WO2012053757A3 - 봉지재 성형장치 및 방법 - Google Patents

봉지재 성형장치 및 방법 Download PDF

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Publication number
WO2012053757A3
WO2012053757A3 PCT/KR2011/007428 KR2011007428W WO2012053757A3 WO 2012053757 A3 WO2012053757 A3 WO 2012053757A3 KR 2011007428 W KR2011007428 W KR 2011007428W WO 2012053757 A3 WO2012053757 A3 WO 2012053757A3
Authority
WO
WIPO (PCT)
Prior art keywords
sealing material
forming
substrate
cavity block
insert cavity
Prior art date
Application number
PCT/KR2011/007428
Other languages
English (en)
French (fr)
Other versions
WO2012053757A2 (ko
Inventor
석대수
박은숙
최영규
황동주
Original Assignee
신한다이아몬드공업(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신한다이아몬드공업(주) filed Critical 신한다이아몬드공업(주)
Priority to JP2012543034A priority Critical patent/JP5474212B2/ja
Publication of WO2012053757A2 publication Critical patent/WO2012053757A2/ko
Publication of WO2012053757A3 publication Critical patent/WO2012053757A3/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

본 명세서는 오버몰딩 방식이면서도, 신뢰성 있는 두께 치수로 봉지재를 성형할 수 있으며, 관통 구멍이 존재하는 리드프레임과 같은 기판 상에 봉지재를 성형하는데 특히 적합한 봉지재 성형장치를 개시한다. 개시된 봉지재 성형장치는, 기판이 장착되는 고정금형과; 상기 고정금형과 대향되게 배치되는 가동금형과; 상기 고정금형과 상기 가동금형 사이에 위치하는 인서트 캐비티 블록과; 상기 인서트 캐비티 블록과 상기 가동금형 사이에 제공되는 수지 적재 공간을 포함하며,상기 인서트 캐비티 블록에는 상기 기판과 대면하는 성형 캐비티들과, 상기 수지 적재 공간으로부터 상기 성형 캐비티로 이어진 수지 이동 경로가 형성된다.
PCT/KR2011/007428 2010-10-19 2011-10-07 봉지재 성형장치 및 방법 WO2012053757A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012543034A JP5474212B2 (ja) 2010-10-19 2011-10-07 封止材成形装置及び方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100101948A KR101087031B1 (ko) 2010-10-19 2010-10-19 봉지재 성형장치 및 방법
KR10-2010-0101948 2010-10-19

Publications (2)

Publication Number Publication Date
WO2012053757A2 WO2012053757A2 (ko) 2012-04-26
WO2012053757A3 true WO2012053757A3 (ko) 2012-06-14

Family

ID=45398222

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/007428 WO2012053757A2 (ko) 2010-10-19 2011-10-07 봉지재 성형장치 및 방법

Country Status (4)

Country Link
JP (1) JP5474212B2 (ko)
KR (1) KR101087031B1 (ko)
TW (1) TWI466340B (ko)
WO (1) WO2012053757A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009045911A1 (de) 2009-10-22 2011-04-28 Robert Bosch Gmbh Koppelvorrichtung, Anordnung mit einer Koppelvorrichtung, Verfahren zur Herstellung einer Anordnung mit einer Koppelvorrichtung
KR101441966B1 (ko) * 2013-11-19 2014-09-30 인탑스 주식회사 휴대폰케이스의 방수처리장치
JP6525805B2 (ja) * 2015-08-10 2019-06-05 アピックヤマダ株式会社 モールド金型及びモールド装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940002440B1 (ko) * 1990-01-23 1994-03-24 미쓰비시덴키 가부시키가이샤 반도체장치의 수지봉지장치
JP2000021908A (ja) * 1998-07-03 2000-01-21 Toshiba Chem Corp 樹脂封止型電子部品の製造方法
JP2003133352A (ja) * 2001-10-30 2003-05-09 Sainekkusu:Kk 半導体樹脂封止装置
JP2005191064A (ja) * 2003-12-24 2005-07-14 Nec Electronics Corp 樹脂封止方法および樹脂封止装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940002440B1 (ko) * 1990-01-23 1994-03-24 미쓰비시덴키 가부시키가이샤 반도체장치의 수지봉지장치
JP2000021908A (ja) * 1998-07-03 2000-01-21 Toshiba Chem Corp 樹脂封止型電子部品の製造方法
JP2003133352A (ja) * 2001-10-30 2003-05-09 Sainekkusu:Kk 半導体樹脂封止装置
JP2005191064A (ja) * 2003-12-24 2005-07-14 Nec Electronics Corp 樹脂封止方法および樹脂封止装置

Also Published As

Publication number Publication date
JP2013512807A (ja) 2013-04-18
KR101087031B1 (ko) 2011-11-28
WO2012053757A2 (ko) 2012-04-26
JP5474212B2 (ja) 2014-04-16
TW201220553A (en) 2012-05-16
TWI466340B (zh) 2014-12-21

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