WO2012049717A1 - 有機発光パネルとその製造方法、および有機表示装置 - Google Patents
有機発光パネルとその製造方法、および有機表示装置 Download PDFInfo
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- WO2012049717A1 WO2012049717A1 PCT/JP2010/006144 JP2010006144W WO2012049717A1 WO 2012049717 A1 WO2012049717 A1 WO 2012049717A1 JP 2010006144 W JP2010006144 W JP 2010006144W WO 2012049717 A1 WO2012049717 A1 WO 2012049717A1
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- light emitting
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- the present invention relates to an organic light emitting panel, a manufacturing method thereof, and an organic display device.
- each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween.
- driving the display device holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.
- the organic light emitting layers of adjacent pixel portions are partitioned by a partition (bank) made of an insulating material.
- the organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the partition walls and drying the ink.
- Patent Document 1 describes a technique in which a convex portion is provided on the surface portion of the partition wall, thereby controlling the pinning position of the ink with respect to the surface portion of the partition wall. ing. That is, by adopting the technique proposed in Patent Document 1, the pinning position when the ink in one pixel portion is dropped can be pinned to the convex portion formed on the surface portion, thereby The film thickness uniformity can be ensured.
- the technique proposed by the said patent document 1 is employ
- the present invention has been made to solve the above-described problems, and provides a display device with less inhomogeneous luminance in the surface and a method of manufacturing the same, by making the film thickness of the organic light emitting layer uniform over the entire surface of the panel. For the purpose.
- the organic light-emitting panel according to one embodiment of the present invention is characterized by adopting the following configuration.
- An organic light emitting panel includes a first pixel portion, a second pixel portion, a non-pixel portion, a first partition, and a second partition.
- An organic light-emitting layer formed by applying an ink containing an organic light-emitting material for each luminescent color, a second electrode provided on the opposite side of the base layer from the organic light-emitting layer, and facing the base layer
- a plurality of partition walls that divide adjacent light emitting units among the plurality of light emitting units and define each light emitting unit.
- the second pixel portion is different in emission color from each other, is located on one side and is applied with a corresponding ink, the second light emitting portion is located on the center side and is applied with a corresponding ink, A plurality of light emitting units, which are arranged on the other side and arranged in order with a third light emitting unit to which the corresponding ink is applied, each light emitting unit is opposed to the base layer including the first electrode and the base layer An organic light-emitting layer formed by applying an ink containing an organic light-emitting material for each luminescent color, a second electrode provided on the opposite side of the base layer from the organic light-emitting layer, and facing the base layer Different from the first pixel unit, provided with a plurality of partition walls that define adjacent light emitting units among the plurality of light emitting units and define each light emitting unit.
- the non-pixel portion is interposed between the first pixel portion and the second pixel portion, includes the third electrode separated from the first electrode without including the organic light emitting layer, and the second electrode, The second electrode and the third electrode are electrically connected.
- the first partition wall is disposed between the first pixel portion and the non-pixel portion, and divides the third light emitting portion of the first pixel portion and the non-pixel portion, and includes the first pixel portion and the non-pixel portion. Different from the plurality of partition walls in each of the second pixel portions.
- the second partition wall is disposed between the second pixel portion and the non-pixel portion, and divides the first light emitting portion of the second pixel portion and the non-pixel portion, and includes the first pixel portion and the non-pixel portion. Different from the plurality of partition walls in each of the second pixel portions.
- the slope of the surface portion facing the third light-emitting portion side of the first pixel portion in the first partition located on the non-pixel portion side The angle is larger than the inclination angle of the surface portion facing the second light emitting portion of the first pixel portion in the partition located on the second light emitting portion side, and is adjacent to define the first light emitting portion of the second pixel portion.
- the inclination angle of the surface facing the first light emitting unit of the second pixel unit in the second partition located on the non-pixel unit side is the inclination angle of the second pixel unit in the partition positioned on the second light emitting unit side. It is characterized by being larger than the inclination angle of the surface part facing the first light emitting part side.
- the third light emission of the first pixel portion in the first partition located on the non-pixel portion side with respect to two adjacent partitions defining the third light emitting portion of the first pixel portion A configuration is adopted in which the inclination angle of the surface part facing the part side is larger than the inclination angle of the surface part facing the second light emitting part side of the first pixel part in the partition located on the second light emitting part side. For this reason, when the ink for forming the organic light emitting layer is applied, the first pixel in the first partition located on the non-pixel portion side among the two adjacent partitions defining the third light emitting portion of the first pixel portion.
- the ink pinning position with respect to the surface portion facing the third light emitting portion side of the portion is higher than the ink pinning position with respect to the surface portion facing the second light emitting portion side of the first pixel portion in the partition located on the second light emitting portion side. can do. Therefore, in the organic light emitting panel according to one embodiment of the present invention, the film on the first partition side portion in the third light emitting portion of the first pixel portion is distributed due to the distribution of the vapor concentration at the time of applying the ink for forming the organic light emitting layer. While the thickness tends to increase relatively, as described above, by increasing the pinning position, the thickness of the organic light emitting layer in the third light emitting portion of the first pixel portion is biased. Can be suppressed.
- the second pixel portion of the second partition located on the non-pixel portion side is related to two adjacent partitions defining the first light-emitting portion of the second pixel portion.
- a configuration is also adopted in which the inclination angle of the surface portion facing the first light emitting portion is larger than the inclination angle of the surface portion facing the first light emitting portion of the second pixel portion in the partition located on the second light emitting portion side. For this reason, when the ink for forming the organic light emitting layer is applied, the second pixel in the second partition located on the non-pixel portion side among the two adjacent partitions defining the first light emitting portion of the second pixel portion.
- the vapor concentration distribution at the time of applying the ink for forming the organic light emitting layer is determined by the distribution of the vapor concentration at the time of applying the ink for forming the organic light emitting layer.
- the film thickness of the second partition wall side portion in the first light emitting portion of the second pixel portion tends to increase, but as described above, by increasing the pinning position, the second pixel portion
- the uneven thickness of the organic light emitting layer in the first light emitting portion can also be suppressed.
- a non-pixel portion exists between the third light-emitting portion of the first pixel portion and the first light-emitting portion of the second pixel portion, and ink for forming an organic light-emitting layer is applied to the non-pixel portion.
- ink for forming an organic light-emitting layer is applied to the non-pixel portion.
- this is due to the presence of the non-pixel unit to which ink is not applied.
- the vapor concentration is relatively low compared to the other side of each light emitting portion, and this tends to increase the thickness of the organic light emitting layer in the portion.
- the third light emitting portion and the second pixel portion of the first pixel portion are set by setting the inclination angle of the surface portion of the partition wall in accordance with the above relationship with respect to such a tendency.
- the unevenness of the film thickness of the organic light emitting layer in the first light emitting portion can be suppressed.
- the thickness of the organic light emitting layer in both the third light emitting unit of the first pixel unit and the first light emitting unit of the second pixel unit with the non-pixel unit interposed therebetween can be prevented, and good light emission characteristics can be obtained.
- FIG. 3 is a schematic cross-sectional view showing some subpixels 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing the configuration of subpixels 100a1 to 100a3 and 100b1, a non-pixel portion 100c, and banks 105a to 105f in the pixel portions 100a and 100b of the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing some subpixels 100 in the display panel 10.
- FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10.
- FIG. 3 is a schematic cross-sectional view showing the configuration of subpixels 100a1 to 100a3 and 100b1, a non-pixel portion 100c, and banks 105a to 105f in the pixel portions 100a and 100b of the display panel 10.
- (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small
- (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large
- (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small
- (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer.
- FIG. 6 is a diagram showing the film thickness distribution of organic light emitting layers in Samples 1 to 3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5.
- FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order.
- FIG. 4 is a schematic cross-sectional view illustrating an ink application process in the method for manufacturing the display panel 10.
- FIG. 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1.
- FIG. (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- (A), (b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order.
- A) is a figure which shows the relationship between exposure / development processing and the taper angle of a bank
- (b) is AFM which shows the shape of the formed bank.
- (A), (b) is a schematic cross section for demonstrating the definition of a taper angle.
- FIG. 4 is a schematic plan view for explaining regions 10a1, 10a2, and 10b in the display panel 10.
- FIG. 2 is an external perspective view showing an example of an external appearance of a set including the organic display device 1.
- FIG. 14 is a schematic plan view showing a configuration of a bank 805 included in a display panel 80 according to Modification 3.
- FIG. It is a schematic cross section which shows the biased state of the film thickness distribution of the organic light emitting layer for every sub pixel of the pixel parts 90a and 90b in a display panel.
- (A) to (c) are schematic cross-sectional views showing the vapor concentration distribution during the formation of the organic light emitting layer and the state of uneven film shape in the ink drying process.
- An organic light emitting panel includes a first pixel portion, a second pixel portion, a non-pixel portion, a first partition, and a second partition.
- An organic light-emitting layer formed by applying an ink containing an organic light-emitting material for each luminescent color, a second electrode provided on the opposite side of the base layer from the organic light-emitting layer, and facing the base layer
- a plurality of partition walls that divide adjacent light emitting units among the plurality of light emitting units and define each light emitting unit.
- the second pixel portion is different in emission color from each other, is located on one side and is applied with a corresponding ink, the second light emitting portion is located on the center side and is applied with a corresponding ink, A plurality of light emitting units, which are arranged on the other side and arranged in order with a third light emitting unit to which the corresponding ink is applied, each light emitting unit is opposed to the base layer including the first electrode and the base layer An organic light-emitting layer formed by applying an ink containing an organic light-emitting material for each luminescent color, a second electrode provided on the opposite side of the base layer from the organic light-emitting layer, and facing the base layer Different from the first pixel unit, provided with a plurality of partition walls that define adjacent light emitting units among the plurality of light emitting units and define each light emitting unit.
- the non-pixel portion is interposed between the first pixel portion and the second pixel portion, includes the third electrode separated from the first electrode without including the organic light emitting layer, and the second electrode, The second electrode and the third electrode are electrically connected.
- the first partition wall is disposed between the first pixel portion and the non-pixel portion, and divides the third light emitting portion of the first pixel portion and the non-pixel portion, and includes the first pixel portion and the non-pixel portion. Different from the plurality of partition walls in each of the second pixel portions.
- the second partition wall is disposed between the second pixel portion and the non-pixel portion, and divides the first light emitting portion of the second pixel portion and the non-pixel portion, and includes the first pixel portion and the non-pixel portion. Different from the plurality of partition walls in each of the second pixel portions.
- the slope of the surface portion facing the third light-emitting portion side of the first pixel portion in the first partition located on the non-pixel portion side The angle is larger than the inclination angle of the surface portion facing the second light emitting portion of the first pixel portion in the partition located on the second light emitting portion side, and is adjacent to define the first light emitting portion of the second pixel portion.
- the inclination angle of the surface facing the first light emitting unit of the second pixel unit in the second partition located on the non-pixel unit side is the inclination angle of the second pixel unit in the partition positioned on the second light emitting unit side. It is characterized by being larger than the inclination angle of the surface part facing the first light emitting part side.
- the third light emission of the first pixel portion in the first partition located on the non-pixel portion side with respect to two adjacent partitions defining the third light emitting portion of the first pixel portion A configuration is adopted in which the inclination angle of the surface part facing the part side is larger than the inclination angle of the surface part facing the second light emitting part side of the first pixel part in the partition located on the second light emitting part side. For this reason, when the ink for forming the organic light emitting layer is applied, the first pixel in the first partition located on the non-pixel portion side among the two adjacent partitions defining the third light emitting portion of the first pixel portion.
- the ink pinning position with respect to the surface portion facing the third light emitting portion side of the portion is higher than the ink pinning position with respect to the surface portion facing the second light emitting portion side of the first pixel portion in the partition located on the second light emitting portion side. can do. Therefore, in the organic light emitting panel according to one embodiment of the present invention, the film on the first partition side portion in the third light emitting portion of the first pixel portion is distributed due to the distribution of the vapor concentration at the time of applying the ink for forming the organic light emitting layer. While the thickness tends to increase relatively, as described above, by increasing the pinning position, the thickness of the organic light emitting layer in the third light emitting portion of the first pixel portion is biased. Can be suppressed.
- the second pixel portion of the second partition located on the non-pixel portion side is related to two adjacent partitions defining the first light-emitting portion of the second pixel portion.
- a configuration is also adopted in which the inclination angle of the surface portion facing the first light emitting portion is larger than the inclination angle of the surface portion facing the first light emitting portion of the second pixel portion in the partition located on the second light emitting portion side. For this reason, when the ink for forming the organic light emitting layer is applied, the second pixel in the second partition located on the non-pixel portion side among the two adjacent partitions defining the first light emitting portion of the second pixel portion.
- the vapor concentration distribution at the time of applying the ink for forming the organic light emitting layer is determined by the distribution of the vapor concentration at the time of applying the ink for forming the organic light emitting layer.
- the film thickness of the second partition wall side portion in the first light emitting portion of the second pixel portion tends to increase, but as described above, by increasing the pinning position, the second pixel portion
- the uneven thickness of the organic light emitting layer in the first light emitting portion can also be suppressed.
- a non-pixel portion exists between the third light-emitting portion of the first pixel portion and the first light-emitting portion of the second pixel portion, and ink for forming an organic light-emitting layer is applied to the non-pixel portion.
- ink for forming an organic light-emitting layer is applied to the non-pixel portion.
- this is due to the presence of the non-pixel unit to which ink is not applied.
- the vapor concentration is relatively low compared to the other side of each light emitting portion, and this tends to increase the thickness of the organic light emitting layer in the portion.
- the third light emitting portion and the second pixel portion of the first pixel portion are set by setting the inclination angle of the surface portion of the partition wall in accordance with the above relationship with respect to such a tendency.
- the unevenness of the film thickness of the organic light emitting layer in the first light emitting portion can be suppressed.
- the thickness of the organic light emitting layer in both the third light emitting unit of the first pixel unit and the first light emitting unit of the second pixel unit with the non-pixel unit interposed therebetween can be prevented, and good light emission characteristics can be obtained.
- the inclination angle of the surface portion of the first partition facing the third light emitting portion side of the first pixel portion faces the non-pixel portion side of the first partition.
- the inclination angle of the surface portion facing the first light emitting portion side of the second pixel portion in the second partition is larger than the inclination angle of the surface portion facing the non-pixel portion side of the second partition.
- the inclination angle of the surface portion facing the non-pixel portion side of the first partition wall is smaller than the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion, It means that the inclination angle at the surface portion facing the non-pixel portion side in the two partition walls is smaller than the inclination angle at the surface portion facing the first light emitting portion side.
- the inclination angle of the surface portion facing the non-pixel portion side faces each side of the third light emitting portion of the first pixel portion and the first light emitting portion of the second pixel portion. Since the inclination angle is relatively gentler than the inclination angle of the surface portion, it is possible to prevent the second electrode continuously formed also on the upper part of the partition walls from being disconnected or causing leakage current. A reliable electrical connection between the two electrodes and the third electrode can be achieved.
- the inclination angles of the opposing surface portions in the adjacent partition walls defining the second light emitting portion are equal to each other.
- the configuration can be adopted.
- the first light emitting unit and the third light emitting unit are arranged on both sides of the second light emitting unit disposed in each central portion. Therefore, it is difficult to cause a deviation in vapor concentration. For this reason, in the organic light emitting panel according to an aspect of the present invention, in each of the first pixel portion and the second pixel portion, the inclination angles of the opposing surface portions in the adjacent partition walls defining the second light emitting portion are equal to each other. By adopting the configuration, it is possible to prevent an uneven film thickness at the second light emitting unit in each of the first pixel unit and the second pixel unit.
- the inclination angle of the surface portion facing the non-pixel portion side of the first partition and the inclination angle of the surface portion facing the non-pixel portion side of the second partition wall are An equal configuration.
- the thickness of the second electrode it is possible to make the thickness of the second electrode the same at both boundary portions between the non-pixel portion side of the first partition and the non-pixel portion side of the second partition. Problems such as breakage and generation of leakage current can be more effectively suppressed.
- the first light-emitting portion, the second light-emitting portion, and the third light-emitting portion have each emission color. It is possible to adopt a configuration in which corresponding organic inks are simultaneously applied to form an organic light emitting layer.
- each of the first pixel portion and the second pixel portion is caused by the non-pixel portion being disposed between the first pixel portion and the second pixel portion.
- the organic light emitting layer tends to increase in thickness on the non-pixel portion side of the first light emitting portion and the non-pixel portion side of the third light emitting portion.
- the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the first partition, and the surface facing the first light emitting portion side of the second pixel portion in the second partition wall Since the inclination angle of the surface portion to be regulated is defined, each of the thicknesses of the organic light emitting layer in the third light emitting portion in the first pixel portion and the thickness of the organic light emitting layer in the first light emitting portion in the second pixel portion is determined. Can be suppressed.
- the “tilt angle” is such that each of the facing surface portions of the partition and the base layer (the first electrode or the hole injection layer, or the like, on which the partition is formed, The hole injecting and transporting layer corresponds to this)) and the angle formed by the upper surface.
- An organic display device includes any one of the above organic light-emitting panels according to an aspect of the present invention. Therefore, the organic display device according to one embodiment of the present invention has favorable light-emitting characteristics by preventing the effects of the organic light-emitting panel according to one embodiment of the present invention, that is, unevenness of the thickness of the organic light-emitting layer. can get.
- An organic light emitting panel manufacturing method includes an organic light emitting device in which a first pixel portion and a second pixel portion each having a plurality of light emitting portions are provided with a non-pixel portion interposed therebetween.
- a method for manufacturing a panel comprising the following steps.
- a photosensitive resist material is laminated on the underlayer.
- An opening corresponding to the non-pixel portion is formed between the pixel portion and the second pixel portion, a first partition that partitions the first pixel portion and the non-pixel portion, and a second partition that separates the second pixel portion and the non-pixel portion.
- Two partition walls are formed.
- Ink containing organic light emitting material is dropped and dried from the first opening to the third opening in the first pixel portion and the second pixel portion to form an organic light emitting layer.
- a 2nd electrode is formed above an organic light emitting layer.
- the inclination angle of the surface portion facing the third light emitting portion side of the one pixel portion is larger than the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition located on the second light emitting portion side.
- a slope of a surface portion facing the first light emitting portion side of the second pixel portion in the partition wall located on the non-pixel portion side with respect to two adjacent partition walls defining the first light emitting portion of the second pixel portion The angle is formed so as to be larger than the inclination angle of the surface portion facing the first light emitting portion of the second pixel portion in the partition located on the second light emitting portion side.
- the ink corresponding to each emission color is simultaneously dropped from the first opening to the third opening in the first pixel portion and the second pixel portion to form an organic light emitting layer. It is characterized by.
- the surface facing the third light emitting portion side of the first pixel portion in the barrier rib located on the non-pixel portion side is provided.
- the inclination angle of the surface portion that is larger than the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition located on the second light emitting portion side, and the first light emitting portion of the second pixel portion is The second pixel in the partition located on the second light-emitting portion side has an inclination angle of the surface facing the first light-emitting portion side of the second pixel portion in the partition located on the non-pixel portion side with respect to the two adjacent partition walls defined.
- the organic light emitting panel having a feature that the inclination angle of the surface part facing the first light emitting part side of the part is larger can be manufactured, and as described above, the organic light emission resulting from the distribution of the vapor concentration at the time of ink application Effectively prevent uneven layer thickness Door can be.
- an organic light-emitting panel having good light-emitting characteristics can be manufactured.
- the third step with respect to exposure of the photosensitive resist material, two adjacent partitions defining the third light-emitting portion of the first pixel portion,
- the transmittance of light to the portion corresponding to the surface portion facing the third light emitting portion side of the first pixel portion in the partition wall located on the portion side is the third transmittance of the first pixel portion in the partition portion located on the second light emitting portion side.
- a partition located on the non-pixel portion side by using different masks for the portions corresponding to the respective surface portions so as to be smaller than the light transmittance to the portions corresponding to the surface portions facing the light emitting portion side.
- the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion is larger than the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition located on the second light emitting portion side.
- the second drawing With respect to two adjacent barrier ribs that define the first light emitting portion, the transmittance of light to the portion corresponding to the surface portion facing the first light emitting portion side of the second pixel portion in the barrier rib located on the non-pixel portion side is In the partition corresponding to the second light emitting portion, the portion corresponding to each surface portion is smaller than the light transmittance to the portion corresponding to the surface portion facing the first light emitting portion of the second pixel portion.
- the inclination angle of the surface part facing the first light emitting part of the second pixel part in the partition located on the non-pixel part side is set to the second angle in the partition located on the second light emitting part side.
- a configuration in which the pixel portion is formed so as to be larger than the inclination angle of the surface portion facing the first light emitting portion side of the pixel portion can be employed.
- the inclination angle of the corresponding surface portion in the partition can be relatively changed.
- the exposure of the photosensitive resist material, the two adjacent partitions defining the third light emitting portion of the first pixel portion the transmittance of light to the portion corresponding to the surface portion facing the third light emitting portion side of the first pixel portion in the partition wall located on the non-pixel portion side is expressed by the first pixel portion in the partition wall located on the second light emitting portion side.
- the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition wall is determined by the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition wall located on the second light emitting portion side.
- the inclination angle of the corresponding surface portion in the partition can be relatively changed.
- the photosensitive resist material is exposed and developed, and then the adjacent two that define the third light-emitting portion of the first pixel portion.
- the two barrier ribs by performing an additional exposure process on the portion corresponding to the surface portion facing the third light emitting portion side of the first pixel portion in the barrier rib located on the non-pixel portion side, it is positioned on the non-pixel portion side.
- the inclination angle of the surface portion facing the third light emitting portion side of the first pixel portion in the partition wall is larger than the inclination angle of the facing surface portion of the partition wall located on the second light emitting portion side, and the first With respect to two adjacent barrier ribs that define the first light-emitting portion of the two-pixel portion, an exposure process is performed on a portion corresponding to a surface portion facing the first light-emitting portion side of the second pixel portion in the barrier rib located on the non-pixel portion side. To the non-pixel part side.
- the inclination angle of the surface portion facing the first light emitting portion side of the second pixel portion in the partition wall is determined by the inclination angle of the surface portion facing the first light emitting portion side of the second pixel portion in the partition wall located on the second light emitting portion side. It can also be formed to be larger.
- the inclination angle of the corresponding surface portion of the partition wall can be relatively increased.
- the pixel portion 90a and the pixel portion 90b are arranged with a non-pixel portion 90c interposed therebetween.
- the pixel portion 90a and the pixel portion 90b include sub-pixels 90a1, 90a2, 90a3, 90b1, 90b2, and 90b3 corresponding to three emission colors of red (R), green (G), and blue (B), respectively.
- R red
- G green
- B blue
- an anode electrode 902 and an electrode coating layer 903 that covers the anode electrode 902 are provided on the substrate 901. Further, the surface of the electrode coating layer 902 and the substrate 901 is provided.
- a hole injection layer 904 is formed so as to cover the organic light emitting layers 906 a 1, 906 a 2, 906 a 3, 906 b 1, 906 b 2, and 906 b 3 for each corresponding emission color.
- the organic light emitting layers 906a1, 906a2, 906a3, 906b1, 906b2, and 906b3 are partitioned by banks 905a to 905d and 905e to 905h provided on the hole injection layer 904.
- the non-pixel portion 90c has a bus bar 932 and an electrode coating layer 933 covering the bus bar 932, but does not have an organic light emitting layer.
- the thickness of the organic light emitting layers 906a3 and 906b1 of the subpixels 90a3 and 90b1 adjacent to the non-pixel portions 90c of the pixel portions 90a and 90b is uneven. May end up. Specifically, the height of the point C 6 of the bank 905d side of the organic light emitting layer 906a3 in subpixel 90a3 is, the height of the portion C 5 of the bank 905c side, and the bank of the organic light emitting layer 906a2 in subpixel 90a2 A phenomenon occurs in which the height is higher than the heights of the locations C 3 and C 4 on each side of 905b and 905c.
- the height of the portion C 7 of the bank 905e side of the organic light emitting layer 906b1 in subpixel 90b1 is, banks 905F height point C 8 at the side, and the bank of the organic light emitting layer 906b2 in subpixel 90b2 905f, It becomes higher than the height of the locations C 9 and C 10 on each side of 905 g.
- the heights of the portions C 1 and C 12 on the respective sides of the banks 905a and 905h of the organic light emitting layers 906a1 and 906b3 in the subpixels 90a1 and 90b3 are also increased.
- the present inventor presumed that the decrease in film thickness uniformity in the organic light-emitting layer was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 21A, it is assumed that ink 9060a3 for forming an organic light emitting layer is applied to a region defined between the banks 905c and 905d. When the vapor concentration distribution of the organic light emitting layer is lower on the right side than the left side of FIG. 21 (a), as shown by a two-dot chain line, the thickness of the organic light emitting layer is considered to be biased due to the following relationship. It is done.
- the vapor concentration distribution on the right side is lower than that on the left side in FIG. 21A.
- the non-pixel portion 90c exists on the right side of the bank 905d (see FIG. 20), and the ink is not applied. It is thought that it is caused by not being done.
- surface profile L 90 of ink 9060A3 has a shape raised central portion of the sub-pixels.
- fast evaporation rate at low vapor concentrations side since slower at high vapor concentrations side, the changes to the surface profile L 91 It can be considered formally.
- the solvent moves as indicated by the broken line arrow L 92 inside the ink 9061a3 in the middle of drying.
- the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves. Therefore, as shown in FIG. 21 (c), if it has a bias in the vapor concentration distribution, surface profile L 93 is raised about the right (than the height of the portion C 6, a high height of the areas C 5 )
- the organic light emitting layer 906a3 is formed.
- the present inventor has obtained an inference regarding the organic light emitting panel that the uniformity of the thickness of the formed organic light emitting layer is reduced due to the nonuniformity of the vapor concentration distribution when the ink is dried. .
- the present inventor changes the pinning position of the bank side surface portion of the ink by changing the inclination angle of the surface portion of the bank in the panel surface. As a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.
- a display device (organic display device) 1 includes a display panel unit 10 and a drive control unit 20 connected thereto.
- the display panel unit 10 is an organic light emitting panel using an electroluminescence phenomenon of an organic material, and a plurality of pixel units are two-dimensionally arranged in the XY plane direction.
- the drive control unit 20 includes four drive circuits 21 to 24 and a control circuit 25.
- the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.
- the configuration of the display panel 10 will be described with reference to FIG. Note that the display panel 10 according to the present embodiment employs a top emission type organic light emitting panel as an example, and emits organic light having one of red (R), green (G), and blue (B). A plurality of pixel portions including layers are arranged and configured in a matrix. In FIG. 2, one subpixel 100 in one pixel portion is extracted and drawn.
- the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each subpixel 100.
- a bank (partition wall) 105 made of an insulating material and partitioning between the sub-pixels 100 is erected.
- An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each subpixel 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .
- the substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.
- the substrate 101 includes a TFT layer, a passivation film, an interlayer insulating film, and the like that are stacked.
- the anode electrode 102 is composed of a single layer made of a conductive material or a laminated body formed by laminating a plurality of layers.
- a conductive material for example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- Al aluminum
- an alloy containing the same For example, Al (aluminum), an alloy containing the same, Ag (silver), APC (silver) , Palladium, copper alloy), ARA (silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), and the like.
- MoCr molybdenum and chromium alloy
- NiCr nickel and
- Electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers at least a part of the surface of the anode electrode 102 at the upper part in the Z-axis direction.
- ITO indium tin oxide
- the hole injecting and transporting layer 104 is made of, for example, an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), or It is a layer made of a conductive polymer material such as PEDOT (mixture of polythiophene and polystyrene sulfonic acid).
- PEDOT mixture of polythiophene and polystyrene sulfonic acid
- the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.
- the bank (partition wall) 105 is made of an organic material such as resin and has an insulating property.
- the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin.
- the bank 105 preferably has organic solvent resistance.
- the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the process.
- the side surface portion can be treated with fluorine.
- a material having a water repellency that has a resistivity of 10 5 [ ⁇ ⁇ cm] or more can be used, in addition to the above-described materials. This is because when a material having a resistivity of 10 5 [ ⁇ ⁇ cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent subpixels 100 is generated. This is because various problems such as an increase in power consumption are caused.
- the bank 105 when the bank 105 is formed using a hydrophilic material, the difference in lyophilicity / liquid repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. This is because it becomes difficult to selectively hold the ink containing an organic substance in the opening of the bank 105 in order to form the ink.
- the structure of the bank 105 not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted.
- the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.
- Organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108.
- As a material used for forming the organic light emitting layer 106 it is necessary to use a light emitting organic material that can be formed by a wet printing method.
- Electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.
- the cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance
- the cathode electrode 108 As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also.
- the layer containing silver may be formed of silver alone, or may be formed of a silver alloy.
- a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.
- the sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.
- each of the banks 105 extends in the Y-axis direction, and partitions between the sub-pixels of the pixel portion adjacent in the X-axis direction, and partitions between the pixel portion and the non-pixel portion. (In FIG. 3, illustration of the non-pixel portion is omitted).
- the subpixels 100 in each pixel unit are formed so that the emission colors are different for each of the regions partitioned by the bank 105. For example, each of red (R), green (G), and blue (B)
- One pixel portion is composed of a combination of three sub-pixels of the luminescent color.
- FIG. 4 is a cross-sectional end view in which the display panel 10 in FIG. 1 is cut along the AA ′ cross section and a part thereof is schematically shown.
- the display panel 10 is based on a TFT substrate (hereinafter, simply referred to as “substrate”) 101, and a pixel portion 100a and a pixel portion 100b are interposed with a non-pixel portion 100c therebetween. It is arranged in the inserted state.
- a TFT substrate hereinafter, simply referred to as “substrate” 101
- a pixel portion 100a and a pixel portion 100b are interposed with a non-pixel portion 100c therebetween. It is arranged in the inserted state.
- an anode electrode 102 is formed corresponding to each of the subpixels 100a1, 100a2, 100a3, 100b1,...
- an electrode covering layer 103 and a hole injection are formed on the anode electrode 102.
- a transport layer 104 is sequentially stacked.
- banks 105a to 105f made of an insulating material and defining the subpixels 100a1, 100a2, 100a3, 100b1,.
- An organic light emitting layer, an electron injection layer, a cathode electrode, and a sealing layer are sequentially stacked in each region partitioned by the banks 105a to 105f. (Not shown in FIG. 4).
- the pixel unit 100a includes a combination of subpixels 100a1 to 100a3, and the pixel unit 100b includes subpixels 100b1,... (Three subpixels as in the pixel unit 100a). It is configured with a combination of As described above, the non-pixel portion 100c is interposed between the pixel portion 100a and the pixel portion 100b.
- the sub-pixel 100a3 and the non-pixel portion 100c of the pixel portion 100a are partitioned by a bank 105d, and the pixel portion 100b and the non-pixel portion 100c are partitioned by a bank 105e.
- the non-pixel portion 100c is provided with an electrode (bus bar) 302 made of the same material as the anode electrode 102 and separated from the anode electrode 102, and an electrode covering layer 303 covering the electrode 302.
- a hole injecting and transporting layer 104 is extended on the electrode coating layer 303.
- a cathode electrode is formed thereon, and the bus bar 302 and the cathode electrode 108 are electrically connected.
- the organic light emitting layer is not formed in the non-pixel portion 100c.
- the surface 104 forms angles ⁇ b2, ⁇ c2, ⁇ c3, ⁇ d3, ⁇ dc, ⁇ ec, ⁇ e1, and ⁇ f1, respectively.
- angles ⁇ b2, ⁇ c2, ⁇ c3, ⁇ d3, ⁇ dc, ⁇ ec, ⁇ e1, and ⁇ f1 satisfy the relationships shown by the following equations.
- ⁇ e1 and ⁇ f1 are defined by the arrangement of the non-pixel portion 100c between the adjacent pixel portion 100a and the pixel portion 100b, and the application form of inks 1060a1 to 1060a3, 1060b1,. is there.
- FIG. 5 schematically illustrates the structure of one subpixel.
- the angle of inclination of the surface portion of the bank 105x (the angle formed by the surface portion of the bank 105x and the surface of the hole injecting and transporting layer 104) is the angle ⁇ x
- the inclination angle of the surface portion of the bank 105y (the angle formed by the surface portion of the bank 105y and the surface of the hole injection transport layer 104) is the angle ⁇ y.
- the angle ⁇ x and the angle ⁇ y satisfy the following relationship.
- the thickness Tx and the thickness Ty satisfy the following relationship.
- the pinning position is higher in Sample 3 and Sample 4 where the taper angle is larger than the thickness distribution of Sample 2.
- the horizontal axis indicates the horizontal direction
- the vertical axis indicates the height direction.
- anodes corresponding to the respective sub-pixel planned areas 1000a1 to 1000a3, 1000b1, on the upper surface in the Z-axis direction of the substrate 101, anodes corresponding to the respective sub-pixel planned areas 1000a1 to 1000a3, 1000b1,.
- the electrode 102 and the electrode coating layer 103 are sequentially stacked.
- the bus bar 302 and the electrode coating layer 303 are sequentially stacked corresponding to the non-pixel planned region 1000c.
- a hole injecting and transporting layer 104 is formed on the electrode covering layers 103 and 303 so as to cover the entire surface.
- the anode electrode 102 and the bus bar 302 are formed by, for example, forming a thin film made of Al or an alloy thereof or an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the thin film using a photolithography method. Made.
- the electrode coating layers 103 and 303 are formed by forming an ITO thin film on the surfaces of the anode electrode 102 and the bus bar 302 using a sputtering method or the like, and patterning the ITO thin film using a photolithography method or the like. That is done.
- a metal film is formed on the surface of the substrate 101 including the surfaces of the electrode coating layers 103 and 303 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injection / transport layer 104.
- a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coat method.
- a photosensitive resist material is used for the formation of the bank material layer 1050.
- an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.
- a mask 501 provided with openings 501a, 501b, and 501c is provided above the bank material layer 1050 at a location where a bank is to be formed. In this state, exposure is performed through the openings 501, 501 b and 501 c of the mask 501.
- the opening 501a of the mask 501 has a width Wc defined by points Pc1 and Pc2 at the lower ends of the surface portions 105c2 and 105c3 (see FIG. 4) of the bank 105c to be formed. Has been.
- the openings 501b and 501c of the mask 501 located between the planned subpixel area 1000a3 and the non-pixel planned area 1000c and between the planned subpixel area 1000b1 and the non-pixel planned area 1000c have widths Wd1 and We1.
- a mask in which openings 502b and 502c are provided above the bank material layer 1050 at locations corresponding to the surface portions 105dc and 105ec (see FIG. 4) of the banks 105d and 105e. 502 is arranged.
- the second exposure is executed through the openings 502b and 502c of the mask 502.
- the widths Wd2 and We2 of the openings 502b and 502c in the mask 502 correspond to points Pd3 and Pe3 at the lower ends of the surface portions 105dc and 105ec of the banks 105d and 105e to be formed. It is defined by points Pd1 and Pe1 at each upper end.
- the surface portion 105d3 of the bank 105d on the subpixel planned region 1000a3 side and the surface portion 105e1 of the bank 105e on the subpixel planned region 1000b1 side are the surface portion 105b2 of the bank 105b, the surface portion 105c3 of the bank 105c, and the surface portion 105dc of the bank 105d.
- the inclination angle is larger than the surface portion 105ec of the bank 105e and the surface portion 105f1 of the bank 105f.
- ink (ink containing an organic light emitting material) 1060 a 1 for the opening (sub-pixel planned region 1000 a 1) partitioned by the bank 105 a and the bank 105 b is used, and the bank 105 b and the bank are used.
- Ink containing material 1060a3 and ink (ink containing organic light-emitting material) 1060b1 are simultaneously applied (dropped) to the opening (subpixel planned region 1000b1) partitioned by the banks 105e and 105f.
- the ink containing the organic light emitting material is simultaneously applied to the other planned subpixel regions.
- the surface portion 105e1 of the bank 105b the surface portion 105c3 of the bank 105c, the surface portion 105dc of the bank 105d, the surface portion 105ec of the bank 105e, and the surface portion 105f1 of the bank 105f.
- Pinning position Qa1 of ink 1060a1 with respect to surface 105a1 of bank 105a1, pinning position Qd3 of ink 1060a3 with respect to surface 105d3 of bank 105d, and bank 1 Pinning position Qe1 ink 1060b1 for 5e surface portion 105e1 is positioned higher than the other pinning position Qb1, Qb2, Qc2, Qc3, Qf1.
- the film thickness of the formed organic light emitting layer 106 can be increased. Unevenness can be prevented. That is, when the ink 1060a1, 1060a2, 1060a3, and 1060b1 are applied at the same time, in the planned subpixel area 1000a3, there is a non-pixel planned area 1000c to which no ink is applied on the left side, and the planned subpixel area 1000b1.
- each of the inclined angles ⁇ d3, ⁇ e1,... Of the surface portion 105a1 of the bank 105a, the surface portion 105d3 of the bank 105d, and the surface portion 105ec of the bank 105e is made larger than the others, thereby forming the organic light emitting layer 106 formed. Unevenness of the film thickness can be prevented.
- the inclination angle of the surface portion 105 on the subpixel 100a1 side in the bank 105a and the inclination of the surface portion 105d3 on the subpixel 100a3 side in the bank 105d are more than the inclination angles ⁇ b2, ⁇ c2, ⁇ c3, ⁇ dc, ⁇ ec, and ⁇ f1 of the other surface portions 105b2, 105c2, 105c3, 105dc, 105ec, and 105f1. It is set large.
- the surface portions 105b1, 105b2, 105c2, 105c3, 105dc, 105ec, and 105f1 are equal to each other.
- the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in all subpixels including the subpixels 100a1, 100a2, 100a3, and 100b1, and luminance unevenness is small.
- the display apparatus 1 which has the said effect is manufactureable.
- the inclination angles are made equal to each other within a range where the difference in luminance efficiency (luminance unevenness) of the subpixels 100 a 1, 100 a 2, 100 a 3, 100 b 1,. means.
- the inclination angles ⁇ dc and ⁇ ec of the surface portions 105dc and 105ec facing the non-pixel portion 100c are set to be larger than the inclination angles ⁇ d3 and ⁇ e1 of the surface portion 105d3 of the bank 105d and the surface portion 105e1 of the bank 105e. Since it is relatively gradual, it is possible to prevent step breakage or leakage current from occurring in the cathode electrode 108 continuously formed above the banks 105d and 105e. A reliable electrical connection with the bus bar 302 can be achieved.
- Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG.
- FIG. 12 shows a step corresponding to the step shown in FIG. 9C to FIG.
- a mask 503 is disposed thereon.
- the mask 503 is provided with light transmitting portions 503a, 503b1, 503b2, 503c1, and 503c2.
- Each light transmission portion 503a is provided corresponding to a location where the bank 105c is to be formed
- the light transmission portions 503b1 and 503b2 correspond to locations where the bank 105d is to be formed
- the light transmission portions 503c1 and 503c2 are
- the bank 105e is provided corresponding to the location where the bank 105e is to be formed.
- the width Wc of the light transmission portion 503a in the region corresponding to the region between the planned subpixel region 1000a2 and the planned subpixel region 1000a3 is the surface portion of the bank 105c to be formed. It is defined by points Pc1 and Pc2 at the lower ends of 105c2 and 105c3 (see FIG. 4).
- Is defined by points Pd2 and Pe2 at the lower ends of the surface portions 105dc and 105ec (see FIG. 4) of the banks 105d and 105e to be formed, and the widths Wd2 and We2 of the light transmitting portions 503b2 and 503c2 are The upper end points Pd1 and Pe1 and the lower end points Pd3 and Pe3 of the surface portions 105d3 and 105e1 (see FIG. 4) of the 105e are defined.
- the mask 503 is configured using a mask such as a halftone, and the light transmittances of the light transmitting portions 503a, 503b1, and 503c1 and the light transmitting portions 503b2 and 503c2 are different. Specifically, the light transmittance of the light transmitting portions 503b2 and 503c2 is larger than the light transmittance of the light transmitting portions 503a, 503b1, and 503c1.
- Banks 105b to 105f as shown in FIG. 10B can be formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then performing baking. That is, in the places exposed through the light transmitting portions 503b2, 503c2 where the light transmittance is set to be large, the above [Numerical formula 1] to [Several] than in the places exposed through the other light transmitting portions 503a, 503b1, 503c1. 4], the inclination angle of the side wall surface increases.
- the display device 1 can also be manufactured by the manufacturing method as described above.
- a mask 504 is disposed thereon.
- the mask 504 is provided with openings 504a, 504b, and 504c corresponding to the respective locations where the bank 105 is to be formed.
- the opening 504a is formed with the same width as the opening 501a of the mask 501 used in the manufacturing method of the above embodiment.
- the widths Wd3 and We3 of the openings 504b and 504c provided at the locations where the lines are to be formed are the banks 105d and 105e (see FIG. 4), as shown in the portion surrounded by the two-dot chain line in FIG. Are set so as to be larger than the width defined by the points Pd2, Pd3, Pe2, and Pe3 at the lower ends. Specifically, the width is increased at a location where the inclination angle is to be increased.
- the first exposure / development is executed with the mask 504 having the configuration shown in FIG. As a result, as shown in FIG. 13B, bank material layers 1051b to 1051f remain at locations corresponding to the openings 504a to 504c,.
- the inclination angles of the respective surface portions of the bank material layers 1051b to 1051f are uniform.
- the width of the bank material layers 1051d and 1051e in the X-axis direction is wider than the width of the bank material layers 1051a, 1051c and 1051f in the X-axis direction.
- a mask 505 is disposed thereon.
- the mask 505 is limited to portions (surface portion 105d3 of the bank 105d and surface portion 105e1 of the bank 105e) where the inclination angle is to be increased among the portions corresponding to the surface portions of the banks 105b to 105f,. Openings 505b and 505c are provided.
- Banks 105b to 105f,... As shown in FIG. 14B can be formed by performing the second exposure / development with the mask 505 and then baking. Thereby, the inclination angle of the surface portion 105d3 of the bank 105d and the surface portion 105e1 of the bank 105e is larger than the inclination angles of the other surface portions 105b2, 105c2, 105c3, 105dc, 105ec, and 105f1.
- the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
- the inclination angle of the bank side surface portion to be formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.
- the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.
- a horizontal axis shows a horizontal direction and a vertical axis
- shaft shows a height direction.
- each surface portion of the banks 105, 105a to 105f, 105x, and 105y is schematically shown as a plane, but the surface portion of the bank is not necessarily a plane. Also good.
- FIG. 16 (a) when the bank 605, and the surface between the point P 61 to a point P 62, and the surface between the point P 62 to a point P 63, intersects It will be.
- pinning position Qy1 during inking resides on the surface between the point P 62 to a point P 63.
- the inclination angle ⁇ y2 face portion which is formed when subtracting the imaginary straight line L 1 which passes through the point P 62 is important in relation to the pinning position.
- the angle ⁇ y1 in the formation of the bank 605, by controlling the angle ⁇ y1 the surface and forms between the point P 61 of the hole injection transport layer 104 and the bank 605 is an underlying layer to the point P 62, the angle ⁇ y2 also controlled Therefore, it is possible to obtain the above effect by controlling the inclination angle ⁇ y1 substantially. That is, in the case of forming against the angle ⁇ y1 shown in FIG. 16 (a), the bank 705 angle ⁇ y11 large surface between the point P 71 to a point P 72 is (FIG. 16 (b)), FIG. 16 (b), the angle ⁇ y12 the surface between the point P 72 to a point P 73 with respect to the virtual straight line L 2 also increases with respect to the angle ⁇ y2 in FIG 16 (a).
- the application area of the configuration in the display panel 10 is not limited.
- the configuration can be applied to the entire area in the display panel.
- the above configuration can also be applied to a region of a part.
- the display panel 10 can be formally divided into a region 10 a disposed in the center and a region 10 b disposed in the periphery thereof in the direction along the surface.
- the region 10a is connected to the source electrode or drain electrode of the TFT layer in which the anode electrode is formed, and contributes to light emission.
- the region 10b has the anode electrode below it.
- the region including the peripheral region 10a2 and the region 10b may be a pixel portion of about 0.5 [%] to several [%] (for example, 1 [%]) of the outer peripheral portion of the panel. This is because the film thickness variation of the organic light emitting layer in the case of not adjusting the tilt angle in the bank surface portion is taken into consideration.
- each configuration as an example is adopted in order to easily understand the configuration and the operation / effect of the present invention.
- the present invention except for essential parts, It is not limited to the said form.
- the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example.
- a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.
- the cathode electrode 108 When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.
- the specific external shape of the display device 1 is not shown, but it can be a part of the system as shown in FIG.
- the organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.
- the so-called line bank structure as shown in FIG. 3 is adopted as the form of the banks 105, 105a to 105f, 105x, 105y, 605, and 705.
- the display panel 80 can also be configured by using a pixel bank 805 including bank elements 805a extending in the Y-axis direction and bank elements 805b extending in the X-axis direction as shown in FIG.
- the adjustment of the inclination angle of the bank surface portion employed in the above embodiment and the first and second modifications is individually performed on the vapor concentration distribution in the ink application process and the drying process related to the formation of the organic light emitting layer during manufacturing. It can be changed accordingly. For example, due to the structure of the drying device, etc., when the flow of vapor during drying of the ink is in the direction from the outer periphery of the panel toward the center of the panel, it corresponds to the location where the film thickness of the organic light emitting layer increases. Then, the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.
- the inclination angle (taper angle) in the bank surface portion for each luminescent color (red, green, and blue). Since it is conceivable that the characteristics of the ink containing the light emitting material change, in this case, the inclination angle of the corresponding bank surface portion can be defined according to the ink characteristics of each light emission color.
- the bus bar 302 and the anode electrode 102 are made of the same material. However, they are not necessarily made of the same material. However, in the case of using the same material, it can be formed in the same process, which is excellent from the viewpoint of reducing manufacturing costs.
- the present invention is useful for realizing an organic light-emitting panel and an organic display device having little luminance unevenness and high image quality performance.
- Display device 10,80 Display panel 10a1. Central region of light emission 10a2. Light emitting peripheral area 10b. Dummy area 20. Drive control unit 21-24. Drive circuit 25. Control circuit 100a, 100b. Pixel portion 100a1 to 100a3, 100b1. Subpixel 100c. Non-pixel portion 101. Substrate 102. Anode electrode 103,303. Electrode coating layer 104. Hole injection layer 105, 105a to 105f, 105x, 105y, 605, 705, 805. Bank 106, 106x, 106y. Organic light emitting layer 107. Electron injection layer 108. Cathode electrode 109. Sealing layer 302. Bus bar 501-505. Masks 1000a, 1000b. Pixel planned areas 1000a1 to 1000a2, 1000b1. Sub-pixel planned area 1000c. Non-pixel scheduled areas 1050, 1051b, 1051c, 1051d, 1051e, 1051f. Bank material layers 1060a1 to 1060a3, 1060b1, 1060x, 1060y. ink
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Abstract
Description
本発明の一態様に係る有機発光パネルは、第1画素部と、第2画素部と、非画素部と、第1隔壁と、第2隔壁と、を備える。
本発明者は、[背景技術]において記載した有機発光パネルおよびこれを備える有機表示装置に関し、鋭意研究の結果、次のような知見を得た。
以下では、本発明を実施するための形態の一例について、図面を参酌しながら説明する。
本実施の形態に係る表示装置1の全体構成について、図1を用い説明する。
表示パネル10の構成について、図2を用い説明する。なお、本実施の形態に係る表示パネル10は、一例として、トップエミッション型の有機発光パネルを採用し、赤(R)、緑(G)、青(B)の何れか発光色を有する有機発光層を備える複数の画素部がマトリクス状に配置され構成されているが、図2では、一の画素部における一つのサブピクセル100を抜き出して描いている。
基板101は、例えば、無アルカリガラス、ソーダガラス、無蛍光ガラス、燐酸系ガラス、硼酸系ガラス、石英、アクリル系樹脂、スチレン系樹脂、ポリカーボネート系樹脂、エポキシ系樹脂、ポリエチレン、ポリエステル、シリコーン系樹脂、又はアルミナ等の絶縁性材料をベースとして形成されている。そして、基板101には、図示を省略しているが、TFT層およびパッシベーション膜、さらには、層間絶縁膜などが積層形成されている。
アノード電極102は、導電性材料からなる単層、あるいは複数の層が積層されてなる積層体から構成されており、例えば、Al(アルミニウム)やこれを含む合金、Ag(銀)、APC(銀、パラジウム、銅の合金)、ARA(銀、ルビジウム、金の合金)、MoCr(モリブデンとクロムの合金)、NiCr(ニッケルとクロムの合金)などを用い形成されている。なお、本実施の形態のように、トップエミッション型の場合には、高反射性の材料で形成されていることが好ましい。
電極被覆層103は、例えば、ITO(酸化インジウムスズ)を用い形成されており、アノード電極102のZ軸方向上部の表面の少なくとも一部を被覆する。
ホール注入輸送層104は、例えば、銀(Ag)、モリブデン(Mo)、クロム(Cr)、バナジウム(V)、タングステン(W)、ニッケル(Ni)、イリジウム(Ir)などの酸化物、あるいは、PEDOT(ポリチオフェンとポリスチレンスルホン酸との混合物)などの導電性ポリマー材料からなる層である。上記の内、酸化金属からなるホール注入輸送層104は、ホールを安定的に、またはホールの生成を補助して、有機発光層106に対しホールを注入および輸送する機能を有し、大きな仕事関数を有する。
バンク(隔壁)105は、樹脂等の有機材料で形成されており絶縁性を有する。バンク105の形成に用いる有機材料の例としては、アクリル系樹脂、ポリイミド系樹脂、ノボラック型フェノール樹脂等があげられる。そして、バンク105は、有機溶剤耐性を有することが好ましい。
有機発光層106は、アノード電極102から注入されたホールと、カソード電極108から注入された電子とが再結合されることにより励起状態が生成され発光する機能を有する。有機発光層106の形成に用いる材料は、湿式印刷法を用い製膜できる発光性の有機材料を用いることが必要である。
電子注入層107は、カソード電極108から注入された電子を有機発光層106へ輸送する機能を有し、例えば、バリウム、フタロシアニン、フッ化リチウム、あるいはこれらの組み合わせで形成されることが好ましい。
カソード電極108は、例えば、ITO、IZO(酸化インジウム亜鉛)などで形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。光透過性については、透過率が80[%]以上とすることが好ましい。
封止層109は、有機発光層106などが水分に晒されたり、空気に晒されたりすることを抑制する機能を有し、例えば、SiN(窒化シリコン)、SiON(酸窒化シリコン)などの材料を用い形成される。トップエミッション型の表示パネル10の場合においては、光透過性の材料で形成されることが好ましい。
図3に示すように、本実施の形態に係る表示パネル10では、一例としてライン状のバンク105を採用している。具体的には、バンク105は、各々がY軸方向に延伸形成され、X軸方向において隣接する画素部の各サブピクセル間を区画し、また、画素部と非画素部との間を区画している(図3では、非画素部については、図示を省略)。そして、各画素部内におけるサブピクセル100は、バンク105により区画された領域ごとに、発光色が異なるように形成されており、例えば、赤色(R)、緑色(G)、青色(B)の各発光色の3つのサブピクセルの組み合わせを以って、一つの画素部が構成されている。
表示パネル10における一部領域での構成について、図4を用い説明する。なお、図4は、図1における表示パネル10をA-A’断面で切断し、その一部を模式化した断面端面図である。
[数2] θe1>θf1
[数3] θd3>θdc
[数4] θe1>θec
[数5] θb2=θc2
[数6] θdc=θec
なお、本実施の形態では、それぞれの角度θb2,θc2,θc3,θd3,θdc,θec,θe1,θf1を、例えば、次のような範囲で設定することができる。
[数8] 35[°]<θd3<45[°]
[数9] 35[°]<θe1<45[°]
上記[数1]~[数9]の関係でバンク105a~105fの各々の面部105b2,105c2,105c3,105d3,105dc,105ec,105e1,105f1の傾斜角度θb2,θc2,θc3,θd3,θdc,θec,θe1,θf1を規定するのは、隣り合う画素部100aと画素部100bとの間に非画素部100cを配することと、後述するインク1060a1~1060a3,1060b1,・・の塗布形態によるものである。
バンク105における面部の傾斜角度θと有機発光層106の膜厚との関係について、図5および図6を用い説明する。なお、図5では、一つのサブピクセルの構造を模式的に描いている。
各バンク105x,105yで区画された開口部に有機発光材料を含むインク1060x,1060yを滴下(塗布)すると、各ピンニング位置Px,Pyの高さHx,Hyが次のような関係となる。
図5(c)に示すように、インク1060xを乾燥させると、ピンニング位置Pxの高さHxが相対的に低いことに起因して、形成される有機発光層106xでは、サブピクセルの中央部分が盛り上がり、その膜厚が厚みTxとなる。
上記の関係を図6に纏めて示す。図6に示すように、バンク105の面部における傾斜角度(テーパ角)θを小さくすれば、ピンニング位置の高さHが低くなり、結果的に得られる有機発光層106の膜厚Tが厚くなる。逆に、バンク105の面部における傾斜角度(テーパ角)θを大きくすれば、ピンニング位置の高さHが高くなり、結果的に得られる有機発光層106の膜厚Tが薄くなる。
本実施の形態に係る表示パネル10の製造方法について、図9、図10および図11を用い、特徴となる部分を説明する。なお、以下で説明を省略する製造工程については、従来技術として提案されている種々の工程を採用することが可能である。
図4に示すように、本実施の形態に係る表示装置1の表示パネル10では、バンク105aにおけるサブピクセル100a1側の面部105の傾斜角度、およびバンク105dにおけるサブピクセル100a3側の面部105d3の傾斜角度θd3、およびバンク105eにおけるサブピクセル100b1側の面部105e1の傾斜角度θe1を、他の面部105b2,105c2,105c3,105dc,105ec,105f1の傾斜角度θb2,θc2,θc3,θdc,θec,θf1よりも大きく設定されている。このため、図11に示すように、インク1060a1,1060a2,1060a3,1060b1,・・の塗布時において、ピンニング位置Qa1,Qd3,Qe1が、他のピンニング位置Qb1,Qb2,Qc2,Qc3,Qf1,・・よりも高くなる。
次に、図12を用い、表示装置1の製造方法の変形例1について説明する。図12は、図9(c)から図10(a)に示す工程に対応する工程を示す。
次に、図13および図14を用い、表示装置1の製造方法の変形例2について説明する。図13および図14は、図9(c)から図10(b)に示す工程に対応する工程を示す。
上記実施の形態および変形例1,2に係る各製造方法について、具体例を以って形成後のバンク形状について検証を行った。その結果について、図16を用い説明する。
先ず、上記実施の形態および変形例1,2では、バンク105,105a~105f,105x,105yの各面部が平面であると模式的に示したが、バンクの面部については、必ずしも平面でなくてもよい。例えば、図16(a)に示すように、バンク605の場合には、ポイントP61からポイントP62までの間の面と、ポイントP62からポイントP63までの間の面とが、交差することになる。この場合、インク塗布時におけるピンニング位置Qy1は、ポイントP62からポイントP63までの間の面に存する。そして、ポイントP62を通る仮想直線L1を引いたときに形成される面部の傾斜角度θy2が、ピンニング位置との関係で重要となる。
10,80.表示パネル
10a1.発光中央領域
10a2.発光周辺領域
10b.ダミー領域
20.駆動制御部
21~24.駆動回路
25.制御回路
100a,100b.画素部
100a1~100a3,100b1.サブピクセル
100c.非画素部
101.基板
102.アノード電極
103,303.電極被覆層
104.ホール注入層
105,105a~105f,105x,105y,605,705,805.バンク
106,106x,106y.有機発光層
107.電子注入層
108.カソード電極
109.封止層
302.バスバー
501~505.マスク
1000a,1000b.画素予定領域
1000a1~1000a2,1000b1.サブピクセル予定領域
1000c.非画素予定領域
1050,1051b,1051c,1051d,1051e,1051f.バンク材料層
1060a1~1060a3,1060b1,1060x,1060y.インク
Claims (12)
- 互いに発光色が異なる、一方側に位置し、対応するインクが塗布される第1発光部と、中央側に位置し、対応するインクが塗布される第2発光部と、他方側に位置し、対応するインクが塗布される第3発光部とが順に配列された複数の発光部を有し、各発光部が、第1電極を含む下地層と、前記下地層に対向して設けられ、発光色ごとに有機発光材料を含むインクが塗布されて形成された有機発光層と、前記有機発光層に対して前記下地層と反対側に設けられる第2電極と、前記下地層に対向して設けられ、前記複数の発光部のうちの隣り合う発光部を区画し、各発光部を規定する複数の隔壁とを備える、第1画素部と、
互いに発光色が異なる、一方側に位置し、対応するインクが塗布される第1発光部と、中央側に位置し、対応するインクが塗布される第2発光部と、他方側に位置し、対応するインクが塗布される第3発光部とが順に配列された複数の発光部を有し、各発光部が、第1電極を含む下地層と、前記下地層に対向して設けられ、発光色ごとに有機発光材料を含むインクが塗布されて形成された有機発光層と、前記有機発光層に対して前記下地層と反対側に設けられる第2電極と、前記下地層に対向して設けられ、前記複数の発光部のうちの隣り合う発光部を区画し、各発光部を規定する複数の隔壁とを備え、第1画素部とは異なる第2画素部と、
前記第1画素部と前記第2画素部との間に介挿され、有機発光層を含むことなく、前記第1電極とは分離された第3電極と、前記第2電極とを含み、前記第2電極と前記第3電極とが電気的に接続されている非画素部と、
前記第1画素部と前記非画素部との間に配設され、前記第1画素部の前記第3発光部と、前記非画素部とを区画する、前記複数の隔壁とは異なる第1隔壁と、
前記第2画素部と前記非画素部との間に配設され、前記第2画素部の前記第1発光部と、前記非画素部とを区画する前記複数の隔壁とは異なる第2隔壁と、
を有し、
前記第1画素部の第3発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する前記第1隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度は、第2発光部側に位置する隔壁における前記第1画素部の第2発光部側に面する面部の傾斜角度よりも大きく、
且つ、
前記第2画素部の第1発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する前記第2隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度は、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度よりも大きい、
ことを特徴とする有機発光パネル。 - 前記第1隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度は、前記第1隔壁における前記非画素部側に面する面部の傾斜角度よりも大きく、
且つ、
前記第2隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度は、前記第2隔壁における前記非画素部側に面する面部の傾斜角度よりも大きい、
請求項1記載の有機発光パネル。 - 前記第1画素部および前記第2画素部の各々では、
前記第2発光部を規定する隣り合う2つの隔壁における対向する面部の傾斜角度が等しい、
請求項1記載の有機発光パネル。 - 前記第1隔壁における前記非画素部側に面する面部の傾斜角度と、前記第2隔壁における前記非画素部側に面する面部における傾斜角度とは、等しい、
請求項1記載の有機発光パネル。 - 前記第1画素部および前記第2画素部の各々では、
前記第1発光部、前記第2発光部、および前記第3発光部が、各発光色に対応するインクが同時に塗布されて前記有機発光層が形成されてなる、
請求項1記載の有機発光パネル。 - 前記傾斜角度は、前記隔壁における各面部と、前記隔壁が形成されている前記下地層の上面とがなす角度である、
請求項1記載の有機発光パネル。 - 請求項1から請求項6の何れかに記載の有機発光パネルを備えた有機表示装置。
- 各々が複数の発光部を有する第1画素部および第2画素部と、当該第1画素部と第2画素部との間に介挿された非画素部とを有する有機発光パネルの製造方法であって、
基板上に、第1の電極を含む下地層を形成する第1工程と、
前記下地層の上に、感光性レジスト材料を積層する第2工程と、
前記積層された感光性レジスト材料をマスク露光してパターニングすることにより、前記第1画素部として、第1発光部に対応する第1開口、第2発光部に対応する第2開口、第3発光部に対応する第3開口を形成し、隣り合う発光部を区画して各発光部を規定する複数の隔壁を形成し、前記第2画素部として、第1発光部に対応する第1開口、第2発光部に対応する第2開口、第3発光部に対応する第3開口を形成し、隣り合う発光部を区画して各発光部を規定する複数の隔壁を形成し、前記第1画素部と前記第2画素部との間に非画素部に対応する開口を形成し、前記第1画素部と前記非画素部を区画する第1隔壁と、前記第2画素部と前記非画素部を区画する第2隔壁を形成する第3工程と、
前記第1画素部および第2画素部における,前記第1開口から前記第3開口のそれぞれに対して、有機発光材料を含むインクを滴下して乾燥させ、有機発光層を形成する第4工程と、
前記有機発光層の上方に、第2の電極を形成する第5工程と、
を有し、
前記第3工程では、
前記第1画素部の第3発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度よりも大きくなるように形成し、
且つ、
前記第2画素部の第1発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度よりも大きくなるように形成し、
前記第4工程では、
各発光色に対応する前記インクを、前記第1画素部および第2画素部における、前記第1開口から前記第3開口のそれぞれに対して同時に滴下し、有機発光層を形成する、
ことを特徴とする有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、
前記第1画素部の第3発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部に相当する部分への露光量を、第2発光部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部に相当する部分への露光量よりも大きくすることにより、
非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度よりも大きくなるように形成し、
且つ、
前記第2画素部の第1発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部に相当する部分への露光量を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部に相当する部分への露光量よりも大きくすることにより、
非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度よりも大きくなるように形成する、
請求項8記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料の露光に関し、
前記第1画素部の第3発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部に相当する部分への光の透過率を、第2発光部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部に相当する部分への光の透過率よりも小さくなるように、それぞれの面部に相当する部分に対して互いに異なるマスクを用いることにより、
非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度よりも大きくなるように形成し、
且つ、
前記第2画素部の第1発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部に相当する部分への光の透過率を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部に相当する部分への光の透過率よりも小さくなるように、それぞれの面部に相当する部分に対して互いに異なるマスクを用いることにより、
非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度よりも大きくなるように形成する、
請求項8記載の有機発光パネルの製造方法。 - 前記第3工程では、
前記感光性レジスト材料を露光して現像した後、
前記第1画素部の第3発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部に相当する部分に対し、露光処理を追加して行うことにより、
非画素部側に位置する隔壁における前記第1画素部の第3発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁の対向する面部の傾斜角度よりも大きくなるように形成し、
且つ、
前記第2画素部の第1発光部を規定する隣り合う2つの隔壁に関し、非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部に相当する部分に対し、露光処理を追加して行うことにより、
非画素部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度を、第2発光部側に位置する隔壁における前記第2画素部の第1発光部側に面する面部の傾斜角度よりも大きくなるように形成する、
請求項8記載の有機発光パネルの製造方法。 - 請求項8から請求項11の何れかに記載の製造方法により得られた有機発光パネルを備えた有機表示装置。
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KR20130073014A (ko) | 2013-07-02 |
CN102577614A (zh) | 2012-07-11 |
JPWO2012049717A1 (ja) | 2014-02-24 |
CN102577614B (zh) | 2015-11-25 |
JP5677317B2 (ja) | 2015-02-25 |
KR101743789B1 (ko) | 2017-06-05 |
US20120138973A1 (en) | 2012-06-07 |
US8604492B2 (en) | 2013-12-10 |
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