WO2012026058A1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
WO2012026058A1
WO2012026058A1 PCT/JP2011/003544 JP2011003544W WO2012026058A1 WO 2012026058 A1 WO2012026058 A1 WO 2012026058A1 JP 2011003544 W JP2011003544 W JP 2011003544W WO 2012026058 A1 WO2012026058 A1 WO 2012026058A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting device
control circuit
support member
semiconductor light
Prior art date
Application number
PCT/JP2011/003544
Other languages
French (fr)
Japanese (ja)
Inventor
明浩 松本
鈴木　哲也
智之 中川
直樹 曽根
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Publication of WO2012026058A1 publication Critical patent/WO2012026058A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Definitions

  • the present invention relates to a light emitting device, and more particularly to a light emitting device including both a light source and a control circuit unit that controls lighting of the light source.
  • the present invention has been made to solve the above-described problems, and the purpose thereof is to have both a light emitting element and a lighting control unit that controls lighting thereof, and appropriately recover these heats,
  • the object is to provide a light emitting device that can be mounted on various lamps.
  • a light-emitting device includes a control unit that controls lighting of a light source, and a support member that supports the light source and the control unit.
  • the support member supports the light source such that the light emitting unit of the light source protrudes in the main optical axis direction of the light emitting unit relative to the control unit.
  • the degree of freedom of arrangement of optical members such as reflectors can be increased around the light source. For this reason, it becomes possible to use a light-emitting device for various lamps.
  • the support member may include a first support part that supports the control unit and a second support part that protrudes from the first support part and supports the light source.
  • the first support part and the second support part may be integrally formed of the same member.
  • the support member may include a first support part that supports the control unit and a second support part that protrudes from the first support part and supports the light source.
  • the first support part and the second support part may be formed separately and fixed to each other via a filler having a thermal conductivity of 3 W / mK or more.
  • each of the first support portion and the second support portion can be formed in a simple shape, for example, the first support portion is formed in a flat plate shape. For this reason, the processing of the support member can be facilitated, or the die for die casting or casting can be reduced.
  • the filler having a high thermal conductivity in this way, it is possible to suppress a decrease in efficiency of heat recovery caused by making the first support part and the second support part separate.
  • the “filler” may be an adhesive for fixing the first support member and the second support member to each other, or may be a bonding material such as soldering or brazing material.
  • the control unit may be filled with resin at least partially. Thereby, the influence on the conduction
  • the support member may be provided with a printed circuit
  • the control unit may be configured by a mounting component mounted on the support member.
  • the support member and the control unit can be configured as a control circuit board. For this reason, the light emitting device can be reduced in size or cost compared to the case where a substrate for supporting the control circuit substrate and the light source is provided separately.
  • a light-emitting device that has both a light-emitting element and a lighting control unit that controls the lighting of the light-emitting element and can appropriately recover the heat and can be mounted on various lamps.
  • FIG. 1 It is a perspective view which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment.
  • (A) is a top view of the light emitting module which concerns on 1st Embodiment
  • (b) is a front view of the light emitting module which concerns on 1st Embodiment. It is a figure which shows the structure of the light emitting module which concerns on 2nd Embodiment. It is a figure which shows the structure of the light-emitting device which concerns on 3rd Embodiment.
  • FIG. 1 It is a perspective view which shows the structure of the light-emitting device concerning 4th Embodiment.
  • A is a figure which shows an example which mounted the light-emitting device in the lamp.
  • B is a figure which shows another example which mounted the light-emitting device in the lamp.
  • It is a perspective view which shows the structure of the light-emitting device concerning 5th Embodiment.
  • It is a figure which shows an example which mounted the light-emitting device in the lamp.
  • A) is a top view which shows the structure of the light-emitting device concerning 7th Embodiment
  • (b) is SS sectional drawing of (a).
  • It is a perspective view which shows the structure of the light-emitting device concerning 8th Embodiment.
  • FIG. 1 is a perspective view showing a configuration of a light emitting device 10 according to the first embodiment.
  • the light emitting device 10 includes a light emitting module 12, a heat dissipation board unit 13, a housing 16, a control circuit unit 30, and a connector 32.
  • the light emitting module 12 functions as a light source, and includes a plurality of semiconductor light emitting elements 20 and a mounting substrate 22.
  • the plurality of semiconductor light emitting elements 20 are arranged in a line on the upper surface of the mounting substrate 22.
  • the connector 32 is integrally formed with the housing 16 with resin. The connector 32 may be fixed to the housing 16 by adhesion or mechanical fastening.
  • FIG. 2 is a cross-sectional view showing a configuration of the light emitting device 10 according to the first embodiment. 2 shows a cross section of the light emitting device 10 along a vertical plane Q that includes the central point P of the light emitting surfaces 20a of the plurality of semiconductor light emitting elements 20 and is perpendicular to the direction in which the plurality of semiconductor light emitting elements 20 are arranged. The state seen from A is shown.
  • the heat dissipation board unit 13 includes a support member 14 (second support member) and a heat dissipation board 15 (first support member).
  • the heat dissipation substrate 15 is formed in a plate shape.
  • the support member 14 is formed in a block shape, and is fixed to the upper surface 15 a of the heat dissipation substrate 15.
  • the light emitting module 12 is fixed to the upper surface of the support member 14. Therefore, the heat dissipation board unit 13 functions as a support member that supports the semiconductor light emitting element 20.
  • the control circuit unit 30 functions as a control unit that controls lighting of the semiconductor light emitting element 20 that is a light source.
  • the control circuit unit 30 has a single substrate and is attached to the upper surface 15 a of the heat dissipation substrate 15. Therefore, the heat dissipation substrate 15 functions as a support unit that supports the control circuit unit 30. Thus, by configuring the control circuit unit 30 on a single substrate, the height of the control circuit unit 30 can be suppressed.
  • the control circuit unit 30 may have a plurality of substrates.
  • the support member 14 and the heat dissipation substrate 15 are formed separately, and are fixed to each other via an adhesive having a thermal conductivity of 3 W / mK or more.
  • This adhesive functions as a filler filled between the support member 14 and the heat dissipation substrate 15.
  • the support member 14 and the heat dissipation substrate 15 may be coupled by mechanical fastening such as screws, press-fitting, or caulking.
  • a filler such as silicon grease having a thermal conductivity of 3 W / mK or more may be filled between the support member 14 and the heat dissipation substrate 15.
  • the support member 14 and the heat dissipation substrate 15 may be bonded by a metal bonding material such as solder.
  • the metal bonding material functions as a filler filled between the support member 14 and the heat dissipation substrate 15.
  • the heat dissipation substrate 18 supports the plurality of semiconductor light emitting elements 20 and the control circuit unit 30 so as to recover the heat generated by each.
  • heat generated from both the semiconductor light emitting element 20 and the control circuit unit 30 can be efficiently recovered while suppressing the size of the light emitting device 10. Furthermore, since the semiconductor light emitting element 20 and the control circuit unit 30 are formed as one unit, the assembling property to the lamp can be improved as compared with the case where they are configured separately.
  • the control circuit unit 30 is configured to be higher than the light emitting surface 20 a of the semiconductor light emitting element 20, the lower surface of the reflector is disposed between the control circuit unit 30 and the semiconductor light emitting element 20. It is also possible to configure. However, in a small lamp, for example, when the height of the control circuit unit 30 is high, there is a possibility that an optical member such as a reflector cannot be appropriately disposed.
  • the light emitting surface 20 a that is the light emitting unit of the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting surface 20 a than the control circuit unit 30.
  • the light emitting module 12 is supported to do so.
  • the support member 14 is a light emitting module so that the height H1 of the light emitting surface 20a of the semiconductor light emitting element 20 is higher than the height H2 of the control circuit unit 30 with respect to the upper surface 15a of the heat dissipation substrate 15. 12 is lifted up and supported.
  • the “main optical axis” refers to a direction in which the intensity of light from the light emitting surface 20a of the semiconductor light emitting element 20 is highest, and the vertical direction of the light emitting surface 20a when the light emitting surface 20a is planar. It becomes upper.
  • the heat dissipation board unit 13 may support the light emitting module 12 so that the upper surface 22a of the mounting substrate 22 that supports the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting surface 20a from the control circuit unit 30. Thereby, even when the side surface of the semiconductor light emitting element 20 also functions as a light emitting portion, the degree of freedom with respect to the arrangement of members around the semiconductor light emitting element 20 can be increased.
  • the support member 14 and the heat dissipation substrate 15 may be integrally formed of the same member.
  • the support member 14 is integrally formed by, for example, die casting using the same heat radiating material as aluminum as the heat radiating substrate 15. Thereby, the man-hour for fixing the supporting member 14 and the thermal radiation board
  • substrate 15 can be reduced.
  • FIG. 3 is a cross-sectional view showing a configuration of the light emitting device 10 according to the first embodiment.
  • FIG. 3 shows a state in which a cross section of the light emitting device 10 including a point P and a vertical plane R parallel to the arrangement direction of the plurality of semiconductor light emitting elements 20 is viewed from the viewpoint B of FIG.
  • the light emitting module 12 includes a semiconductor light emitting element 20, a mounting substrate 22, and a plating layer 24.
  • An LED is employed for each of the semiconductor light emitting elements 20.
  • the LED may be a blue LED, an ultraviolet LED, or an LED that emits light of another color.
  • Each of the semiconductor light emitting elements 20 is formed in a 1 mm square shape.
  • Each of the semiconductor light emitting elements 20 may be formed in a square of another size such as 0.3 mm square, or may be formed in a rectangle other than the square.
  • a semiconductor light emitting element of another element that emits surface light in a substantially point shape such as a laser diode may be employed instead of the LED.
  • the mounting substrate 22 is formed of a single member of alumina, AlN, or Si.
  • the mounting substrate 22 is formed in a plate shape.
  • the plating layer 24 that is a conductive layer is provided on the surface of the mounting substrate 22 so as to be electrically connected to the semiconductor light emitting device 20 when the semiconductor light emitting device 20 is mounted on the mounting substrate 22.
  • a conductive layer may be formed by evaporating a conductive material on the surface of the upper surface 22a.
  • a plate-like member formed of a conductive material may be bent and fixed to the surface of the mounting substrate 22.
  • a plurality of semiconductor light emitting elements 20 are mounted on the upper surface 22a of the mounting substrate 22 so as to be arranged in a straight line. At this time, each of the plurality of semiconductor light emitting elements 20 is mounted on the mounting substrate 22 such that the main optical axis direction, that is, the direction perpendicular to the light emitting surface 20a is the upward direction.
  • the plurality of semiconductor light emitting elements 20 are mounted on a single mounting substrate 22, but the number of mounting is not limited to four, and one or a plurality other than four may be used. Good. Further, the plurality of semiconductor light emitting elements 20 may be mounted on the mounting substrate 22 so as to be distributed in a plane.
  • Each of the semiconductor light emitting elements 20 is a so-called flip chip type. Each of the semiconductor light emitting elements 20 is connected to the plating layer 24 via Au bumps (not shown) and mounted on the mounting substrate 22. Each of the semiconductor light emitting elements 20 is not limited to the flip chip type, and for example, a vertical chip type or a face-up type may be employed. In this case, the semiconductor light emitting element 20 is connected to the plating layer 24 of the mounting substrate 22 from above the element by a conductive member such as a conductive wire.
  • the semiconductor light emitting element 20 is directly mounted on the mounting substrate 22 without using a so-called submount substrate. Thereby, the process of adhering the submount substrate and the mounting substrate can be reduced.
  • the support member 14 supports the mounting substrate 22.
  • the semiconductor light emitting element 20 is attached to a mounting substrate also formed of AlN or the like via a submount substrate formed of AlN or the like, for example.
  • the heat dissipation can be improved.
  • the support member 14 is provided to have a larger area than the mounting substrate 22. Accordingly, it is possible to suppress a decrease in heat dissipation while reducing the generally expensive mounting substrate 22.
  • the support member 14 is fixed to the upper surface 14a with a lower surface 22d which is a back surface of the upper surface 22a of the mounting substrate 22 in contact with the upper surface 14a, thereby supporting the mounting substrate 22.
  • the support member 14 is formed of a material having relatively high heat dissipation among metals such as copper. Therefore, the support member 14 functions as a heat dissipation member.
  • the support member 14 is made of copper (Cu).
  • the support member 14 may be made of a copper alloy.
  • the mounting substrate 22 is bonded to the support member 14 with an adhesive made of a material having a thermal conductivity of 3 W / m ⁇ K or more. Thereby, long-term reliability can be improved while ensuring heat dissipation performance.
  • a filler such as silicon grease having a thermal conductivity of 3 W / mK or more may be filled between the support member 14 and the mounting substrate 22.
  • the support member 14 may be formed of a composite material made of Cu and a metal having a lower coefficient of thermal expansion than Cu, that is, a linear expansion coefficient.
  • the support member 14 is formed of a clad material in which Cu and Mo are laminated.
  • this clad material is referred to as “CMC (Cu / Mo / Cu)”.
  • CMC is formed by diffusion bonding a Cu plate and a Mo plate by hot pressing.
  • Mo has a lower linear expansion coefficient than Cu.
  • substrate 22 can be suppressed, and generation
  • the mounting substrate 22 is bonded to the support member 14 with solder, which is a metal bonding material having a melting point of 450 ° C. or lower. Since such a bonding material has a small difference in thermal expansion coefficient between the mounting substrate 22 and the support member 14, it is possible to suppress the occurrence of cracks due to thermal stress while ensuring high heat dissipation.
  • the mounting substrate 22 may be bonded to the support member 14 with an adhesive made of a material having a thermal conductivity of 3 W / m ⁇ K or more.
  • the material of the support member 14 is not limited to CMC.
  • a Cu—Mo powder composite material in which Cu is impregnated into a powder formed of Mo may be employed.
  • a special clad material in which the Cu—Mo powder composite material is sandwiched between Cu plates may be employed. This special clad material is formed by sandwiching a Cu—Mo powder composite material between Cu plates and hot rolling.
  • a clad material in which an Invar metal having a lower linear expansion coefficient than Cu is sandwiched between Cu plates may be employed.
  • Invar metal is an alloy composed of Ni and Fe.
  • FIG. 4A is a top view of the light emitting module 12 according to the first embodiment
  • FIG. 4B is a front view of the light emitting module 12 according to the first embodiment.
  • the plated layer 24 is shown hatched.
  • the mounting substrate 22 has a step surface 22b.
  • the step surface 22b is provided below the upper surface 22a and in parallel with the upper surface 22a.
  • the plating layer 24 includes a power feeding part 24a and an element connection part 24b.
  • the power feeding unit 24 a and the element connection unit 24 b are arranged on the surface of the mounting substrate 22 so as to be separated from each other.
  • the power feeding unit 24a passes through the side surface 22c from the upper surface 22a so that power can be fed to the semiconductor light emitting device 20 on the step surface 22b below the upper surface 22a on which the semiconductor light emitting device 20 is mounted on the surface of the mounting substrate 22. It extends to the step surface 22b.
  • the Au wire 28 can be bonded to the power feeding portion 24a below the upper surface 22a.
  • Two power supply portions 24a are provided, and are arranged to be electrically connected to the two semiconductor light emitting elements 20 arranged at the ends of the plurality of semiconductor light emitting elements 20 arranged in parallel.
  • the element connection portion 24b is provided on the upper surface 22a so as to be connected in series by connecting the plurality of semiconductor light emitting elements 20 mounted on the upper surface 22a.
  • three element connection portions 24 b are provided, which is the number of intervals between the four semiconductor light emitting elements 20. In this way, it is possible to supply power to all of the plurality of semiconductor light emitting elements 20 by supplying current between the two power supply units 24a.
  • a method for forming a power supply route to the semiconductor light emitting element 20 there is a method in which an electrode conducting to the semiconductor light emitting element 20 is provided on the upper surface 22a, and a conductive member such as copper is provided on the step surface 22b separately from the electrode on the upper surface 22a. Conceivable. However, in this method, it is necessary to connect the electrode on the upper surface 22a of the mounting substrate 22 and the conductive member on the step surface 22b with a linear conductive member such as an Au wire or a strip-shaped conductive member such as an aluminum ribbon. Therefore, not only is a process for attaching the conductive member necessary, but it is not easy to attach the conductive member so as not to protrude above the light emitting surface 20a.
  • the power feeding unit 24a and the element connecting unit 24b are simultaneously fixed on the surface of the mounting substrate 22 by plating. Therefore, in addition to the step of providing the plating layer 24, a step of bonding an Au wire for connecting the plating layer 24 and another conductive member can be reduced, and the manufacturing process of the light emitting module 12 can be simplified. can do.
  • the power feeding unit 24a may be provided so as to extend on the other surface below the upper surface 22a of the surface of the mounting substrate 22.
  • a conductive member such as an Au wire can be provided. Without being attached, power can be supplied to the semiconductor light emitting element 20 below the upper surface 22a. For this reason, while being able to simplify the manufacturing process of the light emitting module 12, it can avoid that a conductive member influences the light distribution formed by the light which the semiconductor light emitting element 20 emits.
  • an inclined surface that is inclined downward from the upper surface 22a may be provided instead of the step surface 22b.
  • the power feeding unit 24a may be provided so as to extend from the upper surface 22a to the inclined surface.
  • it replaces with the level
  • the Au wire 28 can be bonded to the power feeding portion 24a below the upper surface 22a.
  • the housing 16 is made of resin.
  • the material of the housing 16 is not limited to resin, but may be formed of other insulating materials.
  • the housing 16 has an opening 16b, and the side surface 14b of the support member 14 is fitted into the opening 16b, and both are fixed to each other.
  • the housing 16 has a step surface 16a provided parallel to the upper surface and below the upper surface.
  • the step surface 16 a of the housing 16 has substantially the same height as the step surface 22 b of the mounting substrate 22.
  • the step surface 16a and the step surface 22b may have different heights.
  • a thin plate-like conductive member 26 is provided on the step surface 16a.
  • the conductive member 26 is formed of copper, but may be formed of other conductive materials.
  • the conductive member 26 is disposed apart from the plating layer 24.
  • the Au wire 28 as a conductive member is connected to both the plated layer 24 and the conductive member 26 so as to make the plated layer 24 and the conductive member 26 conductive. In this way, it is possible to supply power for light emission from the conductive member 26 to the plurality of semiconductor light emitting elements 20 via the Au wire 28 and the plating layer 24.
  • FIG. 5 is a diagram illustrating a configuration of a light emitting module 80 according to the second embodiment.
  • FIG. 5 shows a cross section taken along the vertical plane R in FIG. 1 as in FIG. 3, but the illustration of the heat dissipation substrate 15 is omitted.
  • the same parts as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.
  • the light emitting module 80 includes a light emitting module 12, a support member 82 (second support member), and a housing 84.
  • the support member 82 is formed such that the lower surface 82b facing away from the upper surface 82a that contacts the mounting substrate 22 has a larger area than the upper surface 82a.
  • the support member 82 is provided with an enlarged portion 82d that protrudes outward from the side surface 82c in the vicinity of the upper surface 82a in the vicinity of the lower surface 82b.
  • the area of the lower surface 82b is larger than the area of the upper surface 82a.
  • the housing 84 is provided with a recess 84b for accommodating the enlarged portion 82d.
  • the housing 84 is formed in the same manner as the housing 16 described above. Therefore, the housing 84 has a step surface 84a provided parallel to the upper surface and below the upper surface, and the conductive member 26 is provided on the step surface 84a.
  • FIG. 6 is a diagram illustrating a configuration of a light emitting device 100 according to the third embodiment. 6 shows a cross section taken along the vertical plane R in FIG. 1 as in FIG. 3, but the illustration of the heat dissipation substrate 15 is omitted.
  • the same parts as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.
  • the light emitting device 100 is configured in the same manner as the light emitting module 80 according to the second embodiment, except that a sealing member 102 is provided in a groove formed by the light emitting module 12, the support member 82, and the housing 84.
  • the sealing member 102 is obtained by filling a groove with a resin material and solidifying it, and seals the entire Au wire 28 in the groove from the outside air. As a result, the Au wire 28 can be protected from an external impact to increase the connection reliability of the Au wire 28 and the influence of the Au wire 28 on the light distribution can be suppressed.
  • the sealing member 102 may seal a part of the Au wire 28 such as a bonding portion from the outside air.
  • the sealing member 102 is filled in the groove so as to be positioned below the upper surface of the plating layer 24 on which the semiconductor light emitting element 20 is mounted.
  • the sealing member 102 may be filled in the groove so as to be positioned below the light emitting surface 20 a of the semiconductor light emitting element 20.
  • the sealing member 102 may be filled in the groove so as to be positioned below the upper surface 22 a of the mounting substrate 22.
  • a cover may be provided.
  • the cover may be disposed above the Au wire 28 so that the Au wire 28 is positioned below the light emitting surface 20a. Further, the cover may be disposed above the Au wire 28 so that the Au wire 28 is positioned below the upper surface 22 a of the mounting substrate 22. At this time, the cover may be formed between the light emitting module 12 and the housing 84 so as to be formed between the light emitting module 12 and the housing 84 and seal the groove portion in which the Au wire 28 is accommodated from the outside air. Therefore, this cover also functions as a sealing means. By providing the cover in this way, the connection reliability of the Au wire 28 can be improved and the influence of the Au wire 28 on the light distribution can be suppressed.
  • FIG. 7 is a perspective view showing a configuration of a light emitting device 120 according to the fourth embodiment.
  • the light emitting device 120 includes a light emitting module 12, a heat dissipation board unit 13, a housing 122, a control circuit unit 30, a connector 124, and a cord 126.
  • the housing 122 and the connector 124 are separated.
  • the housing 122 is the same as the housing 16 according to the first embodiment.
  • the connector 124 is connected to the control circuit unit 30 via two flexible cords 126.
  • the control circuit unit 30 can be reduced in height by being configured with a single substrate. However, since the connector 124 needs to comply with the standard, it may be difficult to suppress the height. In this way, by connecting the control circuit unit 30 and the connector 124 with the cord 126 having further flexibility, with the connector 124 as a separate body, the degree of freedom in the arrangement of the connector 124 can be increased. Since the housing 122 can be reduced in size by making the connector 124 a separate body, the light emitting device 120 can be mounted on various lamps by changing the arrangement of the connector 124 according to the configuration of the lamp. Become.
  • a terminal 126 a is provided at the tip of the cord 126 on the side attached to the control circuit unit 30.
  • the terminal is further provided with a fixing guide 126b.
  • a portion of the housing 122 to which the cord 126 is attached is provided with an electrode (not shown) and a guide receiving portion 122a into which the guide of the cord 126 is inserted.
  • the terminal 126a and the electrode come into contact with each other.
  • the fixing of the cord 126 to the housing 122 and the conduction between the cord 126 and the control circuit unit 30 are performed simultaneously.
  • the terminal 126a of the cord 126 and the electrode of the housing 122 are joined to each other by soldering, laser welding, resistance welding, or the like.
  • FIG. 8A is a diagram showing an example in which the light emitting device 120 is mounted on the lamp 128.
  • the lamp 128 is configured by attaching the light emitting device 120 to a heat sink 130.
  • a reflector 132 that reflects the light from the semiconductor light emitting element 20 to the front of the lamp is disposed above the light emitting device 120.
  • FIG. 8B is a diagram showing another example in which the light emitting device 120 is mounted on the lamp 134.
  • the lamp 134 is configured by attaching the light emitting device 120 to a heat sink 136.
  • a reflector 138 is disposed that reflects light from the semiconductor light emitting element 20 to the front of the lamp.
  • the connector 124 can be disposed on the side surface of the heat sink 136. Therefore, in the heat sink 136, the area for attaching the main body including the housing 122 is reduced. Can be small. In this way, the control circuit unit 30 and the connector 124 are separately connected to each other by the cord 126, so that the light emitting device 120 can be used for lamps having various configurations.
  • FIG. 9 is a perspective view illustrating a configuration of a light emitting device 150 according to the fifth embodiment.
  • the light emitting device 150 includes a light emitting module 12, a heat dissipation board unit 13, a housing 152, a control circuit unit 30, a connector 154, and a flexible printed circuit board (hereinafter referred to as “FPC (Flexible printed circuits)”) 156.
  • FPC Flexible printed circuits
  • the housing 152 and the connector 154 are separated.
  • the housing 152 is the same as the housing 16 according to the first embodiment.
  • the connector 154 is connected to the control circuit unit 30 via a flexible FPC 156.
  • the degree of freedom of arrangement of the connector 154 can be increased. Since the housing 152 can be reduced in size by making the connector 154 separate, the light emitting device 150 can be mounted on various lamps by changing the arrangement of the connector 154 according to the configuration of the lamp. Become.
  • the terminal (not shown) and the attachment hole 156a are provided in the front-end
  • a portion of the housing 152 to which the FPC 156 is attached is provided with a boss 152 a protruding upward and an electrode (not shown) connected to the control circuit unit 30.
  • the terminal of the FPC 156 comes into contact with the electrode provided on the housing 152. In this way, fixing of the FPC 156 to the housing 122 and conduction between the FPC 156 and the control circuit unit 30 are performed simultaneously.
  • the terminal of the FPC 156 and the electrode of the housing 152 are joined to each other by soldering, laser welding, resistance welding, or the like.
  • FIG. 10 is a diagram illustrating an example in which the light emitting device 150 is mounted on the lamp 160.
  • the lamp 160 includes two light emitting devices 150 attached to the same surface of the heat sink 162.
  • Each of the light emitting devices 150 is provided with a reflector 164 that reflects light emitted from the semiconductor light emitting element 20 to the front of the lamp.
  • the connector 154 can be disposed in the space where the heat sink 162 is free.
  • common components can be used for the housing 152 and the connector 154 only by providing a plurality of FPCs having different shapes such as the FPC 156A and the FPC 156B shown in FIG. For this reason, compared with the case where a plurality of types of housings having different connector arrangements are used, the cost can be reduced by sharing the parts.
  • FIG. 11 is a perspective view showing a configuration of a light emitting device 180 according to the sixth embodiment.
  • the light emitting device 180 includes the light emitting module 12, the heat dissipation board unit 13, the control circuit unit 30, the housing 182, and the connector 184.
  • the connector 184 is provided with a convex portion 184a that functions as a guide portion.
  • the housing 182 is provided with a receiving portion 182a formed such that a peripheral wall portion is partially cut away so as to receive the convex portion 184a.
  • An electrode (not shown) is provided on the convex portion 184 a of the connector 184, and an electrode (not shown) of the control circuit portion 30 is provided in the vicinity of the receiving portion 182 a of the housing 182.
  • the electrode of the connector 184 and the electrode of the control circuit part 30 come into contact with each other.
  • the electrode of the connector 184 and the electrode of the control circuit unit 30 are joined to each other by soldering, laser welding, resistance welding, or the like. In this way, by providing the connector 184 with the convex portion 184a and further providing the housing 182 with the receiving portion 182a, the connector 184 can be easily attached to the housing 182, and the connector 184 and the control circuit unit 30 are appropriately connected. Can be made.
  • FIG. 12A is a top view showing the configuration of the light emitting device 200 according to the seventh embodiment
  • FIG. 12B is an SS cross-sectional view of FIG. 12A.
  • the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.
  • the light emitting device 200 includes a light emitting module 12, a heat dissipation board 202, a housing 204, a connector 206, an FPC 208, and a control circuit unit 210.
  • the housing 204 is formed so that the accommodation area for accommodating the control circuit unit 210 is rectangular when viewed from above.
  • the housing 204 is not provided with a bus bar, and is molded only from resin.
  • the heat dissipation board 202 is configured in the same manner as the heat dissipation board 15 described above except that a flat plate-like portion is formed in a rectangular shape in accordance with the shape of the housing 204.
  • the FPC 208 is formed in a C shape, and electrodes are provided at two tip portions. These two electrodes are connected to the semiconductor light emitting element 20 via the electrodes of the light emitting module 12.
  • the FPC 208 is formed in a rectangular shape along the outer periphery of the housing area of the housing 204.
  • a portion extending so as to protrude from the housing 204 is provided on the opposite side of the two tip portions of the FPC 208, and the connector 206 is connected to the extending portion.
  • the connector 206 is disposed away from the housing 204 so that the connector 206 can be disposed with a certain degree of freedom by bending the FPC 208.
  • the connector 206 and the FPC 208 are joined to each other by soldering, laser welding, resistance welding, or the like. Note that the FPC 208 may be connected by inserting and fitting the FPC 208 into the connector 206 with the tip of the FPC 208 as a terminal.
  • the FPC 208 is placed and connected to a control circuit unit 210 constituted by a single printed board. Note that a plurality of printed circuit boards may be provided in the control circuit unit 210.
  • the connector 206 is connected to the semiconductor light emitting element 20 of the light emitting module 12 via the FPC 208 and the control circuit unit 210 so that power can be supplied.
  • the FPC 208 and the control circuit unit 210 are both housed in the housing area of the housing 204.
  • the integrally formed metal wiring board is deformed by press forming, and the housing is molded so as to be embedded in the resin.
  • the housing provided with the bus bar as described above is generally difficult to suppress in size because it is necessary to cover the periphery of the bus bar with resin in order to ensure insulation.
  • the FPC 208 as in the seventh embodiment, the size of the housing 204 can be suppressed as compared with the case where a bus bar is provided. For this reason, the size of the entire light emitting device 200 can be easily suppressed.
  • FIG. 13 is a perspective view showing a configuration of a light emitting device 220 according to the eighth embodiment.
  • the light emitting device 220 includes the light emitting module 12, the control circuit unit 30, a case 222, and a connector 224.
  • the case 222 is integrally formed of a heat dissipating material such as aluminum.
  • the connector 224 is fixed to the case 222 by adhesion or the like.
  • the case 222 is provided with an accommodation area that accommodates both the control circuit section 30 and the light emitting module 12, and both a support section that supports the control circuit section 30 and a support section that supports the light emitting module 12 in the accommodation area. Is provided. Therefore, the case 222 has the functions of both the heat dissipation board unit 13 and the housing 16 according to the first embodiment. By integrally molding the case 222 in this manner, the number of steps for attaching the housing 16 to the heat dissipation board unit 13 can be reduced as in the first embodiment, and the cost can be reduced by reducing the number of components.
  • the electrode of the light emitting module 12 and the control circuit unit 30 are connected by the Au wire 226.
  • the Au wire 2226 instead of the Au wire 226, another conductive member such as an Al wire or an Al ribbon may be used.
  • the region for accommodating the control circuit unit 30 and the region provided with the Au wire 226 are filled with the sealing member 228.
  • the sealing member 228 is formed by filling the housing region of the case 222 with a resin material and solidifying it, and seals the entire control circuit unit 30 and the Au wire 226 from the outside air.
  • the sealing member 228 may seal part of the control circuit unit 30 or the Au wire 226 from the outside air.
  • the enclosing region of the case 222 may be filled with the sealing member 228 so as to be positioned below the light emitting surface 20a of the semiconductor light emitting element 20.
  • the sealing member 228 may be filled in the groove so as to be positioned below the upper surface of the support member 14 on which the semiconductor light emitting element 20 is mounted.
  • a cover may be provided.
  • the cover may be disposed above the Au wire 226 so that the Au wire 226 is located below the light emitting surface 20a and the upper surface of the cover is located below the light emitting surface 20a. Therefore, this cover also functions as a sealing means for sealing the control circuit unit 30 and the Au wire 226 from the outside.
  • the part used as a frame may be deleted like the above-mentioned thermal radiation board
  • a conductive member such as an Au wire 226, a resin is molded by the transfer molding method so that the resin is positioned below the light emitting surface 20a. Both the portion 30 and the Au wire 226 may be sealed from the outside. Thereby, since the frame portion of the case 222 can be deleted, the light emitting device 220 can be further reduced in size and weight.
  • the support member 14 is fixed on a printed circuit board on which a printed circuit is provided in the control circuit unit, and the semiconductor light emitting element 20 is mounted on the upper surface of the support member 14. Therefore, this printed circuit board functions as a support member that supports the semiconductor light emitting element 20 as a light source.
  • the control unit is configured by mounting components mounted on the printed circuit board.
  • the printed wiring board supports the semiconductor light emitting element 20 so that the light emitting part of the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting part rather than the mounted component.
  • the printed circuit board functions as a heat dissipation board formed of a heat dissipation material.
  • the plurality of semiconductor light emitting elements 20 are connected in parallel so that they can be individually fed.
  • the control circuit unit is provided to control lighting of each of the plurality of semiconductor light emitting elements 20.
  • the present invention can be used for a light-emitting device, and in particular, can be used for a light-emitting device including both a light source and a control circuit unit that controls lighting of the light source.

Abstract

In a light-emitting device (10), a control circuit (30) controls the lighting-up of a semiconductor light-emitting element (20). A heat-dissipating substrate unit (13) supports the semiconductor light-emitting element (20) and the control circuit (30) so as to recover the heat produced by each. The heat-dissipating substrate unit (13) supports the semiconductor light-emitting element (20) such that a light-emitting part of said semiconductor light-emitting element (20) protrudes farther, in the direction of the main optical axis of said light-emitting part, than the control circuit (30). The heat-dissipating substrate unit (13) comprises: a heat-dissipating substrate (15) that supports the control circuit (30); and a support member (14) that protrudes from the heat-dissipating substrate (15) and supports the semiconductor light-emitting element (20). Said heat-dissipating substrate (15) and support member (14) are formed separately and affixed to each other by an adhesive that has a thermal conductivity of at least 3 W/m∙K.

Description

発光装置Light emitting device
　本発明は、発光装置に関し、特に光源および光源の点灯を制御する制御回路部の双方を備えた発光装置に関する。 The present invention relates to a light emitting device, and more particularly to a light emitting device including both a light source and a control circuit unit that controls lighting of the light source.
　近年、省エネルギーや高信頼性などへの要求から、ＬＥＤ（Light Emitting Diode）などの半導体発光素子の用途が例えば車両用前照灯などに急激に拡大している。ここで、ＬＥＤが実装されるサブマウント部材とリードパターンとがボンディングワイヤなどの導電性部材を介して接続されている発光装置が提案されている（例えば、特許文献１参照）。 Recently, due to demands for energy saving and high reliability, applications of semiconductor light emitting elements such as LEDs (Light Emitting Diodes) are rapidly expanding to, for example, vehicle headlamps. Here, a light-emitting device in which a submount member on which an LED is mounted and a lead pattern are connected via a conductive member such as a bonding wire has been proposed (for example, see Patent Document 1).
特開２００７－８７６６８号公報JP 2007-87668 A
　発光素子の点灯制御や灯具などへの組付性向上の観点から、発光素子とその点灯を制御する制御回路部との双方を搭載した小型の発光装置の開発が求められるようになってきている。しかしながら、発光装置および制御回路部はともに熱を発するため、熱の回収は重要な課題となる。また、このような発光装置は様々な灯具に共通して用いられる可能性もあることから、様々な灯具への汎用性も求められる。 From the viewpoint of improving the lighting control of the light emitting element and the ease of assembling to a lamp, development of a small light emitting device equipped with both the light emitting element and a control circuit unit for controlling the lighting has been demanded. . However, since both the light emitting device and the control circuit unit generate heat, recovery of heat becomes an important issue. Moreover, since such a light-emitting device may be commonly used for various lamps, versatility for various lamps is also required.
　そこで、本発明は上述した課題を解決するためになされたものであり、その目的は、発光素子およびその点灯を制御する点灯制御部の双方を有し且つこれらの熱を適切に回収するとともに、様々な灯具に搭載可能な発光装置を提供することにある。 Therefore, the present invention has been made to solve the above-described problems, and the purpose thereof is to have both a light emitting element and a lighting control unit that controls lighting thereof, and appropriately recover these heats, The object is to provide a light emitting device that can be mounted on various lamps.
　上記課題を解決するために、本発明のある態様の発光装置は、光源の点灯を制御する制御ユニットと、光源および制御ユニットを支持する支持部材と、を備える。支持部材は、光源の発光部が制御ユニットよりも発光部の主光軸方向に突出するよう光源を支持する。 In order to solve the above-described problems, a light-emitting device according to an aspect of the present invention includes a control unit that controls lighting of a light source, and a support member that supports the light source and the control unit. The support member supports the light source such that the light emitting unit of the light source protrudes in the main optical axis direction of the light emitting unit relative to the control unit.
　この態様によれば、光源の周辺において、例えばリフレクタなどの光学部材の配置の自由度を高めることができる。このため、発光装置を様々な灯具に用いることが可能となる。 According to this aspect, the degree of freedom of arrangement of optical members such as reflectors can be increased around the light source. For this reason, it becomes possible to use a light-emitting device for various lamps.
　支持部材は、制御ユニットを支持する第１支持部と、第１支持部から突出して光源を支持する第２支持部と、を有してもよい。第１支持部と第２支持部とは同一部材により一体的に形成されていてもよい。 The support member may include a first support part that supports the control unit and a second support part that protrudes from the first support part and supports the light source. The first support part and the second support part may be integrally formed of the same member.
　この態様によれば、第１支持部と第２支持部とを固着させるために要する工数を削減することができる。このため、支持部材の製造工数を抑制することができる。 According to this aspect, it is possible to reduce the man-hours required for fixing the first support part and the second support part. For this reason, the manufacturing man-hour of a support member can be suppressed.
　支持部材は、制御ユニットを支持する第１支持部と、第１支持部から突出して光源を支持する第２支持部と、を有してもよい。第１支持部と第２支持部とは別体に形成され、３Ｗ／ｍＫ以上の熱伝導率を有する充填材を介して互いに固定されてもよい。 The support member may include a first support part that supports the control unit and a second support part that protrudes from the first support part and supports the light source. The first support part and the second support part may be formed separately and fixed to each other via a filler having a thermal conductivity of 3 W / mK or more.
　この態様によれば、例えば第１支持部を平板状に形成するなど、第１支持部および第２支持部の各々を簡素な形状とすることができる。このため、支持部材の加工を容易化することができ、またはダイキャストや鋳造のための型を削減することができる。また、このように熱伝導率の高い充填材を介することにより、第１支持部と第２支持部とを別体とすることによる熱回収の効率低下を抑制することができる。なお、「充填材」は、第１支持部材と第２支持部材とを互いに固着させる接着剤でもよく、また、ハンダ付けやろう付け材料などの接合材料であってもよい。 According to this aspect, each of the first support portion and the second support portion can be formed in a simple shape, for example, the first support portion is formed in a flat plate shape. For this reason, the processing of the support member can be facilitated, or the die for die casting or casting can be reduced. In addition, by using the filler having a high thermal conductivity in this way, it is possible to suppress a decrease in efficiency of heat recovery caused by making the first support part and the second support part separate. The “filler” may be an adhesive for fixing the first support member and the second support member to each other, or may be a bonding material such as soldering or brazing material.
　制御ユニットは、少なくとも一部の周囲に樹脂が充填されてもよい。これにより、例えば外力などによる制御ユニット内の導通への影響を抑制することができる。このため、信頼性の高い発光装置を提供することができる。 The control unit may be filled with resin at least partially. Thereby, the influence on the conduction | electrical_connection in a control unit by external force etc. can be suppressed, for example. For this reason, a highly reliable light-emitting device can be provided.
　支持部材には、プリント回路が設けられ、制御ユニットは、支持部材上に実装される実装部品によって構成されてもよい。この態様によれば、支持部材と制御ユニットとを、制御回路基板として構成することができる。このため、制御回路基板と光源とを支持する基板を別途設ける場合に比べ、発光装置を小型化または低コスト化することができる。 The support member may be provided with a printed circuit, and the control unit may be configured by a mounting component mounted on the support member. According to this aspect, the support member and the control unit can be configured as a control circuit board. For this reason, the light emitting device can be reduced in size or cost compared to the case where a substrate for supporting the control circuit substrate and the light source is provided separately.
　本発明によれば、発光素子およびその点灯を制御する点灯制御部の双方を有し且つこれらの熱を適切に回収するとともに、様々な灯具に搭載可能な発光装置を提供することができる。 According to the present invention, it is possible to provide a light-emitting device that has both a light-emitting element and a lighting control unit that controls the lighting of the light-emitting element and can appropriately recover the heat and can be mounted on various lamps.
第１の実施形態に係る発光装置の構成を示す斜視図である。It is a perspective view which shows the structure of the light-emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の構成を示す断面図である。It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment. 第１の実施形態に係る発光装置の構成を示す断面図である。It is sectional drawing which shows the structure of the light-emitting device which concerns on 1st Embodiment. （ａ）は、第１の実施形態に係る発光モジュールの上面図であり、（ｂ）は、第１の実施形態に係る発光モジュールの正面図である。(A) is a top view of the light emitting module which concerns on 1st Embodiment, (b) is a front view of the light emitting module which concerns on 1st Embodiment. 第２の実施形態に係る発光モジュールの構成を示す図である。It is a figure which shows the structure of the light emitting module which concerns on 2nd Embodiment. 第３の実施形態に係る発光装置の構成を示す図である。It is a figure which shows the structure of the light-emitting device which concerns on 3rd Embodiment. 第４の実施形態にかかる発光装置の構成を示す斜視図である。It is a perspective view which shows the structure of the light-emitting device concerning 4th Embodiment. （ａ）は、発光装置を灯具へ搭載した一例を示す図である。（ｂ）は、発光装置を灯具へ搭載した別の一例を示す図である。(A) is a figure which shows an example which mounted the light-emitting device in the lamp. (B) is a figure which shows another example which mounted the light-emitting device in the lamp. 第５の実施形態にかかる発光装置の構成を示す斜視図である。It is a perspective view which shows the structure of the light-emitting device concerning 5th Embodiment. 発光装置を灯具へ搭載した一例を示す図である。It is a figure which shows an example which mounted the light-emitting device in the lamp. 第６の実施形態にかかる発光装置の構成を示す斜視図である。It is a perspective view which shows the structure of the light-emitting device concerning 6th Embodiment. （ａ）は、第７の実施形態にかかる発光装置の構成を示す上面図であり、（ｂ）は、（ａ）のＳ－Ｓ断面図である。(A) is a top view which shows the structure of the light-emitting device concerning 7th Embodiment, (b) is SS sectional drawing of (a). 第８の実施形態にかかる発光装置の構成を示す斜視図である。It is a perspective view which shows the structure of the light-emitting device concerning 8th Embodiment.
　以下、図面を参照して本発明の実施の形態（以下、実施形態という）について詳細に説明する。 Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
（第１の実施形態）
　図１は、第１の実施形態に係る発光装置１０の構成を示す斜視図である。発光装置１０は、発光モジュール１２、放熱基板ユニット１３、ハウジング１６、制御回路部３０、およびコネクタ３２を有する。発光モジュール１２は光源として機能するものであり、複数の半導体発光素子２０と、実装基板２２とを有する。複数の半導体発光素子２０は、実装基板２２の上面に一列に並ぶよう配置されている。コネクタ３２は、樹脂によりハウジング１６に一体成形されている。なお、コネクタ３２は、接着や機械的締結によってハウジング１６に固着されてもよい。 (First embodiment)
FIG. 1 is a perspective view showing a configuration of a light emitting device 10 according to the first embodiment. The light emitting device 10 includes a light emitting module 12, a heat dissipation board unit 13, a housing 16, a control circuit unit 30, and a connector 32. The light emitting module 12 functions as a light source, and includes a plurality of semiconductor light emitting elements 20 and a mounting substrate 22. The plurality of semiconductor light emitting elements 20 are arranged in a line on the upper surface of the mounting substrate 22. The connector 32 is integrally formed with the housing 16 with resin. The connector 32 may be fixed to the housing 16 by adhesion or mechanical fastening.
　図２は、第１の実施形態に係る発光装置１０の構成を示す断面図である。図２は、複数の半導体発光素子２０の発光面２０ａの中央の点Ｐを含み、且つ複数の半導体発光素子２０の並び方向と垂直な鉛直面Ｑによる発光装置１０の断面を、図１の視点Ａから見た状態を示している。 FIG. 2 is a cross-sectional view showing a configuration of the light emitting device 10 according to the first embodiment. 2 shows a cross section of the light emitting device 10 along a vertical plane Q that includes the central point P of the light emitting surfaces 20a of the plurality of semiconductor light emitting elements 20 and is perpendicular to the direction in which the plurality of semiconductor light emitting elements 20 are arranged. The state seen from A is shown.
　放熱基板ユニット１３は、支持部材１４（第２支持部材）および放熱基板１５（第１支持部材）を有する。放熱基板１５は、板状に形成されている。支持部材１４はブロック状に形成されており、放熱基板１５の上面１５ａに固定されている。発光モジュール１２は、この支持部材１４の上面に固定されている。したがって放熱基板ユニット１３は、半導体発光素子２０を支持する支持部材として機能する。 The heat dissipation board unit 13 includes a support member 14 (second support member) and a heat dissipation board 15 (first support member). The heat dissipation substrate 15 is formed in a plate shape. The support member 14 is formed in a block shape, and is fixed to the upper surface 15 a of the heat dissipation substrate 15. The light emitting module 12 is fixed to the upper surface of the support member 14. Therefore, the heat dissipation board unit 13 functions as a support member that supports the semiconductor light emitting element 20.
　制御回路部３０は、光源である半導体発光素子２０の点灯を制御する制御ユニットとして機能する。制御回路部３０は、一枚の基板を有し、放熱基板１５の上面１５ａに取り付けられている。したがって放熱基板１５は、制御回路部３０を支持する支持部として機能する。このように制御回路部３０を一枚の基板に構成することで、制御回路部３０の高さを抑制することができる。なお、制御回路部３０が複数枚の基板を有していてもよい。 The control circuit unit 30 functions as a control unit that controls lighting of the semiconductor light emitting element 20 that is a light source. The control circuit unit 30 has a single substrate and is attached to the upper surface 15 a of the heat dissipation substrate 15. Therefore, the heat dissipation substrate 15 functions as a support unit that supports the control circuit unit 30. Thus, by configuring the control circuit unit 30 on a single substrate, the height of the control circuit unit 30 can be suppressed. Note that the control circuit unit 30 may have a plurality of substrates.
　支持部材１４と放熱基板１５とは別体に形成され、３Ｗ／ｍＫ以上の熱伝導率を有する接着剤を介して互いに固定される。この接着剤は、支持部材１４と放熱基板１５の間に充填される充填材して機能する。なお、支持部材１４と放熱基板１５とはネジや圧入、かしめなどの機械的締結によって結合されてもよい。このとき支持部材１４と放熱基板１５との間に、３Ｗ／ｍＫ以上の熱伝導率を有するシリコングリスなどの充填材が充填されてもよい。また、ハンダなどの金属接合材によって支持部材１４と放熱基板１５とが接合されてもよい。この場合も、金属接合材は支持部材１４と放熱基板１５の間に充填される充填材して機能する。こうして放熱基板１８は、各々が発する熱を回収するよう複数の半導体発光素子２０および制御回路部３０を支持する。 The support member 14 and the heat dissipation substrate 15 are formed separately, and are fixed to each other via an adhesive having a thermal conductivity of 3 W / mK or more. This adhesive functions as a filler filled between the support member 14 and the heat dissipation substrate 15. The support member 14 and the heat dissipation substrate 15 may be coupled by mechanical fastening such as screws, press-fitting, or caulking. At this time, a filler such as silicon grease having a thermal conductivity of 3 W / mK or more may be filled between the support member 14 and the heat dissipation substrate 15. Further, the support member 14 and the heat dissipation substrate 15 may be bonded by a metal bonding material such as solder. Also in this case, the metal bonding material functions as a filler filled between the support member 14 and the heat dissipation substrate 15. Thus, the heat dissipation substrate 18 supports the plurality of semiconductor light emitting elements 20 and the control circuit unit 30 so as to recover the heat generated by each.
　これにより、発光装置１０のサイズを抑制しつつ半導体発光素子２０および制御回路部３０の双方から発せられる熱を効率的に回収することができる。さらに、半導体発光素子２０と制御回路部３０とが一つのユニット化されているため、これらが別々に構成されている場合に比べ、灯具への組付性を向上させることができる。 Thus, heat generated from both the semiconductor light emitting element 20 and the control circuit unit 30 can be efficiently recovered while suppressing the size of the light emitting device 10. Furthermore, since the semiconductor light emitting element 20 and the control circuit unit 30 are formed as one unit, the assembling property to the lamp can be improved as compared with the case where they are configured separately.
　例えば制御回路部３０が半導体発光素子２０の発光面２０ａよりも高さが高く構成されている場合であっても、制御回路部３０と半導体発光素子２０の間にリフレクタの下面を配置して灯具を構成することも可能である。しかしながら、例えば小型の灯具では、制御回路部３０の高さが高いとリフレクタなどの光学部材を適切に配置できなくなる可能性がある。 For example, even when the control circuit unit 30 is configured to be higher than the light emitting surface 20 a of the semiconductor light emitting element 20, the lower surface of the reflector is disposed between the control circuit unit 30 and the semiconductor light emitting element 20. It is also possible to configure. However, in a small lamp, for example, when the height of the control circuit unit 30 is high, there is a possibility that an optical member such as a reflector cannot be appropriately disposed.
　このため、第１の実施形態に係る発光装置１０では、放熱基板ユニット１３は、半導体発光素子２０の発光部である発光面２０ａが制御回路部３０よりも発光面２０ａの主光軸方向に突出するよう発光モジュール１２を支持する。具体的には、放熱基板１５の上面１５ａを基準として、制御回路部３０の高さＨ２よりも半導体発光素子２０の発光面２０ａの高さＨ１の方が高くなるよう、支持部材１４は発光モジュール１２を上方に持ち上げて支持する。これにより、半導体発光素子２０周辺における部材の配置に対する自由度を高めることができ、様々な灯具にも発光装置１０を搭載することが可能となる。なお、第１の実施形態において「主光軸」とは、半導体発光素子２０の発光面２０ａからの光の強度が最も高い方向をいい、発光面２０ａが平面状の場合は発光面２０ａの鉛直上方となる。なお、放熱基板ユニット１３は、半導体発光素子２０を支持する実装基板２２の上面２２ａが制御回路部３０よりも発光面２０ａの主光軸方向に突出するよう発光モジュール１２を支持してもよい。これにより、半導体発光素子２０の側面も発光部として機能する場合においても、半導体発光素子２０周辺における部材の配置に対する自由度を高めることができる。 For this reason, in the light emitting device 10 according to the first embodiment, in the heat dissipation board unit 13, the light emitting surface 20 a that is the light emitting unit of the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting surface 20 a than the control circuit unit 30. The light emitting module 12 is supported to do so. Specifically, the support member 14 is a light emitting module so that the height H1 of the light emitting surface 20a of the semiconductor light emitting element 20 is higher than the height H2 of the control circuit unit 30 with respect to the upper surface 15a of the heat dissipation substrate 15. 12 is lifted up and supported. Thereby, the freedom degree with respect to arrangement | positioning of the member in the semiconductor light-emitting device 20 periphery can be raised, and it becomes possible to mount the light-emitting device 10 also in various lamps. In the first embodiment, the “main optical axis” refers to a direction in which the intensity of light from the light emitting surface 20a of the semiconductor light emitting element 20 is highest, and the vertical direction of the light emitting surface 20a when the light emitting surface 20a is planar. It becomes upper. The heat dissipation board unit 13 may support the light emitting module 12 so that the upper surface 22a of the mounting substrate 22 that supports the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting surface 20a from the control circuit unit 30. Thereby, even when the side surface of the semiconductor light emitting element 20 also functions as a light emitting portion, the degree of freedom with respect to the arrangement of members around the semiconductor light emitting element 20 can be increased.
　なお、支持部材１４と放熱基板１５とは、同一部材により一体的に形成されていてもよい。この場合、支持部材１４は、放熱基板１５と同じアルミニウムなどの放熱性材料を用いて、例えばダイキャストなどによって一体的に形成される。これにより、支持部材１４と放熱基板１５とを固着させるための工数を削減することができる。 Note that the support member 14 and the heat dissipation substrate 15 may be integrally formed of the same member. In this case, the support member 14 is integrally formed by, for example, die casting using the same heat radiating material as aluminum as the heat radiating substrate 15. Thereby, the man-hour for fixing the supporting member 14 and the thermal radiation board | substrate 15 can be reduced.
　図３は、第１の実施形態に係る発光装置１０の構成を示す断面図である。図３は、点Ｐを含み、且つ複数の半導体発光素子２０の並び方向と平行な鉛直面Ｒによる発光装置１０の断面を、図１の視点Ｂから見た状態を示している。 FIG. 3 is a cross-sectional view showing a configuration of the light emitting device 10 according to the first embodiment. FIG. 3 shows a state in which a cross section of the light emitting device 10 including a point P and a vertical plane R parallel to the arrangement direction of the plurality of semiconductor light emitting elements 20 is viewed from the viewpoint B of FIG.
　発光モジュール１２は、半導体発光素子２０、実装基板２２、およびメッキ層２４を有する。半導体発光素子２０の各々には、ＬＥＤが採用される。ＬＥＤは、青色ＬＥＤでもよく、紫外線ＬＥＤでもよく、また他の色の光を発光するＬＥＤであってもよい。半導体発光素子２０の各々は、１ｍｍ角の正方形状に形成される。なお、半導体発光素子２０の各々は、例えば０．３ｍｍ角など他のサイズの正方形に形成されてもよく、正方形以外の矩形に形成されてもよい。また、半導体発光素子２０として、ＬＥＤに代えて例えばレーザダイオードなど略点状に面発光する他の素子状の半導体発光素子が採用されてもよい。 The light emitting module 12 includes a semiconductor light emitting element 20, a mounting substrate 22, and a plating layer 24. An LED is employed for each of the semiconductor light emitting elements 20. The LED may be a blue LED, an ultraviolet LED, or an LED that emits light of another color. Each of the semiconductor light emitting elements 20 is formed in a 1 mm square shape. Each of the semiconductor light emitting elements 20 may be formed in a square of another size such as 0.3 mm square, or may be formed in a rectangle other than the square. Further, as the semiconductor light emitting element 20, a semiconductor light emitting element of another element that emits surface light in a substantially point shape such as a laser diode may be employed instead of the LED.
　実装基板２２は、アルミナ、ＡｌＮ、またはＳｉの単一部材によって形成される。実装基板２２は板状に形成される。導電層であるメッキ層２４は、実装基板２２に半導体発光素子２０が実装されたとき半導体発光素子２０に導通するよう実装基板２２の表面上に設けられている。なお、メッキ層２４に代えて、導電性材料を上面２２ａの表面に蒸着させて導電層を形成してもよい。また、メッキ層２４に代えて、導電性材料によって形成された板状部材を折り曲げて実装基板２２の表面に固着させてもよい。 The mounting substrate 22 is formed of a single member of alumina, AlN, or Si. The mounting substrate 22 is formed in a plate shape. The plating layer 24 that is a conductive layer is provided on the surface of the mounting substrate 22 so as to be electrically connected to the semiconductor light emitting device 20 when the semiconductor light emitting device 20 is mounted on the mounting substrate 22. Instead of the plating layer 24, a conductive layer may be formed by evaporating a conductive material on the surface of the upper surface 22a. Further, instead of the plating layer 24, a plate-like member formed of a conductive material may be bent and fixed to the surface of the mounting substrate 22.
　実装基板２２の上面２２ａには、複数の半導体発光素子２０が直線状に並ぶよう実装される。このとき複数の半導体発光素子２０の各々は、主光軸方向、すなわち発光面２０ａに垂直な方向が上方向となるよう実装基板２２に実装される。第１の実施形態では、単一の実装基板２２に４つの半導体発光素子２０が実装されるが、実装数が４に限られないことは勿論であり、１または４以外の複数であってもよい。また、複数の半導体発光素子２０は、平面的に分散して配置されるよう実装基板２２に実装されてもよい。 A plurality of semiconductor light emitting elements 20 are mounted on the upper surface 22a of the mounting substrate 22 so as to be arranged in a straight line. At this time, each of the plurality of semiconductor light emitting elements 20 is mounted on the mounting substrate 22 such that the main optical axis direction, that is, the direction perpendicular to the light emitting surface 20a is the upward direction. In the first embodiment, four semiconductor light emitting elements 20 are mounted on a single mounting substrate 22, but the number of mounting is not limited to four, and one or a plurality other than four may be used. Good. Further, the plurality of semiconductor light emitting elements 20 may be mounted on the mounting substrate 22 so as to be distributed in a plane.
　半導体発光素子２０の各々は、いわゆるフリップチップタイプのものが採用されている。半導体発光素子２０の各々は、Ａｕバンプ（図示せず）を介してメッキ層２４に接続され、実装基板２２に実装される。なお、半導体発光素子２０の各々はフリップチップタイプに限られず、例えば垂直チップタイプ、またはフェイスアップタイプのものが採用されてもよい。この場合、半導体発光素子２０は、素子上部から実装基板２２のメッキ層２４に導電性ワイヤなどの導電性部材によって接続される。 Each of the semiconductor light emitting elements 20 is a so-called flip chip type. Each of the semiconductor light emitting elements 20 is connected to the plating layer 24 via Au bumps (not shown) and mounted on the mounting substrate 22. Each of the semiconductor light emitting elements 20 is not limited to the flip chip type, and for example, a vertical chip type or a face-up type may be employed. In this case, the semiconductor light emitting element 20 is connected to the plating layer 24 of the mounting substrate 22 from above the element by a conductive member such as a conductive wire.
　このように、第１の実施形態では、いわゆるサブマウント基板を介することなく、半導体発光素子２０が実装基板２２に直接実装される。これにより、サブマウント基板と実装基板とを固着させる工程を削減することができる。 Thus, in the first embodiment, the semiconductor light emitting element 20 is directly mounted on the mounting substrate 22 without using a so-called submount substrate. Thereby, the process of adhering the submount substrate and the mounting substrate can be reduced.
　支持部材１４は、実装基板２２を支持する。このように実装基板２２を支持部材１４に取り付けることによって、例えば半導体発光素子２０をＡｌＮなどによって形成されたサブマウント基板を介して、同じくＡｌＮなどによって形成された実装基板に取り付ける場合などに比べ、放熱性を向上させることができる。なお、支持部材１４は、実装基板２２よりも面積が大きくなるよう設けられている。これにより、一般的に高価な実装基板２２を小さくしつつ、放熱性の低下を抑制することができる。 The support member 14 supports the mounting substrate 22. By attaching the mounting substrate 22 to the support member 14 in this manner, for example, the semiconductor light emitting element 20 is attached to a mounting substrate also formed of AlN or the like via a submount substrate formed of AlN or the like, for example. The heat dissipation can be improved. The support member 14 is provided to have a larger area than the mounting substrate 22. Accordingly, it is possible to suppress a decrease in heat dissipation while reducing the generally expensive mounting substrate 22.
　支持部材１４は、上面１４ａに、実装基板２２の上面２２ａの背向面である下面２２ｄが当接して固定されており、これにより実装基板２２を支持している。支持部材１４は、銅などの金属の中でも放熱性が比較的高い材料によって形成される。したがって、支持部材１４は放熱部材として機能する。 The support member 14 is fixed to the upper surface 14a with a lower surface 22d which is a back surface of the upper surface 22a of the mounting substrate 22 in contact with the upper surface 14a, thereby supporting the mounting substrate 22. The support member 14 is formed of a material having relatively high heat dissipation among metals such as copper. Therefore, the support member 14 functions as a heat dissipation member.
　第１の実施形態では、支持部材１４は、銅（Ｃｕ）によって形成される。なお、支持部材１４が銅合金によって形成されてもよい。実装基板２２は、熱伝導率が３Ｗ／ｍ・Ｋ以上の材料からなる接着剤によって支持部材１４に接合される。これにより、放熱性能を確保しながら長期における信頼性を向上させることができる。なお、支持部材１４と実装基板２２との間に、３Ｗ／ｍＫ以上の熱伝導率を有するシリコングリスなどの充填材が充填されてもよい。 In the first embodiment, the support member 14 is made of copper (Cu). The support member 14 may be made of a copper alloy. The mounting substrate 22 is bonded to the support member 14 with an adhesive made of a material having a thermal conductivity of 3 W / m · K or more. Thereby, long-term reliability can be improved while ensuring heat dissipation performance. In addition, a filler such as silicon grease having a thermal conductivity of 3 W / mK or more may be filled between the support member 14 and the mounting substrate 22.
　支持部材１４は、Ｃｕより熱膨張率、すなわち線膨張係数の低い金属およびＣｕからなる複合材料により形成されてもよい。具体的には、支持部材１４は、ＣｕとＭｏとを積層させたクラッド材により形成されている。以下、このクラッド材を「ＣＭＣ（Ｃｕ／Ｍｏ／Ｃｕ）」という。ＣＭＣは、Ｃｕ板とＭｏ板とをホットプレスにより拡散接合させることにより形成される。Ｍｏは、Ｃｕよりも低い線膨張係数を有する。このようなクラッド材を支持部材１４の材料として採用することによって、Ｃｕと同等のレベルの熱伝導率を達成しつつ、熱膨張率、すなわち線膨張係数をＣｕより小さくすることが可能となる。このため、実装基板２２との線膨張係数の差を抑制することができ、支持部材１４および実装基板２２の両者の間に生じる熱応力に起因する支持部材１４または実装基板２２へのクラックの発生を抑制することができる。 The support member 14 may be formed of a composite material made of Cu and a metal having a lower coefficient of thermal expansion than Cu, that is, a linear expansion coefficient. Specifically, the support member 14 is formed of a clad material in which Cu and Mo are laminated. Hereinafter, this clad material is referred to as “CMC (Cu / Mo / Cu)”. CMC is formed by diffusion bonding a Cu plate and a Mo plate by hot pressing. Mo has a lower linear expansion coefficient than Cu. By adopting such a clad material as the material of the support member 14, it is possible to make the thermal expansion coefficient, that is, the linear expansion coefficient smaller than that of Cu while achieving a thermal conductivity equivalent to that of Cu. For this reason, the difference of the linear expansion coefficient with the mounting board | substrate 22 can be suppressed, and generation | occurrence | production of the crack to the supporting member 14 or the mounting board | substrate 22 resulting from the thermal stress produced between both the supporting member 14 and the mounting board | substrate 22 is possible. Can be suppressed.
　このような複合材料によって支持部材１４が形成される場合、実装基板２２は、融点が４５０℃以下の金属接合材料であるはんだによって支持部材１４に接合される。このような接合材料は実装基板２２と支持部材１４との間の熱膨張係数の差が小さいため、高い放熱性を確保しつつ熱応力に起因するクラックの発生を抑制することができる。なおこの場合も、実装基板２２は熱伝導率が３Ｗ／ｍ・Ｋ以上の材料からなる接着剤によって支持部材１４に接合されてもよい。 When the support member 14 is formed of such a composite material, the mounting substrate 22 is bonded to the support member 14 with solder, which is a metal bonding material having a melting point of 450 ° C. or lower. Since such a bonding material has a small difference in thermal expansion coefficient between the mounting substrate 22 and the support member 14, it is possible to suppress the occurrence of cracks due to thermal stress while ensuring high heat dissipation. In this case, the mounting substrate 22 may be bonded to the support member 14 with an adhesive made of a material having a thermal conductivity of 3 W / m · K or more.
　支持部材１４の材質はＣＭＣに限られず、例えばＭｏを粉末形成したものにＣｕを含浸させたＣｕ－Ｍｏ粉末複合材料が採用されてもよい。また、このＣｕ－Ｍｏ粉末複合材料をＣｕ板で挟んだ特殊クラッド材が採用されてもよい。この特殊クラッド材は、Ｃｕ－Ｍｏ粉末複合材料をＣｕ板で挟み、熱間圧延させることにより形成される。また、Ｃｕよりも線膨張係数が低いインバー（Invar）金属をＣｕ板で挟んだクラッド材が採用されてもよい。なおインバー金属は、ＮｉとＦｅからなる合金である。 The material of the support member 14 is not limited to CMC. For example, a Cu—Mo powder composite material in which Cu is impregnated into a powder formed of Mo may be employed. Further, a special clad material in which the Cu—Mo powder composite material is sandwiched between Cu plates may be employed. This special clad material is formed by sandwiching a Cu—Mo powder composite material between Cu plates and hot rolling. Further, a clad material in which an Invar metal having a lower linear expansion coefficient than Cu is sandwiched between Cu plates may be employed. Invar metal is an alloy composed of Ni and Fe.
　図４（ａ）は、第１の実施形態に係る発光モジュール１２の上面図であり、図４（ｂ）は、第１の実施形態に係る発光モジュール１２の正面図である。理解し易いよう、メッキ層２４にはハッチングを施して図示している。 FIG. 4A is a top view of the light emitting module 12 according to the first embodiment, and FIG. 4B is a front view of the light emitting module 12 according to the first embodiment. For ease of understanding, the plated layer 24 is shown hatched.
　実装基板２２は、段差面２２ｂを有する。段差面２２ｂは、上面２２ａより下方且つ上面２２ａと平行となるよう設けられる。メッキ層２４は、給電部２４ａおよび素子接続部２４ｂを有する。給電部２４ａおよび素子接続部２４ｂは、実装基板２２の表面上に互いに離間して配置される。給電部２４ａは、実装基板２２の表面のうち半導体発光素子２０が実装される上面２２ａよりも下方の段差面２２ｂにおいて半導体発光素子２０への給電を可能とするよう、上面２２ａから側面２２ｃを経て段差面２２ｂに延在する。これによって、上面２２ａより下方において給電部２４ａにＡｕワイヤ２８をボンディングすることが可能となる。給電部２４ａは２つ設けられ、一列に並設される複数の半導体発光素子２０の端に配置される２つの半導体発光素子２０にそれぞれが導通するよう配置されている。 The mounting substrate 22 has a step surface 22b. The step surface 22b is provided below the upper surface 22a and in parallel with the upper surface 22a. The plating layer 24 includes a power feeding part 24a and an element connection part 24b. The power feeding unit 24 a and the element connection unit 24 b are arranged on the surface of the mounting substrate 22 so as to be separated from each other. The power feeding unit 24a passes through the side surface 22c from the upper surface 22a so that power can be fed to the semiconductor light emitting device 20 on the step surface 22b below the upper surface 22a on which the semiconductor light emitting device 20 is mounted on the surface of the mounting substrate 22. It extends to the step surface 22b. As a result, the Au wire 28 can be bonded to the power feeding portion 24a below the upper surface 22a. Two power supply portions 24a are provided, and are arranged to be electrically connected to the two semiconductor light emitting elements 20 arranged at the ends of the plurality of semiconductor light emitting elements 20 arranged in parallel.
　素子接続部２４ｂは、上面２２ａに実装された複数の半導体発光素子２０の間を接続することで互いに直列に接続させるよう上面２２ａ上に設けられている。第１の実施形態では半導体発光素子２０は４つ設けられることから、素子接続部２４ｂは４つの半導体発光素子２０の間隔部の数である３つ設けられる。こうして、２つの給電部２４ａの間で電流を供給することにより、複数の半導体発光素子２０のすべてに電力を供給することができる。 The element connection portion 24b is provided on the upper surface 22a so as to be connected in series by connecting the plurality of semiconductor light emitting elements 20 mounted on the upper surface 22a. In the first embodiment, since four semiconductor light emitting elements 20 are provided, three element connection portions 24 b are provided, which is the number of intervals between the four semiconductor light emitting elements 20. In this way, it is possible to supply power to all of the plurality of semiconductor light emitting elements 20 by supplying current between the two power supply units 24a.
　半導体発光素子２０への給電ルートの形成方法として、上面２２ａ上に半導体発光素子２０に導通する電極を設け、段差面２２ｂに銅などの導電性部材を上面２２ａ上の電極とは別に設ける方法も考えられる。しかしながら、この方法では、実装基板２２の上面２２ａの電極と段差面２２ｂ上の導電性部材とをＡｕワイヤなどの線状の導電部材またはアルミリボンなどの帯状の導電部材で接続する必要が生じる。したがって、導電部材を取り付ける工程が別途必要となるばかりでなく、発光面２０ａより上方に突出させないよう導電部材を取り付けることは容易ではない。 As a method for forming a power supply route to the semiconductor light emitting element 20, there is a method in which an electrode conducting to the semiconductor light emitting element 20 is provided on the upper surface 22a, and a conductive member such as copper is provided on the step surface 22b separately from the electrode on the upper surface 22a. Conceivable. However, in this method, it is necessary to connect the electrode on the upper surface 22a of the mounting substrate 22 and the conductive member on the step surface 22b with a linear conductive member such as an Au wire or a strip-shaped conductive member such as an aluminum ribbon. Therefore, not only is a process for attaching the conductive member necessary, but it is not easy to attach the conductive member so as not to protrude above the light emitting surface 20a.
　このため第１の実施形態では、給電部２４ａと素子接続部２４ｂとは、メッキ処理によって実装基板２２の表面上に同時に固着される。これにより、メッキ層２４を設ける工程とは別にメッキ層２４と他の導電部材とを接続するためのＡｕワイヤをボンディングするなどの工程を削減することができ、発光モジュール１２の製造工程を簡易にすることができる。 Therefore, in the first embodiment, the power feeding unit 24a and the element connecting unit 24b are simultaneously fixed on the surface of the mounting substrate 22 by plating. Thereby, in addition to the step of providing the plating layer 24, a step of bonding an Au wire for connecting the plating layer 24 and another conductive member can be reduced, and the manufacturing process of the light emitting module 12 can be simplified. can do.
　段差面２２ｂに代えて、実装基板２２の表面のうち上面２２ａよりも下方の他の面に給電部２４ａが延在するよう設けられてもよい。このように上面２２ａよりも下方の面において半導体発光素子２０への給電を可能とするよう、上面２２ａから当該下方の面に延在する給電部２４ａを設けることにより、Ａｕワイヤなどの導電部材を取り付けることなく、上面２２ａよりも下方において半導体発光素子２０への給電が可能となる。このため、発光モジュール１２の製造工程を簡略化できるとともに、半導体発光素子２０が発する光によって形成される配光へ導電部材が影響することを回避できる。 Instead of the stepped surface 22b, the power feeding unit 24a may be provided so as to extend on the other surface below the upper surface 22a of the surface of the mounting substrate 22. In this way, by providing the power feeding portion 24a extending from the upper surface 22a to the lower surface so that power can be supplied to the semiconductor light emitting element 20 on the surface below the upper surface 22a, a conductive member such as an Au wire can be provided. Without being attached, power can be supplied to the semiconductor light emitting element 20 below the upper surface 22a. For this reason, while being able to simplify the manufacturing process of the light emitting module 12, it can avoid that a conductive member influences the light distribution formed by the light which the semiconductor light emitting element 20 emits.
　例えば段差面２２ｂに代えて、上面２２ａから下方に向けて傾斜する傾斜面が設けられていてもよい。給電部２４ａは、上面２２ａからこの傾斜面に延在するよう設けられていてもよい。また、段差面２２ｂに代えて、上面２２ａから下方に凹む溝部が設けられてもよく、給電部２４ａは、上面２２ａからこの溝部の底部に延在するように設けられていてもよい。これらによっても、上面２２ａより下方において給電部２４ａにＡｕワイヤ２８をボンディングすることが可能となる。 For example, instead of the step surface 22b, an inclined surface that is inclined downward from the upper surface 22a may be provided. The power feeding unit 24a may be provided so as to extend from the upper surface 22a to the inclined surface. Moreover, it replaces with the level | step difference surface 22b, and the groove part dented below from the upper surface 22a may be provided, and the electric power feeding part 24a may be provided so that it may extend from the upper surface 22a to the bottom part of this groove part. Also by these, the Au wire 28 can be bonded to the power feeding portion 24a below the upper surface 22a.
　図３に戻る。ハウジング１６は、樹脂によって形成される。なお、ハウジング１６の材質が樹脂に限られないことは勿論であり、他の絶縁材料によって形成されていてもよい。ハウジング１６は開口部１６ｂを有しており、この開口部１６ｂに支持部材１４の側面１４ｂが嵌め合わされ、両者が互いに固定される。 Return to Fig. 3. The housing 16 is made of resin. Of course, the material of the housing 16 is not limited to resin, but may be formed of other insulating materials. The housing 16 has an opening 16b, and the side surface 14b of the support member 14 is fitted into the opening 16b, and both are fixed to each other.
　ハウジング１６は、上面と平行且つ上面より下方に設けられた段差面１６ａを有する。ハウジング１６の段差面１６ａは実装基板２２の段差面２２ｂと略同一の高さとなっている。なお、段差面１６ａと段差面２２ｂとが違う高さであってもよい。段差面１６ａ上には、薄い板状の導電性部材２６が設けられる。導電性部材２６は銅により形成されているが、他の導電性材料によって形成されてもよい。 The housing 16 has a step surface 16a provided parallel to the upper surface and below the upper surface. The step surface 16 a of the housing 16 has substantially the same height as the step surface 22 b of the mounting substrate 22. The step surface 16a and the step surface 22b may have different heights. A thin plate-like conductive member 26 is provided on the step surface 16a. The conductive member 26 is formed of copper, but may be formed of other conductive materials.
　導電性部材２６は、メッキ層２４と離間して配置される。導通部材であるＡｕワイヤ２８は、メッキ層２４と導電性部材２６とを互いに導通させるようメッキ層２４と導電性部材２６との双方に接続される。こうして、導電性部材２６から、Ａｕワイヤ２８、メッキ層２４を介して、複数の半導体発光素子２０に発光のための電力供給が可能となっている。 The conductive member 26 is disposed apart from the plating layer 24. The Au wire 28 as a conductive member is connected to both the plated layer 24 and the conductive member 26 so as to make the plated layer 24 and the conductive member 26 conductive. In this way, it is possible to supply power for light emission from the conductive member 26 to the plurality of semiconductor light emitting elements 20 via the Au wire 28 and the plating layer 24.
（第２の実施形態）
　図５は、第２の実施形態に係る発光モジュール８０の構成を示す図である。図５は、図３と同様に図１における鉛直平面Ｒによる断面を示しているが、放熱基板１５の図示は省略している。以下、上述の実施形態と同様の個所については同一の符号を付して説明を省略する。 (Second Embodiment)
FIG. 5 is a diagram illustrating a configuration of a light emitting module 80 according to the second embodiment. FIG. 5 shows a cross section taken along the vertical plane R in FIG. 1 as in FIG. 3, but the illustration of the heat dissipation substrate 15 is omitted. Hereinafter, the same parts as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.
　発光モジュール８０は、発光モジュール１２、支持部材８２（第２支持部材）、およびハウジング８４を備える。支持部材８２は、実装基板２２と当接する上面８２ａに背向する下面８２ｂが、上面８２ａよりも面積が大きくなるよう形成されている。 The light emitting module 80 includes a light emitting module 12, a support member 82 (second support member), and a housing 84. The support member 82 is formed such that the lower surface 82b facing away from the upper surface 82a that contacts the mounting substrate 22 has a larger area than the upper surface 82a.
　具体的には、支持部材８２は、上面８２ａ近傍の側面８２ｃよりも外側に突出する拡大部８２ｄが下面８２ｂの近傍に設けられている。これにより、下面８２ｂの面積は上面８２ａの面積より大きくなっている。このため、ハウジング８４には、この拡大部８２ｄを収容するための凹部８４ｂが設けられている。この点以外は、ハウジング８４は上述のハウジング１６と同様に形成される。したがって、ハウジング８４は、上面と平行且つ上面より下方に設けられた段差面８４ａを有し、この段差面８４ａ上に導電性部材２６が設けられる。このように下面８２ｂの面積を大きくすることにより、下面８２ｂからより多くの熱を放出させることが可能となる。 Specifically, the support member 82 is provided with an enlarged portion 82d that protrudes outward from the side surface 82c in the vicinity of the upper surface 82a in the vicinity of the lower surface 82b. Thereby, the area of the lower surface 82b is larger than the area of the upper surface 82a. For this reason, the housing 84 is provided with a recess 84b for accommodating the enlarged portion 82d. Except for this point, the housing 84 is formed in the same manner as the housing 16 described above. Therefore, the housing 84 has a step surface 84a provided parallel to the upper surface and below the upper surface, and the conductive member 26 is provided on the step surface 84a. Thus, by increasing the area of the lower surface 82b, it becomes possible to release more heat from the lower surface 82b.
（第３の実施形態）
　図６は、第３の実施形態に係る発光装置１００の構成を示す図である。図６は、図３と同様に図１における鉛直平面Ｒによる断面を示しているが、放熱基板１５の図示は省略している。以下、上述の実施形態と同様の個所については同一の符号を付して説明を省略する。 (Third embodiment)
FIG. 6 is a diagram illustrating a configuration of a light emitting device 100 according to the third embodiment. 6 shows a cross section taken along the vertical plane R in FIG. 1 as in FIG. 3, but the illustration of the heat dissipation substrate 15 is omitted. Hereinafter, the same parts as those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.
　発光装置１００は、発光モジュール１２、支持部材８２、およびハウジング８４によって形成される溝部に封止部材１０２が設けられる以外は、第２の実施形態に係る発光モジュール８０と同様に構成される。 The light emitting device 100 is configured in the same manner as the light emitting module 80 according to the second embodiment, except that a sealing member 102 is provided in a groove formed by the light emitting module 12, the support member 82, and the housing 84.
　封止部材１０２は樹脂材料を溝部に充填して固化させたものであり、溝部にあるＡｕワイヤ２８の全体を外気から封止する。これにより、Ａｕワイヤ２８を外部からの衝撃から保護してＡｕワイヤ２８の接続信頼性を高めることができるとともに、Ａｕワイヤ２８による配光への影響を抑制することができる。なお封止部材１０２は、Ａｕワイヤ２８のうち、例えばボンディング部分など一部を外気から封止してもよい。 The sealing member 102 is obtained by filling a groove with a resin material and solidifying it, and seals the entire Au wire 28 in the groove from the outside air. As a result, the Au wire 28 can be protected from an external impact to increase the connection reliability of the Au wire 28 and the influence of the Au wire 28 on the light distribution can be suppressed. The sealing member 102 may seal a part of the Au wire 28 such as a bonding portion from the outside air.
　第３の実施形態では、封止部材１０２は、半導体発光素子２０が実装されるメッキ層２４の上面よりも下方に位置するよう溝部に充填される。なお、封止部材１０２は、半導体発光素子２０の発光面２０ａよりも下方に位置するよう溝部に充填されてもよい。封止部材１０２は、実装基板２２の上面２２ａよりも下方に位置するよう溝部に充填されてもよい。 In the third embodiment, the sealing member 102 is filled in the groove so as to be positioned below the upper surface of the plating layer 24 on which the semiconductor light emitting element 20 is mounted. The sealing member 102 may be filled in the groove so as to be positioned below the light emitting surface 20 a of the semiconductor light emitting element 20. The sealing member 102 may be filled in the groove so as to be positioned below the upper surface 22 a of the mounting substrate 22.
　封止部材１０２に代えて、カバーが設けられてもよい。カバーは、Ａｕワイヤ２８が発光面２０ａよりも下方に位置するようＡｕワイヤ２８の上方に配置されてもよい。また、カバーは、Ａｕワイヤ２８が実装基板２２の上面２２ａよりも下方に位置するようＡｕワイヤ２８の上方に配置されてもよい。このときカバーは、発光モジュール１２とハウジング８４との間に形成され、Ａｕワイヤ２８が収容される溝部を外気から封止するよう、発光モジュール１２とハウジング８４との間に設けられてもよい。したがって、このカバーもまた封止手段として機能する。このようにカバーを設けることによっても、Ａｕワイヤ２８の接続信頼性を高めるとともに、Ａｕワイヤ２８による配光への影響を抑制することができる。 Instead of the sealing member 102, a cover may be provided. The cover may be disposed above the Au wire 28 so that the Au wire 28 is positioned below the light emitting surface 20a. Further, the cover may be disposed above the Au wire 28 so that the Au wire 28 is positioned below the upper surface 22 a of the mounting substrate 22. At this time, the cover may be formed between the light emitting module 12 and the housing 84 so as to be formed between the light emitting module 12 and the housing 84 and seal the groove portion in which the Au wire 28 is accommodated from the outside air. Therefore, this cover also functions as a sealing means. By providing the cover in this way, the connection reliability of the Au wire 28 can be improved and the influence of the Au wire 28 on the light distribution can be suppressed.
（第４の実施形態）
　図７は、第４の実施形態にかかる発光装置１２０の構成を示す斜視図である。以下、上述の実施形態と同様の個所は同一の符号を付して説明を省略する。発光装置１２０は、発光モジュール１２、放熱基板ユニット１３、ハウジング１２２、制御回路部３０、コネクタ１２４、およびコード１２６を有する。 (Fourth embodiment)
FIG. 7 is a perspective view showing a configuration of a light emitting device 120 according to the fourth embodiment. Hereinafter, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. The light emitting device 120 includes a light emitting module 12, a heat dissipation board unit 13, a housing 122, a control circuit unit 30, a connector 124, and a cord 126.
　図７に示すように、発光装置１２０では、ハウジング１２２とコネクタ１２４とが別体とされている。それ以外は、ハウジング１２２は第１の実施形態に係るハウジング１６と同様である。コネクタ１２４は、２本の柔軟性を有するコード１２６を介して制御回路部３０に接続されている。 As shown in FIG. 7, in the light emitting device 120, the housing 122 and the connector 124 are separated. Other than that, the housing 122 is the same as the housing 16 according to the first embodiment. The connector 124 is connected to the control circuit unit 30 via two flexible cords 126.
　制御回路部３０は、一枚の基板で構成するなどして高さを抑制することが可能である。しかしながら、コネクタ１２４は規格に準拠する必要があることなどから、高さを抑制することが困難なケースが生じ得る。このようにコネクタ１２４を別体としてさらに柔軟性を有するコード１２６で制御回路部３０とコネクタ１２４とを接続することにより、コネクタ１２４の配置の自由度を高めることができる。ハウジング１２２は、コネクタ１２４を別体とすることで小型化が可能となるため、灯具の構成に合わせてコネクタ１２４の配置を変えることで、様々な灯具に発光装置１２０を搭載することが可能となる。 The control circuit unit 30 can be reduced in height by being configured with a single substrate. However, since the connector 124 needs to comply with the standard, it may be difficult to suppress the height. In this way, by connecting the control circuit unit 30 and the connector 124 with the cord 126 having further flexibility, with the connector 124 as a separate body, the degree of freedom in the arrangement of the connector 124 can be increased. Since the housing 122 can be reduced in size by making the connector 124 a separate body, the light emitting device 120 can be mounted on various lamps by changing the arrangement of the connector 124 according to the configuration of the lamp. Become.
　制御回路部３０へ取り付ける側のコード１２６の先端には、端子１２６ａが設けられている。端子には、固定用のガイド１２６ｂがさらに設けられている。ハウジング１２２のうちコード１２６が取り付けられる部分には、電極（図示せず）および、コード１２６のガイドが嵌挿されるガイド受け部１２２ａが設けられている。コード１２６のガイド１２６ｂ部がハウジング１２２のガイド受け部１２２ａに嵌挿されることにより、端子１２６ａと電極とが接触する。こうしてハウジング１２２へのコード１２６の固定と、コード１２６と制御回路部３０との導通が同時に行われる。コード１２６をハウジング１２２に取り付け後、コード１２６の端子１２６ａとハウジング１２２の電極は、はんだ付け、レーザ溶接、または抵抗溶接などにより互いに接合させる。 A terminal 126 a is provided at the tip of the cord 126 on the side attached to the control circuit unit 30. The terminal is further provided with a fixing guide 126b. A portion of the housing 122 to which the cord 126 is attached is provided with an electrode (not shown) and a guide receiving portion 122a into which the guide of the cord 126 is inserted. By inserting the guide 126b portion of the cord 126 into the guide receiving portion 122a of the housing 122, the terminal 126a and the electrode come into contact with each other. Thus, the fixing of the cord 126 to the housing 122 and the conduction between the cord 126 and the control circuit unit 30 are performed simultaneously. After the cord 126 is attached to the housing 122, the terminal 126a of the cord 126 and the electrode of the housing 122 are joined to each other by soldering, laser welding, resistance welding, or the like.
　図８（ａ）は、発光装置１２０を灯具１２８へ搭載した一例を示す図である。灯具１２８は、発光装置１２０がヒートシンク１３０に取り付けられ構成されている。発光装置１２０の上方には、半導体発光素子２０からの光を灯具前方に反射するリフレクタ１３２が配置されている。このようにコード１２６でコネクタ１２４と制御回路部３０とを接続することにより、ヒートシンク１３０の空いたスペースにコネクタ１２４を配置することができる。 FIG. 8A is a diagram showing an example in which the light emitting device 120 is mounted on the lamp 128. The lamp 128 is configured by attaching the light emitting device 120 to a heat sink 130. A reflector 132 that reflects the light from the semiconductor light emitting element 20 to the front of the lamp is disposed above the light emitting device 120. By connecting the connector 124 and the control circuit unit 30 with the cord 126 in this way, the connector 124 can be disposed in the space where the heat sink 130 is free.
　図８（ｂ）は、発光装置１２０を灯具１３４へ搭載した別の一例を示す図である。灯具１３４は、発光装置１２０がヒートシンク１３６に取り付けられ構成されている。発光装置１２０の上方には、半導体発光素子２０からの光を灯具前方に反射するリフレクタ１３８が配置されている。このようにコード１２６でコネクタ１２４と制御回路部３０とを接続することにより、ヒートシンク１３６側面にコネクタ１２４を配置することができるため、ヒートシンク１３６において、ハウジング１２２を含む本体部を取り付けるための面積を小さくすることができる。このように制御回路部３０とコネクタ１２４とを別体としてコード１２６で互いに接続することにより、様々な構成の灯具に発光装置１２０を用いることが可能となる。 FIG. 8B is a diagram showing another example in which the light emitting device 120 is mounted on the lamp 134. The lamp 134 is configured by attaching the light emitting device 120 to a heat sink 136. Above the light emitting device 120, a reflector 138 is disposed that reflects light from the semiconductor light emitting element 20 to the front of the lamp. By connecting the connector 124 and the control circuit unit 30 with the cord 126 in this manner, the connector 124 can be disposed on the side surface of the heat sink 136. Therefore, in the heat sink 136, the area for attaching the main body including the housing 122 is reduced. Can be small. In this way, the control circuit unit 30 and the connector 124 are separately connected to each other by the cord 126, so that the light emitting device 120 can be used for lamps having various configurations.
（第５の実施形態）
　図９は、第５の実施形態にかかる発光装置１５０の構成を示す斜視図である。以下、上述の実施形態と同様の個所は同一の符号を付して説明を省略する。発光装置１５０は、発光モジュール１２、放熱基板ユニット１３、ハウジング１５２、制御回路部３０、コネクタ１５４、およびフレキシブルプリント基板（以下、「ＦＰＣ（Flexible printed circuits）」という）１５６を有する。 (Fifth embodiment)
FIG. 9 is a perspective view illustrating a configuration of a light emitting device 150 according to the fifth embodiment. Hereinafter, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. The light emitting device 150 includes a light emitting module 12, a heat dissipation board unit 13, a housing 152, a control circuit unit 30, a connector 154, and a flexible printed circuit board (hereinafter referred to as “FPC (Flexible printed circuits)”) 156.
　図９に示すように、発光装置１５０では、ハウジング１５２とコネクタ１５４とが別体とされている。それ以外は、ハウジング１５２は第１の実施形態に係るハウジング１６と同様である。第５の実施形態では、コネクタ１５４は、柔軟性を有するＦＰＣ１５６を介して制御回路部３０に接続されている。 As shown in FIG. 9, in the light emitting device 150, the housing 152 and the connector 154 are separated. Other than that, the housing 152 is the same as the housing 16 according to the first embodiment. In the fifth embodiment, the connector 154 is connected to the control circuit unit 30 via a flexible FPC 156.
　このようにコネクタ１５４を別体としてさらにＦＰＣ１５６で制御回路部３０とコネクタ１５４とを接続することにより、コネクタ１５４の配置の自由度を高めることができる。ハウジング１５２は、コネクタ１５４を別体とすることで小型化が可能となるため、灯具の構成に合わせてコネクタ１５４の配置を変えることで、様々な灯具に発光装置１５０を搭載することが可能となる。 Thus, by connecting the control circuit unit 30 and the connector 154 with the FPC 156 with the connector 154 as a separate body, the degree of freedom of arrangement of the connector 154 can be increased. Since the housing 152 can be reduced in size by making the connector 154 separate, the light emitting device 150 can be mounted on various lamps by changing the arrangement of the connector 154 according to the configuration of the lamp. Become.
　制御回路部３０へ取り付ける側のＦＰＣ１５６の先端には、端子（図示せず）および取り付け孔１５６ａが設けられている。ハウジング１５２のうちＦＰＣ１５６が取り付けられる部分には、上方に突出するボス１５２ａ、および制御回路部３０に接続された電極（図示せず）が設けられている。ＦＰＣ１５６の取り付け孔１５６ａがハウジング１５２のボス１５２ａに挿入されることにより、ＦＰＣ１５６の端子がハウジング１５２に設けられた電極とが接触する。こうしてハウジング１２２へのＦＰＣ１５６の固定と、ＦＰＣ１５６と制御回路部３０との導通が同時に行われる。ＦＰＣ１５６をハウジング１５２に取り付け後、ＦＰＣ１５６の端子とハウジング１５２の電極は、はんだ付け、レーザ溶接、または抵抗溶接などにより互いに接合させる。 The terminal (not shown) and the attachment hole 156a are provided in the front-end | tip of FPC156 of the side attached to the control circuit part 30. As shown in FIG. A portion of the housing 152 to which the FPC 156 is attached is provided with a boss 152 a protruding upward and an electrode (not shown) connected to the control circuit unit 30. By inserting the mounting hole 156 a of the FPC 156 into the boss 152 a of the housing 152, the terminal of the FPC 156 comes into contact with the electrode provided on the housing 152. In this way, fixing of the FPC 156 to the housing 122 and conduction between the FPC 156 and the control circuit unit 30 are performed simultaneously. After the FPC 156 is attached to the housing 152, the terminal of the FPC 156 and the electrode of the housing 152 are joined to each other by soldering, laser welding, resistance welding, or the like.
　図１０は、発光装置１５０を灯具１６０へ搭載した一例を示す図である。灯具１６０は、２つの発光装置１５０がヒートシンク１６２の同じ面に取り付けられ構成されている。発光装置１５０の各々には、半導体発光素子２０が発した光を灯具前方に反射するリフレクタ１６４がそれぞれの上方に設けられている。 FIG. 10 is a diagram illustrating an example in which the light emitting device 150 is mounted on the lamp 160. The lamp 160 includes two light emitting devices 150 attached to the same surface of the heat sink 162. Each of the light emitting devices 150 is provided with a reflector 164 that reflects light emitted from the semiconductor light emitting element 20 to the front of the lamp.
　このようにＦＰＣ１５６でコネクタ１５４と制御回路部３０とを接続することにより、ヒートシンク１６２の空いたスペースにコネクタ１５４を配置することができる。また、図１０に示すＦＰＣ１５６ＡおよびＦＰＣ１５６Ｂのように、形状が異なるＦＰＣを複数設けるだけで、ハウジング１５２およびコネクタ１５４は共通部品を使用することができる。このため、コネクタの配置が異なる複数種類のハウジングを用いる場合に比べ、部品共通化による低コスト化を図ることができる。 Thus, by connecting the connector 154 and the control circuit unit 30 with the FPC 156, the connector 154 can be disposed in the space where the heat sink 162 is free. Further, common components can be used for the housing 152 and the connector 154 only by providing a plurality of FPCs having different shapes such as the FPC 156A and the FPC 156B shown in FIG. For this reason, compared with the case where a plurality of types of housings having different connector arrangements are used, the cost can be reduced by sharing the parts.
（第６の実施形態）
　図１１は、第６の実施形態にかかる発光装置１８０の構成を示す斜視図である。以下、上述の実施形態と同様の個所は同一の符号を付して説明を省略する。発光装置１８０は、発光モジュール１２、放熱基板ユニット１３、制御回路部３０、ハウジング１８２、およびコネクタ１８４を有する。 (Sixth embodiment)
FIG. 11 is a perspective view showing a configuration of a light emitting device 180 according to the sixth embodiment. Hereinafter, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. The light emitting device 180 includes the light emitting module 12, the heat dissipation board unit 13, the control circuit unit 30, the housing 182, and the connector 184.
　コネクタ１８４には、ガイド部として機能する凸部１８４ａが設けられている。ハウジング１８２には、凸部１８４ａを受けるべく周囲の壁部が一部切り取られたように形成された受け部１８２ａが設けられている。コネクタ１８４の凸部１８４ａには電極（図示せず）が設けられており、ハウジング１８２の受け部１８２ａ近傍には制御回路部３０の電極（図示せず）が設けられている。 The connector 184 is provided with a convex portion 184a that functions as a guide portion. The housing 182 is provided with a receiving portion 182a formed such that a peripheral wall portion is partially cut away so as to receive the convex portion 184a. An electrode (not shown) is provided on the convex portion 184 a of the connector 184, and an electrode (not shown) of the control circuit portion 30 is provided in the vicinity of the receiving portion 182 a of the housing 182.
　コネクタ１８４の凸部１８４ａがハウジング１８２の受け部１８２ａに嵌挿されることにより、コネクタ１８４の電極と制御回路部３０の電極とが接触する。こうしてコネクタ１８４のハウジング１８２への固定と、コネクタ１８４と制御回路部３０との導通が同時に行われる。コネクタ１８４の電極と制御回路部３０の電極は、はんだ付け、レーザ溶接、または抵抗溶接などにより互いに接合される。このようにコネクタ１８４に凸部１８４ａを設け、さらにハウジング１８２に受け部１８２ａを設けることによっても、コネクタ１８４をハウジング１８２に簡易に取り付け可能としつつ、コネクタ１８４と制御回路部３０とを適切に導通させることができる。 When the convex part 184a of the connector 184 is inserted into the receiving part 182a of the housing 182, the electrode of the connector 184 and the electrode of the control circuit part 30 come into contact with each other. Thus, the fixing of the connector 184 to the housing 182 and the electrical connection between the connector 184 and the control circuit unit 30 are performed simultaneously. The electrode of the connector 184 and the electrode of the control circuit unit 30 are joined to each other by soldering, laser welding, resistance welding, or the like. In this way, by providing the connector 184 with the convex portion 184a and further providing the housing 182 with the receiving portion 182a, the connector 184 can be easily attached to the housing 182, and the connector 184 and the control circuit unit 30 are appropriately connected. Can be made.
（第７の実施形態）
　図１２（ａ）は、第７の実施形態にかかる発光装置２００の構成を示す上面図であり、図１２（ｂ）は、図１２（ａ）のＳ－Ｓ断面図である。以下、上述の実施形態と同様の個所は同一の符号を付して説明を省略する。 (Seventh embodiment)
FIG. 12A is a top view showing the configuration of the light emitting device 200 according to the seventh embodiment, and FIG. 12B is an SS cross-sectional view of FIG. 12A. Hereinafter, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted.
　発光装置２００は、発光モジュール１２、放熱基板２０２、ハウジング２０４、コネクタ２０６、ＦＰＣ２０８、および制御回路部２１０を有する。ハウジング２０４は、制御回路部２１０を収容する収容領域が上方から見て矩形となるよう形成される。第７の実施形態では、ハウジング２０４にはバスバーが設けられておらず、樹脂のみによって成型されている。放熱基板２０２は、このハウジング２０４の形状に合わせて平板状の部分が矩形に形成されている以外は、上述の放熱基板１５と同様に構成される。 The light emitting device 200 includes a light emitting module 12, a heat dissipation board 202, a housing 204, a connector 206, an FPC 208, and a control circuit unit 210. The housing 204 is formed so that the accommodation area for accommodating the control circuit unit 210 is rectangular when viewed from above. In the seventh embodiment, the housing 204 is not provided with a bus bar, and is molded only from resin. The heat dissipation board 202 is configured in the same manner as the heat dissipation board 15 described above except that a flat plate-like portion is formed in a rectangular shape in accordance with the shape of the housing 204.
　ＦＰＣ２０８は、Ｃ字状に形成され、２つの先端部には電極が設けられている。この２つの電極が、発光モジュール１２の電極を介して半導体発光素子２０に接続されている。ＦＰＣ２０８は、ハウジング２０４の収容領域の外周に沿うよう矩形に形成されている。 The FPC 208 is formed in a C shape, and electrodes are provided at two tip portions. These two electrodes are connected to the semiconductor light emitting element 20 via the electrodes of the light emitting module 12. The FPC 208 is formed in a rectangular shape along the outer periphery of the housing area of the housing 204.
　ＦＰＣ２０８の２つの先端部の反対側には、ハウジング２０４から突出するよう延在する部分が設けられており、コネクタ２０６は、この延在する部分に接続されている。こうしてコネクタ２０６は、ＦＰＣ２０８を曲げることによりある程度の自由度を持って配置できるよう、ハウジング２０４から離間して配置される。なお、コネクタ２０６とＦＰＣ２０８とは、はんだ付け、レーザ溶接、または抵抗溶接などにより互いに接合される。なお、ＦＰＣ２０８の先端を端子にして、コネクタ２０６にＦＰＣ２０８を挿入し嵌合させて接続してもよい。 A portion extending so as to protrude from the housing 204 is provided on the opposite side of the two tip portions of the FPC 208, and the connector 206 is connected to the extending portion. In this way, the connector 206 is disposed away from the housing 204 so that the connector 206 can be disposed with a certain degree of freedom by bending the FPC 208. The connector 206 and the FPC 208 are joined to each other by soldering, laser welding, resistance welding, or the like. Note that the FPC 208 may be connected by inserting and fitting the FPC 208 into the connector 206 with the tip of the FPC 208 as a terminal.
　ＦＰＣ２０８は、１枚のプリント基板によって構成された制御回路部２１０に載置され接続される。なお、制御回路部２１０に複数枚のプリント基板が設けられていてもよい。こうしてコネクタ２０６は、ＦＰＣ２０８および制御回路部２１０を介して発光モジュール１２の半導体発光素子２０に給電可能に接続される。ＦＰＣ２０８および制御回路部２１０は、ハウジング２０４の収容領域にともに収容される。 The FPC 208 is placed and connected to a control circuit unit 210 constituted by a single printed board. Note that a plurality of printed circuit boards may be provided in the control circuit unit 210. In this way, the connector 206 is connected to the semiconductor light emitting element 20 of the light emitting module 12 via the FPC 208 and the control circuit unit 210 so that power can be supplied. The FPC 208 and the control circuit unit 210 are both housed in the housing area of the housing 204.
　例えばハウジング内にバスバーを設ける場合、一体成形された金属配線板をプレス形成で変形させて、これを樹脂に埋め込むようにしてハウジングを成型する。このようにバスバーが設けられたハウジングは、絶縁を確保すべくバスバー周辺を樹脂で覆う必要があることからサイズの抑制が一般に難しい。第７の実施形態のようにＦＰＣ２０８を設けることにより、バスバーを設ける場合に比べハウジング２０４のサイズを抑制することができる。このため、発光装置２００全体のサイズも簡易に抑制することができる。 For example, when a bus bar is provided in the housing, the integrally formed metal wiring board is deformed by press forming, and the housing is molded so as to be embedded in the resin. The housing provided with the bus bar as described above is generally difficult to suppress in size because it is necessary to cover the periphery of the bus bar with resin in order to ensure insulation. By providing the FPC 208 as in the seventh embodiment, the size of the housing 204 can be suppressed as compared with the case where a bus bar is provided. For this reason, the size of the entire light emitting device 200 can be easily suppressed.
（第８の実施形態）
　図１３は、第８の実施形態にかかる発光装置２２０の構成を示す斜視図である。以下、上述の実施形態と同様の個所は同一の符号を付して説明を省略する。発光装置２２０は、発光モジュール１２、制御回路部３０、ケース２２２、およびコネクタ２２４を備える。 (Eighth embodiment)
FIG. 13 is a perspective view showing a configuration of a light emitting device 220 according to the eighth embodiment. Hereinafter, the same portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. The light emitting device 220 includes the light emitting module 12, the control circuit unit 30, a case 222, and a connector 224.
　ケース２２２は、アルミニウムなどの放熱性材料によって一体的に形成される。コネクタ２２４は、このケース２２２に接着などによって固着される。ケース２２２は、制御回路部３０および発光モジュール１２の双方を収容する収容領域が設けられており、この収容領域に制御回路部３０を支持する支持部、および発光モジュール１２を支持する支持部の双方が設けられる。したがって、ケース２２２は、第１の実施形態に係る放熱基板ユニット１３とハウジング１６との双方の機能を有する。このようにケース２２２を一体成形することにより、第１の実施形態のようにハウジング１６を放熱基板ユニット１３に取り付ける工数を低減させることができ、また、部品点数削減によるコストダウンを実現できる。 The case 222 is integrally formed of a heat dissipating material such as aluminum. The connector 224 is fixed to the case 222 by adhesion or the like. The case 222 is provided with an accommodation area that accommodates both the control circuit section 30 and the light emitting module 12, and both a support section that supports the control circuit section 30 and a support section that supports the light emitting module 12 in the accommodation area. Is provided. Therefore, the case 222 has the functions of both the heat dissipation board unit 13 and the housing 16 according to the first embodiment. By integrally molding the case 222 in this manner, the number of steps for attaching the housing 16 to the heat dissipation board unit 13 can be reduced as in the first embodiment, and the cost can be reduced by reducing the number of components.
　第８の実施形態では、発光モジュール１２の電極と制御回路部３０とはＡｕワイヤ２２６によって接続される。このため、バスバーを有するハウジングを使用する場合に比べ、ケース２２２の小型化も実現することができる。なお、Ａｕワイヤ２２６に代えて、Ａｌワイヤ、Ａｌリボンなど他の導電性部材が用いられてもよい。 In the eighth embodiment, the electrode of the light emitting module 12 and the control circuit unit 30 are connected by the Au wire 226. For this reason, compared with the case where the housing which has a bus bar is used, size reduction of case 222 is also realizable. Instead of the Au wire 226, another conductive member such as an Al wire or an Al ribbon may be used.
　制御回路部３０を収容する領域、およびＡｕワイヤ２２６が設けられた領域は、封止部材２２８が充填される。封止部材２２８は樹脂材料をケース２２２の収容領域に充填して固化させたものであり、制御回路部３０およびＡｕワイヤ２２６の全体を外気から封止する。これにより、制御回路部３０やＡｕワイヤ２２６を外部からの衝撃から保護し、制御回路部３０およびＡｕワイヤ２２６の接続信頼性を高めることができるとともに、Ａｕワイヤ２２６による配光への影響を抑制することができる。なお封止部材２２８は、制御回路部３０またはＡｕワイヤ２２６の一部を外気から封止してもよい。 The region for accommodating the control circuit unit 30 and the region provided with the Au wire 226 are filled with the sealing member 228. The sealing member 228 is formed by filling the housing region of the case 222 with a resin material and solidifying it, and seals the entire control circuit unit 30 and the Au wire 226 from the outside air. As a result, the control circuit unit 30 and the Au wire 226 can be protected from external impacts, and the connection reliability between the control circuit unit 30 and the Au wire 226 can be improved, and the influence of the Au wire 226 on the light distribution can be suppressed. can do. The sealing member 228 may seal part of the control circuit unit 30 or the Au wire 226 from the outside air.
　第８の実施形態では、封止部材２２８は、半導体発光素子２０の発光面２０ａよりも下方に位置するよう、ケース２２２の収容領域に充填されてもよい。なお、封止部材２２８は、半導体発光素子２０が実装される支持部材１４の上面よりも下方に位置するよう溝部に充填されてもよい。 In the eighth embodiment, the enclosing region of the case 222 may be filled with the sealing member 228 so as to be positioned below the light emitting surface 20a of the semiconductor light emitting element 20. The sealing member 228 may be filled in the groove so as to be positioned below the upper surface of the support member 14 on which the semiconductor light emitting element 20 is mounted.
　封止部材２２８に代えて、カバーが設けられてもよい。カバーは、Ａｕワイヤ２２６が発光面２０ａよりも下方に位置し、さらに自身の上面も発光面２０ａよりも下方に位置するよう、Ａｕワイヤ２２６の上方に配置されてもよい。したがって、このカバーも、制御回路部３０およびＡｕワイヤ２２６を外部から封止する封止手段として機能する。このようにカバーを設けることによっても、制御回路部３０およびＡｕワイヤ２２６の接続信頼性を高めることができるとともに、Ａｕワイヤ２２６による配光への影響を抑制することができる。 Instead of the sealing member 228, a cover may be provided. The cover may be disposed above the Au wire 226 so that the Au wire 226 is located below the light emitting surface 20a and the upper surface of the cover is located below the light emitting surface 20a. Therefore, this cover also functions as a sealing means for sealing the control circuit unit 30 and the Au wire 226 from the outside. By providing the cover in this way, the connection reliability between the control circuit unit 30 and the Au wire 226 can be increased, and the influence of the Au wire 226 on the light distribution can be suppressed.
　なお、ケース２２２は、上述の放熱基板１５のように、枠となる部分が削除されてもよい。発光モジュール１２と制御回路部３０がケース２２２に搭載し、両者をＡｕワイヤ２２６などの導電性部材で接続後、発光面２０ａよりも下方に位置するよう樹脂をトランスファーモールド法によってモールドし、制御回路部３０およびＡｕワイヤ２２６の双方を外部から封止してもよい。これにより、ケース２２２の枠部分を削除できることから、発光装置２２０のさらなる小型軽量化を実現できる。 In addition, as for the case 222, the part used as a frame may be deleted like the above-mentioned thermal radiation board | substrate 15. FIG. After the light emitting module 12 and the control circuit unit 30 are mounted on the case 222 and connected to each other by a conductive member such as an Au wire 226, a resin is molded by the transfer molding method so that the resin is positioned below the light emitting surface 20a. Both the portion 30 and the Au wire 226 may be sealed from the outside. Thereby, since the frame portion of the case 222 can be deleted, the light emitting device 220 can be further reduced in size and weight.
　本発明は上述の各実施形態に限定されるものではなく、各実施形態の各要素を適宜組み合わせたものも、本発明の実施形態として有効である。また、当業者の知識に基づいて各種の設計変更等の変形を各実施形態に対して加えることも可能であり、そのような変形が加えられた実施形態も本発明の範囲に含まれうる。 The present invention is not limited to the above-described embodiments, and an appropriate combination of the elements of each embodiment is also effective as an embodiment of the present invention. Various modifications such as design changes can be added to each embodiment based on the knowledge of those skilled in the art, and embodiments to which such modifications are added can also be included in the scope of the present invention.
　ある変形例では、制御回路部のうち、プリント回路が設けられたプリント回路基板上に支持部材１４が固着され、支持部材１４の上面に半導体発光素子２０が実装される。したがってこのプリント回路基板が、光源である半導体発光素子２０を支持する支持部材として機能する。この場合、プリント回路基板上に実装される実装部品によって制御ユニットが構成される。この例においても、プリント配線基板は、半導体発光素子２０の発光部が実装部品よりも発光部の主光軸方向に突出するよう半導体発光素子２０を支持する。この場合、プリント回路基板は、放熱性材料によって形成された放熱基板として機能する。これにより、放熱基板１５を削除することができ、発光装置の構成を簡素にすることができる。このため、発光装置の小型化やコストダウンを実現することができる。 In a modification, the support member 14 is fixed on a printed circuit board on which a printed circuit is provided in the control circuit unit, and the semiconductor light emitting element 20 is mounted on the upper surface of the support member 14. Therefore, this printed circuit board functions as a support member that supports the semiconductor light emitting element 20 as a light source. In this case, the control unit is configured by mounting components mounted on the printed circuit board. Also in this example, the printed wiring board supports the semiconductor light emitting element 20 so that the light emitting part of the semiconductor light emitting element 20 protrudes in the main optical axis direction of the light emitting part rather than the mounted component. In this case, the printed circuit board functions as a heat dissipation board formed of a heat dissipation material. Thereby, the thermal radiation board | substrate 15 can be deleted and the structure of a light-emitting device can be simplified. For this reason, size reduction and cost reduction of the light emitting device can be realized.
　ある別の変形例では、複数の半導体発光素子２０は、個別に給電可能となるよう、並列に接続されている。制御回路部は、複数の半導体発光素子２０の各々の点灯を制御するよう設けられる。このように半導体発光素子２０が個別に給電される場合においても、半導体発光素子２０の発光部を制御回路部よりも突出させるよう構成することにより、例えば制御回路部の上方にリフレクタなどが配置可能となるなど、灯具の設計自由度を高めることができる。 In another variation, the plurality of semiconductor light emitting elements 20 are connected in parallel so that they can be individually fed. The control circuit unit is provided to control lighting of each of the plurality of semiconductor light emitting elements 20. Thus, even when the semiconductor light emitting element 20 is individually fed, by configuring the light emitting part of the semiconductor light emitting element 20 to protrude from the control circuit part, for example, a reflector or the like can be disposed above the control circuit part. The design freedom of the lamp can be increased.
　１０　発光装置、　１２　発光モジュール、　１３　放熱基板ユニット、　１４　支持部材、　１５　放熱基板、　１６　ハウジング、　２０　半導体発光素子、　２０ａ　発光面、　２２　実装基板、　２８　Ａｕワイヤ、　３０　制御回路部。 10 light emitting device, 12 light emitting module, 13 heat dissipation board unit, 14 support member, 15 heat dissipation board, 16 housing, 20 semiconductor light emitting element, 20a light emitting surface, 22 mounting board, 28 Au wire, 30 control circuit section.
　本発明は、発光装置に利用可能であり、特に光源および光源の点灯を制御する制御回路部の双方を備えた発光装置に利用可能である。 The present invention can be used for a light-emitting device, and in particular, can be used for a light-emitting device including both a light source and a control circuit unit that controls lighting of the light source.

Claims (5)

  1. 　光源の点灯を制御する制御ユニットと、
    　前記光源および前記制御ユニットを支持する支持部材と、
    を備え、
    　前記支持部材は、前記光源の発光部が前記制御ユニットよりも前記発光部の主光軸方向に突出するよう前記光源を支持することを特徴とする発光装置。     A control unit for controlling the lighting of the light source;
    A support member for supporting the light source and the control unit;
    With
    The light-emitting device, wherein the support member supports the light source such that a light-emitting portion of the light source protrudes in a main optical axis direction of the light-emitting portion with respect to the control unit.
  2. 　前記支持部材は、前記制御ユニットを支持する第１支持部と、前記第１支持部から突出して前記光源を支持する第２支持部と、を有し、
    　前記第１支持部と前記第２支持部とは同一部材により一体的に形成されていることを特徴とする請求項１に記載の発光装置。     The support member includes a first support part that supports the control unit, and a second support part that protrudes from the first support part and supports the light source,
    The light emitting device according to claim 1, wherein the first support portion and the second support portion are integrally formed of the same member.
  3. 　前記支持部材は、前記制御ユニットを支持する第１支持部と、前記第１支持部から突出して前記光源を支持する第２支持部と、を有し、
    　前記第１支持部と前記第２支持部とは別体に形成され、３Ｗ／ｍＫ以上の熱伝導率を有する充填材を介して互いに固定されることを特徴とする請求項１に記載の発光装置。     The support member includes a first support part that supports the control unit, and a second support part that protrudes from the first support part and supports the light source,
    2. The light emitting device according to claim 1, wherein the first support part and the second support part are formed separately and are fixed to each other through a filler having a thermal conductivity of 3 W / mK or more. apparatus.
  4. 　前記制御ユニットは、少なくとも一部の周囲に樹脂が充填されることを特徴とする請求項１から３のいずれかに記載の発光装置。 4. The light emitting device according to claim 1, wherein at least a part of the control unit is filled with resin.
  5. 　前記支持部材には、プリント回路が設けられ、
    　前記制御ユニットは、前記支持部材上に実装される実装部品によって構成されることを特徴とする請求項１から４のいずれかに記載の発光装置。     The support member is provided with a printed circuit,
    The light-emitting device according to claim 1, wherein the control unit includes a mounting component mounted on the support member.
PCT/JP2011/003544 2010-08-26 2011-06-21 Light-emitting device WO2012026058A1 (en)

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