DE102008043774A1 - Printed circuit board module for controller for self igniting internal combustion engine of vehicle gearbox, has base printed circuit board comprising electrical through connections at positions of electrical and electronic elements - Google Patents

Abstract

The module (10) has electrical and electronic elements such as ceramic capacitor or foil capacitor (18), flip chip slug up element (24) and a flip chip slug down element (26), arranged on a base printed circuit board or substrate (12). The board is electrically contacted at contacting regions or direct plug (38) and cutting clamp plug (40). A mold window (22) is attached to the electrical and electronic elements for heat dissipation in molding compounds (20, 50). The board has electrical through connections (28, 30) at positions of the electrical and electronic elements. The mold window is made of thermally conductive materials i.e. copper inlays, and/or thermally conductive plastic. The molding compound contains filling materials such as aluminum nitrite, carbon nano-tube, metal fibers, metallic powders or metal balls.

Description

State of the art

DE 60 2005 000 529 T2 refers to the control circuit of an engine. The circuit comprises a printed circuit board 2 on which a variety of electronic components is mounted. On the circuit board, a connector is mounted, which serves to connect the electronic components with an external circuit. The circuit device further includes a resin part 4 on, which is formed of a thermosetting resin and covers the connector, except for a connection part thereof and the circuit board. Further, there are provided cooling means integrally formed with the resin member and cooling the resin member. The coolant is designed in particular as a cooling tube through which a coolant flows. The cooling tube and the circuit board are bonded together using an adhesive and integrally formed in the resin member.

Out DE 10 2006 018 457 A1 An electronic circuit device is known. This has a housing and a circuit board on which electronic links and power transistors are mounted. Furthermore, a connector is provided for connecting the board to an external electrical circuit. The housing is molded by a resin, and the board on which the electronic members, the power transistors, and the connector are mounted is held at a predetermined position in a mold for molding the housing by the resin. Thus, in the electronic circuit device, damage of the circuit components as well as noise due to vibration excitation can be limited without increasing the number of constituent members of the electronic circuit device. According to the solution DE 10 2006 018 457 A1 a heat radiation fin is provided which serves to radiate heat. Further, a pair of Bügelab sections is formed, to which a heat radiating unit is attached and which is associated with the power transistor. The strap sections hold the power transistor such that the heat radiation unit is fixedly attached to the power transistor, which in turn is mounted on the circuit board.

EP 1 643 818 A1 refers to a surface-mounting technique in which through holes are formed in a resin-made plate. A coating process is carried out on the back side of the resin-made plates, whereby the connections of the individual terminals to the printed circuit board are carried out. In the solution according to EP 1 643 818 A1 The through holes are coated with copper and have a diameter of the order of 300 microns. The passage openings 19 , which are lined with copper, extend under the electronic components, which is equipped with the circuit board. With this solution, components that require better cooling, ie cooling than the molding compound can provide cooled. Due to the copper-lined holes underneath the electronic components on top of the resin-made printed circuit board so-called "thermal via's" through the coppered openings on the circuit board opposite side, so that the heat generated by the electronic components can be dissipated on the opposite side of the circuit board ,

at today common construction and connection techniques for Control devices, such as engine control units, the modular principle applies. In essence, the electronic components on a substrate or a printed circuit board soldered and by electrical connections or conductors, which run in the substrate connected. Connector for harness connector are soldered to the substrate or by press-fitting contacted on the substrate. The protection of the environment and media takes place through a housing, which is usually includes a lid and a bottom. Depending on the prevailing thermal Requirements are these components, d. H. Lid and bottom off Sheet metal or cast or made of plastic or the like. For special components such as to be arranged on the circuit board Electrolytic capacitors and chokes are also component carriers known, the electrically and mechanically to the substrate or to the circuit board are connected.

ECUs For example, you can create an embedding "Molding" be protected against environmental influences. A method of embedding "Molding" is the Transfer molding. This is increasingly used in the Ummolden of entire electrical and electronic assemblies or modules. There are basically two different materials used: the so-called "thermoset method" is used a thermoset, which is a crosslinking resin is. This becomes liquid under the action of heat. Processing takes place in the low-pressure spraying process or in the way of transfermolding. The short-chain ends of the molecules react chemically and lead to a network with each other. After solidification, the mold material becomes brittle and can not be remelted, so it is a non-reversible Connection is.

In a second embodiment of the transfer molding thermoplastics are used. The long-chain molecules of thermoplastics do not crosslink. The material is reversible processable, so it can be melted again. In the Re gel are the processing temperatures of "Thermoplastic" higher than the "thermoset" in the thermosets, ie crosslinking resins are used.

The Transfermolding process usually involves a pick-up or a mold for the workpiece to be overmoulded, the recording or the form usually a top and a Lower part includes. The workpiece is in the Bottom part inserted and Moldform by lowering the upper part closed. In a recording of about 170 ° C hot mold tool is a Moldtablette, so for example Duroplast inserted and melted. Under a flow pressure from, for example, 80 bar, the heated, then thin liquid Mold compound via corresponding channels in the mold pressed. After Molden, the workpiece is another Subjected to postmold process, in which the workpiece, for example "baked" at a temperature of 180 ° C for up to 2 hours. When Molden it usually comes to a chemical and thermal Shrinking from 0.1% to 1% (with highly filled molding compounds fewer). The expansion coefficients of the materials need be adapted to each other to mechanical overstress and prevent possible destruction.

Disclosure of the invention

Of the proposed solution according to the invention following are designed according to the invention Control unit required less manufacturing steps, which means the manufacturing costs decrease. It can be a higher reliability and availability are achieved, not least thanks to one significantly improved heat dissipation, it can Higher temperature ranges are permitted in which the According to the invention proposed control units for controlling internal combustion engines, in particular self-igniting Internal combustion engines can be applied.

A Basic circuit board of the control unit for an internal combustion engine or for a vehicle transmission or the like, at least enclosed at the top by a molding compound. members further information Molden can also extend around the border of the circuit board or the complete underside of the base board of the control unit lock in. Parts, or electronic components, the lie in the mold surfaces, and in particular of the molding compound could be excluded from the mold process, d. H. be released and so - called open spaces or Form cooling windows. About this one can Improvement of heat dissipation to the control unit surrounding air can be achieved.

In a design option, the free spaces or cooling window at the top or at the bottom the Grundleitplatte also with thermally conductive Materials, such as copper inlays or thermally conductive Plastics are filled.

It there is still the possibility, "flip chip Slug Up "components with a metallization or a To let part of the metallization look out of the molding compound, for a better heat dissipation of the electronic To ensure components generated heat. Optionally, the free area also with a copper inlay or thermally conductive Be filled with plastics.

At "Multi Chip modules are used for the digital part of circuits Wafer level packaging (WLP-ICs). This is the silicon laminated at the bottom and contacted and for example by means of BGA soldered to the PCB / substrate. Under BGA (Ball Grid Array) is understood a ball grid array, the represents a housing form of integrated circuits. In this case form of integrated circuits are located connections for an SMD assembly compact on the bottom of the chip. The connections are small beads of solder juxtaposed in a grid of columns and lines are. These beads are used during reflow soldering melted in a soldering oven and connect with the copper of the circuit board.

The BGA design is a solution, like a very big one Number of terminals housed on a component can be. Conventional dual in-line (DIL) or pin-grid array designs must be higher in principle Have minimum distances between the terminals, to the short circuit during the soldering process to avoid.

The Chips can be used despite the area soldering For example, with hot air removed from the circuit board without harming them. The chips can if necessary then freed from the old solder beads, cleaned and equipped with new solder balls. she can then back to a new circuit board be soldered.

Farther becomes the unbundling of fine and coarse structures of the circuit often an intermediate substrate z. B. a multi-chip module (MCM) used. According to the invention, the "wafer level Package "(WLP) or Multi Chip Module (MCM) on the PCB or the base substrate of the control unit in one operation with ummoldet. The thermal resistance of the molding compound used is significantly better than the indoor air of today's ECUs, whereby the heat dissipation, d. H. the cooling of the Multi chip module is improved, and therefore more power dissipation can be generated.

Regarding the contact with the plug of the vehicle wiring harness can different methods are used.

at a direct contact on the circuit board protrudes to be contacted Area of the circuit board out of the mold area. The molding compound has in particular a corresponding contour for centering, locking and sealing with the respective mating connector. This configuration The direct contact on the PCB saves both a complete Male connector as well as the process of partial soldering or pressing in the male connector.

In an alternative, an insert is used for contacting. Two approaches are possible. For one thing only one contact carrier soldered to the circuit board become. This contact carrier only takes over the function of positioning and isolating the pins to each other. The complete mating connector contour is created by the Ummolden.

In a second embodiment includes the insert also the contour of the mating connector. This can be the largest possible Accuracy in the fit of plug and mating connector be achieved and the robustness of such contact be increased considerably.

In a third embodiment of the contact with the plug of the vehicle wiring harness can individual Pins are also encapsulated. Especially with low-pole connectors or in addition to the representation of the largest possible variance is conceivable, individual pins by means of press-fitting with the circuit board to contact. These unframed pins will subsequently become ummoldet. It can Ummolden by the molding compound, the mating connector contour be formed or an additional interface be created to a mechanically contacting mating connector.

at the engine control unit proposed according to the invention, is dispensed electrolytic capacitors by these by ceramic capacitors be replaced. Electrolytic capacitors make special components which can not be re-registered as they outgas can and the molding process at a temperature up to 180 ° C, resulting in evaporation of the electrolyte and thus lead to the destruction of the electrolytic capacitor would. Instead of ceramic capacitors on the circuit board arranged and enclosed by the molding compound, can be used corresponding potting compounds with a temperature resistance> 180 ° C also the use of film capacitors become interesting.

Regarding the filling materials, the molding compound, d. H. the thermosets can be buried, for example, the thermal conductivity the molding materials by fillers such as Aluminum nitrite, carbon nanotubes, metal fibers, Metal powders and metal balls significantly improved. According to the invention in a second molding process, by way of the first molding process released cooling windows over the flip Chip Slug Up components themselves or on the PCB counterpart filled with flip-chip components. At "Flip Chip Slug Up "components can be the cooling window that produced in the first molding process, also completely released become.

at Modular Mold Control Units can be single ummoldete Circuit modules such as computer core module, injection power amplifier module and be mounted on a support / substrate. The modules to be mounted on the support or substrate can be completely ummoldet and holes similar the coppered "Thermal Via's", which are in the motherboards are formed to serve as electrical feedthrough. The ummoldete Circuit board for receiving the modules then includes appropriate Male connector pins that are pressed into the modules, resulting in Example in the context of insulation displacement technology can be done. The Basic circuit board has continued to be customized, for example Circuits and components as well as also unbundled from each other Modules that are typically customized. There are Contacting techniques for the modules such as latching, soldering, Collar joining and the like conceivable.

By The modular technology creates benefits in terms of coverage different control unit variants by the possibility the combination of modules on a base support, d. H. a basic circuit board. So there is the possibility of a Injection final stage module for piezo actuators and one for Magnetic actuators produce, these controllers a have the largest possible number of identical parts.

Brief description of the drawings

Based the drawing of the invention will be described in more detail.

It shows:

1 a schematic representation of an embodiment of the inventively proposed circuit board module,

2 a first embodiment variant of an electrical contacting of a Grundleiterplat te or a components receiving the substrate,

3 a further contacting variant via overmolded by a mating connector pins and

4 a further electrical contacting possibility of a printed circuit board module or of its base circuit board or substrate.

variants

Hereinafter, a molding process is understood to mean the casting of a circuit on a mother board 12 or a substrate is arranged. In particular, molding compounds 20 respectively. 50 Applied in the present context by means of the Transfermoldens. The Transfermolden is increasingly used when Ummolden whole electrical or electronic assemblies and modules. Basically, a distinction is made between two different materials to be loosened:
The thermoset process uses thermosets that are a cross-linking resin. This becomes liquid under the action of heat. The processing of the crosslinking resin is carried out in the low-pressure injection molding or transfer molding. The short-chain ends of the molecules react chemically and crosslinking occurs. After solidification of the molding material, the material is brittle and can not be remelted, ie such a vermoldetes component is irreversibly vermoldet.

At the Vermolden of thermoplastics, which are long-chain molecules and no cross-linking occurs, the molding process is reversible, d. H. The molding compound can be melted again. The processing temperatures of thermoplastics to be lapped are higher than in the thermoset method, where thermosets are used.

According to the transfermold, a receptacle or a shape for the workpiece to be overmolded comprises, for example, a base circuit board 12 , which is equipped with electrical or electronic components is a top and a bottom. The workpiece is inserted into the lower part and the Moldform closed by lowering the upper part. In a recording of about 170 ° C hot mold tool, the so-called mold tablet made of a thermosetting plastic or thermoplastic is used and melted. Under a flow pressure of the order of about 80 bar, the low viscosity molding compound is pressed through corresponding channels in the mold. After the molding process, the workpiece is treated in another Postmoldvorgang in which the workpiece is kept warm at 180 ° C for up to 2 hours. Molden causes a chemical and thermal shrinkage of the order of 0.1% to 1%. In the case of highly filled molding compounds, ie molding compounds which may have a high admixture of filler materials, the shrinkage may also be lower. The expansion coefficients of the materials are adapted so that a mechanical load and possible damage to the components used is reliably avoided.

From the schematic representation according to 1 it turns out that a pcb module 10 a basic circuit board 12 or an equivalent substrate. A top of the base board 12 is by reference numerals 14 , whose underside with reference numerals 16 designated. On the top and bottom 14 respectively. 16 the basic circuit board 12 are electronic components 18 attached. These may be capacitors, transistors, resistors and the like. The electronic components 18 can either be just on the top 14 , only on the bottom 16 or on both sides 14 . 16 the basic circuit board 12 be provided.

As shown in the illustration 1 it can be seen further, is the base board 12 and those on the top 14 or its underside 16 arranged electrical components 18 of molding compounds 20 respectively. 50 enclosed. These molding compounds may be the above-mentioned thermosets or thermoplastics. For the molding compounds used 20 . 50 Mold materials are used whose thermal conductivity is improved, for example, by adding aluminum nitrite, carbon nanotubes, metal fibers, metal powders or metal spheres etc. to the mold materials. Due to the degree of incorporation of further filling materials, the electromagnetic compatibility of the circuit board module proposed according to the invention can also be used 10 be influenced favorably.

With the electronic components 18 . 34 . 36 that on the top 14 or the bottom 16 the basic circuit board 12 or the substrate 12 are arranged, are transistors, resistors, diodes and the like. Furthermore, there are also electronic components 18 as condensers installed. The capacitors are preferably ceramic capacitors or film capacitors which have a temperature resistance of> 180 ° C, so that they during the molding process, ie the Vermolden from the top 14 the base board or the bottom 16 the basic circuit board 12 can not be damaged, which may well be the case with special components such as electrolytic capacitors.

The representation according to 1 it is clear, that here, for example, above a top 34 one, for example, as a slug-up device 24 procured electronic component, a free space or a mold window 22 in the molding compound 20 at the top 14 the basic circuit board 12 is trained. This window or this free space 22 in the molding compound 20 at the top 14 serves to better heat dissipation of the electronic component 34 , in this case a slug-up device 24 , As shown in the illustration 1 can be further removed, has the mold window 22 a funnel-shaped geometry, an opening angle of the window 22 is denoted by α. Depending on manufacturing conditions, the opening angle α in the order of 60 to 120 or, for example, as shown in FIG 1 shown 90 °. The representation according to 1 can be further seen that the free space 22 or the window 22 by inclines conditions 32 in the molding compound 20 is limited. Through the slopes 32 that the free space 22 or the mold window 22 Limiting the convection is favorably influenced and the heat dissipation from the exposed top 34 of the slug-up component 24 favored. The mold window or the free space 22 according to the 1 at the top 14 the basic circuit board 12 in the molding compound 20 formed at the top, can also be filled with thermally conductive materials, such as copper inlays or thermally conductive plastics. Furthermore, there is the possibility in a second mold step after the application of the first molding compound 20 and molding the mold window 22 or the free space 22 to fill in these with respect to its thermal conductivity improved molding material. This can be done in a second molding step following the first molding step for applying the molding compound 20 connects, done. The mold window 22 or the free space 22 over the flip chip slug up device 24 itself or on a circuit board opposite side, ie this opposite at the bottom 16 formed, can be filled with these improved in terms of their thermal conductivity molding compound.

From the illustration according to 1 also, that results in one at the bottom 16 the basic circuit board 12 or the substrate 12 arranged slug-down component 26 from a molding compound 50 is covered. An electrical contact of the slug-down device 26 done via contacts 36 at the bottom 16 are indicated. Also in the molding compound 50 on the bottom 16 the basic circuit board 12 or the substrate 12 can the mold windows 22 or open spaces 22 that in the molding compound 20 at the top 14 the basic circuit board 12 or the substrate 12 are formed, be provided.

From the illustration according to 1 it also follows that the base board 12 in the area at the top 14 or the bottom 16 assembled electronic components 24 . 26 Thermal Via's 28 having. Thermal Via's are electrical vias whose primary purpose is to improve thermal conductivity. As a rule, these electrical vias (thermal vias) are prefabricated. By a very dense arrangement, for example in a hexagonal grid of about 0.5 mm and a diameter of the thermal via's of a few tenths of a millimeter up to 10% thermally conductive materials can be introduced into the circuit board.

These electrical vias (Thermal Via's) 28 run through the base board 12 or the substrate and can with a Cu lining, indicated by reference numerals 30 be provided. This can be achieved that of the example at the top 14 the basic circuit board 12 or the substrate 12 assembled electronic component 24 or its top 34 Heat to a copper-plated formed underside, for example 16 , that is discharged to the PCB opposite side. If this area is not ummoldet, can a radiation or heat transfer via convection from the bottom 16 of the PCB module 10 out.

In the illustration according to 1 are beyond electrical contacting possibilities of the base board 12 or the substrate 12 refer to. The electrical contacting of the base board 12 or the substrate 12 can via a direct plug 38 , ie a direct contacting done. In this case, the region of the printed circuit board to be contacted protrudes out of the mold region, as shown in FIG 1 is the direct plug 38 at the front of the base board 12 between the molding compound 20 at the top 14 and the mold mass 50 on the bottom 16 the basic circuit board 12 or the substrate 12 , Advantageously, the direct plug 38 in a protruding area of mold masses 20 . 50 be formed so that a corresponding contour for centering, locking and sealing with a in 1 not shown mating connector is given. This configuration saves both a complete male connector as well as a partial soldering or pressing them into the molding compounds 20 . 50 one.

Alternatively, a contact via a in 1 only schematically indicated insulation displacement connector 40 or a male connector. The electrical contacting is preferably carried out by pressing one of the molding compounds 20 respectively. 50 in a correspondingly configured male connector, wherein the electrical contact pins at predetermined points within the Moldmassen 20 respectively. 50 lie and at a defined Positionie tion of the appropriately trained mating contacts of the insulation displacement connector 40 can be contacted.

The representation according to 2 there is a mating connector to be found in the molding compound 20 . 50 is formed.

2 shows that the mating connector 44 in the mold masses 20 at the top 14 or the molding compound 50 on the bottom 16 the basic circuit board 12 or the substrate is formed. In the cavity of the mating connector 44 protrudes an ummoldetes end of the base board 12 or the substrate 12 at which a contact area 42 is trained.

As the schematic representation according to 2 can be seen, are located at the top 14 or the bottom 16 the basic circuit board 12 or the substrate 12 Electronic Components 18 ,

The representation according to 3 is another embodiment of an electrical contacting of a printed circuit board module 10 refer to.

Analogous to the representation according to 2 are according to the embodiment in 3 both the top 14 as well as the bottom 16 the basic circuit board 12 or the substrate 12 and the electronic components incorporated therein 18 ummoldet. At the top 14 is the mold mass 20 while at the bottom 16 the basic circuit board 12 or the substrate 12 the molding compound 50 is executed. The molding compound 50 is formed in a smaller thickness than the molding compound 20 at the top 14 the basic circuit board 12 or the substrate 12 , As 3 shows is located at one end, here at the top 14 the basic circuit board 12 or the substrate 12 an insert 48 , with which contacting pins 46 are fixed. The free ends of the contact pins 46 protrude into a cavity of the mating connector 44 into it, which in this case also on the side of the Moldmassen 20 respectively. 50 is formed. With the electronic components 18 at the top 14 or the bottom 16 are arranged, it can also be slug-up components as well as slug-down components 26 act, cf. Representation according to 1 ,

4 shows a further embodiment of a contacting possibility of the inventively proposed circuit board module 10 , As 4 shows, the mating connector runs 44 in contrast to the embodiments according to the 2 and 3 not in horizontal direction, but extends vertically upward and is only through the molding compound 20 at the top 14 the basic circuit board 12 or the substrate 12 educated. In the in 4 illustrated embodiment, it also lacks an Anlegeteil 48 for fixing angled trained contact pins 46 , which according to the embodiment in 4 coaxial with the mating connector 44 run and perpendicular to the base board 12 or the substrate 12 enter. Both at the top 14 the basic circuit board 12 or the substrate 12 as well as at the bottom 16 are electronic components, here generally designated by reference numerals 18 , With the electronic components 18 It may be slug-up components in relation to the top 24 and in terms of the bottom 16 around slug-down components 26 act.

The inventively proposed, based on the above 1 to 4 described PCB module 10 could advantageously find use on a modular mold control equipment concept. With a limitation on the size of ummoldeter substrates 12 , could individual ummoldete circuit modules, in particular PCB modules 10 as above with reference to 1 to 4 described, for example, a computer core module, injection final stage module or the like are mounted on a support or a substrate. The individual PCB modules 10 could be completely ummoldet, ie with the Moldmassen 20 and 50 on the tops 14 and 16 ummoldet be and holes similar to the electrical vias (Thermal Via's) 28 in the basic circuit boards 12 or the substrates 12 the PCB modules 10 serve as a contact. The ummoldete base plate of the control unit in turn to accommodate the individual PCB modules 10 , may be provided with male connector pins or insulation displacement contacts, which protrude from the top and bottom and in which the individual PCB modules 10 according to the 1 to 4 can be pressed. The base plate of the modular mold control device may then further comprise custom circuits and components. Other contacting techniques may also be used for electrical through-connection of the printed circuit board modules 10 be used with the base plate of the modular Moldsteuergerätes such as locking, soldering, collar joining and the like.

Thus, modular Moldsteuergerätekonzepte could realize in which a variety of ECU variants could be covered by different combinations of printed circuit board modules on a common base support 10 are arranged. Thus, it is conceivable to produce an injection final stage module for piezo actuators and one for magnetic actuators, wherein the individual printed circuit board modules 10 can be identical.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• - DE 602005000529 T2 [0001]
• - DE 102006018457 A1 [0002, 0002]
• - EP 1643818 A1 [0003, 0003]

Claims (11)

PCB module ( 10 ) for control devices, in particular for internal combustion engines with a base circuit board ( 12 ) or a substrate ( 12 ) on which electrical and electronic components ( 18 . 24 . 26 ), the base board ( 12 ) or the substrate ( 12 ) at a contacting area ( 42 ) or a contact ( 38 . 40 . 46 ) is electrically contacted and the printed circuit board module ( 10 ) on at least one side ( 14 . 16 ) a molding compound ( 20 . 50 ), characterized in that the electrical or electronic components ( 18 . 24 . 26 ) Mold windows ( 22 ) for cooling in the molding compound ( 20 . 50 ) and the base board ( 12 ) or the substrate ( 12 ) at the positions of the electrical components ( 18 . 24 . 26 ) electrical vias (Thermal Via's) ( 28 . 30 ) having. Printed circuit board module according to claim 1, characterized in that the mold windows ( 22 ) for cooling in the molding compound ( 20 . 50 ) are funnel-shaped and formed by Moldschrägen ( 32 ) are limited. Printed circuit board module according to claim 1, characterized in that the mold windows ( 22 ) for cooling in the molding compound ( 20 . 50 ) have an opening angle α between 60 ° and 120 °, preferably 90 °. Printed circuit board module according to claim 1, characterized in that the mold windows ( 22 ) for heat dissipation thermally conductive materials, in particular copper inlays and / or thermally conductive plastic is inserted. Printed circuit board module according to claim 4, characterized in that the thermally conductive materials Metal dopants or carbon nanotubes included. Printed circuit board module according to claim 1, characterized in that the electrical vias (Thermal Via's) ( 28 . 30 ) as copper conductors ( 30 ) are executed and on a copper-plated printed circuit board opposite side, in particular a base circuit board ( 12 ) or a substrate ( 12 ) end up. Circuit board module according to claim 1, characterized in that the molding compound ( 20 . 50 ) whose thermal conductivity contains improving filling materials such as aluminum nitrite, carbon nanotubes, metal fibers, metal powder or metal balls. Printed circuit board module according to claim 1, characterized in that the electrical or electronic components ( 18 . 24 . 26 ) on the motherboard ( 12 ) or the substrate ( 12 ) are ceramic capacitors or film capacitors. Printed circuit board module according to claim 1, characterized in that the electrical components ( 18 . 24 . 26 ) as flip-chip slug-up devices ( 24 ) or flip-chip slug-down devices ( 26 ), the mold windows ( 22 ) are filled with a thermally conductive molding material for cooling in a further molding process. Printed circuit board module according to claim 1, characterized in that this component of a modular Moldsteuergerätes with several printed circuit board modules ( 10 ), each of molding compound ( 20 . 50 ) are completely or partly ummoldet, the Moldfenster for cooling ( 22 ) of which electrical vias (Thermal Via's) ( 28 . 30 ). Printed circuit board module according to claim 10, characterized in that a base plate of the modular Moldsteuergerätes a male connector or cutting / Klemmkontaktierungen ( 40 ) into which the printed circuit board modules ( 10 ) are milled.