WO2012024868A1 - 一种以回收金属饮料罐为散热基体的led灯 - Google Patents

一种以回收金属饮料罐为散热基体的led灯 Download PDF

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WO2012024868A1
WO2012024868A1 PCT/CN2010/079057 CN2010079057W WO2012024868A1 WO 2012024868 A1 WO2012024868 A1 WO 2012024868A1 CN 2010079057 W CN2010079057 W CN 2010079057W WO 2012024868 A1 WO2012024868 A1 WO 2012024868A1
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lamp
cup body
circuit board
metal
lamp cup
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PCT/CN2010/079057
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French (fr)
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陈诺成
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厦门汇耕电子工业有限公司
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]

Definitions

  • the invention relates to the field of LED lamp illumination, and in particular to an LED lamp with a metal beverage can as a heat dissipation base.
  • metal beverage cans such as Coca-Cola, Pepsi, Tsingtao Beer, Budweiser beer and other aluminum beverage cans, and Wahaha, Red Bull, Wang Laoji and other tinplate beverage cans, etc.
  • metal beverage cans after recycling by the waste station, most of them are first melted. It is purified into a metal material and processed through a series of metal foils before it can be recycled. It can be seen that the metal beverage cans inevitably consume a large amount of secondary energy in the process of recycling, which obviously deviates from the low-carbon environmental protection advocates advocated by today's society.
  • the thermal conductivity of metal materials is greater than 60w/m.k.
  • aluminum beverage cans because it is made of pure aluminum, it is a good heat carrier material with a thermal conductivity of 237. w/m.k.
  • LED lamps as their volume shrinks and their power increases, more and more heat is generated, and the heat generated by LED lamps will affect their light and service life. When the LED overheats, its light will dim, the color will become lighter, and its service life will be shortened accordingly. It can be seen that if some metal beverage cans, especially aluminum beverage cans, can be applied to LED lamps, the heat dissipation performance of the LEDs will be greatly improved.
  • the object of the present invention is to overcome the deficiencies of the prior art and provide an LED lamp with a metal beverage can as a heat dissipation substrate, and a metal beverage can, especially an aluminum beverage can, is applied to the LED lamp, thereby achieving low carbon environmental protection. It is also required to improve the heat dissipation effect of the LED lamp.
  • an LED lamp with a metal beverage can as a heat dissipation base comprising a lamp cap, a lamp cup body, a circuit board with a LED and a lamp cover;
  • the lamp cap passes through the insulating plastic shell and the lamp One end of the cup body is fixedly connected, the lamp cover is fixedly connected to the other end of the lamp cup body, and the circuit board is coupled to the lamp cup body and accommodated in the cavity enclosed by the lamp cup body and the lamp cover;
  • the lamp cup body is directly recycled a metal beverage can, and one end of the metal beverage can is used as a metal mounting surface coupled to the circuit board, the circuit board is a copper substrate, and the copper foil layer of the circuit board base is fixed to the metal mounting surface of the metal beverage can by an adhesive.
  • the recycled metal beverage can is a recycled aluminum beverage can.
  • the adhesive is an insulating thermal conductive adhesive; an end surface of the lamp cup body is adhered and fixed to the copper foil layer of the circuit board through the insulating thermal conductive adhesive.
  • the adhesive is a tin material; a metal plating layer is plated on one side of the outer surface of the lamp cup body, and the metal plating layer of the lamp cup body is soldered and fixed to the copper foil layer of the circuit board through the solder material.
  • the outer side of one end surface of the lamp cup body is obtained by electroless plating or vapor deposition or sputtering to obtain a metal plating layer.
  • the LED lamp of the invention for recycling the metal beverage can is a heat-dissipating substrate, and the lamp cup body and the circuit board can be fixed by using a soldering process or a method of bonding with an insulating and thermal conductive adhesive.
  • the use of the insulating thermally conductive adhesive as an adhesive between the body of the lamp cup and the circuit board is more advantageous than the use of tin as an adhesive between the body of the lamp cup and the circuit board.
  • the insulating thermal conductive adhesive is an adhesive with certain electrical conductivity after curing or drying, and the thermal conductive filler can be powder of gold, silver, copper, aluminum, zinc, iron, nickel and graphite and some conductive compounds are The main component, through the bonding action of the matrix resin, combines the heat conductive particles to form a conductive path to realize the conductive connection of the material to be bonded.
  • the matrix resin of the insulating thermal conductive adhesive is an adhesive, it can be bonded at a suitable curing temperature, for example, the epoxy resin adhesive can be cured at room temperature to 150 ° C, which is much lower than 200 soldered by solder.
  • the soldering temperature above °C avoids material deformation caused by soldering high temperature, heat loss of electronic devices and formation of internal stress.
  • the minimum pitch of 0.65mm soldered solder can not meet the actual needs of conductive connections, and insulation.
  • Thermal paste can be made into a slurry for high line resolution.
  • the insulating thermal conductive adhesive also has the characteristics of simple processing, easy operation, and improved production efficiency, thereby achieving an ideal choice for thermal conduction connection.
  • the invention has the beneficial effects that since the recycled metal beverage can is directly used as the lamp cup body, one end of the metal beverage can is used as a metal mounting surface coupled to the circuit board, and the copper foil layer of the circuit board base is passed through the adhesive.
  • the invention ensures that the invention not only realizes a complete metallization structure, but also improves the heat dissipation performance of the LED lamp, effectively controls the heating temperature of the LED lamp, and can recycle the metal beverage can, thereby achieving low carbon and environmental protection. Economic requirements.
  • an LED lamp of the present invention which uses a recycled metal beverage can as a heat-dissipating substrate is not limited to the embodiment.
  • Figure 1 is a schematic view of the structure of the present invention.
  • an LED lamp with a recycled metal beverage can as a heat dissipation substrate, comprising a lamp cap 1, an insulating plastic shell 2, a lamp cup body 3, a circuit board 4 with an LED, and a lampshade 5;
  • the lamp cap 1 is fixed to one end of the lamp cup body 3 through the insulating plastic shell 2,
  • the lamp cover 5 is fixedly connected to the other end of the lamp cup body 3, and
  • the circuit board 4 is coupled to the lamp cup body 3 and accommodated in the lamp cup body 3 and a cavity enclosed by the lampshade 5;
  • the lamp cup body 3 directly adopts a recycled metal beverage can, and one end of the metal beverage can is used as a metal mounting surface coupled to the circuit board 4, and the circuit board 4 is a copper substrate
  • the copper foil layer of the circuit board substrate is fixed to the metal mounting surface of the metal beverage can by an adhesive.
  • the recycled metal beverage can is a recycled aluminum beverage can
  • the adhesive may be an insulating thermal conductive adhesive or a tin; when the adhesive is an insulating thermal conductive adhesive, one end of the lamp cup body 3 is adhered and fixed to the back surface of the circuit board 4 through the insulating thermal conductive adhesive; When the adhesive is a tin material, since the lamp cup body 3 is a recycled aluminum beverage can, the outer side of one end of the lamp cup body 3 is plated with a metal plating layer to increase the surface of one end of the aluminum beverage can. Solderability, the lamp cup body 3 can be welded and fixed to the copper foil layer of the circuit board base through the metal plating layer;
  • the outer side of one end surface of the lamp cup body 3 is obtained by electroless plating or vapor deposition or sputtering to obtain a metal plating layer.
  • the LED lamp of the present invention uses a recycled metal beverage can as a heat dissipating substrate.
  • an insulating thermal conductive adhesive is used as an adhesive between the lamp cup body and the circuit board, because the insulating thermal adhesive is a curing or Adhesive with certain conductivity after drying, and its thermal conductive filler can be powder of gold, silver, copper, aluminum, zinc, iron, nickel and graphite and some conductive compounds as main components, through the bonding of matrix resin The heat conductive particles are combined to form a conductive path to achieve an electrically conductive connection of the material to be bonded.
  • the matrix resin of the insulating thermal conductive adhesive is an adhesive, it can be bonded at a suitable curing temperature, for example, the epoxy resin adhesive can be cured at room temperature to 150 ° C, which is much lower than 200 soldered by solder.
  • the soldering temperature above °C avoids material deformation caused by soldering high temperature, heat loss of electronic devices and formation of internal stress.
  • the minimum pitch of 0.65mm soldered solder can not meet the actual needs of conductive connections, and insulation.
  • Thermal paste can be made into a slurry for high line resolution.
  • the insulating thermal conductive adhesive also has the characteristics of simple processing, easy operation, and improved production efficiency, thereby achieving an ideal choice for thermal conduction connection.
  • the invention adopts a recycled metal beverage can, in particular a recycled aluminum beverage can, as a lamp cup body of an LED lamp, and uses an adhesive, in particular an insulating thermal adhesive, to form a lamp cup body and a circuit board composed of the recovered metal beverage can.
  • the copper foil layer of the base body is bonded or fixed by welding, so that the invention not only realizes a complete metallization structure, but also improves the heat dissipation performance of the LED lamp, effectively controls the heating temperature of the LED lamp, and can recover the metal beverage can. Utilization, to meet the requirements of low carbon, environmental protection and economy.
  • the invention directly adopts the recovered metal beverage can as the lamp cup body, and the bottom end of the metal beverage can is used as a metal mounting surface coupled with the circuit board, and is adhered to the copper foil layer of the circuit board base through the adhesive to recover
  • the metal beverage can is a heat-dissipating substrate, which improves the heat dissipation performance of the LED lamp, enables the heating temperature of the LED lamp to be effectively controlled, and can recycle the metal beverage can to achieve low carbon, environmental protection and economic requirements.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

一种以回收金属饮料罐为散热基体的LED灯 技术领域
本发明涉及LED灯照明领域,特别是涉及一种以回收金属饮料罐为散热基体的LED灯。
背景技术
我们知道,一些金属质饮料罐,如可口可乐、百事可乐、青岛啤酒、百威啤酒等铝质饮料罐,及娃哈哈、红牛、王老吉等马口铁材质饮料罐等,经废品站回收后,大多是先经过熔炼、提纯成金属材质,再经过一系列的金属箔材加工,才得以回收利用的。可见,金属质饮料罐在回收利用的过程中不可避免地会耗用大量的二次能源,这显然与当今社会所大力提倡的低碳环保的主体相背离。
我们还知道,金属材质的导热系数大于60w/m.k,特别的,对于铝质饮料罐,由于它由纯铝材质制作而成,因而它是很好的散热载体材料,它的导热系数为237 w/m.k。对于LED灯而言,随着其体积的日益缩小,以及其功率的日渐增大,其产生的热量越来越多,而LED灯产生的热量又会对其光线及使用寿命产生影响,如当LED过热时,其光线会变暗,颜色会变浅,同时,其使用寿命也会相应缩短。可见,如果能够将一些金属质饮料罐,特别是铝质饮料罐应用于LED灯中,则将使LED的散热性能大大提高。
发明内容
本发明的目的在于克服现有技术之不足,提供一种以回收金属饮料罐为散热基体的LED灯,将金属饮料罐,特别是铝质饮料罐应用于LED灯中,既达到低碳环保的要求,又能够从中改善LED灯的散热效果。
本发明解决其技术问题所采用的技术方案是:一种以回收金属饮料罐为散热基体的LED灯,包括灯头、灯杯本体、装有LED的电路板和灯罩;灯头通过绝缘塑壳与灯杯本体的一端相固接,灯罩与灯杯本体的另一端相固接,电路板联接于灯杯本体上并容纳于灯杯本体和灯罩所围成的腔内;该灯杯本体直接采用回收的金属饮料罐,并将金属饮料罐的一端作为与电路板相联接的金属安装面,该电路板为铜基板,电路板基体的铜箔层通过接着剂与金属饮料罐的金属安装面相固接。
所述的回收金属饮料罐为回收铝质饮料罐。
所述的接着剂为绝缘导热胶;所述灯杯本体的一端面通过该绝缘导热胶与所述电路板的铜箔层相粘接固定。
所述的接着剂为锡料;所述灯杯本体的一端面外侧镀有一金属镀层,所述灯杯本体的金属镀层通过该锡料与所述电路板的铜箔层相焊接固定。
所述的灯杯本体的一端面外侧通过化学镀电镀或蒸镀或溅镀获得金属镀层。
本发明的一种以回收金属饮料罐为散热基体的LED灯,可以采用锡料焊接的工艺或采用绝缘导热胶粘接的工艺使灯杯本体与电路板相固接。但以绝缘导热胶作为灯杯本体与电路板之间的接着剂,比用锡料作为灯杯本体与电路板之间的接着剂更具有优势。这是因为绝缘导热胶是一种固化或干燥后具有一定导电性能的胶黏剂,且其导热填料可以是金、银、铜、铝、锌、铁、镍的粉末和石墨及一些导电化合物为主要组成成分,通过基体树脂的粘接作用,把导热粒子结合在一起,形成导电通路,实现被粘材料的导电连接。此外,由于绝缘导热胶的基体树脂是一种胶黏剂,可以选择适宜的固化温度进行粘接,如环氧树脂胶黏剂可以在室温至150℃下固化,远低于锡料焊接的200℃以上的焊接温度,这就避免了焊接高温可能导致的材料变形、电子器件的热损耗和内应力的形成。同时,随着电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展,锡料焊接的0.65mm的最小节距远远满足不了导电连接的实际需求,而绝缘导热胶可以制成浆料,实现很高的线分辨率。绝缘导热胶还具有加工工艺简单、易于操作、可提高生产效率等特点,从而实现了导热连接的理想选择。
本发明的有益效果是,由于直接采用回收的金属饮料罐作为灯杯本体,并将金属饮料罐的一端作为与电路板相联接的金属安装面,通过接着剂与电路板基体的铜箔层相固接,使得本发明不仅实现了完全的金属化结构,提高了LED灯的散热性能,使LED灯的发热温度得到有效控制,而且能够对金属饮料罐加以回收利用,达到了低碳、环保、经济的要求。
以下结合附图及实施例对本发明作进一步详细说明;但本发明的一种以回收金属饮料罐为散热基体的LED灯不局限于实施例。
附图说明
图1是本发明的结构示意图。
具体实施方式
实施例,请参见附图所示,本发明的一种以回收金属饮料罐为散热基体的LED灯,包括灯头1、绝缘塑壳2、灯杯本体3、装有LED的电路板4和灯罩5;灯头1通过绝缘塑壳2与灯杯本体3的一端相固接,灯罩5与灯杯本体3的另一端相固接,电路板4联接于灯杯本体3上并容纳于灯杯本体3和灯罩5所围成的腔内;该灯杯本体3直接采用回收的金属饮料罐,并将金属饮料罐的一端作为与电路板4相联接的金属安装面,该电路板4为铜基板,电路板基体的铜箔层通过接着剂与金属饮料罐的金属安装面相固接。
其中,
作为一种优选,所述的回收金属饮料罐为回收铝质饮料罐;
所述的接着剂可为绝缘导热胶或锡料;当该接着剂为绝缘导热胶时,所述灯杯本体3的一端通过该绝缘导热胶与所述电路板4的背面相粘接固定;当该接着剂为锡料时,由于灯杯本体3为回收的铝质饮料罐,因此,该灯杯本体3的一端外侧需镀上一金属镀层,以增大铝质饮料罐一端表面的可焊性,则该灯杯本体3即可通过该金属镀层与所述电路板基体的铜箔层相焊接固定;
所述的灯杯本体3的一端面外侧是通过化学镀电镀或蒸镀或溅镀获得金属镀层的。
本发明的一种以回收金属饮料罐为散热基体的LED灯,作为一种优选,采用绝缘导热胶作为灯杯本体与电路板之间的接着剂,这是因为绝缘导热胶是一种固化或干燥后具有一定导电性能的胶黏剂,且其导热填料可以是金、银、铜、铝、锌、铁、镍的粉末和石墨及一些导电化合物为主要组成成分,通过基体树脂的粘接作用,把导热粒子结合在一起,形成导电通路,实现被粘材料的导电连接。此外,由于绝缘导热胶的基体树脂是一种胶黏剂,可以选择适宜的固化温度进行粘接,如环氧树脂胶黏剂可以在室温至150℃下固化,远低于锡料焊接的200℃以上的焊接温度,这就避免了焊接高温可能导致的材料变形、电子器件的热损耗和内应力的形成。同时,随着电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展,锡料焊接的0.65mm的最小节距远远满足不了导电连接的实际需求,而绝缘导热胶可以制成浆料,实现很高的线分辨率。绝缘导热胶还具有加工工艺简单、易于操作、可提高生产效率等特点,从而实现了导热连接的理想选择。
由于金属饮料罐的导热系数较大,且具有优异的薄金属壁面,并采用了先进的清洗技术,保证其传热表面的洁净度,从而减少了导热热阻,强化了传热效果,因此,本发明采用回收的金属饮料罐,特别是回收的铝质饮料罐,作为LED灯的灯杯本体,并用接着剂,特别是绝缘导热胶,将由回收的金属饮料罐构成的灯杯本体与电路板基体的铜箔层相粘接或焊接固定,使得本发明不仅实现了完全的金属化结构,提高了LED灯的散热性能,使LED灯的发热温度得到有效控制,而且能够对金属饮料罐加以回收利用,达到了低碳、环保、经济的要求。
工业实用性
本发明直接采用回收的金属饮料罐作为灯杯本体,并将金属饮料罐的底面一端作为与电路板相联接的金属安装面,通过接着剂与电路板基体的铜箔层相固接,以回收金属饮料罐为散热基体,提高了LED灯的散热性能,使LED灯的发热温度得到有效控制,而且能够对金属饮料罐加以回收利用,达到了低碳、环保、经济的要求。
上述实施例仅用来进一步说明本发明的一种以回收金属饮料罐为散热基体的LED灯,但本发明并不局限于实施例,凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均落入本发明技术方案的保护范围内。

Claims (5)

  1. 一种以回收金属饮料罐为散热基体的LED灯,包括灯头、灯杯本体、装有LED的电路板和灯罩;灯头通过绝缘塑壳与灯杯本体的一端相固接,灯罩与灯杯本体的另一端相固接,电路板联接于灯杯本体上并容纳于灯杯本体和灯罩所围成的腔内;其特征在于:该灯杯本体直接采用回收的金属饮料罐,并将金属饮料罐的一端作为与电路板相联接的金属安装面,该电路板为铜基板,电路板基体的铜箔层通过接着剂与金属饮料罐的金属安装面相固接。
  2. 根据权利要求1所述的以回收金属饮料罐为散热基体的LED灯,其特征在于:所述的回收金属饮料罐为回收铝质饮料罐。
  3. 根据权利要求1或2所述的以饮回收金属料罐为散热基体的LED灯,其特征在于:所述的接着剂为绝缘导热胶;所述灯杯本体的一端面通过该绝缘导热胶与所述电路板的铜箔层相粘接固定。
  4. 根据权利要求1或2所述的以回收金属饮料罐为散热基体的LED灯,其特征在于:所述的接着剂为锡料;所述灯杯本体的一端面外侧镀有一金属镀层,所述灯杯本体的金属镀层通过该锡料与所述电路板基体的铜箔层相焊接固定。
  5. 根据权利要求4所述的以回收金属饮料罐为散热基体的LED灯,其特征在于:所述的灯杯本体的一端面外侧通过化学镀电镀或蒸镀或溅镀获得金属镀层。
PCT/CN2010/079057 2010-08-24 2010-11-24 一种以回收金属饮料罐为散热基体的led灯 WO2012024868A1 (zh)

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