WO2012019822A2

WO2012019822A2 - Electrical device

Info

Publication number: WO2012019822A2
Application number: PCT/EP2011/060780
Authority: WO
Inventors: Fabio Bertolotti
Original assignee: Ssb Wind Systems Gmbh & Co. Kg
Priority date: 2010-08-08
Filing date: 2011-06-28
Publication date: 2012-02-16
Also published as: DE202010018233U1; WO2012019822A3; CN202310380U; DE102010036910A1; CN102378525A

Abstract

Electrical device having an assembly (1) comprising a carrier (2) and electrical components (3-8) wherein the components (3-8) are fixed at predetermined positions on the carrier (2) and project from the latter, and a protective body (12), which is fixedly connected to the assembly (1), is at a distance (13) from the latter, covers the components (3-8) and is provided with depressions (15-19), wherein the depressions (15-19) are arranged opposite the predetermined positions, such that the components (3-8) descend into the depressions (15-20), and an intermediate layer (24), which is arranged at the distance (13) between the protective body (12) and the assembly (1), is in contact both with the protective body (12) and with the assembly (1) and is embodied in elastic fashion.

Description

Electric device

description

The invention relates to an electrical device comprising a carrier and electrical components

Assembly, wherein the components are fixed at predetermined positions on the carrier and protrude from this, one with the assembly firmly connected, this having a distance, the components covering and with

Wells provided protection body, wherein the recesses are arranged opposite the predetermined positions, so that the components are immersed in the wells, and one in the distance between the protective body and the

Assembly arranged and in contact with both the protective body as well as with the assembly intermediate layer. The invention further relates to a method for encapsulating electrical components of an assembly, which the

Components and a carrier includes, with the

Process steps: Attach the components

predetermined positions on the carrier, so that the components protrude from the carrier, producing a protective body with recesses and connecting the protective body with the

Assembly, so that the wells the given

Opposite positions, the components in the

Immerse wells and between the assembly and the protective body remains a distance in which a Intermediate layer provided and brought into contact both with the protective body and with the assembly.

Having the sealing of electrical components

Assemblies to their environment, so protection against moisture, high temperatures and damage

Vibrations is created, is known from the prior art. Such protection is e.g. achieved by an electrically insulating protective body, which is connected to the module and covers the components. The method for applying such a protective body to the assembly or for introducing the assembly into such a protective body is referred to as potting or encapsulation.

The electrical components are usually soldered to a circuit board, e.g. via vias or surface contacts. In the simplest form of the potting process, the assembly is positioned in a mold which is poured with a resin, thereby completely enclosing the components of the resin. After curing the resin is a hard and

resistant protective body formed around the components around. The mold can form a housing and remain permanently connected to the protective body.

In other potting methods, the mold is removed after curing of the resin and can be used for other assemblies. As another option, electrical

To protect components is known as a so-called "dip coating" or dip coating, in which the assembly is immersed in a bath of resin, so that a thick and hard Protective layer is produced on the components that forms the protective body and completely encloses the assembly.

However, the potting process involves some difficulties, such as unwanted and harmful influences on the components. For example, undesirable pressures and mechanical stresses may occur due to the

Shrinking process during curing of the resin are caused. Also, the components can be damaged by high temperatures caused by exothermic processes

Curing of the resin occur. Furthermore, on the

Components acting mechanical stresses harmful due to a different thermal expansion behavior of printed circuit board, components and cured resin

be caused. Likewise, changes in the

electrical properties of the components occur, e.g. when resin penetrates into air gaps of transformers, coils or other electrical components whose

Functionality of the magnetic permeability of the

Air column depends, since the resin usually has a different permeability than air. Changes in the

Furthermore, the electrical properties of devices may be due to the shrinkage of the resin during curing or to thermal expansion of the resin during operation when the devices are pressure sensitive. Pressure sensitive devices are e.g. Quartz crystals, glass-clad reed relays and spools made of iron powder.

Finally, the components may be damaged by chemical by-products forming during curing. Mechanical stresses lead in particular to damage in surface-mounted components (SMD components), which can be easily separated from the circuit board due to their relatively weak solder joint. Furthermore, the potting method can not be used if the

Printed circuit board has cable connector, since a penetration of the resin in the connector blocks movable parts thereof and thus the function of the connector

could affect.

No. 6,583,355 B2 describes a printed circuit board which is arranged in a housing and is enclosed there by a protective cover. To avoid mechanical stresses, a bladder is disposed in the housing that is compliant and enclosed by the protective sheath. When making the protective cover occurring mechanical

Tensions can be compensated by the bubble positioned in the protective cover.

An encapsulated circuit is further described in DE 42 24 122 AI, wherein the circuit is completely enclosed by a potting compound. To reduce unwanted stresses that occur during curing of the potting compound, a buffer element is disposed within the potting compound.

Even if developed with the state-of-the-art

Compensating mechanical stresses are reduced, but these are not excluded. In particular, it has been found that these compensating means can not compensate for mechanical stresses to a sufficient extent, so that an impairment of the Serviceability of the components can not be safely prevented.

These problems are partially solved by a method according to US 6 035 524, according to which a protective body, the

at the same time forms a heat sink, not by pouring the assembled printed circuit board, but is made separately from this. The protective body has the components associated with depressions and is so with the

assembled printed circuit board, that the components are immersed in the wells. Further, the protective body to the circuit board and the components at a distance which is filled with an electrically insulating, good heat conducting and adhesive interlayer. This intermediate layer forms a thermal coupling between the components and the protective body and consists e.g. made of mastic, resin, varnish, lubricant or gel.

However, a different thermal expansion behavior of the protective body and the printed circuit board still entails the risk of local mechanical stresses occurring on the components leading to damage or damage

Impairment of the functionality of the components can result.

It is therefore an object of the invention to provide a means for encapsulating the electrical components

to provide an assembly comprising the occurrence of mechanical stresses in the region of the components due to a different thermal expansion behavior of Carrier and protective body can be avoided or at least reduced.

This object is achieved with a device according to claim 1 and with a method according to claim 19. Preferred developments of the invention are in the

Subordinate claims given.

The electrical device according to the invention comprises an assembly comprising a carrier and electrical components, wherein the components at predetermined positions on the

Carrier are attached and protrude from this, one firmly connected to the assembly, to this a distance

having the components covering and with

Wells provided protective body, wherein the recesses are arranged opposite the predetermined positions, so that the components are immersed in the wells, and in the distance between the protective body and the

Assembly arranged and standing in contact with both the protective body and with the module in the intermediate layer, which is formed elastically.

According to the invention an elastically formed intermediate layer is provided in the distance between the assembly and the protective body, which elastically deforms when forces are introduced into the intermediate layer. The intermediate layer thus forms a buffer for mechanical stresses due to different thermal expansions of

Assembly and protective body occur. It serves the

Intermediate layer at the same time as a spacer between the assembly and the protective body, so that a direct contact is prevented by the carrier and protective body. Damage and functional impairment of the components due to a different thermal expansion behavior of the carrier and protective body are thus avoided or at least noticeably reduced.

The components are preferably arranged spaced apart on the carrier. Preferably, the components are arranged on the same side of the carrier. In particular, the components protrude in the same direction from the carrier.

According to one embodiment of the invention, the carrier is plate-shaped or at least partially plate-shaped. In particular, the carrier is a printed circuit board with which the components are preferably electrically connected, for example by solder joints.

The depressions are in particular the components

assigned. One facing the wearer and with the

Recessed front side of the protective body preferably follows or preferably follows at least approximately a spatial structure formed by the carrier and the components. In particular, the depressions have it

such dimensions that at least one or more of the components or the protective body at a distance, in particular a circumferential distance.

Preferably, at least one or more of the or the components further comprises a frontal distance to the protective body. This ensures that the components are not or only slightly

Extent are in direct contact with the protective body. This also allows the components mechanical stresses be kept away or at least significantly reduced, which are due to a different Auszehnungsverhaiten assembly and protective body.

According to one embodiment of the invention, the circumferential distance between one of the components and the protective body is different from the circumferential distance between another of the components and the protective body. A larger circumferential distance between one of the components and the protective body may e.g. be used as a thermal barrier, if as little heat from this device to the

Protective body to be delivered. Furthermore, the

frontal distance between one of the components and the protective body to be different from the frontal distance between another of the components and the protective body.

Preferably, the intermediate layer fills the gap between the assembly and the protective body partially or at least partially. In particular, the intermediate layer is in contact with the carrier, with the protective body and preferably also with at least one or more of the components or components. The at least one or the with the intermediate layer in

Contacting components are preferably fixed and / or stabilized and / or secured and / or centered by the intermediate layer. Thus, protection of the at least one or the components in contact with the intermediate layer before local mechanical stresses can be achieved. Advantageously, the intermediate layer on the

Front of the protective body provided at least in areas between the wells. Preferably, the extends Intermediate layer in at least one or more of the or in the wells, in particular at least the edge side.

According to one embodiment of the invention, the intermediate layer extends into at least one or more of the or in the circumferential distances. Preferably, the intermediate layer extends into at least one or more of the or in the frontal distances. Preferably

at least one or more of them

Components connected via the intermediate layer with the protective body.

The intermediate layer preferably has a good thermal conductivity, so that heat can be emitted from at least one or more of the components or from the components and / or from the carrier into the protective body. According to one embodiment of the invention, the forms

Protective body a heat sink or a thermal

Coupling link to a heat sink. Thus, by means of the intermediary of the intermediate layer, the assembly can be cooled.

For devices that produce a lot of heat, such as

Power transistors, the thermal coupling via the intermediate layer but can cause problems. These components may overheat during operation, if not enough heat

is dissipated. Furthermore, these components can the

Protective body at least partially heat up such that other components are thermally overloaded. Also, it can not be ruled out that the material of the intermediate layer creeps into the interior of connectors and thus blocks moving parts thereof. Thus, at least one of the recesses into which at least one of the components is immersed is preferably free or substantially free of the intermediate layer. This ensures that the at least one in this depression

submerged component is not in contact with the intermediate layer. Preferably, at least one or more of the components is thus not in contact with the intermediate layer. The on some components with the

Intermediate layer or disadvantages associated with the material of the intermediate layer can be avoided thereby.

Furthermore, this at least one depression is preferably dimensioned so large that the component immersed in this depression is at all sides spaced from the protective body

is positioned. This can, as already above

addressed, a thermal barrier are formed to the protective body.

However, preferably at least one (other) of the recesses into which at least one (another) of the components is immersed is provided with the intermediate layer.

In particular, in this case, the at least one (other) component is in contact with the intermediate layer. Thus, it is possible depending on the nature of the components to take advantage of the intermediate layer and to avoid disadvantages of the intermediate layer. The intermediate layer does not have to be

be formed over the entire surface between the module and the protective body. In particular, it is sufficient that

Provide intermediate layer at a plurality of spaced apart locations. Furthermore, there is the problem that some components, such as electrolytic capacitors, have vent holes that can be clogged by the material of the intermediate layer. At high load of these components then formed gases can not be dissipated to the outside, which can lead to the destruction of the components. Preferably, a free space is thus provided between at least one of the components and the carrier, which is free of the intermediate layer. If the component is an electrolytic capacitor which has a ventilation hole on its side facing the carrier, gas can be released into the free space.

Additionally or alternatively, between at least one of the components and the bottom of the associated is preferred

Well provided a frontal space, the bottom of the recess is free of the intermediate layer.

If the component is an electrolytic capacitor which has a ventilation hole on its side facing away from the carrier, then gas can be released into the frontal space.

As mentioned above, this follows the wearer

facing and provided with the wells front of the protective body preferably by the carrier and the

Components formed spatial structure, at least

approximately. In particular, the components on the support elevations, to which the protective body in

Complementary manner having the wells. to

Ensuring complete encapsulation of the Components is the protective body thus adapted to the shape of the assembly.

Preferably, the circumferential contours of the recesses follow at least approximately the circumferential contours of the components. Preferably, at least one or more of the depressions or depressions are dimensioned such that an all-round distance remains between at least one or more of the structural elements and the protective body. The protective body is preferably spaced differently far from the components. The depressions are in particular in

Depending on the size of the components dimensioned. Preferably, the recesses in the protective body are also adapted to the function and / or to the heat development of the components with regard to their dimensioning. In the case of a component with greater heat development, for example, the associated depression can be chosen larger, so that a larger space or distance to the

Protective body arises.

The components preferably project vertically or in the

Essentially perpendicular to the carrier. The depressions preferably run straight or substantially straight. Thus, a simple introduction of the components in the wells is possible. Preferably, the extend

Wells or some of the recesses bounding circumferential walls perpendicular or substantially

perpendicular to the carrier.

The depressions in particular have a distance from one another. Preferably, in each of the wells one or arranged at least one of the components. Furthermore, it is possible for two or more components to be arranged in at least one of the depressions. This is advantageous if these two or more components are relatively narrow

are arranged side by side on the carrier. The recess can then have different depths, which are adapted to the respective component.

The lying between the wells areas of the

Front of the protective body are preferably adapted to the course of the wearer. In particular, the lying between the recesses areas of the front of the

Protective body on one level.

The intermediate layer preferably fills in part or at least in part the distance between the protective body and the carrier and is preferably in contact both with the protective body and with the carrier. Preferably, in at least one of the depressions, the intermediate layer additionally fills in part, or at least in part, the distance between the part

Protective body and associated with this depression

Component off. Preferably, the intermediate layer is in contact with the component and the protective body. Thus, the intermediate layer is preferably in contact with the

Carrier, the protective body and the component.

The intermediate layer preferably ensures the distance between the assembly and the protective body and thus serves as a spacer. Preferably, the intermediate layer is arranged only in the areas in which it is expedient. According to one embodiment of the invention can also only one Part of the distance between the protective body and the carrier and / or the components to be filled with the intermediate layer, preferably only as far as it is to ensure the distance between the assembly and the protective body and / or a desired heat transfer between the assembly and the protective body and / or a desired sealing of the components is beneficial to the outside. Thus, enough space can be made available for the components. In particular, not every type of component requires the same distance to the protective cover.

Preferably, the components are by the carrier, the

Protective body and the intermediate layer encapsulated and

preferably also sealed to the outside. Since the protective body preferably to the by the carrier and the components

formed, spatial structure is adapted and the

Interlayer next to the elastic buffer function

preferably also assumes the sealing function, this encapsulation and sealing to the outside is relatively easy.

According to one embodiment of the invention, a rear protective body is provided, wherein the protective body by

at least one mechanical fastener, such as e.g. a screw, are firmly connected. The assembly is arranged in particular between the protective bodies. Furthermore, an elastic layer can be provided between the back protection body and the assembly.

The protective body is preferred by at least one

Fastener attached to the carrier. The Fastening means may be formed by or include the intermediate layer, for example. Preferably, the

Protective body attached by means of the intermediate layer to the module. In particular, the protective body is fastened to the carrier and / or to at least one or more of the components by means of the intermediate layer. Preferably, the protective body is glued to the assembly by means of the intermediate layer. In particular, the protective body is adhesively bonded to the carrier and / or to at least one or more of the components by means of the intermediate layer. For this purpose, the intermediate layer preferably has adhesive properties

Properties on. With such an intermediate layer, the encapsulation of the components can be achieved in a simple manner, since additional fastening means are not absolutely necessary. In addition or alternatively, the

Protective body on the assembly by at least one

mechanical fastener, such as e.g. a screw, be attached. In particular, the protective body may additionally or alternatively be fastened to the carrier and / or to at least one or more of the components by the at least one mechanical fastening means. The one or more attachment means are also preferably used as

Spacer, in particular for maintaining the distance between the assembly and the protective body.

The intermediate layer is e.g. formed by an elastomer. In particular, the intermediate layer is through a

Silicone elastomer or formed by a silicone-based elastomer. With such an elastomer bonding of the protective body with the module is possible. Alternatively, a rubber may also be used as the elastomer. In this case Preferably, the at least one mechanical fastening means is used. The intermediate layer is preferably electrically insulating. In particular, the carrier and / or the assembly is electrically isolated from the protective body by means of the intermediate layer. Furthermore, the intermediate layer is preferably thermally conductive. In particular, the carrier and / or the assembly is thermally coupled to the protective body by means of the intermediate layer.

According to one embodiment of the invention, the bottom of at least one of the recesses is in heat-conducting contact with the component arranged in this recess. Thus, a direct cooling of this device by the

Protective body possible. This embodiment is useful for components with a greater heat development.

Preferably, the arrangement formed by the assembly and the protective body is completely or at least partially surrounded by a sheath. The sheath offers one

additional protection of the components, for example before

Moisture and / or from outside

Vibrations. Thus, an insert of the electric

Device even with extremely adverse weather and

Environmental conditions possible. The casing is preferably produced in the casting process from a potting compound, which cures in particular after casting. Thus, the

Arrangement preferably completely or at least partially surrounded by the sheath.

If the term "potting compound" is used, it is preferably a mass that is used during casting is liquid and then hardens or is cured. The cured potting compound preferably forms a solid and / or substantially solid and / or dimensionally stable

and / or substantially dimensionally stable material. When

Potting compound, for example, a polyurethane or an epoxy resin can be used. Depending on the application, the potting compound can be e.g. but also a polyamide imide, a metal or other material can be used.

According to one embodiment of the invention, the arrangement formed by the assembly and the protective body is introduced into a container.

Preferably, the protective body has a in one of

Wells opening, through opening into which in particular a heat sink is introduced, the in

thermally conductive contact with the in this recess

arranged component is. This is useful for a device with a large heat development, such as e.g. a power transistor or a power transistor arrangement, in particular if the heat produced by the component is not to be introduced into the protective body. Preferably, a projection of the container, which is in particular in heat-conducting contact with the component, extends into the through opening, so that the projection forms the heat sink. The heat sink is preferably metallic.

According to one embodiment of the invention, the arrangement at a distance or at least partially disposed at a distance from the walls of the container and completely or at least partially surrounded by the sheath, between the arrangement and the Walls of the container is provided. The sheath is preferably formed by pouring the distance between the

Arrangement and the walls of the container made with the potting compound.

The container preferably forms a housing which

In particular, provides additional protection for the components. For example, an electrical shielding of the components can be realized via the container. The container consists e.g. plastic or metal, in particular aluminum or steel, e.g. Stainless steel.

The term "electrical components" also includes

Electronic Components. Furthermore, an electrical component can have one or more electrical and / or

include electronic components.

The protective body is preferably a solid or im

Essentially solid body. For example, there is the

Protective body made of an epoxy resin, polyamide-imide or metal, e.g. Aluminum.

Preferably, the electrical device and / or the arrangement formed by the carrier and the components is arranged on or in a rotor of a wind turbine and preferably forms a control or at least part of a control of a Blattwinkelverstellantriebs, by means of which one or at least one rotor blade of the rotor relative to a rotor hub of the rotor can be rotated, on which the rotor blade is rotatably mounted. Of the

Blattwinkelverstellantrieb includes in particular one or at least one electric motor, with which the electrical device and / or the arrangement is preferably electrically coupled. Preferably, the electrical device and / or the arrangement is attached to the electric motor.

The electrical device and / or the arrangement preferably comprises one or at least one converter which is electrically connected to the electric motor and has at least one or more of the components or components.

The invention further relates to a method for encapsulating electrical components of an assembly, which the

Components and a carrier includes, with the

Process steps:

Attaching the components at predetermined positions on the carrier so that the components protrude from the carrier,

- producing a protective body with recesses,

Connecting the protective body to the assembly such that the recesses face the predetermined positions, the components dip into the recesses and a space remains between the assembly and the protective body, in which an intermediate layer is provided and connected to both

Protective body as well as with the assembly is brought into contact, wherein the intermediate layer is formed elastically.

The device according to the invention is produced in particular by the method according to the invention, so that it can be developed further in accordance with all embodiments explained in connection with the device according to the invention. Furthermore, the device according to the invention according to all in

Be further developed in connection with the embodiments explained embodiments. The protective body is preferably produced separately from the assembly, in particular before it is connected to the protective body.

According to one embodiment of the invention, the

Interlayer between the protective body and the

Components provided and / or the carrier. Before the

Connecting the protective body with the module is the

Intermediate layer preferably on the protective body

applied. Preferably, the protective body is then placed with the intermediate layer on the assembly or the assembly is placed on the intermediate layer.

Preferably, the distance between the protective body and the assembly is ensured by the intermediate layer, which thus forms a spacer.

According to a further embodiment of the invention, the

Interlayer in at least one area on the

Protective body applied. The intermediate layer is preferably applied on a front side of the protective body in regions between the depressions and is preferably introduced into at least one of the depressions, at least peripherally.

The recesses are preferably assigned to the components. In particular, the recesses are provided in the protective body at positions which are assigned to the predetermined positions. Preferably, the protective body is adapted or at least approximately adapted to the spatial structure formed by the carrier and the components,

preferably in a complementary manner. Thus, the Immerse components when connecting the assembly with the protective body in the wells. Advantageously, the

Protective body produced by casting, pressing, cutting, milling or the like.

According to one embodiment of the invention, the

Encapsulated components by connecting or merging the protective body with the assembly and preferably also sealed to the outside. In particular, the intermediate layer is brought into contact with the carrier.

Preferably, the intermediate layer is further contacted with at least one or more of the components. Additionally or alternatively, the intermediate layer is preferably not brought into contact with at least one or more (other) of the components.

Preferably, the intermediate layer is in at least one

Area or in several areas in the distance between the protective body and the assembly provided. Preferably, the intermediate layer, in particular in the field of

Components, brought into contact with the protective body and the carrier and preferably also with at least one or more of the or the components. Transitions between the

Areas can be seamless or intermittent.

Preferably, the arrangement formed by the assembly and the protective body connected thereto is provided with a

Sheath providing the arrangement whole or

at least partially surrounds and preferably seals to the outside. In particular, the from the assembly and the formed with this connected protection body arrangement completely or at least partially around with a potting compound, which preferably forms the jacket after curing. In particular, the potting compound does not come into contact with the electrical components, so that no damage or functional impairment of the components by the potting compound can occur.

According to one embodiment of the invention, the assembly formed from the assembly and the protective body connected to it is placed in a container and

preferably connected by at least one fastening means to the container. The fastening means comprises

For example, an adhesive and / or a mechanical fastener, such as a screw.

The arrangement is preferably arranged at a distance or at least in regions spaced from walls of the container. The at least one fastening means preferably also serves as a spacer. In particular, the distance between the arrangement and the walls of the container is poured with the potting compound. Thus, the arrangement

completely or at least partially enclosed by the potting compound, which forms the shell after curing. The container preferably forms a mold.

In particular, the container forms a housing.

According to a first variant of the invention, the arrangement provided with the jacket remains in the container. According to a second variant of the invention, the arrangement provided with the sheath is removed from the container. Subsequently, the arrangement provided with the sheath is preferably installed in a housing, which is provided in particular in addition to the container.

The housing, regardless of whether it is formed by the container or provided in addition to this, serves in particular for better shielding of the assembly from its surroundings and thus provides additional protection.

According to an alternative, a mask which simulates or at least approximately reproduces the spatial structure formed by the carrier and the components is produced, and the protective body is manufactured using the mask. Preferably, the mask is arranged in a mold and preferably connected by at least one fastening means with the mold. The fastening means is in particular detachable and comprises, for example, a mechanical

Fasteners, such as e.g. a screw. The mask in particular represents one or approximately a positive impression of the carrier with the components. The mask is preferably arranged at a distance or at least in regions at a distance from walls of the casting mold, wherein the at least one

Fastener preferably also serves as a spacer.

After arranging the mask in the mold, this is preferably poured with a potting compound, the

then hardens. After curing of the potting compound, the mask is removed from the mold, wherein the hardened potting compound forms the protective body. Furthermore, the protective body can be removed from the mold.

However, the casting mold preferably forms a housing, so that the protective body can remain in the casting mold.

Subsequently, the intermediate layer is applied to the protective body and / or the assembly and the assembly connected to the protective body and / or the housing. In particular, the assembly is introduced into the housing.

Preferably, the assembly is applied to the intermediate layer and connected to the protective body, so that the components are immersed in the wells and the

Intermediate layer is brought into contact with the carrier.

If the casting forms a housing, then it is in particular firmly connected to the arrangement formed by the assembly and the protective body.

The procedure with the aid of the mask ensures that no damage or functional impairment of the components is caused on the

Sealing compound are attributed. When casting the mold is encased by the potting compound only the mask, the stresses may be exposed during curing of the potting compound.

For making the mask, e.g. the spatial structure formed by the carrier and the components are scanned. Based on the sampling obtained

Information can then be made the mask. But is already a negative impression of the assembly, such. one

Protective body, present, so this can be in a mold are used, after which the mask is made by introducing a potting compound into the mold.

The from the assembly and connected to this

Protection body formed arrangement is preferably mounted on or in a rotor of a wind turbine. Preferably, the arrangement is surrounded by the sheath and / or arranged in the housing. In particular, the assembly is electrically arranged with one on or in the rotor

Blattwinkelverstellantrieb coupled, by means of which preferably a rotor blade of the rotor relative to a

Rotor hub of the rotor is rotated, on which the rotor blade is rotatably mounted or is. Preferably, the

Arrangement also mechanically with a motor of

Blattwinkelverstellantriebs coupled.

The invention will be described below with reference to preferred

Embodiments with reference to the drawing

explained. In the drawing show:

Fig. 1 is a partially sectioned side view of a

Assembly with a carrier and electrical components arranged thereon,

Fig. 2 is a partially sectioned side view of

Assembly according to FIG. 1 and a protective body adapted to the spatial structure of the assembly,

3 shows the view according to FIG. 2 with a partial layer applied to the protective body intermediate layer, FIG. 4 shows the view according to FIG. 3, wherein the assembly with the protective layer coated with the intermediate layer is connected to an arrangement according to a first embodiment of the invention, FIG.

Fig. 5 is a partially sectioned side view of

Arrangement according to FIG. 4 in a state introduced into a housing,

Fig. 6 is the view of FIG. 5, wherein the housing with

a potting compound is poured, a partially sectioned side view of an arrangement according to a second embodiment of the invention,

8 is a partially sectioned side view of a mask disposed in a housing,

Fig. 9 is the view of FIG. 8, wherein the housing with

a potting compound is poured out and

10 is the view of FIG. 9, wherein the mask by a

Assembly according to FIG. 1 has been replaced.

From Figs. 1 to 6 is a method of encapsulation

electrical components according to a first embodiment of the invention can be seen. An assembly 1 comprises a carrier 2 in the form of a printed circuit board with electrical components 3 to 8 arranged thereon. The individual components are arranged at a distance from one another on the printed circuit board 2 and illustrate the diversity of electrical components that can be installed on the circuit board. The component 3 represents a transformer with louvers 9, preferably free from

Foreign material should remain. The component 4 is a

Connector. The component 5 is an electrolytic capacitor, which is arranged at a distance from the printed circuit board 2, so that a free space 10 is provided between the capacitor 5 and the printed circuit board 2. The capacitor 5 is fixed to the printed circuit board 2 with connecting wires and preferably has a ventilation hole in its area. The

Component 6 is a diode with a glass housing, which may only be exposed to low mechanical loads. The component 7 is an SMD card. Furthermore, the component 8 forms a transistor arrangement, in particular an IGBT module, which can be cooled via a surface 11.

When referring hereinafter to "the" device or "the" devices, what has been said preferably applies to any of the above-described devices 3 to 8, unless explicitly stated to refer to a particular device.

To protect the components against environmental influences, a protective body 12 is connected to the carrier 2, so that the components are encapsulated between the carrier 2 and the protective body 12 and thereby protected. The protective body

12 is connected to the carrier 2 such that a distance

13 between the carrier 2 the protective body 12 remains.

Furthermore, circumferential distances 14 and frontal

Distances 37 between the components and the protective body 12th intended. Thus, the protective body 12 touches neither the

Carrier 2 still the components directly.

The protective body 12 is adapted to a spatial structure of the assembly 1 formed by the carrier 2 and the components. In particular, the protective body 12

Recesses 15 to 19, which correspond approximately to the sizes and shapes of the components. In particular, the recess 15 for receiving the component 3, the recess 16 for receiving the component 4, the recess 17 for receiving the component 5 and the recess 19 for receiving the component 8. Further, the recess 18 is used for

Receiving the components 6 and 7, so that the recess 18 forms a common recess for the components 6 and 7. Each of the recesses is larger than the respective associated component or the respectively associated

Components designed.

In the distance 13 between the protective body 12 and the carrier 2 and in the recesses 15, 17 and 18, between the protective body 12 and the components 3, 5, 6 and 7, an elastic intermediate layer 24 is provided, by means of which the assembly 1 is connected to the protective body 12. On the other hand, the recesses 16 and 19 are free or substantially free of the intermediate layer 24. Furthermore, the bottom of the recess 17 is free of the intermediate layer 24. Also, the recess 15 in the air slots 9 is free from the intermediate layer 24. Thus, the distance between the assembly 1 and the protective body 12 only partially filled with the intermediate layer 24, which inter alia as Spacer between the assembly 1 and the protective body 12 is used.

As already mentioned above, some of the depressions are free or at least partially free of the

Intermediate layer 24. The enclosed between the device 4 and the protective body 12 space 21 in the recess 16 is free or substantially free of the intermediate layer 24, so that no material of the intermediate layer in the

Plug connector 4 penetrate and can block moving parts thereof. The between the component 5 and the

Protective body 12 enclosed space 22 in the recess 17 is free or substantially free of the intermediate layer 24, so that one in the condenser 5 frontally

provided ventilation hole can not clog. The enclosed between the device 8 and the protective body 12 space 23 in the recess 19 is free or substantially free of the intermediate layer 24 so that it can not form a thermal bridge between the device 8 and the protective body 12. Further, in the recess 19, the circumferential distance 14 is made larger in comparison with the other recesses for providing a thermal barrier, so that of the

Component 8 discharged heat is introduced into the protective body 12 in the smallest possible extent.

The intermediate layer 24 is thus only partially arranged between the assembly 1 and the protective body 12.

In particular, some depressions are free or at least partially free of the intermediate layer 24, if it is necessary for the functionality of these depressions

arranged components is expedient. The protective body 12 adapted to the spatial structure formed by the carrier 2 and the components is produced in a preliminary process. For example, the

Protective body 12 by casting, cutting, pressing, milling

and / or other shape-forming processes are produced. The protective body 12 is thus produced separately from the assembly 1, and in particular before it is connected to the protective body 12.

The from the assembly 1 and connected to this

Protective body 12 formed arrangement 20 is inserted into a housing 25, wherein between the arrangement 20 and the walls of the housing 25 in regions a distance 30 remains. A projection 27 of the housing 25 extends through a through opening 28 in the protective body 12, which merges into the recess 19. The projection 27 abuts the surface 11 of the device 8 and serves as a heat sink for the device 8. Further, the assembly 1 and thus also the assembly 20 by mechanical fasteners 26, here in the form of screws, with the projection 27 and thus firmly connected to the housing 25.

Complementary or alternative to the mechanical

Fasteners 26, the assembly 20 may also be secured by an adhesive 29 to the housing 25. The distance or gap 30 formed between the arrangement 20 and the walls of the housing 25 is provided with a potting compound 31

filled, wherein the protective body 12 remote from the side of the carrier 2 is covered by the potting compound 31. After curing of the potting compound 31, the arrangement 20 permanently encapsulated in the potting compound. This can be seen from Fig. 6, which shows an electrical device 38 according to a first embodiment of the invention.

Due to the separate production of the protective body 12 can be used for this different materials with different properties. For example, as

Material for the protective body 12 an epoxy resin, in particular a 2-component epoxy resin can be used, which is e.g. a modulus of elasticity of E = 2.7MPa, a yield strength of E_fliess = 20MPa, a working temperature of T = -40 to

150 ° C, a glass transition temperature of about 60 ° C and a thermal expansion coefficient of Tg = 80ppm / K

(instead of ppm / K ym / m / K is also written). The thermal expansion coefficient of the carrier or

Printed circuit board material is preferably in a range of 20 to 30 ppm / K. The value of 80ppm / K of the epoxy resin is reasonably close to the value of 30ppm / K, so

Differences in material expansion remain relatively small if the temperature during operation is subject to relatively small fluctuations (for example between 0 and 40 ° C) and below the glass transition temperature Tg of the

Epoxy resin remains. The thermal conductivity of the

Epoxy resin is especially at 0.18W / (m * K) and its dielectric strength especially at 16kV / mm. Furthermore, the water absorption capacity of the epoxy resin is preferably very low. Such an epoxy resin forms a good one

Potting material and is known from the prior art.

A more suitable material for the protective body 12 is

however, polyamide-imide (PAI), for example, the 4275th This is in particular a polyimide with 20% graphite and 3% polytetrafluoroethylene (PTFE). This material has a thermal expansion coefficient of 25 ppm / K, which is close to the value of 20 ppm / K of the printed circuit board material, so that due to temperature fluctuations almost no relative movements between the carrier 2 and the

Protective body 12 and thus also almost no mechanical stresses occur. In addition, PAI retains a high

Strength over a temperature range of -190 to 260 ° C and has a very good dielectric strength.

Furthermore, PAI has a glass transition temperature of 275 ° C and can therefore be used even at the highest working temperatures of electrical components.

However, due to the high viscosity and melting temperature of over 200 ° C of PAI, this material can not be used as part of a normal casting process in which the components with the potting compound in closer thermal

Can contact. As a result, the protective body 12 is manufactured separately without touching the electrical components. For producing the protective body 12, known manufacturing methods may be used, e.g. also injection molding. The separate production of the protective body 12 is referred to herein as pre-potting.

Hereinafter, the manufacturing method according to the first embodiment will be described.

The assembly 1 is made by attaching the components to the carrier 2. The assembly 1 can be seen for example in FIG. 1. The protective body 12 is separated from the assembly 1

made and to the by the carrier 2 and the

Components formed spatial structure of the assembly 1 adapted. Thus, the protective body 12, the recesses 15 to 19, in which the arranged on the support 2 components can dive, which is apparent from Fig. 2. According to FIG. 3, the elastic intermediate layer 24 with adhesive properties is subsequently applied to the surface of the protective body 12, by means of which the carrier 2 is permanently connected to the protective body 12, as shown in FIG. It represents the

Intermediate layer 24 preferably favors a desired distance between the carrier 2 and the protective body 12.

As a preferred material for the intermediate layer 24, a silicone elastomer or silicone-based elastomer is used, which before curing a low viscosity and after curing a high flexibility (low

Elastic modulus), has a high dielectric strength and a low coefficient of thermal expansion. For example, such an elastomer has a viscosity of 2850 mPA * s, a hardness of 45 Shore A after curing and a thermal expansion coefficient of 250 ppm / K.

After joining the protective body 12 to the carrier 2, the resulting assembly 20 is waterproof and thus can be used without damage in a humid environment

survive. Furthermore, the assembly 20 is resistant to vibration and other external influences. The arrangement 20 preferably forms a coherent, in particular

monolithic structure.

Due to the high dielectric strength of the intermediate layer 24 and due to the electrically insulating properties of the intermediate layer 24, the protective body 12 may also comprise metallic material or consist of metallic material. In this case, the protective body 12 form an external housing for the module 1 and / or the components or take over the function of an external housing for the module 1 and / or the components. The metallic material is or preferably comprises aluminum.

Referring to FIG. 5, the composite assembly 20 is inserted into the housing 25, the assembly 20 being secured within the housing 25 by the attachment means 26 and / or the adhesive 29 applied to a spacer 39. The arrangement 20 is thereby positioned at a distance or at least in regions at a distance from the walls of the housing 25. The protective body 12 has, in the region of the component 8, the continuous recess 28, so that the component 8 is brought into contact with the projection 27 of the housing 25. According to FIG. 6, the housing 25 is filled with a liquid potting compound 31, which consists for example of a polyurethane or an epoxy resin. After the curing of the potting compound 31, the housing 25, the potting compound 31 and the arrangement 20 form a coherent, in particular monolithic structure.

As an alternative to a silicone-based elastomer, other elastic and / or elastomeric material for the Intermediate layer 24 can be used. For example, the intermediate layer 24 may consist of a non-adhesive, elastic material 32, which is apparent from Fig. 7, which shows an assembly 20 according to a second embodiment of the invention, wherein the first embodiment

identical or similar features are denoted by the same reference numerals as in the first embodiment. Furthermore, the carrier 2 is covered by a protective body 33 on the back, wherein the two protective bodies 12 and 33 by mechanical fastening means 34, here in the form of

Screws, firmly connected. Furthermore, an elastic layer 41 is arranged between the rear protective body 33 and the carrier 2. According to FIG. 7, rubber is preferably used for the intermediate layer 24 and / or for the elastic layer 41. The arrangement 20 according to FIG. 7 forms in particular an electrical device according to a second embodiment of the invention.

For further description of the second embodiment, reference is made to the description of the first embodiment. In particular, the arrangement 20 according to the second

Embodiment, the arrangement 20 according to the first

Replace the embodiment.

With reference to Figs. 8 to 10, a third

Embodiment of the invention described, wherein the previous embodiments similar or identical

Features are denoted by the same reference numerals as in the previous embodiments. 8, a mask 35 is used in a housing 25, which forms an approximate positive shape of an assembly 1, which according to FIG. 1 is constructed and a carrier 2 and attached thereto

Has components. The mask 35 is fixed by mechanical fasteners 40, here in the form of screws, in the housing 25 to form at least one gap 36, wherein the housing 25 simultaneously forms a mold. Subsequently, the housing 25 is poured with a liquid potting compound 31, which is apparent from Fig. 9. In this case, the gap 36 between the mask 35 and the walls of the housing 25 is filled with the potting compound 31, wherein 31 can be used as a potting compound polyurethane or epoxy resin. After curing of the potting compound 31, the mask 35 is removed, wherein the cured by the

Potting compound 31 formed body 12 forms a negative mold of the mask and thus an approximate negative form of the assembly 1. Subsequently, an elastic, adhesive

Intermediate layer 24 applied to the body 12, after which the carrier 2 is placed with the components on the body 12, which thus forms a protective body. The body 12, the housing 25 and the assembly 1 thus form a

coherent, in particular monolithic structure. This can be seen from Fig. 10, which shows an electrical device 38 according to a third embodiment of the invention. For further description of the third embodiment, reference is made to the description of the first embodiment.

To prevent water or water vapor in the

Cavities between the carrier 2 and the protective body 12 occurs, the connection of the assembly 1 with the

Protective body 12 made in all embodiments, preferably in an inert atmosphere. LIST OF REFERENCE NUMBERS

1 module

2 supports / printed circuit board

3 transformer

4 connectors

5 electrolytic capacitor

6 diode with glass housing

7 SMD card

8 transistor arrangement

9 louvre

10 free space

11 surface of the transistor arrangement

12 protective body

13 distance

14 distance

15 deepening in protective body

16 deepening in protective body

17 recess in protective body

18 deepening in protective body

19 recess in protective body

20 arrangement

21 room

22 room

23 room

24 interlayer

25 housing

26 fasteners / screws

27 projection of the housing

28 through opening adhesive

Distance / gap

potting compound

non-adhesive, elastic material / back protection body

Fasteners / screws

mask

Space between mask and housing distance

electrical device

spacer

Fasteners / screws

Elastic layer

Claims

Electrical device Claims

1. Electrical device with

a component (1) comprising a carrier (2) and electrical components (3-8), the components (3-8) being fastened to the carrier (2) at predetermined positions and projecting therefrom,

- One with the assembly (1) fixedly connected to this a distance (13) having, the components (3-8) covering and with recesses (15-19) provided

Protective body (12), wherein the recesses (15-19) are arranged opposite the predetermined positions, so that the components (3-8) are immersed in the recesses (15-20),

- One in the distance (13) between the protective body (12) and the assembly (1) arranged and both with the

Protective body (12) as well as with the assembly (1) in contact intermediate layer (24),

characterized in that

the intermediate layer (24) is elastic.

2. Electrical device according to claim 1,

characterized in that

the components (3-8) spaced from each other on the carrier (2) are arranged.

3. Electrical device according to claim 1 or 2, characterized in that

a front side of the protective body (12) facing the carrier (2) and provided with the depressions (3-8) follows or at least approximately follows a spatial structure formed by the carrier (2) and the components (3-8).

4. Electrical device according to one of the preceding

Claims,

characterized in that

the recesses have dimensions such that the components (3-8) to the protective body (12) has a circumferential distance (14).

5. Electrical device according to claim 4,

characterized in that

the circumferential distance (14) between one of the components (3) and the protective body (12) is different from the one

circumferential distance (23) between another of the

Components (8) and the protective body (12).

6. Electrical device according to one of the preceding

Claims,

characterized in that

the intermediate layer (24) the distance (13) between the

Assembly (1) and the protective body (12) at least partially fills and in contact with the carrier (2), the protective body (12) and at least one of the components (3).

7. Electrical device according to claim 6, characterized in that

the at least one component in contact with the intermediate layer (24) is centered and secured by the intermediate layer (24).

8. Electrical device according to one of the preceding

Claims ,

characterized in that

- At least one of the recesses (19) free or in

Essentially free of the intermediate layer (24).

9. Electrical device according to one of the preceding

Claims,

characterized in that

at least one of the components (8) not with the

Intermediate layer (24) is in contact.

10. Electrical device according to one of the preceding claims,

characterized in that

the components (3-8) are encapsulated by the carrier (2), the protective body (12) and the intermediate layer (24) and sealed to the outside.

11. Electrical device according to one of the preceding claims,

characterized in that

the protective body (12) is fastened to the carrier (2) by at least one mechanical fastening means (34).

12. Electrical device according to one of the preceding claims,

characterized in that

the protective body (12) is glued to the carrier (2) by means of the intermediate layer (24).

13. Electrical device according to one of the preceding claims,

characterized in that

the intermediate layer (24) is formed by an elastomer.

14. Electrical device according to one of the preceding claims,

characterized in that

the bottom of at least one of the recesses (19) in

thermally conductive contact with the arranged in this

Component (8) stands.

15. Electrical device according to one of the preceding claims,

characterized in that

the assembly (20) formed by the assembly (1) and the protective body (12) is at least partially surrounded by a sheath (31).

16. Electrical device according to one of the preceding claims,

characterized in that

the arrangement (20) formed by the assembly (1) and the protective body (12) is introduced into a container (25).

17. Electrical device according to claim 16,

characterized in that

the protective body into one of the recesses (19)

opening, through-opening (28) into which a projection (27) of the container (25) extends, which is in heat-conducting contact with the in this recess (19) arranged component (8).

18. Electrical device according to claim 15 and to

Claim 16 or 17,

characterized in that

the arrangement (20) at least in regions spaced from the walls of the container (25) and the sheath (31) between the assembly (20) and the walls of the container (25) is provided.

19. Method for encapsulating electrical components of an assembly (1), which comprises the components (3-8) and a carrier (2), with the method steps:

- Attaching the components (3-8) at predetermined positions on the carrier (2), so that the components (3-8) of the

Protrude carrier (2),

- Producing a protective body (12) with recesses (15-19),

- Connecting the protective body (12) with the assembly (1), so that the recesses (15-19) opposite to the predetermined positions, the components (3-8) in the recesses (15-19) immerse and between the assembly (1) and the protective body (12) remains a distance in which a

Intermediate layer (24) provided and both with the Protective body (12) as well as with the assembly (1) is brought into contact,

characterized in that

the intermediate layer (24) is formed elastically.

20. The method according to claim 19,

characterized in that

the intermediate layer (24) is applied to the protective body (12) before the protective body (12) is joined to the assembly (1).

21. The method according to claim 19 or 20,

characterized in that

the intermediate layer (24) on a front side of the

Protective body (12) applied in areas between the recesses (15-19) and introduced into at least one of the recesses (19) at least at the edge.

22. The method according to any one of claims 19 to 21,

characterized in that

the protective body (12) to the spatial structure formed by the carrier (2) and the components (3-8) in

complementarily adapted or at least approximated.

23. The method according to any one of claims 19 to 22,

characterized in that

by connecting the protective body (12) to the assembly (1), the components (3-8) are encapsulated.

24. The method according to any one of claims 19 to 23, characterized in that

the arrangement (20) formed from the assembly (1) and the protective body (12) connected to it in whole or in part

at least partially surrounded by a Vergussmase (31), which forms a shell after curing, which surrounds the assembly (20) completely or at least partially.

25. The method according to any one of claims 19 to 24,

characterized in that

the arrangement (20) formed from the assembly (1) and the protective body (12) connected thereto, into a container

(25) is introduced and connected by at least one fastening means to the container (25).

26. Method according to claims 24 and 25,

characterized in that

the arrangement (20) is arranged at least in regions at a distance from walls of the container (25) and the distance between the arrangement (20) and the walls of the container (25) with the potting compound (31) is poured out and thereby the

Sheath is formed.

27. The method according to claim 25 or 26,

characterized in that

the fastener a mechanical fastener

(26) and / or an adhesive (29).

28. The method according to any one of claims 19 to 24,

characterized in that

a spatial structure formed by the carrier (2) and the components (3-8) or at least An approximately replica mask (35) is produced and the protective body (12) is made using the mask (35).

29. The method according to claim 28,

characterized in that

- The mask (35) arranged in a mold and this is poured with a potting compound (31),

- The mask (35) after curing of the potting compound (31) is removed from the mold, wherein the cured

Potting compound forms the protective body (12),

the intermediate layer (24) on the protective body (12)

is applied,

- The assembly (1) is applied to the intermediate layer (24) and connected to the protective body (12), so that the components (3-8) in the recesses (15-19) dip and the intermediate layer (24) in contact with the Carrier (2) is brought.

30. The method according to claim 29,

characterized in that

the mold forms a housing (25) which forms with the through the assembly (1) and the protective body (12)

Arrangement is firmly connected.