sealing material 4 '. Doing.
- the heat-adhesive resin sheet used for the said sealing material sheet 4 was formed by the extrusion process by T-die, or the calender process, in many cases, the heat-adhesive resin sheet extended in the machine direction formed in this way is All have large heat shrinkage. For this reason, when such a heat-adhesive resin sheet is used for the sheet
- the bubble shrinks when the temperature is low while the solar cell is exposed to the outdoors for a long time, and when the temperature is high, the bubble expands. Cracking occurs in the module, and there is a problem that adversely affect the long-term durability and reliability of the product.
- Method for producing a sheet for a solar cell sealing material comprises the steps of (a) providing a heat-adhesive resin containing the olefin resin as a main component, (b) the heat-adhesive resin Powdered and dispersed, and (c) heating the heat-adhesive resin powder below the melting temperature of the resin powder to form a sheet including a plurality of pores.
- Sheet for a sealing material of a solar cell for achieving the above object is a sheet for a sealing material of a solar cell comprising a heat-adhesive resin containing a olefin resin as a main component, the sheet of the powder form It is characterized in that the heat-adhesive resin is fused and formed while having a plurality of voids.
- the method for manufacturing a sheet for solar cell sealing material according to the present invention has an advantage in that all harmful gases generated in the manufacturing process are discharged into the pores by manufacturing the sheet having the pores by heat-sealing the resin powder at a predetermined temperature.
- the sheet for sealing material of the solar cell according to the present invention is not manufactured by extrusion, there is an advantage that the heat shrinkage is low and flexibility is also very high because the resin powder is formed by fusion.
- the sheet is provided with a plurality of voids and easy to discharge the harmful gas generated during the manufacturing of the solar cell module, has the advantage of excellent bubble discharge capacity.
- FIG. 2 is a cross-sectional view showing the configuration of a general solar cell.
- 3a to 3e are photographs showing the bubble discharge capacity test results according to the vacuum evacuation time of the solar cell module.
- 4A to 4H are photographs showing the results of comparison of shrinkage with respect to heat of the solar cell sealing material sheet.
- the solar cell sealing material sheet 4 is a solar cell sealing material sheet comprising a heat-adhesive resin containing olefinic resin as a main component, the sheet is a powder-like heat-adhesive resin is fused and many It is characterized by being formed while having a void.
- the heat adhesive resin used for the said sealing material sheet 4 means resin which adhesiveness expresses by adding heat.
- Polymers used in the resin may be an olefin resin, polyvinyl butyral, copolymerized nylon, polyester, and the like.
- the olefin resin may be preferably used because of its excellent processability and durability.
- the olefin resin is a general term for a polymer obtained by polymerizing or copolymerizing olefins such as ethylene, propylene, butadiene and isoprene or diolefins, and also includes copolymers and ionomers of ethylene with other monomers such as vinyl acetate and acrylic esters. can do.
- the olefin resin may include both an ethylene resin and a propylene resin, and specifically, polyethylene, polypropylene, polymethylpentene, ethylene vinyl chloride copolymer, ethylene vinyl acetate copolymer, ethylene vinyl alcohol copolymer, Chlorinated polyethylene, chlorinated polypropylene, and the like.
- Ethylene-based resins are copolymers of ethylene and a resin copolymerizable with ethylene. Examples thereof include the following.
- Copolymers of ethylene and vinyl esters such as vinyl acetate or vinyl propionate, copolymers of ethylene and unsaturated carboxylic acid esters such as methyl acrylate, ethyl acrylate, isobutyl acrylate, nbutyl acrylate and methyl methacrylate, and ethylene
- a copolymer of an unsaturated carbonic acid such as acrylic acid and methacrylic acid or a portion of ethylene and an unsaturated carbonic acid neutralized with metal salts such as sodium, zinc and lithium, propylene, 1-butene, 1-hexene and 1-octene
- metal salts such as sodium, zinc and lithium, propylene, 1-butene, 1-hexene and 1-octene
- s-olefins such as, 4-methyl, 1-pentene and the like
- a mixture of two or more kinds of these copolymers may be used.
- ethylene vinyl acetate copolymer may be used.
- the ethylene-based resin may include a polyethylene-based resin, but is not particularly limited and may include both a homopolymer of ethylene or a copolymer in which a vinyl silane compound is graft polymerized in polyethylene.
- ethylene-based resin used for the sealing material sheet 4 of the said solar cell 60 weight% or more and less than 90 weight% of an ethylene content in a copolymer are preferable. More preferably, the ethylene content may range from 65% by weight to 75% by weight.
- the adhesiveness of a copolymer becomes strong and extraction as a powder becomes difficult. Even if a powder is obtained, the fluidity of the powder worsens, and as a result, uniform powder dispersion becomes difficult. If uniform powder dispersion is difficult, the uniform sealing sheet 4 cannot be obtained.
- the nonuniform sealing sheet means that the porosity of the resin is partially different or the sheet thickness is nonuniform depending on the position.
- the adhesiveness of the copolymer is stronger, there is a problem in that it is adhered to a roll or a die, which is a process equipment during the manufacture of the sheet for the sealing material may cause difficulties in the film forming process.
- the propylene copolymer used as a main component of the sealing material sheet of a solar cell is a copolymer of propylene and resin which can be copolymerized with propylene,
- the following is mentioned.
- a copolymer of propylene with an a-olefin having 2 to 20 carbon atoms other than at least one kind of propylene is mentioned, as an a-olefin having 2 to 20 carbon atoms other than propylene, ethylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene and 1-dode
- sen, 1- tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene, etc. are mentioned,
- the copolymer with ethylene or / and the a-olefin which has 4-10 carbon atoms is mentioned. It can be used preferably.
- melt mass flow (JIS K6924-1) of resin used for the sealing material sheet of this invention 1 (g / 10min) or more and 50 (g / 10min) or less are preferable.
- the melt mass flow of the said resin is less than 1 (g / 10min)
- liquidity of resin of a hot melt state will worsen.
- the sealing sheet using such a resin may leave gaps around the edges of the sealing material 4 and the solar cell element 3 or produce poor adhesion when the solar cell is manufactured.
- melt mass flow of the said resin becomes 50 (g / 10min) or more, since fluidity
- one or more additives described below may be added.
- a crosslinking agent can further be added in order to improve heat resistance, transparency, and adhesiveness of the sealing material sheet 4 which consists of olefin resin.
- a crosslinking agent organic peroxide is used preferably, The half-life temperature of the 1 hour is preferable 70-180 degreeC, and 90-160 degreeC is especially preferable.
- peroxides examples include tertiary butyl peroxy isopropyl carbonate, tertiary butyl peroxy 2-ethylhexyl carbonate, tertiary butyl peroxy acetate, tertiary butyl peroxy benzoate, tertiary butyl dicumyl peroxide, 2,5-dimethyl-2,5 bis (tertiarybutylperoxy) hexane, di tert-butylbutylperoxide, 2,5-dimethyl-2,5-bis (tertiarybutylperoxy) hexyn-1,1- Bis (tertbutylperoxy) cyclohexane, methylethylketone peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, tert-butylhydroperoxide, p-methanehydroperoxide, benzoyl per Oxides, p-chloro
- a crosslinking adjuvant can be further added.
- Triaryl cyanurate, triaryl isocyanurate, (meth) acrylic ester, etc. are mentioned as a crosslinking adjuvant.
- the addition amount of these crosslinking adjuvant is 0.05-15 (weight part) with respect to 100 (weight part) of ethylene-type copolymers, Preferably it is 0.1-5 (weight part).
- silane coupling agent can be added in order to improve the adhesiveness of an olefin resin.
- silane coupling agents (gamma) -chloropropyl methoxysilane, vinylethoxysilane, vinyl tris (ß-methoxyethoxy) silane, (gamma) -methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, (gamma) -Glycidoxypropyltrimethoxysilane, ⁇ -Glycidoxypropyltriethoxysilane, ß- (3,4-epoxyhexyl) ethyltriethoxysilane, vinyltrichlorosilane, ⁇ -melcaptopropyltrimethoxysilane and ⁇ -aminopropyltriethoxysilane and N- ⁇ - (aminoethyl) - ⁇ -aminopropyltrimethoxysilane.
- an olefin resin in order to prevent deterioration by the ultraviolet-ray in sunlight, can add additives, such as a ultraviolet absorber, a light stabilizer, and antioxidant.
- UV absorber 2-hydroxy-4-methoxybenzophenone, 2, 2-dihydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-2-carboxybenzophenone, 2-hydroxy Benzophenone series, such as oxy-4- octoxy benzophenone, 2- (2-hydroxy-3, 5-di- tert butylphenyl) benzotriazole, 2- (2-hydroxy-5- methylphenyl) benzotriazole
- salicylic acid esters such as benzotriazoles such as 2- (2-hydroxy-5-tertylphenyl) benzotriazole, phenyl salicylate and p-octylphenyl salicylate, and other 2-ethyl and 2'- Ethoxy-oxanide, etc. are mentioned.
- a hindered amine type is preferable.
- the antioxidants include hindered phenolic antioxidants, phosphorus thermal stabilizers, lactone thermal stabilizers and sulfur thermal stabilizers. And the addition amount of these additives is 0.01-2 (weight part) with respect to 100 (weight part) of ethylene-type copolymers, Preferably it is 0.03-1 weight%.
- Melting of the polymer resin powder refers to a process of gradually changing from a solid state to a liquid state and having a viscosity. This phenomenon occurs when heated above the melting temperature of the polymer resin powder. Melting temperature of the resin powder may vary depending on the type of each polymer resin.
- Below the melting temperature of the resin powder in the present invention means below the temperature at which the process of changing the polymer resin powder into a liquid. That is, the sealing sheet according to the present invention is formed through the inter-fusion of the resin powder at the melting temperature or less.
- the sheet for sealing material according to the present invention may have excellent flexibility compared to the conventional sheet for sealing material by partially fused with the heat-adhesive resin powder. Partial fusion of the resin powder can be adjusted through the ratio of the apparent density of the sheet for sealing material to the net density of the heat-adhesive resin.
- the sealing sheet 4 having voids is made of a sheet having superior thermal contraction rate and higher flexibility than a sheet manufactured by thermocompression bonding or calendering as in the prior art.
- This flexibility increases with more voids. That is, the smaller the ratio of the apparent density to the net density of the resin, the higher the flexibility.
- the apparent density is preferably 20% or more and 70% or less of the net density of the heat-adhesive resin.
- the apparent density of the sealing sheet 4 is less than 20% of the pure density of the resin, the porosity is too large, so that it is difficult to extract air from the voids in the sealing sheet 4 at the time of manufacturing the solar cell module, and thus the sealing sheet Bubbles remain in the sealing material 4 'in which (4) is melted.
- the porosity of the sealing material sheet 4 is too big
- the porosity is small, so the flexibility is poor, which is not suitable as the sheet for sealing material 4 of the solar cell.
- seat 4 for sealing materials of this invention into 20% or more and 70% or less of the pure density of a heat adhesive resin.
- the gap between the surroundings of the solar cell element 3 and the sealing material sheet 4 at the time of manufacturing a solar cell is made small, and to the sealing material 4 'after heat bonding. You can avoid leaving voids. That is, the incidence rate of defective products due to voids can be reduced.
- the apparent density of the said sealing material sheet 4 can be adjusted with the dispersion state of the resin powder spread
- the sealing sheet 4 since the space
- the optimal thickness of the sealing sheet 4 varies depending on the thickness and size of the solar cell element to be bonded, its arrangement, and the like.
- the solar cell element 3 shown in FIG. 2 has two protective members 1 and 2. It is necessary to determine based on the amount of resin which is reliably adhered between the) and at the same time, the voids do not occur in the sealing member 4 'in the thermally bonded state.
- the sealing sheet 4 Even if there is a sufficient amount of resin to fill the voids, if the thickness of the sealing sheet 4 is too thin, the cushioning property becomes insufficient, and the solar cell element 3 may be damaged. On the other hand, if the thickness of the sealing sheet 4 is too thick, the sealing material 4 'of the manufactured solar cell is too thick, there is also a problem that the light transmittance of the solar light is reduced to reduce the electromotive force of the solar cell, When joining the protective members 1 and 2, there may arise a problem that the sealing material 4 'comes out of the cross section.
- the method for producing a sheet for solar cell sealing material includes the steps of: (a) providing a heat-adhesive resin mainly containing an olefin resin; (b) powdering and spreading the heat adhesive resin; And (c) heating the heat-adhesive resin powder below the melting temperature of the resin powder to form a sheet including a plurality of voids.
- Step (a) is a step of providing a heat-adhesive resin containing olefin resin as a main component.
- the olefin resin used as a main component of the solar cell sealing material sheet according to the present invention may preferably include an ethylene resin or a propylene resin.
- the ethylene-based resin may contain ethylene and vinyl acetate copolymer as a main component.
- Step (b) is a step of dispersing the prepared heat-adhesive resin on a release sheet.
- the heat-adhesive resin powder constituting the sealing sheet 4 can be obtained by mechanical grinding, freeze-pulverization, chemical grinding, or the like of pellets of the heat-adhesive resin.
- the particle size of the obtained powder is not particularly limited, but considering the fluidity of the powder and the flexibility of the sheet, the range of 20 mesh (the size of the powder particles is about 864 microns) to 120 mesh (the size of the powder particles is about 117 microns) is preferable. Do. More preferably, a resin powder may be used in the range of 30 mesh (the size of the powder particles is about 535 microns) to 70 mesh (the size of the powder particles is about 200 microns).
- the dispersion amount of the resin powder is 300-1000 g / m ⁇ 2> .
- the sealing material sheet according to the present invention about 1 g of resin powder may be scattered to make a sheet having a thickness of 1 ⁇ m in a width of 1 m in length. Since the preferred thickness of the sheet for sealing material according to the present invention is 300 ⁇ m to 1000 ⁇ m in a porous state, the amount of dispersion of the resin powder required for the production of the sheet for sealing material may be 300 to 1000 g / m 2 . In addition, the thickness after the solar cell module lamination may be about 150 ⁇ m to 400 ⁇ m.
- the thickness of the porous sheet is 500 ⁇ 700 ⁇ m (dispersion amount is 500 ⁇ 700 g / m 2 ), the thickness after lamination can be prepared to 150 ⁇ 300 ⁇ m.
- the heat-adhesive resin powder is uniformly dispersed with a powder spreader or the like on the release sheet through the above spreading amount.
- the failure rate can be increased when manufacturing the solar cell module because it does not obtain a suitable thickness as a sealing sheet.
- the heat-adhesive resin powder prepared as described above is uniformly dispersed on a release sheet by a powder spreader or the like.
- Extrusion or calendering process which is a conventional manufacturing process of a sheet for sealing material, is a process of heating a polymer resin at a melting temperature or more to melt it completely and then molding it before solidifying.
- the method for manufacturing a sheet for sealing material according to the present invention forms a sheet by heating and bonding the heat-adhesive resin powder at a melting temperature or lower.
- Heating and bonding the heat-adhesive resin powder below the melting temperature means that the surface of the powder is slightly fused to maintain the sheet form. That is, by fusion of the particles in the powder state at the melting temperature or lower, the pores in the particle state are kept uniform, thereby producing a sheet including a plurality of pores.
- the heat-adhesive resin powder is heated above the melting temperature, not only the resin powder is melted to obtain a desired shape as a sheet for solar cell sealing material, but also a manufacturing problem occurs such that the sheet sticks to the release plate. Can be.
- Fusion of the heat-adhesive resin powder may be performed using a far infrared heater or the like. At this time, it is preferable that the heating temperature of a heater is the range of 80-140 degreeC. More preferably, it can be carried out at 100 ⁇ 120 °C.
- the heating temperature is less than 80 ° C.
- a part of the heat adhesive resin powder may not be sufficiently fused. That is, there may be difficulty in manufacturing a solar cell module because it exceeds the flexibility suitable for the solar cell sealing sheet.
- the heating temperature exceeds 140 °C, because the heating temperature is too high, the amount close to the entire amount of the resin powder may be fused to obtain a problem that can not obtain a suitable flexibility for the sealing material sheet, the sheet is a release plate The manufacturing problem may get stuck.
- seat 4 for sealing materials of the solar cell which concerns on this invention was fusion
- the sealing sheet 4 containing voids is made of a sheet having excellent heat shrinkage and high flexibility compared to a sheet manufactured by conventional thermocompression or calendering. This flexibility increases with more voids.
- the sealing sheet 4 according to the present invention is easily discharged by the air bubbles containing the harmful gas generated during the manufacturing of the solar cell module, the defective product rate is reduced and the bubble removal process time can be significantly reduced. There is an advantage that can reduce the process cost of the solar cell module.
- Example according to the present invention is an ethylene vinyl acetate copolymer (100 parts by weight) containing 28% by weight of vinyl oxide, the melt mass flow is 18 (g / 10 minutes), the half-life temperature of 1 hour as a crosslinking agent is 119.3 °C Phosphorous tertiary butyl peroxy 2-ethylhexyl carbonate 1 (parts by weight) and ⁇ -methacryloxypropyltrimethoxysilane 0.5 (parts by weight) as a silane coupling agent were mixed. It was set so that it was melt-kneaded and the heat-adhesive resin was obtained.
- the heat adhesive resin was pulverized by freeze grinding using liquid nitrogen to obtain a heat adhesive resin powder having a particle size of 42 mesh to 200 mesh.
- the heat-adhesive resin powder was uniformly spread on the release sheet using a powder spreader at a dispersion amount of 700 (g / m 2 ), and then partially heated by the far-infrared heater to 120 ° C. to partially disperse the resin powder.
- the sealing sheet 4 of this example was fused.
- the thickness of this sealing sheet 4 was 0.7 (mm), and the weight per unit area was 400 (g / cm 2 ).
- the conventional vacuum process time for bubble discharge of the sealing sheet is about 5 minutes. This experiment can be confirmed by comparing with the comparative example whether the bubble discharge is good even when the existing process time is reduced to less than half.
- a glass having a length of 500 mm and a thickness of 3.2 tons was used as a protective member.
- Nine solar cells and metal electrodes were inserted between the sheets for sealing to fabricate a solar cell module under the same conditions as the actual module.
- the module manufacturing conditions used the processing conditions of the compression process temperature 145 °C, pressure 1 atm, which is the existing solar cell module production process conditions, except the vacuum process time for bubble discharge.
- Comparative Example is a solar cell module manufactured using an EVA sheet manufactured by Mitsui (solar EVA), the experimental results are shown in Table 1 below.
- FIGS. 3A to 3E bubbles are generated in the solar cell module manufactured by using an EVA sheet manufactured by Mitsui, as shown.
- 3A and 3B are images showing bubbles generated in the comparative example when the vacuum process time is 2 minutes
- FIGS. 3C to 3E are images showing bubbles generated in the comparative example when the vacuum process time is 1 minute.
- the sealing sheet according to the present invention includes a plurality of voids therein, and bubbles are easily discharged from these voids. That is, even if the vacuum degassing process time is reduced, the sealing sheet according to the present invention is excellent in productivity of the solar cell module because all the bubbles are discharged.
- a Teflon sheet which is not bonded with the sealing material sheet is placed on a heater at 145 ° C., and then a square sealing material sheet having a width of 150 mm in length and length is heated for 20 minutes. It is a measure.
- Comparative Examples are EVA sheets for sealing materials of solar cells, each manufactured by a third party.
- Comparative Example 1 is a 3M DYNEONTM E-20101 EVA sheet (0.45t) manufactured by 3M
- Comparative Example 2 is a FirstTM F806 EVA sheet of HZ
- Comparative Example 3 is a solar EVA sheet of Misui
- Comparative Example 4 is a heavy right EVA sheet prepared in Comparative Example 5 is CI kasei's CIK Cap FL
- Comparative Example 6 are C.I. Kasei's CIK Cap FH EVA sheet. Experimental results for the degree of heat shrinkage are shown in Table 2 below.
- 4A to 4H are images showing the heat shrinkage degree of the comparative example and the embodiment.
- 4A to 4G are images showing thermal shrinkage of Comparative Examples 1 to 6, respectively, and
- FIG. 4H is an image showing thermal shrinkage of the example.
- the sheet according to the present invention has a very small heat shrinkage rate, there was no deformation in the longitudinal direction to the width direction of the sheet.
- the sheet for sealing material according to the present invention has a low heat shrinkability because the resin powder is made of a fusion, unlike the EVA film using a conventional extrusion method.
- the experimental results as described above were obtained.
- the apparent density (D) of the sheet was computed by the following formula using the test piece which concerns on the said Example.
- W weight per unit area of sheet (g / cm 2 )
- V volume per unit area of sheet (cm 3 / cm 2 )
- the net density of the heat adhesive resin obtained in the Example was 948 (kg / m ⁇ 3> ).
- seat for sealing materials produced by the Example was 400 (kg / m ⁇ 3> ), and was 42% of the pure density of heat adhesive resin.
- the solar cell module was produced using the sheet
- seat 4 for sealing materials is raised on the surface of the surface side protection member 1 which consists of glass, and many solar cell elements 3 are mounted on it.
- the sheet 4 for sealing material is similarly raised on these solar cell elements 3, and the back surface protection member 2 made of glass is put on it, and a laminated body is comprised.
- the laminating agent thus produced was set in a laminator for solar cell production, the temperature of the hot plate was 130 deg. C, and degassed in a vacuum time of 3 minutes, followed by pressing for 5 minutes at a pressure of 1 (kgf / cm 2 ).
- seat for sealing materials which concerns on the said Example, the sheet
- the sheet for sealing materials of the comparative example was formed by dispersing the heat-adhesive resin powder used in the examples on the release sheet and melting with a far-infrared heater.
- the adhesive sheet of the sealing material of this comparative example obtained was fusion
- the thickness of this sealing material sheet was 0.45 mm, and was half or less of the thickness of the sealing material sheet of the said Example.
- the sealing sheet of this comparative example had a weight per unit area of 400 (g / cm 2 ) and an apparent density of 889 (kg / m 3 ). That is, the apparent density of the sealing material sheet of the comparative example was 94% of the pure density of the heat adhesive resin, and the apparent density was larger than 70% of the pure density of the heat adhesive resin.
- the incidence rate of the defective product was 5%.
- the reason can be considered as follows.
- seat for sealing materials of this comparative example had large apparent density, ie, the porosity was small, and sufficient flexibility could not be obtained. For this reason, in the manufacturing process of a solar cell module, the space
- the sealing sheet according to this comparative example has a lower porosity and a smaller thickness than the sealing sheet of the embodiment. For this reason, the cushion property is bad, and the pressure in a manufacturing process acted on the solar cell element.
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- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Photovoltaic Devices (AREA)
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Abstract
Description
진공 시간 | 5분 | 3분 | 2분 | 1분 | |
기포유무 | 비교예(Mitsui사 제조) | 없음 | 없음 | 기포발생 | 기포발생 |
실시예 | 없음 | 없음 | 없음 | 없음 |
EVA종류 | 비교예1 | 비교예2 | 비교예3 | 비교예4 | 비교예5 | 비교예6 | 실시예 | |
변형량 | 길이방향 | -15mm | -5mm | -17mm | -5mm | -4mm | -4mm | 0 |
폭 방향 | 2mm | 0mm | -1mm | -1mm | 1mm | 1mm | 0 |
Claims (18)
- (a) 올레핀계 수지를 주성분으로 하는 열접착성 수지를 마련하는 단계;(b) 상기 열접착성 수지를 분말화하여 산포하는 단계; 및(c) 상기 열접착성 수지 분말을 상기 수지 분말의 용융온도 이하에서 가열하여, 다수의 공극을 포함하는 시트를 형성하는 단계;를 포함하는 태양전지 밀봉재용 시트의 제조 방법.
- 제1항에 있어서,상기 올레핀계 수지는에틸렌계 또는 프로필렌계 수지를 포함하는 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 제2항에 있어서,상기 에틸렌계 수지는폴리에틸렌계 수지 또는 에틸렌 비닐아세트테이트 공중합체를 포함하는 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 제2항에 있어서,상기 에틸렌계 수지는에틸렌 함유량이 60 중량% 이상, 90 중량% 이하인 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법
- 제1항에 있어서,상기 열접착성 수지는용융 질량 흐름(melt mass-flow rate)이 1 g/10min 이상 50 g/10min 이하인 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 제1항에 있어서,상기 열접착성 수지는가교제, 가교 조제, 실란 커플링제, 자외선 흡수제, 광안정제 및 산화방지제에서 선택되는 하나 이상의 첨가제를 더 포함하는 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 제1항에 있어서,상기 (b) 단계는상기 수지 분말의 산포량이 300 ~ 1000 g/m2 인 것을 특징으로 하는 태양전지의 밀봉재용 시트의 제조 방법.
- 제1항에 있어서,상기 (c) 단계는상기 열접착성 수지 분말을 80 ~ 140 ℃에서 융착시키는 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 제1항에 있어서,상기 열접착성 수지 분말은입자 크기가 20 ~ 120 메쉬인 것을 특징으로 하는 태양전지 밀봉재용 시트의 제조 방법.
- 올레핀계 수지를 주성분으로 하는 열접착성 수지를 포함하는 태양전지의 밀봉재용 시트로서,상기 시트는 분말 형태의 열접착성 수지가 융착되어 다수의 공극을 가지면서 형성되는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 올레핀계 수지는에틸렌계 또는 프로필렌계 수지를 포함하는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제11항에 있어서,상기 에틸렌계 수지는폴리에틸렌계 수지 또는 에틸렌 비닐아세트테이트 공중합체를 포함하는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 시트는상기 열접착성 수지 분말이 부분적으로 융착되어 형성되는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 열접착성 수지 분말은상기 수지 분말의 용융온도 이하에서 가열되어 융착되는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 시트의 겉보기 밀도가 상기 열접착성 수지의 순밀도의 20% 이상 70% 이하인 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제11항에 있어서,상기 에틸렌계 수지는에틸렌 함유량이 60 중량% 이상, 90 중량% 이하인 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 열접착성 수지는용융 질량 흐름(melt mass-flow rate)이 1 g/10min 이상 50 g/10min 이하인 것을 특징으로 하는 태양전지의 밀봉재용 시트.
- 제10항에 있어서,상기 열접착성 수지는가교제, 가교 조제, 실란 커플링제, 자외선 흡수제, 광안정제 및 산화방지제에서 선택되는 하나 이상의 첨가제를 더 포함하는 것을 특징으로 하는 태양전지의 밀봉재용 시트.
Priority Applications (4)
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EP11843634.4A EP2645424B1 (en) | 2010-11-23 | 2011-11-22 | Sheet for a sealing member of a solar cell, and method for preparing same |
US13/988,257 US8835519B2 (en) | 2010-11-23 | 2011-11-22 | Sheet for a sealing member of a solar cell, and method for preparing same |
JP2013538667A JP2013544032A (ja) | 2010-11-23 | 2011-11-22 | 太陽電池の密封材用シート及びその製造方法 |
CN201180056556.7A CN103229310B (zh) | 2010-11-23 | 2011-11-22 | 太阳能电池的密封组件用薄片及其制备方法 |
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KR1020100117093A KR101218900B1 (ko) | 2010-11-23 | 2010-11-23 | 태양 전지의 밀봉재용 시트 및 그 제조 방법 |
KR10-2010-0117093 | 2010-11-23 |
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WO2012070842A3 WO2012070842A3 (ko) | 2012-07-19 |
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US (1) | US8835519B2 (ko) |
EP (1) | EP2645424B1 (ko) |
JP (1) | JP2013544032A (ko) |
KR (1) | KR101218900B1 (ko) |
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TWI561563B (en) * | 2012-02-15 | 2016-12-11 | Mitsui Chemicals Tohcello Inc | Encapsulating sheet for solar cell, solar cell and method for producing solar cell |
KR101458668B1 (ko) * | 2012-02-24 | 2014-11-06 | (주)엘지하우시스 | 미립자를 포함하는 태양광 전지용 eva시트 및 그의 제조방법 |
KR101448343B1 (ko) * | 2012-04-09 | 2014-10-08 | (주)엘지하우시스 | 태양전지 밀봉재용 eva시트 및 그의 제조방법 |
KR101647708B1 (ko) * | 2014-12-30 | 2016-08-11 | 에스케이씨 주식회사 | 태양전지용 봉지재 시트 조성물 |
JP6361535B2 (ja) * | 2015-03-16 | 2018-07-25 | 日立金属株式会社 | 接着装置および接着方法 |
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ES2822134T3 (es) * | 2015-11-04 | 2021-04-29 | Borealis Ag | Módulo fotovoltaico |
DE102018213627B4 (de) | 2017-08-17 | 2022-03-10 | Armor Solar Power Films Gmbh | Flächenmaterial mit Photovoltaikmodul, Erzeugnis mit einer solchen Flächenmaterial und Verfahren zur Herstellung einer Flächenmaterial |
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- 2011-11-22 WO PCT/KR2011/008919 patent/WO2012070842A2/ko active Application Filing
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WO2012070842A3 (ko) | 2012-07-19 |
US8835519B2 (en) | 2014-09-16 |
EP2645424A2 (en) | 2013-10-02 |
EP2645424A4 (en) | 2014-06-04 |
KR101218900B1 (ko) | 2013-01-21 |
US20130245146A1 (en) | 2013-09-19 |
EP2645424B1 (en) | 2018-01-03 |
KR20120055377A (ko) | 2012-05-31 |
CN103229310A (zh) | 2013-07-31 |
JP2013544032A (ja) | 2013-12-09 |
CN103229310B (zh) | 2016-03-02 |
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