TW201234017A - Probe unit - Google Patents

Probe unit Download PDF

Info

Publication number
TW201234017A
TW201234017A TW100141984A TW100141984A TW201234017A TW 201234017 A TW201234017 A TW 201234017A TW 100141984 A TW100141984 A TW 100141984A TW 100141984 A TW100141984 A TW 100141984A TW 201234017 A TW201234017 A TW 201234017A
Authority
TW
Taiwan
Prior art keywords
diameter
small
probe
plunger
hole
Prior art date
Application number
TW100141984A
Other languages
Chinese (zh)
Other versions
TWI457573B (en
Inventor
Toshio Kazama
Kohei Hironaka
Shigeki Ishikawa
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW201234017A publication Critical patent/TW201234017A/en
Application granted granted Critical
Publication of TWI457573B publication Critical patent/TWI457573B/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0483Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention provides a probe unit which has a plurality of large diameter probes, a plurality of small diameter probes each having a diameter smaller them that of the large diameter probe, a large diameter probe holder provided with a plurality of large hole portions piercing therethrough in a thickness direction for respectively holding the plurality of large diameter probes, each large hole portion having one end portion in which an end portion of a small diameter probe is received in the state of contacting a large diameter probe holder provided with a plurality of small hole portions piercing therethrough in a thickness direction for holding the small diameter probes respectively in the state of being unremoveable, the small diameter probe holder being overlapped with the large diameter probe holder such that the thickness direction of the small diameter probe holder coincides with the thickness direction of the large diameter probe holder. Each large hole portion has a center axis extending in a longitudinal direction different from the center axis of each small hole portion communicating with the large hole portion, and the plurality of small hole portions include two adjacent small hole portions having a distance between their center axes smaller than the distance between the center axes of the two adjacent large hole portions communicating with the two adjacent small hole pertions.

Description

201234017 六、發明說明: 【發明所屬之技術領域】 氣特性檢杳 進行 本發明係關於-種用以收容導電性探針之 該導電性探針係在半導體積體電路等之電翕 元 信號之輸出輸入。 ' 【先前技術】 在ic晶片等半導體積體電路之電氣特性檢查 用對應於該半導體積體電路所具有之外部電極的二圖: 而將複數個導電性探針收容在預定位置之探針單元 ^ 單元係具備設置有複數個供賴探_通认部的探= 持具’藉由使該探針保持具所保持之導電性探針之邱 分別與半導體積體電路及輸出檢查用信號之電路基板之 極接觸,而料導體㈣電路與電路基板之間予以電性 接(參照例如專利文獻1)。 4 (先前技術文獻) (專利文獻) 專利文獻1 :日本特開2002-107377號公報 【發明内容】 (發明所欲解決之課題) 然而,近年來在進行汽車之控制系統用半導體等之檢 查的情形等中,要求一種可使電流值為1〇至2〇a左右之大 電流流通的探針。為了因應上述要求,只要使探針之直徑 變粗即可。錢,當半導體之電極的最大直經或間距在_ 以下時’反而會有必須將探針之直經變細,結果造成容許 323672 4 201234017 電谷邊小之問題。再者, 有2個探針之檢查時,亦需要疋般在1個端子需要 小容許電流。 *直傻之探針,而不得不減 種可抑制:二5於上述課題而研創者’其目的在於提供-c探針之細直徑化所造成之容許電流之降低的探 (解決課題之手段) 針單=3決上述課題’並達成上述目的,本發明之探 圈狀=Γ針,其具有第1桂塞、第2柱塞、及線 !=! 沿著長度方向伸縮自如,其中,第1 性材料而形成,且在同軸上具有呈大 端部及與該第1前端部連接之第1基端 上具有前端指向與前述第1柱塞之 述第二=的第2前端部、及前述轴方向之長度比前 之第2基端部,彈簧構件係長度方向之- ㈣述第2基端 二ί \、則述第1及第2柱塞且具有在前述第 1柱塞側 密捲=密捲繞部、及以預定間距在前述第2柱塞側捲繞 之疏捲繞部,並且沿著該長度方向伸縮自如; f數個小徑探針,各自顧導電性材料而形成,且具 有比前述大徑探針之直徑小的直徑; 大徑探針保持具,其具有個別地保持前述複數個大徑 探針之複數個大孔部、及直徑比前述大孔部小且與前述複 323672 5 201234017 數個,孔敎任-者連通,並且在與前述第2前端部接觸 之狀態下收容前述小徑探針之端部的複數個收容 此連通之料大孔部及前㈣容孔敎㈣麵度;向貫 通,以及 具’在厚度方向貫通設置有在防止脫落 _地保持前述複數個小徑探針之複數個小孔 ° 探針保持具細各'〗、孔部與前述複數個收六 孔部之任一者連通之方式積層在前述大今 彼此連通之前述大孔部及_小_ 心軸係為不同, π度方向的中 在前述複數個小孔部,包含有鄰接之 心轴間距離比分別對應該二個小孔部之:小孔部的中 軸間距離小者, 個大孔部的中心 針時,進人前述密捲===查時之負载施加於小徑探 - = 前述發”,前述第2 平面。 探針之長度方向大致正交之 再者,本發明之探針單元 探針保持具係具備:第1基板:::述發明中,前述大徑 顯露出地對前述第一柱塞予別逸第1桎塞之前端邹 在前述第1基板,並且積屛二、、,以及第2基板,必一 容前述小徑探針保持具所^小控探針保持具, 再者’本發明之探針單元::述小徑探針之端部 針早疋係在前述發明中,前迷 6 201234017 探針保持具係積財分贼前述小赠針之任 露出並予以保持的二個基板所構成者。 鸲$顯 探針前述大桠 及/或前述小徑騎探針 (發明之效果) 根據本發明之探針單元,由於藉由在使 離之狀態下組合大_針與,H b之轴線偏 此即使在對應於檢查對象之間二::二且探:因 使探針之兩方端部細徑化。因此, j、:須 所造成之容許電流的降低。 &針之細輕化 【實施方式】 以下’參照附圖詳細說明用以實施本發明之开" 外,並非由以下之實施形態來限定本發明者 一此 下之說明中參照之各圖係僅為以可理解本 在以 概略性顯示形狀、大小及位置關係。 =之程度 限定在各圖中例示之形狀、大小及位置關係。I明並非僅 第1圖係顯示本發明之—實施形態:之探針單 部分構成的局部剖面®。第丨圖所示之探 主要 在進行作為檢查對象之半導體積體電路;^1係使用 的裝置,且將半導體積體電路與將檢查用^性檢查時 體積體電路之電路基板之間予以電性連接半導 元1係具備:複數個大徑探針2,其各自 置。探針單 電路基板之電極接觸;複數個小徑探針3之二蠕與設置在 各自之一端 323672 7 201234017 與大仏探針2接觸,且另—端*半 觸,並且I* 體積體電路之電極接 #JL4, , 您罝徑小之直徑;大徑探針 =二具5脫落之狀態保持複數個大_針以及小 _ 5m㈣之«_複_小徑探針 觸f且具有比大_針2之直徑小之直 : 4,以防止麟之狀態㈣隸探針保 大么探針2係具備:第1柱塞2卜利用導電性材料 端安裝在1於彈性構件之彈簧構件22,一 塞23 21 ’且朝長度方向伸縮自如;及第2柱 ΐ 21之^/構件22之另—端,且前端指向與第1柱 塞21之則&相反之方向。 _ 塞.彈簧構件22、及第9二: 1 1柱 係為-致。 柱塞23之長度方向的中心轴 ',、』.1^塞21係具備:前端部2U(第1前端部),具有 大凸緣部21b,具有比前端部…之直徑大的直徑; 凸:s)部21c,隔著凸緣部仙朝與前端部2ia相反 °犬出形成具有比凸緣部21b之直徑小且比彈簧構 件22之内&略大之直徑的圓柱狀,供彈簧構件22之端部 ,入及呈圓柱狀之基端部21d(第1基端部),有比凸柱 4 21c之直徑小且比彈簧構件22之内徑略小之直徑,且進 入彈簧構件22之内部。 彈黃構件22係具備:疏捲繞部22b,其端部壓入於第 1柱塞21之凸柱部2ic ;及密捲繞部22a,从比疏捲繞部 更被接之狀態下捲繞構成彈簧構件22之線材,且其端部被 壓入第2杈塞23。疏捲繞部22b與密捲繞部22a係相連接, 323672 201234017 且彼此之直徑相等。 山第2柱塞23係具備:呈圓杈狀之前端部23a(第2前 鳊P) ’凸柱邛23b,形成具有比前端部之直徑小且比 彈簧構件22之内徑略大之直徑的圓柱狀,供密捲繞部^ 之端部Μ心及基端部23c(第2基端部),具有比凸柱部 23b之直徑小且比彈簧構件22<内徑略小之直纟,且進入 彈脊構件22之内部。前端部23a之外徑係比彈簧構件22 之外徑略大。 立 A本實施形L中务,邵23c之長度係比基端 f 23d之長度長,且即使大徑探針2為最大行程,只要在 與第1域21接觸之範圍内,即可任意地設定。此外, 面ill中形成第2柱塞23之上表面的前端部23a之前端 =為與大徑探針2之長度方向正交之平面,在該平面接 觸有小徑探針3。 接 部32小2針3係具備分別具有尖銳端之前端部31及基端 :二及設置在前端部31及基端部犯之間,且直經比 與基端心2部32大之凸緣部33。前端部31之直徑 針2:::r=rr’該等之直徑係比‘ 2之第2柱塞23;^Γ ^端係如上所述’與大徑探針 中心轴與大_針i ^2、接觸。小徑探針3係以使其 相對於大徑探針2偏置之位置。㈣之方式,配置在 穑展針保持具4係在厚度方向(第1圖之上下士 積層有利用樹脂、 上下方向) 機械加工喊m緣性材料分別 323672 9 201234017 形成之第1基板41及第2基板42而構成。大徑探針保持 具4係具有複數個大孔部4a’個職保持複數個大徑探針 2;及複數個收容孔部4b,直徑比大孔部切小,且與複數 個大孔部4a之任-者連通’在與大徑探針2接觸之狀態下 收容小徑探針3之基端部32。彼此連通之大孔部4a及收 容孔部4b之組係朝厚度方向貫通大徑探針保持具4。而 且,彼此連通之大孔部4a及收容孔部4b之長度方向的中 心轴係為平行且相異。大孔部4a之中心軸與收容孔部 之中心軸的距離d係設定為比形成前端部23a之前端面之 圓的半徑小。藉由以上述方式設定距離d,可確實地使分 別插通於彼此連通之大孔部4a及收容孔部4b之大徑探針 2及小徑探針3相接觸。 在第1基板41 s又置有複數個形成大孔部4a之一部分 的第1孔部41 a。第1孔部41 a係具有可供第1柱塞21 之前端部21a插通之圓筒狀的小徑孔4na、及直徑比小徑 孔411a大且與小位孔411a形成同軸之圓筒狀的大徑孔 412a。小徑孔411a之直徑係比第丨柱塞21之凸緣部2比 的直徑小。小徑孔411a係在使第丨柱塞21之前端部2ia 顯露出之狀態下防止第1柱塞21之脫落。此外,大徑孔 412a之最大徑係比大徑探針2之最大徑大。 在第2基板42設置有:複數個收容孔部牝;及複數 個第2孔部42a,形成大孔部4a之一部分,且與對應之收 容孔部4b連通,而於厚度方向貫通第2基板42。第2孔 部42a之直徑係與大徑孔412a之直徑相等。複數個第2孔 323672 10 201234017 ^ ^ 、八同樣之絕緣性材料分別形 板52而構成者。在小徑探針保 的第板51設置有複數個形成小孔部5a之-部八 的第3孔部51 a。第3孔部51 a係具 4刀 =31插通之具圓形剖面之圓筒狀的二:3 =禮比小徑孔511a大且與小徑孔5以形成同轴筒 、徑孔⑽之_比小徑探針3 : 凸緣33的直径小。而且,女保 心 容小徑探針3之凸緣部33之=:二直徑係為可收 固鞀许沾士 , ^ ^灸大小,且具有與凸緣部33相 係在使小經探針3之前端部 31 .,、員露出之狀態下防止小徑探針3之脫落。 在第4基板52設置有與對應之第3孔部… 成小孔部5a之複數個第4孔部52a。第4孔部孤係^ 可供小控探針3之基端部32插通之圓筒狀的小徑孔 及直徑比小徑孔521a大且與小徑孔灿形成同轴之^ 狀的大徑孔522a。小徑孔521a係與收容孔部奶連通圓靖 控孔521a之直徑係與收容孔部4b的直徑㈣n ^ 323672 11 201234017 徑孔522a之直徑係與大徑孔512a之直徑相等。複數個大 徑孔522a之各者係與複數個大徑孔5l2a之任一者同轴地 連通。第4基板52係在使小徑探針3之基端部犯顯露: 之狀態下防止小徑探針3之脫落。 大孔部4a、收容孔部4b及小孔部5a係藉由進行鑽孔 加工、银刻、衝壓成形,或進行利用雷射、 w⑺ %子束、離子 束、線放電等之加工而形成。 此外,大徑探針保持具4及小徑探針保持具5亦 以下構成:藉由絕緣性材料被覆由導電性材料所構成之美 板之表面(亦包含對應大孔部4a、收容孔部仆及小 土 之侧面的部分)。 ° 第2圖係示意性顯示大孔部4a與小孔部5&之 更具體而言,係顯示大徑孔412a與小徑孔叫之 置關係圖。大徑孔412a之中心轴間距離h係比 :二之令心軸間距離h大。此外,在連通之大孔部“ 4 5a中,大徑孔412a之中心轴與小獲孔5} 、 轴的距離係與大孔部4a之中心軸與小孔部%之中^ 相;。如此’藉由設定大孔部知與小孔心:之: 徑探針觸之小徑探針3側的間-比大 第3圖係顯示探針單元1 ,後,利二=:對 323672 201234017 藉由:乂二保持具5分別先設置定位用之開口部,再 η Λ ·' #入大徑探針保持具4之開口部及對 Π徑探針保持具5之開口部而進行兩者之定= 話,即可f交且。、\位:的 易迅速地進行探針單元1之組裝。 係顯讀針單元丨之整體構纽使用探針單 η…體積體電路之電氣特性檢查之概要的斜視圖。在 :外中在大徑探針保持具4及小徑探針保持具5 ”又置有抑制檢查時產生半導體積體電路1QG之 偏離的保持具構件6。在保持具構件 6之底面側,安裝^ # 具備用以輪出檢查用信號之電路的電路基板200。 第5圖係顯示半導體積體電路1〇〇之檢查時之探針單 兀1之主要部分構成的局部剖面圖。在第5圖所示之狀= 下,大徑探針2係藉由與電路基板2〇〇之電極2〇1接觸而 於圖中承受向上之力。另一方面,小徑探針3係藉由與半 導體積體電路100之電極1〇1接觸而於圖中承受向下之 力。因此,大徑探針2之彈簧構件22係比小徑探針3未與 半導體積體電路100之電極101接觸的狀態更沿著長度方 向收縮。 在半導體積體電路100之檢查時產生的檢查用彳古號係、 透過電路基板200之電極201而經由大徑探針2之第丨柱 塞21、密捲繞部22a、第2柱塞23後,經由小徑探針3到 達半導體積體電路100之電極101。如此,在大徑探針2 中,由於第1柱塞21與第2柱塞23經由密捲繞部22a而 導通,因此可將電氣信號之導通路徑設為最小。因此,防 323672 13 201234017 止檢查時信號流入疏捲繞部22b,而可謀求電感及電阻之 減低及穩定化。 虽探針單元1反覆進行檢查時,小徑探針3係於每次 檢查會反覆進行與電極101之接觸/分離,因此會有因長期 之使用造成前端部31磨耗或小徑探針3破損之情形。此種 情形時,在本實施形態中,由於可從大徑探針保持具4拆 下小徑探針保持具5,因此可簡單地僅更換小徑探針3。 依據以上說明之本發明之一實施形態,由於藉由在使 彼此之軸線偏離之狀態下組合大徑探針與小徑探針而構成 一組探針,因此即使在對應檢查對象之間距的窄小化時 不使探針之兩方端部細徑化亦可。因此,可抑㈣因_ 針之細徑化所造成的容許電流之降低。 此外’依據本實施形態,可將歷時性劣化顯著而為 觸電阻值之增加之最大要因的小徑探針於大徑探針之, 立地更換,因此可簡單地進行維護。此外,由於 獨 徑探針,因此大徑探針保持具側若無特別問題,^、 使用。因此,可節省大徑探針,而具經濟性。 、、、續 再者,依據本實施形態,由於個別地加工大徑 第2柱塞及^絲針,因此與將大徑探針與小徑^ 偏置(offset)而一體成形之情形相比較更容易加工。以 將大經探針與小徑探針予以偏置而一體成开 H 並未形成㈣稱之形狀。因此,在將—體成形之 於探針保持具時,必須留意供對應於小 ^ 之孔部的位置來進行定位,而有探針之二之= 323672 14 201234017 題。相對於此,在本實施形態中, 探針予以分離’而使各探針形 易地將各探針收容在探針保持具。 彳 因此可谷 再者,依據本實施形態,藉由 部比第1柱塞之第1基端部更長 柱塞之第2基端 之繞著與第2柱塞的長度方向正卩7抑制施加有負載時 2柱塞之凸緣部或第2基端部不會卡住彈: 構件,而可使第2柱塞順暢地上下移動。針保持具或彈黃 再者,依據本實施形態,施加於彈菁 之橫負載(起因於大徑探針及小徑探針之軸線 柱塞之傾斜所產生之旋轉負载),係由於第 &成第2 較長而減少,並維持行_之密捲繞部的密捲I之基端部 發揮密捲繞部22a之電阻值穩定的效果。 %。因此, 之 由以上說明得知,本發明係可包含在此未 各樣之實施形料者,在不職由巾請專利範式 技術思想的範圍内可施行各種設計變更。 特疋 (產業上之可利用性) 如上所述,本發明之探針單元係適用於心 體積體電路之電氣特性檢查。 B曰片等半導 【圖式簡單說明】 第1圖係顯示本發明之—實施形態之 部分的構成圖。 平疋之主要 圖 第2圖係示意性顯示大孔部與小孔部之位置 關係的 323672 201234017 第3圖係顯示本發明之一實施形態之探針單元之組裝 的概要圖。 第4圖係示意性顯示本發明之一實施形態之探針單元 之整體構成的斜視圖。 第5圖係顯示本發明之一實施形態之探針單元之檢查 時狀態圖。 【主要元件符號說明】 1 探針單元 2 大徑探針 3 小徑探針 4 大徑探針保持具 4a 大孔部 4b 收容孔部 5 小徑探針保持具 5a 小孔部 6 保持具構件 21 第1柱塞 21a、 23a、31前端部 21b、 33凸緣部 21c、 23b凸柱部 21d、 23c、32基端部 22 彈簧構件 22a 密捲繞部 22b 疏捲繞部 23 第2柱塞 41 第1基板 41a 第1孔部 42 第2基板 42a 第2孔部 51 第3基板 51a 第3孔部 52 第4基板 52a 第4孔部 100 半導體積體電路 101 ' 201電極 200 電路基板 411a 、511a、521a 小徑孔 412a 、512a、522a 大徑孔 16 323672201234017 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a type of electric conductivity sensor for accommodating a conductive probe in a semiconductor integrated circuit or the like. Output input. [Prior Art] A two-figure diagram corresponding to an external electrode of the semiconductor integrated circuit for electrical characteristic inspection of a semiconductor integrated circuit such as an ic chip: a probe unit that accommodates a plurality of conductive probes at predetermined positions ^ The unit system is provided with a plurality of probes for the probes _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The circuit board is in contact with the pole, and the material conductor (four) circuit is electrically connected to the circuit board (see, for example, Patent Document 1). 4 (Prior Art) (Patent Document) Patent Document 1: JP-A-2002-107377 SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, in recent years, inspections of semiconductors and the like for control systems for automobiles have been carried out. In the case and the like, a probe that allows a large current having a current value of about 1 〇 to 2 〇 a to flow is required. In order to meet the above requirements, it is only necessary to make the diameter of the probe thick. Money, when the maximum direct or spacing of the electrodes of the semiconductor is below _, there will be a need to thin the probe straight, resulting in a problem of allowing the 323672 4 201234017 electric valley to be small. Furthermore, when there are two probes, it is also necessary to have a small allowable current at one terminal. * Straight stupid probe, and have to reduce the variety can be suppressed: 2 5 in the above-mentioned subject and researcher's purpose is to provide a probe for the reduction of the allowable current caused by the thin diameter of the probe (the means to solve the problem) In the case of the above-mentioned object, the present invention has the above-mentioned object, and the probe ring of the present invention has a first cassia plug, a second plunger, and a wire! =! Formed as a first material, and having a large end portion coaxially and a first base end connected to the first distal end portion, the second proximal end portion having a distal end directed to the second plunger and the second distal end; And the second base end portion of the length in the axial direction, the spring member is in the longitudinal direction - (4) the second base end, and the first and second plungers are provided on the first plunger side The dense coil = the dense winding portion and the sparsely wound portion wound on the second plunger side at a predetermined pitch, and is expandable and contractible along the longitudinal direction; f a plurality of small-diameter probes each having a conductive material Forming and having a diameter smaller than the diameter of the aforementioned large diameter probe; large diameter probe holder having individual retention a plurality of large-hole portions of the plurality of large-diameter probes and a diameter smaller than the large-hole portion and connected to the plurality of 323672 5 201234017, and the holes are connected to each other, and are in contact with the second front end portion a plurality of the large hole portions and the front (four) hole holes (four) of the end portions of the small-diameter probes are accommodated; the through holes are formed, and the plurality of holes are provided in the thickness direction to prevent the falling off. a plurality of small holes of the small-diameter probes, wherein the probes are kept in a thin manner, and the holes are connected to any of the plurality of six-hole portions, and the large-hole portions that are connected to each other in the present and the _ small _ mandrel system is different, in the π degree direction in the plurality of small hole portions, including the distance between the adjacent mandrels corresponding to the two small hole portions: the small hole portion of the small axis between the small distance When the center needle of the large hole portion is inserted into the small volume === the load at the time of inspection is applied to the small diameter probe - = the above-mentioned hair, the second plane. The length direction of the probe is substantially orthogonal, The probe unit probe holder of the present invention comprises: a first substrate: In the above aspect of the invention, the large diameter of the first plunger is exposed to the first substrate, and the first substrate is disposed on the first substrate, and the second substrate and the second substrate are accommodated. The probe holder has a small control probe holder, and the probe unit of the present invention: the end needle of the small diameter probe is in the foregoing invention, and the former holder 6 201234017 probe holder system It is composed of two substrates which are exposed and held by the aforementioned small gift thieves. The 探针$ display probe of the above-mentioned large cymbal and/or the aforementioned small-diameter riding probe (effect of the invention) probe according to the present invention The unit, because the axis of the H b is combined by the large _ pin and the state of the H b, even if it corresponds to the inspection object two:: two and the probe: because the two ends of the probe are small Chemical. Therefore, j, the required allowable current is reduced. [Embodiment] The present invention is not limited by the following embodiments, and the drawings referred to in the following description of the present invention are not limited by the following embodiments. The shape, size, and positional relationship are shown in a schematic manner only in an understandable manner. The degree of = is limited to the shape, size, and positional relationship illustrated in each figure. It is to be understood that the first section is a partial section of the present invention, which is a single section of the probe. The probe shown in the figure is mainly used for the semiconductor integrated circuit to be inspected; the device used in the system is electrically connected to the circuit substrate of the bulk circuit which is to be inspected for inspection. The sexually coupled semiconductor 1 includes a plurality of large-diameter probes 2, each of which is disposed. Electrode contact of the probe single circuit substrate; a plurality of small diameter probes 3 are disposed at one end of each of the 323672 7 201234017 and are in contact with the large sputum probe 2, and the other end is half touched, and the I* volume circuit is The electrode is connected to #JL4, , the diameter of your path is small; the large diameter probe = two with 5 off state to maintain a plurality of large _ needles and a small _ 5m (four) of the «_ complex _ small diameter probe touch f and has a larger than _ The diameter of the needle 2 is small: 4, in order to prevent the state of the lining. (4) The probe 2 is provided with the probe 2: the first plunger 2 is mounted on the spring member 22 of the elastic member by the end of the conductive material, One plug 23 21 'and is stretchable in the longitudinal direction; and the other end of the member 22 of the second post 21, and the front end is directed in the opposite direction to the first plunger 21. _ plug spring member 22, and ninth: 1 1 column is -. The central axis ' in the longitudinal direction of the plunger 23, the first plug portion 21 includes a distal end portion 2U (first distal end portion) having a large flange portion 21b and having a diameter larger than the diameter of the distal end portion. The :s) portion 21c is opposite to the front end portion 2ia via the flange portion. The dog is formed into a cylindrical shape having a diameter smaller than the diameter of the flange portion 21b and slightly larger than the inside of the spring member 22, for the spring. The end portion of the member 22, the cylindrical base end portion 21d (the first base end portion), has a diameter smaller than the diameter of the boss 4 21c and slightly smaller than the inner diameter of the spring member 22, and enters the spring member. 22 inside. The elastic yellow member 22 includes a sparsely wound portion 22b whose end portion is press-fitted into the boss portion 2ic of the first plunger 21 and the densely wound portion 22a, and is rolled up from a state in which it is connected to the thinner winding portion. The wire constituting the spring member 22 is wound around, and its end portion is pressed into the second dam 23 . The unwinding portion 22b is connected to the densely wound portion 22a, 323672 201234017 and is equal in diameter to each other. The mountain second plunger 23 has a rounded front end portion 23a (second front 鳊P) 'the convex ridge 23b, and has a diameter smaller than the diameter of the front end portion and slightly larger than the inner diameter of the spring member 22. The cylindrical shape, the end portion of the densely wound portion ^ and the base end portion 23c (second base end portion) have a diameter smaller than that of the boss portion 23b and slightly smaller than the spring member 22< And entering the inside of the ridge member 22. The outer diameter of the front end portion 23a is slightly larger than the outer diameter of the spring member 22. In the embodiment A, the length of the Shao 23c is longer than the length of the base end f 23d, and even if the large diameter probe 2 is the maximum stroke, it may be arbitrarily selected within the range of contact with the first domain 21 set up. Further, the front end portion 23a of the upper surface of the second plunger 23 in the surface ill is a plane orthogonal to the longitudinal direction of the large-diameter probe 2, and the small-diameter probe 3 is contacted on the plane. The connecting portion 32 has a small 2-pin 3 system having a sharp end front end portion 31 and a base end respectively; and a convex portion disposed between the front end portion 31 and the base end portion and having a straight ratio and a base end portion 2 of the base portion 2 Edge 33. The diameter of the tip end portion 31 is 2:::r=rr', and the diameter is the ratio of the second plunger 23 of '2; the end is as described above' with the large diameter probe central axis and the large _ needle i ^2, contact. The small diameter probe 3 is positioned to be offset with respect to the large diameter probe 2. (4) In the case of the 针 针 保持 保持 4 ( ( 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 323 The substrate 42 is configured. The large-diameter probe holder 4 has a plurality of large-hole portions 4a' to hold a plurality of large-diameter probes 2; and a plurality of receiving hole portions 4b having a smaller diameter than the large-hole portions and a plurality of large-hole portions The connection of the 4a-connector' accommodates the base end portion 32 of the small-diameter probe 3 in a state of being in contact with the large-diameter probe 2. The large hole portion 4a and the receiving hole portion 4b that communicate with each other penetrate the large diameter probe holder 4 in the thickness direction. Further, the central axes in the longitudinal direction of the large hole portion 4a and the accommodating hole portion 4b that communicate with each other are parallel and different. The distance d between the central axis of the large hole portion 4a and the central axis of the receiving hole portion is set to be smaller than the radius of the circle forming the front end surface of the front end portion 23a. By setting the distance d in the above manner, the large diameter probe 2 and the small diameter probe 3 which are respectively inserted into the large hole portion 4a and the receiving hole portion 4b which are in communication with each other can be surely brought into contact with each other. Further, a plurality of first hole portions 41a forming a part of the large hole portion 4a are placed in the first substrate 41s. The first hole portion 41a has a cylindrical small diameter hole 4na through which the front end portion 21a of the first plunger 21 can be inserted, and a cylinder having a larger diameter than the small diameter hole 411a and coaxial with the small hole hole 411a. Large diameter hole 412a. The diameter of the small diameter hole 411a is smaller than the diameter of the flange portion 2 of the second plunger 21. The small diameter hole 411a prevents the first plunger 21 from coming off in a state where the front end portion 2ia of the second plunger 21 is exposed. Further, the maximum diameter of the large diameter hole 412a is larger than the maximum diameter of the large diameter probe 2. The second substrate 42 is provided with a plurality of receiving hole portions 牝 and a plurality of second hole portions 42a, and a portion of the large hole portion 4a is formed, and communicates with the corresponding receiving hole portion 4b to penetrate the second substrate in the thickness direction. 42. The diameter of the second hole portion 42a is equal to the diameter of the large diameter hole 412a. A plurality of second holes 323672 10 201234017 ^ ^, and the same insulating material is formed by the shape of the plate 52, respectively. The third hole portion 51a of the plurality of portions 8 forming the small hole portion 5a is provided in the first plate 51 of the small diameter probe. The third hole portion 51 a is a cylindrical shape having a circular cross section with 4 knives = 31 inserted; 3 = 3 is larger than the small diameter hole 511a and forms a coaxial tube and a radial hole with the small diameter hole 5 (10) The smaller than the small diameter probe 3: the diameter of the flange 33 is small. Moreover, the female patient's heart is the flange portion 33 of the small-diameter probe 3 =: the two-diameter system is sturdy, and the moxibustion is sized, and has a small probe 3 attached to the flange portion 33. The front end portion 31., the member is exposed, and the small-diameter probe 3 is prevented from coming off. The fourth substrate 52 is provided with a plurality of fourth hole portions 52a which are formed in the small hole portions 5a with the corresponding third hole portions. The fourth hole portion is a cylindrical small diameter hole through which the base end portion 32 of the small control probe 3 is inserted, and the diameter is larger than the small diameter hole 521a and is coaxial with the small diameter hole. Large diameter hole 522a. The small diameter hole 521a is connected to the diameter of the receiving hole portion 521a and the diameter of the receiving hole portion 4b. (4) n ^ 323672 11 201234017 The diameter of the diameter hole 522a is equal to the diameter of the large diameter hole 512a. Each of the plurality of large diameter holes 522a is coaxially communicated with any of the plurality of large diameter holes 512a. The fourth substrate 52 prevents the small-diameter probe 3 from coming off in a state where the base end portion of the small-diameter probe 3 is exposed. The large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a are formed by drilling, silver etching, press forming, or processing by laser, w(7) % beam, ion beam, wire discharge, or the like. Further, the large-diameter probe holder 4 and the small-diameter probe holder 5 are also configured such that the surface of the sheet made of a conductive material is covered with an insulating material (including the corresponding large hole portion 4a and the receiving hole portion). And the side of the small soil). The second drawing schematically shows the large hole portion 4a and the small hole portion 5& more specifically, the relationship between the large diameter hole 412a and the small diameter hole is shown. The distance between the central axes of the large diameter holes 412a is a ratio of two: the distance between the mandrels is large. Further, in the large hole portion "45a, the central axis of the large diameter hole 412a and the small hole 5}, and the distance between the axis and the central axis of the large hole portion 4a and the small hole portion% are included. So by setting the large hole part and the small hole heart: the diameter probe touches the small diameter of the probe 3 side of the gap - the larger picture shows the probe unit 1 , after the Li 2 =: pair 323672 201234017: The second holder 5 is provided with an opening for positioning, and then the opening of the large diameter probe holder 4 and the opening of the probe holder 5 are performed. The setting of the ==, you can f, and \, the position: easy to quickly assemble the probe unit 1. The overall configuration of the reading unit 系 uses the probe single η... the electrical characteristics of the bulk circuit The outline of the inspection is an oblique view of the holder member 6 in which the large-diameter probe holder 4 and the small-diameter probe holder 5 are placed in the outer portion to cause a deviation of the semiconductor integrated circuit 1QG. On the bottom surface side of the holder member 6, a circuit board 200 having a circuit for rotating a signal for inspection is mounted. Fig. 5 is a partial cross-sectional view showing the configuration of a main portion of the probe unit 1 when the semiconductor integrated circuit 1 is inspected. In the shape shown in Fig. 5, the large-diameter probe 2 is subjected to an upward force in the drawing by being in contact with the electrode 2〇1 of the circuit board 2〇〇. On the other hand, the small-diameter probe 3 is subjected to a downward force in the drawing by being in contact with the electrode 1〇1 of the semiconductor body circuit 100. Therefore, the spring member 22 of the large-diameter probe 2 is contracted more in the longitudinal direction than the state in which the small-diameter probe 3 is not in contact with the electrode 101 of the semiconductor integrated circuit 100. In the inspection of the semiconductor integrated circuit 100, the inspection of the semiconductor integrated circuit 100, the transmission of the electrode 201 of the circuit board 200, the passage of the second plunger 21 of the large diameter probe 2, the dense winding portion 22a, and the second plunger 23 Thereafter, the electrode 101 of the semiconductor integrated circuit 100 is reached via the small diameter probe 3. As described above, in the large diameter probe 2, since the first plunger 21 and the second plunger 23 are electrically connected via the dense winding portion 22a, the conduction path of the electric signal can be minimized. Therefore, the 323672 13 201234017 signal flows into the unwinding unit 22b at the time of inspection, and the inductance and resistance can be reduced and stabilized. When the probe unit 1 is repeatedly inspected, the small-diameter probe 3 is repeatedly brought into contact with and separated from the electrode 101 every time, so that the front end portion 31 is worn or the small-diameter probe 3 is broken due to long-term use. The situation. In this case, in the present embodiment, since the small-diameter probe holder 5 can be removed from the large-diameter probe holder 4, only the small-diameter probe 3 can be easily replaced. According to an embodiment of the present invention described above, since a large-diameter probe and a small-diameter probe are combined in a state in which the axes of the two are offset from each other, a set of probes is formed, so that the distance between the objects to be inspected is narrow. When the size is small, the diameters of both ends of the probe may not be reduced. Therefore, it is possible to suppress (4) the decrease in the allowable current due to the narrowing of the _ needle. Further, according to the present embodiment, the small-diameter probe which is distinguished by the deterioration of the chronological resistance and which is the largest factor of the increase in the contact resistance value can be replaced by the large-diameter probe, so that the maintenance can be easily performed. In addition, due to the unique probe, there is no special problem with the large-diameter probe holder side. Therefore, the large diameter probe can be saved and it is economical. Further, according to the present embodiment, since the large-diameter second plunger and the wire needle are individually processed, compared with the case where the large-diameter probe and the small-diameter probe are integrally formed by offset. Easier to process. The large-diameter probe and the small-diameter probe are biased to form an open H. The shape of the (four) is not formed. Therefore, when shaping the body to the probe holder, it is necessary to pay attention to the position corresponding to the hole portion of the small hole for positioning, and the second of the probes = 323672 14 201234017. On the other hand, in the present embodiment, the probes are separated', and each probe can easily accommodate each probe in the probe holder. According to the present embodiment, the second base end of the plunger is longer than the first base end of the first plunger, and the second base end of the second plunger is restrained from the longitudinal direction of the second plunger. When the load is applied, the flange portion or the second base end portion of the plunger does not catch the spring member, and the second plunger can be smoothly moved up and down. According to the present embodiment, the needle holder or the spring yellow is applied to the transverse load of the elastic crystal (the rotational load caused by the inclination of the axis plunger of the large diameter probe and the small diameter probe), due to the & The second end is made smaller and smaller, and the base end portion of the dense roll I of the densely wound portion is maintained to have an effect of stabilizing the resistance value of the densely wound portion 22a. %. Therefore, it is to be understood that the present invention may be embodied in a variety of embodiments, and various design changes can be made within the scope of the technical idea of the patent application. Features (Industrial Applicability) As described above, the probe unit of the present invention is suitable for electrical property inspection of a cardiac volume circuit. Semi-conducting such as B-slices [Simplified description of the drawings] Fig. 1 is a view showing a configuration of a part of the embodiment of the present invention. Fig. 2 is a schematic view showing the relationship between the position of the large hole portion and the small hole portion. 323672 201234017 Fig. 3 is a schematic view showing the assembly of the probe unit according to an embodiment of the present invention. Fig. 4 is a perspective view schematically showing the overall configuration of a probe unit according to an embodiment of the present invention. Fig. 5 is a view showing the state of the probe unit in an embodiment of the present invention. [Description of main component symbols] 1 Probe unit 2 Large diameter probe 3 Small diameter probe 4 Large diameter probe holder 4a Large hole portion 4b Housing hole portion 5 Small diameter probe holder 5a Small hole portion 6 Hold member 21 first plungers 21a, 23a, 31 front end portions 21b, 33 flange portions 21c, 23b, boss portions 21d, 23c, 32 base end portion 22 spring member 22a tightly wound portion 22b sparse winding portion 23 second plunger 41 first substrate 41a first hole portion 42 second substrate 42a second hole portion 51 third substrate 51a third hole portion 52 fourth substrate 52a fourth hole portion 100 semiconductor integrated circuit 101 '201 electrode 200 circuit substrate 411a 511a, 521a small diameter holes 412a, 512a, 522a large diameter holes 16 323672

Claims (1)

201234017 七、申凊專利範圍: 1· 一種探針單元,係具備: 複數個大徑探針,其具有第1柱塞、第2柱塞、及 線圏狀之彈簧構件,且沿著長度方向伸縮自如,其中, 第1柱塞係各自利用導電性材料而形成,且在同軸上具 有呈大致針狀之第1前端部及與該第1前端部連接之第 1基鳊部,第2柱塞係在同轴上具有前端指向與前述第 1柱塞之前端相反之方向的第2前端部、及前述轴方向 之長度比前述第1基端部長之第2基端部,彈簧構件係 長度方向之一端部包括前述第1基端部且另一端部包 括月!J述第2基端部,安裝在則述第1及第2柱塞且且有 在則述第1柱塞側密捲繞之密捲繞部、及以預定間距在 前述第2柱塞側捲繞之疏捲繞部,並且沿著該長度方向 伸縮自如; 復數個小徑探針,各自利角 ,丨王何科而形成 具有比前述大徑探針之直徑小的直徑; 大徑探針保持具,其具有個別地保持前述複數個大 徑探針之複數個大孔部、及直徑比前述大孔部小且與前 述複數個大孔部之任一者連通,並且在與前述第2前 =接觸之狀態下收容前述小卿狀端部的複數個收 彼,通之前述大孔部及前述收容孔部之組係 在厚度方向貫通;以及 小徑探針簡具,麵度方向貫通設 落之狀態下個別地保捭前、f $机 方止脫 也保持刖述複數個小徑探針之複數個 323672 1 201234017 小孔部,且該小徑探針保持具係以各小孔部與前述複數 個收容孔部之任一者連通之方式積層在前述大徑探針 保持具·; 彼此連通之前述大孔部及前述小孔部之長度方向 的中心軸係為不同, 在前述複數個小孔部,包含有鄰接之二個小孔部的 中心軸間距離比分別對應該二個小孔部之二個大孔部 的中心軸間距離小者, 前述第2基端部係至少在檢查時之負載施加於小 徑探針時,進入前述密捲繞部之内部。 2. 如申請專利範圍第1項所述之探針單元,其中,前述第 2柱塞之前端係形成與前述大徑探針之長度方向大致 正交之平面。 3. 如申請專利範圍第2項之所述探針單元,其中,前述大 徑探針保持具係具備: 第1基板,使前述第1柱塞之前端部顯露出地對前 述第一柱塞予以保持;以及 第2基板,積層在前述第1基板,並且積層在前述 小徑探針保持具,以收容前述小徑探針保持具所保持之 前述小徑探針之端部。 ’ 4. 如申請專利範圍第1項所述之探針單元,其中,前述大 徑探針保持具係具備: 第1基板,使前述第1柱塞之前端部顯露出地對前 述第一柱塞予以保持;以及 2 323672 201234017 第2基板’積層在前述第i基板,並且積層在前述 =探針_具’叫容前料徑探針料具所保持之 别述小徑探針之端部。 5· ^申請專賴㈣4項所述之探針單元,其巾,前述小 徑探針保持具係由分別使前述小徑探針之任一方之端 對前述小徑探針予以保持的二個基板積層 6. 2請專鄉㈣3賴狀探針單元,其巾,前述小 化探針保持具係由分別使前述小經探針之任一方之端 部=露出地對前述小徑探針予以保持的 而構成者。 丨"签取檟層 7·如申請專利範圍第2項所述之探針單元, 徑探針保持具係由分別使前述小徑探針之任一;端、 =地對前述小後探針予以保持的二個基板積層: 8. 如申請專利_第丨項所述之探針單元 徑探針保持具係由分別使前述小押 、〒則述小 =對前述小彳_予,;的 9. 如申=韻_項至第δ項中 :,其中,前述大徑探針保持具及前述小徑探針= 係至少與前述大徑探針及/或前述小檀探針接觸 具有絕緣性。 323672 3201234017 VII. Application scope of the patent: 1. A probe unit comprising: a plurality of large diameter probes having a first plunger, a second plunger, and a coil-shaped spring member, and along the length direction Each of the first plungers is formed of a conductive material, and has a first needle end portion that is substantially needle-shaped and a first base portion that is connected to the first tip end portion, and a second column. The plug has a second distal end portion whose distal end is directed in a direction opposite to the front end of the first plunger, and a length of the axial direction that is longer than a second proximal end portion of the first proximal end, and a spring member length One end of the direction includes the aforementioned first base end and the other end includes a month! The second proximal end portion is attached to the first and second plungers, and the densely wound portion that is tightly wound on the first plunger side and the second plunger side at a predetermined pitch Winding the unwound portion and expanding and contracting along the length direction; a plurality of small-diameter probes, each having a sharp angle, forming a diameter smaller than a diameter of the large-diameter probe; The plurality of large-hole portions each having the plurality of large-diameter probes individually held, and having a diameter smaller than the large-hole portion and communicating with any of the plurality of large-hole portions, and before the second In the state of contact, a plurality of the small-sized end portions are accommodated, and the group of the large-hole portion and the receiving hole portion are penetrated in the thickness direction; and the small-diameter probe is simple, and the surface of the small-diameter is inserted. In the falling state, before the individual protection, the f $ machine stops the 323672 1 201234017 small hole portion of the plurality of small diameter probes, and the small diameter probe holder is attached to each small hole portion. Laminating in front of any of the plurality of receiving hole portions The large-diameter probe holder has a central axis in the longitudinal direction of the large hole portion and the small hole portion that communicate with each other, and the plurality of small hole portions include a center of two adjacent small hole portions The distance between the shafts is smaller than the distance between the central axes of the two large hole portions of the two small hole portions, and the second base end portion enters the dense portion when at least the load at the time of inspection is applied to the small diameter probe. The inside of the winding section. 2. The probe unit according to claim 1, wherein the second plunger front end forms a plane substantially orthogonal to a longitudinal direction of the large diameter probe. 3. The probe unit according to claim 2, wherein the large-diameter probe holder includes: a first substrate, the front end of the first plunger is exposed to the first plunger And the second substrate is laminated on the first substrate, and is laminated on the small-diameter probe holder to accommodate an end portion of the small-diameter probe held by the small-diameter probe holder. 4. The probe unit according to claim 1, wherein the large-diameter probe holder includes: a first substrate, the first plunger is exposed to the first column before the first column The plug is held; and 2 323672 201234017 the second substrate 'laminated on the aforementioned i-th substrate, and laminated at the end of the other small-diameter probe held by the aforementioned probe_probe . 5. The invention relates to a probe unit according to (4), wherein the small-diameter probe holder has two of the small-diameter probes respectively holding the end of the small-diameter probe to the small-diameter probe. The substrate laminate 6.2 is a home-made (4) 3-way probe unit, and the small-sized probe holder is provided with the end portion of each of the small-sized probes to expose the small-diameter probe. The person who keeps it.丨"Signature layer 7] The probe unit described in claim 2, the probe holder is made of any of the aforementioned small-diameter probes; The two substrate layers to be held by the needle are as follows: 8. The probe unit diameter probe holder according to the application of the above-mentioned patent _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 9. The method of claim 1, wherein the large diameter probe holder and the small diameter probe are at least in contact with the large diameter probe and/or the aforementioned small Tan probe. Insulation. 323672 3
TW100141984A 2010-11-17 2011-11-17 Probe unit TWI457573B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010257232 2010-11-17

Publications (2)

Publication Number Publication Date
TW201234017A true TW201234017A (en) 2012-08-16
TWI457573B TWI457573B (en) 2014-10-21

Family

ID=46084048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100141984A TWI457573B (en) 2010-11-17 2011-11-17 Probe unit

Country Status (3)

Country Link
JP (1) JPWO2012067125A1 (en)
TW (1) TWI457573B (en)
WO (1) WO2012067125A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747536B (en) * 2019-10-04 2021-11-21 日商村田製作所股份有限公司 Probe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6567954B2 (en) * 2015-10-28 2019-08-28 株式会社エンプラス Socket for electrical parts
CN113552393A (en) * 2020-04-23 2021-10-26 跃澐科技股份有限公司 Test probe seat structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002062312A (en) * 2000-08-22 2002-02-28 Toyo Denshi Giken Kk Contact device
JP4521106B2 (en) * 2000-09-28 2010-08-11 日本発條株式会社 Conductive contact with movable guide plate
US6859054B1 (en) * 2003-08-13 2005-02-22 Advantest Corp. Probe contact system using flexible printed circuit board
JP4607004B2 (en) * 2005-12-27 2011-01-05 株式会社ヨコオ Inspection unit
JP4939879B2 (en) * 2006-09-13 2012-05-30 株式会社エンプラス Electrical contact and socket for electrical parts
KR101174007B1 (en) * 2008-02-01 2012-08-16 니혼 하츠쵸 가부시키가이샤 probe unit
TWI388839B (en) * 2008-02-14 2013-03-11 Nhk Spring Co Ltd Probe unit
WO2009102029A1 (en) * 2008-02-14 2009-08-20 Nhk Spring Co., Ltd. Contact probe and probe unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747536B (en) * 2019-10-04 2021-11-21 日商村田製作所股份有限公司 Probe

Also Published As

Publication number Publication date
JPWO2012067125A1 (en) 2014-05-12
TWI457573B (en) 2014-10-21
WO2012067125A1 (en) 2012-05-24

Similar Documents

Publication Publication Date Title
TWI397692B (en) Probe unit
TWI600218B (en) Connection terminal
KR101593572B1 (en) Electrical connector with insulation member
TWI482973B (en) Wire material for spring, contact probe, and probe unit
TWI418820B (en) Inspection fixture and probe
TW200829922A (en) High frequency probe
TW201234017A (en) Probe unit
TW200922022A (en) Ultra fine pitch connector and cable assembly
JP2012164469A5 (en)
TWI479156B (en) Probe unit
JP6283929B2 (en) Inspection jig and method for manufacturing inspection jig
TWI457571B (en) Inspection probe and inspection fixture
JP2007178163A (en) Inspection unit and outer sheath tube assembly for inspection probe used for it
TW200902983A (en) Conductive contact and conductive contact unit
JP2007533974A5 (en)
US11089676B2 (en) Multi-layered fabrication processing
TW201145728A (en) Contact pin holder
JP2012159425A5 (en)
US8463379B2 (en) Lead wire and pacemaker using the same
TWI626453B (en) Probe assembly and capacitive space transformer thereof
JP5894718B2 (en) Contact, inspection jig, and method of manufacturing contact
KR101565838B1 (en) Probe pin equipped with niddle for preventing short
JP6071633B2 (en) Contact, inspection jig, and method of manufacturing contact
JP2012251837A (en) Connection terminal, method of manufacturing connection terminal, and micro spring
JP2018125174A (en) Chuck signal transmission cable and prober system

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees