WO2012026516A1 - Emballage contenant un élément et module comportant celui-ci - Google Patents

Emballage contenant un élément et module comportant celui-ci Download PDF

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Publication number
WO2012026516A1
WO2012026516A1 PCT/JP2011/069145 JP2011069145W WO2012026516A1 WO 2012026516 A1 WO2012026516 A1 WO 2012026516A1 JP 2011069145 W JP2011069145 W JP 2011069145W WO 2012026516 A1 WO2012026516 A1 WO 2012026516A1
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WO
WIPO (PCT)
Prior art keywords
metal substrate
input
brazing material
storage package
output member
Prior art date
Application number
PCT/JP2011/069145
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English (en)
Japanese (ja)
Inventor
藤原　宏信
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2012026516A1 publication Critical patent/WO2012026516A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an element storage package for storing a semiconductor element such as an optical semiconductor element typified by LD (laser diode) and PD (photodiode), and a module including the same.
  • a semiconductor element such as an optical semiconductor element typified by LD (laser diode) and PD (photodiode)
  • LD laser diode
  • PD photodiode
  • a package described in Patent Document 1 is known as an element storage package for storing semiconductor elements (hereinafter also simply referred to as a package).
  • the package described in Patent Document 1 includes an input / output member inserted between a flat substrate and a frame body disposed on the upper surface of the substrate.
  • the input / output member is bonded and fixed to the substrate via a brazing material.
  • the input / output member includes an insulating base and a plurality of wiring conductors disposed on the top surface of the base.
  • the semiconductor element is electrically connected to external wiring via these wiring conductors.
  • a brazing material reservoir is formed so as to be in contact with the side surface of the input / output member inside the input / output member when the input / output member is viewed in plan. Therefore, part of the brazing material that joins the substrate and the input / output member also adheres to the side surface of the ceramic base constituting the input / output member. When the height of the input / output member is reduced, the brazing material may adhere not only to the side surface of the ceramic substrate but also to the upper surface. Therefore, there is a possibility that a plurality of wiring conductors disposed on the upper surface of the ceramic substrate are electrically short-circuited. JP 2003-204107 A
  • An element storage package includes a metal substrate having a placement area on which a semiconductor element is placed on an upper surface, and an upper surface of the metal substrate so as to surround the placement area.
  • the said metal substrate has the recessed part formed in the part enclosed with the said frame on the upper surface at least in the part which overlaps with the peripheral part of the said input-output member up and down.
  • FIG. 2 is a plan view of the element storage package shown in FIG. 1.
  • FIG. 3 is an enlarged cross-sectional view showing the vicinity of an input / output member in the AA cross section of the element storage package shown in FIG. 2.
  • FIG. 10 is an enlarged cross-sectional view showing a first modification of the element storage package shown in FIG. 3.
  • FIG. 10 is an enlarged cross-sectional view showing a second modification of the element storage package shown in FIG. 3.
  • FIG. 10 is an enlarged cross-sectional view showing a third modification of the element storage package shown in FIG. 3.
  • FIG. 10 is an enlarged cross-sectional view showing a fifth modification of the element storage package shown in FIG. 3.
  • the element storage package according to the present invention can include arbitrary constituent members not shown in the drawings referred to in this specification.
  • the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.
  • the element storage package 1 has a metal substrate 5 having a placement region 5a on which the semiconductor element 3 is placed on the top surface, and a metal substrate 5 on the top surface.
  • the frame body 7 disposed so as to surround the placement region 5a, the input / output member 9 inserted between the metal substrate 5 and the frame body 7, and the metal substrate 5 and the input / output member 9 are positioned between, A brazing material 11 for joining the metal substrate 5 and the input / output member 9 is provided.
  • the input / output member 9 has a ceramic substrate 13 and a plurality of wiring conductors 15 disposed between the metal substrate 5 and the frame body 7 and disposed on the upper surface of the ceramic substrate 13.
  • the metal substrate 5 has the recessed part 17 formed in the area
  • the metal substrate 5 has a recess 17 formed in a region surrounded by the frame 7 on the upper surface thereof and at least overlapping with the peripheral portion of the ceramic base 13.
  • the metal substrate 5 has better wettability to the brazing material than the ceramic base 13 constituting the input / output member 9. Therefore, even if the brazing material 11 that joins the metal substrate 5 and the ceramic base 13 protrudes from these joining portions, the brazing material 11 spreads wet on the surface of the metal substrate 5. Therefore, the possibility that the brazing material 11 spreads on the surface of the ceramic substrate 13 can be reduced.
  • the concave portion 17 can be used as a brazing material reservoir, it is possible to suppress the brazing material 11 from spreading excessively on the surface of the metal substrate 5 or flowing the brazing material 11 to an unexpected position.
  • the concave portion 17 since the concave portion 17 is formed, the distance between the metal substrate 5 and the surface (lower surface) of the ceramic base 13 can be increased. Therefore, the possibility that the brazing material 11 spreading wet on the surface of the metal substrate 5 simultaneously spreads on the surface (lower surface) of the ceramic substrate 13 can be reduced.
  • the concave portion 17 is formed in a region surrounded by the frame 7 on the upper surface of the metal substrate 5 and at least overlapping with the peripheral portion of the input / output member 9 in the vertical direction.
  • the concave portion 17 is formed so as to surround the input / output member 9 when viewed in plan.
  • a concave portion 17 is formed in a portion that overlaps the entire peripheral portion of the input / output member 9 in the vertical direction.
  • the concave portion 17 is formed in a portion overlapping the entire peripheral portion of the ceramic base 13 in the vertical direction. Therefore, it is possible to reduce the possibility that the brazing material 11 that joins the metal substrate 5 and the input / output member 9 excessively travels along the lower surface of the ceramic substrate 13 and spreads on the side surface of the ceramic substrate 13. As a result, since the possibility that the brazing material 11 adheres to the upper surface of the ceramic base 13 is reduced, the possibility that the plurality of wiring conductors 15 disposed on the upper surface of the ceramic base 13 are electrically short-circuited can be reduced.
  • the metal substrate 5 in the present embodiment has a square plate shape and has a placement region 5a on which the semiconductor element 3 is placed.
  • the placement region 5a means a region that overlaps the semiconductor element 3 when the metal substrate 5 is viewed in plan.
  • the size of the square plate portion can be set to, for example, 10 mm to 100 mm on a side. Moreover, as thickness of the metal substrate 5, it can set to 0.5 mm or more and 2 mm or less, for example.
  • the placement area 5a is formed at the center of the upper surface, but the area where the semiconductor element 3 is placed is referred to as the placement area 5a. Therefore, for example, there is no problem even if the placement region 5 a is formed at the end of the upper surface of the metal substrate 5.
  • the metal substrate 5 may have a plurality of placement regions 5a, and the semiconductor element 3 may be placed on each placement region 5a.
  • the brazing material 11 joining the metal substrate 5 and the input / output member 9 it is possible to prevent the brazing material 11 joining the metal substrate 5 and the input / output member 9 from being excessively attached to the side surface of the ceramic base 13, in other words, the brazing material 11 on the upper surface of the ceramic base 13. Any shape may be used as long as the brazing material 11 can be stored to such an extent that the adhesion of the solder can be suppressed.
  • the bottom surface and two side surfaces positioned so as to sandwich the bottom surface may be used.
  • the boundary portion between the bottom surface and the side surface has a curved surface shape. This is because when the brazing material 11 accumulates in the recess 17, it is possible to suppress local concentration of stress applied to the metal substrate 5 due to expansion and contraction of the brazing material 11.
  • the corner of the opening edge of the concave portion 17 is not a bent shape but a curved shape.
  • the shape of the concave portion 17 shown in FIGS. 5 and 6 is a shape in which the two side surfaces are not parallel and the width increases toward the opening. In such a case, the influence of the stress applied to the metal substrate 5 due to expansion and contraction of the brazing material 11 when the brazing material 11 accumulates in the recess 17 can be reduced.
  • the brazing material 11 when the brazing material 11 is accumulated in the recess 17 so as to be in contact with both side surfaces, the brazing material 11 easily expands and contracts above the metal substrate 5. Therefore, stress applied in a direction parallel to the upper surface of the metal substrate 5 due to expansion and contraction of the brazing material 11 can be dispersed in a direction perpendicular to the upper surface of the metal substrate 5.
  • the depth D of the concave portion 17 can be set to 0.1 mm or more and 1.5 mm or less, for example. Further, the depth D of the concave portion 17 is preferably larger than the thickness T of the brazing material 11 located between the metal substrate 5 and the ceramic base 13. Thereby, even if a part of the brazing material 11 protrudes from between the metal substrate 5 and the input / output member 9, the brazing material 11 can be stably stored in the recess 17. Therefore, the possibility that the brazing material 11 adheres to the upper surface of the ceramic base 13 is reduced. As a result, the possibility that the plurality of wiring conductors 15 disposed on the upper surface of the ceramic substrate 13 are electrically short-circuited can be further reduced.
  • the depth D of the concave portion 17 is preferably 10 to 50% with respect to the thickness of the metal substrate 5.
  • the brazing material 11 can be stably stored in the recess 17.
  • the portion of the metal substrate 5 located below the recess 17 has a relatively small thickness.
  • the ratio is 50% or less, the portion having the relatively small thickness is also used. A sufficient thickness of the metal substrate 5 can be ensured. As a result, it can suppress that durability of the metal substrate 5 falls excessively.
  • the width W1 in the first direction of the recess 17 is larger than the width W2 of the input / output member 9 in the first direction.
  • the brazing material 11 overlaps the concave portion 17 in the vertical direction. As shown in FIG. 3, since the brazing material 11 is positioned so that at least a part of the brazing material 11 overlaps with the concave portion 17, even if the brazing material 11 protrudes from the joining portion, It can flow reliably and can be stored in the recess 17. Therefore, it is possible to further suppress the brazing material 11 joining the metal substrate 5 and the input / output member 9 from being excessively attached to the side surface of the ceramic base 13.
  • the recess 17 may be formed in a region surrounded by the frame body 7 and in a portion overlapping only the peripheral portion of the ceramic base 13, but is formed as shown in FIG. 3. It is preferable. That is, the concave portion 17 is preferably formed so as to overlap vertically with the entire ceramic base 13 in the region surrounded by the frame body 7.
  • the concave portion 17 When the concave portion 17 is formed in this way, the possibility that the brazing material 11 spreads wet on the lower surface of the input / output member 9 in the region surrounded by the frame body 7 can be reduced. Therefore, the possibility that the brazing material 11 spreads on the side surface of the input / output member 9 in the region surrounded by the frame body 7 can be reduced. As a result, the possibility that the plurality of wiring conductors 15 are electrically short-circuited can be further reduced.
  • the recess 17 may have a stepped portion 17 a between the bottom surface and the side surface of the metal substrate 5 on the side close to the placement region 5 a. Similar to the shape of the concave portion 17 shown in FIGS. 5 and 6, when the brazing material 11 is accumulated in the concave portion 17, the influence of the stress applied to the metal substrate 5 due to the expansion and contraction of the brazing material 11 is reduced. can do. Moreover, the rigidity in the mounting area 5a, which is reduced by providing the concave portion 17 on the metal substrate 5, is increased.
  • the stepped portion 17 a is located inside the input / output member 9. In other words, it is preferable that the stepped portion 17a does not overlap the input / output member 9 vertically. In such a case, the peripheral edge portion of the lower surface of the ceramic substrate 13 faces the bottom surface of the recess 17. Therefore, it can suppress that the space
  • the package 1 according to the present embodiment is mounted on which the metal substrate 5 is mounted so that the metal substrate 5 extends outside the frame body 7 when the metal substrate 5 is viewed in plan. It has the screwing part 19 screwed to a board
  • the screwing portion 19 is located on an extension in the direction in which the screwing portion 19 of the recess 17 extends. Specifically, when the direction in which the screwing portion 19 of the metal substrate 5 extends is the second direction, the recess 17 and the screwing portion 19 are each extended in the second direction, as indicated by the region X, as shown in FIG. It is preferable that the concave portion 17 and the screwing portion 19 partially overlap.
  • the portion of the metal substrate 5 that is located below the recess 17 is relatively thin and thus is easily elastically deformed. Since the portion that is easily elastically deformed in the metal substrate 5 is located at the point where the pressing force is transmitted, the pressing force can be relaxed in the concave portion 17.
  • the metal substrate 5 is composed of a plate-shaped metal member. Specifically, a metal material such as iron, copper, nickel, chromium, cobalt, or tungsten, or an alloy made of these metals can be used as the metal member. A plate-like metal member constituting the metal substrate 5 can be produced by subjecting such a metal member ingot to a metal working method such as a rolling method or a punching method.
  • the metal substrate 5 may be constituted by a single metal member or may be constituted by laminating a plurality of metal members.
  • a recess 17 is formed by partially cutting at least a portion of the upper surface of the metal substrate 5 thus manufactured, which is surrounded by the frame 7 and overlaps at least with the peripheral portion of the ceramic base 13. can do. Further, for example, when the metal substrate 5 is configured by laminating a plurality of metal members, the concave portion 17 may be formed by providing a through hole in the metal member located at the top.
  • the frame body 7 is provided on the upper surface of the metal substrate 5 so as to surround the placement area 5a when viewed in plan.
  • the frame body 7 has through holes that open to the inner peripheral surface and the outer peripheral surface.
  • a cylindrical fixing member 21 to which the optical fiber 29 is fixed is inserted and fixed in the through hole.
  • the through hole can be formed in the frame body 7 by, for example, drilling.
  • the outer periphery can be set to 10 mm or more and 100 mm or less on a side.
  • the thickness of the frame 7 can be set to 0.5 mm or more and 2 mm or less, for example.
  • a metal member such as iron, copper, nickel, chromium, cobalt or tungsten, or an alloy made of these metals can be used.
  • the frame body 7 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • a ceramic member such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body may be used.
  • the frame body 7 may be composed of one member, but may be a laminated structure of a plurality of members.
  • the frame body 7 is bonded to the metal substrate 5 via a bonding member located between the metal substrate 5 and the frame body 7.
  • An exemplary joining member includes silver wax.
  • the input / output member 9 includes a ceramic base 13 (first ceramic base 13) and a plurality of wiring conductors 15 disposed on the upper surface of the first ceramic base 13.
  • a plurality of wiring conductors 15 are disposed on the upper surface of the first ceramic base 13. Signals can be input / output between the semiconductor element 3 and external wiring (not shown) via these wiring conductors 15. As described above, since the wiring conductor 15 is disposed on the upper surface of the first ceramic base 13, the first ceramic base 13 is required to have high insulation.
  • a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body or a silicon nitride sintered body, Alternatively, a glass ceramic material can be used.
  • the size of the first ceramic base 13 can be set, for example, such that the long side of the upper surface is 5 mm or more and 50 mm or less. . Moreover, the short side of the upper surface can be set to 1 mm or more and 10 mm or less. Moreover, as thickness of the 1st ceramic base
  • the first ceramic base 13 and the second ceramic base body 23 between the wiring conductor 15 and the frame body 7 are provided to ensure insulation of the wiring conductor 15 with respect to the frame body 7. It is preferable that it is disposed.
  • the second ceramic substrate 23 for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or silicon nitride is used in the same manner as the first ceramic substrate 13.
  • a ceramic material such as a sintered material, or a glass ceramic material can be used.
  • a metal layer such as a metallized layer is formed on the lower surface of the ceramic substrate 13. This is because the wettability of the input / output terminal 9 with respect to the brazing material 11 can be improved.
  • a metal layer is not formed in a peripheral edge portion of the lower surface of the ceramic base 13 and located in a region surrounded by the frame body 7 when viewed in plan. This is to reduce the possibility that the brazing material 11 spreads on the side surface of the ceramic base 13 through the surface of the metal layer.
  • the frame body 7 has a peripheral portion on the lower surface of the ceramic base 13 when viewed in plan.
  • a configuration in which a metal layer is not formed in a portion located in the enclosed region can be achieved. In such a case, it is possible to reduce the possibility that the brazing material 11 spreads on the side surface of the ceramic substrate 13 while improving the bonding property between the metal substrate 5 and the ceramic substrate 13.
  • the width W3 of the brazing material 11 may be larger than the thickness W4 of the frame 7 as shown in FIG. preferable.
  • the width W3 of the brazing material 11 is larger than the thickness W4 of the frame body 7, the bondability between the metal substrate 5 and the input / output member 9 and the airtightness of the package 1 can be improved.
  • the brazing material 11 for joining the metal substrate 5 and the ceramic base 13 may be excessively attached to the side surface of the ceramic base 13.
  • the brazing material 11 that joins the metal substrate 5 and the input / output member 9 is excessively attached to the side surface of the ceramic substrate 13. The possibility of doing can be reduced.
  • the plurality of wiring conductors 15 are located from the inside to the outside of the region surrounded by the frame body 7. Thereby, electrical connection can be achieved between the inside and the outside of the region surrounded by the frame body 7.
  • the plurality of wiring conductors 15 are arranged at predetermined intervals so as not to be electrically short-circuited with each other.
  • the wiring conductor 15 it is preferable to use a member having good conductivity. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, or gold can be used as the wiring conductor 15. The above metal materials may be used alone or as an alloy.
  • the wiring conductor 15 is a member for electrically connecting an external wiring (not shown) and the semiconductor element 3 via the lead terminal 25 or the like. Therefore, although the wiring conductor 15 in this embodiment is arrange
  • the first ceramic base 13 made of an insulating member is provided between the wiring conductors 15 in the embedded portion. Will exist. Therefore, the insulation between the plurality of wiring conductors 15 can be improved.
  • a part of the wiring conductor 15 is embedded in the first ceramic base 13, a portion where the wiring conductor 15 is pulled out from the side surface of the first ceramic base 13 and is exposed on the side surface of the metal substrate 5.
  • the lead terminal 25 may be electrically connected.
  • the lead terminal 25 it is preferable to use a member having good conductivity like the wiring conductor 15. Specifically, a metal material such as tungsten, molybdenum, nickel, copper, silver, or gold can be used as the lead terminal 25. The above metal materials may be used alone or as an alloy.
  • the package 1 of the present embodiment has a plurality of input / output members 9, and each input / output member 9 is inserted and fixed between the metal substrate 5 and the frame body 7.
  • the package 1 of this embodiment has a plurality of ceramic bases 13, and each ceramic base 13 is inserted and fixed between the metal substrate 5 and the frame body 7.
  • the metal substrate 5 has the recessed part 17 each formed in the area
  • the brazing material 11 for joining the metal substrate 5 and the respective input / output members 9 is formed in the portion where the ceramic base 13 and the metal substrate 5 overlap each other in the vertical direction. Excessive adhesion to the side surface of each ceramic substrate 13 can be suppressed.
  • the depths of these recesses 17 are equal.
  • the variation in the depth of the concave portion 17 is large, the stress tends to concentrate on a part of the metal substrate 5.
  • the depths of the recesses 17 are equal, variations in stress applied to the portion of the metal substrate 5 located below the respective recesses 17 can be reduced. As a result, the durability of the metal substrate 5 can be improved.
  • the package 1 of the present embodiment includes a mounting substrate 27 for mounting the semiconductor element 3 disposed on the mounting region 5a.
  • the semiconductor element 3 may be mounted directly on the metal substrate 5
  • the mounting board 27 is provided as in the package 1 of the present embodiment, and the semiconductor element 3 is mounted on the mounting board 27. It is preferable to be placed. This is because the insulation of the semiconductor element 3 with respect to the metal substrate 5 can be secured.
  • an optical semiconductor element is used as the semiconductor element 3 it is possible to reduce a deviation in height between the optical semiconductor element and a fixing member 21 described later. Therefore, the optical coupling of the semiconductor element 3 to the optical fiber 29 can be facilitated.
  • the mounting substrate 27 it is preferable to use a member having good insulating properties.
  • a member having good insulating properties For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or silicon nitride is used.
  • a ceramic material such as a sintered material, or a glass ceramic material can be used.
  • the package 1 of the present embodiment includes a cylindrical fixing member 21 to which the optical fiber 29 is fixed. More specifically, as shown in FIGS. 1 to 3, the fixing member 21 is fixed to the frame body 7 so that one end is positioned inside the frame body 7 and the other end is positioned outside the frame body 7. Has been. Specifically, the fixing member 21 is inserted and fixed in a through hole provided in the frame body 7. Therefore, the fixing member 21 is separated from the metal substrate 5 by a predetermined distance.
  • the fixing member 21 fixes and positions the optical fiber 29 and has a cylindrical shape, so that light is transmitted between the optical semiconductor element and the optical fiber 29 in the cylindrical hollow portion. It can be performed.
  • the fixing member 21 is fixed to the frame body 7 by a second bonding member located between the frame body 7 and the fixing member 21.
  • the fixing member 21 has a strength that can at least fix the optical fiber 29.
  • a metal member such as iron, copper, nickel, chromium, cobalt, or tungsten, or an alloy made of these metals can be used.
  • the cylindrical fixing member 21 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.
  • the frame body 7 and the fixing member 21 are formed using the same metal member. This is because the difference in thermal expansion between the frame body 7 and the fixing member 21 can be reduced. Thereby, the stress which arises between the frame 7 and the fixing member 21 can be made small.
  • the concave portion 17 is formed in a region of the metal substrate 5 located below the through hole of the frame body 7 in which the fixing member 21 is inserted and fixed. Therefore, even when a part of the second joining member flows out between the frame body 7 and the fixing member 21, the second joining member can also be stored in the recess 17.
  • the module 31 of this embodiment is joined to the element housing package 1 typified by the above embodiment, the semiconductor element 3 placed in the placement area 5 a of the element housing package 1, and the frame body 7.
  • a lid 33 that seals the semiconductor element 3 is provided.
  • an optical semiconductor element is placed as the semiconductor element 3 in the placement area 5 a of the metal substrate 5. Further, the semiconductor element 3 is electrically connected to the wiring conductor 15 through a conductive wire. A desired output can be obtained from the semiconductor element 3 by inputting an external signal to the semiconductor element 3 via the external wiring, the wiring conductor 15 and the conducting wire.
  • optical semiconductor element examples include a light emitting element that emits light to the optical fiber 29 typified by an LD element, and a light receiving element that receives light to the optical fiber 29 typified by a PD element. It is done.
  • the semiconductor element 3 can be electrically connected to the wiring conductor 15 by, for example, so-called wire bonding via a conducting wire.
  • the semiconductor element 3 may be electrically connected to the wiring conductor 15 by so-called flip chip.
  • the wiring conductor 15 may be extended just below the semiconductor element 3, and the semiconductor element 3 may be joined to the wiring conductor 15 via a conductive adhesive such as the brazing material 11.
  • the lid body 33 is joined to the frame body 7 so as to seal the semiconductor element 3.
  • the lid body 33 is joined to the upper surface of the frame body 7.
  • the semiconductor element 3 is sealed in a space surrounded by the metal substrate 5, the frame body 7, and the lid body 33.
  • the lid 33 for example, a metal member such as iron, copper, nickel, chromium, cobalt, or tungsten, or an alloy made of these metals can be used.
  • the frame body 7 and the lid body 33 can be joined by, for example, a seam welding method. Further, the frame body 7 and the lid body 33 may be joined using, for example, gold-tin solder.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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Abstract

Conformément à l'un des ses aspects, la présente invention porte sur un emballage contenant un élément comportant : un substrat métallique, dont la surface supérieure a une région de placement dans laquelle un élément semi-conducteur est placé ; un cadre disposé sur la surface supérieure du substrat métallique de façon à entourer ladite région de placement ; un élément d'entrée (E)/sortie (O) qui est inséré entre le substrat métallique et le cadre et comprend un substrat en céramique et une pluralité de conducteurs de câblage disposés sur la surface supérieure dudit substrat en céramique ; et un matériau d'apport de brasage fort qui est situé entre le substrat métallique et l'élément d'entrée (E)/sortie (S) et assemble ledit substrat métallique et l'élément d'entrée (E)/sortie (S). Le substrat métallique a un renfoncement formé dans une zone qui est située à l'intérieur de la région entourée par le cadre sur la surface supérieure et est, au moins, superposée verticalement sur la périphérie de l'élément d'entrée (E)/sortie (S).
PCT/JP2011/069145 2010-08-27 2011-08-25 Emballage contenant un élément et module comportant celui-ci WO2012026516A1 (fr)

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JP2010190477 2010-08-27
JP2010-190477 2010-08-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014150212A (ja) * 2013-02-04 2014-08-21 Nippon Steel & Sumikin Electronics Devices Inc 電子部品収納用パッケージ
CN112119489A (zh) * 2018-08-21 2020-12-22 Ngk电子器件株式会社 布线基板、封装体及模块
CN113068333A (zh) * 2015-09-15 2021-07-02 赛峰电子与防务公司 紧凑型电子系统及包括这种系统的设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168220A (ja) * 1999-12-10 2001-06-22 Kyocera Corp 半導体素子収納用パッケージ
JP2002134763A (ja) * 2000-10-27 2002-05-10 Kyocera Corp 半導体受光素子収納用容器
JP2003046015A (ja) * 2001-07-27 2003-02-14 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2004095596A (ja) * 2002-08-29 2004-03-25 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168220A (ja) * 1999-12-10 2001-06-22 Kyocera Corp 半導体素子収納用パッケージ
JP2002134763A (ja) * 2000-10-27 2002-05-10 Kyocera Corp 半導体受光素子収納用容器
JP2003046015A (ja) * 2001-07-27 2003-02-14 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
JP2004095596A (ja) * 2002-08-29 2004-03-25 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014150212A (ja) * 2013-02-04 2014-08-21 Nippon Steel & Sumikin Electronics Devices Inc 電子部品収納用パッケージ
CN113068333A (zh) * 2015-09-15 2021-07-02 赛峰电子与防务公司 紧凑型电子系统及包括这种系统的设备
CN113068333B (zh) * 2015-09-15 2022-08-05 赛峰电子与防务公司 紧凑型电子系统及包括这种系统的设备
CN112119489A (zh) * 2018-08-21 2020-12-22 Ngk电子器件株式会社 布线基板、封装体及模块
CN112119489B (zh) * 2018-08-21 2024-03-12 Ngk电子器件株式会社 布线基板、封装体及模块

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