WO2012024867A1 - 一种金属一体化的照明及背光用led散热结构体 - Google Patents

一种金属一体化的照明及背光用led散热结构体 Download PDF

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WO2012024867A1
WO2012024867A1 PCT/CN2010/079056 CN2010079056W WO2012024867A1 WO 2012024867 A1 WO2012024867 A1 WO 2012024867A1 CN 2010079056 W CN2010079056 W CN 2010079056W WO 2012024867 A1 WO2012024867 A1 WO 2012024867A1
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aluminum
layer
circuit board
cup body
lamp
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PCT/CN2010/079056
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English (en)
French (fr)
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陈诺成
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厦门汇耕电子工业有限公司
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Publication of WO2012024867A1 publication Critical patent/WO2012024867A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED heat dissipation structure, and more particularly to an LED heat dissipation structure for illumination and backlight that can realize metal integration.
  • LED lamps generate more and more heat, and the heat generated by LED lamps will affect their light and service life. For example, when the LED is overheated, its light will become darker, the color will become lighter, and its service life will be shortened accordingly. Therefore, the design of the overall heat dissipation structure of LED lighting is crucial.
  • a thermal conductive paste is generally used to achieve mutual fixation, but the thermal conductivity of the polymer material of the thermal conductive paste is too low (only 0.01-0.1 w/mk). ), although the thermal conductive material of the formulation component is added in the system, the thermal conductivity of the thermal paste is poor. Conversely, the thermal conductivity of metals is generally 60-700. Between w/m.k, therefore, the thermal conductivity of the thermal paste is far less than the thermal conductivity of the metal. To this end, the present invention has been made in an effort to study a coupling structure capable of achieving complete metal integration between the lamp cup body of the LED lamp and the circuit board, thereby greatly improving the heat dissipation effect of the LED.
  • the object of the present invention is to overcome the deficiencies of the prior art, and provide a metal integrated illumination and backlight LED heat dissipation structure, which uses a solder paste to solder and fix the lamp cup body and the circuit board, thereby realizing complete metal integration.
  • the coupling structure overcomes the shortcomings of the prior art LED heat dissipation effect and short service life.
  • a metal integrated illumination and backlight LED heat dissipation structure comprising a lamp cap, a lamp cup body, a circuit board with a LED and a lamp cover; and the circuit board is coupled to the lamp cup
  • the body is received in the cavity surrounded by the lamp cup body and the lamp cover;
  • the lamp cup body is an integral structure made of aluminum material;
  • the side of the circuit board connected with the lamp cup body is set as an aluminum foil or aluminum plate layer
  • the outer surface of the aluminum foil or aluminum plate layer is plated with a first metal plating layer;
  • the side of the lamp cup body coupled to the circuit board is provided with an aluminum mounting surface, and the outer surface of the aluminum mounting surface is plated with a second metal plating layer;
  • the first metal plating of the aluminum foil or aluminum plate layer of the circuit board is soldered and fixed to the second metal plating of the lamp cup body by solder paste.
  • the lamp cap is fixed to one end of the lamp cup body through an insulating plastic case; the lamp cover is fixedly connected to the other end of the lamp cup body.
  • the circuit board is provided with a copper foil layer, and a high thermal conductivity or ultra-high thermal conductivity dielectric layer is further disposed between the copper foil layer of the circuit board and the aluminum foil or aluminum plate layer.
  • the aluminum foil has a thickness of C6 micrometers U-200U; the aluminum foil layer has a thickness of 0.2-6.4 micrometers.
  • the copper foil layer is made of an electrolytic copper foil having a thickness of 1/4 to 9.5 oz or a rolled copper foil having a thickness of 1/4 to 9.5 oz.
  • the high thermal conductivity or ultra-high thermal conductivity dielectric layer is prepared by using a polymer insulating material as a rubber compound and adding a non-metal solid heat conductive medium.
  • the outer surface of the aluminum foil or aluminum plate layer is obtained by electroless plating or evaporation or sputtering to obtain a first metal plating layer.
  • the outer surface of the aluminum mounting surface is obtained by electroless plating or evaporation or sputtering to obtain a second metal plating.
  • the metal integrated illumination and backlight LED heat dissipation structure of the invention combines a copper foil layer with a high thermal conductivity or ultra-high thermal conductivity dielectric layer and an aluminum foil or aluminum plate layer to form a circuit board, and is outside the aluminum foil or aluminum plate layer
  • the surface is electrolessly plated or vapor-deposited or sputtered to form a first metal plating layer with excellent solderability, so that the circuit board can pass the solder paste (plus solder and flux) and the lamp by means of the first metal plating layer.
  • the cup body is welded into one body, thereby realizing a completely metal integrated structure, greatly improving the heat dissipation of the LED lamp, and effectively controlling the heat generation temperature of the LED lamp.
  • the second metal plating layer is plated on the outer surface of the mounting surface, which facilitates the welding and fixing of the lamp cup body and the circuit board.
  • the invention has the beneficial effects that one side of the circuit board and the lamp cup body is set as an aluminum foil or aluminum plate layer, and the outer surface of the aluminum foil or aluminum plate layer is plated with the first metal plating layer; the lamp cup body is made of aluminum material.
  • the integrated structure, and the side of the lamp cup body and the circuit board is provided with an aluminum mounting surface, and the outer surface of the aluminum mounting surface is plated with a second metal plating layer, so that the present invention uses solder paste to the lamp cup body and After the circuit board is soldered and fixed, the complete metal integration of the LED lamp is realized, thereby greatly improving the heat dissipation of the LED lamp, and effectively controlling the heating temperature of the LED lamp; due to the use of a copper foil layer, a high thermal conductivity or an ultra-high thermal conductivity medium
  • the layer and the aluminum foil or aluminum plate layer form a circuit board, and the aluminum foil or aluminum plate layer is disposed on a side of the circuit board and the lamp cup body, and the outer surface of the aluminum foil or aluminum plate layer is
  • the LED heat dissipation structure of the present invention has the characteristics of low cost, good heat dissipation effect, and long service life.
  • Figure 1 is a schematic view of the structure of the present invention
  • Figure 2 is a partial cross-sectional view showing the coupling of the lamp cup body and the circuit board of the present invention.
  • a fully metal-integrated LED heat dissipation structure for illumination and backlight comprising a lamp cap 1, a lamp cup body 2, a circuit board 3 with LEDs, and a lamp cover 4; 1 is fixed to one end of the lamp cup body 2 through an insulating plastic case; the lamp cover 4 is fixed to the other end of the lamp cup body 2; the circuit board 3 is coupled to the lamp cup body 2 and housed in the lamp cup body 2 and the lamp cover 4
  • the enclosed cup body 2 is an integral structure made of aluminum material; the side of the circuit board 3 coupled to the lamp cup body 2 is formed as an aluminum foil or aluminum plate layer 33, the aluminum foil or aluminum plate layer The outer surface of the aluminum foil mounting surface 21 is plated with a second metal plating layer 211.
  • the outer surface of the aluminum alloy mounting surface 21 is plated with a second metal plating layer 211.
  • the first metal plating layer 331 of the aluminum foil or aluminum plate layer 33 of the circuit board 3 is soldered and fixed to the second metal plating layer 211 of the lamp cup body through the solder paste 6.
  • the circuit board 3 further includes a copper foil layer 31; between the copper foil layer 31 of the circuit board and the aluminum foil or aluminum plate layer 33 is also provided with a high thermal or ultra-high thermal conductivity dielectric layer 32;
  • the side of the circuit board 3 coupled to the lamp cup body 2 may be an aluminum foil layer or an aluminum plate layer, when it is an aluminum foil layer, its thickness is C6 micron U-200U; when it is an aluminum plate layer, its thickness is 0.2-6.4 micrometer;
  • the copper foil layer 31 is made of THE type electrolytic copper foil (ED copper, thickness 1/4 oz - 9.5 oz) or rolled copper (RA copper, with a folding angle of 90 degrees or more and one time fixed or infrequently folded, thickness 1/4 oz - 9.5 oz);
  • the high thermal conductive or ultra-high thermal conductive medium layer 32 is prepared by preparing a polymer insulating material into a rubber compound and adding a non-metal solid heat conductive medium; here, the polymer insulating material comprises an epoxy type polyimide.
  • the polymer insulating material comprises an epoxy type polyimide.
  • a powder or nano material such as silicon carbide, amorphous carbon, aluminum nitride or boron nitride is obtained by coating, drying and film forming; the high thermal conductive or ultrahigh thermal conductive material can be made into a pure film type. Used on a metal substrate or as a prepreg with a carrier;
  • the outer surface of the aluminum foil or aluminum plate layer 33 is obtained by electroless plating or evaporation or sputtering method to obtain a first metal plating layer 331;
  • the outer surface of the aluminum mounting surface 21 is obtained by electroless plating or evaporation or sputtering to obtain a second metal plating layer 211.
  • the manufacturing process of the first metal plating layer 331 and the second metal plating layer 211 described above are as follows:
  • Alkaline tin plating An alkaline tin plating solution mainly composed of sodium stannate is electroplated by a combination of sodium hydroxide and potassium hydroxide.
  • Acidic tin plating Adding antioxidants and other additives to the sulfuric acid and stannous sulfate solution to obtain a good quality matt or bright coating.
  • aluminum foil or aluminum plate is oxidized to obtain an aluminum oxide surface layer, which is surface-treated with silane (epoxysilane or aminosilane) and used as an activator for electroless copper plating.
  • silane epoxysilane or aminosilane
  • electroplating using copper sulfate as electrolyte, copper as anode, aluminum for cathodic electrolysis; copper plating layer is stable, corrosion resistance, strong resistance to discoloration, coating is non-toxic, soft, has good weldability and ductility Therefore, it has a wide range of applications in the industry.
  • the present invention also requires solder and flux.
  • the solder paste has a temperature range of 40-320 degrees for the RTS curve and the RSS curve;
  • the solder has a soft and hard type of work, and has a low melting point and a soft texture for the solder of the soft type, and has a melting point for the solder of the hard type.
  • the present invention uses a soft solder; for the flux, the present invention selects a soft soldering process, and uses a fluxing active agent to assist heat conduction to remove oxides, reduce the surface strength of the material to be welded, and increase the soldering area thereof. To prevent reoxidation.
  • the LED heat dissipating structure for the complete metal integrated illumination and backlight of the invention combines the copper foil with the aluminum foil or the aluminum plate, and its thermal conductivity is similar to that of the copper foil, but the cost is greatly reduced.
  • the present invention also obtains the first metal plating layer by electroless plating or vapor deposition or sputtering on the outer surface of the aluminum foil or aluminum plate layer of the circuit board, and the aluminum mounting surface of the lamp cup body
  • the outer surface is obtained by electroless plating or evaporation or sputtering to obtain a second metal plating layer, and the first metal plating layer is used to pass the circuit board through the solder paste and the second metal plating layer of the aluminum mounting surface of the lamp cup body.
  • the fusion is integrated into one, thereby realizing a completely metal-integrated structure, thereby greatly improving the heat dissipation of the LED lamp, and effectively controlling the heating temperature of the LED lamp.
  • the circuit board of the invention adopts a copper foil layer, a high thermal or ultra-high thermal conductive medium layer and an aluminum foil or aluminum plate layer to form a circuit board, and the aluminum foil or aluminum plate layer is disposed on a side of the circuit board and the lamp cup body, the aluminum foil or aluminum plate layer
  • the outer surface is plated with a first metal plating layer, so that the circuit board not only has superior solderability and thermal conductivity, but also has a greatly reduced cost.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

一种金属一体化的照明及背光用LED散热结构体 技术领域
本发明涉及一种LED散热结构体，特别是涉及一种能够实现金属一体化的照明及背光用LED散热结构体。
背景技术
目前，随着LED灯体积的日益缩小，以及LED灯功率的日渐增大，LED灯产生的热量越来越多，而LED灯产生的热量又会对其光线及使用寿命产生影响。如当LED过热时，其光线会变暗，颜色会变浅，同时，其使用寿命也会相应缩短。因此，LED照明的整体散热结构的设计至关重要。
在现有技术中，LED灯的灯杯本体与其电路板之间，一般采用导热膏来实现相互固接，但由于导热膏的高分子材料的导热系数太低（仅为0.01-0.1w/m.k），其体系中虽添加配方组分的导热材料，仍使得该导热膏的导热效果较差。相反的，金属的导热系数一般在60-700 w/m.k之间，因此，导热膏的导热效果远不如金属的导热效果好。为此，本发明致力于研究一种能够使LED灯的灯杯本体与电路板之间实现完全金属一体化的联接结构，从而大大提高LED的散热效果。
另外，由于铝的可焊性很差，即使对其表面经过氧化处理，其可焊性也达不到工艺要求。以往一种通常的做法是将LED灯结构中的铝箔，采用铜箔或铜板代替，以此改善它的可焊性。然而，由于铜箔的成本较高，且质软、硬度差，因此，现有技术的这种做法，不利于推广应用。
发明内容
本发明的目的在于克服现有技术之不足，提供一种金属一体化的照明及背光用LED散热结构体，采用锡膏对灯杯本体和电路板之间进行焊接固定，从而实现了完全金属一体化的联接结构，克服了现有技术的LED散热效果不佳，使用寿命较短等不足之处。
本发明解决其技术问题所采用的技术方案是：一种金属一体化的照明及背光用LED散热结构体，包括灯头、灯杯本体、装有LED的电路板和灯罩；电路板联接于灯杯本体上并容纳于灯杯本体和灯罩所围成的腔内；该灯杯本体为铝材料制作而成的一体式结构；电路板中与灯杯本体相联接的一面设为一铝箔或铝板层，该铝箔或铝板层的外侧表面镀有一第一金属镀层；该灯杯本体中与电路板相联接的一面设有铝质安装面，该铝质安装面的外侧表面镀有一第二金属镀层；该电路板的铝箔或铝板层的第一金属镀层通过锡膏与灯杯本体的第二金属镀层相焊接固定。
所述灯头通过绝缘塑壳与灯杯本体的一端相固接；灯罩与灯杯本体的另一端相固接。
所述的电路板设有铜箔层，在电路板的铜箔层与铝箔或铝板层之间还设有一高导热或超高导热介质层。
所述的铝箔的厚度为C6微米U-200U；所述铝板层的厚度为0.2-6.4微米。
所述的铜箔层是由厚度为1/4-9.5盎斯的电解铜箔或厚度为1/4-9.5盎斯的压延铜箔制作而成。
所述的高导热或超高导热介质层是由高分子绝缘材料用溶剂制备成胶料，添加非金属固体类导热介质制作而成。
所述的铝箔或铝板层的外侧表面是通过化学镀电镀或蒸镀或溅镀获得第一金属镀层。
所述的铝质安装面的外侧表面是通过化学镀电镀或蒸镀或溅镀获得第二金属镀层。
本发明的一种金属一体化的照明及背光用LED散热结构体，将铜箔层通过高导热或超高导热介质层和铝箔或铝板层相结合构成电路板，并在铝箔或铝板层的外侧表面经化学镀电镀或蒸镀或溅镀等方法，形成可焊性优越的第一金属镀层，使得该电路板即可借助其第一金属镀层通过锡膏（加上焊料和助焊剂）与灯杯本体焊接成一体，从而实现了完全金属一体化结构，大大提高了LED灯的散热性，使LED灯的发热温度得到有效控制。此外，由于灯杯本体及其安装面为铝质的灯杯结构，因而，在其安装面的外侧表面镀上第二金属镀层，将有利于灯杯本体与电路板的相焊接固定。
本发明的有益效果是，由于电路板与灯杯本体相联接的一面设为铝箔或铝板层，且该铝箔或铝板层的外侧表面镀有第一金属镀层；灯杯本体为由铝材料制作而成的一体式结构，且灯杯本体与电路板相联接的一面设有铝质安装面，该铝质安装面的外侧表面镀有第二金属镀层，使得本发明采用锡膏将灯杯本体和电路板相焊接固定后，实现了LED灯的完全金属一体化，从而大大提高了LED灯的散热性，使LED灯的发热温度得到有效控制；由于采用铜箔层、高导热或超高导热介质层和铝箔或铝板层构成电路板，且铝箔或铝板层设在电路板与灯杯本体相联接的一面，该铝箔或铝板层的外侧表面镀有第一金属镀层，使得该电路板不仅具有优越的可焊性、导热性，而且其成本也大大降低。
综上所述，本发明的LED散热结构体具有成本低、散热效果好、使用寿命长等特点。
以下结合附图及实施例对本发明作进一步详细说明；但本发明的一种完全金属一体化的照明及背光用LED散热结构体不局限于实施例。
附图说明
图1是本发明的结构示意图；
图2是本发明的灯杯本体与电路板的联接处的局部剖视图。
具体实施方式
实施例，请参见附图所示，本发明的一种完全金属一体化的照明及背光用LED散热结构体，包括灯头1、灯杯本体2、装有LED的电路板3和灯罩4；灯头1通过绝缘塑壳与灯杯本体2的一端相固接；灯罩4与灯杯本体2的另一端相固接；电路板3联接于灯杯本体2上并容纳于灯杯本体2和灯罩4所围成的腔内；该灯杯本体2为铝材料制作而成的一体式结构；电路板3中与灯杯本体2相联接的一面设为一铝箔或铝板层33，该铝箔或铝板层33的外侧表面镀有一第一金属镀层331；该灯杯本体2中与电路板3相联接的一面设有铝质安装面21，该铝质安装面21的外侧表面镀有一第二金属镀层211；该电路板3的铝箔或铝板层33的第一金属镀层331通过锡膏6与灯杯本体的第二金属镀层211相焊接固定。
其中，
所述的电路板3还包括铜箔层31；在电路板的铜箔层31与铝箔或铝板层33之间还设有一高导热或超高导热介质层32；
电路板3与灯杯本体2相联接的一面可为铝箔层或铝板层，当为铝箔层时，其厚度为C6微米U-200U；当为铝板层时，其厚度为0.2-6.4微米；
所述的铜箔层31采用THE型的电解铜箔（ED铜，厚度为1/4盎斯-9.5盎斯）或压延铜（RA铜，折角90度以上且一次固定或不经常折，厚度1/4盎斯-9.5盎斯）制作而成；
所述的高导热或超高导热介质层32是由高分子绝缘材料用溶剂制备成胶料，添加非金属固体类导热介质制作而成；这里，高分子绝缘材料包括环氧型聚酰亚胺型、有机氟树脂型、有机硅树脂型、聚醚型、聚醚铜型、（PEEK）有机高分子液晶等高分子材料，非金属固体类导热介质如三氧化二铝、氧化铍、石墨、碳化硅、无定型碳、氮化铝、氮化硼等粉末或纳米材料，经涂布、烘干、成膜而制得；该高导热或超高导热介质材料可以制成纯薄膜型附着在金属基体上，或制成有载体的半固化片材使用；
所述的铝箔或铝板层33的外侧表面是通过化学镀电镀或蒸镀或溅镀的方法获得第一金属镀层331；
所述的铝质安装面21的外侧表面是通过化学镀电镀或蒸镀或溅镀的方法获得第二金属镀层211。
上述第一金属镀层331和第二金属镀层211的制备工艺要点如下：
1）、碱性镀锡：以锡酸钠为主的碱性镀锡溶液采用氢氧化钠和氢氧化钾结合物进行电镀。
2）、酸性镀锡：在硫酸和硫酸亚锡溶液中加入抗氧化剂和其它附加剂，可获得质量良好的无光或光亮的镀层。
3）、铝箔或铝板经氧化处理，得到氧化铝表面层，用硅烷（环氧基硅烷或氨基硅烷）进行表面处理后用作活化剂进行化学镀铜。
4）、电镀：用硫酸铜做电解液，铜做阳极，铝做阴极电解；镀铜层稳定好、耐腐蚀、抗变色能力强，镀层无毒、柔软，有良好的可焊性和延展性，因此在工业上有广泛的应用。
本发明在采用锡膏进行焊接的过程中，还需用到焊料和助焊剂。其中，锡膏，其温度RTS曲线和RSS曲线的温度范围为40-320度；焊料有软硬工种，对于软工种的焊料，具有熔点低、质软等特点，对于硬工种的焊料，具有熔点高等特点，这里，本发明采用软性焊料；对于助焊剂，本发明选择软性焊接工艺，并利用助焊活性剂来辅助热传导去除氧化物，降低被焊接材质的表面强力，增大其焊接面积，防止再氧化。
本发明的一种完全金属一体化的照明及背光用LED散热结构体，将铜箔与铝箔或铝板相结合，它的导热性能与铜箔相近，但成本却大大降低了。为了实现铝材料的可焊性，本发明还在电路板的铝箔或铝板层的外侧表面采用化学镀电镀或蒸镀或溅镀等方法获得第一金属镀层，在灯杯本体的铝质安装面的外侧表面采用化学镀电镀或蒸镀或溅镀等方法获得第二金属镀层，以借助该第一金属镀层将该电路板通过锡膏和灯杯本体的铝质安装面的第二金属镀层热熔连接成一体，从而实现了完全金属一体化的结构，进而大大提高了LED灯的散热性，使LED灯的发热温度得到有效控制。
工业实用性
本发明的电路板采用铜箔层、高导热或超高导热介质层和铝箔或铝板层构成电路板，且铝箔或铝板层设在电路板与灯杯本体相联接的一面，该铝箔或铝板层的外侧表面镀有第一金属镀层，使得该电路板不仅具有优越的可焊性、导热性，而且其成本也大大降低。
上述实施例仅用来进一步说明本发明的一种完全金属一体化的照明及背光用LED散热结构体，但本发明并不局限于实施例，凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均落入本发明技术方案的保护范围内。

Claims (7)

  1. 一种金属一体化的照明及背光用LED散热结构体，包括灯头、灯杯本体、装有LED的电路板和灯罩；电路板联接于灯杯本体上并容纳于灯杯本体和灯罩所围成的腔内；其特征在于：该灯杯本体为铝材料制作而成的一体式结构；电路板中与灯杯本体相联接的一面设为一铝箔或铝板层，该铝箔或铝板层的外侧表面镀有一第一金属镀层；该灯杯本体中与电路板相联接的一面设有铝质安装面，该铝质安装面的外侧表面镀有一第二金属镀层；该电路板的铝箔或铝板层的第一金属镀层通过锡膏与灯杯本体的第二金属镀层相焊接固定。
  2. 根据权利要求1所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的电路板设有铜箔层，在电路板的铜箔层与铝箔或铝板层之间还设有一高导热或超高导热介质层,LED芯片植入在电路板的铜箔层上。
  3. 根据权利要求1所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的铝箔的厚度为C6微米U-200U；所述铝板层的厚度为0.2-6.4微米。
  4. 根据权利要求2所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的铜箔层是由厚度为1/4-9.5盎斯的电解铜箔或厚度为1/4-9.5盎斯的压延铜箔制作而成。
  5. 根据权利要求2所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的高导热或超高导热介质层是由高分子绝缘材料用溶剂制备成胶料，添加非金属固体类导热介质制作而成。
  6. 根据权利要求1所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的铝箔或铝板层的外侧表面是通过化学镀电镀或蒸镀或溅镀获得第一金属镀层。
  7. 根据权利要求1所述的金属一体化的照明及背光用LED散热结构体，其特征在于：所述的铝质安装面的外侧表面是通过化学镀电镀或蒸镀或溅镀获得第二金属镀层。
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