CN201804865U - LED (light-emitting diode) integrated structure with cooling device - Google Patents
LED (light-emitting diode) integrated structure with cooling device Download PDFInfo
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- CN201804865U CN201804865U CN2010205160748U CN201020516074U CN201804865U CN 201804865 U CN201804865 U CN 201804865U CN 2010205160748 U CN2010205160748 U CN 2010205160748U CN 201020516074 U CN201020516074 U CN 201020516074U CN 201804865 U CN201804865 U CN 201804865U
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- heat
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- coolant flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
- F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An LED (light-emitting diode) integrated structure with a cooling device comprises a heat-radiating substrate and an LED chip, wherein the LED chip is fixed on the heat-radiating substrate. The LED integrated structure with the cooling device is characterized in that the cooling device comprises a flow passage casing, a device for driving a cooling medium to flow and a cooling flow passage for accommodating the cooling medium, wherein the flow passage casing is arranged on one side of the heat-radiating substrate opposite to the LED chip; the cooling flow passage is formed between the flow passage casing and the heat-radiating substrate and is hermetically sealed or hydraulically sealed with the heat-radiating substrate; the back side of the LED chip is completely covered by the cooling flow passage; and one side of the heat-radiating substrate opposite to the LED chip is in direct contact with the cooling medium. The utility model has the advantages as follows: since the temperature of the cooling medium is easy to control, the device for driving the cooling medium to flow can drive the cooling medium in the cooling flow passage to flow quickly to accelerate the heat exchange, thereby more quickly carrying away a larger amount of heat generated by the LED chip; and therefore, compared with the method of allowing the heat-radiating substrate to be in direct contact with the air, the LED integrated structure can achieve better cooling effect.
Description
Technical field
The utility model relates to and a kind ofly is used to throw light on, the LED integrated morphology that has cooling device of backlight source module, television set, LED dot matrix display screen, projector equipment etc., particularly relates to a kind of cooling device of high-power LED integrated morphology.
Background technology
Led light source, high-power LED light source particularly, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, the temperature of led light source is too high, will cause the light efficiency of LED to reduce, the life-span is low etc., therefore the heat that how led chip is produced when luminous has effectively distributed the bottleneck into the popularization and application led light source rapidly.How to improve the light efficiency of led light source, thereby and the heat dispersion that how to improve led light source increase the service life, be the important technology difficult problem on the present industry.The heat dissipation problem of existing solution led light source, a kind of scheme are to improve LED integrated morphology, easier the distributing of heat that led light source is produced, and another kind of scheme is to increase cooling device.
In the patent No. is 200820134860.4 utility model patent, disclose a kind of radiator structure and had the led lamp of this radiator structure, the radiator structure of this utility model includes a cavity, be equipped with a cooling solution therebetween, and be provided with the even number dividing plate, to form a runner, this runner is communicated with in the mode of S shape, and has at least one heat extraction district, at least one heat affected zone and at least one buffering area.Though this utility model is provided with coolant flow channel, but both do not driven the coolant flow device and made the interior cold and hot quick exchange of coolant of runner, because the heat extraction district places the both sides of cavity, coolant in the runner also can't utilize the different proportion of coolant to carry out the quick exchange of cold and hot coolant, the cold and hot exchange of coolant is to lean on the heat conduction of coolant to exchange, place the heat extraction district area of dissipation of both sides of cavity again little, when the heat of led chip generation is dispersed in the coolant, because the heat of coolant itself is difficult to distribute, the cold and hot exchange of coolant is very slow again, and is therefore bad to the cooling effect of led chip.
The existing heat abstractor that utilizes semiconductor cooling device that led chip is cooled off, be generally the semiconductor cooling fin and cover the back side of led chip fully, because the power of led chip is little, and the power of semiconductor cooling device is big, so existing this semiconductor cooling device, cool off low power led chip with the large-power semiconductor cooling device, uneconomical.In 200920009830.5 utility model patent, a kind of LED light fixture of lamp body Controllable Temperature is disclosed, comprise the LED lamp body and, be pasted with the one or more wafers that can realize refrigeration or heat-production functions and respective sustain LED lamp body temperature constant on the described LED lamp body for the LED lamp body provides galvanic driving power.Though this utility model uses one or more wafers to solve the refrigeration problem of LED lamp body, but because wafer directly is attached on the lamp body, no coolant flow channel, heat exchange between led chip and the wafer can only be by solid dielectric conduction exchange, because the solid conduction heat exchange is slow, therefore this wafer is bad to the cooling effect of led chip.
The utility model content
Bad for the cooling device cooling effect that solves existing LED integrated morphology, use that uneconomic problem, the technical problems to be solved in the utility model are to provide the heat exchange of the cold and hot medium of a kind of cooling device fast, cooling effectiveness is high, the LED integrated morphology that has cooling device of good cooling results.
The LED integrated morphology that has cooling device, comprise heat-radiating substrate, led chip, led chip is fixed on the heat-radiating substrate, it is characterized in that: cooling device comprises an effluent guidance tape, the driving coolant flow device that is arranged on heat-radiating substrate and deviates from led chip, the coolant flow channel that forms ccontaining coolant between runner plate and heat-radiating substrate, coolant flow channel and heat-radiating substrate hermetic seal or liquid sealing; The back side of the led chip runner that is cooled fully covers; The side that heat-radiating substrate deviates from led chip directly contacts with coolant.As first kind of improvement of scheme one, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, and the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Drive the coolant flow device and comprise two intermeshing first gears and second gears being installed in bottom portion of groove, be arranged on a side that deviates from groove and drive the drive motors that first gear and second gear rotate, the gear shaft of the gear shaft of first gear and second gear seals or liquid sealing with the groove spirit.
As second kind of improvement of scheme one, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, and the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Drive the coolant flow device and comprise two intermeshing first gears and second gears being installed in bottom portion of groove, be arranged on a side that deviates from groove and drive the drive motors that first gear and second gear rotate, between drive motors and first gear or second gear, be provided with the magnet that makes first gear or the rotation of second gear; Runner plate is a nonmagnetic substance.
The third improvement as scheme one, drive the coolant flow device and comprise the agitator arm that is installed in coolant flow channel, drive motors, the impeller shaft of agitator arm and coolant flow channel hermetic seal or the liquid sealing that is arranged on the side drive agitator arm rotation that deviates from coolant flow channel.
The 4th kind of improvement as scheme one, drive the coolant flow device comprise be installed in the coolant flow channel agitator arm, be arranged on a side that deviates from coolant flow channel and drive the drive motors that agitator arm rotates, be provided with the magnet that agitator arm is rotated between drive motors and agitator arm, runner plate is a nonmagnetic substance.
As the 5th kind of improvement of scheme one, a side that deviates from coolant flow channel at runner plate is provided with cooling fan, the coolant of coolant for not freezing, and runner plate is a heating panel, the side that runner plate deviates from coolant flow channel directly contacts with air.
As the 6th kind of improvement of scheme one, the position that deviates from a side respective slot of groove at runner plate is the heat radiation raised line that protrudes runner plate, and coolant flow channel is rugged coolant flow channel; A side that deviates from heat-radiating substrate at runner plate also is provided with wind deflector, and wind deflector forms the air channel parallel with groove with runner plate; Side in the air channel is equipped with cooling fan; The coolant of coolant for not freezing, runner plate is a heating panel, the side that runner plate deviates from groove directly contacts with air.
As the 7th kind of improvement of scheme one, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, and the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Cooling device also comprises refrigerating plant, and refrigerating plant is installed in the side that runner plate deviates from heat-radiating substrate, and the heat absorbing end of refrigerating plant can be fitted on the runner plate with heat conduction and place the desired location at the circulatory flow back side, and coolant is a liquid.
As the improvement of such scheme, refrigerating plant comprises semiconductor cooling device or magnetic refrigeration apparatus; A side that deviates from heat-radiating substrate at runner plate also is provided with fin, and the heat absorbing end of refrigerating plant can be fitted in the back side of the groove of runner plate with heat conduction, and the radiating end of refrigerating plant can be fitted on the fin with heat conduction.
As the another improvement of such scheme, refrigerating plant comprises semiconductor cooling device or magnetic refrigeration apparatus; A side that deviates from heat-radiating substrate at runner plate also is provided with heating panel, a side that deviates from runner plate at heating panel also is provided with cooling bath, a side that deviates from runner plate at heating panel also is provided with the sealing plate that seals cooling bath, the heat absorbing end of refrigerating plant can be fitted in the back side of the coolant flow channel of runner plate with heat conduction, and the radiating end of refrigerating plant can be fitted on the heating panel with heat conduction.
As the 8th kind of improvement of scheme one, also be provided with the cooling medium inlet and the coolant outlet that are communicated with coolant flow channel, cooling medium inlet and coolant outlet are communicated with the coolant of outside.
Compared with prior art, the beneficial effects of the utility model are:
1, a side that deviates from led chip at heat-radiating substrate is provided with coolant flow channel, in coolant flow channel, be full of coolant, because coolant temperature is controlled easily, driving the coolant flow device can make the coolant in the coolant flow channel flow fast, heat exchange is faster, can take away the heat that is produced by led chip faster and more, therefore contact with air than heat-radiating substrate is direct, cooling effect is better.During particularly for the heat-radiating substrate horizontal positioned, drive the coolant flow device and can make the interior coolant temperature basically identical of coolant flow channel, thereby can make the temperature of entire heat dissipation substrate approaching consistent, heat is not concentrated in the led chip position.
2, coolant flow channel comprises being arranged on and makes coolant mobile groove capable of circulation on the runner plate, driving the coolant flow device is intermeshing two gears and drive motors, simple in structure, and the coolant in the coolant flow channel can be by the mobile heat-shift of the Rapid Cycle of coolant, good cooling results.
3, drive the coolant flow device and be agitator arm and drive motors, simple in structure, and the coolant in the coolant flow channel is by the mobile heat-shift of the Rapid Cycle of coolant, good cooling results.
4, agitator arm or intermeshing two gears drive by magnetic force, and magnet drives two gears or agitator arm across runner plate, and runner plate is as a whole, does not need perforate and hermetically-sealed construction, and is simple in structure, good sealing effect, and long service life.Runner plate between magnet and agitator arm or gear is a nonmagnetic substance, as copper material, aluminium, stainless steel, pottery etc.
5, a side that deviates from coolant flow channel at the runner housing is provided with cooling fan, cooling fan can be installed in the back side of runner housing, also can be installed in the side of runner housing, cooling fan can make the heat of coolant be dispersed in the air rapidly through the runner housing, make coolant remain lower temperature, thereby make coolant can take away the heat that led chip produces faster and more.
6, form rugged coolant flow channel in the position that runner plate deviates from a side respective slot of groove for the heat radiation raised line that protrudes runner plate, increase the contact area of cool stream guidance tape and air as far as possible, thereby increase area of dissipation, increasing cooling fan and heat radiation raised line can make the heat of coolant be dispersed in the air rapidly through runner plate, make coolant remain lower temperature, thereby make coolant can take away the heat that led chip produces faster and more.
7, refrigerating plant is installed in the position of respective slot, refrigerating plant only need cool off a spot of coolant and by driving the coolant flow device coolant be flowed fast in groove, can make the temperature that coolant reaches to be needed, thereby make coolant can take away the heat that led chip produces faster and more, the temperature of the temperature that led chip, entire heat dissipation substrate is reached need and each led chip, entire heat dissipation substrate is consistent substantially.
8, adopt the semiconductor semiconductor cooling device, simple in structure, cost is low, good refrigeration effect; Adopt magnetic refrigeration apparatus, good refrigeration effect; The heat absorbing end of refrigerating plant can be fitted in the back side of the coolant flow channel of runner housing with heat conduction, heat on the heat-radiating substrate can be taken away rapidly, the radiating end of refrigerating plant can be fitted on the fin with heat conduction, the heat of refrigerating plant can be dispersed in the air rapidly to go.
9, the heat absorbing end of refrigerating plant can be fitted in the back side of the coolant flow channel of runner housing with heat conduction, heat on the heat-radiating substrate can be taken away rapidly, the radiating end of refrigerating plant can be fitted on the heating panel with heat conduction, the heat of refrigerating plant can be dispersed in the cooling bath rapidly to go, and cooling effect is better.
10, the coolant by the outside constantly in coolant flow channel fluxion strap walk the heat of heat-radiating substrate and led chip, just can reach cooling effect well.
11, the coolant of refrigerating plant is communicated with coolant flow channel by the coolant mouth, and directly by the coolant cooling coolant flow channel of refrigerating plant, the thermal loss link is few, good cooling results.
Description of drawings
Fig. 1 is the perspective exploded view of the utility model embodiment 1.
Fig. 2 is the perspective exploded view of the utility model embodiment 2.
Fig. 3 is the perspective exploded view of the utility model embodiment 3
Fig. 4 is the perspective exploded view that the utility model embodiment 3 only illustrates part-structure.
Fig. 5 is the I portion enlarged drawing of Fig. 4.
Fig. 6 is the perspective exploded view of the utility model embodiment 4.
Fig. 7 is the perspective exploded view that the utility model embodiment 4 only illustrates part-structure.
Fig. 8 is the perspective exploded view of the utility model embodiment 5.
Fig. 9 is the perspective exploded view of the utility model embodiment 6.
Figure 10 is the schematic perspective view of the utility model embodiment 7.
Figure 11 is the perspective exploded view of the utility model embodiment 7.
Figure 12 is the perspective exploded view of the utility model embodiment 8.
Figure 13 is the perspective exploded view that the utility model embodiment 8 only illustrates part-structure.
Figure 14 is the perspective exploded view of the utility model embodiment 9.
Figure 15 is the perspective exploded view of the utility model embodiment 10.
Figure 16 is the perspective exploded view of the utility model embodiment 11.
Figure 17 is the perspective exploded view of the utility model embodiment 12.
Embodiment 1
As shown in Figure 1, a kind of LED integrated morphology that has cooling device, comprise cover plate 1, reflecting plate 2, heat-radiating substrate 3, led chip 4, lens 5, lens position ring 6, be electrically connected led chip 4 electrode gold thread 7 and be electrically connected gold thread 7 Butut circuit conductive layer 8, be used for the packing colloid 9 of packaging LED chips 4 and gold thread 7.Cooling device comprises the effluent guidance tape 10 that is arranged on heat-radiating substrate 3 and deviates from led chip 4, is being provided with coolant flow channel that groove 11 on groove 11, the runner plate 10 and 3 of heat-radiating substrates form ccontaining cooling waters on the runner plate 10, is driving flow of cooling water device (not shown), and driving the flow of cooling water device is water pump.Be provided with the cooling water inlet 12 and the coolant outlet (not shown) that are communicated with coolant flow channel on runner plate 10, runner plate is communicated with by the water in the cooling water water tank (not shown) of cooling water inlet 12 and coolant outlet and outside.The back side of led chip 4 runner that is cooled fully covers; The side that heat-radiating substrate 3 deviates from led chip 4 directly contacts with cooling water, is full of cooling water in coolant flow channel.Reflecting plate 2 is installed on the heat-radiating substrate 3, and cover plate 1 is installed on the runner plate 10, other structure of cover plate 1 and runner plate 10 sealing LED integrated morphologies.On reflecting plate 2, be provided with and lens 5 through hole 13 one to one, on cover plate 1 with lens 5 reflector 14 one to one.Runner plate 10 is the heating panel of heat conduction, and the side that runner plate 10 deviates from groove 11 directly contacts with air.Driving the flow of cooling water device is installed in outside the coolant flow channel.
Lens position ring 6 is selected resistant to elevated temperatures PPA plastics for use.On lens position ring 6, be provided with first through hole 15 of positioning lens 5 and coating packing colloid 9, extend on the lens position ring 6 and be provided with fixed leg 16, form blocking part 17,3 liquid sealings of fixed leg 16 and heat-radiating substrate in the end of fixed leg 16 during at the forming plastic cement locating ring in by the mould that heat-radiating substrate 3 is placed molded lens locating ring 6.Be provided with the glue injection channel 18 of injecting packing colloid 9 on lens position ring 6, the glue mouth 19 of glue injection channel 18 places on the end face of lens position ring 6 away from blocking part one side, and glue mouth 19 and glue injection channel 18 are communicated with the sidewall of first through hole 15.
Heat-radiating substrate 3 is stamped to form by the thin-sheet metal or the metal alloy of high heat-conducting, and its material can be stainless steel, copper, tungsten, aluminium, aluminium nitride, chromium etc. or its alloy.Heat-radiating substrate 3 comprises a flat base plate, and with a plurality of chip fixing lug boss 20 of heat-radiating substrate 3 integrated protrusion base plates, corresponding each chip fixing lug boss 20 is provided with second through hole 21 that cooperates with fixed leg 16.The cross section of chip fixing lug boss 20 is circular, and the area of the cross section of base plate greater than the area of the cross section of chip fixing lug boss 20, is more than three times or three times of area of the cross section of chip fixing lug boss 20 greatly at least.Be provided with the depressed part 22 with the concentric storing led chip 4 of chip fixing lug boss 20 at the top of chip fixing lug boss 20, the bottom surface of depressed part 22 is for placing the plane of led chip 4.A side that deviates from chip fixing lug boss 20 at heat-radiating substrate 3 is provided with and places in the chip fixing lug boss 20 the heat radiation blind hole (not shown) concentric with chip fixing lug boss 20.The side that heat-radiating substrate 3 deviates from chip fixing lug boss 20 directly contacts with cooling water.
The fixed leg 16 of lens position ring 6 passes second through hole 21 of heat-radiating substrate 3, and blocking part 17 heat-radiating substrates 3 of the end by fixed leg 16 are fixing, and heat-radiating substrate 3 and lens position ring 6 are fixed together like this.Chip fixing lug boss 20 places in first through hole 15 of corresponding lens position ring 6, Butut circuit conductive layer 8 is set directly at the side of heat-radiating substrate 3 towards boss 20, Butut circuit conductive layer 8 stretches between the madial wall and chip fixing lug boss 20 lateral walls of first through hole 15, led chip 4 directly is fixed on the end face of chip fixing lug boss 20 by solid brilliant technology, gold thread 7 places in the lens position ring 6, gold thread 7 one ends are electrically connected with the electrode of led chip 4, and the other end of gold thread 7 is electrically connected with Butut circuit conductive layer 8 in stretching into lens position ring 6; Lens 5 are installed on the lens position ring 6 and are tightly fixed with lens position ring 6.Further that lens 5 are fixing by the packing colloid 9 that glue mouth 19 and glue injection channel 18 are injected.
Embodiment 2
As shown in Figure 2, as different from Example 1, a kind of LED integrated morphology that has cooling device also comprises pcb board 51.Only be provided with the coolant inlet 53 that is communicated with coolant flow channel at runner plate 52, groove 56 on the runner plate 52 and heat-radiating substrate 66 form the coolant flow channel of airtight circulation, and coolant circulates in coolant flow channel.Driving the coolant flow device comprises two intermeshing first gears 54 and second gears 55 being installed in groove 56 bottoms, is arranged on a side that deviates from groove 56 and drives the drive motors 57 that first gear 54 and second gear 55 rotate, with drive motors 57 coaxial mounted gears 58, with gear 58 meshed gears 59, with the fixing magnet 60 of gear 59.First gear 54 by and magnet between magnetic force and magnet forward to synchronously.The gear shaft of first gear 54 and second gear 55 forms from the bottom extension of groove 56.
The chip fixing lug boss 63 of heat-radiating substrate 66 is passed the fourth hole 64 of pcb board 51, the fixed leg 68 of lens position ring 61 pass third through-hole 65 on the pcb board 51, heat-radiating substrate 66 second through hole 67 and with second through hole, 67 liquid sealings, the end by hot melt fixed leg 68 forms blocking part 69 and fixing with pcb board 51, heat-radiating substrate 66.
Embodiment 3
As shown in Figure 3, as different from Example 2, driving the coolant flow device comprises two the intermeshing first gear (not shown) and second gear (not shown) being installed in groove (not shown) bottom, is arranged on a side that deviates from groove and drives the drive motors 126 that first gear and second gear rotate, with drive motors 126 coaxial mounted gears 130, with gear 130 meshed gears 125, be installed in the fan 128 that runner plate 127 deviates from groove one side, fan 128 is fixed on the runner plate 127 by support 129.First gear passes runner plate 127 with gear 125 coaxial its fixed axis of fixing.Liquid sealing at the bottom of the gear shaft of the gear shaft of first gear and second gear and the groove.
As Fig. 4, shown in Figure 5, plastic cement lens position ring 101 links as a whole by dowel 102.In the top depression portion 104 of chip fixing lug boss 103, be fixed with R look led chip 108, G look led chip 109, B look led chip 110 by solid brilliant technology.When heat-radiating substrate 100, pcb board 123 and plastic cement lens position ring 101 are fixed together, chip fixing lug boss 103 places in first through hole 124 of corresponding plastic cement lens position ring 101, be arranged between the lateral wall that Butut circuit conductive layer 112,114,116,118,120,122 on the pcb board 123 stretches into the madial wall of first through hole 124 and chip fixing lug boss 103 and independently of one another, gold thread 111,113,115,117,119,121 places in first through hole 124.The positive pole of the led chip 108 of R look is electrically connected by the first Butut circuit conductive layer 112 between the lateral wall of gold thread 111 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 108 of R look is electrically connected by the Butut circuit conductive layer 114 between the lateral wall of gold thread 113 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.The positive pole of the led chip 109 of G look is electrically connected by the Butut circuit conductive layer 116 between the lateral wall of gold thread 115 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 109 of G look is electrically connected by the Butut circuit conductive layer 118 between the lateral wall of gold thread 117 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.The positive pole of the led chip 110 of B look is electrically connected by the Butut circuit conductive layer 120 between the lateral wall of gold thread 119 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103, and the negative pole of the led chip 110 of B look is electrically connected by the Butut circuit conductive layer 122 between the lateral wall of gold thread 121 and the madial wall that stretches into first through hole 124 and chip fixing lug boss 103.
Embodiment 4
As shown in Figure 6, as different from Example 2, cooling device also comprises semiconductor cooling device 162, semiconductor cooling device 162 is installed in the side that runner plate 163 deviates from heat-radiating substrate 151, the heat absorbing end of semiconductor cooling device 162 can be fitted on the runner plate 163 with heat conduction and place the desired location at the circulatory flow back side, the radiating end of semiconductor cooling device 162 can be fitted on the fin 164 with heat conduction, and local beyond the heat absorbing end of runner plate 163 laminated semiconductor refrigerating plants 162 and a side that deviates from heat-radiating substrate 151 are provided with the heat insulation layer (not shown).
As shown in Figure 7, plastic cement lens position part is a lens position plastic plate 150, and the number of lens position plastic plate 150 is one.On lens position plastic plate 150, be provided with six and be used for positioning lens 154 and coat first through hole 153 of packing colloid 158 with the chip fixing lug boss 152 of heat-radiating substrate 151 cooperates one by one.Lens 154 are by being tightly fixed in first through hole 153.Extension is provided with fixed leg 155 on the end face of lens position plastic plate 150, forms blocking part 157 in the end of fixed leg 155 in the mould of plastic plate 150 by heat-radiating substrate 151, pcb board 156 being placed molded lens locate when molded lens is located plastic plate 150.On lens position plastic plate 150, be provided with the glue injection channel 159 of injecting packing colloid 158, the glue mouth 160 of glue injection channel 159 places on the end face of lens position plastic plate 150 away from blocking part one side, and glue mouth 160 and glue injection channel 159 are communicated with the sidewall of first through hole 153.
Embodiment 5
As shown in Figure 8, as different from Example 4, cooling device also comprises conducting strip 201, conducting strip 201 is installed in the side that runner plate 202 deviates from heat-radiating substrate 200, one end of conducting strip 201 can be fitted on the runner plate 202 with heat conduction and place the desired location at the circulatory flow back side, the other end of conducting strip 201 can be fitted on the fin 203 with heat conduction, and local outside runner plate 202 applying conducting strips 201 and a side that deviates from heat-radiating substrate 200 are provided with the heat insulation layer (not shown).
Embodiment 6
As shown in Figure 9, as different from Example 4, cooling device also comprises magnetic refrigeration apparatus 251 and is arranged on the heating panel 253 that runner plate 252 deviates from a side of heat-radiating substrate, a side that deviates from runner plate 252 at heating panel 253 also is provided with cooling bath 254, a side that deviates from runner plate 252 at heating panel 253 also is provided with the sealing plate 255 that seals cooling bath 254, the heat absorbing end of magnetic refrigeration apparatus 251 can be fitted in the back side of the coolant flow channel of runner plate 252 with heat conduction, and the radiating end of magnetic refrigeration apparatus 251 can be fitted in the back side of the cooling bath 254 of heating panel with heat conduction.Local beyond the heat absorbing end of runner plate 252 applying magnetic refrigeration apparatus 251 and a side that deviates from heat-radiating substrate are provided with heat insulation layer.
Embodiment 7
Shown in Figure 10,11, as different from Example 2, the position that deviates from a side respective slot 302 of groove 302 at runner plate 301 is the heat radiation raised line 303 that protrudes runner plate 301, extend in the both sides of runner plate 301 perpendicular grooves 302 and to be provided with retaining wall 304, extend towards a side of groove 302 at runner plate 301 and be provided with the block 305 parallel with groove 302; Be provided with the sidewall 306 vertical with groove 302 in the both sides of heat-radiating substrate 300; The sidewall 306 of heat-radiating substrate 300 is fitted with block 305, and heat-radiating substrate 300 deviates from the face of led chip and face applying that runner plate 301 is provided with groove 302; The seal 307,310 that also comprises the runner sealing that heat-radiating substrate 300 and runner plate 301 are formed; The groove 302 of runner plate 301, retaining wall 304, block 305 form and make coolant mobile rugged coolant flow channel capable of circulation with face, the sidewall 306 of heat-radiating substrate 300, the seal 307 that heat-radiating substrate 300 deviates from chip; A side that deviates from heat-radiating substrate 300 at runner plate 301 also is provided with wind deflector 308, and wind deflector 308 and runner plate 301 forms the air channel parallel with groove 302; Side in the air channel is equipped with cooling fan 309; The coolant of coolant for not freezing, runner plate 301 is a heating panel, the side that runner plate 301 deviates from groove 302 directly contacts with air.
Embodiment 8
Shown in Figure 12,13, as different from Example 1, a kind of LED integrated morphology that has cooling device, comprise heat-radiating substrate 350, led chip 351, lens 352, plastic cement lens moulding ring 353 is electrically connected the lead 354 of led chip 351 electrodes and the Butut circuit conductive layer 355 of electrical connecting wire 354.Heat-radiating substrate 350 is formed by the die casting such as pottery of high heat-conducting.Heat-radiating substrate 350 comprises a flat base plate 361, and with a plurality of boss 362 of heat-radiating substrate 350 integrated protrusion base plates 361, corresponding each boss 362 is provided with second through hole 363 that cooperates with fixed leg 357.Butut circuit conductive layer 355 is set directly on the heat-radiating substrate 350, and Butut circuit conductive layer 355 is distributed on the same plane.
Cooling device also comprises refrigerating plant 364 and fin 365.Coolant flow channel favours horizontal plane and arranges that the heat absorbing end of refrigerating plant 364 places the top of coolant flow channel, and the heating end is fitted with fin 365.
Embodiment 9
As shown in figure 14, LED integrated morphology comprises cover plate 409, heat-radiating substrate 400, cooling device, is installed in led chip, lead, Butut circuit conductive layer of 400 of cover plate 409 and heat-radiating substrates etc.Lead is electrically connected by metal pins with Butut circuit conductive layer.Heat-radiating substrate 400 is a circular slab.Cooling device comprises and is arranged on the sleeve 401 that heat-radiating substrate deviates from led chip one side, sleeve 401 and be arranged on the flow passage cover plate 406 of sleeve 401 away from an end of heat-radiating substrate 400, heat-radiating substrate 400, sleeve 401 and flow passage cover plate 406 form the coolant flow channel of sealing, and the back side that the drives coolant flow device .LED chip runner that is cooled fully covers.The side that heat-radiating substrate 400 deviates from led chip directly contacts with coolant.Driving the coolant flow device comprises agitator arm 402 in the coolant flow channel that is installed in sealing, is arranged on and deviates from the drive motors 403 that a side that seal runner drives agitator arm 402 rotations, coaxial cooling fan 404 and the magnet 405 of being fixed with on drive motors 403, a side that deviates from fan at flow passage cover plate 406 is provided with impeller shaft 407, agitator arm 402 is fixed on the impeller shaft 407, impeller shaft 407 can rotate relative to flow passage cover plate 406, and is adsorbed on the magnet 405 and rotates synchronously with magnet 405.Outside fan, also be provided with fan guard 408.
Embodiment 10
As shown in figure 15, as different from Example 9, driving the coolant flow device comprises agitator arm 452 in the coolant flow channel that is installed in sealing, is arranged on and deviates from the drive motors 453 that a side that seal runner drives agitator arm 452 rotations, the coaxial cooling fan 454 that is fixed with on drive motors 453, fixedly the axle 455 of cooling fan 454 passes flow passage cover plate 456, agitator arm 452 is fixed on axle 455 end, axle 455 pass flow passage cover plate 456 and with flow passage cover plate 456 liquid sealings.
Embodiment 11
As shown in figure 16, LED integrated morphology comprises cover plate 504, heat-radiating substrate 500, cooling device, is installed in led chip, lead, Butut circuit conductive layer of 500 of cover plate 504 and heat-radiating substrates etc.Heat-radiating substrate 500 is a circular slab.Cooling device comprises and is arranged on the fan 501 that heat-radiating substrate 500 deviates from a side of led chip, is arranged on the outer fan guard 502 of fan 501.At fan guard 502 internal fixation motor 503 is arranged, fan 501 is installed on the motor 503, and heat-radiating substrate 500 is fixed on the fan guard 502.The side that heat-radiating substrate 500 deviates from led chip directly contacts with air.
Embodiment 12
As shown in figure 17, LED integrated morphology comprises cover plate 553, heat-radiating substrate 550, cooling device, is installed in led chip, lead, Butut circuit conductive layer of 550 of cover plate 553 and heat-radiating substrates etc.Cooling device comprise the runner housing 552 that is arranged on heat-radiating substrate and deviates from led chip one side, runner housing 552 and 550 formation of heat-radiating substrate coolant flow channel, refrigerating plant 551, be installed in the driving coolant flow device (for illustrating) that drives the coolants in the coolant flow channels in the refrigerating plant 551 and flow fast, be arranged on the coolant mouth 554 that is communicated with coolant flow channel on the runner housing; The coolant of refrigerating plant 551 is communicated with coolant flow channel by coolant mouth 554, and coolant circulates between coolant flow channel and refrigerating plant by driving the driving of coolant flow device.
The utility model is not limited to the foregoing description.The shape of the utility model heat-radiating substrate can design different shape as required, even can be designed to the product appearance part, and the utility model just intercepts partial L ED chip unit illustrative.Chip fixing lug boss number in the utility model can be from one to a lot of, and the utility model just exemplifies several LED integrated morphology unit that have cooling device.Butut circuit conductive layer in the utility model is an illustrative.On a chip fixing lug boss, can fix a led chip, also can fix the led chip of two different colours, the chip of three R, G, B different colours, or the chip more than three.When the chip number not simultaneously, the design corresponding modify of Butut circuit conductive layer belongs to prior art, the utility model no longer describes in detail.Pcb board also can two-sidedly be equipped with Butut circuit conductive layer, as long as the Butut conductive layer surface of a side that contacts with heat-radiating substrate and heat-radiating substrate insulation.Led chip can directly be fixed on the heat-radiating substrate, or be fixed on the integrated depressed part of heat-radiating substrate in, or it is first-class to be fixed on heat-radiating substrate by alternate manner, that is to say, cooling device of the present utility model is suitable for all LED integrated morphology, owing to be not utility model point of the present utility model, in the utility model, discuss in detail no longer one by one.
Claims (12)
1. the LED integrated morphology that has cooling device, comprise heat-radiating substrate, led chip, led chip is fixed on the heat-radiating substrate, it is characterized in that: cooling device comprises a side runner housing that is arranged on heat-radiating substrate and deviates from led chip, the coolant flow channel that drives the coolant flow device, forms, coolant flow channel and heat-radiating substrate hermetic seal or liquid sealing between runner housing and heat-radiating substrate; The back side of the led chip runner that is cooled fully covers; The side that heat-radiating substrate deviates from led chip directly contacts with coolant.
2. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: the runner housing is a runner plate, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Drive the coolant flow device and comprise two intermeshing first gears and second gears being installed in bottom portion of groove, be arranged on a side that deviates from groove and drive the drive motors that first gear and second gear rotate, the gear shaft of the gear shaft of first gear or second gear pass from the bottom of groove runner plate and with runner plate hermetic seal or liquid sealing.
3. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: the runner housing is a runner plate, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Driving the coolant flow device comprises two intermeshing first gears and second gears being installed in bottom portion of groove, is arranged on a side that deviates from groove and drives the drive motors that first gear and second gear rotate, be provided with the magnet that first gear or second gear are rotated between drive motors and first gear or second gear, magnetic is fixed between the magnet and first gear or second gear; Runner plate is a nonmagnetic substance.
4. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: drive the coolant flow device and comprise and place in the coolant flow channel and be installed in agitator arm on the runner housing, be arranged on a side that deviates from coolant flow channel and drive the drive motors that agitator arm rotates that the impeller shaft of agitator arm passes runner housing and hermetic seal of runner housing or liquid sealing.
5. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: drive the coolant flow device and comprise and place in the coolant flow channel and be installed in agitator arm on the runner housing, be arranged on a side that deviates from coolant flow channel and drive the drive motors that agitator arm rotates, be provided with the magnet that agitator arm is rotated between drive motors and agitator arm, magnetic is fixed between magnet and agitator arm; The runner housing is a nonmagnetic substance.
6. the LED integrated morphology that has cooling device as claimed in claim 1 is characterized in that: on the outer wall of runner housing, be provided with cooling fan, and the coolant of coolant for not freezing, the runner housing is a heat sink, the runner housing directly contacts with air.
7. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: the runner housing is a runner plate, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, drive the coolant flow device and be installed in the groove; The position that deviates from a side respective slot of groove at runner plate is the heat radiation raised line that protrudes runner plate, and coolant flow channel is rugged coolant flow channel; A side that deviates from heat-radiating substrate at runner plate also is provided with wind deflector, and wind deflector forms the air channel parallel with groove with runner plate; Side in the air channel is equipped with cooling fan; The coolant of coolant for not freezing, runner plate is a heating panel, the side that runner plate deviates from groove directly contacts with air.
8. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: the runner housing is a runner plate, coolant flow channel comprises being arranged on makes coolant mobile groove capable of circulation on the runner plate, the side that groove and heat-radiating substrate deviate from led chip forms described coolant flow channel; Cooling device also comprises refrigerating plant, and refrigerating plant is installed in the side that runner plate deviates from heat-radiating substrate, and the heat absorbing end of refrigerating plant can be fitted on the runner plate with heat conduction and place the desired location at the circulatory flow back side, and coolant is a liquid.
9. the LED integrated morphology that has cooling device as claimed in claim 8, it is characterized in that: refrigerating plant also comprises semiconductor cooling device or magnetic refrigeration apparatus, is arranged on the fin that runner plate deviates from a side of heat-radiating substrate; The heat absorbing end of refrigerating plant can be fitted in the back side of the groove of runner plate with heat conduction, and the radiating end of refrigerating plant can be fitted on the fin with heat conduction.
10. the LED integrated morphology that has cooling device as claimed in claim 8, it is characterized in that: refrigerating plant comprises semiconductor cooling device or magnetic refrigeration apparatus; A side that deviates from heat-radiating substrate at runner plate also is provided with heating panel, a side that deviates from runner plate at heating panel also is provided with cooling bath, a side that deviates from runner plate at heating panel also is provided with the sealing plate that seals cooling bath, the heat absorbing end of refrigerating plant can be fitted in the back side of the coolant flow channel of runner plate with heat conduction, and the radiating end of refrigerating plant can be fitted on the heating panel with heat conduction.
11. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: also be provided with the cooling medium inlet and the coolant outlet that are communicated with coolant flow channel on the runner housing, cooling medium inlet and coolant outlet are communicated with the coolant of outside.
12. the LED integrated morphology that has cooling device as claimed in claim 1, it is characterized in that: cooling device also comprises refrigerating plant, is arranged on the coolant mouth that is communicated with coolant flow channel on the runner housing, the coolant of refrigerating plant is communicated with coolant flow channel by the coolant mouth, and coolant circulates between coolant flow channel and refrigerating plant by driving the driving of coolant flow device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205160748U CN201804865U (en) | 2010-09-01 | 2010-09-01 | LED (light-emitting diode) integrated structure with cooling device |
| PCT/CN2010/079705 WO2012027936A1 (en) | 2010-09-01 | 2010-12-13 | Led integrated structure with cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205160748U CN201804865U (en) | 2010-09-01 | 2010-09-01 | LED (light-emitting diode) integrated structure with cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201804865U true CN201804865U (en) | 2011-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205160748U Expired - Fee Related CN201804865U (en) | 2010-09-01 | 2010-09-01 | LED (light-emitting diode) integrated structure with cooling device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN201804865U (en) |
| WO (1) | WO2012027936A1 (en) |
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| WO2012027937A1 (en) * | 2010-09-01 | 2012-03-08 | Yang Dongzuo | Led integrative structure with cooling device |
| WO2012034332A1 (en) * | 2010-09-15 | 2012-03-22 | Yang Dongzuo | Led integral structure with cooling equipment |
| WO2013082803A1 (en) * | 2011-12-09 | 2013-06-13 | GE Lighting Solutions, LLC | Led lamp having magnetic thermal management |
| CN103196051A (en) * | 2013-03-15 | 2013-07-10 | 曹延良 | Efficiently-radiating LED module and LED display screen |
| CN103327671A (en) * | 2012-03-19 | 2013-09-25 | 黄如金 | PCB of LED lamp |
| CN104154511A (en) * | 2014-07-08 | 2014-11-19 | 华南理工大学 | Magnetic refrigeration pump circulating heat radiation based structure for LED lamp and method thereof |
| CN108766897A (en) * | 2018-06-12 | 2018-11-06 | 厦门大学 | Realize the packaging method of the 3-D heterojunction structure of high-power GaN device layer heat dissipation |
| CN109683357A (en) * | 2019-01-10 | 2019-04-26 | 惠科股份有限公司 | Cooling device and processing production line of display device |
| CN110252224A (en) * | 2018-07-09 | 2019-09-20 | 黄位凤 | A kind of continuous flow photochemical reactor |
| WO2020258379A1 (en) * | 2019-06-26 | 2020-12-30 | 东北大学 | High-power chip closed liquid metal two-loop cooling system |
| CN112474162A (en) * | 2020-12-08 | 2021-03-12 | 东莞市腾腾电子有限公司 | Atomization structure and atomizer |
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| JP3816194B2 (en) * | 1996-11-22 | 2006-08-30 | ファナック株式会社 | Cooling device, light source device, surface light emitting device, and manufacturing method thereof |
| DE10021059B4 (en) * | 2000-04-28 | 2006-06-29 | Hiss, Eckart, Dr. | sensor |
| CN2819292Y (en) * | 2005-08-15 | 2006-09-20 | 冯子瑜 | Liquid cooling computer radiator |
| KR100734583B1 (en) * | 2006-05-18 | 2007-07-03 | 주식회사 대한트랜스 | Manufacturing method for led module |
| CN201502994U (en) * | 2009-03-13 | 2010-06-09 | 朱建钦 | Heat radiation device of high-power LED lamp |
| CN201556645U (en) * | 2009-12-14 | 2010-08-18 | 东莞勤上光电股份有限公司 | Silicon baseplate power-type LED encapsulating structure |
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- 2010-09-01 CN CN2010205160748U patent/CN201804865U/en not_active Expired - Fee Related
- 2010-12-13 WO PCT/CN2010/079705 patent/WO2012027936A1/en active Application Filing
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| WO2012027937A1 (en) * | 2010-09-01 | 2012-03-08 | Yang Dongzuo | Led integrative structure with cooling device |
| WO2012034332A1 (en) * | 2010-09-15 | 2012-03-22 | Yang Dongzuo | Led integral structure with cooling equipment |
| WO2013082803A1 (en) * | 2011-12-09 | 2013-06-13 | GE Lighting Solutions, LLC | Led lamp having magnetic thermal management |
| CN103327671A (en) * | 2012-03-19 | 2013-09-25 | 黄如金 | PCB of LED lamp |
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| CN103196051B (en) * | 2013-03-15 | 2014-11-26 | 于德海 | Efficiently-radiating LED module and LED display screen |
| CN104154511A (en) * | 2014-07-08 | 2014-11-19 | 华南理工大学 | Magnetic refrigeration pump circulating heat radiation based structure for LED lamp and method thereof |
| CN104154511B (en) * | 2014-07-08 | 2017-09-26 | 华南理工大学 | The structure and its method based on magnetic refrigeration pump circulation cooling for LED lamp |
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| CN109683357B (en) * | 2019-01-10 | 2022-01-25 | 惠科股份有限公司 | Cooling device and processing production line of display device |
| WO2020258379A1 (en) * | 2019-06-26 | 2020-12-30 | 东北大学 | High-power chip closed liquid metal two-loop cooling system |
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| WO2012027936A1 (en) | 2012-03-08 |
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Granted publication date: 20110420 Termination date: 20130901 |