WO2012061962A1 - 无版转印膜 - Google Patents

无版转印膜 Download PDF

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Publication number
WO2012061962A1
WO2012061962A1 PCT/CN2010/002163 CN2010002163W WO2012061962A1 WO 2012061962 A1 WO2012061962 A1 WO 2012061962A1 CN 2010002163 W CN2010002163 W CN 2010002163W WO 2012061962 A1 WO2012061962 A1 WO 2012061962A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
transfer
transfer film
plateless
substrate
Prior art date
Application number
PCT/CN2010/002163
Other languages
English (en)
French (fr)
Inventor
刘崇生
Original Assignee
蓝天电脑股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蓝天电脑股份有限公司 filed Critical 蓝天电脑股份有限公司
Priority to JP2013600067U priority Critical patent/JP3187000U/ja
Publication of WO2012061962A1 publication Critical patent/WO2012061962A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/12—Transfer pictures or the like, e.g. decalcomanias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer

Definitions

  • the utility model relates to a transfer technology, in particular to a plateless transfer technology, which can adopt a pattern
  • transfer technology such as water transfer, thermal transfer and rub transfer.
  • the transfer pattern can be obtained by traditional printing and digital printing output, which are plate transfer and non-print transfer, among which thermal transfer It has been widely used on various items to make items beautiful or unique.
  • the thermal transfer mainly covers the transfer film on the object to be transferred, transfers the pattern on the transfer film to the object to be transferred, and obtains a stable transfer quality on a small area or a plane, but encounters The uneven surface such as the uneven surface or the vertical angle is liable to cause uneven adhesion or peeling due to the presence of air bubbles between the transfer film and the article to be transferred. Summary of the invention
  • the object of the present invention is to provide a plateless transfer film for improving the transfer effect of an electronic device having an uneven surface or a vertical angle, and avoiding uneven adhesion or falling off between the transfer film and the electronic device after transfer. .
  • a technical solution of the present invention provides a plateless transfer film, comprising: a substrate; and a transfer layer on the substrate, the transfer layer comprising: a release layer on the substrate, the substrate is selectively separated from the transfer layer; a patterned layer on the release layer, having a full-color image, text, symbol or number; a white ink a layer on the pattern layer; and an adhesive layer on the white ink layer to impart adhesion to the plateless transfer film.
  • the substrate is a plastic film or paper.
  • the pattern layer is formed by an output of an inkjet printer or a laser printer.
  • the release layer is a hot melt type, a heat hardening type or a semi-hardening type release agent.
  • the adhesive layer is a thermal transfer adhesive.
  • the plateless transfer film further comprises a transparent protective layer, the transparent protective layer being located between the release layer and the pattern layer.
  • the release layer is a transparent anti-solvent ink, a transparent acrylic glue or a transparent hot melt adhesive.
  • Figure 1 is a cross-sectional view showing an embodiment of a plateless transfer film of the present invention
  • FIG. 2 is a schematic view of an embodiment of a plateless transfer film of the present invention.
  • FIG. 3 is a schematic view of an embodiment of an electronic device having a full color pattern according to the present invention
  • FIG. 4 is a schematic view showing an embodiment of the plateless transfer device of the present invention
  • Figure 5 is a flow chart of an embodiment of a method of manufacturing a plateless transfer mold of the present invention
  • Figure 6 is a flow chart of an embodiment of a method of manufacturing an electronic device having a full color pattern of the present invention.
  • the utility model uses a roller to perform plateless transfer on an electronic device body, so that the plateless transfer film can be uniformly and evenly transferred onto the electronic device body to obtain an article having a full color pattern.
  • FIG. 1 is a cross-sectional view showing an embodiment of a plateless transfer film provided by the present invention.
  • a plateless transfer film 1 includes a substrate 10 and a transfer layer 12, wherein the transfer layer 12 includes a release layer 121, a transparent protective layer 123, a pattern layer 125, and a white layer. Ink layer 127 and an adhesive layer 129.
  • the transfer layer 12 is located on the substrate 10, the release layer 121 in the transfer layer 12 is on the substrate 10, the transparent protective layer 123 is on the release layer 121, and the pattern layer 125 is on the transparent protective layer 123.
  • Layer 127 is on pattern layer 125 and adhesive layer 129 is on white ink layer 127.
  • the substrate 10 may be a soft film such as a plastic film or a paper. If it is a plastic film, it is difficult to adhere to pigments such as ink. Therefore, it is necessary to add a release layer 121.
  • the release layer 121 may be hot-melt type or heat-hardened.
  • the type or semi-hardening release agent can prevent the pattern layer 125 from being inseparable from the substrate 10, that is, as a release agent; and the transparent protection layer 123 can be a transparent anti-solvent ink, a transparent acrylic glue or a transparent hot melt.
  • Glue or the like which has heat-resistant and non-melting properties, not only provides a smooth output of the pattern layer 125 of the printer, but also resists chemical solvent erosion or physical scratch damage to protect the pattern layer 125;
  • the pattern layer 125 can be laser printer or inkjet printer
  • the color ink layer of the inkjet output is printed, and the ink is an environmentally-friendly solvent ink, which constitutes a pattern of one or more combinations of images, characters, symbols or numerals, and the pattern layer 125 can also be repeatedly applied four times by four color paints.
  • the pattern is further dried, and the four colors can be four primary colors of yellow, red, blue and black, wherein the coating step is completed by using a coater.
  • the drying step is performed by using a blower or a baking machine;
  • the white ink layer 127 is a white paint; and the adhesive layer 129 can be a thermal transfer adhesive for printing.
  • FIG. 2 is a schematic view of an embodiment of the plateless transfer film of the present invention.
  • the plateless transfer film 1 is a sheet or a roll of flexible sheet, and the substrate 10 may have 250 mesh.
  • the unit of the mesh is: strip/inch, in one embodiment, without a plate.
  • the transfer film 1 is formed by coating a release coating layer 121 on a substrate 10 with a coater or a printer, and then coating the pattern layer 125 on the release layer 121 by a coater or a printer, or
  • the transparent protective layer 123 is coated and then printed with the pattern layer 125, wherein the release layer 121 has a higher mesh and is not easily penetrated by the ink or paint of the pattern layer 125.
  • a mesh of at least 400 or higher may be colored, and then a white ink layer 127 may be applied or printed on the pattern layer 125, and the white ink layer 127 may have a mesh of about 300.
  • the adhesive layer 129 is coated or printed on the white ink layer 127 by a coater, and the adhesive layer 129 is melted at a suitable temperature.
  • the shape for example, has the best viscosity at about 75 to 120 degrees, and has low viscosity at normal temperature, so that the non-printing film 1 has adhesiveness when heated, and can be used as a scroll bar type at normal temperature.
  • FIG. 3 is a schematic diagram of an embodiment of an electronic device having a full color pattern according to the present invention.
  • the electronic device 2 having a full color pattern includes an electronic device body 20 and a transfer layer 12, wherein the pattern layer 125 of the transfer layer 12 is a pattern designed according to customization requirements, and the transferred object 20 is a replacement notebook type.
  • the computer casing adds the uniqueness and anti-counterfeiting property of the notebook computer.
  • the material of the adhesive layer 129 needs to match the material of the electronic device body 20 and the electronic device.
  • the material of the surface of the body 20 is compatible, and the material of the adhesive layer 129 may be polyester, epoxy resin or a composition thereof, and the material of the electronic device body 20 may be metal or plastic, and the adhesive layer 129 has good adhesion at a certain temperature.
  • the adhesive layer 129 is closely adhered to the surface of the electronic device body 20, and the temperature does not reach the melting point of the electronic device body 20, so that the electronic device body 20 is not damaged; in an embodiment, the adhesive layer 129 can have a higher The low melting point, about 75 to 100 degrees, allows the transfer to be performed under low temperature heating, avoiding melting or deforming the electronic device body 20, and cooling to after heating
  • the transfer layer 12 may be uniformly peeled off from the substrate 10 at a lower temperature, for example, at about 40, i.e., when the release layer 121 is cooled or still in a liquid state, and the transfer layer 12 may include a transparent protective layer 123 or may not include The transparent protective layer 123, if the transfer layer 12 does not include the transparent protective layer 123, after the substrate 10 is peeled off from the transfer layer 12, an anti-solvent transparent ink is applied on the pattern layer 125 to form a transparent protective layer 123.
  • the protective pattern layer 125 is not damaged by physical solvents or physically scratched.
  • the transfer layer 12 does not include the adhesive layer 129, but the material of the electronic device body 20 or the surface primer thereof is viscous when heated, and is adhered to the pattern layer 125.
  • the plateless transfer device 3 includes a plateless transfer film 1 and a transfer machine 30.
  • the transfer machine 30 includes a roller 33, a fixed base 31, and a transfer portion 35.
  • the fixing base 31 is used for fixing the electronic device body 20, and the roller 33 is matched with the outer shape of the electronic device body 20. The position of the roller 33 can be changed by lifting.
  • a plurality of rollers 33 can be used, which have the same or Different radius sizes to uniformly press the plateless transfer film 1 with the electronic device body 20;
  • the plateless transfer film 1 is flatly spread on the electronic device body 20, and the transfer portion 35 can be a rotating shaft or a roller.
  • the plateless transfer film 1 can be A heating portion (not shown) is heated to a specific temperature, for example, about 75 to 100 degrees, so that the plateless transfer film 1 is viscous, wherein the heating portion can be a light source that is a heat source, such as a laser, when there is no plate.
  • the transfer film 1 is placed on the surface of the electronic device body 20 to be transferred, and after applying a pressure to the plateless transfer film 1 via the roller 33, the plateless transfer film 1 is transferred to the electronic device body 20 uniformly and without bubbles.
  • the printer 30 further includes a suction portion (not shown) for vacuuming the environment in the transfer machine 30 to ensure a gap between the plateless transfer film 1 and the electronic device body 20. There is no bubble present; in one embodiment, the roller 33 has a heating source (not shown) at a temperature of about 75 to 100 degrees. When the roller 33 is in contact with the plateless transfer film 1, the non-printing film 1 is simultaneously applied.
  • the transfer machine 30 further includes a high temperature blowing portion (not shown). After the roller 33 is imprinted with the plateless transfer film, a silicone layer 331 is overlaid on the plateless transfer film 1, and the high temperature blowing portion is used. The gas pressure blown by the silica gel layer 331 applies pressure between the plate-free transfer films 1. If the surface of the electronic device body 20 is uneven or has a vertical angle, the silica gel layer 331 contributes to the force applied to the plateless transfer film 1. Evenly, the adhesion effect of the plateless transfer film 1 on the electronic device body 20 is better, so that the transfer quality is improved. "
  • FIG. 5 is a flow chart of an embodiment of a method for manufacturing a plateless transfer film of the present invention.
  • a plastic film or paper is prepared as a substrate 10, and a release agent is coated on the substrate 10 by a coater to form a release layer 121 (S501);
  • a transparent anti-solvent ink is applied onto the release layer 121 to form a transparent protective layer 123 (S503), and a full-color pattern is printed on the transparent protective layer 123 by a laser printer or an inkjet printer to form a pattern.
  • the layer 125 (S505), in one embodiment, the pattern layer 125 can be repeatedly printed by the printer for several times; after the pattern layer 125 is dried, the white ink is printed on the pattern layer 125 to form a white ink layer 127 (S507), After the white ink layer 127 is dried, the thermal transfer adhesive is applied onto the white ink layer 127 to form an adhesive layer 129 (S509).
  • FIG. 6 is a flow chart of an embodiment of a method of manufacturing an electronic device having a full color pattern according to the present invention.
  • the above-mentioned plateless transfer film 1 is prepared, and the plateless transfer film 1 is flatly covered on the electronic device body 20 by the transfer portion 35 of the transfer machine 30 (S601); a heat source such as a laser light source is used.
  • a heat source is provided to heat the plateless transfer film 1 (S603), and the heating temperature may be 75 to 100 degrees; the plateless transfer film 1 (S605) is embossed by the roller 33, and in one embodiment, the roller 33
  • the transfer machine 30 may include a plurality of rollers 33; then, passing about 75 to 100 degrees The high temperature gas is subjected to air pressure pressing on the plateless transfer film 1 (S607).
  • the silicon plate layer 331 may be covered on the plateless transfer film 1, and the high temperature gas is blown to the silicone layer 331. Pressurization, indirect addition of uniform pressure to the plateless transfer film 1.
  • the present invention transfers the plateless transfer film onto the body of the electronic device by low-temperature heating and air-blowing, thereby achieving the purpose of transferring the pattern on an uneven surface or a vertical angle.
  • the plateless transfer device of the present invention can solve the problem that the transfer film is easily peeled off due to the long-term use of the conventional transfer article because of the bubble between the transfer film and the body of the electronic device.

Landscapes

  • Decoration By Transfer Pictures (AREA)
  • Laminated Bodies (AREA)

Description

无版转印膜 技术领域
本实用新型涉及一种转印技术， 尤指一种无版转印技术， 其可以将图案
- 转印于电子装置的机壳。 背景技术
转印的技术有许多种， 如水转印、 热转印及擦转印， 其转印的图案可由 传统印刷及数字印刷输出得到， 分别为有版转印及无版转印， 其中热转印已 广泛地应用在各种物品上， 使物品产生美感或具有独特性。
热转印主要是将转印膜覆盖在待转印物品上， 将转印膜上的图案转印于 待转印物品上，、 于小面积或平面上可得到稳定的转印质量， 但是遇到不平整 面如凹凸面或是垂直角， 容易因为转印膜与待转印物品之间有气泡存在而产 生附着不均匀或脱落的情形。 发明内容
本实用新型的目的在于提供一种无版转印膜， 以改善具有不平整面或是 垂直角的电子装置的转印效果， 避免转印后转印膜与电子装置之间附着不均 匀或脱落。
为了解决上述技术问题， 本实用新型的一技术方案提供一种无版转印 膜， 其特征在于， 包括:一基材;及一转印层， 位于该基材上， 该转印层包括: 一离型层， 位于该基材上， 提供该基材与该转印层选择式分离；一图案层， 位 于该离型层上， 具有全彩的图像、 文字、 符号或数字;一白色油墨层， 位于该 图案层上;及一黏着层， 位于该白色油墨层上， 使该无版转印膜具有附着力。
其中， 该基材为塑料膜或纸张。
其中， 该图案层为喷墨打印机或激光打印机所输出形成。
其中， 该离型层为热熔化型、 热硬化型或半硬化型离型剂。
其中， 该黏着层为热转印胶。
其中， 该无版转印膜还包括一透明保护层， 该透明保护层位于该离型层 与该图案层之间。
其中， 该离型层为透明抗溶剂油墨、 透明压克力胶或透明热熔胶。
以上的概述与接下来的详细说明皆为示范性质， 是为了进一步说明本实 用新型的申请专利范围。 而有关本实用新型的其它目的与优点， 将在后续的 说明与图示加以阐述。 附图说明
图 1为本实用新型的无版转印膜的一实施例的剖面图；
图 2为本实用新型的无版转印膜的一实施例的示意图；
图 3为本实用新型的具有全彩图案的电子装置的一实施例的示意图； 及 图 4为本实用新型的无版转印装置的一实施例的示意图；
图 5为本实用新型的制造无版转印模的方法的一实施例的流程图； 及 图 6为本实用新型的制造具有全彩图案的电子装置的方法的一实施例的 流程图。
其中， 附图标记说明如下：
1无版转印膜
10基材
12转印层
121离型层
123透明保护层
125图案层
127白色油墨层
129黏着层
2具有全彩图案的电子装置
20电子装置本体
3无版转印装置
30转印机
31固定底座
33滚轮
35传送部
331硅胶层 . 具体实施方式
本实用新型以一滚轮对一电子装置本体进行无版转印， 使得无版转印膜 可以均匀平整地转印在电子装置本体上， 以得到具有全彩图案的物品。
为了提供更详尽的说明与解释， 以下将配合示意图针对本实用新型进行 解说， 以便更为明确而清楚地揭露本实用新型所使用的技术及手段， 以彰显 本实用新型所具有的优点及其所能达成的功效。
以下的说明中当提到某一层位于另一层上或类似位置相对关系的用语 时， 是为了指出图中所举的实施例， 若将图式的坐标旋转， 则原本被描述为 位于另一层上将位于另一层下， 且两层之间可存在其它层。
请参考图 1， 其为本实用新型所提供的一种无版转印膜的一实施例的剖 面图。 如图 1所示， 一无版转印膜 1包括一基材 10及一转印层 12， 其中转 印层 12包括一离型层 121、 一透明保护层 123、 一图案层 125、 一白色油墨 层 127及一黏着层 129。
其中转印层 12位于基材 10上， 转印层 12中的离型层 121位于基材 10 上，透明保护层 123位于离型层 121上， 图案层 125位于透明保护层 123上， 白色油墨层 127位于图案层 125上， 黏着层 129位于白色油墨层 127上。
其中基材 10可为塑料膜或纸张等软性片材，若为塑料膜则不易附着油墨 等颜料， 因此需要加上一层离型层 121， 离型层 121可为热熔化型、 热硬化 型或半硬化型离型剂，且可以避免图案层 125与基材 10不可分离，也就是作 为脱膜剂； 而透明保护层 123可为透明抗溶剂油墨、 透明压克力胶或透明热 熔胶等， 其具有耐热不易熔解性质， 不仅提供打印机顺利输出图案层 125， 且可抵抗化学溶剂侵蚀或物理性刮伤破坏， 以保护图案层 125 ; 图案层 125 可由激光打印机或喷墨打印机所喷绘输出的彩色油墨层， 且墨水为环保型溶 剂墨水， 构成图像、 文字、 符号或数字等其中一种或两种以上组合的图案， 图案层 125亦可由四种颜色涂料重复进行四次涂布再烘干完成图案， 其中四 种颜色可为黄色、 红色、 蓝色与黑色四种原色， 其中涂布的步骤为利用涂布 机完成， 而烘干的步骤为利用吹气机或烘烤机完成； 白色油墨层 127为一种 白色涂料； 黏着层 129可为印刷用热转印胶。
请参考图 2，其为本实用新型的无版转印膜的一实施例的示意图。如图 2 所示， 无版转印膜 1为一片或一卷的软性片材， 基材 10可具有 250网目， 网 目的单位为： 条 /英吋， 在一实施例中, 无版转印膜 1的制作为在基材 10上 以涂布机涂布或打印机印刷上离型层 121， 接着在离型层 121上以涂布机涂 布或打印机印刷图案层 125，或是先涂上透明保护层 123再印刷上图案层 125， 其中离型层 121具有较高的网目且不易被图案层 125的油墨或涂料穿透， 例 如最少为 400或更高的网目， 且可以均勾地被上色， 接着再涂上或印刷上白 色油墨层 127于图案层 125上， 而白色油墨层 127可具有约 300的网目， 用 以弥补打印机无法印刷出白色颜料， 更可以增加图案层 125的对比， 最后在 白色油墨层 127上以涂布机涂布或打印机印刷黏着层 129， 黏着层 129在一 适当的温度下呈熔融状，例如约在 75〜120度时具有最好的黏性，而常温时黏 性低， 使无版转印膜 1加热时具有黏着性， 在常温时可做滚动条式收藏。
、请参考图 3， 其为本实用新型的具有全彩图案的电子装置的一实施例的 示意图。 具有全彩图案的电子装置 2包括一电子装置本体 20及转印层 12， 其中转印层 12的图案层 125为依据客制化需求所设计的图案， 被转印物 20 为替换式笔记型电脑机壳， 增添了笔记本电脑外观的独特性与防伪性； 为了 使无版转印膜 1与电子装置本体 20顺利转印，黏着层 129的材质需配合电子 装置本体 20的材质且与电子装置本体 20表面的材质兼容， 黏着层 129的材 质可为聚脂、环氧树脂或其组成物，而电子装置本体 20的材质可为金属或塑 料， 在一特定温度下黏着层 129具有好的黏着性， 使黏着层 129紧密地黏在 电子装置本体 20的表面， 且该温度未达电子装置本体 20的熔点， 因此不会 破坏电子装置本体 20; 在一实施例中， 黏着层 129可具有较低的熔点， 约 75 至 100度，使转印可在低温加热下进行，避免使电子装置本体 20熔化变形或 损毁， 且加热后冷却到一较低的温度， 例如约在 40时， 即离型层 121冷却或 仍为液态时，转印层 12可与基材 10均匀地剥离，转印层 12可包含透明保护 层 123或不包括透明保护层 123 , 若转印层 12不包括透明保护层 123， 则在 基材 10与转印层 12剥离后， 再将一抗溶剂透明油墨涂在图案层 125上来形 成透明保护层 123， 以保护图案层 125不被化学溶剂破坏或物理性刮伤。 在 另一实施例中， 转印层 12不包含黏着层 129， 而是电子装置本体 20本身材 质或其表面底漆遇热时具有黏性， 可与图案层 125黏着。
接着， 请参考图 4， 为本实用新型的无版转印装置的一实施例的示意图。 如图 4所示， 无版转印装置 3包括无版转印膜 1及一转印机 30， 转印机 30 包括一滚轮 33、一固定底座 31及一传送部 35。其中固定底座 31用以固定电 子装置本体 20， 且滚轮 33配合电子装置本体 20的外形， 滚轮 33的位置可 作升降的变化， 在一实施例中， 可使用多个滚轮 33， 分别具有相同或不同半 径大小， 以均匀地将无版转印膜 1与电子装置本体 20压合； 传送部 35用以 将无版转印膜 1平整地展开在电子装置本体 20上， 传送部 35可为一转轴或 滚筒，在无版转印膜 1覆盖在电子装置本体 20之前， 无版转印膜 1可被一加 热部 (图未示)加热到一特定温度， 例如约 75〜100度， 使无版转印膜 1具有黏 性， 其中该加热部可为一光能是热源， 如激光， 当无版转印膜 1位于电子装 置本体 20欲转印的表面上， 经滚轮 33对无版转印膜 1施加一压力后， 让无 版转印膜 1均匀且无气泡地转印在电子装置本体 20上，在一实施例中， 印 机 30还包括一抽气部 （图未示） ， 可将转印机 30内的环境抽成真空， 确保 无版转印膜 1 与电子装置本体 20之间没有气泡存在； 在一实施例中， 滚轮 33具有一加热源 (图未示)， 温度约 75至 100度， 当滚轮 33与无版转印膜 1 接触时， 同时对无版转印膜 1 加热， 确保无版转印膜 1 与电子装置本体 20 互相紧密附着； 在另一实施例中， 转印机 30还包括一高温吹气部 (图未示)， 当滚轮 33压印无版转印膜后，将一硅胶层 331覆盖在无版转印膜 1上，利用 高温吹气部对硅胶层 331吹出的气体压力， 对无版转印膜 1间 施加压力， 若电子装置本体 20表面不平整或具有垂直角时，硅胶层 331有助于对无版转 印膜 1的施力更均匀，使无版转印膜 1转印在电子装置本体 20的密合效果更 佳， 以提高转印质量。 "
请参考图 5， 其为本实用新型的制造无版转印膜的方法的一实施例的流 程图。 如图 5所示， 首先， 准备塑料膜或纸张作为一基材 10， 将离型剂以涂 布机涂布在基材 10上以形成一离型层 121(S501); 待离型层 121干燥后， 涂 布一透明抗溶剂油墨于离型层 121上以形成一透明保护层 123(S503)，利用激 光打印机或喷墨打印机印刷输出一全彩图案于透明保护层 123上以形成一图 案层 125(S505)，在一实施例中，图案层 125可经由打印机重复印刷数次形成； 待图案层 125 干燥后， 将白色油墨印刷于图案层 125 上以形成白色油墨层 127(S507), 乍为图案层 125的底^ 待白色油墨层 127干燥后， 将热转印胶 涂布在白色油墨层 127上以形成一黏着层 129(S509)。
请参考图 6， 其为本实用新型的制造具有全彩图案的电子装置的方法的 一实施例的流程图。 如图 6所示， 首先准备上述无版转印膜 1， 通过转印机 30的传送部 35将无版转印膜 1平整地覆盖在电子装置本体 20 ±(S601); 利 用热源如一激光光源提供热源对无版转印膜 1 加热 (S603)， 且加热温度可为 75至 100度； 利用滚轮 33压印无版转印膜 1(S605)， 在一实施例中， 滚轮 33 具有一加热源， 于压印无版转印膜 1时同时对无版转印膜 1加热， 在一实施 例中， 转印机 30可包括多滚轮 33 ; 接着， 通过约为 75至 100度的高温气体 对无版转印膜 1进行吹气加压 (S607), 在一实施例中， 可在无版转印膜 1上 覆盖上一硅胶层 331， 则高温气体对硅胶层 331 吹气加压， 间接式加均匀的 压力给无版转印膜 1。
综合上述所列举实施方式的作法， 可知本实用新型利用低温加热及吹气 加压将无版转印膜转印在电子装置本体上， 达到在不平整的表面上或垂直角 转印图案目的。 如此， 本实用新型的无版转印装置可以解决传统转印物品长 期使用下， 因为转印膜与电子装置本体之间具有气泡而造成转印膜易脱落的 问题。
然而上述所揭露的附图及说明， 仅为本实用新型的实施例而已， 其并非 用以限定本实用新型， 任何熟习此技术的人员， 可依据上述的说明做各种的 更动与润饰， 如有其它符合本实用新型的精神与未实质改变本实用新型的技 术手段， 皆属本实用新型所涵盖保护的范围。

Claims

权利要求
1.一种无版转印膜， 其特征在于， 包括：
一基材；及
一转印层， 位于该基材上， 该转印层包括：
一离型层， 位于该基材上， 提供该基材与该转印层选择式分离； 一图案层， 位于该离型层上， 具有全彩的图像、 文字、 符号或数字； 一白色油墨层， 位于该图案层上;及
一黏着层， 位于该白色油墨层上， 使该无版转印膜具有附着力。
2.如权利要求 1所述的无版转印膜， 其特征在于， 该基材为塑料膜或纸 张。
3.如权利要求 1所述的无版转印膜， 其特征在于， 该图案层为喷墨打印 机或激光打印机所输出形成。
4.如权利要求 1所述的无版转印膜， 其特征在于， 该离型层为热熔化型、 热硬化型或半硬化型离型剂。
5.如权利要求 1所述的无版转印膜， 其特征在于， 该黏着层为热转印胶。
6.如权利要求 1所述的无版转印膜， 其特征在于， 该无版转印膜还包括 一透明保护层， 该透明保护层位于该离型层与该图案层之间。
7.如权利要求 6所述的无版转印膜， 其特征在于， 该离型层为透明抗溶 剂油墨、 透明压克力胶或透明热熔胶。
PCT/CN2010/002163 2010-11-12 2010-12-24 无版转印膜 WO2012061962A1 (zh)

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