WO2012050096A1 - Parallelism adjustment method and parallelism adjustment apparatus for mounting apparatus - Google Patents

Parallelism adjustment method and parallelism adjustment apparatus for mounting apparatus Download PDF

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Publication number
WO2012050096A1
WO2012050096A1 PCT/JP2011/073359 JP2011073359W WO2012050096A1 WO 2012050096 A1 WO2012050096 A1 WO 2012050096A1 JP 2011073359 W JP2011073359 W JP 2011073359W WO 2012050096 A1 WO2012050096 A1 WO 2012050096A1
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Prior art keywords
bonding tool
parallelism
substrate stage
parallelism adjustment
inclination
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PCT/JP2011/073359
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French (fr)
Japanese (ja)
Inventor
井野信行
寺田勝美
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東レエンジニアリング株式会社
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Priority to KR1020137006397A priority Critical patent/KR20130129359A/en
Publication of WO2012050096A1 publication Critical patent/WO2012050096A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/75802—Rotational mechanism
    • H01L2224/75803—Pivoting mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Definitions

  • the present invention relates to a parallelism adjustment method and a parallelism adjustment device between a bonding tool that holds a chip component and a substrate stage that holds the circuit board when the chip component is mounted on a circuit board.
  • a mounting method is known in which a substrate stage is provided on an arcuate rotation bearing, the substrate is sucked and held, and a chip component held by a bonding tool is mounted on the substrate from above the substrate stage (for example, Patent Document 1). FIG. 5).
  • a process of pressing the bonding tool against the substrate stage with a predetermined pressure and copying the rotational bearing is performed in advance. After the copying, the substrate stage keeps its inclination held by air suction or spring force. By following the rotation bearing, the parallelism between the bonding tool and the substrate stage is ensured.
  • the parallelism is adjusted by adjusting the rotating mechanism while measuring it with an instrument that measures displacement, such as a pick gauge. There is a problem that it takes.
  • an object of the present invention is to provide a parallelism adjustment method for a mounting apparatus capable of adjusting the parallelism of a substrate stage and a bonding tool in a short time with high accuracy even when mounting a chip component with a low pressure force.
  • a parallelism adjusting device is provided.
  • the invention according to claim 2 is the invention according to claim 1,
  • the parallelism adjusting unit is a method for adjusting the parallelism of a mounting apparatus, comprising a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  • the invention according to claim 3 is the invention according to claim 2, A parallelism adjustment method for a mounting apparatus, wherein the parallelism adjustment unit is provided on the substrate stage side.
  • a parallelism adjusting device for a mounting device that mounts a chip component sucked and held on a bonding tool using a bonding tool positioned above the substrate stage on a substrate sucked and held on a substrate stage, A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit, A height detection means for detecting the height position of the bonding tool; While the bonding tool is pressed against the substrate stage at a predetermined pressure, the inclination of the parallelism adjustment unit is changed by the drive means, and the parallelism adjustment that is the lowest point position of the bonding tool is determined from the information on the height detection means of the bonding tool
  • a parallelism adjusting device for a mounting apparatus comprising: a control means for holding the inclined position of the part.
  • the parallelism adjusting unit is a parallelism adjusting device for a mounting device, which includes a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  • the invention according to claim 6 is the invention according to claim 5,
  • the parallelism adjusting device is a parallelism adjusting device for a mounting apparatus provided on the substrate stage side.
  • the substrate stage is pressed with the bonding tool.
  • the mounting apparatus of the present invention includes a parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive unit that drives the parallelism adjusting unit. For this reason, since the driving means changes the inclination of the parallelism adjusting unit, the pressing force of the bonding tool may be low. It is not necessary to adjust the parallelism of the bonding tool surface and the substrate stage surface by following the substrate stage with the pressure of the bonding tool. Therefore, the parallelism between the substrate stage and the bonding tool can be adjusted with high accuracy in a short time even when mounting chip components with low pressure.
  • the parallelism adjusting unit is provided on the substrate stage side, the holding mechanism for the spherical bearing is simplified, and the apparatus can be configured with good maintainability.
  • FIG. 2 is a schematic plan view seen from the AA direction of FIG. It is a schematic side view explaining the relationship between a bonding tool and a spherical bearing.
  • FIG. 1 is a schematic side view of a mounting apparatus 1 used in the present invention.
  • the left-right direction toward the mounting apparatus 1 is defined as the X axis
  • the front direction is defined as the Y axis
  • the axis orthogonal to the XY plane constituted by the X axis and the Y axis is defined as the Z axis.
  • the mounting apparatus 1 is roughly divided into a base 2, a substrate stage 3 having a spherical bearing provided on the base 2, a tool lifting / lowering means 4 for lifting and lowering a bonding tool provided on the base 2, and a mounting apparatus. 1 comprises a control unit 5 for controlling the whole.
  • the spherical bearing corresponds to the parallelism adjusting unit of the present invention
  • the control unit 5 corresponds to the control means of the present invention.
  • the substrate stage surface is the XY plane
  • the inclination directions are the X ⁇ and Y ⁇ directions
  • the change in the inclination of the parallelism adjusting unit means the movement in the X ⁇ and Y ⁇ directions.
  • the substrate stage 3 is composed of a frame body 11 fixed to the base 2 and driving means 18 arranged at a position surrounding the frame body 11.
  • a concave hemispherical member 13 is supported by the support portion 12 inside the frame body 11.
  • the upper surface side (upper side in the Z direction) of the frame 11 is open.
  • a convex hemispherical member 14 is provided along the concave surface 13 a of the concave hemispherical member 13.
  • the concave hemispherical member 13 and the convex hemispherical member 14 are in contact with each other via an air bearing 15.
  • a compressed air suction port 16 is provided in the lower part of the concave hemispherical member 13, and a compressed air pump and a suction pump (not shown) are connected thereto.
  • a substrate holding stage 17 for attracting and holding the substrate 6 is provided on the flat surface 14 b of the convex hemispherical member 14.
  • the claw 20 is in contact with the flat surface 14b.
  • the claw 20 is located at the tip of the L-shaped arm 19.
  • the arm 19 is driven in the vertical direction by the driving means 18.
  • the claw 20 can push the convex hemispherical member 14 downward in the Z direction based on the movement amount of the arm 19 of the driving means 18 via the arm 19.
  • the driving unit 18 may be a driving unit using an air cylinder, a driving unit using a ball screw and a servo motor, a driving unit using a piezo element, or the like.
  • the driving unit 18 controls the position of the arm 19 based on a signal from the control unit 5.
  • FIG. 2 shows four sets of pressing composed of a convex hemispherical member 14, a driving means 18, an arm 19, and a claw 20 (shown by a dotted line in FIG. 2) when referred to in the AA direction of FIG. 1.
  • the positional relationship of means is shown.
  • the claw 20 can press the four locations on the outer periphery of the convex hemispherical member 14. Thereby, the flat surface 14b of the convex hemispherical member 14 can be made into arbitrary inclination.
  • the air bearing 15 is configured such that an air bearing 15 using the gas as a lubricant is formed when gas or air is supplied from the compressed air pump through the compressed air suction port 16.
  • the convex hemispherical member 14 is rotatable in any direction with respect to the concave hemispherical member 13.
  • the rotation is used when moving along the convex surface 14a or the concave surface 13a.
  • the axis center at the time of movement is the center of the flat surface 14b of the convex hemispherical member 14.
  • the tool lifting / lowering means 4 includes a Z-axis feed mechanism 30 and an air cylinder 35 attached to the Z-axis feed mechanism 30 via a bracket 34.
  • the Z-axis feed mechanism 30 is a mechanism that moves the bracket 34 up and down in the Z direction by driving the ball screw 33 by the lifting servo motor 32.
  • the bracket 34 moves up and down along the slider 31 provided in the Z-axis feed mechanism 30.
  • An air cylinder 35 is attached to the bracket 34, and the piston 36 can move up and down in the Z direction inside the air cylinder 35.
  • a position detector 37 for detecting the position of the upper surface 36 a of the piston 36 is provided on the upper portion of the air cylinder 35.
  • the position detector 37 corresponds to the height detection means of the present invention.
  • a supply hole 38a for supplying balancing air is provided in the upper part of the air cylinder 35, and a supply hole 38b for supplying holding air is provided in the lower side.
  • Balance air and holding air for controlling the position of the piston 36 are supplied from a pressure air source (not shown), and a predetermined pressure is applied to the piston 36.
  • the chip component 7 is held by suction on the piston rod 36 b of the piston 36.
  • the portion where the chip component 7 is sucked and held at the tip of the piston rod 36b is hereinafter referred to as a bonding tool 39.
  • the suction surface of the chip component 7 of the bonding tool 39 is denoted
  • the tool lifting / lowering means 4 operates the Z-axis feed mechanism 30 until the chip component 7 sucked and held by the bonding tool 39 contacts the substrate 6 sucked and held by the substrate holding stage 17 based on a signal from the control unit 5. . Thereafter, the chip component 7 sucked and held by the bonding tool 39 with a predetermined pressure applied to the piston 36 is pressed against the substrate 6 sucked and held by the substrate holding stage 17.
  • the parallelism adjustment between the chip suction surface 39 a of the bonding tool 39 and the flat surface 14 b of the convex hemispherical member 14 is performed in advance.
  • General parallelism adjustment is performed in the following procedure. First, air is supplied to the air bearing 15 from the compressed air suction port 16 to float the convex hemispherical member 14. Next, the suction surface 39a of the bonding tool 39 presses the flat surface 14b of the convex hemispherical member 14 by maintaining the piston 36 of the air cylinder 35 at a predetermined pressure. Then, the convex hemispherical member 14 moves in the X ⁇ and Y ⁇ directions according to the pressed force.
  • Such a method of adjusting the parallelism is effective when the pressing force of the suction surface 39a of the bonding tool 39 is a pressing force capable of moving the convex hemispherical member 14.
  • the pressing force of the suction surface 39a does not become a sufficient pressing force, so that the convex hemispherical member 14 cannot be moved (followed). Therefore, in the present invention, the parallelism of the flat surface 14 b and the suction surface 39 a of the bonding tool 39 is adjusted using the claw 20 that contacts the flat surface 14 b of the convex hemispherical member 14.
  • the parallelism adjusting method will be described with reference to FIG.
  • FIG. 3 is a schematic side view for explaining the positional relationship between the convex hemispherical member 14 and the bonding tool 39.
  • FIG. 3A shows a state in which a part of the suction surface 39 a of the bonding tool 39 is in contact with the flat surface 14 b of the convex hemispherical member 14. In this state, as shown in FIG. 3A, an angle ⁇ is generated between the suction surface 39a and the flat surface 14b, and the parallelism is not maintained. Further, the convex hemispherical member 14 does not move with the applied pressure applied to the bonding tool 39. At this time, the position of the bonding tool 39 is detected by the position detector 37 and stored in the height position h0 and the control unit 5.
  • the driving means 18 is driven and the claw 20 is pressed downward in the Z direction.
  • the control unit 5 can press and release the flat end portion 14b with respect to the four driving means 18 so that the flat end portion 14b has a predetermined angle (the pressing force is free, and the control unit 5 can move upward in the Z direction). Control).
  • a predetermined pressure is applied to the piston 36 to the bonding tool 39, the position in the Z direction (Z-axis height position) of the bonding tool 39 changes following the change in the angle of the flat surface 14b.
  • FIG. 3B shows a state in which the attitude of the convex hemispherical member 14 is varied around the Y axis using the claw 20 and the suction surface 39a of the bonding tool 39 is in close contact with the flat surface 14b.
  • the position of the piston 36 is the lowest point in the Z direction (the lowest position).
  • the position detected by the position detector 37 is stored in the control unit 5 as h1.
  • FIG. 3C shows a state in which the attitude of the convex hemispherical member 14 is changed around the Y axis by using the claws 20 from the state of FIG. 3B.
  • the height position of the piston 36 in the Z direction is an elevated position as compared with FIG.
  • the position detected by the position detector 37 is stored in the control unit 5 as h2.
  • the position serving as the lowest point in the Z-axis direction is obtained from the height data of the bonding tool 39 stored in the control unit 5 according to the change in the angle of the flat portion 14b.
  • h1 is the lowest point in the Z-axis direction.
  • the position that becomes the lowest point in the Z-axis direction of the bonding tool 39 can be obtained about the X-axis.
  • the position of the upper surface 36a of the piston 36 connected to the bonding tool 39 is measured by the position detector 37 while changing the posture of the convex hemispherical member 14 with the claw 20, so that it is flat with the suction surface 39a.
  • the spherical bearing composed of the concave hemispherical member 13 and the convex hemispherical member 15 is used as the parallelism adjusting unit.
  • the goniostage that can tilt in the X ⁇ and Y ⁇ directions may be configured as a rotary bearing that can be tilted by forming a cross.
  • the parallelism adjustment unit may be configured by a mechanism that varies the inclination of the substrate stage surface by supporting the periphery of the substrate stage with a plurality of support members and varying the stroke of each support member.
  • the parallelism adjustment function may be configured in at least one of them.

Abstract

[Objective] To provide a parallelism adjustment method and a parallelism adjustment apparatus for a mounting apparatus, wherein parallelism between a substrate stage and a bonding tool can be adjusted with high-precision, and in a short period of time, even when mounting a chip component with low pressurizing force. [Solution] Provided is a parallelism adjustment method and a parallelism adjustment apparatus for a mounting apparatus, which is provided with: a parallelism adjustment unit for changing the inclination of the face of a bonding tool or a substrate stage; a driving means for driving the parallelism adjustment unit; a height detecting means for detecting the height position of the bonding tool. The parallelism adjustment method comprises: a process for pressing down the bonding tool onto the substrate stage with a prescribed pressure; a process wherein the driving means changes the inclination of the parallelism adjustment unit; a process for obtaining the position of the lowermost point of the bonding tool, from information about the bonding tool coming from the height detecting means while the inclination of the parallelism adjustment unit is being changed; and a process for maintaining an inclination position of the parallelism adjustment unit acquired when the bonding tool was at the lowermost point.

Description

実装装置の平行度調整方法および平行度調整装置Parallelism adjusting method and parallelism adjusting device for mounting apparatus
　チップ部品を回路基板に実装する際の、チップ部品を保持するボンディングツールと、回路基板を保持する基板ステージとの平行度調整方法および平行度調整装置に関する。 The present invention relates to a parallelism adjustment method and a parallelism adjustment device between a bonding tool that holds a chip component and a substrate stage that holds the circuit board when the chip component is mounted on a circuit board.
　円弧状の回動軸受けに基板ステージを設け、基板を吸着保持して、基板ステージの上部からボンディングツールに保持されたチップ部品を基板に実装する実装方法が知られている（例えば特許文献１の図５）。この実装方法においては、予め、ボンディングツールを基板ステージに所定圧で押し付け、回動軸受けを倣わせる工程が行われている。倣わせた後、基板ステージはその傾斜をエアー吸引やバネ力などにより保持した状態を保つ。回動軸受けを倣わせることにより、ボンディングツールと基板ステージの平行度が確保される。 A mounting method is known in which a substrate stage is provided on an arcuate rotation bearing, the substrate is sucked and held, and a chip component held by a bonding tool is mounted on the substrate from above the substrate stage (for example, Patent Document 1). FIG. 5). In this mounting method, a process of pressing the bonding tool against the substrate stage with a predetermined pressure and copying the rotational bearing is performed in advance. After the copying, the substrate stage keeps its inclination held by air suction or spring force. By following the rotation bearing, the parallelism between the bonding tool and the substrate stage is ensured.
特許第４０９８９４９号公報Japanese Patent No. 4098949
　一方、チップ部品を基板に実装する際に、チップ部品の加圧力を低圧にして（チップ部品に設けられたバンプへの荷重を微小にして）実装する実装方法が行われている。このような実装方法においてもチップ部品と基板の平行度は要求されている。しかし、加圧力が低く抑えられているため、円弧状の基板ステージを倣わせる際に、ボンディングツールを押し付けても、加圧力が低いため基板ステージが倣ってくれない問題がある。 On the other hand, when a chip component is mounted on a substrate, a mounting method is carried out in which the pressure applied to the chip component is low (the load on the bumps provided on the chip component is made small). Even in such a mounting method, the parallelism between the chip component and the substrate is required. However, since the pressing force is kept low, there is a problem that even when the bonding tool is pressed when copying the arc-shaped substrate stage, the pressing force is low and the substrate stage does not copy.
　そのため、低加圧のチップ部品の実装には倣い機構による平行度調整が難しいという問題がある。 Therefore, there is a problem that it is difficult to adjust the parallelism by a copying mechanism when mounting a low-pressure chip component.
　また、円弧状の倣い機構を用いない回動機構であっても、平行度の調整には、ピックゲージなど変位を測定する器具などで測定しながら回動機構を調整するので、非常に時間がかかると言った問題がある。 Even with a rotating mechanism that does not use an arc-shaped copying mechanism, the parallelism is adjusted by adjusting the rotating mechanism while measuring it with an instrument that measures displacement, such as a pick gauge. There is a problem that it takes.
　上記問題点に鑑み、本発明の課題は、加圧力の低いチップ部品の実装であっても基板ステージとボンディングツールの平行度を高精度に短時間で調整できる、実装装置の平行度調整方法および平行度調整装置を提供することとする。 In view of the above problems, an object of the present invention is to provide a parallelism adjustment method for a mounting apparatus capable of adjusting the parallelism of a substrate stage and a bonding tool in a short time with high accuracy even when mounting a chip component with a low pressure force. A parallelism adjusting device is provided.
　上記課題を解決するために、請求項１に記載の発明は、
基板ステージに吸着保持された基板に、基板ステージの上方に位置したボンディングツールを用いてボンディングツールに吸着保持されたチップ部品を実装する実装装置のボンディングツールと基板ステージの平行度を調整する平行度調整方法であって、
ボンディングツール面もしくは基板ステージ面の傾斜を変化させる平行度調整部と、平行度調整部を駆動する駆動手段とを備え、
ボンディングツールの高さ位置を検出する高さ検出手段を備え、
ボンディングツールを所定圧で、基板ステージに押し付ける工程と、
駆動手段が平行度調整部の傾斜を変化させる工程と、
平行度調整部の傾斜を変化させている間の、ボンディングツールの高さ検知手段の情報から、ボンディングツールの最下点の位置を求める工程と、
ボンディングツールが最下点になった際の平行度調整部の傾斜位置を保持する工程とからなる実装装置の平行度調整方法である。 In order to solve the above-mentioned problem, the invention described in claim 1
Parallelism that adjusts the parallelism between the bonding tool of the mounting device and the substrate stage that mounts the chip component sucked and held on the bonding tool using the bonding tool located above the substrate stage on the board held and sucked on the substrate stage An adjustment method,
A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit,
Provided with height detection means for detecting the height position of the bonding tool,
A process of pressing the bonding tool against the substrate stage with a predetermined pressure;
A step in which the driving means changes the inclination of the parallelism adjusting unit;
While changing the inclination of the parallelism adjustment unit, from the information of the height detection means of the bonding tool, to determine the position of the lowest point of the bonding tool;
This is a method for adjusting the parallelism of the mounting apparatus, which includes a step of maintaining the tilt position of the parallelism adjusting unit when the bonding tool reaches the lowest point.
　請求項２に記載の発明は、請求項１に記載の発明において、
平行度調整部が、凸状半球面部材と凹状半球面部材とを組み合わせた球面軸受けからなる、実装装置の平行度調整方法である。 The invention according to claim 2 is the invention according to claim 1,
The parallelism adjusting unit is a method for adjusting the parallelism of a mounting apparatus, comprising a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
　請求項３に記載の発明は、請求項２に記載の発明において、
平行度調整部が、基板ステージ側に備えられている、実装装置の平行度調整方法である。 The invention according to claim 3 is the invention according to claim 2,
A parallelism adjustment method for a mounting apparatus, wherein the parallelism adjustment unit is provided on the substrate stage side.
　請求項４に記載の発明は、
基板ステージに吸着保持された基板に、基板ステージの上方に位置したボンディングツールを用いてボンディングツールに吸着保持されたチップ部品を実装する実装装置の平行度調整装置であって、
ボンディングツール面もしくは基板ステージ面の傾斜を変化させる平行度調整部と、平行度調整部を駆動する駆動手段とを備え、
ボンディングツールの高さ位置を検出する高さ検出手段と、
ボンディングツールを所定圧で、基板ステージに押し付けた状態で平行度調整部の傾斜を駆動手段で変化させ、ボンディングツールの高さ検知手段の情報から、ボンディングツールの最下点位置となる平行度調整部の傾斜位置を保持する制御手段とを備えることを特徴とする実装装置の平行度調整装置である。 The invention according to claim 4
A parallelism adjusting device for a mounting device that mounts a chip component sucked and held on a bonding tool using a bonding tool positioned above the substrate stage on a substrate sucked and held on a substrate stage,
A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit,
A height detection means for detecting the height position of the bonding tool;
While the bonding tool is pressed against the substrate stage at a predetermined pressure, the inclination of the parallelism adjustment unit is changed by the drive means, and the parallelism adjustment that is the lowest point position of the bonding tool is determined from the information on the height detection means of the bonding tool A parallelism adjusting device for a mounting apparatus, comprising: a control means for holding the inclined position of the part.
　請求項５に記載の発明は、請求項４に記載の発明において、
平行度調整部が、凸状半球面部材と凹状半球面部材とを組み合わせた球面軸受けからなる、実装装置の平行度調整装置である。 The invention according to claim 5 is the invention according to claim 4,
The parallelism adjusting unit is a parallelism adjusting device for a mounting device, which includes a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
　請求項６に記載の発明は、請求項５に記載の発明において、
平行度調整部が、基板ステージ側に備えられている、実装装置の平行度調整装置である。 The invention according to claim 6 is the invention according to claim 5,
The parallelism adjusting device is a parallelism adjusting device for a mounting apparatus provided on the substrate stage side.
　請求項１および４に記載の発明によれば、基板ステージをボンディングツールで押し付けている。本発明の実装装置は、ボンディングツール面もしくは基板ステージ面の傾斜を変化させる平行度調整部と、平行度調整部を駆動する駆動手段とを備えている。そのため、駆動手段が平行度調整部の傾斜を変化させるので、ボンディングツールの加圧力が低加圧でもよい。ボンディングツールの加圧力で、基板ステージを倣わせて、ボンディングツール面と基板ステージ面の平行度を調整しなくてよい。したがって、加圧力の低いチップ部品の実装であっても基板ステージとボンディングツールの平行度を短時間で高精度に調整できる。 According to the first and fourth aspects of the invention, the substrate stage is pressed with the bonding tool. The mounting apparatus of the present invention includes a parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive unit that drives the parallelism adjusting unit. For this reason, since the driving means changes the inclination of the parallelism adjusting unit, the pressing force of the bonding tool may be low. It is not necessary to adjust the parallelism of the bonding tool surface and the substrate stage surface by following the substrate stage with the pressure of the bonding tool. Therefore, the parallelism between the substrate stage and the bonding tool can be adjusted with high accuracy in a short time even when mounting chip components with low pressure.
　請求項２および５に記載の発明によれば、平行度調整部が、凸状半球面部材と凹状半球面部材とを組み合わせた球面軸受けから構成されているので、高精度にボンディングツール面と基板ステージ面の傾斜を変化させることができる。 According to the second and fifth aspects of the present invention, since the parallelism adjusting portion is composed of a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined, the bonding tool surface and the substrate can be accurately obtained. The inclination of the stage surface can be changed.
　請求項３および６に記載の発明によれば、平行度調整部が、基板ステージ側に備えられているので、球面軸受けの保持機構が簡単となり、メンテナンス性の良い装置構成とすることができる。 According to the third and sixth aspects of the present invention, since the parallelism adjusting unit is provided on the substrate stage side, the holding mechanism for the spherical bearing is simplified, and the apparatus can be configured with good maintainability.
本発明の実施の形態で用いる実装装置の概略側面図である。It is a schematic side view of the mounting apparatus used in the embodiment of the present invention. 図１のＡ－Ａ方向から見た概略平面図である。FIG. 2 is a schematic plan view seen from the AA direction of FIG. ボンディングツールと球面軸受けの関係を説明する概略側面図である。It is a schematic side view explaining the relationship between a bonding tool and a spherical bearing.
　以下、図面を参照して本発明の実施の形態を説明する。図１は、本発明で用いる実装装置１の概略側面図である。図１において、実装装置１に向かって左右方向をＸ軸、手前方向をＹ軸、Ｘ軸とＹ軸で構成されるＸＹ平面に直交する軸をＺ軸とする。実装装置１は、大きく分けて、基台２と、基台２に設けられた球面軸受けを有する基板ステージ３と、基台２に設けられたボンディングツールを昇降させるツール昇降手段４と、実装装置１全体を制御する制御部５とから構成されている。球面軸受けは、本発明の平行度調整部に対応し、制御部５は、本発明の制御手段に対応する。なお、本発明の場合、基板ステージ面をＸＹ平面とし、傾斜方向をＸθ、Ｙθ方向とし、平行度調整部の傾斜の変化はＸθ、Ｙθ方向への移動を意味する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a mounting apparatus 1 used in the present invention. In FIG. 1, the left-right direction toward the mounting apparatus 1 is defined as the X axis, the front direction is defined as the Y axis, and the axis orthogonal to the XY plane constituted by the X axis and the Y axis is defined as the Z axis. The mounting apparatus 1 is roughly divided into a base 2, a substrate stage 3 having a spherical bearing provided on the base 2, a tool lifting / lowering means 4 for lifting and lowering a bonding tool provided on the base 2, and a mounting apparatus. 1 comprises a control unit 5 for controlling the whole. The spherical bearing corresponds to the parallelism adjusting unit of the present invention, and the control unit 5 corresponds to the control means of the present invention. In the case of the present invention, the substrate stage surface is the XY plane, the inclination directions are the Xθ and Yθ directions, and the change in the inclination of the parallelism adjusting unit means the movement in the Xθ and Yθ directions.
　基板ステージ３は、基台２に固定された枠体１１と、枠体１１の周りを取り囲む位置に配置された駆動手段１８とから構成されている。枠体１１の内部には、凹状半球面部材１３が支持部１２で支持されている。枠体１１の上面側（Ｚ方向上側）は開放されている。凹状半球面部材１３の凹面１３ａに沿うように凸状半球面部材１４が設けられている。凹状半球面部材１３と、凸状半球面部材１４は、エアーベアリング１５を介して当接されている。凹状半球面部材１３の下部には圧空吸引口１６が設けられ、図示していない圧空ポンプおよび吸引ポンプが接続されている。 The substrate stage 3 is composed of a frame body 11 fixed to the base 2 and driving means 18 arranged at a position surrounding the frame body 11. A concave hemispherical member 13 is supported by the support portion 12 inside the frame body 11. The upper surface side (upper side in the Z direction) of the frame 11 is open. A convex hemispherical member 14 is provided along the concave surface 13 a of the concave hemispherical member 13. The concave hemispherical member 13 and the convex hemispherical member 14 are in contact with each other via an air bearing 15. A compressed air suction port 16 is provided in the lower part of the concave hemispherical member 13, and a compressed air pump and a suction pump (not shown) are connected thereto.
　凸状半球面部材１４の平坦面１４ｂには基板６を吸着保持する基板保持ステージ１７が設けられている。平坦面１４ｂには、爪２０が当接されている。爪２０は、Ｌ字形のアーム１９の先端に位置している。アーム１９は駆動手段１８により上下方向に駆動されている。爪２０は、アーム１９を介して、駆動手段１８のアーム１９の移動量に基づき凸状半球面部材１４をＺ方向下側に押し込むことができる。特に限定しないが、駆動手段１８は、エアーシリンダを用いた駆動手段や、ボールねじとサーボモータを用いた駆動手段や、ピエゾ素子を用いた駆動手段などを用いることができる。駆動手段１８は、制御部５からの信号に基づきアーム１９の位置を制御している。 A substrate holding stage 17 for attracting and holding the substrate 6 is provided on the flat surface 14 b of the convex hemispherical member 14. The claw 20 is in contact with the flat surface 14b. The claw 20 is located at the tip of the L-shaped arm 19. The arm 19 is driven in the vertical direction by the driving means 18. The claw 20 can push the convex hemispherical member 14 downward in the Z direction based on the movement amount of the arm 19 of the driving means 18 via the arm 19. Although not particularly limited, the driving unit 18 may be a driving unit using an air cylinder, a driving unit using a ball screw and a servo motor, a driving unit using a piezo element, or the like. The driving unit 18 controls the position of the arm 19 based on a signal from the control unit 5.
　駆動手段１８とアーム１９と爪２０とから構成されている押し付け手段は、少なくとも３組設けられる。本実施の形態では４組の場合について図示する。図２に図１のＡ－Ａ方向で参照した場合の凸状半球面部材１４と、駆動手段１８とアーム１９と爪２０（図２では点線で示す）とから構成されている４組の押し付け手段の位置関係を示す。図２に示すように、凸状半球面部材１４の外周の４箇所を爪２０が押し付けることができる。これにより、凸状半球面部材１４の平坦面１４ｂを任意の傾きにすることができる。 At least three sets of pressing means composed of the driving means 18, the arm 19, and the claw 20 are provided. In this embodiment, four sets are illustrated. FIG. 2 shows four sets of pressing composed of a convex hemispherical member 14, a driving means 18, an arm 19, and a claw 20 (shown by a dotted line in FIG. 2) when referred to in the AA direction of FIG. 1. The positional relationship of means is shown. As shown in FIG. 2, the claw 20 can press the four locations on the outer periphery of the convex hemispherical member 14. Thereby, the flat surface 14b of the convex hemispherical member 14 can be made into arbitrary inclination.
　エアーベアリング１５は、圧空ポンプから圧空吸引口１６を介してガスや空気が供給されることで、該気体を潤滑剤とするエアーベアリング１５が形成されるようになっている。これにより、凸状半球面部材１４が、凹状半球面部材１３に対して任意の方向に回動自在となっている。本発明では、回動を凸面１４ａもしくは凹面１３ａに沿って移動する場合に用いる。移動の際の軸中心は凸状半球面部材１４の平坦面１４ｂの中央部となる。 The air bearing 15 is configured such that an air bearing 15 using the gas as a lubricant is formed when gas or air is supplied from the compressed air pump through the compressed air suction port 16. Thereby, the convex hemispherical member 14 is rotatable in any direction with respect to the concave hemispherical member 13. In the present invention, the rotation is used when moving along the convex surface 14a or the concave surface 13a. The axis center at the time of movement is the center of the flat surface 14b of the convex hemispherical member 14.
　図１にもどり、ツール昇降手段４は、Ｚ軸送り機構３０と、Ｚ軸送り機構３０にブラケット３４を介して取り付けられたエアーシリンダ３５とから構成されている。Ｚ軸送り機構３０は、昇降用サーボモータ３２がボールねじ３３を駆動することによりブラケット３４をＺ方向上下に移動させる機構となっている。ブラケット３４は、Ｚ軸送り機構３０に設けられたスライダ３１に沿ってＺ方向上下に移動する。 Returning to FIG. 1, the tool lifting / lowering means 4 includes a Z-axis feed mechanism 30 and an air cylinder 35 attached to the Z-axis feed mechanism 30 via a bracket 34. The Z-axis feed mechanism 30 is a mechanism that moves the bracket 34 up and down in the Z direction by driving the ball screw 33 by the lifting servo motor 32. The bracket 34 moves up and down along the slider 31 provided in the Z-axis feed mechanism 30.
　ブラケット３４にはエアーシリンダ３５が取り付けられており、エアーシリンダ３５の内部ではピストン３６がＺ方向上下に移動可能になっている。エアーシリンダ３５の上部にはピストン３６の上面３６ａの位置を検出する位置検出器３７が備えられている。位置検出器３７は、本発明の高さ検出手段に対応する。エアーシリンダ３５の上部にはバランス用エアーを供給する供給孔３８ａが設けられ、下側には保持用エアーを供給する供給孔３８ｂが設けられている。図示していない圧空源よりピストン３６の位置を制御するためのバランス用エアーおよび保持用エアーが供給され、所定の加圧力がピストン３６に付与されている。ピストン３６のピストンロッド３６ｂにはチップ部品７が吸着保持される。ピストンロッド３６ｂの先端部でチップ部品７が吸着保持される部分を、以下、ボンディングツール３９と呼ぶ。ボンディングツール３９のチップ部品７の吸着面を３９ａと表記する。 An air cylinder 35 is attached to the bracket 34, and the piston 36 can move up and down in the Z direction inside the air cylinder 35. A position detector 37 for detecting the position of the upper surface 36 a of the piston 36 is provided on the upper portion of the air cylinder 35. The position detector 37 corresponds to the height detection means of the present invention. A supply hole 38a for supplying balancing air is provided in the upper part of the air cylinder 35, and a supply hole 38b for supplying holding air is provided in the lower side. Balance air and holding air for controlling the position of the piston 36 are supplied from a pressure air source (not shown), and a predetermined pressure is applied to the piston 36. The chip component 7 is held by suction on the piston rod 36 b of the piston 36. The portion where the chip component 7 is sucked and held at the tip of the piston rod 36b is hereinafter referred to as a bonding tool 39. The suction surface of the chip component 7 of the bonding tool 39 is denoted as 39a.
　ツール昇降手段４は、制御部５の信号に基づきボンディングツール３９に吸着保持されたチップ部品７が、基板保持ステージ１７に吸着保持された基板６に接触するまで、Ｚ軸送り機構３０を動作させる。その後、ピストン３６に付与されている所定圧でボンディングツール３９に吸着保持されたチップ部品７を基板保持ステージ１７に吸着保持された基板６に押し付けるようになっている。 The tool lifting / lowering means 4 operates the Z-axis feed mechanism 30 until the chip component 7 sucked and held by the bonding tool 39 contacts the substrate 6 sucked and held by the substrate holding stage 17 based on a signal from the control unit 5. . Thereafter, the chip component 7 sucked and held by the bonding tool 39 with a predetermined pressure applied to the piston 36 is pressed against the substrate 6 sucked and held by the substrate holding stage 17.
　チップ部品７を基板６に実装する際に、予め、ボンディングツール３９のチップ吸着面３９ａと凸状半球面部材１４の平坦面１４ｂの平行度調整が行われる。一般的な平行度調整は、次のような手順で行われている。まず、エアーベアリング１５に圧空吸引口１６よりエアーを供給し、凸状半球面部材１４を浮上させる。次に、エアーシリンダ３５のピストン３６を所定圧で維持することにより、ボンディングツール３９の吸着面３９ａが凸状半球面部材１４の平坦面１４ｂを押し付ける。そうすると、押し付けられた力に応じて、凸状半球面部材１４がＸθ、Ｙθ方向に移動する。吸着面３９ａと平坦面１４ｂが密着した状態となると、ボンディングツール３９と凸状半球面部材１４の平行度が確保される。この状態で、圧空吸引口１６から供給しているエアーを圧空から吸引に切り換え、凸状半球面部材１４を凹状半球面部材１３に密着させ姿勢を保持させる。以後、密着状態でチップ部品７の基板６へのボンディングを開始する。 When the chip component 7 is mounted on the substrate 6, the parallelism adjustment between the chip suction surface 39 a of the bonding tool 39 and the flat surface 14 b of the convex hemispherical member 14 is performed in advance. General parallelism adjustment is performed in the following procedure. First, air is supplied to the air bearing 15 from the compressed air suction port 16 to float the convex hemispherical member 14. Next, the suction surface 39a of the bonding tool 39 presses the flat surface 14b of the convex hemispherical member 14 by maintaining the piston 36 of the air cylinder 35 at a predetermined pressure. Then, the convex hemispherical member 14 moves in the Xθ and Yθ directions according to the pressed force. When the suction surface 39a and the flat surface 14b are in close contact with each other, the parallelism between the bonding tool 39 and the convex hemispherical member 14 is ensured. In this state, the air supplied from the compressed air suction port 16 is switched from compressed air to suction, and the convex hemispherical member 14 is brought into close contact with the concave hemispherical member 13 to maintain the posture. Thereafter, the bonding of the chip component 7 to the substrate 6 is started in a close contact state.
　このような平行度の調整方法は、ボンディングツール３９の吸着面３９ａの押し付け力が、凸状半球面部材１４を移動させることができる加圧力の場合には有効となる。しかし、チップ部品７の低加圧ボンディングでは、吸着面３９ａの押し付け力が十分な加圧力にならないため凸状半球面部材１４を移動（倣わせる）させることができない。そのため、本発明では、凸状半球面部材１４の平坦面１４ｂに接触する爪２０を用いて、平坦面１４ｂとボンディングツール３９の吸着面３９ａの平行度調整を行う。以下、図３を用いて平行度調整方法を説明する。 Such a method of adjusting the parallelism is effective when the pressing force of the suction surface 39a of the bonding tool 39 is a pressing force capable of moving the convex hemispherical member 14. However, in the low-pressure bonding of the chip component 7, the pressing force of the suction surface 39a does not become a sufficient pressing force, so that the convex hemispherical member 14 cannot be moved (followed). Therefore, in the present invention, the parallelism of the flat surface 14 b and the suction surface 39 a of the bonding tool 39 is adjusted using the claw 20 that contacts the flat surface 14 b of the convex hemispherical member 14. Hereinafter, the parallelism adjusting method will be described with reference to FIG.
　図３は、凸状半球面部材１４とボンディングツール３９との位置関係を説明する概略側面図である。図３（ａ）は、ボンディングツール３９の吸着面３９ａの一部が凸状半球面部材１４の平坦面１４ｂに接触した状態を示している。この状態では、図３（ａ）に示すように、吸着面３９ａと平坦面１４ｂとの間に角度αが発生し、平行度が保たれていない。また、ボンディングツール３９に付与されている加圧力では凸状半球面部材１４は移動しない。このとき、ボンディングツール３９の位置を位置検出器３７で検出し、高さ位置ｈ０と制御部５に記憶する。 FIG. 3 is a schematic side view for explaining the positional relationship between the convex hemispherical member 14 and the bonding tool 39. FIG. 3A shows a state in which a part of the suction surface 39 a of the bonding tool 39 is in contact with the flat surface 14 b of the convex hemispherical member 14. In this state, as shown in FIG. 3A, an angle α is generated between the suction surface 39a and the flat surface 14b, and the parallelism is not maintained. Further, the convex hemispherical member 14 does not move with the applied pressure applied to the bonding tool 39. At this time, the position of the bonding tool 39 is detected by the position detector 37 and stored in the height position h0 and the control unit 5.
　次に、制御部５の指令に基づき、駆動手段１８を駆動し爪２０をＺ方向下側に押し付ける。制御部５は、本実施の形態の場合、４個の駆動手段１８に対して平端部１４ｂが所定の角度になるように押し付けおよび開放（押し付け力をフリーとしてＺ方向上側への移動を可能とする）を制御する。この間、ボンディングツール３９に所定圧がピストン３６に付与されるているので、平坦面１４ｂの角度の変化に追従してボンディングツール３９のＺ方向の位置（Ｚ軸高さ位置）は変化する。 Next, based on the command of the control unit 5, the driving means 18 is driven and the claw 20 is pressed downward in the Z direction. In the case of the present embodiment, the control unit 5 can press and release the flat end portion 14b with respect to the four driving means 18 so that the flat end portion 14b has a predetermined angle (the pressing force is free, and the control unit 5 can move upward in the Z direction). Control). During this time, since a predetermined pressure is applied to the piston 36 to the bonding tool 39, the position in the Z direction (Z-axis height position) of the bonding tool 39 changes following the change in the angle of the flat surface 14b.
　図３（ｂ）は、爪２０を用いて凸状半球面部材１４の姿勢をＹ軸回りに可変させ、ボンディングツール３９の吸着面３９ａが平坦面１４ｂと密着した状態を示している。このとき、ピストン３６の位置はＺ方向最下点（一番低い位置）となる。たとえば、この位置検出器３７で検出した位置をｈ１として制御部５に記憶する。 FIG. 3B shows a state in which the attitude of the convex hemispherical member 14 is varied around the Y axis using the claw 20 and the suction surface 39a of the bonding tool 39 is in close contact with the flat surface 14b. At this time, the position of the piston 36 is the lowest point in the Z direction (the lowest position). For example, the position detected by the position detector 37 is stored in the control unit 5 as h1.
　図３（ｃ）は、図３（ｂ）の状態から、さらに爪２０を用いて凸状半球面部材１４の姿勢をＹ軸回りに可変させた状態を示している。この状態では、ピストン３６のＺ方向高さ位置は、図３（ｂ）に比べて上昇した位置となる。位置検出器３７で検出した位置をｈ２として制御部５に記憶する。 FIG. 3C shows a state in which the attitude of the convex hemispherical member 14 is changed around the Y axis by using the claws 20 from the state of FIG. 3B. In this state, the height position of the piston 36 in the Z direction is an elevated position as compared with FIG. The position detected by the position detector 37 is stored in the control unit 5 as h2.
　平坦部１４ｂの角度の変化に応じて制御部５に記憶したボンディングツール３９の高さデータから、Ｚ軸方向最下点となる位置を求める。図３の例ではｈ１がＺ軸方向最下点となる。Ｘ軸回りについても、同様に、ボンディングツール３９のＺ軸方向最下点となる位置を求めることができる。このように、爪２０で凸状半球面部材１４の姿勢を可変させながら、ボンディングツール３９に連結されたピストン３６の上面３６ａの位置を位置検出器３７で測定することにより、吸着面３９ａと平坦面１４ｂが密着し平行度が確保された際の、平坦部１４ｂの状態を知ることができる。ボンディングツール３９の高さ位置をＺ軸方向最下点になるように、爪２０を用いて凸状半球面部材１４を移動させた後、圧空吸引口１６から供給しているエアーを圧空から吸引に切り換え、凸状半球面部材１４を凹状半球面部材１３に密着させ姿勢を保持させる。以後、ボンディングツール３９と凸状半球面部材１４が高精度に平行度調整された状態で実装が行われるようになる。 The position serving as the lowest point in the Z-axis direction is obtained from the height data of the bonding tool 39 stored in the control unit 5 according to the change in the angle of the flat portion 14b. In the example of FIG. 3, h1 is the lowest point in the Z-axis direction. Similarly, the position that becomes the lowest point in the Z-axis direction of the bonding tool 39 can be obtained about the X-axis. As described above, the position of the upper surface 36a of the piston 36 connected to the bonding tool 39 is measured by the position detector 37 while changing the posture of the convex hemispherical member 14 with the claw 20, so that it is flat with the suction surface 39a. It is possible to know the state of the flat portion 14b when the surface 14b is in close contact and the parallelism is ensured. After the convex hemispherical member 14 is moved using the claw 20 so that the height position of the bonding tool 39 is the lowest point in the Z-axis direction, the air supplied from the compressed air suction port 16 is sucked from the compressed air. The convex hemispherical member 14 is brought into close contact with the concave hemispherical member 13 to maintain the posture. Thereafter, mounting is performed in a state in which the bonding tool 39 and the convex hemispherical member 14 are adjusted in parallelism with high accuracy.
　なお、本実施の形態では、凹状半球面部材１３と凸状半球面部材１５から構成されている球面軸受けを平行度調整部として用いたが、Ｘθ、Ｙθ方向に傾斜可能なゴニオステージや、それぞれの方向（Ｘ，Ｙ方向）の軸受けを十字に構成して傾斜可能とした回転軸受けで構成しても良い。また、基板ステージの周辺を複数の支持部材で支持し各支持部材のストロークを可変させることにより基板ステージ面の傾斜を可変させる機構で平行度調整部を構成しても良い。 In the present embodiment, the spherical bearing composed of the concave hemispherical member 13 and the convex hemispherical member 15 is used as the parallelism adjusting unit. However, the goniostage that can tilt in the Xθ and Yθ directions, The bearings in the directions (X and Y directions) may be configured as a rotary bearing that can be tilted by forming a cross. Further, the parallelism adjustment unit may be configured by a mechanism that varies the inclination of the substrate stage surface by supporting the periphery of the substrate stage with a plurality of support members and varying the stroke of each support member.
　また、基板ステージ面とボンディングツール面の平行度が相対的に調整可能であれば、平行度調整機能を少なくともどちらか一方に構成させていればよい。 Further, if the parallelism between the substrate stage surface and the bonding tool surface can be relatively adjusted, the parallelism adjustment function may be configured in at least one of them.
　１　　実装装置
　２　　基台
　３　　基板ステージ
　４　　ツール昇降手段
　５　　制御部
　６　　基板
　７　　チップ部品
　１１　　枠体
　１２　　支持部
　１３　　凹状半球面部材
　１４　　凸状半球面部材
　１５　　エアーベアリング
　１６　　圧空吸引口
　１７　　基板保持ステージ
　１８　　駆動手段
　１９　　アーム
　２０　　爪
　３０　　Ｚ軸送り機構
　３１　　スライダ
　３２　　サーボモータ
　３３　　ボールねじ
　３４　　ブラケット
　３５　　エアーシリンダ
　３６　　ピストン
　３７　　位置検出器
　３９　　ボンディングツール
　１３ａ　　凹面
　１４ａ　　凸面
　１４ｂ　　平坦面
　１４ｂ　　平端部
　３６ａ　　上面
　３６ｂ　　ピストンロッド
　３８ａ　　供給孔
　３８ｂ　　供給孔
　３９ａ　　吸着面 DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Base 3 Board | substrate stage 4 Tool raising / lowering means 5 Control part 6 Board | substrate 7 Chip component 11 Frame 12 Supporting part 13 Concave hemispherical member 14 Convex hemispherical member 15 Air bearing 16 Pressure suction port 17 Substrate holding stage 18 Drive means 19 Arm 20 Claw 30 Z axis feed mechanism 31 Slider 32 Servo motor 33 Ball screw 34 Bracket 35 Air cylinder 36 Piston 37 Position detector 39 Bonding tool 13a Concave surface 14a Convex surface 14b Flat surface 14b Flat end 36a Upper surface 36b Piston rod 38a Supply Hole 38b Supply hole 39a Adsorption surface

Claims (6)

  1. 基板ステージに吸着保持された基板に、基板ステージの上方に位置したボンディングツールを用いてボンディングツールに吸着保持されたチップ部品を実装する実装装置のボンディングツールと基板ステージの平行度を調整する平行度調整方法であって、
    ボンディングツール面もしくは基板ステージ面の傾斜を変化させる平行度調整部と、平行度調整部を駆動する駆動手段とを備え、
    ボンディングツールの高さ位置を検出する高さ検出手段を備え、
    ボンディングツールを所定圧で、基板ステージに押し付ける工程と、
    駆動手段が平行度調整部の傾斜を変化させる工程と、
    平行度調整部の傾斜を変化させている間の、ボンディングツールの高さ検知手段の情報から、ボンディングツールの最下点の位置を求める工程と、
    ボンディングツールが最下点になった際の平行度調整部の傾斜位置を保持する工程とからなる実装装置の平行度調整方法。     Parallelism that adjusts the parallelism between the bonding tool of the mounting device and the substrate stage that mounts the chip component sucked and held on the bonding tool using the bonding tool located above the substrate stage on the board held and sucked on the substrate stage An adjustment method,
    A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit,
    Provided with height detection means for detecting the height position of the bonding tool,
    A process of pressing the bonding tool against the substrate stage with a predetermined pressure;
    A step in which the driving means changes the inclination of the parallelism adjusting unit;
    While changing the inclination of the parallelism adjustment unit, from the information of the height detection means of the bonding tool, to determine the position of the lowest point of the bonding tool;
    A method of adjusting the parallelism of the mounting apparatus, comprising the step of maintaining the tilt position of the parallelism adjusting unit when the bonding tool reaches the lowest point.
  2. 請求項１に記載の発明において、
    平行度調整部が、凸状半球面部材と凹状半球面部材とを組み合わせた球面軸受けからなる、実装装置の平行度調整方法。     In the invention of claim 1,
    A parallelism adjustment method for a mounting apparatus, wherein the parallelism adjustment unit includes a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  3. 請求項２に記載の発明において、
    平行度調整部が、基板ステージ側に備えられている、実装装置の平行度調整方法。     In the invention of claim 2,
    A parallelism adjustment method for a mounting apparatus, wherein the parallelism adjustment unit is provided on the substrate stage side.
  4. 基板ステージに吸着保持された基板に、基板ステージの上方に位置したボンディングツールを用いてボンディングツールに吸着保持されたチップ部品を実装する実装装置の平行度調整装置であって、
    ボンディングツール面もしくは基板ステージ面の傾斜を変化させる平行度調整部と、平行度調整部を駆動する駆動手段とを備え、
    ボンディングツールの高さ位置を検出する高さ検出手段と、
    ボンディングツールを所定圧で、基板ステージに押し付けた状態で平行度調整部の傾斜を駆動手段で変化させ、ボンディングツールの高さ検知手段の情報から、ボンディングツールの最下点位置となる平行度調整部の傾斜位置を保持する制御手段とを備えることを特徴とする実装装置の平行度調整装置。     A parallelism adjusting device for a mounting device that mounts a chip component sucked and held on a bonding tool using a bonding tool positioned above the substrate stage on a substrate sucked and held on a substrate stage,
    A parallelism adjusting unit that changes the inclination of the bonding tool surface or the substrate stage surface, and a drive means for driving the parallelism adjusting unit,
    A height detection means for detecting the height position of the bonding tool;
    While the bonding tool is pressed against the substrate stage at a predetermined pressure, the inclination of the parallelism adjustment unit is changed by the drive means, and the parallelism adjustment that is the lowest point position of the bonding tool is determined from the information on the height detection means of the bonding tool A parallelism adjusting device for a mounting apparatus, comprising: a control means for holding the inclined position of the part.
  5. 請求項４に記載の発明において、
    平行度調整部が、凸状半球面部材と凹状半球面部材とを組み合わせた球面軸受けからなる、実装装置の平行度調整装置。     In the invention of claim 4,
    A parallelism adjusting device for a mounting device, wherein the parallelism adjusting unit is a spherical bearing in which a convex hemispherical member and a concave hemispherical member are combined.
  6. 請求項５に記載の発明において、
    平行度調整部が、基板ステージ側に備えられている、実装装置の平行度調整装置。     In the invention of claim 5,
    A parallelism adjusting device for a mounting apparatus, wherein the parallelism adjusting unit is provided on the substrate stage side.
PCT/JP2011/073359 2010-10-13 2011-10-12 Parallelism adjustment method and parallelism adjustment apparatus for mounting apparatus WO2012050096A1 (en)

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