WO2012042568A1 - Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine - Google Patents

Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine Download PDF

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Publication number
WO2012042568A1
WO2012042568A1 PCT/JP2010/005854 JP2010005854W WO2012042568A1 WO 2012042568 A1 WO2012042568 A1 WO 2012042568A1 JP 2010005854 W JP2010005854 W JP 2010005854W WO 2012042568 A1 WO2012042568 A1 WO 2012042568A1
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WO
WIPO (PCT)
Prior art keywords
mold
temperature
thermoplastic resin
optical encoder
resin component
Prior art date
Application number
PCT/JP2010/005854
Other languages
English (en)
Japanese (ja)
Inventor
芳直 立井
村上　治
制 東岡
博康 川瀬
保敏 武田
佐土根　俊和
庫宇祐 社本
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2010/005854 priority Critical patent/WO2012042568A1/fr
Priority to TW099136899A priority patent/TW201213092A/zh
Publication of WO2012042568A1 publication Critical patent/WO2012042568A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
    • G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
    • G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
    • G01D5/34707—Scales; Discs, e.g. fixation, fabrication, compensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling

Definitions

  • the present invention relates to a method for manufacturing a resin component including a molding process, and an optical encoder including the resin component.
  • the resin material used for the code plate of the optical encoder is required to have high heat resistance and oil resistance.
  • FIG. 4 is a graph showing the relationship between the temperature (° C.) and the elastic modulus E ′ (MPa) of each thermoplastic resin.
  • the glass transition temperatures of polyetherimide, polyethersulfone, and polyphenylsulfone proposed in Patent Document 1 are 217 ° C., 225 ° C., and 220 ° C., respectively, which are the highest among thermoplastic resins. For this reason, when these thermoplastic resins are used for the code plate of the optical encoder, it is necessary to heat the thermoplastic resin flow to a temperature of about 400 ° C. during the injection molding of the code plate. Further, in order to maintain the fluidity of the thermoplastic resin during the injection molding of the code plate, it is necessary to heat the mold to a temperature near the glass transition temperature of the thermoplastic resin (ie, about 200 to 210 ° C.). .
  • FIG. 5 shows an X-ray diffraction profile of a mold used for molding a polyetherimide.
  • the presence of crystallized material of the mold material can be confirmed at two peaks, indicating that the embrittlement has progressed.
  • the quality of the optical encoder is degraded.
  • thermoplastic resin having a glass transition temperature of 155 ° C. or higher and 190 ° C. or lower is heated to a temperature of the glass transition temperature or higher and 360 ° C. or lower of the thermoplastic resin, and the mold is heated to 180 ° C. It was heated to the following temperature and provided with a molding step for molding the thermoplastic resin with the mold.
  • the optical encoder in the present invention includes a resin component manufactured by the manufacturing method described above.
  • the mold temperature can be lowered at the time of molding the resin, it is possible to suppress the progress of crystallization of nickel or nickel phosphorus, which is the mold material. Thereby, the lifetime of a metal mold
  • FIG. 3 is an enlarged cross-sectional view showing a main part of a mold 1 in Embodiment 1.
  • FIG. 1 is a perspective view of an optical encoder 10 according to Embodiment 1.
  • FIG. 3 is an AA cross-sectional enlarged view of FIG. 2. It is a graph which shows the relationship between the temperature (degreeC) and elastic modulus E '(MPa) of each thermoplastic resin. It is a graph which shows the X-ray-diffraction profile of the metal mold
  • Embodiment 1 FIG. A first embodiment of the present invention will be described with reference to FIGS.
  • FIG. 1 is an enlarged cross-sectional view showing a main part of a mold 1 in the first embodiment.
  • the mold 1 includes a mold body 2 having a space portion formed therein, and a movable block 3 that is slidably fitted into the space portion of the mold body 2 and forms a cavity 6 in the mold body 2.
  • the mold body 2 and the movable block 3 contain nickel or nickel phosphorus in their materials.
  • the mold body 2 has a flat molding surface 2 a on the surface facing the movable block 3.
  • the movable block 3 is formed with a molding surface 3a having a shape in which a plurality of V-shaped grooves are arranged at equal intervals on the surface of the mold body 2 facing the molding surface 2a. Each V-shaped groove has a width of about 2 ⁇ m.
  • the mold body 2 and the movable block 3 are provided with a heater 4 and a heater 5, respectively.
  • the movable block 3 is slidable in the vertical direction in FIG.
  • the mold body 2 and the movable block 3 are heated by the heater 4 and the heater 5, respectively.
  • the temperature of the mold body 2 and the movable block 3 may be a temperature of 180 ° C. or less. Further, the temperature of the mold body 2 and the movable block 3 may be different from each other. For example, the temperature of the movable block 3 having the fine-shaped molding surface 3a is made higher than the temperature of the mold body 2. Also good.
  • thermoplastic resin having a glass transition temperature of 155 ° C. or higher and 190 ° C. or lower is used.
  • thermoplastic resins include polysulfone having a glass transition temperature of 185 ° C. and transparent nylon having a glass transition temperature of 160 ° C., as shown in FIG. And the temperature of the thermoplastic resin at this time should just be the temperature more than the glass transition temperature of this thermoplastic resin and 360 degrees C or less.
  • the temperature of the thermoplastic resin at the time of injection molding is 300 ° C. or more and 360 °. It is desirable that the temperature is not higher than ° C. In this case, the temperature of the mold during the injection molding is desirably 140 ° C. or higher and 180 ° C. or lower.
  • FIG. 5 shows not only the X-ray diffraction profile of the mold used for molding the polyetherimide, but also the X-ray diffraction profile of the mold used for molding the resin according to the present invention.
  • the X-ray diffraction profile of the mold used for molding the resin according to the present invention does not have a peak as seen in the X-ray diffraction profile of the mold used for molding the polyetherimide. That is, according to the present invention, it can be seen that the crystallization of the mold material has not progressed.
  • the temperature of the thermoplastic resin is set to 300 to 360 ° C. and the temperature of the mold 1 is set to 140 to 180 ° C. at the time of injection molding.
  • the mold temperature can be lowered during injection molding. Therefore, the progress of crystallization of nickel or nickel phosphorus, which is a mold material, can be suppressed, and the life of the mold 1 can be extended.
  • it can suppress that the metal mold
  • FIG. 2 is a perspective view of the optical encoder according to the first embodiment.
  • FIG. 3 is an enlarged cross-sectional view taken along the line AA in FIG.
  • the optical encoder 10 includes a code plate 11, a projector 12, and a light receiver 13.
  • the code plate 11, which is a disk-shaped resin part, is attached to the rotating shaft 20 of the motor and is rotated by the rotation of the rotating shaft 20.
  • the code plate 11 is made of a thermoplastic resin having a glass transition temperature of 155 ° C. or higher and 190 ° C. or lower, and is manufactured through the above-described injection molding process. As shown in FIG.
  • a code pattern 11a having a shape in which a plurality of V-shaped protrusions are arranged at equal intervals is formed on the upper surface of the code plate 11.
  • Each V-shaped protrusion of the code pattern 11a has a width of about 2 ⁇ m.
  • the bottom surface of the code plate 11 is formed flat.
  • the projector 12 is composed of, for example, an LED, and includes a projector main body 12a in which a circuit is stored, and a lens 12b that is a resin component.
  • the light projector 12 and the light receiver 13 are fixed at a fixed position in a state of facing each other with the code plate 11 interposed therebetween.
  • the projector 12 emits light 3
  • the light 3 enters the bottom surface of the code plate 11.
  • a part of the light 3 passes through the flat portion of the code pattern 11 a on the upper surface of the code plate 11 and is received by the light receiver 13.
  • the remaining light 3 is reflected by the V-shaped projections of the code pattern 11 a on the upper surface of the code plate 11 and passes through the bottom surface of the code plate 11.
  • solubility parameter (Solubility parameter: SP value) of polysulfone is about 18.
  • the SP value of transparent nylon is about 13.
  • Embodiment 1 since the mold temperature during injection molding can be lowered, the progress of crystallization of nickel or nickel phosphorus, which is a mold material, can be suppressed. Thereby, the lifetime of a metal mold
  • die 1 shown in FIG. 1 is only what showed the concept, and may consist of structures other than this.
  • Embodiment 1 demonstrated the case where the code plate 11 of FIG. 2 was manufactured by injection molding, this invention is applicable also when manufacturing other resin components by injection molding.
  • the present invention can be applied to the case where the lens 12b of the projector 12 shown in FIG. 2 is manufactured by injection molding.
  • optical encoder 10 in Embodiment 1 is a rotary optical encoder, it is not limited to this.
  • a linear scale optical encoder may be used.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Optical Transform (AREA)

Abstract

L'invention porte sur un procédé de production d'un élément en résine qui comprend une étape de moulage consistant à chauffer une résine thermoplastique ayant une température de transition vitreuse non inférieure à 155°C et non supérieure à 190°C à une température non inférieure à la température de transition vitreuse de la résine thermoplastique et non supérieure à 360°C, chauffer un moule à pas plus de 180°C et mouler la résine thermoplastique à l'aide du moule. En outre, la présente invention porte sur un codeur optique qui comprend un élément en résine qui est produit par le procédé de production. Ceci permet d'allonger la vie du moule et permet d'obtenir un élément en résine ayant une bonne précision de forme et un codeur optique de haute qualité qui comprend cet élément.
PCT/JP2010/005854 2010-09-29 2010-09-29 Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine WO2012042568A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2010/005854 WO2012042568A1 (fr) 2010-09-29 2010-09-29 Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine
TW099136899A TW201213092A (en) 2010-09-29 2010-10-28 Method of preparing resin part and optical encoder provided with the resin part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/005854 WO2012042568A1 (fr) 2010-09-29 2010-09-29 Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine

Publications (1)

Publication Number Publication Date
WO2012042568A1 true WO2012042568A1 (fr) 2012-04-05

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PCT/JP2010/005854 WO2012042568A1 (fr) 2010-09-29 2010-09-29 Procédé de production d'un élément en résine et codeur optique comprenant l'élément en résine

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WO (1) WO2012042568A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6639750B1 (ja) * 2019-04-11 2020-02-05 三菱電機株式会社 エンコーダ

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08230034A (ja) * 1995-03-01 1996-09-10 Canon Inc 光学式スケール及びその製造方法
JP2004171672A (ja) * 2002-11-20 2004-06-17 Mitsubishi Gas Chem Co Inc ディスク基板の製造方法
JP2004309302A (ja) * 2003-04-07 2004-11-04 Fanuc Ltd 光学式エンコーダのコード板、及びコード板の金型
JP2005238456A (ja) * 2004-02-24 2005-09-08 Sumitomo Chemical Co Ltd 偏肉大型導光板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08230034A (ja) * 1995-03-01 1996-09-10 Canon Inc 光学式スケール及びその製造方法
JP2004171672A (ja) * 2002-11-20 2004-06-17 Mitsubishi Gas Chem Co Inc ディスク基板の製造方法
JP2004309302A (ja) * 2003-04-07 2004-11-04 Fanuc Ltd 光学式エンコーダのコード板、及びコード板の金型
JP2005238456A (ja) * 2004-02-24 2005-09-08 Sumitomo Chemical Co Ltd 偏肉大型導光板の製造方法

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