WO2012027937A1 - Led integrative structure with cooling device - Google Patents

Led integrative structure with cooling device Download PDF

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Publication number
WO2012027937A1
WO2012027937A1 PCT/CN2010/079795 CN2010079795W WO2012027937A1 WO 2012027937 A1 WO2012027937 A1 WO 2012027937A1 CN 2010079795 W CN2010079795 W CN 2010079795W WO 2012027937 A1 WO2012027937 A1 WO 2012027937A1
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WO
WIPO (PCT)
Prior art keywords
lens
cooling
flow path
led chip
heat dissipation
Prior art date
Application number
PCT/CN2010/079795
Other languages
French (fr)
Chinese (zh)
Inventor
杨东佐
Original Assignee
Yang Dongzuo
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Filing date
Publication date
Application filed by Yang Dongzuo filed Critical Yang Dongzuo
Publication of WO2012027937A1 publication Critical patent/WO2012027937A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/06—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the lampholder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Definitions

  • the invention relates to an LED integrated structure with a cooling device for illumination, a backlight module, a television set, an LED dot matrix display screen, a projection device, etc., in particular to a cooling device with a high-power LED integrated structure .
  • LED light source especially high-power LED light source
  • the heat is concentrated when the light is emitted. If the heat generated by the LED chip is not released in time, the temperature of the LED light source is too high, which will lead to the LED light reduction and low life, so how to The heat generated by the LED chip is quickly and effectively dissipated and becomes a bottleneck for popularizing LED light sources. How to improve the light efficiency of LED light sources and how to improve the heat dissipation performance of LED light sources to prolong the service life is an important technical problem in the industry.
  • the existing solution to the problem of heat dissipation of the LED light source is to improve the integrated structure of the LED, so that the heat generated by the LED light source is more easily emitted, and the other solution is to increase the cooling structure.
  • the existing LED high-power LED integrated structure with cooling device is usually re-integrated by a single individual LED light-emitting tube packaged by a bracket.
  • an LED package device comprises: an LED die and a high thermal conductivity material. And a heat dissipation base for the die contact, an electrode holder, a positioning unit and a covering body.
  • the heat sink base is made of a highly thermally conductive material such as metal or ceramic, and includes a recessed portion of the chassis, the body, and the top surface of the body. The crystal grains are placed on the bottom surface of the depressed portion.
  • the electrode holder is punched out from a metal material, and includes a substrate and a positioning wall extending axially from the periphery of the hollow portion of the substrate and defining an accommodation space.
  • the positioning unit is disposed on at least one of the heat dissipation base and the electrode holder, so that the heat dissipation base is embedded and fixed in the accommodating space of the electrode holder.
  • the positioning unit may be at least one card-bump bump protruding from the inner wall surface of the positioning wall of the electrode holder, or It includes a flange that projects radially outward from the top surface of the heat sink base.
  • the covering body is formed by injection molding, and the heat-dissipating base fixed to each other is combined with the electrode holder portion.
  • the existing LED package device, heat sink base and electrode holder combination and method thereof have the following defects and deficiencies:
  • the die passes through the stepped column-shaped heat sink base as the first heat sink. Since the columnar heat sink base does not directly contact the air to dissipate heat, and has a certain solid metal length, it requires a long metal conduction heat dissipation distance. The heat is emitted to the air, and the contact area of the heat dissipation base with the air is small, so the heat generated when the crystal grains emit light has a heat accumulation effect. In order to improve the heat dissipation performance, the heat dissipation base generally needs to design other heat dissipation materials such as metal or ceramics that are in direct thermal conduction contact with the heat dissipation base, and finally dissipate heat through the heat dissipation member.
  • the heat dissipation base In order to improve the heat dissipation performance, the heat dissipation base generally needs to design other heat dissipation materials such as metal or ceramics that are in direct thermal conduction contact with the heat dissipation base, and
  • this method increases the distance of heat conduction and heat dissipation.
  • the heat dissipation base and the heat sink are divided into two parts, the two are bonded together with the thermal conductive glue, and there is still a huge thermal resistance.
  • the temperature of the heat sink base is kept high, and the temperature of the heat sink is similar to the ambient temperature.
  • the heat on the heat sink base is not quickly dissipated, and the heat dissipation effect is poor.
  • Application No. 200720172030 discloses a package structure of a pin-type high-power LED device, including an LED chip, a lens, a printed PCB board, a metal heat sink body, a gold wire and a lead;
  • the metal heat sink body includes a base and the base a boss on the seat, and the upper surface area of the base is at least twice the area of the upper surface of the boss;
  • the printed PCB board is glued to the base; and the through hole is disposed on the base below the printed PCB board.
  • the through-hole pin is electrically connected to the printed PCB board; the lens cover LED chip and the printed PCB board are adhered to the printed PCB board by a potting process.
  • This high-power pin-type high-power LED device although increasing the base area of the metal heat sink body, has a poor heat dissipation effect, even if a heat sink is additionally disposed, the heat on the LED chip must be conducted due to heat dissipation.
  • the bump and the base are transferred to the metal heat sink body, and then transferred to the heat sink by the metal heat sink body. Since the heat transfer increases the intermediate link and the very long heat transfer path corresponding to the thick metal heat transfer body, the thermal resistance is high and the heat conduction effect is poor.
  • the pin should be electrically connected to the layout circuit above the printed PCB board and pass through the printed PCB board and the metal heat sink body. The processing is complicated and the process is difficult. The electrical connection between the LED chip and the layout circuit on the printed PCB needs to pass through the electrode.
  • the bracket has a complicated structure and many thermal resistances in the middle part.
  • the COB (Chip on Board) package design of the LED integrated structure with the cooling device is proposed in the prior art.
  • the invention directly fixes the chip on the substrate by silver glue or eutectic solder, the thermal resistance of the intermediate link can be minimized, thereby reducing the LED.
  • the thermal resistance of the chip pn junction to the external environment can improve heat dissipation efficiency and luminous efficiency.
  • COB Chip on Board
  • the advantage of this COB (Chip on Board) package design is that the electrodes of each LED chip form an ohmic contact directly with the metal pad through the bonding electrode leads, and the formation of the multi-channel LED chip array is through the heat dissipation substrate and the LED chip.
  • the connecting device realizes electrical interconnection, which can realize series-parallel connection of LED chips, and can improve product reliability and yield.
  • the outer shape is small, the thickness is thin, and the assembly is easy, and it can be used for occasions where the size of the light source assembly is high, such as illumination and display.
  • the invention patent of the application No. 200920112089. 5 discloses a device for a high-power LED street lamp of a C0B package, including a lens, a silicone, a gold wire, a chip, a heat sink, etc., and 5 to 50 convexities are arranged on the heat dissipation plate.
  • the chip is directly fixed on the boss of the heat sink, and then radiated through the heat sink and the heat sink on the heat sink.
  • the high-power LED street lamp of this structure has better heat dissipation effect.
  • the positioning of the lens is not accurate, and the silicon dioxide is pre-pointed in the lens to encapsulate the chip.
  • a high-power LED package structure with high-efficiency heat-dissipating illumination which comprises a lens, a substrate and an LED light-emitting chip.
  • the lens is fixed on the upper surface of the substrate, and the lower surface of the lens is provided with an upward convex surface.
  • the recess is mounted, the LED light-emitting chip is placed on the upper surface of the substrate and the recessed cover is mounted, and the upper and lower negative-emitting electrodes are disposed on the upper surface of the substrate that is fastened by the mounting recess, and the light-emitting electrode and the LED light-emitting chip are connected by a metal wire, and the upper surface of the substrate
  • the positive and negative connecting electrodes connected to the illuminating electrode are disposed, and the lower surface of the lens outside the mounting recess and the upper surface of the substrate are bonded by an annular adhesive layer, and the inner hole and the mounting recess formed in the adhesive layer are formed.
  • the cavity is filled with silica gel, and a glue injection channel is formed on the substrate to communicate with the inner hole of the adhesive layer and the cavity formed by the mounting recess, and the lens and the substrate are both made of crystal crystal.
  • the high-power LED package structure of this structure has the disadvantage that the fixing of the lens and the substrate is adhered by the adhesive layer, and the bonding is not firmly fixed; the second disadvantage is that the positioning mechanism of the positioning lens is not positioned when the lens is bonded to the substrate.
  • the positioning is not accurate, and the position of the lens is easily deviated during the filling;
  • the third disadvantage is that the lens is fixed on the substrate through the adhesive layer, the adhesive layer is easy to block the injection passage, affecting the injection of the silica gel;
  • the disadvantage is that the LED is electrically connected to the LED light-emitting chip.
  • the metal wire is electrically connected to the light-emitting electrode fixed on the substrate and disposed in the mounting recess of the lens, and the light-emitting electrode is electrically connected to the connecting electrode, and the connecting electrode is electrically connected to the conductive layer of the layout circuit, and the intermediate link is More thermal resistance, affecting heat dissipation efficiency and luminous efficiency.
  • a high-power LED light-emitting diode which comprises an aluminum substrate, a silver paste, a wafer, a gold wire, a reflective cover, and the aluminum substrate has a convex-concave cup shape, that is, at the center thereof.
  • the bottom surface has a circular groove, and a corresponding cup top has a cup-shaped boss.
  • the boss is provided with a plastic frame, the plastic frame is circular, the center is provided with a circular hole, and the groove is concentric with two grooves, inside and outside. Forming two low-high convex edges, the bottom surface is symmetrically provided with two cylindrical legs, and is mounted in a circular hole on both sides of the cup-shaped boss.
  • the curved surface of the reflective cover is smaller than the flat cover, and the lower edge is coated with glue.
  • Glue packed in the groove of the plastic frame.
  • the bottom of the plastic frame is coated with adhesive glue filled with glue.
  • the distance between the illuminant wafer and the bottom surface of the reflective cover is small.
  • the aluminum substrate may be in the shape of a plum or a circle. The assembly procedure of the patent is to first place the silver glue into the boss cup of the aluminum substrate, fix the wafer on the silver paste, and bake it in the oven for 145 C for 1 hour, then solder the gold wire to fix the lens.
  • the negative electrode is respectively soldered on the positive and negative electrodes of the aluminum substrate with gold wire, and the plastic frame is The bottom surface is coated with adhesive glue, inserted into the positioning hole of the aluminum substrate, the glue is filled into the plastic frame for baking, and then the reflective cover is coated with adhesive glue, and can be used by being inserted into the groove of the plastic frame.
  • adhesive glue which is not resistant to high temperature in the subsequent packaging process, and the reliability of the fixing under high temperature conditions is greatly affected; There is no glue filling channel on the plastic frame. Fill the glue before filling the reflector. If the mold is not used, the shape of the glue cannot be controlled. If the mold is used to fill the glue, the cost is high.
  • the third disadvantage is that the glue will be filled.
  • the reflective cover is coated with adhesive glue and fixed in the groove of the plastic frame.
  • the fixing is unreliable, the positional relationship is fixed inaccurately, and there is a gap between the reflective cover and the glue, and there is air in the gap, that is, reflection.
  • the aluminum substrate in the invention patent has a cup shape, and has only one boss on the upper surface, and the gold wire is electrically connected to the positive and negative electrodes of the aluminum substrate, and the positive and negative electrodes of the aluminum substrate are viewed from the text and the contents disclosed in the figure. It is not a conductive layer of the layout circuit, but a light-emitting electrode or a bracket-type bow and the like as disclosed in the 200820214808.
  • the existing problem of improving the heat dissipation of the LED integrated structure by adding a cooling device is to use a fan to dissipate heat, one is to use a semiconductor refrigerating piece to dissipate heat, and the other is to use a cooling channel to dissipate heat. Cooling with a fan, because the cooling temperature depends on the ambient temperature, the high-power LED integrated structure, the cooling effect is not good, and even the cooling requirements cannot be achieved.
  • a heat dissipation structure and an LED lamp having the heat dissipation structure are disclosed.
  • the heat dissipation structure of the utility model comprises a cavity, a cooling solution is accommodated therebetween, and is provided with An even number of baffles are formed to form a channel, the channels being connected in an S-shape and having at least one row of hot zones, at least one heated zone, and at least one buffer zone.
  • the utility model is provided with a cooling flow channel, neither the cooling medium flow device is driven to quickly exchange the cooling medium in the flow channel, and the cooling medium in the flow channel cannot be cooled by the heat removal zone on both sides of the cavity.
  • the different specific gravity of the medium is used for rapid exchange of cold and hot cooling medium.
  • the cold and heat exchange of the cooling medium is exchanged by the heat conduction of the cooling medium, and the heat dissipation area of the heat removal area placed on both sides of the cavity is small, when the heat generated by the LED chip is generated.
  • the cold and heat exchange of the cooling medium is very slow, so the LED is The cooling effect of the chip is not good.
  • a conventional heat sink for cooling an LED chip by using a semiconductor cooling device generally has a semiconductor cooling fin completely covering the back surface of the LED chip. Since the power of the LED chip is small and the power of the semiconductor cooling device is large, the existing semiconductor is used.
  • the cooling device uses a high-power semiconductor cooling device to cool a low-power LED chip, which is uneconomical.
  • an LED lamp with controllable temperature of the lamp body is disclosed, which comprises an LED lamp body and a driving power source for supplying DC power to the LED lamp body, and one or more energy can be attached to the LED lamp body.
  • a semiconductor wafer that achieves a cooling or heating function and maintains a constant temperature of the LED lamp body.
  • the utility model solves the problem of cooling of the LED lamp body by using one or more semiconductor sheets, since the semiconductor wafer is directly attached to the lamp body without a cooling flow path, heat exchange between the LED chip and the semiconductor wafer can only pass through the solid medium. Conductive exchange, due to the slow conduction of solid conductive heat exchange, the cooling effect of such a semiconductor wafer on the LED chip is not good.
  • the LED chip integrated structure has a poor optical effect and the cooling device has a poor cooling effect.
  • the technical problem to be solved by the present invention is to provide a small thermal resistance of the intermediate link, good heat dissipation, and direct electrical connection of the conductive layer of the chip to the layout circuit. Reflow soldering or wave soldering is not required.
  • the encapsulant can be made of resin or silica gel.
  • the positional relationship between the lens and the chip is accurate, the luminous flux is high, the structure is simple, the assembly is simple, the heat dissipation effect is good, the optical effect is good, and the LED chip has good heat dissipation.
  • LED integrated structure with cooling device LED integrated structure with cooling device.
  • An LED integrated structure with a cooling device comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming
  • One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate.
  • the fixing post passes through the second through hole of the heat dissipation substrate, and the end portion of the fixing column is provided with a resisting portion; the plastic piece of the positioning lens or the forming lens is fixed by The pillar and the resisting portion are fixed to the heat dissipating substrate; the LED chip is directly fixed on the heat dissipating substrate by the die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends into the sidewall of the first through hole and the LED chip Between the wires is placed in the first through hole, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip;
  • the cooling substrate faces away from the flow channel housing on one side of the LED chip, the cooling flow path formed between the flow path housing and the heat dissipation substrate, and the driving cooling medium flowing device that drives the cooling medium in the cooling flow path to flow rapidly; the back surface of the LED chip is completely
  • the flow path housing is a flow path plate
  • the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip.
  • the driving cooling medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate,
  • the gear shaft of the first gear or the gear shaft of the second gear passes through the flow passage plate from the bottom of the groove and is hermetically sealed or liquid-tight with the flow passage plate.
  • the flow path housing is a flow path plate
  • the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip.
  • the driving cooling medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate, A magnet for rotating the first gear or the second gear is disposed between the driving motor and the first gear or the second gear, and the magnet is magnetically fixed with the first gear or the second gear;
  • the flow path plate is a non-magnetic material.
  • the driving cooling medium flow device comprises a stirring impeller placed in the cooling flow passage and mounted on the flow path housing, and a driving motor disposed on a side facing away from the cooling flow passage to drive the stirring impeller to rotate, stirring
  • the impeller shaft of the impeller is hermetically sealed or fluidly sealed through the runner housing and the runner housing.
  • the driving cooling medium flow device comprises a stirring impeller placed in the cooling flow passage and mounted on the flow path housing, and arranged on the side facing away from the cooling flow passage to drive the stirring.
  • the driving motor for rotating the impeller is provided with a magnet for rotating the stirring impeller between the driving motor and the stirring impeller, and magnetically fixed between the magnet and the stirring impeller;
  • the flow path housing is a non-magnetic material.
  • a cooling fan is disposed on the outer wall of the flow path housing, the cooling medium is a cooling medium that is not cooled, the flow path housing is a heat dissipating member, and the flow path housing is directly in contact with the air.
  • the flow path housing is a flow path plate
  • the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the driving cooling medium flow device is installed in the groove;
  • the side of the flow channel plate facing away from the groove corresponds to the heat dissipating rib of the flow channel plate, and the cooling flow channel is a rugged cooling flow channel;
  • the side of the flow plate back is also provided with a guide on the side of the discrete thermal substrate.
  • the wind deflector, the air deflector and the flow channel plate form a duct parallel to the groove; a cooling fan is installed on one side of the air duct; the cooling medium is a cooling medium that is not cooled, the flow channel plate is a heat sink, and the flow channel plate faces away from One side of the groove is in direct contact with the air.
  • the flow path housing is a flow path plate
  • the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip.
  • Cooling device further comprises a refrigerating device, wherein the refrigerating device is mounted on one side of the discrete thermal substrate on the back of the flow channel, and the heat absorbing end of the refrigerating device is thermally conductively attached to the flow channel plate and disposed on the back of the circulating flow channel At a fixed position, the cooling medium is a liquid.
  • the refrigerating apparatus further includes a semiconductor refrigerating device or a magnetic refrigerating device, and a heat dissipating fin disposed on one side of the discrete hot substrate of the flow path plate; the heat absorbing end of the refrigerating device is thermally conductively attached to the back surface of the groove of the flow path plate The heat dissipating end of the refrigerating device is thermally conductively attached to the heat sink.
  • the refrigerating device includes a semiconductor refrigerating device or a magnetic refrigerating device; a heat dissipating plate is further disposed on a side of the flow plate back of the discrete thermal substrate, and a cooling groove is further disposed on a side of the heat dissipating plate facing away from the flow channel plate to dissipate heat
  • the side of the plate away from the flow channel plate is further provided with a sealing plate for sealing the cooling groove, and the heat absorption end of the refrigeration device can be thermally coupled to the back surface of the cooling flow channel of the flow channel plate, and the heat dissipation end of the refrigeration device can be thermally coupled On the heat sink.
  • a cooling medium inlet and a cooling medium outlet communicating with the cooling flow passage are further disposed on the flow path housing, and the cooling medium inlet and the cooling medium outlet are in communication with the external cooling medium.
  • the cooling device further includes a refrigerating device, a cooling medium port disposed on the flow path housing and communicating with the cooling flow channel, and the cooling medium of the refrigerating device is connected to the cooling flow channel through the cooling medium port, the cooling medium The circulation of the cooling flow path and the refrigerating device is driven by the driving of the cooling medium flow device.
  • a cooling medium inlet and a cooling medium outlet communicating with the cooling flow passage are also provided, and the cooling medium inlet and the cooling medium outlet are in communication with the external cooling medium.
  • one or more bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the LED chip is directly fixed on the end surface of the boss by a die bonding process; Inside the first through hole.
  • the PCB board is further disposed on the PCB board, and the third through hole is matched with the fixing post on the PCB board, and the fixing column passes through the PCB board in sequence.
  • the third through hole on the third through hole and the fourth through hole on the heat dissipation substrate, and then the heat dissipation substrate and the PCB board are placed in the mold of the plastic part forming the positioning lens or the molded lens by heat, and the plastic part of the positioning lens or the molding lens is formed.
  • the part is formed with a resisting portion.
  • the package colloid for packaging the LED chip and the wire is further included; the lens is fixed to the plastic part of the positioning lens or the molding lens by tight fitting with the first through hole or by hot pressing by a crimper.
  • the plastic injection member of the positioning lens or the molded lens is provided with a glue injection channel for injecting the package colloid at a position corresponding to the first through hole, and the rubber port of the injection injection channel is placed on the side of the plastic part of the positioning lens or the molded lens away from the resisting portion.
  • the glue port and the glue injection channel communicate with the inner side wall of the first through hole; after the encapsulant is injected, the encapsulant further fixes the lens; and the heat dissipating substrate is formed in a mold of the plastic part forming the positioning lens or the molded lens.
  • the lens or the plastic part of the lens is molded, the abutting portion of the end of the fixing column is formed.
  • the lens is an encapsulation colloid for encapsulating the LED chip and the wire; and is formed by molding the disposing lens or the plastic part of the molding lens by placing the heat dissipating substrate in a mold of the plastic part forming the positioning lens or the molding lens. The abutment of the end of the fixed column.
  • the plastic part of the positioning lens or the forming lens is a plastic ring, and two or more plastic rings independent of each other are fixed on the heat dissipation substrate.
  • the plastic part of the positioning lens or the forming lens comprises a plastic ring and a connecting rib formed by injection molding together with the plastic ring connecting the set number of plastic rings, positioning lens or molding lens Plastic parts include two or more plastic rings.
  • the plastic member for positioning the lens or the molded lens is in the form of a plate, and two or more first through holes are provided in the plastic member of the positioning lens or the molded lens.
  • An LED integrated structure with a cooling device comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming
  • One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate.
  • the fixing post passes through the second through hole of the heat dissipation substrate, and the resisting portion is disposed at the end of the fixing column; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; the LED chip is directly processed by the die bonding process Fixed on the heat dissipation substrate and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, the wire is placed in the first through hole, and one end of the wire and the LED The electrode of the chip is electrically connected, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; the cooling device comprises a heat dissipation base LED chip side facing away from the fan, and the air cooling the side facing away from the substrate in direct contact with the LED chip.
  • An LED integrated structure with a cooling device comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming
  • One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate.
  • the fixing post passes through the second through hole of the heat dissipation substrate, and the resisting portion is disposed at the end of the fixing column; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; the LED chip is directly processed by the die bonding process Fixed on the heat dissipation substrate and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, the wire is placed in the first through hole, and one end of the wire and the LED The electrodes of the chip are electrically connected, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip;
  • the utility model comprises a flow channel plate disposed on a side of the heat dissipation substrate facing away from the LED chip, a cooling flow channel for accommodating the cooling medium formed between the flow channel plate and the heat dissipation substrate, and a refrigeration device; the back surface of the
  • the LED chip is directly fixed on the heat dissipation substrate by the die bonding process, and the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the heat dissipation gas or the heat dissipation liquid.
  • the heat dissipation substrate of the structure is a thin plate, and the thickness of the heat dissipation substrate is generally in the range of 0. 2mm to 5mm.
  • the COB (Chip on Board) package design of the LED integrated structure with a cooling device is directly compared with the existing LED integrated structure with a cooling device, and the LED chip is directly passed through a silver paste or a eutectic solder.
  • the heat generated by the working of the LED chip passes through the thin heat-conducting layer of the heat-dissipating substrate and directly contacts the heat-dissipating gas such as air or the heat-dissipating liquid, and the heat contacting the heat-dissipating substrate is caused by the difference in density of the hot-cold gas or liquid. It is quickly taken away, thus taking away the heat of the substrate, which can minimize the thermal resistance of the intermediate link, and greatly reduce the heat transfer path distance from the pn junction heating portion of the LED chip to the external air environment or the heat dissipating liquid, thereby greatly reducing the thermal resistance.
  • the conductive layer of the layout circuit can be inserted into the plastic part of the positioning lens or the forming lens, and the wire can be directly connected to the conductive layer of the layout circuit, and is no longer needed.
  • the conductive wire is connected to the conductive layer of the layout circuit through the conductive metal bracket or through the wiring substrate from the heat dissipation substrate facing away from the LED chip and connected to the conductive layer of the layout circuit, thereby simplifying the structure and minimizing the thermal resistance of the intermediate link, and the heat dissipation effect
  • the encapsulant can be made of resin or silica gel; and the LED chip and the electrical connection can be ensured.
  • the wire and its two soldered ends are not exposed to the air, which is beneficial for long life.
  • the encapsulant cannot use the resin. Since the price of the silica gel is much higher than that of the resin, and the light transmittance is inferior to that of the resin, the present invention can further save costs and improve the optical performance of the LED chip.
  • This COB package The advantage of the meter is that the electrodes of each LED chip 2 directly form an ohmic contact with the conductive layer of the layout circuit through the bonding wires, and the formation of the multi-channel LED chip array is electrically interconnected by the electrical connection device between the heat dissipation substrate and the LED chip, that is, It can realize series and parallel connection of LED chips, and can improve product reliability and production yield.
  • a cooling flow channel is arranged on a side of the heat dissipation substrate facing away from the LED chip, and a cooling medium is filled in the cooling flow channel. Since the temperature of the cooling medium is easily controlled, the cooling medium flowing device can quickly flow the cooling medium in the cooling flow channel, and the heat exchange is performed. Faster, faster and more away from the heat generated by the LED chip, so it is directly in contact with the air than the heat sink substrate, and the cooling effect is better. In particular, when the heat dissipating substrate is horizontally placed, the driving cooling medium flowing device can make the temperature of the cooling medium in the cooling flow channel substantially uniform, so that the temperature of the entire heat dissipating substrate is nearly uniform, and the heat is not concentrated at the position of the LED chip.
  • the cooling flow path includes a groove disposed on the flow path plate to circulate the cooling medium, and the driving cooling medium flow device is two gears and a driving motor that mesh with each other, the structure is simple, and the cooling medium in the cooling flow channel can pass The rapid circulation of the cooling medium exchanges heat and has a good cooling effect.
  • the driving cooling medium flowing device is a stirring impeller and a driving motor, and the structure is simple, and the cooling medium in the cooling flow channel exchanges heat through the rapid circulating flow of the cooling medium, and the cooling effect is good.
  • the stirring impeller or the two gears meshing with each other are driven by magnetic force.
  • the magnet drives the two gears or the stirring impeller through the flow channel plate.
  • the flow channel plate is a whole, no opening and sealing structure is required, and the structure is simple and the sealing effect is good. , and has a long service life.
  • the flow plate between the magnet and the stirring impeller or gear is made of non-magnetic material such as copper, aluminum, stainless steel, ceramics, etc.
  • a cooling fan is disposed on a side of the flow path housing facing away from the cooling flow passage.
  • the cooling fan may be installed on the back side of the flow path housing or on the side of the flow path housing, and the cooling fan may heat the cooling medium. It is quickly dissipated into the air through the flow path shell, so that the cooling medium is always kept at a lower temperature, so that the cooling medium can quickly remove more heat generated by the LED chip.
  • the position of the corresponding groove on the side of the flow channel plate facing away from the groove is such that the heat dissipation rib of the convex flow channel plate forms a rugged cooling flow passage, thereby increasing the contact area between the cooling flow channel plate and the air as much as possible, thereby Increase the heat dissipation area, increase the cooling fan and heat dissipation ribs to allow the heat of the cooling medium to pass through the flow path
  • the plate is quickly released into the air, keeping the cooling medium at a low temperature, so that the cooling medium can take away more heat from the LED chip.
  • the refrigeration device is installed at the position corresponding to the groove.
  • the refrigeration device only needs to cool a small amount of cooling medium and drive the cooling medium flow device to make the cooling medium flow rapidly in the groove, so that the cooling medium can reach the required temperature, thereby cooling
  • the medium can take away the heat generated by the LED chip more quickly, so that the LED chip and the entire heat dissipation substrate reach the required temperature, and the temperatures of the respective LED chips and the entire heat dissipation substrate are substantially consistent.
  • the semiconductor semiconductor refrigeration device is simple in structure, low in cost and good in cooling effect; the magnetic refrigeration device has good cooling effect; the heat absorption end of the refrigeration device can be thermally conductively attached to the back surface of the cooling flow channel of the flow channel housing.
  • the heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat sink, and the heat of the refrigerating device can be quickly dissipated into the air.
  • the heat absorbing end of the refrigerating device can be thermally coupled to the back surface of the cooling flow channel of the flow channel housing, and the heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat dissipating plate.
  • the heat of the refrigeration unit can be quickly dissipated into the cooling tank for better cooling.
  • the external cooling medium continuously flows in the cooling flow path to remove the heat of the heat dissipation substrate and the LED chip, so that a good cooling effect can be achieved.
  • the cooling medium of the refrigerating device communicates with the cooling flow passage through the cooling medium port, and directly cools the cooling flow passage through the cooling medium of the refrigerating device, and the heat loss link is small, and the cooling effect is good.
  • a plurality of chip fixing bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the area of the heat dissipation substrate is substantially larger than the area of the top of the chip fixing boss, and the LED chip is directly fixed on the chip fixing boss by the die bonding method. .
  • the heat generated by the LED chip is greatly reduced in the intermediate path distance of the heat dissipating gas, that is, in the air or the heat dissipating liquid, and the contact area with the heat dissipating liquid and the dissipating gas is greatly increased, the heat accumulation effect is greatly reduced, and the heat dissipation can be greatly improved.
  • the chip fixing boss and the heat dissipation substrate are integrally formed, so the heat generated by the chip is directly emitted into the air through the heat dissipation substrate, so the heat resistance is small, the heat dissipation speed is fast, and the heat dissipation is not required by the other heat sink, and the heat dissipation effect is quite good. Due to the chip fixing boss, the electrical connection wire is emitted to the LED chip The shadow of the light is reduced to the lowest, which is conducive to optical secondary optimization!
  • the existing LED bracket is omitted, that is, the heat-dissipating metal parts in the LED bracket and the electrode intermediate parts thereof are omitted, especially avoiding The high thermal resistance generated between the heat dissipating metal member and the two parts of the heat dissipating substrate, so the thermal resistance is small, the heat conduction has a fast heat dissipation effect, and the structure is simple and reliable.
  • the chip fixing boss and the heat dissipating substrate are integrally formed to facilitate the design and assembly of the light source. Process, and save costs. Therefore, the invention has simple and reliable structure, few parts, thin thickness and easy assembly, and is particularly suitable for occasions requiring high power for the light source.
  • the positioning lens or the plastic part of the molding lens can fix the heat dissipation substrate and the PCB board together.
  • the use of a PCB board facilitates the layout design of the circuit of the conductive layer of the layout circuit, eliminating the complicated manufacturing process of the original circuit layout over the heat dissipation substrate, and using a very mature PCB board, which greatly saves cost, The process is simplified and the reliability and design flexibility of the conductive layer of the layout circuit are improved.
  • the PCB board has a heat insulating effect, which is more favorable for the heat on the heat dissipation substrate to be radiated along the side in contact with the air.
  • the glue port of the glue injection channel is placed on the end surface of the plastic lens positioning member away from the resisting portion, and the glue injection channel communicates with the inner side wall of the plastic lens positioning member to facilitate the injection; since the plastic lens positioning member is a plastic piece,
  • the glue and glue injection channels are easy to form. Before injecting the encapsulant, the lens is tightly fitted or fixed by the plastic lens positioning member, so that the lens is first fixed and repackaged, and the lens is not displaced when the LED chip is packaged, which is beneficial to the filling and curing process, especially Some are much more reliable by fixing the lens only by the adhesion of silicone or the like.
  • the plastic lens positioning member can accurately mount the lens position during packaging, and fix the lens, the LED chip, the electrical connection wire and its two soldering ends, the heat dissipation substrate and the chip thereof after vacuuming and injection molding.
  • the bumps are solidified together, especially when the package is packaged, the bubble can be generated when the package colloid is solidified in a vacuum environment, which plays an important role in ensuring the light quality of the LED chip, and does not cause the emitted light to have a spot.
  • optical congenital defects such as shadows
  • optical congenital defects of LED chip illumination quality without bubble generation more favorable to optical secondary optimization of LED light source
  • the plastic part of the positioning lens or the forming lens fixes and fixes the heat dissipating substrate by placing the heat dissipating substrate in the mold of the plastic part forming the positioning lens or the molding lens to form the positioning lens or the plastic part of the molding lens, and the fixing is reliable. In the subsequent packaging process, it can withstand high temperatures, and the reliability of its fixation will not be affected under high temperature conditions.
  • the plastic part of the positioning lens or the forming lens is fixed to the heat dissipating substrate by injection molding the positioning lens or the plastic part of the molding lens, thereby eliminating the installation process of mounting the positioning lens or the plastic part of the molding lens on the heat dissipation substrate.
  • the production cost is greatly saved.
  • the plastic parts of the positioning lens or the molding lens and the heat dissipating substrate do not exist in the axial direction and the radial direction. Gap, even the liquid cooling medium can directly contact the heat sink substrate, improve the cooling effect, and the fixing is very reliable.
  • the positional relationship between the heat dissipating substrate and the positioning lens or the plastic part of the forming lens can be very precise, positioning lens or molding lens
  • the lens mounting position on the plastic part can be very precise in size, thereby improving the optical effect of the LED integrated structure with the cooling device.
  • the chip is placed in a single plastic lens positioning ring.
  • the amount of plastic is greatly reduced, and the cost is reduced.
  • the lens is fixed on the plastic part of the positioning lens or the forming lens by tight fitting or hot pressing, so that the lens is first fixed and repackaged, and the lens is not displaced when the LED chip is packaged, which is beneficial to the filling and curing process, especially It is much more reliable to fix the lens only by the adhesion of silicone or the like.
  • All the plastic positioning rings on a heat dissipating substrate can be connected into an integral positioning lens or a molded plastic part by a connecting rib during injection molding; or a part of the lens positioning ring on a heat dissipating substrate can be connected as a whole.
  • a plastic part for positioning a lens or a molded lens at the time of injection molding, and two or more such positioning lenses or plastic parts for forming a lens are provided on one heat dissipating substrate.
  • a chip fixing boss corresponds to a plastic lens positioning ring, and the plastic dosage is small when the plastic lens positioning ring is formed, and the cost is low.
  • the mold gate can be disposed on the plastic lens positioning ring or the connecting rib, which facilitates the arrangement of the mold gate and is more favorable for the plastic filling balance in the mold during the injection molding.
  • the plastic flow between the different plastic lens positioning rings is realized by the connecting ribs, the number of the mold gates can be reduced and the design of the mold flow path can be facilitated, and two or more plastic lens positioning rings can be formed by one mold gate.
  • plastic lens positioning rings only one plastic spline can be directly designed to form a plurality of plastic lens positioning rings; the second is to reduce the number of fixed columns, and does not need to be positioned in each plastic. There are two or more fixed columns on the ring, which can reduce the manufacturing cost of the mold on the one hand, and reduce the amount of plastic when molding the positioning lens or the plastic part of the molded lens on the other hand.
  • the third is for the same size.
  • the plastic lens positioning ring can be used to design the fixing column at the boundary between the plastic lens positioning ring and the connecting rib, thereby increasing the fixing column
  • the fourth section is for the same size of the plastic lens positioning ring, because the cavity of the cavity of the adjacent lens positioning ring is connected to form the cavity of the connecting rib, so more plastic lens positioning can be arranged in a unit area.
  • the service life of the ring is longer; the fifth is that the positional relationship between the plastic lens positioning ring and the plastic lens positioning ring is more precise and more reliable, so that the positional relationship between the lenses is more accurate and the optical effect is improved.
  • a heat-dissipating substrate may be provided with only one plate-shaped positioning lens or a molded plastic piece; or two or more plate-shaped positioning lenses or plastic parts of the molded lens may be disposed on one heat-dissipating substrate.
  • the plastic part of the positioning lens or the forming lens is plate-shaped. The first is that when the positioning lens or the plastic part of the forming lens is injection molded, the mold gate design is more flexible, and the layout of the mold gate is facilitated and the mold is more favorable in the injection molding.
  • the plastic filling balance; the second is to reduce the number of fixed columns and increase the cross section of the fixed column; the third is to install more lenses per unit area; the fourth is the more precise positional relationship between the lenses, improve Optical effect.
  • a cooling flow channel is disposed on a side of the heat dissipation substrate facing away from the LED chip, and the cooling flow channel is filled with a cooling medium, the cooling flow channel is arranged at a horizontal plane, and the heat absorption end of the refrigeration device is placed at the top of the cooling flow channel, due to the cooling medium
  • the temperature is easily controlled, and the specific gravity of the cold cooling medium is greater than that of the hot
  • the specific gravity of the cooling medium enables the cooling medium to automatically and quickly exchange the cooling medium, so that the structure of the cooling device is simple, and it is not necessary to drive the cooling medium flow path device.
  • the structure can be mainly applied to an LED backlight or other LED light source mounted on a tilted horizontal plane of the heat sink substrate.
  • FIG. 1 is a perspective exploded view of Embodiment 1 of the present invention.
  • Fig. 2 is a perspective exploded perspective view showing a second embodiment of the present invention.
  • Figure 3 is a perspective exploded view of Embodiment 3 of the present invention.
  • Fig. 4 is a perspective exploded perspective view showing only a partial structure of Embodiment 3 of the present invention.
  • Fig. 5 is an enlarged view of a portion I of Fig. 4.
  • Figure 6 is a perspective exploded view of Embodiment 4 of the present invention.
  • Fig. 7 is a perspective exploded perspective view showing only a partial structure of Embodiment 4 of the present invention.
  • Figure 8 is a perspective exploded view of Embodiment 5 of the present invention.
  • Fig. 9 is a perspective exploded perspective view showing a sixth embodiment of the present invention.
  • Figure 10 is a perspective view showing a seventh embodiment of the present invention.
  • Figure 11 is a perspective exploded view of Embodiment 7 of the present invention.
  • Figure 12 is a perspective exploded view of Embodiment 8 of the present invention.
  • Fig. 13 is a perspective exploded perspective view showing only a partial structure of an embodiment 8 of the present invention.
  • Figure 14 is a perspective exploded view of Embodiment 9 of the present invention.
  • Figure 15 is a perspective exploded view of Embodiment 10 of the present invention.
  • Figure 16 is a perspective exploded view of Embodiment 11 of the present invention.
  • Figure 17 is a perspective exploded view of Embodiment 12 of the present invention.
  • an LED integrated structure with a cooling device includes a cover plate 1 , a reflector 2 , a heat dissipation substrate 3 , an LED chip 4 , a lens 5 , a lens positioning ring 6 , and an electrode electrically connected to the LED chip 4 .
  • the gold wire 7 and the patterned circuit conductive layer 8 electrically connecting the gold wire 7 and the encapsulant 9 for encapsulating the LED chip 4 and the gold wire 7.
  • the cooling device includes a flow path plate 10 disposed on a side of the heat dissipation substrate 3 facing away from the LED chip 4, a groove 11 provided on the flow path plate 10, and a groove 11 on the flow path plate 10 and A cooling flow path for accommodating cooling water is formed between the heat dissipation substrates 3, a cooling water flow device (not shown) is driven, and the cooling water flow device is driven as a water pump.
  • a cooling water inlet 12 and a cooling water outlet (not shown) communicating with the cooling flow passage are provided on the flow passage plate 10, and the flow passage plate passes through the cooling water inlet 12 and the cooling water outlet and the external cooling water storage tank (not The water in the connection is shown).
  • the back surface of the LED chip 4 is completely covered by the cooling flow path; the side of the heat dissipation substrate 3 facing away from the LED chip 4 is in direct contact with the cooling water, and the cooling flow path is filled with cooling water.
  • the reflecting plate 2 is mounted on the heat radiating substrate 3, and the cover plate 1 is mounted on the flow path plate 10, and the cover plate 1 and the flow path plate 10 seal other structures of the LED integrated structure.
  • the reflector 2 is provided with a through hole 13 corresponding to the lens 5, and a reflector 14 corresponding to the lens 5 on the cover 1.
  • the flow channel plate 10 is a heat-conducting heat dissipation plate, and the side of the flow channel plate 10 facing away from the groove 11 is in direct contact with the air.
  • the drive cooling water flow device is installed outside the cooling flow passage.
  • the lens positioning ring 6 is made of high temperature resistant PPA plastic.
  • a positioning lens 5 and a first through hole 15 covering the encapsulating body 9 are disposed on the lens positioning ring 6.
  • the fixing post 16 is extended on the lens positioning ring 6, and the heat dissipating substrate 3 is placed at the end of the fixing post 16.
  • the mold portion of the molded lens positioning ring 6 is formed with a resisting portion 17 when the plastic positioning ring is formed, and the fixing post 16 and the heat dissipating substrate 3 are fluidly sealed.
  • a glue injection channel 18 for injecting the encapsulant 9 is disposed on the lens positioning ring 6.
  • the glue port 19 of the glue injection channel 18 is placed on the end surface of the lens positioning ring 6 away from the resisting portion, and the glue port 19 and the glue injection channel 18 are The side walls of the first through holes 15 are in communication.
  • the heat dissipation substrate 3 is stamped from a sheet metal or a metal alloy of a high thermal conductivity material, and may be made of stainless steel, copper, tungsten, aluminum, aluminum nitride, chromium, or the like.
  • the heat dissipating substrate 3 includes a flat bottom plate, and a plurality of chip fixing bosses 20 protruding from the heat dissipating substrate 3, and corresponding to each of the chip fixing bosses 20, a second through hole that is matched with the fixing post 16 twenty one.
  • the chip fixing boss 20 has a circular cross section, and the cross-sectional area of the bottom plate is much larger than the cross-sectional area of the chip fixing boss 20, at least three times or three times the area of the cross section of the chip fixing boss 20. the above.
  • a recess portion 22 in which the LED chip 4 is placed concentrically with the chip fixing boss 20 is provided on the top of the chip fixing boss 20, and the bottom surface of the recess portion 22 is a plane on which the LED chip 4 is placed.
  • a heat dissipation blind hole (not shown) disposed in the chip fixing boss 20 concentric with the chip fixing boss 20 is provided.
  • the side of the heat dissipation substrate 3 facing away from the chip fixing boss 20 The cooling water is in direct contact.
  • the fixing post 16 of the lens positioning ring 6 passes through the second through hole 21 of the heat dissipating substrate 3, and is fixed by the heat dissipating portion 3 of the end portion of the fixing post 16 so that the heat dissipating substrate 3 and the lens positioning ring 6 are fixed together.
  • the chip fixing boss 20 is disposed in the first through hole 15 of the corresponding lens positioning ring 6, and the conductive layer 8 of the layout circuit is directly disposed on the side of the heat dissipation substrate 3 facing the boss 20, and the conductive layer 8 of the layout circuit extends into the first
  • the LED chip 4 is directly fixed on the end surface of the chip fixing boss 20 by a die bonding process, and the gold wire 7 is placed in the lens positioning ring 6, the gold wire
  • the 7-end is electrically connected to the electrode of the LED chip 4, and the other end of the gold wire 7 is electrically connected to the patterned circuit conductive layer 8 extending into the lens positioning ring 6;
  • the lens 5 is mounted on the lens positioning ring 6 and the lens positioning ring 6 Tight fit.
  • the lens 5 is further fixed by the encapsulant 9 injected through the glue port 19 and the glue injection channel 18.
  • an LED integrated structure with a cooling device further includes a PCB board 51.
  • the flow path plate 52 only the cooling medium inlet 53 communicating with the cooling flow path is provided.
  • the groove 56 on the flow path plate 52 forms a closed circulating cooling flow path with the heat dissipation substrate 66, and the cooling medium circulates in the cooling flow path.
  • the driving cooling medium flow device includes two intermeshing first gears 54 and second gears 55 mounted at the bottom of the recess 56, and driving on the side facing away from the recess 56 to drive the rotation of the first gear 54 and the second gear 55
  • the motor 57 is a gear 58 mounted coaxially with the drive motor 57, a gear 59 meshing with the gear 58, and a magnet 60 fixed to the gear 59.
  • the first gear 54 is turned by the magnetic force between the magnet and the magnet.
  • the gear shafts of the first gear 54 and the second gear 55 extend from the bottom of the groove 56.
  • the lens positioning ring 61 is made of high temperature resistant PP0+GF plastic.
  • the heat dissipation substrate 66 is die-cast from a ceramic of high thermal conductivity.
  • the patterned circuit conductive layer 62 is disposed directly on the PCB board 51, and the patterned circuit conductive layers 62 are distributed on the same plane.
  • Each of the chip fixing bosses 63 is provided with a fourth through hole 64 that cooperates with the chip fixing boss 63 and a third through hole 65 that cooperates with the fixing post 68 on the PCB board 51.
  • the PCB board 51 is disposed on the heat dissipation substrate 66.
  • One side of the chip fixing boss 63 is in direct contact with the heat dissipation substrate 66, and the side of the PCB board 51 provided with the conductive layer 62 of the layout circuit faces away from the contact The contact surface of the thermal substrate 66.
  • the chip fixing boss 63 of the heat dissipation substrate 66 passes through the fourth through hole 64 of the PCB board 51.
  • the fixing post 68 of the lens positioning ring 61 passes through the third through hole 65 of the PCB board 51 and the second through hole of the heat dissipation substrate 66.
  • 67 is liquid-tightly sealed with the second through hole 67, and the resisting portion 69 is formed by the end portion of the heat-fusible fixing post 68 and fixed to the PCB board 51 and the heat dissipation substrate 66.
  • the driving cooling medium flow device includes two intermeshing first gears (not shown) and a second gear (not shown) mounted at the bottom of the recess (not shown).
  • a drive motor 126 that rotates the first gear and the second gear on a side facing away from the groove, a gear 130 that is mounted coaxially with the drive motor 126, and a gear 125 that meshes with the gear 130 are mounted on the flow path plate.
  • the fan 128 is away from the fan 128 on the side of the groove, and the fan 128 is fixed to the flow path plate 127 via the bracket 129.
  • the first gear and the gear 125 coaxially fix their fixed shafts through the flow passage plate 127.
  • the gear shaft of the first gear and the gear shaft of the second gear are sealed to the groove bottom.
  • the plastic lens positioning ring 101 is connected as a whole by the connecting ribs 102.
  • An R color LED chip 108, a G color LED chip 109, and a B color LED chip 110 are fixed in the top recess portion 104 of the chip fixing boss 103 by a die bonding process.
  • the chip fixing boss 103 is placed in the first through hole 124 corresponding to the plastic lens positioning ring 101, and the layout circuit is disposed on the PCB board 123.
  • the conductive layers 112, 114, 116, 118, 120, 122 extend between the inner sidewall of the first through hole 124 and the outer sidewall of the chip fixing boss 103, and are independent of each other, the gold wires 111, 113, 115, 117, 119, 121 is placed in the first through hole 124.
  • the anode of the R color LED chip 108 is electrically connected to the first patterned circuit conductive layer 112 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 111, and the R color LED
  • the negative electrode of the chip 108 is electrically connected to the patterned circuit conductive layer 114 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 113.
  • the positive electrode of the G-color LED chip 109 is electrically connected to the patterned circuit conductive layer 116 extending between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 115.
  • the G color LED chip 109 The negative electrode is fixed to the chip through the gold wire 117 and the inner side wall of the first through hole 124
  • the patterned circuit conductive layer 118 between the outer sidewalls of the boss 103 is electrically connected.
  • the positive electrode of the B color LED chip 110 is electrically connected to the patterned circuit conductive layer 120 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 119, and the B color LED chip 110
  • the negative electrode is electrically connected to the patterned circuit conductive layer 122 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 121.
  • the cooling device further includes a semiconductor refrigerating device 162 mounted on a side of the flow channel plate 163 opposite to the discrete thermal substrate 151, and the heat absorbing end of the semiconductor refrigerating device 162 can be
  • the heat-dissipating surface is attached to the flow path plate 163 and placed at a set position on the back surface of the circulation flow path, and the heat-dissipating end of the semiconductor refrigeration device 162 is thermally conductively attached to the heat sink 164, and the semiconductor refrigeration device is attached to the flow path plate 163.
  • a heat insulating layer (not shown) is provided at a portion other than the heat absorbing end of the 162 and on the side of the back discrete heat substrate 151.
  • the plastic lens positioning member is a lens positioning plastic plate 150, and the number of the lens positioning plastic plates 150 is one.
  • the lens positioning plastic plate 150 is provided with six first through holes 153 for positioning the lens 154 and covering the encapsulant 158 with the chip fixing boss 152 of the heat dissipation substrate 151.
  • the lens 154 is fixed in the first through hole 153 by a tight fit.
  • a fixing post 155 is extended on the end surface of the lens positioning plastic plate 150.
  • the lens positioning plastic plate 150 is provided with a glue injection channel 159 for injecting the encapsulant 158.
  • the glue port 160 of the glue injection channel 159 is placed on the end surface of the lens positioning plastic plate 150 away from the resisting portion, the glue port 160 and the glue injection channel. 159 is in communication with the side wall of the first through hole 153.
  • the cooling device further includes a heat conductive sheet 201 mounted on one side of the flow channel plate 202 on the back of the discrete thermal substrate 200, and one end of the heat conductive sheet 201 is thermally conductively attached thereto.
  • the flow path plate 202 is placed at a set position on the back surface of the circulation flow path, and the other end of the heat conductive sheet 201 is thermally conductively attached to the heat sink 203, and the flow path plate 202 is attached to the place outside the heat conductive sheet 201 and is separated from the heat.
  • One side of the substrate 200 is provided with a heat insulating layer (not shown).
  • the cooling device further includes a magnetic refrigerating device 251 and a heat dissipating plate 253 disposed on a side of the flow path plate 252 opposite to the discrete thermal substrate, the heat dissipating plate 253 facing away from the flow path plate 252.
  • a cooling groove 254 is further disposed on one side, and a sealing plate 255 sealing the cooling groove 254 is further disposed on a side of the heat dissipation plate 253 facing away from the flow channel plate 252, and the heat absorbing end of the magnetic refrigeration device 251 is thermally conductively attached to the flow channel plate.
  • the heat radiating end of the magnetic refrigerating device 251 is thermally coupled to the back surface of the cooling groove 254 of the heat radiating plate.
  • a heat insulating layer is provided on a side of the flow path plate 252 that is attached to the outside of the heat absorbing end of the magnetic refrigerating device 251 and on the side opposite to the discrete heat substrate.
  • the position of the corresponding groove 302 on the side of the flow path plate 301 facing away from the groove 302 is the heat dissipation ridge 303 of the flow channel plate 301, in the flow path.
  • a blocking wall 304 is defined on two sides of the vertical groove 302 of the plate 301.
  • a stopper 305 parallel to the groove 302 is defined on a side of the flow plate 301 facing the groove 302.
  • the two sides of the heat dissipation substrate 300 are disposed on the two sides of the heat dissipation substrate 300.
  • the wall 306 and the sealing member 307 form a rugged cooling flow passage for circulating the cooling medium.
  • a wind deflecting plate 308, a wind deflecting plate 308 and a flow channel plate 301 are further disposed.
  • an LED integrated structure with a cooling device includes a heat dissipation substrate 350, an LED chip 351, a lens 352, a plastic lens molding ring 353, and an LED chip 351 electrically connected.
  • the heat dissipation substrate 350 is die-cast from a ceramic of high thermal conductivity.
  • the heat dissipation substrate 350 includes a The flat bottom plate 361 and the plurality of bosses 362 of the protruding bottom plate 361 formed integrally with the heat dissipation substrate 350 are provided with a second through hole 363 corresponding to the fixing post 357 for each of the bosses 362.
  • the patterned circuit conductive layer 355 is disposed directly on the heat dissipation substrate 350, and the layout circuit conductive layers 355 are distributed on the same plane.
  • the cooling device also includes a refrigeration unit 364 and a heat sink 365.
  • the cooling flow path is disposed at a horizontal plane, the heat absorbing end of the refrigerating unit 364 is placed at the top of the cooling flow path, and the heat generating end is attached to the heat sink 365.
  • Example 9
  • the heat dissipation substrate 400 is a circular plate.
  • the flow path housing includes a sleeve 401 disposed to store the coolant outside the heat dissipation substrate 400 and a flow path cover 406 disposed at an end of the sleeve 401 remote from the heat dissipation substrate 400.
  • the heat sink substrate 400, the sleeve 401 and the flow path cover plate 406 form a sealed cooling flow path.
  • the driving cooling medium flow device includes a stirring impeller 402 installed in the sealed cooling flow passage, a driving motor 403 disposed on the side facing away from the sealing flow passage to drive the stirring impeller 402 to rotate, and a cooling fan 404 is coaxially fixed on the driving motor 403.
  • the magnet 405 is provided with an impeller shaft 407 on a side of the flow passage cover 406 facing away from the fan.
  • the agitating impeller 402 is fixed on the impeller shaft 407.
  • the impeller shaft 407 is rotatable relative to the flow passage cover 406 and is adsorbed on the magnet 405 and the magnet. 405 rotates synchronously.
  • a fan cover 408 is also provided outside the fan.
  • the driving cooling medium flow device includes a stirring impeller 452 installed in the sealed cooling flow passage, and a driving motor 453 disposed on the side facing away from the sealing flow passage to drive the stirring impeller 452 to rotate.
  • a cooling fan 454 is coaxially fixed to the driving motor 453.
  • the shaft 455 of the fixed cooling fan 454 passes through the flow path cover 456, and the stirring impeller 452 is fixed to the end of the shaft 455.
  • the shaft 455 passes through the flow path cover 456 and Sealed with the flow channel cover 456 liquid.
  • the heat dissipation substrate 660 is a circular plate.
  • the cooling device includes a fan 501 disposed on a side of the heat dissipation substrate 660 facing away from the LED chip, and a fan cover 502 disposed outside the fan 501.
  • a motor 503 is fixed in the fan cover 502, and the fan 501 is installed in the electric On the machine 503, the heat dissipation substrate 660 is fixed to the fan cover 502.
  • the side of the heat dissipation substrate 660 facing away from the LED chip is in direct contact with the air.
  • the cooling device includes a cooling flow path formed between the flow path housing 552 disposed on the side of the heat dissipation substrate facing away from the LED chip, the flow path housing 552 and the heat dissipation substrate 550, and cooling.
  • a device 551 a driving cooling medium flowing device (shown) installed in the cooling device 551 to drive the cooling medium in the cooling flow path to flow rapidly, and a cooling medium port 554 disposed on the flow path housing and communicating with the cooling flow channel;
  • the cooling medium of 551 is in communication with the cooling flow passage through the cooling medium port 554, and the cooling medium is driven by the driving cooling medium flow device to circulate between the cooling flow passage and the cooling device.
  • the invention is not limited to the above embodiments.
  • the shape of the heat dissipating substrate of the present invention can be designed in various shapes as needed, and can even be designed as a product appearance piece.
  • the present invention merely illustrates a part of the LED chip unit.
  • the number of chip fixing bosses in the present invention can vary from one to many, and the present invention is exemplified by several LED integrated structural units with cooling means.
  • the conductive layer of the layout circuit in the present invention is only illustrative. On one chip fixing boss, one LED chip can be fixed, and two different color LED chips can be fixed, three R, G, B different color chips, or more than three chips.
  • the PCB board may also be provided with a conductive layer of the layout circuit on both sides, as long as the surface of the conductive layer on the side in contact with the heat dissipation substrate is insulated from the heat dissipation substrate.
  • the LED chip can be directly fixed on the heat dissipation substrate, or fixed in a recess formed integrally with the heat dissipation substrate.

Abstract

An LED integrative structure with cooling device comprises a heat-radiating substrate (3), an LED chip (4), a lens (5), a lens locator (6) and a cooling device. The lens locator (6) is provided with a first hole (15), and also with a fixing column (16) extending from the end surface of the lens locator. The fixing column (16) passes through a second hole (21) on the heat-radiating substrate (3), and is fixed with the heat-radiating substrate (3) through the block part (17) located on the end of the fixing column (16); the LED chip (4) is fixed directly on the heat-radiating substrate (3) through solid crystal technique, and is located in the first hole (15); the cooling device is provided on the side of the heat-radiating substrate (3) which is opposite from the LED chip (4), and may be cooling medium, fan and/or the refrigeration device. The structure has the advantages of the precise position relationship between the lens and the chip, simple assembly, reduced heat resistance of intermediate portion and good radiating effect.

Description

带有冷却装置的 LED集成结构 技术领域  LED integrated structure with cooling device
本发明涉及一种用于照明、 背光源模组、 电视机、 LED点阵显示屏、 投 影设备等的带有冷却装置的 LED集成结构， 特别是涉及一种大功率的 LED 集成结构的冷却装置。  The invention relates to an LED integrated structure with a cooling device for illumination, a backlight module, a television set, an LED dot matrix display screen, a projection device, etc., in particular to a cooling device with a high-power LED integrated structure .
背景技术 Background technique
LED光源， 特别是大功率的 LED光源， 发光时热量集中， 如果 LED芯片 产生的热量不及时散发出去， LED光源的温度过高，就会导致 LED的光效降 低、 寿命低等， 因此如何将 LED芯片发光时产生的热量迅速有效的散发出 去成了普及应用 LED光源的瓶颈。 如何提高 LED光源的光效， 以及如何提 高 LED光源的散热性能从而延长使用寿命，是目前行业上的重要技术难题。 现有的解决 LED光源的散热问题， 一种方案是改善 LED集成结构， 使 LED 光源产生的热量更易散发出去， 另一种方案是增加冷却结构。  LED light source, especially high-power LED light source, the heat is concentrated when the light is emitted. If the heat generated by the LED chip is not released in time, the temperature of the LED light source is too high, which will lead to the LED light reduction and low life, so how to The heat generated by the LED chip is quickly and effectively dissipated and becomes a bottleneck for popularizing LED light sources. How to improve the light efficiency of LED light sources and how to improve the heat dissipation performance of LED light sources to prolong the service life is an important technical problem in the industry. The existing solution to the problem of heat dissipation of the LED light source is to improve the integrated structure of the LED, so that the heat generated by the LED light source is more easily emitted, and the other solution is to increase the cooling structure.
现有常用的大功率带有冷却装置的 LED集成结构通常采用支架封装成 的单一个体 LED发光管再集成的方式。  The existing LED high-power LED integrated structure with cooling device is usually re-integrated by a single individual LED light-emitting tube packaged by a bracket.
申请号为 200810135621. 5的发明专利中，公开了一种发光二极管封装装置、 散热基座与电极支架组合及其方法， 该发光二极管封装装置包含： 一发光 二极管晶粒、 一由高导热材质制成且供晶粒接触放置的散热基座、 一电极 支架、一定位单元及一包覆体。散热基座由金属或陶瓷等高导热材质制成， 包括底盘、 本体及本体顶面的凹陷部。 晶粒置于凹陷部的底面。 电极支架 由金属材质冲出成型， 包括一基板及一自基板的镂空区周缘轴向延伸且界 定出一容置空间的定位壁。 定位单元设于散热基座与电极支架至少其中之 一， 用以使散热基座嵌卡固定于该电极支架的容置空间中。 该定位单元可 以是包括至少一个自该电极支架的定位壁内壁面凸出的卡樺凸点， 也可以 是包括一自该散热基座近顶面处径向向外凸伸的凸缘。 包覆体以射出成型 方式制成， 将相互嵌卡固定的散热基座与电极支架部分包覆结合。 In the invention patent of the application No. 200810135621. 5, an LED package device, a heat sink base and an electrode holder combination and a method thereof are disclosed. The LED package device comprises: an LED die and a high thermal conductivity material. And a heat dissipation base for the die contact, an electrode holder, a positioning unit and a covering body. The heat sink base is made of a highly thermally conductive material such as metal or ceramic, and includes a recessed portion of the chassis, the body, and the top surface of the body. The crystal grains are placed on the bottom surface of the depressed portion. The electrode holder is punched out from a metal material, and includes a substrate and a positioning wall extending axially from the periphery of the hollow portion of the substrate and defining an accommodation space. The positioning unit is disposed on at least one of the heat dissipation base and the electrode holder, so that the heat dissipation base is embedded and fixed in the accommodating space of the electrode holder. The positioning unit may be at least one card-bump bump protruding from the inner wall surface of the positioning wall of the electrode holder, or It includes a flange that projects radially outward from the top surface of the heat sink base. The covering body is formed by injection molding, and the heat-dissipating base fixed to each other is combined with the electrode holder portion.
现有的这种发光二极管封装装置、散热基座与电极支架组合及其方法， 存在以下缺陷和不足：  The existing LED package device, heat sink base and electrode holder combination and method thereof have the following defects and deficiencies:
1 ) 晶粒通过阶梯柱状的散热基座作第一散热体， 由于柱状的散热基座不直 接接触空气来散热， 而且其具有一定的金属实心长度， 由于需要较长的金 属传导散热距离才能将热散发于空气， 且散热基座与空气的接触面积小， 因此晶粒发光时产生的热量会起到热聚集效应。 为了提高散热性能， 该散 热基座一般还需设计与散热基座直接热传导接触的其它高散热性能的金属 或陶瓷等散热件， 透过散热件来最终散热。 这种方式一方面增加了热传导 散热的距离， 另一方面由于散热基座与散热件分属两个零件， 两者就是使 用导热胶粘合在一起也还是有巨大的热阻， 晶粒发光时基本上会保持散热 基座这边温度很高， 散热件这边温度与环境温度差不多的现象， 达不到将 散热基座上的热量迅速散发出去的目的， 散热效果很差。 1) The die passes through the stepped column-shaped heat sink base as the first heat sink. Since the columnar heat sink base does not directly contact the air to dissipate heat, and has a certain solid metal length, it requires a long metal conduction heat dissipation distance. The heat is emitted to the air, and the contact area of the heat dissipation base with the air is small, so the heat generated when the crystal grains emit light has a heat accumulation effect. In order to improve the heat dissipation performance, the heat dissipation base generally needs to design other heat dissipation materials such as metal or ceramics that are in direct thermal conduction contact with the heat dissipation base, and finally dissipate heat through the heat dissipation member. On the one hand, this method increases the distance of heat conduction and heat dissipation. On the other hand, since the heat dissipation base and the heat sink are divided into two parts, the two are bonded together with the thermal conductive glue, and there is still a huge thermal resistance. Basically, the temperature of the heat sink base is kept high, and the temperature of the heat sink is similar to the ambient temperature. The heat on the heat sink base is not quickly dissipated, and the heat dissipation effect is poor.
2 ) 由于多了柱状的散热基座及电极支架等， 与散热件又是不同的零件， 所 以零件多结构复杂， 厚度较厚， 不利于装配， 成本也高； 发光二极管与布 图电路导电层的电性连接需经过电极支架，结构复杂，中间环节的热阻多， 降低了 LED芯片的发光效率及散热效率。 2) Since there are more columnar heat-dissipating pedestals and electrode holders, and the heat-dissipating parts are different parts, the parts have many complicated structures and thick thickness, which is not conducive to assembly and high cost; LED and layout circuit conductive layer The electrical connection needs to pass through the electrode holder, the structure is complicated, and the thermal resistance of the intermediate link is much, which reduces the luminous efficiency and heat dissipation efficiency of the LED chip.
申请号为 200720172030公开了一种引脚式大功率 L E D器件的封装结 构， 包括 L E D晶片、 透镜、 印刷 PCB板、 金属热沉体、 金线和引脚； 金 属热沉体包括基座和该基座上的凸台， 而且基座的上表面面积至少是凸台 的上表面面积的 2倍； 印刷 PCB板与基座胶粘在一起； 在印刷 PCB板下方 的基座上设置有通孔， 借助该通孔引脚与印刷 PCB板电连接； 透镜罩扣 L E D晶片和印刷 PCB板并借助灌胶工艺粘固在印刷 PCB板上。 这种大功率 的引脚式大功率 L E D器件， 虽然增大了金属热沉体的基座面积， 但散热 效果还是较差， 即使另外配置散热器， 由于散热时须将 LED芯片上的热量 传导给凸台和基座上，再传给金属热沉体，再由金属热沉体传导给散热器， 由于热传导增加了中间环节， 以及很厚的金属传热体对应的很长的传热路 径， 因此热阻很高，导热效果很差。还有透镜要先靠罩扣在印刷 PCB板上， 再由灌胶来粘固是很难实现的， 因为透镜先靠罩扣在印刷 PCB板上时很难 定位准确， 以及灌胶时会使透镜移位， 透镜位置无法准确定义。 引脚要与 印刷 PCB板上方的布图电路电连接并穿过印刷 PCB板和金属热沉体， 加工 复杂，工艺难度大， LED晶片与印刷 PCB上的布图电路的电性连接需经过电 极支架， 结构复杂， 中间环节的热阻多。 Application No. 200720172030 discloses a package structure of a pin-type high-power LED device, including an LED chip, a lens, a printed PCB board, a metal heat sink body, a gold wire and a lead; the metal heat sink body includes a base and the base a boss on the seat, and the upper surface area of the base is at least twice the area of the upper surface of the boss; the printed PCB board is glued to the base; and the through hole is disposed on the base below the printed PCB board. The through-hole pin is electrically connected to the printed PCB board; the lens cover LED chip and the printed PCB board are adhered to the printed PCB board by a potting process. This high-power pin-type high-power LED device, although increasing the base area of the metal heat sink body, has a poor heat dissipation effect, even if a heat sink is additionally disposed, the heat on the LED chip must be conducted due to heat dissipation. The bump and the base are transferred to the metal heat sink body, and then transferred to the heat sink by the metal heat sink body. Since the heat transfer increases the intermediate link and the very long heat transfer path corresponding to the thick metal heat transfer body, the thermal resistance is high and the heat conduction effect is poor. There is also a lens to be attached to the printed PCB board by the cover, and then it is difficult to achieve the glue by the glue, because the lens is difficult to position accurately when the cover is pressed on the printed PCB, and the glue will be The lens is displaced and the lens position cannot be accurately defined. The pin should be electrically connected to the layout circuit above the printed PCB board and pass through the printed PCB board and the metal heat sink body. The processing is complicated and the process is difficult. The electrical connection between the LED chip and the layout circuit on the printed PCB needs to pass through the electrode. The bracket has a complicated structure and many thermal resistances in the middle part.
为了解决现有的大功率 LED的集成结构的散热问题， 现有技术中提出 了带有冷却装置的 LED集成结构的 COB (Chip on Board ) 封装设计。 与现 有的支架式带有冷却装置的 LED集成结构相比， 由于该发明直接将芯片通 过银胶或共晶焊料等固定在基板上， 可以最大限度的减少中间环节的热阻， 从而减少 LED芯片 p-n结到外部环境的热阻，可提高散热效率和发光效率。 这种 COB (Chip on Board ) 封装设计的优点在于每个 LED 芯片的电极都通 过键合电极引线直接与金属焊盘形成欧姆接触， 多路 LED芯片阵列的形成 是通过散热基板与 LED芯片的电连接装置实现电性互联， 即可实现 LED芯 片的串并联，又可提高产品的可靠性和合格率。而且外形尺寸小，厚度薄， 易于装配， 可用于照明、 显示仪等对光源装配尺寸要求较高的场合。 这种 封装设计主要有以下几种方式：  In order to solve the heat dissipation problem of the integrated structure of the existing high-power LED, the COB (Chip on Board) package design of the LED integrated structure with the cooling device is proposed in the prior art. Compared with the existing LED integrated structure with a cooling device, since the invention directly fixes the chip on the substrate by silver glue or eutectic solder, the thermal resistance of the intermediate link can be minimized, thereby reducing the LED. The thermal resistance of the chip pn junction to the external environment can improve heat dissipation efficiency and luminous efficiency. The advantage of this COB (Chip on Board) package design is that the electrodes of each LED chip form an ohmic contact directly with the metal pad through the bonding electrode leads, and the formation of the multi-channel LED chip array is through the heat dissipation substrate and the LED chip. The connecting device realizes electrical interconnection, which can realize series-parallel connection of LED chips, and can improve product reliability and yield. Moreover, the outer shape is small, the thickness is thin, and the assembly is easy, and it can be used for occasions where the size of the light source assembly is high, such as illumination and display. There are several ways to design this package:
申请号为 200920112089. 5的发明专利中， 公开了一种 C0B封装的大功 率 LED路灯用装置， 包括透镜、 硅胶、 金线、 芯片、 散热板等， 在散热板 上设置有 5— 50个凸台， 芯片直接固定在散热板的凸台上，再通过散热板和 散热板上的散热片散发出去。 这种结构的大功率 LED路灯， 虽然散热效果 较好， 但由于没有定位透镜或成型透镜的塑胶件， 透镜的定位不准， 在透 镜内预点上硅胶来封装芯片，一方面硅胶用量大，特别是用这种封装方式， 封装硅胶固化后有气泡产生， 严重影响 LED芯片的发光质量， 会导致散发 出来的光线有光斑， 阴影等光学先天缺陷， 不利于 LED光源的光学二次优 化开发。 申请号为 200820214808. X的发明专利中， 公开了一种高效散热发光的 大功率 LED封装结构， 包括透镜、 基板与 LED发光芯片， 透镜固定于基板 上表面，透镜下表面设有向上凸起的安装凹陷， LED发光芯片置于基板上表 面并被安装凹陷扣盖， 在安装凹陷所扣盖的基板上表面设有正、 负发光电 极， 发光电极与 LED发光芯片通过金属线连接， 基板上表面设有与发光电 极相连的正、 负连接电极， 在安装凹陷外侧的透镜下表面与基板上表面之 间通过环形的胶粘层相粘结， 在胶粘层的内孔与安装凹陷所形成的腔体内 注满硅胶， 在基板上开设有向胶粘层的内孔与安装凹陷所形成的腔体内连 通的注胶通道， 且透镜与基板均由水晶晶体制成。 这种结构的大功率 LED 封装结构， 缺点一是透镜与基板的固定靠胶粘层粘结， 粘结固定不牢； 缺 点二是无定位透镜的定位机构， 透镜靠与基板粘结时来定位，定位不准确， 灌胶时容易使透镜位置偏离； 缺点三是透镜通过粘结层固定在基板上， 粘 结层容易将注胶通道堵塞， 影响注射硅胶； 缺点四是电性连接 LED发光芯 片的金属线需与固定在基板上并置于透镜的安装凹陷部内的发光电极电性 连接， 发光电极再与连接电极电性连接， 连接电极再与布图电路导电层电 性连接， 中间环节的热阻多， 影响散热效率和发光效率。 The invention patent of the application No. 200920112089. 5 discloses a device for a high-power LED street lamp of a C0B package, including a lens, a silicone, a gold wire, a chip, a heat sink, etc., and 5 to 50 convexities are arranged on the heat dissipation plate. The chip is directly fixed on the boss of the heat sink, and then radiated through the heat sink and the heat sink on the heat sink. The high-power LED street lamp of this structure has better heat dissipation effect. However, since there is no plastic lens for locating the lens or forming the lens, the positioning of the lens is not accurate, and the silicon dioxide is pre-pointed in the lens to encapsulate the chip. On the one hand, the amount of the silicone is large. In particular, with this packaging method, bubbles are generated after the curing of the packaged silica gel, which seriously affects the light-emitting quality of the LED chip, which causes the emitted light to have spots, shadows and other optical defects, which is not conducive to the optical secondary optimization development of the LED light source. In the invention patent No. 200820214808. X, a high-power LED package structure with high-efficiency heat-dissipating illumination is disclosed, which comprises a lens, a substrate and an LED light-emitting chip. The lens is fixed on the upper surface of the substrate, and the lower surface of the lens is provided with an upward convex surface. The recess is mounted, the LED light-emitting chip is placed on the upper surface of the substrate and the recessed cover is mounted, and the upper and lower negative-emitting electrodes are disposed on the upper surface of the substrate that is fastened by the mounting recess, and the light-emitting electrode and the LED light-emitting chip are connected by a metal wire, and the upper surface of the substrate The positive and negative connecting electrodes connected to the illuminating electrode are disposed, and the lower surface of the lens outside the mounting recess and the upper surface of the substrate are bonded by an annular adhesive layer, and the inner hole and the mounting recess formed in the adhesive layer are formed. The cavity is filled with silica gel, and a glue injection channel is formed on the substrate to communicate with the inner hole of the adhesive layer and the cavity formed by the mounting recess, and the lens and the substrate are both made of crystal crystal. The high-power LED package structure of this structure has the disadvantage that the fixing of the lens and the substrate is adhered by the adhesive layer, and the bonding is not firmly fixed; the second disadvantage is that the positioning mechanism of the positioning lens is not positioned when the lens is bonded to the substrate. The positioning is not accurate, and the position of the lens is easily deviated during the filling; the third disadvantage is that the lens is fixed on the substrate through the adhesive layer, the adhesive layer is easy to block the injection passage, affecting the injection of the silica gel; the disadvantage is that the LED is electrically connected to the LED light-emitting chip. The metal wire is electrically connected to the light-emitting electrode fixed on the substrate and disposed in the mounting recess of the lens, and the light-emitting electrode is electrically connected to the connecting electrode, and the connecting electrode is electrically connected to the conductive layer of the layout circuit, and the intermediate link is More thermal resistance, affecting heat dissipation efficiency and luminous efficiency.
申请号为 200420112507. 8的发明专利中， 公开了一种大功率 LED发光 二极管， 包括铝基板、 银胶、 晶片、 金线、 反射盖， 铝基板为凸凹型碗杯 形状， 即在其中心处的底面有一圆形凹槽， 与其对应的上面有一碗杯状凸 台， 凸台上装有塑胶框架， 塑胶框架为圆形， 中心设有圆孔， 与圆孔同心 开有两道凹槽， 内外构成低高两道凸沿， 底面对称设有两个圆柱脚， 并装 在碗杯状凸台两边的圆孔中， 反射盖弧面较小接近于平盖， 其下沿口涂有 粘合胶水， 装之于塑胶框架的凹槽内。 塑胶框架底面涂有粘合胶水， 其内 填充有胶水。 发光体晶片与反射盖底面距离 H值较小。 铝基板可以是梅花 形状， 也可以是圆形。 该专利的组装步骤是， 先将银胶点入铝基板凸台形 碗杯内， 再将晶片固定在银胶上， 放入烤箱内烘烤 145C° 1 小时， 然后焊 接金线， 将镜片的正负极分别用金线焊接在铝基板正负极上， 将塑胶框架 底面涂上粘合胶水，插入铝基板定位孔内，将胶水填充进塑胶框架内烘烤， 再将反射盖涂上粘合胶水， 装入塑胶框架的凹槽内即可使用。 该专利的缺 点一是需要通过粘合胶水将塑胶框架与铝基板固定， 在后续的封装工艺过 程中， 不耐高温， 在高温条件下其固定的可靠性会受很大的影响； 缺点二 是在塑胶框架上没有注入填充胶水的通道， 在装反射盖前就需填充胶水， 如果不使用模具，胶水的形状无法控制，如果使用模具填充胶水，成本高； 缺点三是是填充胶水后再将反射盖上涂上粘合胶水装入塑胶框架的凹槽内 固定， 这样一方面固定不可靠， 位置关系固定不准确， 另外反射盖与胶水 间会有间隙， 间隙内会有空气， 也就是反射盖内会有空气， 大大影响发光 二极管的发光效果。 还有该发明专利中的铝基板为碗杯形状， 其上只有一 个凸台， 金线电性连接铝基板的正负极， 从其文字和图公开的内容来看， 铝基板的正负极不会是布图电路导电层， 而是为如 200820214808. X专利中 公开的发光电极或支架式弓 I脚等。 In the invention patent of the application No. 200420112507. 8, a high-power LED light-emitting diode is disclosed, which comprises an aluminum substrate, a silver paste, a wafer, a gold wire, a reflective cover, and the aluminum substrate has a convex-concave cup shape, that is, at the center thereof. The bottom surface has a circular groove, and a corresponding cup top has a cup-shaped boss. The boss is provided with a plastic frame, the plastic frame is circular, the center is provided with a circular hole, and the groove is concentric with two grooves, inside and outside. Forming two low-high convex edges, the bottom surface is symmetrically provided with two cylindrical legs, and is mounted in a circular hole on both sides of the cup-shaped boss. The curved surface of the reflective cover is smaller than the flat cover, and the lower edge is coated with glue. Glue, packed in the groove of the plastic frame. The bottom of the plastic frame is coated with adhesive glue filled with glue. The distance between the illuminant wafer and the bottom surface of the reflective cover is small. The aluminum substrate may be in the shape of a plum or a circle. The assembly procedure of the patent is to first place the silver glue into the boss cup of the aluminum substrate, fix the wafer on the silver paste, and bake it in the oven for 145 C for 1 hour, then solder the gold wire to fix the lens. The negative electrode is respectively soldered on the positive and negative electrodes of the aluminum substrate with gold wire, and the plastic frame is The bottom surface is coated with adhesive glue, inserted into the positioning hole of the aluminum substrate, the glue is filled into the plastic frame for baking, and then the reflective cover is coated with adhesive glue, and can be used by being inserted into the groove of the plastic frame. One of the shortcomings of this patent is that the plastic frame and the aluminum substrate need to be fixed by adhesive glue, which is not resistant to high temperature in the subsequent packaging process, and the reliability of the fixing under high temperature conditions is greatly affected; There is no glue filling channel on the plastic frame. Fill the glue before filling the reflector. If the mold is not used, the shape of the glue cannot be controlled. If the mold is used to fill the glue, the cost is high. The third disadvantage is that the glue will be filled. The reflective cover is coated with adhesive glue and fixed in the groove of the plastic frame. On the one hand, the fixing is unreliable, the positional relationship is fixed inaccurately, and there is a gap between the reflective cover and the glue, and there is air in the gap, that is, reflection. There will be air inside the cover, which greatly affects the luminous effect of the LED. In addition, the aluminum substrate in the invention patent has a cup shape, and has only one boss on the upper surface, and the gold wire is electrically connected to the positive and negative electrodes of the aluminum substrate, and the positive and negative electrodes of the aluminum substrate are viewed from the text and the contents disclosed in the figure. It is not a conductive layer of the layout circuit, but a light-emitting electrode or a bracket-type bow and the like as disclosed in the 200820214808.
现有的通过增加冷却装置改善 LED集成结构的散热问题， 一种是采用风 扇散热， 一种是采用半导体制冷片散热， 一种是采用冷却流道散热。 采用 风扇散热， 由于冷却的温度取决于环境温度， 对大功率的 LED集成结构， 冷却效果不好， 甚至无法达到冷却要求。  The existing problem of improving the heat dissipation of the LED integrated structure by adding a cooling device is to use a fan to dissipate heat, one is to use a semiconductor refrigerating piece to dissipate heat, and the other is to use a cooling channel to dissipate heat. Cooling with a fan, because the cooling temperature depends on the ambient temperature, the high-power LED integrated structure, the cooling effect is not good, and even the cooling requirements cannot be achieved.
在专利号为 200820134860. 4的实用新型专利中， 公开了一种散热结构 及具有该散热结构的发光二极管灯具， 本实用新型的散热结构包含有一腔 体， 其间容置有一冷却溶液， 并设置有偶数个隔板， 以形成一流道， 该流 道以 S形的方式连通， 并具有至少一排热区、 至少一受热区及至少一缓冲 区。 该实用新型虽然设有冷却流道， 但既没有驱动冷却介质流动装置使流 道内的冷却介质冷热快速交换， 由于排热区置于腔体的两侧， 流道内的冷 却介质也无法利用冷却介质不同的比重进行冷热冷却介质的快速交换， 冷 却介质的冷热交换是靠冷却介质的热传导进行交换， 置于腔体的两侧的排 热区散热面积又小， 当 LED芯片产生的热量散发到冷却介质中时， 由于冷 却介质的热量本身很难散发出去，冷却介质的冷热交换又很慢， 因此对 LED 芯片的冷却效果不好。 In the utility model patent of the patent No. 200820134860. 4, a heat dissipation structure and an LED lamp having the heat dissipation structure are disclosed. The heat dissipation structure of the utility model comprises a cavity, a cooling solution is accommodated therebetween, and is provided with An even number of baffles are formed to form a channel, the channels being connected in an S-shape and having at least one row of hot zones, at least one heated zone, and at least one buffer zone. Although the utility model is provided with a cooling flow channel, neither the cooling medium flow device is driven to quickly exchange the cooling medium in the flow channel, and the cooling medium in the flow channel cannot be cooled by the heat removal zone on both sides of the cavity. The different specific gravity of the medium is used for rapid exchange of cold and hot cooling medium. The cold and heat exchange of the cooling medium is exchanged by the heat conduction of the cooling medium, and the heat dissipation area of the heat removal area placed on both sides of the cavity is small, when the heat generated by the LED chip is generated. When it is dissipated into the cooling medium, since the heat of the cooling medium itself is difficult to dissipate, the cold and heat exchange of the cooling medium is very slow, so the LED is The cooling effect of the chip is not good.
现有的利用半导体冷却装置对 LED芯片进行冷却的散热装置，一般为半 导体冷却片完全覆盖 LED芯片的背面， 由于 LED芯片的功率小， 而半导体 冷却装置的功率大， 因此现有的这种半导体冷却装置， 用大功率的半导体 冷却装置冷却小功率的 LED芯片， 不经济。 在 200920009830. 5的实用新型 专利中， 公开了一种灯体温度可控的 LED灯具， 包括 LED灯体和为 LED 灯体提供直流电的驱动电源， LED灯体上贴附有一个或多个能实现制冷或 制热功能并相应维持 LED灯体温度恒定的半导体薄片。 该实用新型虽然使 用一个或多个半导体薄片解决 LED灯体的制冷问题， 但由于半导体薄片直 接贴在灯体上， 无冷却流道， LED芯片与半导体薄片之间的热交换只能通 过固体介质传导交换，由于固体传导热交换慢，因此这种半导体薄片对 LED 芯片的冷却效果不好。  A conventional heat sink for cooling an LED chip by using a semiconductor cooling device generally has a semiconductor cooling fin completely covering the back surface of the LED chip. Since the power of the LED chip is small and the power of the semiconductor cooling device is large, the existing semiconductor is used. The cooling device uses a high-power semiconductor cooling device to cool a low-power LED chip, which is uneconomical. In the utility model patent of 200920009830. 5, an LED lamp with controllable temperature of the lamp body is disclosed, which comprises an LED lamp body and a driving power source for supplying DC power to the LED lamp body, and one or more energy can be attached to the LED lamp body. A semiconductor wafer that achieves a cooling or heating function and maintains a constant temperature of the LED lamp body. Although the utility model solves the problem of cooling of the LED lamp body by using one or more semiconductor sheets, since the semiconductor wafer is directly attached to the lamp body without a cooling flow path, heat exchange between the LED chip and the semiconductor wafer can only pass through the solid medium. Conductive exchange, due to the slow conduction of solid conductive heat exchange, the cooling effect of such a semiconductor wafer on the LED chip is not good.
发明内容 Summary of the invention
为了解决现有的 LED集成结构中间环节热阻过多而造成的散热不畅， 寿命短，发光效率低下，及芯片电气互连的可靠性不高造成的良率低等和 C 0 B技术封装的 L E D芯片集成结构光学效果不好、 冷却装置冷却效果不 好的问题， 本发明要解决的技术问题在于提供一种中间环节热阻小、 散热 性好、 芯片到布图电路导电层直接电连接、 不需要回流焊或波峰焊、 封装 胶体可以用树脂或硅胶等， 透镜和芯片的位置关系精确、 具有高光通量、 结构简单、 装配简单、 散热效果好、 光学效果好、 LED芯片散热好的带有冷 却装置的 LED集成结构。  In order to solve the problem of poor heat dissipation caused by excessive thermal resistance in the intermediate part of the existing LED integrated structure, short life, low luminous efficiency, low reliability of chip electrical interconnection, and low yield and C 0 B technology package The LED chip integrated structure has a poor optical effect and the cooling device has a poor cooling effect. The technical problem to be solved by the present invention is to provide a small thermal resistance of the intermediate link, good heat dissipation, and direct electrical connection of the conductive layer of the chip to the layout circuit. Reflow soldering or wave soldering is not required. The encapsulant can be made of resin or silica gel. The positional relationship between the lens and the chip is accurate, the luminous flux is high, the structure is simple, the assembly is simple, the heat dissipation effect is good, the optical effect is good, and the LED chip has good heat dissipation. LED integrated structure with cooling device.
带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 在定位透镜或成型透镜的塑胶件上设有一个或一个以上的 第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设有固定柱， 在 散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热基板的第二通 孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑胶件通过固定 柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔的侧壁与 LED芯 片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电极电连接， 导线 的另一端与第一通孔与 LED芯片之间的布图电路导电层电连接； 冷却装置 包括设置在散热基板背离 LED芯片一侧的流道壳体、 流道壳体与散热基板 间形成的冷却流道、 驱动冷却流道内的冷却介质快速流动的驱动冷却介质 流动装置； LED芯片的背面完全被冷却流道覆盖， 固定柱与散热基板间气密 封或液密封； 散热基板背离 LED芯片的一侧与冷却介质直接接触。 An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate. The fixing post passes through the second through hole of the heat dissipation substrate, and the end portion of the fixing column is provided with a resisting portion; the plastic piece of the positioning lens or the forming lens is fixed by The pillar and the resisting portion are fixed to the heat dissipating substrate; the LED chip is directly fixed on the heat dissipating substrate by the die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends into the sidewall of the first through hole and the LED chip Between the wires is placed in the first through hole, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; The cooling substrate faces away from the flow channel housing on one side of the LED chip, the cooling flow path formed between the flow path housing and the heat dissipation substrate, and the driving cooling medium flowing device that drives the cooling medium in the cooling flow path to flow rapidly; the back surface of the LED chip is completely cooled The flow path covers, and the gas seal or liquid seal between the fixed column and the heat dissipation substrate; the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the cooling medium.
作为方案一的第一种改进， 流道壳体为流道板， 冷却流道包括设置在 流道板上使冷却介质可循环流动的凹槽， 凹槽与散热基板背离 LED芯片的 一侧形成冷却流道； 驱动冷却介质流动装置包括安装在凹槽底部的两个相 互啮合的第一齿轮和第二齿轮、 设置在背离凹槽的一侧带动第一齿轮和第 二齿轮转动的驱动电机， 第一齿轮的齿轮轴或第二齿轮的齿轮轴从凹槽的 底部穿过流道板并与流道板气密封或液密封。  As a first improvement of the first solution, the flow path housing is a flow path plate, and the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip. a cooling flow passage; the driving cooling medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate, The gear shaft of the first gear or the gear shaft of the second gear passes through the flow passage plate from the bottom of the groove and is hermetically sealed or liquid-tight with the flow passage plate.
作为方案一的第二种改进， 流道壳体为流道板， 冷却流道包括设置在 流道板上使冷却介质可循环流动的凹槽， 凹槽与散热基板背离 LED芯片的 一侧形成冷却流道； 驱动冷却介质流动装置包括安装在凹槽底部的两个相 互啮合的第一齿轮和第二齿轮、 设置在背离凹槽的一侧带动第一齿轮和第 二齿轮转动的驱动电机， 在驱动电机与第一齿轮或第二齿轮间设有使第一 齿轮或第二齿轮转动的磁铁， 磁铁与第一齿轮或第二齿轮间磁固定； 流道 板为非磁性材料。  As a second modification of the first solution, the flow path housing is a flow path plate, and the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip. a cooling flow passage; the driving cooling medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, and a driving motor disposed on a side facing away from the groove to drive the first gear and the second gear to rotate, A magnet for rotating the first gear or the second gear is disposed between the driving motor and the first gear or the second gear, and the magnet is magnetically fixed with the first gear or the second gear; the flow path plate is a non-magnetic material.
作为方案一的第三种改进， 驱动冷却介质流动装置包括置于冷却流道 内并安装在流道壳体上的搅拌叶轮、 设置在背离冷却流道的一侧带动搅拌 叶轮转动的驱动电机， 搅拌叶轮的叶轮轴穿过流道壳体与流道壳体气密封 或液密封。  As a third modification of the first solution, the driving cooling medium flow device comprises a stirring impeller placed in the cooling flow passage and mounted on the flow path housing, and a driving motor disposed on a side facing away from the cooling flow passage to drive the stirring impeller to rotate, stirring The impeller shaft of the impeller is hermetically sealed or fluidly sealed through the runner housing and the runner housing.
作为方案一的第四种改进， 驱动冷却介质流动装置包括置于冷却流道 内并安装在流道壳体上的搅拌叶轮、 设置在背离冷却流道的一侧带动搅拌 叶轮转动的驱动电机， 在驱动电机与搅拌叶轮间设有使搅拌叶轮转动的磁 铁， 磁铁与搅拌叶轮间磁固定； 流道壳体为非磁性材料。 As a fourth improvement of the first solution, the driving cooling medium flow device comprises a stirring impeller placed in the cooling flow passage and mounted on the flow path housing, and arranged on the side facing away from the cooling flow passage to drive the stirring. The driving motor for rotating the impeller is provided with a magnet for rotating the stirring impeller between the driving motor and the stirring impeller, and magnetically fixed between the magnet and the stirring impeller; the flow path housing is a non-magnetic material.
作为方案一的第五种改进， 在流道壳体的外壁上设有冷却风扇， 冷却 介质为不制冷的冷却介质，流道壳体为散热件，流道壳体直接与空气接触。  As a fifth improvement of the first embodiment, a cooling fan is disposed on the outer wall of the flow path housing, the cooling medium is a cooling medium that is not cooled, the flow path housing is a heat dissipating member, and the flow path housing is directly in contact with the air.
作为方案一的第六种改进， 流道壳体为流道板， 冷却流道包括设置在 流道板上使冷却介质可循环流动的凹槽， 驱动冷却介质流动装置安装在凹 槽内； 在流道板背离凹槽的一侧对应凹槽的位置为凸出流道板的散热凸条， 冷却流道为高低不平的冷却流道； 在流道板背离散热基板的一侧还设有导 风板， 导风板与流道板形成与凹槽平行的风道； 在风道的一侧安装有冷却 风扇； 冷却介质为不制冷的冷却介质， 流道板为散热板， 流道板背离凹槽 的一侧直接与空气接触。  As a sixth improvement of the first solution, the flow path housing is a flow path plate, and the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the driving cooling medium flow device is installed in the groove; The side of the flow channel plate facing away from the groove corresponds to the heat dissipating rib of the flow channel plate, and the cooling flow channel is a rugged cooling flow channel; the side of the flow plate back is also provided with a guide on the side of the discrete thermal substrate. The wind deflector, the air deflector and the flow channel plate form a duct parallel to the groove; a cooling fan is installed on one side of the air duct; the cooling medium is a cooling medium that is not cooled, the flow channel plate is a heat sink, and the flow channel plate faces away from One side of the groove is in direct contact with the air.
作为方案一的第七种改进， 流道壳体为流道板， 冷却流道包括设置在 流道板上使冷却介质可循环流动的凹槽， 凹槽与散热基板背离 LED芯片的 一侧形成冷却流道； 冷却装置还包括制冷装置， 制冷装置安装在流道板背 离散热基板的一侧， 制冷装置的吸热端可导热地贴合在流道板上并置于循 环流道背面的设定位置， 冷却介质为液体。  As a seventh improvement of the first solution, the flow path housing is a flow path plate, and the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate, and the groove and the heat dissipation substrate are formed away from the side of the LED chip. Cooling device; the cooling device further comprises a refrigerating device, wherein the refrigerating device is mounted on one side of the discrete thermal substrate on the back of the flow channel, and the heat absorbing end of the refrigerating device is thermally conductively attached to the flow channel plate and disposed on the back of the circulating flow channel At a fixed position, the cooling medium is a liquid.
作为改进， 制冷装置还包括半导体制冷装置或磁制冷装置， 设置在流 道板背离散热基板的一侧的散热片； 制冷装置的吸热端可导热地贴合在流 道板的凹槽的背面， 制冷装置的散热端可导热地贴合在散热片上。  As an improvement, the refrigerating apparatus further includes a semiconductor refrigerating device or a magnetic refrigerating device, and a heat dissipating fin disposed on one side of the discrete hot substrate of the flow path plate; the heat absorbing end of the refrigerating device is thermally conductively attached to the back surface of the groove of the flow path plate The heat dissipating end of the refrigerating device is thermally conductively attached to the heat sink.
作为又一改进， 制冷装置包括半导体制冷装置或磁制冷装置； 在流道 板背离散热基板的一侧还设有散热板， 在散热板背离流道板的一侧还设有 冷却槽， 在散热板背离流道板的一侧还设有密封冷却槽的密封板， 制冷装 置的吸热端可导热地贴合在流道板的冷却流道的背面， 制冷装置的散热端 可导热地贴合在散热板上。  As a further improvement, the refrigerating device includes a semiconductor refrigerating device or a magnetic refrigerating device; a heat dissipating plate is further disposed on a side of the flow plate back of the discrete thermal substrate, and a cooling groove is further disposed on a side of the heat dissipating plate facing away from the flow channel plate to dissipate heat The side of the plate away from the flow channel plate is further provided with a sealing plate for sealing the cooling groove, and the heat absorption end of the refrigeration device can be thermally coupled to the back surface of the cooling flow channel of the flow channel plate, and the heat dissipation end of the refrigeration device can be thermally coupled On the heat sink.
作为方案一的第八种改进， 在流道壳体上还设有与冷却流道连通的冷 却介质进口和冷却介质出口， 冷却介质进口和冷却介质出口与外部的冷却 介质连通。 作为方案一的第九种改进， 冷却装置还包括制冷装置、 设置在流道壳 体上与冷却流道连通的冷却介质口， 制冷装置的冷却介质通过冷却介质口 与冷却流道连通， 冷却介质由驱动冷却介质流动装置驱动在冷却流道和制 冷装置之间循环流动。 As an eighth improvement of the first solution, a cooling medium inlet and a cooling medium outlet communicating with the cooling flow passage are further disposed on the flow path housing, and the cooling medium inlet and the cooling medium outlet are in communication with the external cooling medium. As a ninth modification of the first aspect, the cooling device further includes a refrigerating device, a cooling medium port disposed on the flow path housing and communicating with the cooling flow channel, and the cooling medium of the refrigerating device is connected to the cooling flow channel through the cooling medium port, the cooling medium The circulation of the cooling flow path and the refrigerating device is driven by the driving of the cooling medium flow device.
作为方案一的第八种改进， 还设有与冷却流道连通的冷却介质进口和 冷却介质出口， 冷却介质进口和冷却介质出口与外部的冷却介质连通。  As an eighth improvement of the first aspect, a cooling medium inlet and a cooling medium outlet communicating with the cooling flow passage are also provided, and the cooling medium inlet and the cooling medium outlet are in communication with the external cooling medium.
作为上述方案的第一种共同改进， 在散热基板上设有与散热基板一体 成型的一个或一个以上的凸台， LED芯片通过固晶工艺直接固定在凸台的端 面上； 凸台置于对应的第一通孔内。  As a first common improvement of the above solution, one or more bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the LED chip is directly fixed on the end surface of the boss by a die bonding process; Inside the first through hole.
作为上述方案的第二种共同改进， 还包括 PCB板， 布图电路导电层直 接设置在 PCB板上， 在 PCB板上设有与固定柱配合的第三通孔， 固定柱依 次穿过 PCB板上的第三通孔和散热基板上的第四通孔， 再通过热将散热基 板、 PCB板置于成型定位透镜或成型透镜的塑胶件的模具内，在成型定位透 镜或成型透镜的塑胶件时成型有抵挡部。  As a second common improvement of the above solution, the PCB board is further disposed on the PCB board, and the third through hole is matched with the fixing post on the PCB board, and the fixing column passes through the PCB board in sequence. The third through hole on the third through hole and the fourth through hole on the heat dissipation substrate, and then the heat dissipation substrate and the PCB board are placed in the mold of the plastic part forming the positioning lens or the molded lens by heat, and the plastic part of the positioning lens or the molding lens is formed. The part is formed with a resisting portion.
作为上述方案的第三种共同改进， 还包括用来封装 LED芯片和导线的 封装胶体； 透镜通过与第一通孔紧配合或通过压边机热压固定在定位透镜 或成型透镜的塑胶件上； 在定位透镜或成型透镜的塑胶件上对应第一通孔 的位置设有注入封装胶体的注胶通道， 注胶通道的胶口置于定位透镜或成 型透镜的塑胶件远离抵挡部一侧的端面上， 胶口和注胶通道与第一通孔的 内侧壁连通； 注入封装胶体后， 封装胶体进一步将透镜固定； 通过将散热 基板置于成型定位透镜或成型透镜的塑胶件的模具内在成型定位透镜或成 型透镜的塑胶件时成型固定柱端部的抵挡部。  As a third common improvement of the above solution, the package colloid for packaging the LED chip and the wire is further included; the lens is fixed to the plastic part of the positioning lens or the molding lens by tight fitting with the first through hole or by hot pressing by a crimper. The plastic injection member of the positioning lens or the molded lens is provided with a glue injection channel for injecting the package colloid at a position corresponding to the first through hole, and the rubber port of the injection injection channel is placed on the side of the plastic part of the positioning lens or the molded lens away from the resisting portion. On the end surface, the glue port and the glue injection channel communicate with the inner side wall of the first through hole; after the encapsulant is injected, the encapsulant further fixes the lens; and the heat dissipating substrate is formed in a mold of the plastic part forming the positioning lens or the molded lens. When the lens or the plastic part of the lens is molded, the abutting portion of the end of the fixing column is formed.
作为上述方案的第四种共同改进， 透镜为封装 LED芯片和导线的封装 胶体； 通过将散热基板置于成型定位透镜或成型透镜的塑胶件的模具内在 成型定位透镜或成型透镜的塑胶件时成型固定柱端部的抵挡部。  As a fourth common improvement of the above solution, the lens is an encapsulation colloid for encapsulating the LED chip and the wire; and is formed by molding the disposing lens or the plastic part of the molding lens by placing the heat dissipating substrate in a mold of the plastic part forming the positioning lens or the molding lens. The abutment of the end of the fixed column.
作为上述方案的第五种共同改进， 定位透镜或成型透镜的塑胶件为塑 胶环， 在散热基板上固定有两个或两个以上相互独立的塑胶环。 作为上述方案的第六种共同改进， 定位透镜或成型透镜的塑胶件包括 塑胶环和将设定个数的塑胶环连接在一起的与塑胶环一起注塑成型的连接 筋， 定位透镜或成型透镜的塑胶件包括两个或两个以上塑胶环。 As a fifth common improvement of the above solution, the plastic part of the positioning lens or the forming lens is a plastic ring, and two or more plastic rings independent of each other are fixed on the heat dissipation substrate. As a sixth common improvement of the above solution, the plastic part of the positioning lens or the forming lens comprises a plastic ring and a connecting rib formed by injection molding together with the plastic ring connecting the set number of plastic rings, positioning lens or molding lens Plastic parts include two or more plastic rings.
作为上述方案的第七种共同改进， 定位透镜或成型透镜的塑胶件为板 状， 在定位透镜或成型透镜的塑胶件上设有两个或两个以上第一通孔。  As a seventh common improvement of the above solution, the plastic member for positioning the lens or the molded lens is in the form of a plate, and two or more first through holes are provided in the plastic member of the positioning lens or the molded lens.
带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 在定位透镜或成型透镜的塑胶件上设有一个或一个以上的 第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设有固定柱， 在 散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热基板的第二通 孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑胶件通过固定 柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔的侧壁与 LED芯 片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电极电连接， 导线 的另一端与第一通孔与 LED芯片之间的布图电路导电层电连接； 冷却装置 包括设置在散热基板背离 LED芯片一侧的风扇， 散热基板背离 LED芯片的 一侧与空气直接接触。  An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate. The fixing post passes through the second through hole of the heat dissipation substrate, and the resisting portion is disposed at the end of the fixing column; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; the LED chip is directly processed by the die bonding process Fixed on the heat dissipation substrate and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, the wire is placed in the first through hole, and one end of the wire and the LED The electrode of the chip is electrically connected, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; the cooling device comprises a heat dissipation base LED chip side facing away from the fan, and the air cooling the side facing away from the substrate in direct contact with the LED chip.
带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 在定位透镜或成型透镜的塑胶件上设有一个或一个以上的 第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设有固定柱， 在 散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热基板的第二通 孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑胶件通过固定 柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔的侧壁与 LED芯 片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电极电连接， 导线 的另一端与第一通孔与 LED芯片之间的布图电路导电层电连接； 冷却装置 包括设置在散热基板背离 LED芯片的一侧流道板、 在流道板和散热基板间 形成的容置冷却介质的冷却流道、制冷装置； LED芯片的背面完全被冷却流 道覆盖， 固定柱与散热基板间形成气密封或液密封； 散热基板背离 LED芯 片的一侧与冷却介质直接接触； 冷却流道倾斜于水平面布置， 制冷装置的 吸热端置于冷却流道的顶部。 An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and a layout circuit of the electrical connection wire, in positioning the lens or forming One or more first through holes are formed in the plastic part of the lens, and a fixing post is extended on an end surface of the plastic part of the positioning lens or the molding lens, and a second through hole is matched on the heat dissipation substrate. The fixing post passes through the second through hole of the heat dissipation substrate, and the resisting portion is disposed at the end of the fixing column; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; the LED chip is directly processed by the die bonding process Fixed on the heat dissipation substrate and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, the wire is placed in the first through hole, and one end of the wire and the LED The electrodes of the chip are electrically connected, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; The utility model comprises a flow channel plate disposed on a side of the heat dissipation substrate facing away from the LED chip, a cooling flow channel for accommodating the cooling medium formed between the flow channel plate and the heat dissipation substrate, and a refrigeration device; the back surface of the LED chip is completely covered by the cooling flow channel, and the fixing column is fixed Forming a hermetic seal or a liquid seal with the heat dissipating substrate; the side of the heat dissipating substrate facing away from the LED chip is in direct contact with the cooling medium; the cooling flow path is arranged at a horizontal plane, and the heat absorbing end of the refrigerating device is placed at the top of the cooling flow path.
与现有技术相比， 本发明的有益效果是：  Compared with the prior art, the beneficial effects of the present invention are:
1、 LED芯片直接通过固晶工艺直接固定在散热基板上， 散热基板背离 LED芯片的一侧与散热气体或散热液体直接接触，本结构的散热基板为薄板， 散热基板的厚度范围一般在 0. 2mm至 5mm内。 这种带有冷却装置的 LED集 成结构的 COB ( Chip on Board ) 封装设计， 与现有的带有冷却装置的 LED 集成结构相比， 由于本发明直接将 LED芯片通过银胶或共晶焊料等固定在 散热基板上， LED芯片工作时产生的热量经过散热基板薄薄的导热层就直接 与散热气体如空气接触或与散热液体接触，接触散热基板的热量因为热冷 气体或液体密度差流动效应迅速被带走， 从而带走基板的热量，可以最大限 度的减少中间环节的热阻， 大大减少 LED芯片 p-n结发热部到外部空气环 境或散热液体的传热路径距离， 从而大大减少热阻。  1. The LED chip is directly fixed on the heat dissipation substrate by the die bonding process, and the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the heat dissipation gas or the heat dissipation liquid. The heat dissipation substrate of the structure is a thin plate, and the thickness of the heat dissipation substrate is generally in the range of 0. 2mm to 5mm. The COB (Chip on Board) package design of the LED integrated structure with a cooling device is directly compared with the existing LED integrated structure with a cooling device, and the LED chip is directly passed through a silver paste or a eutectic solder. Fixed on the heat-dissipating substrate, the heat generated by the working of the LED chip passes through the thin heat-conducting layer of the heat-dissipating substrate and directly contacts the heat-dissipating gas such as air or the heat-dissipating liquid, and the heat contacting the heat-dissipating substrate is caused by the difference in density of the hot-cold gas or liquid. It is quickly taken away, thus taking away the heat of the substrate, which can minimize the thermal resistance of the intermediate link, and greatly reduce the heat transfer path distance from the pn junction heating portion of the LED chip to the external air environment or the heat dissipating liquid, thereby greatly reducing the thermal resistance.
2、 由于均设有定位透镜或成型透镜的塑胶件， 布图电路导电层可伸入 定位透镜或成型透镜的塑胶件内， 一方面导线可直接与布图电路导电层电 连接， 不再需要通过导电金属支架将导线与布图电路导电层连接或通过接 线脚从背离 LED芯片的散热基板穿出与布图电路导电层连接， 简化了结构 和最大限度的减少中间环节的热阻， 散热效果好； 另一方面不再需要焊接 金属支架或接线脚与布图电路导电层电连接， 不需要回流焊或波峰焊， 因 此封装胶体可以用树脂或硅胶等； 而且还可保证 LED芯片、 电连接导线及 其两个焊接端不会暴露于空气中， 有利于使用的长寿命。 而需要回流焊或 波峰焊时， 由于回流焊或波峰焊的温度一般在 250C°或 280C°，封装胶体就 不可以使用树脂。 由于硅胶的价格远远高于树脂， 透光性比树脂差， 因此 本发明可以进一步节省成本， 提高 LED芯片的光学性能。 这种 COB封装设 计的优点在于每个 LED 芯片 2的电极都通过键合导线直接与布图电路导电 层形成欧姆接触， 多路 LED芯片阵列的形成是通过散热基板与 LED芯片的 电连接装置实现电气互联， 即可实现 LED芯片的串并联， 又可提高产品的 可靠性和生产合格率。 2. Since the plastic parts of the positioning lens or the forming lens are provided, the conductive layer of the layout circuit can be inserted into the plastic part of the positioning lens or the forming lens, and the wire can be directly connected to the conductive layer of the layout circuit, and is no longer needed. The conductive wire is connected to the conductive layer of the layout circuit through the conductive metal bracket or through the wiring substrate from the heat dissipation substrate facing away from the LED chip and connected to the conductive layer of the layout circuit, thereby simplifying the structure and minimizing the thermal resistance of the intermediate link, and the heat dissipation effect On the other hand, it is no longer necessary to solder the metal bracket or the wiring pin to the electrical connection of the conductive layer of the layout circuit, and no reflow or wave soldering is required. Therefore, the encapsulant can be made of resin or silica gel; and the LED chip and the electrical connection can be ensured. The wire and its two soldered ends are not exposed to the air, which is beneficial for long life. When reflow soldering or wave soldering is required, since the temperature of reflow soldering or wave soldering is generally 250C or 280C, the encapsulant cannot use the resin. Since the price of the silica gel is much higher than that of the resin, and the light transmittance is inferior to that of the resin, the present invention can further save costs and improve the optical performance of the LED chip. This COB package The advantage of the meter is that the electrodes of each LED chip 2 directly form an ohmic contact with the conductive layer of the layout circuit through the bonding wires, and the formation of the multi-channel LED chip array is electrically interconnected by the electrical connection device between the heat dissipation substrate and the LED chip, that is, It can realize series and parallel connection of LED chips, and can improve product reliability and production yield.
3、 在散热基板背离 LED芯片的一侧设有冷却流道， 在冷却流道内充满 冷却介质， 由于冷却介质温度容易控制， 驱动冷却介质流动装置能使冷却 流道内的冷却介质快速流动，热交换更快， 能更快更多地带走由 LED芯片产 生的热量， 因此比散热基板直接与空气接触， 冷却效果更好。 特别是对于 散热基板水平放置时， 驱动冷却介质流动装置能使冷却流道内的冷却介质 温度基本一致， 因而能使整个散热基板的温度接近一致， 热量不会集中在 LED芯片位置。  3. A cooling flow channel is arranged on a side of the heat dissipation substrate facing away from the LED chip, and a cooling medium is filled in the cooling flow channel. Since the temperature of the cooling medium is easily controlled, the cooling medium flowing device can quickly flow the cooling medium in the cooling flow channel, and the heat exchange is performed. Faster, faster and more away from the heat generated by the LED chip, so it is directly in contact with the air than the heat sink substrate, and the cooling effect is better. In particular, when the heat dissipating substrate is horizontally placed, the driving cooling medium flowing device can make the temperature of the cooling medium in the cooling flow channel substantially uniform, so that the temperature of the entire heat dissipating substrate is nearly uniform, and the heat is not concentrated at the position of the LED chip.
4、 冷却流道包括设置在流道板上使冷却介质可循环流动的凹槽， 驱动 冷却介质流动装置为相互啮合的两个齿轮和驱动电机， 结构简单， 且冷却 流道内的冷却介质能通过冷却介质的快速循环流动交换热量，冷却效果好。  4. The cooling flow path includes a groove disposed on the flow path plate to circulate the cooling medium, and the driving cooling medium flow device is two gears and a driving motor that mesh with each other, the structure is simple, and the cooling medium in the cooling flow channel can pass The rapid circulation of the cooling medium exchanges heat and has a good cooling effect.
5、 驱动冷却介质流动装置为搅拌叶轮和驱动电机， 结构简单， 且冷却 流道内的冷却介质通过冷却介质的快速循环流动交换热量， 冷却效果好。  5. The driving cooling medium flowing device is a stirring impeller and a driving motor, and the structure is simple, and the cooling medium in the cooling flow channel exchanges heat through the rapid circulating flow of the cooling medium, and the cooling effect is good.
6、 搅拌叶轮或相互啮合的两个齿轮通过磁力带动， 磁铁隔着流道板带 动两个齿轮或搅拌叶轮， 流道板为一个整体， 不需要开孔和密封结构， 结 构简单， 密封效果好， 且使用寿命长。 磁铁与搅拌叶轮或齿轮间的流道板 为非磁性材料， 如铜材、 铝材、 不锈钢、 陶瓷等。  6. The stirring impeller or the two gears meshing with each other are driven by magnetic force. The magnet drives the two gears or the stirring impeller through the flow channel plate. The flow channel plate is a whole, no opening and sealing structure is required, and the structure is simple and the sealing effect is good. , and has a long service life. The flow plate between the magnet and the stirring impeller or gear is made of non-magnetic material such as copper, aluminum, stainless steel, ceramics, etc.
7、 在流道壳体背离冷却流道的一侧设有冷却风扇， 冷却风扇可以安装 在流道壳体的背面， 也可安装在流道壳体的侧面， 冷却风扇可以使冷却介 质的热量透过流道壳体迅速散发到空气中， 使冷却介质始终保持较低的温 度， 从而使冷却介质能更快更多地带走 LED芯片产生的热量。  7. A cooling fan is disposed on a side of the flow path housing facing away from the cooling flow passage. The cooling fan may be installed on the back side of the flow path housing or on the side of the flow path housing, and the cooling fan may heat the cooling medium. It is quickly dissipated into the air through the flow path shell, so that the cooling medium is always kept at a lower temperature, so that the cooling medium can quickly remove more heat generated by the LED chip.
8、在流道板背离凹槽的一侧对应凹槽的位置为凸出流道板的散热凸条 形成高低不平的冷却流道，尽可能增大冷却流道板与空气的接触面积， 从而 增大散热面积， 增加冷却风扇和散热凸条可以使冷却介质的热量透过流道 板迅速散发到空气中， 使冷却介质始终保持较低的温度， 从而使冷却介质 能更快更多地带走 LED芯片产生的热量。 8. The position of the corresponding groove on the side of the flow channel plate facing away from the groove is such that the heat dissipation rib of the convex flow channel plate forms a rugged cooling flow passage, thereby increasing the contact area between the cooling flow channel plate and the air as much as possible, thereby Increase the heat dissipation area, increase the cooling fan and heat dissipation ribs to allow the heat of the cooling medium to pass through the flow path The plate is quickly released into the air, keeping the cooling medium at a low temperature, so that the cooling medium can take away more heat from the LED chip.
9、 制冷装置安装在对应凹槽的位置， 制冷装置只需冷却少量的冷却介 质并通过驱动冷却介质流动装置使冷却介质在凹槽内快速流动， 可以使冷 却介质达到需要的温度， 从而使冷却介质能更快更多地带走 LED芯片产生 的热量，使 LED芯片、 整个散热基板达到需要的温度且各个 LED芯片、 整个 散热基板的温度基本保持一致。  9. The refrigeration device is installed at the position corresponding to the groove. The refrigeration device only needs to cool a small amount of cooling medium and drive the cooling medium flow device to make the cooling medium flow rapidly in the groove, so that the cooling medium can reach the required temperature, thereby cooling The medium can take away the heat generated by the LED chip more quickly, so that the LED chip and the entire heat dissipation substrate reach the required temperature, and the temperatures of the respective LED chips and the entire heat dissipation substrate are substantially consistent.
10、 采用半导体半导体制冷装置， 结构简单、 成本低、 制冷效果好； 采用磁制冷装置， 制冷效果好； 制冷装置的吸热端可导热地贴合在流道壳 体的冷却流道的背面， 可将散热基板上的热量迅速带走， 制冷装置的散热 端可导热地贴合在散热片上， 可将制冷装置的热量迅速散发到空气中去。  10. The semiconductor semiconductor refrigeration device is simple in structure, low in cost and good in cooling effect; the magnetic refrigeration device has good cooling effect; the heat absorption end of the refrigeration device can be thermally conductively attached to the back surface of the cooling flow channel of the flow channel housing. The heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat sink, and the heat of the refrigerating device can be quickly dissipated into the air.
11、 制冷装置的吸热端可导热地贴合在流道壳体的冷却流道的背面， 可将散热基板上的热量迅速带走， 制冷装置的散热端可导热地贴合在散热 板上， 可将制冷装置的热量迅速散发到冷却槽中去， 冷却效果更好。  11. The heat absorbing end of the refrigerating device can be thermally coupled to the back surface of the cooling flow channel of the flow channel housing, and the heat on the heat dissipating substrate can be quickly taken away, and the heat dissipating end of the refrigerating device can be thermally conductively attached to the heat dissipating plate. The heat of the refrigeration unit can be quickly dissipated into the cooling tank for better cooling.
12、 通过外部的冷却介质不断在冷却流道内流动带走散热基板和 LED 芯片的热量， 就可以达到很好地冷却效果。  12. The external cooling medium continuously flows in the cooling flow path to remove the heat of the heat dissipation substrate and the LED chip, so that a good cooling effect can be achieved.
13、 制冷装置的冷却介质通过冷却介质口与冷却流道连通， 直接通过 制冷装置的冷却介质冷却冷却流道， 热损失环节少， 冷却效果好。  13. The cooling medium of the refrigerating device communicates with the cooling flow passage through the cooling medium port, and directly cools the cooling flow passage through the cooling medium of the refrigerating device, and the heat loss link is small, and the cooling effect is good.
14、 在散热基板上设有与散热基板一体成型的多个芯片固定凸台， 散 热基板的面积大大的大于芯片固定凸台顶部的面积， LED芯片通过固晶方式 直接固定在芯片固定凸台上。 这样一方面大大减少 LED芯片产生的热量散 发于散热气体即空气中或散热液体中的中间路径距离和大大增加了与散热 液体和散热气体的接触面积， 大大减少了热积聚效应，可大大提高散热效率 和使芯片保持于合适的工作温度，从而保持芯片的长寿命及有效发光效率。 芯片固定凸台与散热基板一体成型， 因此芯片产生的热量只透过散热基板 就直接散发于空气中，故热阻小， 散热速度快，不须借助其它散热件来散热， 散热效果便相当好由于有芯片固定凸台，使得电连接导线对 LED芯片发出的 光线的抵挡阴影降到最低 ，利于光学二次优化!省去了现有的 LED支架，也 就是省去了 LED支架中的散热金属件， 及其电极金属脚等多层中间环节， 尤其避免了散热金属件与散热基板的两个零件之间产生的高热阻，因此热 阻小， 导热快散热效果好， 结构简单可靠， 尤其芯片固定凸台与散热基板 一体成型更有利于光源的设计与装配工艺， 又节省成本。 因此本发明结构 简单可靠，零件少，厚度薄， 易于装配， 特别适用于对光源要求大功率的场 合。 14. A plurality of chip fixing bosses integrally formed with the heat dissipation substrate are disposed on the heat dissipation substrate, and the area of the heat dissipation substrate is substantially larger than the area of the top of the chip fixing boss, and the LED chip is directly fixed on the chip fixing boss by the die bonding method. . In this way, the heat generated by the LED chip is greatly reduced in the intermediate path distance of the heat dissipating gas, that is, in the air or the heat dissipating liquid, and the contact area with the heat dissipating liquid and the dissipating gas is greatly increased, the heat accumulation effect is greatly reduced, and the heat dissipation can be greatly improved. Efficiency and keeping the chip at the proper operating temperature maintains long life and efficient luminous efficiency of the chip. The chip fixing boss and the heat dissipation substrate are integrally formed, so the heat generated by the chip is directly emitted into the air through the heat dissipation substrate, so the heat resistance is small, the heat dissipation speed is fast, and the heat dissipation is not required by the other heat sink, and the heat dissipation effect is quite good. Due to the chip fixing boss, the electrical connection wire is emitted to the LED chip The shadow of the light is reduced to the lowest, which is conducive to optical secondary optimization! The existing LED bracket is omitted, that is, the heat-dissipating metal parts in the LED bracket and the electrode intermediate parts thereof are omitted, especially avoiding The high thermal resistance generated between the heat dissipating metal member and the two parts of the heat dissipating substrate, so the thermal resistance is small, the heat conduction has a fast heat dissipation effect, and the structure is simple and reliable. In particular, the chip fixing boss and the heat dissipating substrate are integrally formed to facilitate the design and assembly of the light source. Process, and save costs. Therefore, the invention has simple and reliable structure, few parts, thin thickness and easy assembly, and is particularly suitable for occasions requiring high power for the light source.
15、 布图电路导电层设置于 PCB板上时， 定位透镜或成型透镜的塑胶 件又可实现把散热基板、 PCB板固定在一起。使用 PCB板， 便于布图电路导 电层的电路的布图设计， 省掉了原来电路布图覆着于散热基板上的复杂的 制造工艺， 使用了非常成熟的 PCB板， 大大节省了成本， 既简化了工艺又 提高了布图电路导电层的可靠性和设计灵活性。同时 PCB板具有隔热作用， 更利于散热基板上的热量沿与空气接触的一侧散发出去。 15. When the conductive layer of the layout circuit is disposed on the PCB, the positioning lens or the plastic part of the molding lens can fix the heat dissipation substrate and the PCB board together. The use of a PCB board facilitates the layout design of the circuit of the conductive layer of the layout circuit, eliminating the complicated manufacturing process of the original circuit layout over the heat dissipation substrate, and using a very mature PCB board, which greatly saves cost, The process is simplified and the reliability and design flexibility of the conductive layer of the layout circuit are improved. At the same time, the PCB board has a heat insulating effect, which is more favorable for the heat on the heat dissipation substrate to be radiated along the side in contact with the air.
16、 注胶通道的胶口置于塑胶透镜定位件远离抵挡部一侧的端面上， 注胶通道与塑胶透镜定位件的内侧壁连通， 便于注胶； 由于塑胶透镜定位 件是塑胶件， 因此胶口和注胶通道易成型。 在注入封装胶体前， 透镜与塑 胶透镜定位件紧配合或热压固定， 这样透镜先固定再封装， 在封装 LED芯 片时， 透镜不会移位， 有利于灌胶和固化工序， 特别是比现有的只通过靠 硅胶等的粘结力来固定透镜可靠得多。 当封装 LED芯片时， 先把芯片通过 固晶方式固定在散热基板芯片固定凸台上， 再焊接电连接导线， 然后再安 装透镜，在抽真空环境中通过塑胶透镜定位件上的注胶口进行注胶，因此， 塑胶透镜定位件可实现封装时的透镜位置的精确安装， 以及通过抽真空及 注胶后把透镜、 LED芯片、 电连接导线及其两个焊接端、散热基板及其芯片 固定凸台固化在一起， 特别是封装时这种结构可实现在抽真空环境下封装 胶体固化时无气泡产生， 对 LED芯片的发光质量起到重要的保证作用， 不 会导致散发出来的光线有光斑， 阴影等光学先天缺陷； 由于没有了气泡产 生的 LED芯片发光质量的光学先天缺陷， 更有利于 LED光源的光学二次优 化开发， 塑胶透镜定位件使透镜安装方便和实现透镜安装位置精确固定和 固定可靠， 对光效的聚集利于光学的二次优化， 最终实现光学效果好， 同 时塑胶透镜定位件和透镜又使注胶时硅胶的填充量少， 可降低成本。 16. The glue port of the glue injection channel is placed on the end surface of the plastic lens positioning member away from the resisting portion, and the glue injection channel communicates with the inner side wall of the plastic lens positioning member to facilitate the injection; since the plastic lens positioning member is a plastic piece, The glue and glue injection channels are easy to form. Before injecting the encapsulant, the lens is tightly fitted or fixed by the plastic lens positioning member, so that the lens is first fixed and repackaged, and the lens is not displaced when the LED chip is packaged, which is beneficial to the filling and curing process, especially Some are much more reliable by fixing the lens only by the adhesion of silicone or the like. When the LED chip is packaged, the chip is first fixed on the heat sink substrate fixing boss by means of die bonding, and then the electrical connection wire is soldered, and then the lens is mounted, and the glue injection port on the plastic lens positioning member is performed in a vacuum environment. Injection molding, therefore, the plastic lens positioning member can accurately mount the lens position during packaging, and fix the lens, the LED chip, the electrical connection wire and its two soldering ends, the heat dissipation substrate and the chip thereof after vacuuming and injection molding. The bumps are solidified together, especially when the package is packaged, the bubble can be generated when the package colloid is solidified in a vacuum environment, which plays an important role in ensuring the light quality of the LED chip, and does not cause the emitted light to have a spot. , optical congenital defects such as shadows; optical congenital defects of LED chip illumination quality without bubble generation, more favorable to optical secondary optimization of LED light source The development of plastic lens positioning parts makes the lens easy to install and realizes the precise fixing and fixing of the lens mounting position. The aggregation of light effect is beneficial to the secondary optimization of optics, and finally the optical effect is good. At the same time, the plastic lens positioning member and the lens make the injection. When the glue is used, the filling amount of the silica gel is small, and the cost can be reduced.
17、 定位透镜或成型透镜的塑胶件通过将散热基板置于成型定位透镜 或成型透镜的塑胶件的模具内在成型定位透镜或成型透镜的塑胶件时成型 抵挡部将散热基板定位和固定， 固定可靠， 在后续的封装工艺过程中， 能 耐高温， 在高温条件下其固定的可靠性也不会受影响。 定位透镜或成型透 镜的塑胶件通过在注塑成形定位透镜或成型透镜的塑胶件时与散热基板固 定， 一方面省去了将定位透镜或成型透镜的塑胶件安装到散热基板上的安 装工序， 对于一个散热基板上设有多个定位透镜或成型透镜的塑胶件的情 况下， 大大节约了生产成本， 另一方面定位透镜或成型透镜的塑胶件与散 热基板在轴向、 径向方向均不存在间隙， 即使是液体的冷却介质也可直接 与散热基板接触， 提高冷却效果， 且固定非常可靠， 散热基板与定位透镜 或成型透镜的塑胶件之间的位置关系可以非常精确， 定位透镜或成型透镜 的塑胶件上的透镜安装位置尺寸可以非常精确， 从而提高带有冷却装置的 LED集成结构的光学效果。  17. The plastic part of the positioning lens or the forming lens fixes and fixes the heat dissipating substrate by placing the heat dissipating substrate in the mold of the plastic part forming the positioning lens or the molding lens to form the positioning lens or the plastic part of the molding lens, and the fixing is reliable. In the subsequent packaging process, it can withstand high temperatures, and the reliability of its fixation will not be affected under high temperature conditions. The plastic part of the positioning lens or the forming lens is fixed to the heat dissipating substrate by injection molding the positioning lens or the plastic part of the molding lens, thereby eliminating the installation process of mounting the positioning lens or the plastic part of the molding lens on the heat dissipation substrate. In the case where a plurality of positioning lenses or molded plastic parts are provided on one heat dissipating substrate, the production cost is greatly saved. On the other hand, the plastic parts of the positioning lens or the molding lens and the heat dissipating substrate do not exist in the axial direction and the radial direction. Gap, even the liquid cooling medium can directly contact the heat sink substrate, improve the cooling effect, and the fixing is very reliable. The positional relationship between the heat dissipating substrate and the positioning lens or the plastic part of the forming lens can be very precise, positioning lens or molding lens The lens mounting position on the plastic part can be very precise in size, thereby improving the optical effect of the LED integrated structure with the cooling device.
18、 芯片置于单个的塑胶透镜定位环内， 在成型定位透镜或成型透镜 的塑胶件时塑胶用量大大减少， 降低成本。 透镜通过紧配合或热压方式固 定在定位透镜或成型透镜的塑胶件上，这样透镜先固定再封装，在封装 LED 芯片时， 透镜不会移位， 有利于灌胶和固化工序， 特别是比现有的只通过 靠硅胶等的粘结力来固定透镜可靠得多。  18. The chip is placed in a single plastic lens positioning ring. When the positioning lens or the molded plastic part is molded, the amount of plastic is greatly reduced, and the cost is reduced. The lens is fixed on the plastic part of the positioning lens or the forming lens by tight fitting or hot pressing, so that the lens is first fixed and repackaged, and the lens is not displaced when the LED chip is packaged, which is beneficial to the filling and curing process, especially It is much more reliable to fix the lens only by the adhesion of silicone or the like.
19、 在一块散热基板上的全部塑胶定位环可在注塑时通过连接筋连接 成一个整体的定位透镜或成型透镜的塑胶件； 也可将一块散热基板上的部 分透镜定位环连接为一个整体的定位透镜或成型透镜的在注塑时塑胶件， 在一块散热基板上设有两个或两个以上这种定位透镜或成型透镜的塑胶件。 一个芯片固定凸台对应一个塑胶透镜定位环， 在成型塑胶透镜定位环时塑 胶用量少， 成本低。 通过连接筋将塑胶透镜定位环连接为一个整体， 第一 是在注塑成型定位透镜或成型透镜的塑胶件时， 其模具浇口可以设置在塑 胶透镜定位环上或连接筋上， 便于模具浇口的布置和在注塑时更利于模具 内的塑胶充填平衡， 而且不同塑胶透镜定位环之间的塑胶流动通过连接筋 来实现， 可减少模具浇口的数量和便于模具流道的设计， 可用一个模具浇 口成型两个或两个以上的塑胶透镜定位环， 如在塑胶透镜定位环个数较少 的情况下可只直接设计一个直浇口就可成型多个塑胶透镜定位环； 第二是 可减少固定柱的个数， 并不需要在每个塑胶定位环上设有两个或两个以上 的固定柱， 这样一方面可降低模具制造成本， 另一方面可在注塑成型定位 透镜或成型透镜的塑胶件时减少塑胶的用量； 第三是对于同样大小的塑胶 透镜定位环， 可将固定柱设计在塑胶透镜定位环和连接筋交界的位置， 因 此可增加固定柱的横截面； 第四是对于同样大小的塑胶透镜定位环， 因为 成型相邻的透镜定位环的模腔薄壁被连通为成型连接筋的型腔， 因此在单 位面积内可排列更多的塑胶透镜定位环， 模具的使用寿命更长； 第五是塑 胶透镜定位环与塑胶透镜定位环之间的位置关系更精确、 固定更可靠， 从 而使透镜之间的位置关系更精确， 提高光学效果。 19. All the plastic positioning rings on a heat dissipating substrate can be connected into an integral positioning lens or a molded plastic part by a connecting rib during injection molding; or a part of the lens positioning ring on a heat dissipating substrate can be connected as a whole. A plastic part for positioning a lens or a molded lens at the time of injection molding, and two or more such positioning lenses or plastic parts for forming a lens are provided on one heat dissipating substrate. A chip fixing boss corresponds to a plastic lens positioning ring, and the plastic dosage is small when the plastic lens positioning ring is formed, and the cost is low. Connecting the plastic lens positioning ring as a whole through the connecting ribs, first When the plastic part of the positioning lens or the molding lens is injection molded, the mold gate can be disposed on the plastic lens positioning ring or the connecting rib, which facilitates the arrangement of the mold gate and is more favorable for the plastic filling balance in the mold during the injection molding. Moreover, the plastic flow between the different plastic lens positioning rings is realized by the connecting ribs, the number of the mold gates can be reduced and the design of the mold flow path can be facilitated, and two or more plastic lens positioning rings can be formed by one mold gate. For example, if there is a small number of plastic lens positioning rings, only one plastic spline can be directly designed to form a plurality of plastic lens positioning rings; the second is to reduce the number of fixed columns, and does not need to be positioned in each plastic. There are two or more fixed columns on the ring, which can reduce the manufacturing cost of the mold on the one hand, and reduce the amount of plastic when molding the positioning lens or the plastic part of the molded lens on the other hand. The third is for the same size. The plastic lens positioning ring can be used to design the fixing column at the boundary between the plastic lens positioning ring and the connecting rib, thereby increasing the fixing column The fourth section is for the same size of the plastic lens positioning ring, because the cavity of the cavity of the adjacent lens positioning ring is connected to form the cavity of the connecting rib, so more plastic lens positioning can be arranged in a unit area. The service life of the ring is longer; the fifth is that the positional relationship between the plastic lens positioning ring and the plastic lens positioning ring is more precise and more reliable, so that the positional relationship between the lenses is more accurate and the optical effect is improved.
20、 在一块散热基板可只设有一个板状的定位透镜或成型透镜的塑胶 件； 也可在一块散热基板上设有两个或两个以上的板状的定位透镜或成型 透镜的塑胶件。 定位透镜或成型透镜的塑胶件为板状， 第一是在注塑成型 定位透镜或成型透镜的塑胶件时， 其模具浇口设计更灵活， 便于模具浇口 的布置和在注塑时更利于模具内的塑胶充填平衡； 第二是可减少固定柱的 个数和可增加固定柱的横截面； 第三是单位面积内可布设更多的透镜； 第 四是透镜之间的位置关系更精确， 提高光学效果。  20. A heat-dissipating substrate may be provided with only one plate-shaped positioning lens or a molded plastic piece; or two or more plate-shaped positioning lenses or plastic parts of the molded lens may be disposed on one heat-dissipating substrate. . The plastic part of the positioning lens or the forming lens is plate-shaped. The first is that when the positioning lens or the plastic part of the forming lens is injection molded, the mold gate design is more flexible, and the layout of the mold gate is facilitated and the mold is more favorable in the injection molding. The plastic filling balance; the second is to reduce the number of fixed columns and increase the cross section of the fixed column; the third is to install more lenses per unit area; the fourth is the more precise positional relationship between the lenses, improve Optical effect.
21、 在散热基板背离 LED芯片的一侧直接用风扇冷却， 不再需要冷却流 道， 让流动的空气迅速带走热量，该结构简单， 冷却效果好。  21. Cool the fan directly on the side of the heat-dissipating substrate away from the LED chip. The cooling flow channel is no longer needed, so that the flowing air quickly removes heat. The structure is simple and the cooling effect is good.
22、 在散热基板背离 LED芯片的一侧设有冷却流道， 在冷却流道内充满 冷却介质， 冷却流道倾斜于水平面布置， 制冷装置的吸热端置于冷却流道 的顶部， 由于冷却介质温度容易控制， 通过冷的冷却介质的比重大于热的 冷却介质的比重， 使冷却介质自动快速产生冷却介质的交换， 从而使冷却 装置的结构简单，不需要驱动冷却介质流道装置。该结构可主要应用在 LED 背光源上或者是散热基板倾斜水平面安装的其他 LED光源上。 22. A cooling flow channel is disposed on a side of the heat dissipation substrate facing away from the LED chip, and the cooling flow channel is filled with a cooling medium, the cooling flow channel is arranged at a horizontal plane, and the heat absorption end of the refrigeration device is placed at the top of the cooling flow channel, due to the cooling medium The temperature is easily controlled, and the specific gravity of the cold cooling medium is greater than that of the hot The specific gravity of the cooling medium enables the cooling medium to automatically and quickly exchange the cooling medium, so that the structure of the cooling device is simple, and it is not necessary to drive the cooling medium flow path device. The structure can be mainly applied to an LED backlight or other LED light source mounted on a tilted horizontal plane of the heat sink substrate.
附图说明 DRAWINGS
图 1是本发明实施例 1的立体分解示意图。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of Embodiment 1 of the present invention.
图 2是本发明实施例 2的立体分解示意图。 Fig. 2 is a perspective exploded perspective view showing a second embodiment of the present invention.
图 3是本发明实施例 3的立体分解示意图。 Figure 3 is a perspective exploded view of Embodiment 3 of the present invention.
图 4是本发明实施例 3仅示出部分结构的立体分解示意图。 Fig. 4 is a perspective exploded perspective view showing only a partial structure of Embodiment 3 of the present invention.
图 5是图 4的 I部放大图。 Fig. 5 is an enlarged view of a portion I of Fig. 4.
图 6是本发明实施例 4的立体分解示意图。 Figure 6 is a perspective exploded view of Embodiment 4 of the present invention.
图 7是本发明实施例 4仅示出部分结构的立体分解示意图。 Fig. 7 is a perspective exploded perspective view showing only a partial structure of Embodiment 4 of the present invention.
图 8是本发明实施例 5的立体分解示意图。 Figure 8 is a perspective exploded view of Embodiment 5 of the present invention.
图 9是本发明实施例 6的立体分解示意图。 Fig. 9 is a perspective exploded perspective view showing a sixth embodiment of the present invention.
图 10是本发明实施例 7的立体示意图。 Figure 10 is a perspective view showing a seventh embodiment of the present invention.
图 11是本发明实施例 7的立体分解示意图。 Figure 11 is a perspective exploded view of Embodiment 7 of the present invention.
图 12是本发明实施例 8的立体分解示意图。 Figure 12 is a perspective exploded view of Embodiment 8 of the present invention.
图 13是本发明实施例 8仅示出部分结构的立体分解示意图。 Fig. 13 is a perspective exploded perspective view showing only a partial structure of an embodiment 8 of the present invention.
图 14是本发明实施例 9的立体分解示意图。 Figure 14 is a perspective exploded view of Embodiment 9 of the present invention.
图 15是本发明实施例 10的立体分解示意图。 Figure 15 is a perspective exploded view of Embodiment 10 of the present invention.
图 16是本发明实施例 1 1的立体分解示意图。 Figure 16 is a perspective exploded view of Embodiment 11 of the present invention.
图 17是本发明实施例 12的立体分解示意图。 Figure 17 is a perspective exploded view of Embodiment 12 of the present invention.
实施例 1 Example 1
如图 1所示， 一种带有冷却装置的 LED集成结构， 包括盖板 1、 反射板 2、 散热基板 3、 LED芯片 4、 透镜 5、 透镜定位环 6、 电连接 LED芯片 4的 电极的金线 7和电连接金线 7的布图电路导电层 8、 用来封装 LED芯片 4 和金线 7的封装胶体 9。 冷却装置包括设置在散热基板 3背离 LED芯片 4 的一侧流道板 10、 在流道板 10上设有凹槽 11、 流道板 10上的凹槽 11与 散热基板 3间形成容置冷却水的冷却流道、驱动冷却水流动装置（未示出）， 驱动冷却水流动装置为水泵。在流道板 10上设有与冷却流道连通的冷却水 入口 12和冷却水出口 （未示出）， 流道板通过冷却水入口 12和冷却水出口 与外部的冷却水储水罐（未示出）中的水连通。 LED芯片 4的背面完全被冷 却流道覆盖； 散热基板 3背离 LED芯片 4的一侧与冷却水直接接触， 在冷 却流道内充满冷却水。 反射板 2安装在散热基板 3上， 盖板 1安装在流道 板 10上， 盖板 1和流道板 10密封 LED集成结构的其它结构。 在反射板 2 上设有与透镜 5—一对应的通孔 13， 在盖板 1上与透镜 5—一对应的反射 罩 14。流道板 10为导热的散热板，流道板 10背离凹槽 11的一侧直接与空 气接触。 驱动冷却水流动装置安装在冷却流道外。 As shown in FIG. 1 , an LED integrated structure with a cooling device includes a cover plate 1 , a reflector 2 , a heat dissipation substrate 3 , an LED chip 4 , a lens 5 , a lens positioning ring 6 , and an electrode electrically connected to the LED chip 4 . The gold wire 7 and the patterned circuit conductive layer 8 electrically connecting the gold wire 7 and the encapsulant 9 for encapsulating the LED chip 4 and the gold wire 7. The cooling device includes a flow path plate 10 disposed on a side of the heat dissipation substrate 3 facing away from the LED chip 4, a groove 11 provided on the flow path plate 10, and a groove 11 on the flow path plate 10 and A cooling flow path for accommodating cooling water is formed between the heat dissipation substrates 3, a cooling water flow device (not shown) is driven, and the cooling water flow device is driven as a water pump. A cooling water inlet 12 and a cooling water outlet (not shown) communicating with the cooling flow passage are provided on the flow passage plate 10, and the flow passage plate passes through the cooling water inlet 12 and the cooling water outlet and the external cooling water storage tank (not The water in the connection is shown). The back surface of the LED chip 4 is completely covered by the cooling flow path; the side of the heat dissipation substrate 3 facing away from the LED chip 4 is in direct contact with the cooling water, and the cooling flow path is filled with cooling water. The reflecting plate 2 is mounted on the heat radiating substrate 3, and the cover plate 1 is mounted on the flow path plate 10, and the cover plate 1 and the flow path plate 10 seal other structures of the LED integrated structure. The reflector 2 is provided with a through hole 13 corresponding to the lens 5, and a reflector 14 corresponding to the lens 5 on the cover 1. The flow channel plate 10 is a heat-conducting heat dissipation plate, and the side of the flow channel plate 10 facing away from the groove 11 is in direct contact with the air. The drive cooling water flow device is installed outside the cooling flow passage.
透镜定位环 6选用耐高温的 PPA塑料。 在透镜定位环 6上设有定位透 镜 5和包覆封装胶体 9的第一通孔 15，透镜定位环 6上延伸设有固定柱 16， 在固定柱 16的端部通过将散热基板 3置于成型透镜定位环 6的模具内在成 型塑胶定位环时成型有抵挡部 17， 固定柱 16与散热基板 3间液密封。在透 镜定位环 6上设有注入封装胶体 9的注胶通道 18， 注胶通道 18的胶口 19 置于透镜定位环 6远离抵挡部一侧的端面上， 胶口 19和注胶通道 18与第 一通孔 15的侧壁连通。  The lens positioning ring 6 is made of high temperature resistant PPA plastic. A positioning lens 5 and a first through hole 15 covering the encapsulating body 9 are disposed on the lens positioning ring 6. The fixing post 16 is extended on the lens positioning ring 6, and the heat dissipating substrate 3 is placed at the end of the fixing post 16. The mold portion of the molded lens positioning ring 6 is formed with a resisting portion 17 when the plastic positioning ring is formed, and the fixing post 16 and the heat dissipating substrate 3 are fluidly sealed. A glue injection channel 18 for injecting the encapsulant 9 is disposed on the lens positioning ring 6. The glue port 19 of the glue injection channel 18 is placed on the end surface of the lens positioning ring 6 away from the resisting portion, and the glue port 19 and the glue injection channel 18 are The side walls of the first through holes 15 are in communication.
散热基板 3 由高导热材质的薄板金属或金属合金冲压而成， 其材料可 以是不锈钢、 铜、 钨、 铝、 氮化铝、 铬等或其合金。 散热基板 3包括一平 板状的底板，与散热基板 3—体成型的凸出底板的复数个芯片固定凸台 20， 对应每个芯片固定凸台 20设有与固定柱 16配合的第二通孔 21。 芯片固定 凸台 20的横截面为圆形，底板的横截面的面积大大的大于芯片固定凸台 20 的横截面的面积， 至少是芯片固定凸台 20的横截面的面积的三倍或三倍以 上。 在芯片固定凸台 20的顶部设有与芯片固定凸台 20同心的置放 LED芯 片 4的凹陷部 22， 凹陷部 22的底面为放置 LED芯片 4的平面。在散热基板 3背离芯片固定凸台 20的一侧设有置于芯片固定凸台 20内与芯片固定凸台 20同心的散热盲孔 （未示出）。 散热基板 3背离芯片固定凸台 20的一侧与 冷却水直接接触。 The heat dissipation substrate 3 is stamped from a sheet metal or a metal alloy of a high thermal conductivity material, and may be made of stainless steel, copper, tungsten, aluminum, aluminum nitride, chromium, or the like. The heat dissipating substrate 3 includes a flat bottom plate, and a plurality of chip fixing bosses 20 protruding from the heat dissipating substrate 3, and corresponding to each of the chip fixing bosses 20, a second through hole that is matched with the fixing post 16 twenty one. The chip fixing boss 20 has a circular cross section, and the cross-sectional area of the bottom plate is much larger than the cross-sectional area of the chip fixing boss 20, at least three times or three times the area of the cross section of the chip fixing boss 20. the above. A recess portion 22 in which the LED chip 4 is placed concentrically with the chip fixing boss 20 is provided on the top of the chip fixing boss 20, and the bottom surface of the recess portion 22 is a plane on which the LED chip 4 is placed. On the side of the heat dissipation substrate 3 facing away from the chip fixing boss 20, a heat dissipation blind hole (not shown) disposed in the chip fixing boss 20 concentric with the chip fixing boss 20 is provided. The side of the heat dissipation substrate 3 facing away from the chip fixing boss 20 The cooling water is in direct contact.
透镜定位环 6的固定柱 16穿过散热基板 3的第二通孔 21，通过固定柱 16的端部的抵挡部 17散热基板 3固定， 这样散热基板 3与透镜定位环 6 固定在一起。芯片固定凸台 20置于对应的透镜定位环 6的第一通孔 15内， 布图电路导电层 8直接设置在散热基板 3朝向凸台 20的一侧， 布图电路导 电层 8伸入第一通孔 15的内侧壁与芯片固定凸台 20外侧壁之间， LED芯片 4通过固晶工艺直接固定在芯片固定凸台 20的端面上， 金线 7置于透镜定 位环 6内， 金线 7—端与 LED芯片 4的电极电连接， 金线 7的另一端与伸 入透镜定位环 6内的布图电路导电层 8电连接；透镜 5安装在透镜定位环 6 上与透镜定位环 6紧配合固定。 通过胶口 19和注胶通道 18注入的封装胶 体 9进一步将透镜 5固定。  The fixing post 16 of the lens positioning ring 6 passes through the second through hole 21 of the heat dissipating substrate 3, and is fixed by the heat dissipating portion 3 of the end portion of the fixing post 16 so that the heat dissipating substrate 3 and the lens positioning ring 6 are fixed together. The chip fixing boss 20 is disposed in the first through hole 15 of the corresponding lens positioning ring 6, and the conductive layer 8 of the layout circuit is directly disposed on the side of the heat dissipation substrate 3 facing the boss 20, and the conductive layer 8 of the layout circuit extends into the first Between the inner side wall of a through hole 15 and the outer side wall of the chip fixing boss 20, the LED chip 4 is directly fixed on the end surface of the chip fixing boss 20 by a die bonding process, and the gold wire 7 is placed in the lens positioning ring 6, the gold wire The 7-end is electrically connected to the electrode of the LED chip 4, and the other end of the gold wire 7 is electrically connected to the patterned circuit conductive layer 8 extending into the lens positioning ring 6; the lens 5 is mounted on the lens positioning ring 6 and the lens positioning ring 6 Tight fit. The lens 5 is further fixed by the encapsulant 9 injected through the glue port 19 and the glue injection channel 18.
实施例 2 Example 2
如图 2所示， 与实施例 1不同的是， 一种带有冷却装置的 LED集成结 构，还包括 PCB板 51。在流道板 52仅设有与冷却流道连通的冷却介质入口 53， 流道板 52上的凹槽 56与散热基板 66形成密闭的循环的冷却流道， 冷 却介质在冷却流道内循环流动。 驱动冷却介质流动装置包括安装在凹槽 56 底部的两个相互啮合的第一齿轮 54和第二齿轮 55、 设置在背离凹槽 56的 一侧带动第一齿轮 54和第二齿轮 55转动的驱动电机 57， 与驱动电机 57 同轴安装的齿轮 58， 与齿轮 58啮合的齿轮 59， 与齿轮 59固定的磁铁 60。 第一齿轮 54通过与磁铁间的磁力与磁铁同步转到。 第一齿轮 54和第二齿 轮 55的齿轮轴从凹槽 56的底部延伸而成。  As shown in Fig. 2, unlike Embodiment 1, an LED integrated structure with a cooling device further includes a PCB board 51. In the flow path plate 52, only the cooling medium inlet 53 communicating with the cooling flow path is provided. The groove 56 on the flow path plate 52 forms a closed circulating cooling flow path with the heat dissipation substrate 66, and the cooling medium circulates in the cooling flow path. The driving cooling medium flow device includes two intermeshing first gears 54 and second gears 55 mounted at the bottom of the recess 56, and driving on the side facing away from the recess 56 to drive the rotation of the first gear 54 and the second gear 55 The motor 57 is a gear 58 mounted coaxially with the drive motor 57, a gear 59 meshing with the gear 58, and a magnet 60 fixed to the gear 59. The first gear 54 is turned by the magnetic force between the magnet and the magnet. The gear shafts of the first gear 54 and the second gear 55 extend from the bottom of the groove 56.
透镜定位环 61选用耐高温的 PP0+GF塑料。 散热基板 66由高导热材 质的陶瓷等压铸而成。 布图电路导电层 62直接设置在 PCB板 51上， 布图 电路导电层 62分布在同一个平面上。 在 PCB板 51上对应每个芯片固定凸 台 63设有与芯片固定凸台 63配合的第四通孔 64和与固定柱 68配合的第 三通孔 65， PCB板 51置于散热基板 66设有芯片固定凸台 63的一侧并与散 热基板 66直接接触， PCB板 51设有布图电路导电层 62的一侧背离接触散 热基板 66的接触面。 The lens positioning ring 61 is made of high temperature resistant PP0+GF plastic. The heat dissipation substrate 66 is die-cast from a ceramic of high thermal conductivity. The patterned circuit conductive layer 62 is disposed directly on the PCB board 51, and the patterned circuit conductive layers 62 are distributed on the same plane. Each of the chip fixing bosses 63 is provided with a fourth through hole 64 that cooperates with the chip fixing boss 63 and a third through hole 65 that cooperates with the fixing post 68 on the PCB board 51. The PCB board 51 is disposed on the heat dissipation substrate 66. One side of the chip fixing boss 63 is in direct contact with the heat dissipation substrate 66, and the side of the PCB board 51 provided with the conductive layer 62 of the layout circuit faces away from the contact The contact surface of the thermal substrate 66.
散热基板 66的芯片固定凸台 63穿过 PCB板 51的第四通孔 64，透镜定 位环 61的固定柱 68穿过 PCB板 51上的第三通孔 65、 散热基板 66的第二 通孔 67并与第二通孔 67液密封，通过热熔固定柱 68的端部形成抵挡部 69 并与 PCB板 51、 散热基板 66固定。  The chip fixing boss 63 of the heat dissipation substrate 66 passes through the fourth through hole 64 of the PCB board 51. The fixing post 68 of the lens positioning ring 61 passes through the third through hole 65 of the PCB board 51 and the second through hole of the heat dissipation substrate 66. 67 is liquid-tightly sealed with the second through hole 67, and the resisting portion 69 is formed by the end portion of the heat-fusible fixing post 68 and fixed to the PCB board 51 and the heat dissipation substrate 66.
实施例 3 Example 3
如图 3所示， 与实施例 2不同的是， 驱动冷却介质流动装置包括安装 在凹槽 （未示出） 底部的两个相互啮合的第一齿轮 （未示出） 和第二齿轮 (未示出）、设置在背离凹槽的一侧带动第一齿轮和第二齿轮转动的驱动电 机 126，与驱动电机 126同轴安装的齿轮 130，与齿轮 130啮合的齿轮 125， 安装在流道板 127背离凹槽一侧的风扇 128，风扇 128通过支架 129固定在 流道板 127上。第一齿轮与齿轮 125同轴固定其固定轴穿过流道板 127。第 一齿轮的齿轮轴和第二齿轮的齿轮轴与凹槽底液密封。  As shown in FIG. 3, unlike Embodiment 2, the driving cooling medium flow device includes two intermeshing first gears (not shown) and a second gear (not shown) mounted at the bottom of the recess (not shown). A drive motor 126 that rotates the first gear and the second gear on a side facing away from the groove, a gear 130 that is mounted coaxially with the drive motor 126, and a gear 125 that meshes with the gear 130 are mounted on the flow path plate. The fan 128 is away from the fan 128 on the side of the groove, and the fan 128 is fixed to the flow path plate 127 via the bracket 129. The first gear and the gear 125 coaxially fix their fixed shafts through the flow passage plate 127. The gear shaft of the first gear and the gear shaft of the second gear are sealed to the groove bottom.
如图 4、 图 5所示，塑胶透镜定位环 101通过连接筋 102连结为一个整 体。在芯片固定凸台 103的顶部凹陷部 104内通过固晶工艺固定有 R色 LED 芯片 108、 G色 LED芯片 109、 B色 LED芯片 110。 当散热基板 100、 PCB板 123和塑胶透镜定位环 101固定在一起时，芯片固定凸台 103置于对应塑胶 透镜定位环 101的第一通孔 124内， 设置在 PCB板 123上的布图电路导电 层 112、 114、 116、 118、 120、 122伸入第一通孔 124的内侧壁与芯片固定 凸台 103的外侧壁之间并彼此独立， 金线 111、 113、 115、 117、 119、 121 置于第一通孔 124内。 R色的 LED芯片 108的正极通过金线 111与伸入第一 通孔 124的内侧壁与芯片固定凸台 103的外侧壁之间的第一布图电路导电 层 112电连接， R色的 LED芯片 108的负极通过金线 113与伸入第一通孔 124的内侧壁与芯片固定凸台 103的外侧壁之间的布图电路导电层 114电连 接。 G色的 LED芯片 109的正极通过金线 115与伸入第一通孔 124的内侧壁 与芯片固定凸台 103的外侧壁之间的布图电路导电层 116电连接， G色的 LED芯片 109的负极通过金线 117与伸入第一通孔 124的内侧壁与芯片固定 凸台 103的外侧壁之间的布图电路导电层 118电连接。 B色的 LED芯片 110 的正极通过金线 119与伸入第一通孔 124的内侧壁与芯片固定凸台 103的 外侧壁之间的布图电路导电层 120电连接，B色的 LED芯片 110的负极通过 金线 121与伸入第一通孔 124的内侧壁与芯片固定凸台 103的外侧壁之间 的布图电路导电层 122电连接。 As shown in FIG. 4 and FIG. 5, the plastic lens positioning ring 101 is connected as a whole by the connecting ribs 102. An R color LED chip 108, a G color LED chip 109, and a B color LED chip 110 are fixed in the top recess portion 104 of the chip fixing boss 103 by a die bonding process. When the heat dissipation substrate 100, the PCB board 123 and the plastic lens positioning ring 101 are fixed together, the chip fixing boss 103 is placed in the first through hole 124 corresponding to the plastic lens positioning ring 101, and the layout circuit is disposed on the PCB board 123. The conductive layers 112, 114, 116, 118, 120, 122 extend between the inner sidewall of the first through hole 124 and the outer sidewall of the chip fixing boss 103, and are independent of each other, the gold wires 111, 113, 115, 117, 119, 121 is placed in the first through hole 124. The anode of the R color LED chip 108 is electrically connected to the first patterned circuit conductive layer 112 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 111, and the R color LED The negative electrode of the chip 108 is electrically connected to the patterned circuit conductive layer 114 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 113. The positive electrode of the G-color LED chip 109 is electrically connected to the patterned circuit conductive layer 116 extending between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 115. The G color LED chip 109 The negative electrode is fixed to the chip through the gold wire 117 and the inner side wall of the first through hole 124 The patterned circuit conductive layer 118 between the outer sidewalls of the boss 103 is electrically connected. The positive electrode of the B color LED chip 110 is electrically connected to the patterned circuit conductive layer 120 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 119, and the B color LED chip 110 The negative electrode is electrically connected to the patterned circuit conductive layer 122 between the inner side wall of the first through hole 124 and the outer side wall of the chip fixing boss 103 through the gold wire 121.
实施例 4 Example 4
如图 6所示， 与实施例 2不同的是， 冷却装置还包括半导体制冷装置 162， 半导体制冷装置 162安装在流道板 163背离散热基板 151的一侧， 半 导体制冷装置 162的吸热端可导热地贴合在流道板 163上并置于循环流道 背面的设定位置，半导体制冷装置 162的散热端可导热地贴合在散热片 164 上， 在流道板 163贴合半导体制冷装置 162的吸热端以外的地方并背离散 热基板 151的一侧设有绝热层 （未示出）。  As shown in FIG. 6, unlike the second embodiment, the cooling device further includes a semiconductor refrigerating device 162 mounted on a side of the flow channel plate 163 opposite to the discrete thermal substrate 151, and the heat absorbing end of the semiconductor refrigerating device 162 can be The heat-dissipating surface is attached to the flow path plate 163 and placed at a set position on the back surface of the circulation flow path, and the heat-dissipating end of the semiconductor refrigeration device 162 is thermally conductively attached to the heat sink 164, and the semiconductor refrigeration device is attached to the flow path plate 163. A heat insulating layer (not shown) is provided at a portion other than the heat absorbing end of the 162 and on the side of the back discrete heat substrate 151.
如图 7所示， 塑胶透镜定位件为透镜定位塑胶板 150，透镜定位塑胶板 150的个数为一个。在透镜定位塑胶板 150上设有六个与散热基板 151的芯 片固定凸台 152—一配合的用来定位透镜 154和包覆封装胶体 158的第一 通孔 153。透镜 154通过紧配合固定在第一通孔 153内。在透镜定位塑胶板 150的端面上延伸设有固定柱 155，在固定柱 155的端部通过将散热基板 151、 PCB板 156置于成型透镜定位塑胶板 150的模具内在成型透镜定位塑胶板 150时成型有抵挡部 157。 在透镜定位塑胶板 150上设有注入封装胶体 158 的注胶通道 159，注胶通道 159的胶口 160置于透镜定位塑胶板 150远离抵 挡部一侧的端面上，胶口 160和注胶通道 159与第一通孔 153的侧壁连通。 实施例 5  As shown in FIG. 7, the plastic lens positioning member is a lens positioning plastic plate 150, and the number of the lens positioning plastic plates 150 is one. The lens positioning plastic plate 150 is provided with six first through holes 153 for positioning the lens 154 and covering the encapsulant 158 with the chip fixing boss 152 of the heat dissipation substrate 151. The lens 154 is fixed in the first through hole 153 by a tight fit. A fixing post 155 is extended on the end surface of the lens positioning plastic plate 150. When the heat dissipating substrate 151 and the PCB board 156 are placed in the mold of the molding lens positioning plastic plate 150 at the end of the fixing post 155, the plastic lens 150 is positioned by the molding lens. A resisting portion 157 is formed. The lens positioning plastic plate 150 is provided with a glue injection channel 159 for injecting the encapsulant 158. The glue port 160 of the glue injection channel 159 is placed on the end surface of the lens positioning plastic plate 150 away from the resisting portion, the glue port 160 and the glue injection channel. 159 is in communication with the side wall of the first through hole 153. Example 5
如图 8所示， 与实施例 4不同的是， 冷却装置还包括导热片 201， 导热 片 201安装在流道板 202背离散热基板 200的一侧， 导热片 201的一端可 导热地贴合在流道板 202上并置于循环流道背面的设定位置， 导热片 201 的另一端可导热地贴合在散热片 203上， 在流道板 202贴合导热片 201外 的地方并背离散热基板 200的一侧设有绝热层 （未示出）。 实施例 6 As shown in FIG. 8, unlike the fourth embodiment, the cooling device further includes a heat conductive sheet 201 mounted on one side of the flow channel plate 202 on the back of the discrete thermal substrate 200, and one end of the heat conductive sheet 201 is thermally conductively attached thereto. The flow path plate 202 is placed at a set position on the back surface of the circulation flow path, and the other end of the heat conductive sheet 201 is thermally conductively attached to the heat sink 203, and the flow path plate 202 is attached to the place outside the heat conductive sheet 201 and is separated from the heat. One side of the substrate 200 is provided with a heat insulating layer (not shown). Example 6
如图 9所示， 与实施例 4不同的是， 冷却装置还包括磁制冷装置 251 和设置在流道板 252背离散热基板的一侧的散热板 253，在散热板 253背离 流道板 252的一侧还设有冷却槽 254，在散热板 253背离流道板 252的一侧 还设有密封冷却槽 254的密封板 255，磁制冷装置 251的吸热端可导热地贴 合在流道板 252的冷却流道的背面， 磁制冷装置 251的散热端可导热地贴 合在散热板的冷却槽 254的背面。 在流道板 252贴合磁制冷装置 251的吸 热端以外的地方并背离散热基板的一侧设有绝热层。  As shown in FIG. 9, unlike the fourth embodiment, the cooling device further includes a magnetic refrigerating device 251 and a heat dissipating plate 253 disposed on a side of the flow path plate 252 opposite to the discrete thermal substrate, the heat dissipating plate 253 facing away from the flow path plate 252. A cooling groove 254 is further disposed on one side, and a sealing plate 255 sealing the cooling groove 254 is further disposed on a side of the heat dissipation plate 253 facing away from the flow channel plate 252, and the heat absorbing end of the magnetic refrigeration device 251 is thermally conductively attached to the flow channel plate. On the back surface of the cooling passage 252, the heat radiating end of the magnetic refrigerating device 251 is thermally coupled to the back surface of the cooling groove 254 of the heat radiating plate. A heat insulating layer is provided on a side of the flow path plate 252 that is attached to the outside of the heat absorbing end of the magnetic refrigerating device 251 and on the side opposite to the discrete heat substrate.
实施例 7 Example 7
如图 10、 11所示， 与实施例 2不同的是， 在流道板 301背离凹槽 302 的一侧对应凹槽 302的位置为凸出流道板 301 的散热凸条 303， 在流道板 301垂直凹槽 302的两侧延伸设有挡壁 304，在流道板 301朝向凹槽 302的 一侧延伸设有与凹槽 302平行的挡块 305 ;在散热基板 300的两侧设有与凹 槽 302垂直的侧壁 306 ;散热基板 300的侧壁 306与挡块 305贴合，散热基 板 300背离 LED芯片的面与流道板 301设有凹槽 302的面贴合； 还包括将 散热基板 300与流道板 301形成的流道密封的密封件 307、 310；流道板 301 的凹槽 302、 挡壁 304、 挡块 305与散热基板 300背离芯片的面、 散热基板 300的侧壁 306、密封件 307形成使冷却介质可循环流动的高低不平的冷却 流道； 在流道板 301背离散热基板 300的一侧还设有导风板 308， 导风板 308与流道板 301形成与凹槽 302平行的风道；在风道的一侧安装有冷却风 扇 309; 冷却介质为不制冷的冷却介质， 流道板 301为散热板， 流道板 301 背离凹槽 302的一侧直接与空气接触。  As shown in FIGS. 10 and 11, unlike the second embodiment, the position of the corresponding groove 302 on the side of the flow path plate 301 facing away from the groove 302 is the heat dissipation ridge 303 of the flow channel plate 301, in the flow path. A blocking wall 304 is defined on two sides of the vertical groove 302 of the plate 301. A stopper 305 parallel to the groove 302 is defined on a side of the flow plate 301 facing the groove 302. The two sides of the heat dissipation substrate 300 are disposed on the two sides of the heat dissipation substrate 300. a sidewall 306 perpendicular to the recess 302; a sidewall 306 of the heat dissipation substrate 300 is attached to the stopper 305, and a surface of the heat dissipation substrate 300 facing away from the LED chip is attached to a surface of the flow channel plate 301 provided with the recess 302; The sealing plate 307, 310 of the flow path sealing plate formed by the heat dissipation substrate 300 and the flow path plate 301; the groove 302 of the flow path plate 301, the blocking wall 304, the surface of the stopper 305 and the heat dissipation substrate 300 facing away from the chip, and the side of the heat dissipation substrate 300 The wall 306 and the sealing member 307 form a rugged cooling flow passage for circulating the cooling medium. On the side of the flow channel plate 301 opposite to the discrete thermal substrate 300, a wind deflecting plate 308, a wind deflecting plate 308 and a flow channel plate 301 are further disposed. Forming a duct parallel to the groove 302; mounted on one side of the duct But the fan 309; refrigeration cooling medium is a cooling medium, the flow channel plate 301 to the heat radiating plate, the flow channel plate 301 away from the side of the groove 302 is in direct contact with the air.
实施例 8 Example 8
如图 12、 13所示， 与实施例 1不同的是， 一种带有冷却装置的 LED集 成结构，包括散热基板 350， LED芯片 351，透镜 352，塑胶透镜成型环 353， 电连接 LED芯片 351电极的导线 354和电连接导线 354的布图电路导电层 355 ο 散热基板 350由高导热材质的陶瓷等压铸而成。 散热基板 350包括一 平板状的底板 361，与散热基板 350—体成型的凸出底板 361的复数个凸台 362， 对应每个凸台 362设有与固定柱 357配合的第二通孔 363。 布图电路 导电层 355直接设置在散热基板 350上， 布图电路导电层 355分布在同一 个平面上。 As shown in FIGS. 12 and 13, different from Embodiment 1, an LED integrated structure with a cooling device includes a heat dissipation substrate 350, an LED chip 351, a lens 352, a plastic lens molding ring 353, and an LED chip 351 electrically connected. The wire 354 of the electrode and the patterned circuit conductive layer 355 of the electrical connection wire 354. The heat dissipation substrate 350 is die-cast from a ceramic of high thermal conductivity. The heat dissipation substrate 350 includes a The flat bottom plate 361 and the plurality of bosses 362 of the protruding bottom plate 361 formed integrally with the heat dissipation substrate 350 are provided with a second through hole 363 corresponding to the fixing post 357 for each of the bosses 362. The patterned circuit conductive layer 355 is disposed directly on the heat dissipation substrate 350, and the layout circuit conductive layers 355 are distributed on the same plane.
冷却装置还包括制冷装置 364和散热片 365。冷却流道倾斜于水平面布 置， 制冷装置 364的吸热端置于冷却流道的顶部， 发热端与散热片 365贴 合。 实施例 9  The cooling device also includes a refrigeration unit 364 and a heat sink 365. The cooling flow path is disposed at a horizontal plane, the heat absorbing end of the refrigerating unit 364 is placed at the top of the cooling flow path, and the heat generating end is attached to the heat sink 365. Example 9
如图 14所示， 与实施例 1不同的是， 散热基板 400为圆形板。 流道壳 体包括设置在散热基板 400外储存冷却液的套筒 401和设置在套筒 401远 离散热基板 400的一端的流道盖板 406。 散热基板 400、 套筒 401与流道盖 板 406形成密封的冷却流道。 驱动冷却介质流动装置包括安装在密封的冷 却流道内的搅拌叶轮 402、 设置在背离密封流道的一侧带动搅拌叶轮 402 转动的驱动电机 403， 在驱动电机 403上同轴固定有冷却风扇 404与磁铁 405， 在流道盖板 406背离风扇的一侧设有叶轮轴 407， 搅拌叶轮 402固定 在叶轮轴 407上， 叶轮轴 407可相对流道盖板 406转动， 并吸附在磁铁 405 上与磁铁 405同步转动。 在风扇外还设有风扇罩 408。  As shown in Fig. 14, unlike the first embodiment, the heat dissipation substrate 400 is a circular plate. The flow path housing includes a sleeve 401 disposed to store the coolant outside the heat dissipation substrate 400 and a flow path cover 406 disposed at an end of the sleeve 401 remote from the heat dissipation substrate 400. The heat sink substrate 400, the sleeve 401 and the flow path cover plate 406 form a sealed cooling flow path. The driving cooling medium flow device includes a stirring impeller 402 installed in the sealed cooling flow passage, a driving motor 403 disposed on the side facing away from the sealing flow passage to drive the stirring impeller 402 to rotate, and a cooling fan 404 is coaxially fixed on the driving motor 403. The magnet 405 is provided with an impeller shaft 407 on a side of the flow passage cover 406 facing away from the fan. The agitating impeller 402 is fixed on the impeller shaft 407. The impeller shaft 407 is rotatable relative to the flow passage cover 406 and is adsorbed on the magnet 405 and the magnet. 405 rotates synchronously. A fan cover 408 is also provided outside the fan.
实施例 10 Example 10
如图 15所示， 与实施例 9不同的是， 驱动冷却介质流动装置包括安装 在密封的冷却流道内的搅拌叶轮 452、设置在背离密封流道的一侧带动搅拌 叶轮 452转动的驱动电机 453，在驱动电机 453上同轴固定有冷却风扇 454， 固定冷却风扇 454的轴 455穿过流道盖板 456， 搅拌叶轮 452固定在轴 455 的端部， 轴 455穿过流道盖板 456并与流道盖板 456液密封。  As shown in FIG. 15, different from Embodiment 9, the driving cooling medium flow device includes a stirring impeller 452 installed in the sealed cooling flow passage, and a driving motor 453 disposed on the side facing away from the sealing flow passage to drive the stirring impeller 452 to rotate. A cooling fan 454 is coaxially fixed to the driving motor 453. The shaft 455 of the fixed cooling fan 454 passes through the flow path cover 456, and the stirring impeller 452 is fixed to the end of the shaft 455. The shaft 455 passes through the flow path cover 456 and Sealed with the flow channel cover 456 liquid.
实施例 11 Example 11
如图 16所示， 与实施例 1不同的是， 散热基板 660为圆形板。 冷却装 置包括设置在散热基板 660背离 LED芯片的一侧的风扇 501， 设置在风扇 501外的风扇罩 502。 在风扇罩 502内固定有电机 503， 风扇 501安装在电 机 503上， 散热基板 660固定在风扇罩 502上。 散热基板 660背离 LED芯 片的一侧与空气直接接触。 As shown in FIG. 16, unlike the first embodiment, the heat dissipation substrate 660 is a circular plate. The cooling device includes a fan 501 disposed on a side of the heat dissipation substrate 660 facing away from the LED chip, and a fan cover 502 disposed outside the fan 501. A motor 503 is fixed in the fan cover 502, and the fan 501 is installed in the electric On the machine 503, the heat dissipation substrate 660 is fixed to the fan cover 502. The side of the heat dissipation substrate 660 facing away from the LED chip is in direct contact with the air.
实施例 12 Example 12
如图 17所示， 与实施例 1不同的是， 冷却装置包括设置在散热基板背 离 LED芯片一侧的流道壳体 552、流道壳体 552与散热基板 550间形成的冷 却流道、制冷装置 551、安装在制冷装置 551内驱动冷却流道内的冷却介质 快速流动的驱动冷却介质流动装置（为示出）、 设置在流道壳体上与冷却流 道连通的冷却介质口 554; 制冷装置 551 的冷却介质通过冷却介质口 554 与冷却流道连通， 冷却介质由驱动冷却介质流动装置驱动在冷却流道和制 冷装置之间循环流动。  As shown in FIG. 17, different from the first embodiment, the cooling device includes a cooling flow path formed between the flow path housing 552 disposed on the side of the heat dissipation substrate facing away from the LED chip, the flow path housing 552 and the heat dissipation substrate 550, and cooling. a device 551, a driving cooling medium flowing device (shown) installed in the cooling device 551 to drive the cooling medium in the cooling flow path to flow rapidly, and a cooling medium port 554 disposed on the flow path housing and communicating with the cooling flow channel; The cooling medium of 551 is in communication with the cooling flow passage through the cooling medium port 554, and the cooling medium is driven by the driving cooling medium flow device to circulate between the cooling flow passage and the cooling device.
本发明并不限于上述实施例。 本发明散热基板的形状可根据需要设计各种 形状， 甚至可设计为产品外观件， 本发明只是截取部分 LED芯片单元示意 说明。 本发明中的芯片固定凸台个数可从一个到很多个， 本发明只是例举 几种带有冷却装置的 LED集成结构单元。 本发明中的布图电路导电层只是 示意说明。 在一个芯片固定凸台上， 可固定一个 LED芯片， 也可固定两个 不同颜色的 LED芯片， 三个 R、 G、 B不同颜色的芯片， 或者是三个以上的 芯片。当芯片个数不同时，布图电路导电层的设计相应修改，属现有技术， 本发明不再详细说明。 PCB板也可双面均设有布图电路导电层，只要与散热 基板接触的一侧的布图导电层表面与散热基板绝缘即可。 LED芯片可直接固 定在散热基板上， 或者是固定在与散热基板一体成型的凹陷部内等。 The invention is not limited to the above embodiments. The shape of the heat dissipating substrate of the present invention can be designed in various shapes as needed, and can even be designed as a product appearance piece. The present invention merely illustrates a part of the LED chip unit. The number of chip fixing bosses in the present invention can vary from one to many, and the present invention is exemplified by several LED integrated structural units with cooling means. The conductive layer of the layout circuit in the present invention is only illustrative. On one chip fixing boss, one LED chip can be fixed, and two different color LED chips can be fixed, three R, G, B different color chips, or more than three chips. When the number of chips is different, the design of the conductive layer of the layout circuit is modified accordingly, which belongs to the prior art, and the present invention will not be described in detail. The PCB board may also be provided with a conductive layer of the layout circuit on both sides, as long as the surface of the conductive layer on the side in contact with the heat dissipation substrate is insulated from the heat dissipation substrate. The LED chip can be directly fixed on the heat dissipation substrate, or fixed in a recess formed integrally with the heat dissipation substrate.

Claims

权 利 要 求 书 Claim
1、 带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 其特征在于： 在定位透镜或成型透镜的塑胶件上设有一个 或一个以上的第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设 有固定柱， 在散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热 基板的第二通孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑 胶件通过固定柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定 在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔 的侧壁与 LED芯片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电 极电连接， 导线的另一端与第一通孔与 LED芯片之间的布图电路导电层电 连接； 冷却装置包括设置在散热基板背离 LED芯片一侧的流道壳体、 流道 壳体与散热基板间形成的冷却流道、 驱动冷却流道内的冷却介质快速流动 的驱动冷却介质流动装置； LED芯片的背面完全被冷却流道覆盖， 固定柱与 散热基板间气密封或液密封； 散热基板背离 LED芯片的一侧与冷却介质直 接接触。 1. An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and the layout circuit of the electrical connection wire, wherein : one or more first through holes are formed in the plastic part of the positioning lens or the molding lens, and a fixing post is extended on the end surface of the plastic part of the positioning lens or the molding lens, and the fixing column is arranged on the heat dissipation substrate a second through hole, the fixing post passes through the second through hole of the heat dissipation substrate, and the end portion of the fixing column is provided with a resisting portion; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; The chip is directly fixed on the heat dissipation substrate by a die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, and the wire is placed in the first through hole Inside, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; The flow path housing disposed on the side of the heat dissipation substrate facing away from the LED chip, the cooling flow path formed between the flow path housing and the heat dissipation substrate, and the driving cooling medium flow device for driving the cooling medium in the cooling flow path to flow rapidly; the back surface of the LED chip It is completely covered by the cooling flow channel, and the sealing column and the heat dissipation substrate are hermetically sealed or liquid-tight; the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the cooling medium.
2、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 流道 壳体为流道板， 冷却流道包括设置在流道板上使冷却介质可循环流动的凹 槽， 凹槽与散热基板背离 LED芯片的一侧形成所述的冷却流道； 驱动冷却 介质流动装置包括安装在凹槽底部的两个相互啮合的第一齿轮和第二齿轮、 设置在背离凹槽的一侧带动第一齿轮和第二齿轮转动的驱动电机， 第一齿 轮的齿轮轴或第二齿轮的齿轮轴从凹槽的底部穿过流道板并与流道板气密 封或液密封。  2. The LED integrated structure with a cooling device according to claim 1, wherein: the flow path housing is a flow path plate, and the cooling flow path comprises a groove disposed on the flow path plate to allow the cooling medium to circulate. Forming, by the side of the recess and the heat dissipation substrate away from the LED chip, the cooling flow channel; the driving cooling medium flow device comprises two intermeshing first gears and second gears mounted on the bottom of the groove, disposed away from the groove One side drives the driving motor of the first gear and the second gear to rotate, and the gear shaft of the first gear or the gear shaft of the second gear passes through the flow channel plate from the bottom of the groove and is hermetically sealed or liquid-sealed with the flow channel plate.
3、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 流道 壳体为流道板， 冷却流道包括设置在流道板上使冷却介质可循环流动的凹 槽， 凹槽与散热基板背离 LED芯片的一侧形成所述的冷却流道； 驱动冷却 介质流动装置包括安装在凹槽底部的两个相互啮合的第一齿轮和第二齿轮、 设置在背离凹槽的一侧带动第一齿轮和第二齿轮转动的驱动电机， 在驱动 电机与第一齿轮或第二齿轮间设有使第一齿轮或第二齿轮转动的磁铁， 磁 铁与第一齿轮或第二齿轮间磁固定； 流道板为非磁性材料。 3. The LED integrated structure with a cooling device according to claim 1, wherein: the flow path housing is a flow path plate, and the cooling flow path comprises a groove disposed on the flow path plate to allow the cooling medium to circulate. a side of the recess and the heat dissipation substrate facing away from the LED chip to form the cooling flow channel; the driving cooling medium flow device includes two intermeshing first gears and a second gear mounted on the bottom of the groove, a driving motor for driving the first gear and the second gear to rotate on a side facing away from the groove, and a magnet for rotating the first gear or the second gear between the driving motor and the first gear or the second gear, the magnet and the first A gear or a second gear is magnetically fixed; the flow passage plate is a non-magnetic material.
4、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 驱动 冷却介质流动装置包括置于冷却流道内并安装在流道壳体上的搅拌叶轮、 设置在背离冷却流道的一侧带动搅拌叶轮转动的驱动电机， 搅拌叶轮的叶 轮轴穿过流道壳体与流道壳体气密封或液密封。  4. The LED integrated structure with a cooling device according to claim 1, wherein: the driving cooling medium flow device comprises a stirring impeller disposed in the cooling flow path and mounted on the flow path housing, disposed away from the cooling flow One side of the track drives a drive motor that rotates the impeller, and the impeller shaft of the agitating impeller is hermetically sealed or liquid-tight through the runner housing and the runner housing.
5、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 驱动 冷却介质流动装置包括置于冷却流道内并安装在流道壳体上的搅拌叶轮、 设置在背离冷却流道的一侧带动搅拌叶轮转动的驱动电机， 在驱动电机与 搅拌叶轮间设有使搅拌叶轮转动的磁铁， 磁铁与搅拌叶轮间磁固定； 流道 壳体为非磁性材料。  5. The LED integrated structure with a cooling device according to claim 1, wherein: the driving cooling medium flow device comprises a stirring impeller disposed in the cooling flow path and mounted on the flow path housing, disposed away from the cooling flow One side of the track drives a driving motor for rotating the impeller, and a magnet for rotating the stirring impeller is arranged between the driving motor and the stirring impeller, and the magnet and the stirring impeller are magnetically fixed; the flow path housing is a non-magnetic material.
6、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 在流 道壳体的外壁上设有冷却风扇， 冷却介质为不制冷的冷却介质， 流道壳体 为散热件， 流道壳体直接与空气接触。  6. The LED integrated structure with a cooling device according to claim 1, wherein: a cooling fan is disposed on an outer wall of the flow path housing, the cooling medium is a cooling medium that is not cooled, and the flow path housing is configured to dissipate heat. The flow path housing is in direct contact with the air.
7、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 流道 壳体为流道板， 冷却流道包括设置在流道板上使冷却介质可循环流动的凹 槽， 驱动冷却介质流动装置安装在凹槽内； 在流道板背离凹槽的一侧对应 凹槽的位置为凸出流道板的散热凸条， 冷却流道为高低不平的冷却流道； 在流道板背离散热基板的一侧还设有导风板， 导风板与流道板形成与凹槽 平行的风道； 在风道的一侧安装有冷却风扇； 冷却介质为不制冷的冷却介 质， 流道板为散热板， 流道板背离凹槽的一侧直接与空气接触。  7. The LED integrated structure with a cooling device according to claim 1, wherein: the flow path housing is a flow path plate, and the cooling flow path comprises a groove disposed on the flow path plate to allow the cooling medium to circulate. The driving cooling medium flowing device is installed in the groove; the corresponding groove on the side of the flow channel plate facing away from the groove is a heat dissipating rib protruding from the flow channel plate, and the cooling flow channel is a rugged cooling flow channel; An air deflector is further disposed on one side of the discrete thermal substrate of the flow channel back, and the air deflector and the flow channel plate form a wind channel parallel to the groove; a cooling fan is installed on one side of the air passage; the cooling medium is cooled without cooling The medium, the runner plate is a heat sink, and the side of the runner plate facing away from the groove is in direct contact with the air.
8、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 流道 壳体为流道板， 冷却流道包括设置在流道板上使冷却介质可循环流动的凹 槽， 凹槽与散热基板背离 LED芯片的一侧形成所述的冷却流道； 冷却装置 还包括制冷装置， 制冷装置安装在流道板背离散热基板的一侧， 制冷装置 的吸热端可导热地贴合在流道板上并置于循环流道背面的设定位置， 冷却 介质为液体。 8. The LED integrated structure with a cooling device according to claim 1, wherein: the flow path housing is a flow path plate, and the cooling flow path includes a groove disposed on the flow path plate to allow the cooling medium to circulate. The side of the recess and the heat dissipating substrate facing away from the LED chip forms the cooling flow channel; the cooling device further comprises a refrigerating device, the refrigerating device is mounted on one side of the discrete hot substrate of the flow channel back, and the heat absorbing end of the refrigerating device is thermally conductive Fitted on the flow path plate and placed in the set position on the back of the circulation flow path, cooling The medium is a liquid.
9、 如权利要求 8所述的带有冷却装置的 LED集成结构， 其特征在于： 制冷 装置还包括半导体制冷装置或磁制冷装置， 设置在流道板背离散热基板的 一侧的散热片； 制冷装置的吸热端可导热地贴合在流道板的凹槽的背面， 制冷装置的散热端可导热地贴合在散热片上。  9. The LED integrated structure with a cooling device according to claim 8, wherein: the refrigerating device further comprises a semiconductor refrigerating device or a magnetic refrigerating device, and a heat dissipating fin disposed on one side of the discrete thermal substrate of the flow path plate back; The heat absorbing end of the device can be thermally coupled to the back surface of the groove of the flow channel plate, and the heat dissipation end of the refrigeration device can be thermally conductively attached to the heat sink.
10、 如权利要求 8所述的带有冷却装置的 LED集成结构， 其特征在于： 制 冷装置包括半导体制冷装置或磁制冷装置； 在流道板背离散热基板的一侧 还设有散热板， 在散热板背离流道板的一侧还设有冷却槽， 在散热板背离 流道板的一侧还设有密封冷却槽的密封板， 制冷装置的吸热端可导热地贴 合在流道板的冷却流道的背面， 制冷装置的散热端可导热地贴合在散热板 上。  10. The LED integrated structure with a cooling device according to claim 8, wherein: the refrigerating device comprises a semiconductor refrigerating device or a magnetic refrigerating device; and a heat dissipating plate is further disposed on a side of the flow plate back of the discrete thermal substrate, A cooling groove is further disposed on a side of the heat dissipation plate facing away from the flow channel plate, and a sealing plate sealing the cooling groove is further disposed on a side of the heat dissipation plate facing away from the flow channel plate, and the heat absorption end of the refrigeration device can be thermally conductively attached to the flow channel plate. On the back side of the cooling flow path, the heat dissipating end of the refrigerating device can be thermally coupled to the heat dissipating plate.
11、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 在 流道壳体上还设有与冷却流道连通的冷却介质进口和冷却介质出口， 冷却 介质进口和冷却介质出口与外部的冷却介质连通。  11. The LED integrated structure with a cooling device according to claim 1, wherein: a cooling medium inlet and a cooling medium outlet connected to the cooling flow passage are further provided on the flow path housing, the cooling medium inlet and the cooling The media outlet is in communication with an external cooling medium.
12、 如权利要求 1所述的带有冷却装置的 LED集成结构， 其特征在于： 冷 却装置还包括制冷装置、设置在流道壳体上与冷却流道连通的冷却介质口， 制冷装置的冷却介质通过冷却介质口与冷却流道连通， 冷却介质由驱动冷 却介质流动装置驱动在冷却流道和制冷装置之间循环流动。  12. The LED integrated structure with a cooling device according to claim 1, wherein the cooling device further comprises a cooling device, a cooling medium port disposed on the flow path housing and communicating with the cooling flow path, and cooling of the cooling device. The medium communicates with the cooling flow passage through the cooling medium port, and the cooling medium is driven by the driving cooling medium flow device to circulate between the cooling flow passage and the cooling device.
13、如权利要求 1至 12任意一项所述的带有冷却装置的 LED集成结构， 其特 征在于： 在散热基板上设有与散热基板一体成型的一个或一个以上的凸台， LED芯片通过固晶工艺直接固定在凸台的端面上;凸台置于对应的第一通孔内。 The LED integrated structure with a cooling device according to any one of claims 1 to 12, wherein: the heat dissipation substrate is provided with one or more bosses integrally formed with the heat dissipation substrate, and the LED chip passes The die bonding process is directly fixed on the end surface of the boss; the boss is placed in the corresponding first through hole.
14、 如权利要求 1至 12任意一项所述的带有冷却装置的 LED集成结构， 其 特征在于： 还包括 PCB板， 布图电路导电层直接设置在 PCB板上， 在 PCB 板上设有与固定柱配合的第三通孔， 固定柱依次穿过 PCB板上的第三通孔 和散热基板上的第四通孔，再通过热将散热基板、 PCB板置于成型定位透镜 或成型透镜的塑胶件的模具内， 在成型定位透镜或成型透镜的塑胶件时成 型有抵挡部。 The LED integrated structure with a cooling device according to any one of claims 1 to 12, further comprising: a PCB board, wherein the conductive layer of the layout circuit is directly disposed on the PCB board, and is disposed on the PCB board a third through hole that cooperates with the fixing post, the fixing post sequentially passes through the third through hole on the PCB board and the fourth through hole on the heat dissipation substrate, and then the heat dissipation substrate and the PCB board are placed in the forming positioning lens or the molding lens by heat In the mold of the plastic part, a resisting portion is formed when forming the positioning lens or the plastic part of the molded lens.
15、 如权利要求 1至 12任意一项所述的带有冷却装置的 LED集成结构， 其 特征在于： 还包括用来封装 LED芯片和导线的封装胶体； 透镜通过与第一 通孔紧配合或通过压边机热压固定在定位透镜或成型透镜的塑胶件上； 在 定位透镜或成型透镜的塑胶件上对应第一通孔的位置设有注入封装胶体的 注胶通道， 注胶通道的胶口置于定位透镜或成型透镜的塑胶件远离抵挡部 一侧的端面上， 胶口和注胶通道与第一通孔的内侧壁连通； 注入封装胶体 后， 封装胶体进一步将透镜固定； 通过将散热基板置于成型定位透镜或成 型透镜的塑胶件的模具内在成型定位透镜或成型透镜的塑胶件时成型固定 柱端部的抵挡部。 The LED integrated structure with a cooling device according to any one of claims 1 to 12, further comprising: an encapsulant for encapsulating the LED chip and the wire; the lens is tightly matched with the first through hole or It is fixed by hot pressing on the plastic part of the positioning lens or the forming lens by the edger; the plastic injection part of the positioning lens or the molded lens is provided with a glue injection channel for injecting the encapsulation colloid, and the glue of the glue injection channel. The mouth is placed on the end face of the positioning lens or the molded lens away from the resisting portion, and the glue port and the glue injection channel communicate with the inner side wall of the first through hole; after the encapsulant is injected, the encapsulant further fixes the lens; The heat dissipating substrate is placed in a mold of the plastic part forming the positioning lens or the molding lens to form a resisting portion at the end of the fixing post when forming the positioning lens or the plastic part forming the lens.
16、 如权利要求 1至 12任意一项所述的带有冷却装置的 LED集成结构， 其 特征在于： 透镜为封装 LED芯片和导线的封装胶体； 通过将散热基板置于 成型定位透镜或成型透镜的塑胶件的模具内在成型定位透镜或成型透镜的 塑胶件时成型固定柱端部的抵挡部。  The LED integrated structure with a cooling device according to any one of claims 1 to 12, wherein: the lens is an encapsulant for encapsulating the LED chip and the wire; and the heat dissipating substrate is placed on the molding positioning lens or the molding lens The mold of the plastic part is formed by forming a positioning lens or a plastic part of the molding lens to form a resisting portion at the end of the fixing column.
17、如权利要求 1至 12任意一项所述的一种带有冷却装置的 LED集成结构， 其特征在于： 定位透镜或成型透镜的塑胶件为塑胶环， 在散热基板上固定 有两个或两个以上相互独立的所述的塑胶环。  The LED integrated structure with a cooling device according to any one of claims 1 to 12, wherein: the plastic component of the positioning lens or the molding lens is a plastic ring, and two or two fixed on the heat dissipation substrate Two or more of the plastic rings independently of each other.
18、如权利要求 1至 12任意一项所述的一种带有冷却装置的 LED集成结构， 其特征在于： 定位透镜或成型透镜的塑胶件包括塑胶环和将设定个数的塑 胶环连接在一起的与塑胶环一起注塑成型的连接筋， 定位透镜或成型透镜 的塑胶件包括两个或两个以上所述的塑胶环。  The LED integrated structure with a cooling device according to any one of claims 1 to 12, wherein: the plastic part of the positioning lens or the forming lens comprises a plastic ring and a set number of plastic rings. The joint ribs that are injection molded together with the plastic ring, the plastic parts of the positioning lens or the molded lens include two or more plastic rings.
19、如权利要求 1至 12任意一项所述的一种带有冷却装置的 LED集成结构， 其特征在于： 定位透镜或成型透镜的塑胶件为板状， 在定位透镜或成型透 镜的塑胶件上设有两个或两个以上所述的第一通孔。  The LED integrated structure with a cooling device according to any one of claims 1 to 12, wherein: the plastic part of the positioning lens or the forming lens is a plate shape, and the plastic part of the positioning lens or the forming lens Two or more first through holes are provided thereon.
20、 带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 其特征在于： 在定位透镜或成型透镜的塑胶件上设有一个 或一个以上的第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设 有固定柱， 在散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热 基板的第二通孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑 胶件通过固定柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定 在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔 的侧壁与 LED芯片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电 极电连接， 导线的另一端与第一通孔与 LED芯片之间的布图电路导电层电 连接； 冷却装置包括设置在散热基板背离 LED芯片一侧的风扇， 散热基板 背离 LED芯片的一侧与空气直接接触。 20. An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and the layout circuit of the electrical connection wire, wherein : one or more first through holes are provided in the plastic part of the positioning lens or the forming lens, and are extended on the end surface of the positioning piece or the plastic part of the forming lens The fixing column has a second through hole that is matched with the fixing post on the heat dissipating substrate, the fixing post passes through the second through hole of the heat dissipating substrate, and the end portion of the fixing post is provided with a resisting portion; the plastic for positioning the lens or the forming lens The component is fixed to the heat dissipation substrate through the fixing post and the resisting portion; the LED chip is directly fixed on the heat dissipation substrate by the die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends into the sidewall of the first through hole Between the LED chip and the LED chip, the wire is placed in the first through hole, and one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; The fan is disposed on a side of the heat dissipation substrate facing away from the LED chip, and the side of the heat dissipation substrate facing away from the LED chip is in direct contact with the air.
21、 带有冷却装置的 LED集成结构， 包括散热基板， LED芯片， 透镜， 定位 透镜或成型透镜的塑胶件， 电连接 LED芯片电极的导线和电连接导线的布 图电路导电层， 其特征在于： 在定位透镜或成型透镜的塑胶件上设有一个 或一个以上的第一通孔， 在定位透镜或成型透镜的塑胶件的端面上延伸设 有固定柱， 在散热基板上设有与固定柱配合的第二通孔， 固定柱穿过散热 基板的第二通孔， 在固定柱的端部设有抵挡部； 定位透镜或成型透镜的塑 胶件通过固定柱和抵挡部与散热基板固定； LED芯片通过固晶工艺直接固定 在散热基板上， 并置于对应的第一通孔内； 布图电路导电层伸入第一通孔 的侧壁与 LED芯片之间， 导线置于第一通孔内， 导线一端与 LED芯片的电 极电连接， 导线的另一端与第一通孔与 LED芯片之间的布图电路导电层电 连接； 冷却装置包括设置在散热基板背离 LED芯片的一侧的流道壳体、 在 流道壳体和散热基板间形成容置冷却介质的冷却流道、制冷装置； LED芯片 的背面完全被冷却流道覆盖， 固定柱与散热基板间气密封或液密封； 散热 基板背离 LED芯片的一侧与冷却介质直接接触； 冷却流道倾斜于水平面布 置， 制冷装置的吸热端置于冷却流道的顶部。  21. An LED integrated structure with a cooling device, comprising a heat dissipating substrate, an LED chip, a lens, a positioning lens or a plastic part of a molded lens, a conductive layer electrically connecting the wires of the LED chip electrode and the layout circuit of the electrical connection wire, wherein : one or more first through holes are formed in the plastic part of the positioning lens or the molding lens, and a fixing post is extended on the end surface of the plastic part of the positioning lens or the molding lens, and the fixing column is arranged on the heat dissipation substrate a second through hole, the fixing post passes through the second through hole of the heat dissipation substrate, and the end portion of the fixing column is provided with a resisting portion; the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating substrate through the fixing post and the resisting portion; The chip is directly fixed on the heat dissipation substrate by a die bonding process and placed in the corresponding first through hole; the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, and the wire is placed in the first through hole Inside, one end of the wire is electrically connected to the electrode of the LED chip, and the other end of the wire is electrically connected with the conductive layer of the layout circuit between the first through hole and the LED chip; The utility model comprises a flow channel housing disposed on a side of the heat dissipation substrate facing away from the LED chip, a cooling flow channel for accommodating the cooling medium between the flow path housing and the heat dissipation substrate, and a refrigeration device; the back surface of the LED chip is completely covered by the cooling flow channel. The sealing column and the heat dissipating substrate are hermetically sealed or liquid sealed; the side of the heat dissipating substrate facing away from the LED chip is in direct contact with the cooling medium; the cooling flow channel is arranged at a horizontal plane, and the heat absorbing end of the refrigerating device is placed at the top of the cooling flow channel.
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