WO2012019822A3 - Dispositif électrique - Google Patents
Dispositif électrique Download PDFInfo
- Publication number
- WO2012019822A3 WO2012019822A3 PCT/EP2011/060780 EP2011060780W WO2012019822A3 WO 2012019822 A3 WO2012019822 A3 WO 2012019822A3 EP 2011060780 W EP2011060780 W EP 2011060780W WO 2012019822 A3 WO2012019822 A3 WO 2012019822A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- assembly
- components
- depressions
- protective body
- electrical device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62K—CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDE-CARS, FORECARS, OR THE LIKE
- B62K19/00—Cycle frames
- B62K19/30—Frame parts shaped to receive other cycle parts or accessories
- B62K19/34—Bottom brackets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
- B62M6/00—Rider propulsion of wheeled vehicles with additional source of power, e.g. combustion engine or electric motor
- B62M6/40—Rider propelled cycles with auxiliary electric motor
- B62M6/45—Control or actuating devices therefor
- B62M6/50—Control or actuating devices therefor characterised by detectors or sensors, or arrangement thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Manufacturing & Machinery (AREA)
- Transportation (AREA)
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
L'invention concerne un dispositif électrique comprenant : un module (1) comportant un support (2) et des composants (3-8) électriques, lesdits composants (3-8) étant fixés à des emplacements prédéfinis sur le support (2) et faisant saillie par rapport à celui-ci; un corps de protection (12) assemblé solidement avec le module (1), de telle sorte qu'un espace (13) soit ménagé entre ceux-ci, ledit corps de protection (12) couvrant les composants (3-8) et présentant des évidements (15-19) qui sont disposés en vis-à-vis des emplacements prédéfinis de sorte que les composants (3-8) pénètrent dans lesdits évidements (15-20); ainsi qu'une couche intermédiaire (24) élastique disposée dans l'espace (13) entre le corps de protection (12) et le module (1) et placée en contact avec le corps de protection (12) et le module (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010036910.1 | 2010-08-08 | ||
DE102010036910A DE102010036910A1 (de) | 2010-08-08 | 2010-08-08 | Elektrische Vorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012019822A2 WO2012019822A2 (fr) | 2012-02-16 |
WO2012019822A3 true WO2012019822A3 (fr) | 2012-04-05 |
Family
ID=44629985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/060780 WO2012019822A2 (fr) | 2010-08-08 | 2011-06-28 | Dispositif électrique |
Country Status (3)
Country | Link |
---|---|
CN (2) | CN102378525A (fr) |
DE (2) | DE102010036910A1 (fr) |
WO (1) | WO2012019822A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106660243A (zh) * | 2014-08-20 | 2017-05-10 | 罗伯特·博世有限公司 | 电子的控制单元及用于制造电子的控制单元的模具和方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010036910A1 (de) * | 2010-08-08 | 2012-02-09 | Ssb Wind Systems Gmbh & Co. Kg | Elektrische Vorrichtung |
US9561604B2 (en) * | 2012-02-28 | 2017-02-07 | Dialight Corporation | Method and apparatus for sky-line potting |
CN102647863A (zh) * | 2012-04-10 | 2012-08-22 | 苏州达方电子有限公司 | 电子装置 |
DE102012110683A1 (de) * | 2012-11-08 | 2014-05-08 | Conti Temic Microelectronic Gmbh | LC-Modul zum Einbau in einem Kraftfahrzeugsteuergerät |
EP2884817B1 (fr) * | 2013-12-13 | 2017-08-30 | Eberspächer catem GmbH & Co. KG | Dispositif de chauffage électrique et son procédé de fabrication |
DE102014014012B4 (de) * | 2014-09-26 | 2017-09-28 | Paul Voinea | Vorrichtungen und Verfahren zur teilweisen Beschichtung der Oberfläche eines Werkstückes durch Vergießen |
DE102015118498A1 (de) * | 2015-10-29 | 2017-05-04 | Endress+Hauser Conducta Gmbh+Co. Kg | Verfahren zum Vergießen einer Leiterplatte mit Bauteilen |
DE102016100479B4 (de) * | 2016-01-13 | 2019-02-14 | Asm Automation Sensorik Messtechnik Gmbh | Sensor, sowie Herstellverfahren hierfür |
JP6817843B2 (ja) * | 2017-02-17 | 2021-01-20 | 日信工業株式会社 | 電気部品組立体及び車両用ブレーキ制御装置 |
DE102017209179A1 (de) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Elektronikanordnung |
DE102017209175A1 (de) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung einer Elektronikanordnung und Elektronikanordnung |
DE102018206977A1 (de) * | 2018-05-04 | 2019-11-07 | Robert Bosch Gmbh | Steuergehäuse für ein Steuergerät |
DE102018218783A1 (de) * | 2018-11-05 | 2020-05-07 | Zf Friedrichshafen Ag | Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung |
EP3735111A1 (fr) | 2019-05-03 | 2020-11-04 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Support de composant à couche déformée destiné à recevoir un composant |
DE102020202777A1 (de) * | 2020-03-04 | 2021-09-09 | Atlas Elektronik Gmbh | Vorrichtung zur Schocklagerung von Elektronik |
DE102020115066B3 (de) | 2020-06-05 | 2021-10-14 | Pollmann International Gmbh | Vibrationsrobuste Elektronikkomponente |
CN114718719A (zh) * | 2022-06-07 | 2022-07-08 | 宁德市卓力电机有限公司 | 一种具备防水底座结构的柴油发电机组 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
EP0650315A2 (fr) * | 1993-10-23 | 1995-04-26 | Leonische Drahtwerke AG | Appareil de commande électrique à installer dans une automobile en particulier |
US20030193794A1 (en) * | 2002-04-10 | 2003-10-16 | Bradley Reis | Board-level EMI shield with enhanced thermal dissipation |
DE102004057493A1 (de) * | 2004-11-29 | 2006-06-01 | Siemens Ag | Umhüllung von auf einem Substrat angeordneten Bauelementen |
EP1879294A1 (fr) * | 2006-07-11 | 2008-01-16 | Balluff GmbH | Appareil électrique et méthode de fabrication d'un appareil électrique |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4224122C2 (de) | 1992-07-22 | 1995-11-02 | Turck Werner Kg | In einem Gehäuse eingegossene elektronische Schaltunng |
FR2730894B3 (fr) | 1995-02-21 | 1997-03-14 | Thomson Csf | Procede de fabrication d'une carte electronique a refroidissement par conduction thermique |
DE19715573C2 (de) * | 1997-04-15 | 2001-05-31 | Telefunken Microelectron | Gehäuse |
US6303860B1 (en) | 1999-11-30 | 2001-10-16 | Bombardier Motor Corporation Of America | Bladder insert for encapsulant displacement |
US7742309B2 (en) * | 2006-12-29 | 2010-06-22 | Nokia Corporation | Electronic device and method of assembling an electronic device |
DE102010036910A1 (de) * | 2010-08-08 | 2012-02-09 | Ssb Wind Systems Gmbh & Co. Kg | Elektrische Vorrichtung |
-
2010
- 2010-08-08 DE DE102010036910A patent/DE102010036910A1/de not_active Ceased
- 2010-08-08 DE DE202010018233.6U patent/DE202010018233U1/de not_active Expired - Lifetime
-
2011
- 2011-06-28 WO PCT/EP2011/060780 patent/WO2012019822A2/fr active Application Filing
- 2011-08-05 CN CN2011102246676A patent/CN102378525A/zh active Pending
- 2011-08-05 CN CN2011202824794U patent/CN202310380U/zh not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (de) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Elektronisches geraet mit mindestens einer leiterplatte |
EP0650315A2 (fr) * | 1993-10-23 | 1995-04-26 | Leonische Drahtwerke AG | Appareil de commande électrique à installer dans une automobile en particulier |
US20030193794A1 (en) * | 2002-04-10 | 2003-10-16 | Bradley Reis | Board-level EMI shield with enhanced thermal dissipation |
DE102004057493A1 (de) * | 2004-11-29 | 2006-06-01 | Siemens Ag | Umhüllung von auf einem Substrat angeordneten Bauelementen |
EP1879294A1 (fr) * | 2006-07-11 | 2008-01-16 | Balluff GmbH | Appareil électrique et méthode de fabrication d'un appareil électrique |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106660243A (zh) * | 2014-08-20 | 2017-05-10 | 罗伯特·博世有限公司 | 电子的控制单元及用于制造电子的控制单元的模具和方法 |
CN106660243B (zh) * | 2014-08-20 | 2019-03-05 | 罗伯特·博世有限公司 | 电子的控制单元及用于制造电子的控制单元的模具和方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2012019822A2 (fr) | 2012-02-16 |
CN102378525A (zh) | 2012-03-14 |
DE202010018233U1 (de) | 2015-01-21 |
DE102010036910A1 (de) | 2012-02-09 |
CN202310380U (zh) | 2012-07-04 |
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