WO2012019822A3 - Electrical device - Google Patents
Electrical device Download PDFInfo
- Publication number
- WO2012019822A3 WO2012019822A3 PCT/EP2011/060780 EP2011060780W WO2012019822A3 WO 2012019822 A3 WO2012019822 A3 WO 2012019822A3 EP 2011060780 W EP2011060780 W EP 2011060780W WO 2012019822 A3 WO2012019822 A3 WO 2012019822A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- assembly
- components
- depressions
- protective body
- electrical device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62K—CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDE-CARS, FORECARS, OR THE LIKE
- B62K19/00—Cycle frames
- B62K19/30—Frame parts shaped to receive other cycle parts or accessories
- B62K19/34—Bottom brackets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
- B62M6/00—Rider propulsion of wheeled vehicles with additional source of power, e.g. combustion engine or electric motor
- B62M6/40—Rider propelled cycles with auxiliary electric motor
- B62M6/45—Control or actuating devices therefor
- B62M6/50—Control or actuating devices therefor characterised by detectors or sensors, or arrangement thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Manufacturing & Machinery (AREA)
- Transportation (AREA)
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Electrical device having an assembly (1) comprising a carrier (2) and electrical components (3-8) wherein the components (3-8) are fixed at predetermined positions on the carrier (2) and project from the latter, and a protective body (12), which is fixedly connected to the assembly (1), is at a distance (13) from the latter, covers the components (3-8) and is provided with depressions (15-19), wherein the depressions (15-19) are arranged opposite the predetermined positions, such that the components (3-8) descend into the depressions (15-20), and an intermediate layer (24), which is arranged at the distance (13) between the protective body (12) and the assembly (1), is in contact both with the protective body (12) and with the assembly (1) and is embodied in elastic fashion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010036910.1 | 2010-08-08 | ||
DE102010036910A DE102010036910A1 (en) | 2010-08-08 | 2010-08-08 | Electric device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012019822A2 WO2012019822A2 (en) | 2012-02-16 |
WO2012019822A3 true WO2012019822A3 (en) | 2012-04-05 |
Family
ID=44629985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/060780 WO2012019822A2 (en) | 2010-08-08 | 2011-06-28 | Electrical device |
Country Status (3)
Country | Link |
---|---|
CN (2) | CN102378525A (en) |
DE (2) | DE102010036910A1 (en) |
WO (1) | WO2012019822A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106660243A (en) * | 2014-08-20 | 2017-05-10 | 罗伯特·博世有限公司 | Electronic control unit, molding tool, and method for producing an electronic control unit |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010036910A1 (en) * | 2010-08-08 | 2012-02-09 | Ssb Wind Systems Gmbh & Co. Kg | Electric device |
US9561604B2 (en) * | 2012-02-28 | 2017-02-07 | Dialight Corporation | Method and apparatus for sky-line potting |
CN102647863A (en) * | 2012-04-10 | 2012-08-22 | 苏州达方电子有限公司 | Electronic device |
DE102012110683A1 (en) * | 2012-11-08 | 2014-05-08 | Conti Temic Microelectronic Gmbh | LC module for installation in a motor vehicle control unit |
EP2884817B1 (en) * | 2013-12-13 | 2017-08-30 | Eberspächer catem GmbH & Co. KG | Electric heating device and method for its production |
DE102014014012B4 (en) * | 2014-09-26 | 2017-09-28 | Paul Voinea | Devices and methods for partially coating the surface of a workpiece by casting |
DE102015118498A1 (en) * | 2015-10-29 | 2017-05-04 | Endress+Hauser Conducta Gmbh+Co. Kg | Method for casting a printed circuit board with components |
DE102016100479B4 (en) * | 2016-01-13 | 2019-02-14 | Asm Automation Sensorik Messtechnik Gmbh | Sensor, as well as manufacturing method thereof |
JP6817843B2 (en) * | 2017-02-17 | 2021-01-20 | 日信工業株式会社 | Brake control device for electrical component assemblies and vehicles |
DE102017209179A1 (en) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | electronics assembly |
DE102017209175A1 (en) * | 2017-05-31 | 2018-12-06 | Conti Temic Microelectronic Gmbh | Method for producing an electronic assembly and electronic assembly |
DE102018206977A1 (en) * | 2018-05-04 | 2019-11-07 | Robert Bosch Gmbh | Control housing for a control unit |
DE102018218783A1 (en) * | 2018-11-05 | 2020-05-07 | Zf Friedrichshafen Ag | Electronic unit with electronic components and an arrangement for protecting the same against pressurization |
EP3735111A1 (en) | 2019-05-03 | 2020-11-04 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with deformed layer for accommodating component |
DE102020202777A1 (en) * | 2020-03-04 | 2021-09-09 | Atlas Elektronik Gmbh | Device for shock mounting of electronics |
DE102020115066B3 (en) | 2020-06-05 | 2021-10-14 | Pollmann International Gmbh | Vibration-resistant electronic component |
CN114718719A (en) * | 2022-06-07 | 2022-07-08 | 宁德市卓力电机有限公司 | Diesel generating set who possesses waterproof base structure |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (en) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block |
EP0650315A2 (en) * | 1993-10-23 | 1995-04-26 | Leonische Drahtwerke AG | Electric control apparatus, especially for installation in a vehicle |
US20030193794A1 (en) * | 2002-04-10 | 2003-10-16 | Bradley Reis | Board-level EMI shield with enhanced thermal dissipation |
DE102004057493A1 (en) * | 2004-11-29 | 2006-06-01 | Siemens Ag | Method for encasing components arranged on a substrate for electronic devices comprises placing a foil on the components, applying a deforming composition, pressing the composition against the foil and removing the composition |
EP1879294A1 (en) * | 2006-07-11 | 2008-01-16 | Balluff GmbH | Electrical device and method of producing an electrical device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4224122C2 (en) | 1992-07-22 | 1995-11-02 | Turck Werner Kg | Electronic circuit cast in a housing |
FR2730894B3 (en) | 1995-02-21 | 1997-03-14 | Thomson Csf | METHOD FOR MANUFACTURING AN ELECTRONIC CARD HAVING THERMAL CONDUCTION |
DE19715573C2 (en) * | 1997-04-15 | 2001-05-31 | Telefunken Microelectron | casing |
US6303860B1 (en) | 1999-11-30 | 2001-10-16 | Bombardier Motor Corporation Of America | Bladder insert for encapsulant displacement |
US7742309B2 (en) * | 2006-12-29 | 2010-06-22 | Nokia Corporation | Electronic device and method of assembling an electronic device |
DE102010036910A1 (en) * | 2010-08-08 | 2012-02-09 | Ssb Wind Systems Gmbh & Co. Kg | Electric device |
-
2010
- 2010-08-08 DE DE102010036910A patent/DE102010036910A1/en not_active Ceased
- 2010-08-08 DE DE202010018233.6U patent/DE202010018233U1/en not_active Expired - Lifetime
-
2011
- 2011-06-28 WO PCT/EP2011/060780 patent/WO2012019822A2/en active Application Filing
- 2011-08-05 CN CN2011102246676A patent/CN102378525A/en active Pending
- 2011-08-05 CN CN2011202824794U patent/CN202310380U/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2919058A1 (en) * | 1979-05-10 | 1980-11-20 | Siemens Ag | Electronic appliance with printed circuit module - encapsulated with modules in recesses of precast plastic block |
EP0650315A2 (en) * | 1993-10-23 | 1995-04-26 | Leonische Drahtwerke AG | Electric control apparatus, especially for installation in a vehicle |
US20030193794A1 (en) * | 2002-04-10 | 2003-10-16 | Bradley Reis | Board-level EMI shield with enhanced thermal dissipation |
DE102004057493A1 (en) * | 2004-11-29 | 2006-06-01 | Siemens Ag | Method for encasing components arranged on a substrate for electronic devices comprises placing a foil on the components, applying a deforming composition, pressing the composition against the foil and removing the composition |
EP1879294A1 (en) * | 2006-07-11 | 2008-01-16 | Balluff GmbH | Electrical device and method of producing an electrical device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106660243A (en) * | 2014-08-20 | 2017-05-10 | 罗伯特·博世有限公司 | Electronic control unit, molding tool, and method for producing an electronic control unit |
CN106660243B (en) * | 2014-08-20 | 2019-03-05 | 罗伯特·博世有限公司 | The mold and method of the control unit of electronics and the control unit for manufacturing electronics |
Also Published As
Publication number | Publication date |
---|---|
WO2012019822A2 (en) | 2012-02-16 |
CN102378525A (en) | 2012-03-14 |
DE202010018233U1 (en) | 2015-01-21 |
DE102010036910A1 (en) | 2012-02-09 |
CN202310380U (en) | 2012-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012019822A3 (en) | Electrical device | |
USD851650S1 (en) | Mounting element of a dashboard vent mount for an electronic device | |
USD715224S1 (en) | Protective electrical wiring device | |
WO2012005811A3 (en) | Switch system having a button travel limit feature | |
WO2011140311A3 (en) | Electronic device case and method of use | |
WO2008086530A3 (en) | Mems sensor with cap electrode | |
WO2012120357A3 (en) | Protective device for onboard electrical equipment | |
WO2011126876A3 (en) | Irreversible circuit activation switch | |
WO2015069953A3 (en) | Protective covering for wearable devices | |
WO2013004522A3 (en) | Portable device with apertured electrical contacts | |
TW200710936A (en) | MEMS devices having support structures and methods of fabricating the same | |
WO2007103959A3 (en) | Retractable cord assembly for securing portable electronic devices | |
WO2013019459A3 (en) | Fingertip cover and methods of manufacturing and dispensing same | |
WO2012037536A3 (en) | Packaging to reduce stress on microelectromechanical systems | |
WO2011079266A3 (en) | Fall protection safety device with a braking mechanism | |
EP2577767A4 (en) | Battery space, battery protecting device and power battery comprising the same | |
USD692384S1 (en) | Electric plug having a tactile indicator | |
WO2009055365A3 (en) | Packaged microchip with spacer for mitigating electrical leakage between components | |
WO2012067415A3 (en) | Compound and organic electronic device using same, and terminal comprising the organic electronic device | |
GB201014213D0 (en) | Aircraft bearing assembly | |
WO2012039490A3 (en) | Wiring structure of wire harness and shielding cover | |
WO2011073953A3 (en) | Push-pull interconnection system | |
WO2012087885A3 (en) | Clip light | |
WO2015097521A3 (en) | Semiconductor device and manufacturing method of the same | |
WO2014075779A3 (en) | Mechanical seal arrangement having an improved secondary seal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11741535 Country of ref document: EP Kind code of ref document: A2 |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11741535 Country of ref document: EP Kind code of ref document: A2 |