JP2012018881A - Lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that in the case of a lighting fixture in which a light-emitting element is mounted on a substrate and the substrate is connected to a heat radiation member by heat conduction grease etc., since the light-emitting element has large heat generation, and since an insulation layer inside the metal substrate and the heat conduction grease etc. are interposed between the light-emitting element and the heat radiation member, high heat radiation is difficult.SOLUTION: A solder pattern is directly formed on an upper face of the heat radiation part and the light-emitting element is directly mounted on the solder pattern, while the upper face of the heat radiation part is formed by a combination of solid surfaces instead of plane shapes, and the light-emitting element is located so as to be along the solid surfaces, thereby, an irradiation angle of the light-emitting element is established in a slope or a side face direction of the lighting fixture.

Description

The present invention relates to a lighting apparatus including a light emitting element such as an LED.

Conventionally, it is known that a lighting device provided with a light emitting element such as an LED having higher luminance has a large heat generation of the light emitting element. As a heat dissipation method for the light emitting element, the light emitting element is mounted on a substrate. In addition, there is known one in which the substrate is connected to a heat radiating member with heat conductive grease or the like.

For example, in Japanese Patent Application Laid-Open No. 2008-293966 (hereinafter “Patent Document 1”), a substrate having an inner surface, an outer surface opposite to the inner surface, and a bottom, and a ring connected to the periphery of the transport unit and the transport unit. A plurality of substrates each having a frame, the transport unit having a plurality of openings, and a plurality of wire units each disposed in the openings, each of which includes a wire and an insulating material covering the periphery of the wires. A plurality of LED chips arranged in the wire unit, and a plurality of LED chips electrically connected to the corresponding wires, and two LED chips arranged in the bottom part of the substrate. A light emitting diode (LE) comprising: a lamp base provided with a power contact; and a control circuit module disposed between the substrate and the lamp base and electrically connected to the wire and the two power contacts. ) Is a lamp. The substrate is made of a metal material, and the metal material is made of copper, a copper alloy, aluminum, an aluminum alloy, a composite material formed of copper or a copper alloy, and a composite material formed of aluminum or an aluminum alloy. Selected from the group.

The substrate further includes a light reflecting film disposed on the inner surface of the substrate, and the material of the light reflecting film is selected from the group consisting of silver, aluminum, stainless steel, and nickel. Further, the insulating material is selected from the group consisting of a polymerized material, glass and ceramic.

The LED chip is electrically connected to a corresponding wire by a wire bonding technique, or the LED chip is electrically connected to a corresponding wire by a flip chip bonding technique. Further, the lamp base is a screw-in lamp base, or the lamp base is an insertion lamp base.

In addition, a heat dissipating element is provided on the outer surface of the substrate, and the heat dissipating element is selected from the group consisting of a plurality of heat dissipating fins and heat pipes. Furthermore, an LED lamp having a molding material that is disposed inside the substrate and covers the LED chip has been proposed. In addition, as other conventional examples relating to heat dissipation measures for light emitting elements, there are several inventions such as Japanese Patent Application Laid-Open No. 2010-45030 (hereinafter “Patent Document 2”) and Japanese Patent Application Laid-Open No. 2010-16233 (hereinafter “Patent Document 3”). Proposed.

JP 2008-293966 A JP 2010-45030 A JP 2010-16233 A

However, the above-described conventional lighting fixture has the following problems. That is, in the LED lamp of Patent Document 1, it is necessary to use a substrate-shaped transport unit made of a conductive metal and an insulating material, and further, it is necessary to electrically connect the LED and the transport unit with a wire. There is a problem in that a transport unit that is a necessary component is necessary and the number of manufacturing steps is further increased. Also, in the case where the light emitting element is mounted on the substrate and the substrate is connected to the heat radiating member with heat conductive grease or the like, the insulating layer in the metal substrate and the heat conductive grease or the like are interposed between the light emitting element which is a heat generating component and the heat radiating member. Therefore, there is a problem that high heat dissipation is difficult. Also, in other prior examples, as typified by Patent Document 2 or Patent Document 3, a circuit board or a heat conducting member is interposed between the light emitting element serving as a heating element and the heat radiating portion, so that a further heat radiation effect can be obtained. Improvement is desired.

The present invention has been made in view of the above problems, and a first object is to efficiently dissipate heat from the light emitting element, and a second object is to expand the light desired by consumers in addition to the first object. It is to provide a luminaire that can be designed accordingly.

In order to solve the above problems, the present invention is configured as follows. That is, in the invention of claim 1, in a lighting device including a heat radiating portion formed of a ceramic material and a light emitting element on the upper surface of the heat radiating portion, and a driving circuit for the light emitting element as a single package, A lighting device is characterized in that a solder pattern is directly formed on the upper surface of the heat dissipating part, and the light emitting element is directly mounted on the solder pattern.

According to a second aspect of the present invention, there is provided a heat dissipating part made of a ceramic material having a substantially cylindrical axial end surface as a heat dissipating member upper surface and a substantially flat surface, and a light emitting element on the heat dissipating member upper surface. In a lighting fixture having a cover provided so as to cover the upper surface of the part, and a board housing part that houses a drive circuit for controlling light emission driving of the light emitting element on the other end surface of the heat radiating part. Is provided with a wiring pattern for connecting the light emitting element and the driving circuit, and the wiring pattern is formed by a solder pattern for directly routing the solder on the upper surface of the ceramic material, and the light emitting element is directly mounted on the solder pattern. It is set as the lighting fixture characterized by this.

In the above configuration, a plurality of light emitting elements may be mounted, and the light emitting elements may be connected with a solder pattern, or the solder pattern may be soldered by ultrasonic waves. Moreover, even if the irradiation angle of the light emitting element is set in the inclined or side surface direction of the lighting fixture by forming the upper surface of the heat radiating unit by a combination of solid surfaces instead of a planar shape, and positioning the light emitting elements along the solid surface. Good.

As described above, a solder pattern is directly formed on the upper surface of the heat dissipating part, and a light emitting element is directly mounted on the solder pattern, and the upper surface of the heat dissipating part is formed by a combination of three-dimensional surfaces instead of a planar shape. By positioning along the three-dimensional surface, the irradiation angle of the light emitting element is set in the direction of the slope or side of the lighting fixture, and the heat dissipation area is expanded, so that an insulating member is unnecessary and the spread of light desired by the consumer Therefore, it is possible to design a lighting fixture that can efficiently perform heat dissipation of the light emitting element.

The disassembled perspective view of the lighting fixture made into the Example of this invention is shown. FIG. 2 shows a side sectional view after assembly of FIG. 1. The figure which attached the light emitting element on the heat sink upper surface of the 1st Example of this invention is shown. 2 shows a second embodiment of the present invention. 3 shows a third embodiment of the present invention. Side surface sectional drawing of the conventional lighting fixture is shown.

Hereinafter, examples showing embodiments of the present invention will be described with reference to FIGS.

Next, examples of the present invention will be described. FIG. 1 is an exploded perspective view of parts before assembling a lighting fixture according to an embodiment of the present invention, and FIG. 2 is a side sectional view after assembling. The luminaire of the present invention is a luminaire used for an incandescent bulb, a fluorescent lamp, a fluorescent lamp stand or the like conventionally illuminated by a base.

As shown in FIGS. 1 and 2, the lighting fixture of the present invention uses a surface-mounted light emitting element 40 such as an LED as a light source, and the light emitting element is on the heat dissipating part upper surface 31 of the heat dissipating part 30 occupying most of the outer structure. The heat dissipating portion upper surface 31 is covered with a substantially hemispherical cover 20 that serves as a light spreading and protection of the light emitting element 40. The heat dissipating part 30 is, for example, a molding made of a ceramic material made of alumina. In order to increase the heat dissipating effect, heat dissipating fins 32 are integrally formed on the outer periphery of the side surface, and one end surface of the substantially cylindrical axial direction is used as the upper surface of the heat dissipating part. A substantially planar shape is formed. Further, the inside of the heat radiating portion 30 is hollow, and a drive circuit 60 for controlling the turning-off or dimming of the light emitting element 40 is disposed in this space. Usually, the drive circuit 60 is accommodated in the substrate accommodating portion 70 and is shaped so that the outer peripheral wall of the substrate accommodating portion 70 fits into the inner peripheral wall of the heat radiating portion 32. In the present embodiment, the substrate housing portion 70 is formed by molding a resin material. Further, a base 80 serving as a power supply terminal is provided at the lower end of the substrate housing portion 70 as in the prior art, and the base 80, the drive circuit 60, and the light emitting element 40 are electrically connected.

Next, as a first embodiment of the present invention, a mounting structure of the light emitting element 40 will be described with reference to FIG. FIG. 3 is a top view of the above-described upper surface 31 of the heat radiating portion as viewed from above, and the cover 20 is in a removed state. In FIG. 3, a direct wiring pattern (hereinafter referred to as “solder pattern 50”) is formed on the heat radiating portion upper surface 30 of the heat radiating portion 30 integrally formed of a ceramic material using an ultrasonic soldering iron. In the first embodiment, four surface-mounted LEDs are provided as the light-emitting elements 40, and the respective light-emitting elements are arranged so as to be connected in series. The drive circuit connection portion 33 on the top surface 31 is connected to the drive circuit 60. For example, as shown in FIG. 2, the connection extends from the upper surface 31 of the heat radiating portion to the heat radiating portion 30 to reach the drive circuit.

Next, the manufacturing method of the light emitting element mounting part of the lighting fixture of a present Example is described. In this embodiment, the heat radiating portion is integrally formed of a ceramic material, and the solder pattern 50 is drawn around the upper surface 31 in advance using an ultrasonic soldering iron. Thereafter, the surface-mounted light emitting device 40 is mounted in a pattern, and then the electrodes of the light emitting device 40 are subjected to a reflow process using a general molten solder process or cream solder to fix the light emitting element 40 on the solder pattern 50 and to electrically Complete the connection.

With the above configuration, since the wiring pattern can be directly routed on the ceramic material forming the heat radiation part 30, inclusions such as an electrical insulating member or an adhesive necessary for installing a conventional wiring board are omitted. In other words, the heat of the light emitting element 40 that is a heating element is directly transmitted to the heat radiating unit 30.

Next, a second embodiment of the present invention will be described with reference to FIG. In FIG. 4, the heat dissipating part upper surface 31 formed in a planar shape in the first embodiment is three-dimensionally formed. In FIG. 4, the light emitting element 40 is formed along the slope 34 so that the solder pattern 50 formed on the slope 34 connects the light emitting elements 34 in series. The inclined surface 34 is formed integrally with the heat dissipating part by a ceramic material forming the heat dissipating part 30, and in this embodiment, the light axis of the light emitting element 40, that is, the irradiation angle can be inclined, In addition to being able to design a luminaire according to the desired spread of light, it is possible to realize a larger heat radiation area compared to the upper surface of the flat heat radiation portion as in the first embodiment, and the light emitting element The further heat dissipation effect can be expected. Since other structures are the same as or equivalent to those of the first embodiment described above, description thereof will be omitted.

Next, a third embodiment of the present invention will be described with reference to FIG. In FIG. 5, similar to the second embodiment, the heat dissipating portion upper surface 31 formed in a planar shape in the first embodiment has a three-dimensional structure, and the light emitting element 40 is formed substantially perpendicular to the heat dissipating portion upper surface 31. The solder pattern 50 formed on the upper surface wall 35 is formed along the upper surface wall 35 so as to connect the light emitting elements 34 in series. The upper surface wall 35 is formed integrally with the heat radiating portion by a ceramic material forming the heat radiating portion 30, and in this embodiment, the optical axis, that is, the irradiation angle of the light emitting element 40 can be inclined, It is possible not only to design lighting fixtures according to the desired spread of light, but also to realize a larger heat radiation area compared to the upper surface of the flat heat radiation portion as in the first embodiment, and to emit light A further heat dissipation effect of the element can be expected. Since other structures are the same as or equivalent to those of the first embodiment described above, description thereof will be omitted.

The light emitting element 40 described in each of the above embodiments is not limited to a surface mount type LED, but can be replaced as long as other light emitting elements cause a problem of heat generation. It is not limited to the number of examples. Further, the heat radiating portion formed of alumina may be replaced with another ceramic material that can realize electrical insulation, and the presence or absence of fins, the shape of the cover, etc. are not limited to the above, and the present invention is an insulating material. If a wiring pattern is directly formed on a certain ceramic material by soldering and a light emitting element is mounted thereon, the same effect can be obtained even if the above configuration is appropriately changed.

DESCRIPTION OF SYMBOLS 10 Illuminating device 20 Cover 30 Radiation part 31 Radiation part upper surface 32 Radiation fin 33 Drive circuit connection part 34 Slope 35 Upper surface wall 40 Light emitting element 50 Solder pattern 60 Drive circuit 70 Substrate accommodating part 80 Base

Claims (5)

A light-emitting element is disposed on the heat dissipating part formed from the ceramic material and the upper surface of the heat dissipating part,
In a luminaire provided with the drive circuit of the light emitting element as one package,
A solder pattern is directly formed on the upper surface of the heat dissipation part,
A lighting apparatus, wherein the light emitting element is directly mounted on the solder pattern. A heat dissipating part made of a ceramic material having a substantially cylindrical axial end surface as a heat dissipating part upper surface, and a cover provided to cover the heat dissipating part upper surface with a light emitting element on the heat dissipating part upper surface. ,
In the luminaire provided with a substrate housing portion for housing a drive circuit for controlling light emission driving of the light emitting element on the other end surface of the heat radiating portion,
A wiring pattern for connecting the light emitting element and the drive circuit is applied to the upper surface of the heat dissipation part,
The lighting device is characterized in that the wiring pattern is formed by a solder pattern that directly draws solder on an upper surface of a ceramic material, and the light emitting element is directly mounted on the solder pattern. The lighting apparatus according to claim 1 or 2, wherein a plurality of light emitting elements are mounted, and the light emitting elements are connected by a solder pattern.   The lighting fixture according to claim 1, wherein the solder pattern is formed by an ultrasonic soldering method. Form the upper surface of the heat dissipation part with a combination of solid surfaces instead of flat
The lighting fixture according to any one of claims 1 to 4, wherein an irradiation angle of the light emitting element is set in a slope or side direction of the lighting fixture by positioning the light emitting device along the three-dimensional plane.

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