WO2012067125A1 - Unité de sonde - Google Patents

Unité de sonde Download PDF

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Publication number
WO2012067125A1
WO2012067125A1 PCT/JP2011/076334 JP2011076334W WO2012067125A1 WO 2012067125 A1 WO2012067125 A1 WO 2012067125A1 JP 2011076334 W JP2011076334 W JP 2011076334W WO 2012067125 A1 WO2012067125 A1 WO 2012067125A1
Authority
WO
WIPO (PCT)
Prior art keywords
diameter
small
probe
plunger
hole
Prior art date
Application number
PCT/JP2011/076334
Other languages
English (en)
Japanese (ja)
Inventor
風間　俊男
浩平 広中
重樹 石川
Original Assignee
日本発條株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本発條株式会社 filed Critical 日本発條株式会社
Priority to JP2012544267A priority Critical patent/JPWO2012067125A1/ja
Publication of WO2012067125A1 publication Critical patent/WO2012067125A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Definitions

  • the present invention relates to a probe unit that houses a conductive probe that inputs and outputs signals in an electrical characteristic inspection of a semiconductor integrated circuit or the like.
  • a probe unit in which a plurality of conductive probes are accommodated at predetermined positions is used corresponding to the external electrode installation pattern of the semiconductor integrated circuit.
  • the probe unit includes a probe holder provided with a plurality of holes through which the contact probe is inserted, and both ends of the conductive probe held by the probe holder are connected to a semiconductor integrated circuit and a circuit board that outputs a test signal. By contacting each of the electrodes, the semiconductor integrated circuit and the circuit board are electrically connected (see, for example, Patent Document 1).
  • a probe capable of flowing a large current of about 10 to 20 A has been required in the case of inspecting a semiconductor for a control system of an automobile.
  • the probe diameter may be increased.
  • the maximum diameter or pitch of the semiconductor electrodes is 1 mm or less, there is a problem that the diameter of the probe has to be made rather thin, and as a result, the allowable current becomes small.
  • a probe with a small diameter is necessary, and the allowable current has to be reduced.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a probe unit capable of suppressing a reduction in allowable current due to a narrowed probe diameter.
  • each of the probe units according to the present invention is formed using a conductive material, and is connected to the first tip portion having a substantially needle shape and the first tip portion.
  • a first plunger having a first base end on the same axis, a second front end whose tip is directed in a direction opposite to the front end of the first plunger, and a length in the axial direction compared to the first base end
  • a second plunger having a long second base end on the same axis, one end in the longitudinal direction encompassing the first base end, and the other end including the second base end.
  • a plurality of large-diameter probes that are telescopically stretchable, a plurality of small-diameter probes that are each formed using a conductive material and have a diameter smaller than the diameter of the large-diameter probe, and the plurality of large-diameter probes A plurality of large hole portions held in the hole, and having a diameter smaller than that of the large hole portion, communicating with any of the plurality of large hole portions, and receiving the end portion of the small diameter probe in contact with the second tip portion.
  • a large-diameter probe holder through which a set of the large-hole portion and the reception-hole portion communicating with each other passes in the thickness direction, and the plurality of small-diameter probes are individually retained.
  • a small-diameter probe holder that is provided on the large-diameter probe holder so that each small-hole portion communicates with one of the plurality of receiving-hole portions.
  • a central axis in a longitudinal direction of the large hole portion and the small hole portion is different, and the plurality of small hole portions have two distances between the center axes of two adjacent small hole portions corresponding to the two small hole portions, respectively.
  • the second base end portion enters the inside of the tightly wound portion when a load at the time of inspection is applied to at least the small-diameter probe.
  • the tip of the second plunger forms a plane substantially perpendicular to the longitudinal direction of the large-diameter probe.
  • the large-diameter probe holder is laminated on the first substrate, the first substrate holding the tip portion of the first plunger exposed, and the first substrate. And a second substrate that is stacked on the small-diameter probe holder and receives the end of the small-diameter probe held by the small-diameter probe holder.
  • the probe unit according to the present invention is characterized in that, in the above invention, the small-diameter probe holder is formed by laminating two substrates that expose and hold either one end of the small-diameter probe. To do.
  • the probe unit according to the present invention is characterized in that, in the above invention, the large-diameter probe holder and the small-diameter probe holder have an insulating property at least in contact with the large-diameter probe and / or the small-diameter probe. To do.
  • the probe unit since a pair of probes is configured by combining a large-diameter probe and a small-diameter probe in a state in which the axes are shifted from each other, it is possible to cope with the narrowing of the pitch to be inspected. In addition, it is not necessary to reduce the diameter of both ends of the probe. Therefore, it is possible to suppress a decrease in allowable current due to the narrowing of the probe.
  • FIG. 1 is a diagram showing a configuration of a main part of a probe unit according to an embodiment of the present invention.
  • FIG. 2 is a diagram schematically showing the positional relationship between the large hole portion and the small hole portion.
  • FIG. 3 is a diagram showing an outline of assembly of the probe unit according to the embodiment of the present invention.
  • FIG. 4 is a perspective view schematically showing the overall configuration of the probe unit according to the embodiment of the present invention.
  • FIG. 5 is a diagram showing a state at the time of inspection of the probe unit according to the embodiment of the present invention.
  • FIG. 1 is a partial cross-sectional view showing a configuration of a main part of a probe unit according to an embodiment of the present invention.
  • a probe unit 1 shown in FIG. 1 is a device used when an electrical characteristic test is performed on a semiconductor integrated circuit to be inspected, and between the semiconductor integrated circuit and a circuit board that outputs a test signal to the semiconductor integrated circuit. Is an apparatus for electrically connecting the two.
  • the probe unit 1 has a plurality of large-diameter probes 2 each having one end in contact with an electrode provided on a circuit board, each one in contact with the large-diameter probe 2, and the other end in contact with an electrode of a semiconductor integrated circuit.
  • the large-diameter probe 2 is formed using a conductive material, and has a first needle 21 having a substantially needle shape, a spring member 22 that is an elastic member that has one end attached to the first plunger 21 and is elastic in the longitudinal direction, The other end of the spring member 22 is attached and the second plunger 23 has a tip directed in a direction opposite to the tip of the first plunger 21.
  • the first plunger 21, the spring member 22, and the second plunger 23 have the same center axis in the longitudinal direction.
  • the first plunger 21 has a tip portion 21a (first tip portion) having a sharp end, a flange portion 21b having a diameter larger than the diameter of the tip portion 21a, and a direction opposite to the tip portion 21a via the flange portion 21b. It protrudes and has a cylindrical shape having a diameter that is smaller than the diameter of the flange portion 21b and slightly larger than the inner diameter of the spring member 22, and has a boss portion 21c into which the end of the spring member 22 is press-fitted, and a diameter of the boss portion 21c.
  • a base end portion 21d (first base end portion) having a cylindrical shape that is smaller and smaller in diameter than the inner diameter of the spring member 22 and enters the inside of the spring member 23.
  • the spring member 22 is wound in a state where the end portion is press-fitted into the boss portion 21c of the first plunger 21, and the wire constituting the spring member 22 is in close contact with the coarse winding portion 22b. And a tightly wound portion 22 a that is press-fitted into the second plunger 23.
  • the coarsely wound portion 22b and the tightly wound portion 22a are connected to each other and have the same diameter.
  • the second plunger 23 has a columnar tip portion 23a (second tip portion) and a columnar shape having a diameter smaller than the diameter of the tip portion 23a and slightly larger than the inner diameter of the spring member 22, and a tightly wound portion.
  • the outer diameter of the tip portion 23 a is slightly larger than the outer diameter of the spring member 22.
  • the length of the base end portion 23c is arbitrarily set as long as it is longer than the length of the base end portion 21d and does not come into contact with the first plunger 21 even if the large-diameter probe 2 has the maximum stroke. Is possible.
  • the distal end surface of the distal end portion 23a that forms the upper surface of the second plunger 23 in FIG. 1 is a plane orthogonal to the longitudinal direction of the large-diameter probe 2, and the small-diameter probe 3 contacts this plane.
  • the small-diameter probe 3 is provided with a distal end portion 31 and a proximal end portion 32 each having a sharp end, and a flange having a diameter larger than that of the distal end portion 31 and the proximal end portion 32. Part 33.
  • the diameter of the distal end portion 31 and the diameter of the proximal end portion 32 are substantially equal, and those diameters are smaller than the outer diameter of the large diameter probe 2.
  • the distal end of the base end portion 32 is in contact with the distal end portion 23a of the second plunger 23 of the large diameter probe 2 as described above.
  • the small-diameter probe 3 is disposed at a position offset from the large-diameter probe 2 so that its central axis is parallel to and different from the central axis of the large-diameter probe 2.
  • the large-diameter probe holder 4 is formed by laminating a first substrate 41 and a second substrate 42 formed of an insulating material such as resin, machinable ceramic, or silicon in the thickness direction (vertical direction in FIG. 1). Become.
  • the large diameter probe holder 4 has a plurality of large hole portions 4a for individually holding a plurality of large diameter probes 2 and a diameter smaller than that of the large hole portion 4a and communicates with any of the plurality of large hole portions 4a.
  • 3 has a plurality of receiving hole portions 4b for receiving the base end portion 32 in contact with the large-diameter probe 2. A set of the large hole portion 4a and the receiving hole portion 4b communicating with each other penetrates the large diameter probe holder 4 in the thickness direction.
  • the central axes in the longitudinal direction of the large hole portion 4a and the receiving hole portion 4b communicating with each other are parallel and different.
  • the distance d between the central axis of the large hole portion 4a and the central axis of the receiving hole portion 4b is set to be smaller than the radius of the circle forming the distal end surface of the distal end portion 23a.
  • the first substrate 41 is provided with a plurality of first hole portions 41a that form part of the large hole portions 4a.
  • the first hole 41a is a cylindrical small-diameter hole 411a that can be inserted through the tip 21a of the first plunger 21, and a cylindrical large-diameter hole that is larger in diameter than the small-diameter hole 411a and coaxial with the small-diameter hole 411a. 412a.
  • the diameter of the small diameter hole 411 a is smaller than the diameter of the flange portion 21 b of the first plunger 21.
  • the small-diameter hole 411a prevents the first plunger 21 from coming off while the front end portion 21a of the first plunger 21 is exposed.
  • the maximum diameter of the large-diameter hole 412a is larger than the maximum diameter of the large-diameter probe 2.
  • the second substrate 42 forms a plurality of receiving hole portions 4b and a part of the large hole portion 4a, and communicates with the corresponding receiving hole portions 4b to penetrate the second substrate 42 in the thickness direction.
  • a hole 42a is provided.
  • the diameter of the second hole portion 42a is equal to the diameter of the large diameter hole 412a.
  • Each of the plurality of second holes 42a is coaxially connected to one of the plurality of large-diameter holes 412a at an end different from the end communicating with the receiving hole 4b.
  • the small-diameter probe holder 5 is formed by laminating a third substrate 51 and a fourth substrate 52, which are respectively formed using an insulating material similar to that of the large-diameter probe holder 4, in the thickness direction (vertical direction in FIG. 1).
  • the small-diameter probe holder 5 is provided with a plurality of small holes 5a that hold the plurality of small-diameter probes 3 in a state in which the small-diameter probes 3 are individually removed and penetrate in the thickness direction.
  • the small-diameter probe holder 5 is stacked on the large-diameter probe holder 4 so that each of the plurality of small hole portions 5a communicates coaxially with any of the plurality of receiving hole portions 4b.
  • the third substrate 51 is provided with a plurality of third hole portions 51a that form part of the small hole portions 5a.
  • the third hole 51a has a cylindrical small diameter hole 511a having a circular cross section through which the tip 31 of the small diameter probe 3 can be inserted, and a cylindrical shape having a diameter larger than that of the small diameter hole 511a and coaxial with the small diameter hole 511a.
  • a large-diameter hole 512a The diameter of the small diameter hole 511a is smaller than the diameter of the flange portion 33 of the small diameter probe 3.
  • the diameter of the large-diameter hole 512 a is large enough to accommodate the flange portion 33 of the small-diameter probe 3 and has the same size as the flange portion 33.
  • the third substrate 51 prevents the small-diameter probe 3 from coming off while the tip 31 of the small-diameter probe 3 is exposed.
  • the fourth substrate 52 is provided with a plurality of fourth hole portions 52a that communicate with the corresponding third hole portions 51a to form the small hole portions 5a.
  • the fourth hole 52a is a cylindrical small diameter hole 521a through which the proximal end portion 32 of the small diameter probe 3 can be inserted, and a cylindrical large diameter hole having a diameter larger than that of the small diameter hole 521a and coaxial with the small diameter hole 521a. 522a.
  • the small diameter hole 521a communicates with the receiving hole 4b.
  • the diameter of the small diameter hole 521a is equal to the diameter of the receiving hole portion 4b.
  • the diameter of the large diameter hole 522a is equal to the diameter of the large diameter hole 512a.
  • Each of the plurality of large diameter holes 522a is in coaxial communication with any one of the plurality of large diameter holes 512a.
  • the fourth substrate 52 prevents the small-diameter probe 3 from coming off while the proximal end portion 32 of the small-diameter probe 3 is exposed.
  • the large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a are formed by performing drilling, etching, punching molding, or processing using laser, electron beam, ion beam, wire discharge, or the like. .
  • the large-diameter probe holder 4 and the small-diameter probe holder 5 include the surface of the substrate made of a conductive material (including portions corresponding to the side surfaces of the large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a) as insulating materials. It is also possible to have a structure covered with the above.
  • FIG. 2 is a diagram schematically showing a positional relationship between the large hole portion 4a and the small hole portion 5a, and more specifically a diagram showing a positional relationship between the large diameter hole 412a and the small diameter hole 511a.
  • the center axis distance H of the large diameter hole 412a is greater than the center axis distance h of the small diameter hole 511a.
  • the distance between the central axis of the large diameter hole 412a and the central axis of the small diameter hole 511a is the distance between the central axis of the large hole portion 4a and the central axis of the receiving hole portion 4b. Equal to the distance d.
  • FIG. 3 is a diagram showing an outline of assembly of the probe unit 1.
  • the large-diameter probe holder 4 and the small-diameter probe holder 5 are provided with positioning openings, and positioning pins are provided in the large-diameter probe holder 4 and the small-diameter probe holder 5 corresponding to the opening. If both are positioned by insertion, the assembly of the probe unit 1 can be performed more easily and quickly.
  • FIG. 4 is a perspective view showing an overall configuration of the probe unit 1 and an outline of electrical characteristic inspection of a semiconductor integrated circuit using the probe unit 1.
  • a holder member 6 is provided on the outer periphery of the large-diameter probe holder 4 and the small-diameter probe holder 5 to prevent the semiconductor integrated circuit 100 from being displaced during inspection.
  • a circuit board 200 having a circuit for outputting a test signal is attached to the bottom surface side of the holder member 6.
  • FIG. 5 is a partial cross-sectional view showing a configuration of a main part of the probe unit 1 when the semiconductor integrated circuit 100 is inspected.
  • the large-diameter probe 2 receives an upward force in the drawing by contacting the electrode 201 of the circuit board 200.
  • the small-diameter probe 3 receives a downward force in the figure by contacting the electrode 101 of the semiconductor integrated circuit 100. Therefore, the spring member 22 of the large-diameter probe 2 is contracted along the longitudinal direction as compared with the state where the small-diameter probe 3 is not in contact with the electrode 101 of the semiconductor integrated circuit 100.
  • An inspection signal generated when inspecting the semiconductor integrated circuit 100 passes through the first plunger 21 of the large-diameter probe 2, the tightly wound portion 22 a, and the second plunger 23 via the electrode 201 of the circuit board 200, and then passes through the small-diameter probe 3. It reaches the electrode 101 of the semiconductor integrated circuit 100 via the route.
  • the first plunger 21 and the second plunger 23 are conducted through the tightly wound portion 22a, so that the electrical signal conduction path can be minimized. Therefore, it is possible to prevent a signal from flowing to the rough winding portion 22b during inspection, and to reduce and stabilize the inductance and resistance.
  • the small-diameter probe 3 When the probe unit 1 repeats the inspection, the small-diameter probe 3 repeatedly contacts and separates from the electrode 101 every inspection, and therefore, the tip 31 may be worn or the small-diameter probe 3 may be damaged by long-term use. is there. In such a case, in this embodiment, since the small diameter probe holder 5 can be removed from the large diameter probe holder 4, only the small diameter probe 3 can be easily replaced.
  • a set of probes is configured by combining a large-diameter probe and a small-diameter probe in a state where their axes are shifted from each other.
  • it is not necessary to reduce the diameter of both ends of the probe. Therefore, it is possible to suppress a decrease in allowable current due to the narrowing of the probe.
  • the deterioration with time is severe, and the small diameter probe, which is the largest cause of the increase in the contact resistance value, can be replaced independently of the large diameter probe, so that maintenance can be easily performed. It becomes.
  • the large-diameter probe holder can be used as it is unless there is a particular problem. Therefore, a large-diameter probe can be saved and it is economical.
  • the processing is easier than the case where the large diameter probe and the small diameter probe are offset and integrally formed.
  • the probe does not have an axisymmetric shape. For this reason, when housing the integrally formed probe in the probe holder, positioning must be performed while paying attention to the position of the hole through which the portion corresponding to the small diameter probe is inserted, and it takes time to house the probe. There was a problem.
  • the large-diameter probe and the small-diameter probe are separated so that each probe has an axisymmetric shape, so that each probe can be easily accommodated in the probe holder. it can.
  • the second base end portion of the second plunger is made longer than the first base end portion of the first plunger, thereby being orthogonal to the longitudinal direction of the second plunger when a load is applied.
  • the rotation around the shaft can be suppressed. Therefore, the second plunger can be smoothly moved up and down without the flange portion or the second base end portion of the second plunger being caught by the probe holder or the spring member.
  • the lateral load applied to the tightly wound portion of the spring member (the rotational load due to the inclination of the second plunger caused by the deviation of the axes of the large diameter probe and the small diameter probe) is 2 Since the base end of the plunger is long, it decreases and the tight winding of the tightly wound portion during the stroke is maintained. For this reason, there exists an effect that the electrical resistance value of a close_contact
  • the probe unit according to the present invention is useful for inspection of electrical characteristics of a semiconductor integrated circuit such as an IC chip.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente unité de sonde comporte : une pluralité de sondes à grand diamètre ; une pluralité de sondes à petit diamètre dont le diamètre de chacune est inférieur à celui des sondes à grand diamètre ; un support de sondes à grand diamètre qui comporte une pluralité de grands trous qui maintiennent chacun un individu de la pluralité de sondes à grand diamètre, pénétrant dans la direction de l'épaisseur, et qui loge à l'état de l'extrémité d'une sonde à petit diamètre en contact avec une sonde à grand diamètre à une extrémité de chaque grand trou ; et un support de sondes à petit diamètre qui comporte une pluralité de petits trous qui maintiennent chacun un individu de la pluralité de sondes à petit diamètre à un état empêchant le retrait, et qui est empilé sur le support de sondes à grand diamètre de telle manière que la direction de son épaisseur correspond à la direction de l'épaisseur du support à grand diamètre. Les axes centraux dans la direction de la longueur d'interconnexion des grands trous et des petits trou sont différents l'un de l'autre, et la pluralité de petits trous comprend ceux qui sont tels que la distance entre les axes centraux de deux petits trous adjacents est inférieure à la distance entre les axes centraux de grands trous qui s'interconnectent respectivement avec les petits trous.
PCT/JP2011/076334 2010-11-17 2011-11-15 Unité de sonde WO2012067125A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012544267A JPWO2012067125A1 (ja) 2010-11-17 2011-11-15 プローブユニット

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-257232 2010-11-17
JP2010257232 2010-11-17

Publications (1)

Publication Number Publication Date
WO2012067125A1 true WO2012067125A1 (fr) 2012-05-24

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JP (1) JPWO2012067125A1 (fr)
TW (1) TWI457573B (fr)
WO (1) WO2012067125A1 (fr)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
WO2017073599A1 (fr) * 2015-10-28 2017-05-04 株式会社エンプラス Prise de composant électrique
CN113552393A (zh) * 2020-04-23 2021-10-26 跃澐科技股份有限公司 测试探针座结构

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021065702A1 (fr) * 2019-10-04 2021-04-08 株式会社村田製作所 Sonde

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JP2002062312A (ja) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk コンタクト装置
JP2002107377A (ja) * 2000-09-28 2002-04-10 Nhk Spring Co Ltd 可動ガイドプレート付き導電性接触子
WO2009096318A1 (fr) * 2008-02-01 2009-08-06 Nhk Spring Co., Ltd. Unité à sondes

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US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP4939879B2 (ja) * 2006-09-13 2012-05-30 株式会社エンプラス 電気接触子、及び、電気部品用ソケット
JPWO2009102029A1 (ja) * 2008-02-14 2011-06-16 日本発條株式会社 コンタクトプローブおよびプローブユニット
WO2009102030A1 (fr) * 2008-02-14 2009-08-20 Nhk Spring Co., Ltd. Unité de sonde

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2002062312A (ja) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk コンタクト装置
JP2002107377A (ja) * 2000-09-28 2002-04-10 Nhk Spring Co Ltd 可動ガイドプレート付き導電性接触子
WO2009096318A1 (fr) * 2008-02-01 2009-08-06 Nhk Spring Co., Ltd. Unité à sondes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017073599A1 (fr) * 2015-10-28 2017-05-04 株式会社エンプラス Prise de composant électrique
JP2017083295A (ja) * 2015-10-28 2017-05-18 株式会社エンプラス 電気部品用ソケット
US10431947B2 (en) 2015-10-28 2019-10-01 Enplas Corporation Electrical component socket
CN113552393A (zh) * 2020-04-23 2021-10-26 跃澐科技股份有限公司 测试探针座结构

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TW201234017A (en) 2012-08-16
JPWO2012067125A1 (ja) 2014-05-12
TWI457573B (zh) 2014-10-21

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