JP2009231473A - Lighting module and electronic apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting module whose size is reduced while insulation property is kept, being of low cost and long life, and to provide an electronic apparatus using the same. <P>SOLUTION: The lighting module includes an LED element 1 which converts voltage into light, an LED board 2 where the LED element 1 is mounted on its surface, a drive circuit element 4 for driving the LED element 1, and a drive circuit board 5 where the drive circuit element 4 is mounted on its surface. The LED board 2 and the drive circuit board 5 are tightly fitted as one body while the rear surfaces of the boards 2 and 5 are arranged to face each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an illumination module including an LED (Light Emitting Diode) element, and an electronic apparatus such as an illumination apparatus and an electric apparatus using the illumination module.

  An example of a conventional lighting device is shown in FIG.

  The lighting device includes a lighting module, which will be described later, a cover case 106 that supports and protects the lighting module, and a lens 108 that is disposed in an opening on the upper surface of the cover case 106.

  The illumination module is fixed to a plurality of LED elements 101 arranged to face the lens 108, an LED substrate 102 on which the LED elements 101 are mounted, and a back surface of the LED substrate 102 via heat radiation grease 103. The heat conducting member 107, a plurality of drive circuit elements 104 for driving the LED elements 101, and a drive circuit substrate 105 on which these drive circuit elements 104 are mounted.

  Further, the LED substrate 102 is fixed to the upper surface side (the lens 108 side) inside the cover case 106 via the heat conducting member 107, while the drive circuit substrate 105 is supported on the lower surface side inside the cover case 106. It is fixed via 106a.

  A power supply terminal block 111 having a power supply terminal (not shown) for connecting an external power supply is disposed outside the lower surface of the cover case 106, and the illumination module is for supplying power to the power supply terminal and the drive circuit element 104. A power supply line 110 for power supply that electrically connects electrodes (not shown), an output electrode (not shown) of the drive circuit element 104, and an input electrode (not shown) of the LED substrate 102 are electrically connected. And a light source power supply line 109.

  As described above, the conventional lighting device includes the heat conductive member 107 for radiating the heat generated in the LED element 101, and the LED substrate 102 and the drive circuit substrate 105 are individually provided. Heat generated in the LED element 101 and the drive circuit element 104 is not transmitted to the LED substrate 102.

  However, in such a structure, insulation between the LED substrate 102 on which the LED element 101 that operates at a relatively low voltage is mounted and the drive circuit substrate 105 on which the drive circuit element 104 that operates at a relatively high voltage is mounted. It was necessary to secure a sufficient distance. As a result, the conventional illumination device has a problem that the illumination module cannot be reduced in size and the cover case 106 becomes large.

  As a conventional example of lighting equipment for solving such a problem, there is an LED lighting device disclosed in Japanese Patent Laid-Open No. 2003-59335 (Patent Document 1).

  FIG. 11 is a longitudinal sectional view showing an example of a conventional LED lighting device.

In this LED lighting device, a plurality of LEDs 202 are arranged on one surface of a wiring board 201, and a power control circuit 204 for driving the LEDs 202 is arranged on the other surface. 201, LED 202, and power control circuit 204 are configured to be covered with a mold part 205 formed using a transparent synthetic resin or synthetic rubber.
JP 2003-59335 A

  However, when power is supplied to the power control circuit 204 via the power supply line 210 for power supply, the high voltage that is at least 100 V or more is lowered to a low voltage by a resistor, a capacitor, or the like in the power control circuit 204 before the LED 202 Therefore, the power loss in the power control circuit 204 is large, and heat is generated in the power control circuit 204. Therefore, in the configuration of the conventional LED lighting device, it is inevitable that the heat generated in the power control circuit 204 is conducted to the LED 202 through the wiring board 201. In addition, the LED 202 itself is a heat-generating component, and when the temperature rises, the conversion efficiency when converting the supplied electric power into light is reduced, and the deterioration of the light amount of the LED element itself is accelerated, so that the lifetime of the LED element is increased. There is a problem that the light emission becomes shorter and the light emission performance deteriorates.

  Therefore, in order to solve the problem that the life of the LED element is shortened and the problem that the light emission performance is deteriorated, the LED element is driven so that the life of the LED element is lengthened and the light emission performance is not deteriorated. An illumination module has been proposed. This lighting module uses (b) a means for reducing the number of LED elements used or reducing the drive current, and (b) a ceramic substrate with high thermal conductivity. Means are provided for suppressing the amount of heat generation.

  However, since the means (a) reduces the amount of light emitted from the lighting module, when used in lighting equipment, it is necessary to increase the number of uses in order to obtain the set amount of light emission, resulting in an increase in the cost of the lighting equipment. There was a problem such as. In addition, the means (b) is difficult to increase the size of the substrate because the cost of the ceramic substrate itself is high, and the mechanical strength of the substrate itself is weak, so care must be taken when mounting it in lighting equipment. There was a problem that the spread of products was hindered.

  Furthermore, in the configuration of the conventional LED lighting device, a module having a low voltage circuit on one surface of the wiring substrate 201 and a high voltage circuit on the other surface is formed on one surface of the wiring substrate 201. It was necessary to ensure insulation between the module formed on the other surface and the module formed on the other surface.

  Therefore, in the configuration of the conventional LED lighting device, a substrate material having high insulation performance is necessary, or the mounting component layout and the wiring layout are restricted in order to ensure the insulation distance, and the material and There is also a problem that the cost of the mounted parts is increased and the substrate size is increased for securing the insulation distance, resulting in an increase in product cost.

  The present invention was devised to solve such problems. The purpose of the present invention is to provide a lighting module that has sufficient heat dissipation, is inexpensive, has a long life, and can be miniaturized while maintaining insulation. And providing an electronic apparatus using the lighting module.

  In order to solve the above-mentioned problem, as shown in FIGS. 1 and 2, the illumination module of the present invention includes an LED element 1 that converts a voltage into light, an LED substrate 2 on which the LED element 1 is mounted, A drive circuit element 4 for driving the LED element 1 and a drive circuit board 5 having the drive circuit element 4 mounted on the surface thereof are provided, and the LED board 2 and the drive circuit board 5 are each of the boards 2 and 5. In other words, the back surfaces of the two are in close contact with each other and integrated.

  Thereby, since it has sufficient heat dissipation, it is possible to obtain an illumination module that is inexpensive, has a long life, and can be miniaturized.

  The drive circuit board may be composed of a heat radiating metal plate, an insulating heat radiating resin plate, and a wiring metal layer.

  In this case, the heat generated by the LED element and the drive circuit element can be radiated more efficiently.

  The heat radiating metal plate may be provided with a fixing means for fixing an electronic device.

  In this case, mechanical stress (stress caused by fixing) and stress due to thermal expansion can be relaxed on an LED substrate generally made of ceramic or the like having low mechanical strength.

  Also, an insert case for supporting the LED board and the drive circuit board is provided, and a metal terminal is fixed to the insert case by insert molding, and the output electrode of the drive circuit board and the LED board are connected via the metal terminal. You may have the structure that the input electrode is electrically connected.

  In this case, the drive circuit board and the LED board can be electrically connected, and the LED board and the drive circuit board can be more closely attached.

  Further, a heat dissipation grease or a heat dissipation elastic sheet may be provided between the LED substrate and the drive circuit substrate.

  In this case, it is preferable because the heat dissipation of the LED substrate and the drive circuit substrate can be further enhanced.

  The LED board may include a connection unit that fixes the LED board to the drive circuit board, and the drive circuit board includes a connection unit that fixes the drive circuit board to the LED board. Also good.

  In this case, the LED board and the drive circuit board can be electrically and / or mechanically connected.

  Further, the heat radiating metal plate may include connection means for fixing the drive circuit board to the LED board.

  In this case, it is possible to relieve mechanical stress and stress due to thermal expansion on an LED substrate generally made of ceramic or the like having low mechanical strength.

  Further, the connection means may be a terminal connection notch formed by notching and removing a terminal connection hole having a through hole structure or an LED substrate.

  When the connection means is a terminal connection hole having a through-hole structure, the electrical connection strength and the mechanical connection strength (adhesion degree) between the LED substrate and the drive circuit substrate can be improved. On the other hand, when the connection means is a notch for terminal connection formed by cutting out a part of the LED board and the drive circuit board, the LED board and the drive circuit board can be easily arranged at a preset position. Can be arranged.

  Moreover, the structure that the said metal terminal has penetrated the said hole for terminal connection or the notch for terminal connection may be sufficient.

  In this case, the LED board and the drive circuit board can be mechanically and / or electrically connected more easily.

  Moreover, it is preferable that the metal plate for heat dissipation is formed using Al alloy or Cu alloy, since the heat conductivity of the metal plate for heat dissipation can be increased.

  The drive circuit element mounting surface of the drive circuit board may be resin-sealed with a low-elasticity resin portion formed by potting low-elasticity resin.

  In this case, the heat generated by the drive circuit element can be radiated to the outside more efficiently.

  The electronic device of the present invention uses any one of the above-described lighting modules.

  Accordingly, an electronic device that is inexpensive, has a long life, and can be miniaturized while maintaining insulation can be obtained.

  Since the present invention is configured as described above, the illumination module has sufficient heat dissipation, is inexpensive, has a long life, and can be reduced in size while maintaining insulation, and an electronic device using the illumination module Equipment can be obtained.

  Hereinafter, embodiments of an illumination module of the present invention and an electronic device using the illumination module will be described.

<One Embodiment of Lighting Module>
First, an embodiment of the illumination module of the present invention will be described with reference to the drawings.

  FIG. 1 is an explanatory view showing an embodiment of an illumination module of the present invention, where FIG. 1 (a) is a top view and FIG. 1 (b) is a bottom view. 2 is a longitudinal sectional view taken along line AA in FIG. 1, and FIG. 3 is a longitudinal sectional view taken along line BB in FIG.

  As shown in FIG. 1, the illumination module of the present embodiment includes a plurality of LED elements 1, an LED substrate 2 on which these LED elements 1 are mounted, and a plurality of drive circuit elements 4 for driving the LED elements 1. (See FIG. 2) and a drive circuit board 5 on which the drive circuit elements 4 are mounted on the surface. As shown in FIG. 2, the LED board 2 and the drive circuit board 5 are connected to each other on the back surface of each board. They are in close contact with each other and integrated. The drive circuit board 5 has a three-layer structure including a heat radiating metal plate 5a, an insulating heat radiating resin plate 5b, and a wiring metal layer 5c forming electrodes and a wiring pattern, which are disposed on the back surface of the LED substrate 2. The metal plate 5 a is disposed on the back surface side of the drive circuit board 5, and the wiring metal layer 5 c is disposed on the front surface side of the drive circuit board 5.

  With such a configuration, the lighting module has sufficient heat dissipation, so that it is possible to obtain an illumination module that is inexpensive, has a long life, and can be miniaturized.

  Further, as shown in FIGS. 2 and 3, it is possible to provide a heat radiating member 14 such as a heat radiating grease or a heat radiating elastic sheet between the LED board 2 and the driving circuit board 5. Since the heat dissipation of 5 can be improved more, it is preferable.

  The illumination module further includes an insert case 20 that supports the integrated LED board 2 and drive circuit board 5, and a power supply line 10 for power supply for supplying power to the drive circuit board 5.

  The insert case 20 is a cylindrical member having a hollow portion 20b, and its transverse cross-sectional shape matches or substantially matches the shape of the surface of the drive circuit board 5 (the lower surface in FIGS. 2 and 3). The circuit board 5 is disposed on the lower surface side. The drive circuit element 4 of the drive circuit board 5 is disposed in the hollow portion 20b.

  The hollow portion 20b is resin-sealed with a low-elasticity resin portion 25 formed by filling and curing a low-elasticity resin (for example, silicone resin or urethane resin) having heat dissipation by potting. The drive circuit element mounting surface (front surface) of the drive circuit element 4 can be resin-sealed. By providing the low elastic resin portion 25, the heat generated by the drive circuit element 4 can be radiated to the outside more efficiently.

  The LED board 2 and the drive circuit board 5 have at least one terminal connection hole 23a as connection means for electrically connecting and / or mechanically connecting the drive circuit board 5 and the LED board 2. , 23b are formed. When the LED board 2 and the drive circuit board 5 are integrated, the terminal connection hole 23a of the LED board 2 overlaps with any one of the terminal connection holes 23b of the drive circuit board 5, and two terminal connections are made. A pair of service holes 23a and 23b form a single through hole 23.

  FIG. 4 is a top view showing an example of terminal connection holes formed in the LED board and the drive circuit board constituting the illumination module shown in FIG. FIG. 4 shows a state in which the LED board and the drive circuit board are integrated as seen from the LED board side.

  In FIG. 4, one terminal connection holes 23a and 23b are formed in the upper and lower portions of the LED board 2 and the drive circuit board 4, respectively.

  In addition, as shown in FIG. 2, a plurality of terminal receiving portions 20a are provided on the inner side surface of the insert case 20, and electrode terminals 19 formed of Cu alloy, Fe alloy or the like are provided on these terminal receiving portions 20a. Is arranged (fixed) by insert molding. Specifically, the plurality of terminal receiving portions 20a are respectively provided at positions facing the respective through holes 23, and the horizontal portion 19a of the L-shaped electrode terminal 19 is in contact with the lower surface of the terminal receiving portion 20a. The vertical portion 19b of the electrode terminal 19 sequentially penetrates the terminal receiving portion 20a and each through hole 23, and the tip portion protrudes from the surface of the LED substrate 2.

  Further, one end of a wire 18 such as an Al wire or an Au wire is electrically connected to the tip of the horizontal portion 19a, and the other end of the wire 18 is a wiring metal constituting the drive circuit board 5. It is connected to the output electrode of the layer 5c. The tip of the vertical portion 19 b is electrically connected to the input electrode of the LED substrate 2 formed around the terminal connection hole 23 via the solder portion 21.

  With such an electrical and mechanical connection configuration using the insert case 20, the drive circuit board 5 and the LED board 2 can be electrically connected, and the LED board 2 and the drive circuit board 5 are mechanically connected. It can be made to adhere more by connecting to. As a result, it is possible to reduce the size of the lighting module while ensuring the insulation between the drive circuit board 5 and the LED board 2 while realizing the long life of the LED element 1 and preventing the light emission performance from being lowered.

  The connection means is not limited to the terminal connection holes 23a and 23b shown in FIG.

  FIG. 5 is a top view showing another example of the connecting means formed on the LED board and the drive circuit board constituting the illumination module shown in FIG. FIG. 5 shows a state in which the LED board and the drive circuit board are integrated as seen from the LED board side.

  5, instead of the terminal connection holes 23a and 23b shown in FIG. 4, terminal connection notches 24a and 24b are formed in the peripheral portions of the LED substrate 2 and the drive circuit substrate 4, respectively.

  As shown in FIG. 4, when the connecting means are terminal connection holes 23a and 23b having a through-hole structure, the electrical connection strength and mechanical connection strength between the LED board 2 and the drive circuit board 4 ( (Adhesion degree) can be further improved. On the other hand, when the connection means is notch portions 24a and 24b for terminal connection formed by cutting out the upper and lower portions of the LED board 2 and the drive circuit board 4, as shown in FIG. A board | substrate and a drive circuit board | substrate can be arrange | positioned in the preset position of the insert case 20 more easily.

  FIG. 6 is an enlarged view showing a region C of FIG.

  As described above with reference to FIG. 2, the drive circuit board 5 has a heat radiation metal plate 5a, an insulating heat radiation resin plate 5b disposed on the back surface of the LED board 2, and a wiring metal forming electrodes and a wiring pattern. LED having a three-layer structure composed of the layer 5c, the heat dissipating metal plate 5a being disposed on the back surface side of the drive circuit board 5, and the wiring metal layer 5c being disposed on the front surface side of the drive circuit board 5 It is preferable because the heat generated by the element 1 and the drive circuit element 4 can be radiated more efficiently.

  The heat radiating metal plate 5a is preferably a thin plate formed using an alloy having high thermal conductivity (for example, Al alloy or Cu alloy), and the insulating heat radiating resin plate 5b is provided with insulating and heat radiating properties. It is preferable that it is a thin plate formed using a material having high properties (for example, an epoxy resin or an acrylic resin), and the wiring metal layer 5c is formed only by rolling or after rolling using, for example, a Cu alloy or an Al alloy. It is preferably formed by a plating method.

  FIG. 7 is a top view showing an example of fixing means formed on the drive circuit board constituting the illumination module of the present invention. FIG. 7 shows a state in which the drive circuit board is viewed from the heat radiating metal plate side, and only the outer shape of the LED board is shown using a broken line on the drive circuit board.

  As shown in FIGS. 1 and 7, the heat radiating metal plate 5 a of the drive circuit board 5 includes a plurality of extending portions 51 that protrude outward from the end face of the LED substrate 2. Are formed with at least one module fixing hole 51a as a fixing means for fixing the lighting module to the lighting device and the lightning device. These module fixing holes 51a are formed in order to insert bolts when the lighting modules are fixed to the lighting equipment and lightning equipment with bolts or the like. In this way, by forming the module fixing hole 51a in the heat radiating metal plate 5a, the heat radiating metal is generally not tightened on the LED substrate 2 formed of ceramic or the like having low mechanical strength. The lighting module can be fixed to the lighting device and the lightning device only by the plate 5a, and the work of attaching the lighting module to the lighting device and the lightning device becomes easy.

  1 and 7, extension portions 51 are respectively provided at the left and right ends of the heat radiating metal plate 5a of the drive circuit board 5, and two extension holes 51a are provided in each extension portion 51, respectively. Is formed.

  Further, the fixing means is not limited to the module fixing hole 51a shown in FIGS.

  FIG. 8 is a top view showing another example of fixing means formed on the drive circuit board constituting the illumination module of the present invention. FIG. 8 shows a state in which the drive circuit board is viewed from the heat radiating metal plate side, and only the outer shape of the LED board is shown on the drive circuit board using broken lines.

  In FIG. 8, a module fixing notch 51b is formed instead of the module fixing hole 51a.

  When the connecting means is a module fixing hole 51a having a through-hole structure as shown in FIG. 7, the lighting module can be more firmly fixed to the lighting device and the lightning device. In the case of the module fixing cutout portion 51b formed by cutting out the end portion of the portion 51, the lighting module can be more easily disposed in the lighting device and the lightning device, and the time required for the fixing work can be reduced. It can be shortened.

  Although not shown, extended portions projecting outward from the end surface of the LED substrate 2 are provided at the upper and lower ends of the heat radiating metal plate 5a of the drive circuit board 5, and only these extended portions are shown in FIG. 5 or a terminal connection notch as shown in FIG. 5, and the metal terminal 19 may be inserted into the terminal connection hole or the terminal connection notch. In this case, it is necessary to provide a wire for electrically connecting the tip of the metal terminal 19 and the input electrode of the LED substrate 2 instead of the solder portion 21. With such a configuration, it is possible to relieve mechanical stress and stress due to thermal expansion on an LED substrate that is generally made of ceramic or the like having low mechanical strength.

<One Embodiment of Electronic Device>
Next, an embodiment of an electronic apparatus according to the present invention will be described with reference to the drawings.

  FIG. 9 is a cross-sectional explanatory view showing one embodiment of the electronic apparatus of the present invention.

  The electronic device of the present embodiment is, for example, a lighting device or a lightning device, and here, description will be made using the lighting device.

  The lighting device, which is an embodiment of the electronic device of the present embodiment, includes a lighting module 31 having the same configuration as in FIG. 3, a cover case 32 that houses and supports the lighting module 31 and protects the lighting module 31, and The lens 33 is disposed in the opening.

  A power supply terminal block 34 having a power supply terminal (not shown) for connecting an external power supply is arranged outside the lower surface of the cover case 32. The power supply terminal and the power supply line 10 for power supply of the illumination module 31 Electrically connected.

  Further, the cover case 32 is formed with a stepped portion 32a on the inner side so that the thickness of the lower portion of the side surface is larger than that of the upper portion of the side surface, and the heat radiating metal plate 5a of the illumination module 31 is formed on the stepped portion 32a. The extending portion 51 is mounted and fixed.

  A screw-cut nut hole 32a1 is formed on the upper surface of the stepped portion 32a. By tightening the bolt 35 in a state where the module fixing hole 51a and the nut hole 32a1 of the extended portion 51 are aligned with each other, The illumination module 31 can be fixed to the cover case 32.

  Note that the lighting module 31 may be fixed to the cover case 32 using a connector or a positioning pin and a spring mechanism instead of the bolt 35.

  Since the electronic apparatus of the present embodiment has such a configuration, it can be downsized.

  The illumination module of the present invention and an electronic device using the illumination module can be utilized when downsizing electronic devices such as illumination devices and lightning devices.

It is explanatory drawing which shows one Embodiment of the illumination module of this invention. FIG. 2 is a vertical sectional view taken along line AA in FIG. 1. It is a BB line longitudinal cross-sectional view of FIG. It is a top view which shows an example of the hole for a terminal connection formed in the LED board and drive circuit board which comprise the illumination module shown in FIG. It is a top view which shows the other example of the connection means formed in the LED board and drive circuit board which comprise the illumination module shown in FIG. It is an enlarged view which shows the area | region C of FIG. It is a top view which shows an example of the fixing means formed in the drive circuit board | substrate which comprises the illumination module of this invention. It is a top view which shows the other example of the fixing means formed in the drive circuit board | substrate which comprises the illumination module of this invention. It is a section explanatory view showing one embodiment of electronic equipment of the present invention. It is a longitudinal cross-sectional view which shows an example of the conventional lighting equipment. It is a longitudinal cross-sectional view which shows an example of the conventional LED lighting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED element 2 LED board 4 Drive circuit element 5 Drive circuit board 5a Heat radiation metal plate 5b Insulating heat radiation resin plate 5c Wiring metal layer 51 Extension part 51a Module fixing hole 51b Module fixing notch part 10 Power supply for power supply Wire 14 Heat radiation member 18 Wire 19 Electrode terminal 20 Insert case 20a Terminal receiving part 20b Hollow part 21 Solder part 23 Through hole 23a, 23b Terminal connection hole 24a, 24b Notch part 25 for terminal connection Low elastic resin part 31 Lighting module 32 Cover case 33 Lens

Claims (13)

An LED element that converts a voltage into light, an LED board on which the LED element is mounted, a drive circuit element that drives the LED element, and a drive circuit board that has the drive circuit element mounted on the surface In the lighting module,
The illumination module, wherein the LED substrate and the drive circuit substrate are closely adhered and integrated in a state where the back surfaces of the substrates are opposed to each other.   2. The illumination module according to claim 1, wherein the drive circuit board is composed of a heat radiating metal plate, an insulating heat radiating resin plate, and a wiring metal layer.   The illumination module according to claim 2, wherein the heat dissipating metal plate is provided with a fixing means for fixing an electronic device.   4. The illumination module according to claim 1, further comprising an insert case for supporting the LED substrate and the drive circuit substrate, wherein a metal terminal is fixed to the insert case by insert molding, and the metal terminal is interposed therebetween. The output module of the drive circuit board and the input electrode of the LED board are electrically connected.   5. The illumination module according to claim 1, wherein a radiation grease or a radiation elastic body sheet is provided between the LED board and the drive circuit board.   6. The illumination module according to claim 1, 2, 3, 4, or 5, wherein the LED board includes connection means for fixing the LED board to a drive circuit board.   6. The illumination module according to claim 1, wherein the drive circuit board includes connection means for fixing the drive circuit board to the LED board.   4. The illumination module according to claim 2, wherein the heat radiating metal plate includes connection means for fixing the drive circuit board to the LED board.   9. The illumination module according to claim 6, 7 or 8, wherein the connection means is a terminal connection notch formed by notching and removing a terminal connection hole having a through-hole structure or an LED substrate.   The lighting module according to claim 9, further comprising an insert case for supporting the LED substrate and the drive circuit substrate, wherein a metal terminal is fixed to the insert case by insert molding, and the metal terminal is connected to the terminal connection hole. Or the illumination module which has penetrated the notch part for terminal connection.   3. The illumination module according to claim 2, wherein the heat radiating metal plate is formed using an Al alloy or a Cu alloy.   12. The illumination module according to claim 1, wherein the drive circuit element mounting surface of the drive circuit board is sealed with a low elastic resin portion formed by potting a low elastic resin. Lighting module.   An electronic device using the illumination module according to any one of claims 1 to 12.

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