DE102013206256A1 - Method for producing a plug - Google Patents

Method for producing a plug Download PDF

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Publication number
DE102013206256A1
DE102013206256A1 DE201310206256 DE102013206256A DE102013206256A1 DE 102013206256 A1 DE102013206256 A1 DE 102013206256A1 DE 201310206256 DE201310206256 DE 201310206256 DE 102013206256 A DE102013206256 A DE 102013206256A DE 102013206256 A1 DE102013206256 A1 DE 102013206256A1
Authority
DE
Germany
Prior art keywords
circuit board
plug
printed circuit
connector
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE201310206256
Other languages
German (de)
Inventor
Christoph Schikora
Bernd Ströhlein
Stefan Schaub
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Priority to DE201310206256 priority Critical patent/DE102013206256A1/en
Publication of DE102013206256A1 publication Critical patent/DE102013206256A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung eines Steckers (2), umfassend die Schritte: Bereitstellen einer FR4-Mehrlagenleiterplatte (1), Einbringen von Steckerpins (4) in einen für den Steckerbereich (3) vorgesehenen Teil der Mehrlagenleiterplatte (1) und Umspritzen des Steckerbereichs (3) der Mehrlagenleiterplatte (1) mit einem duroplastischen Material (8), wobei während des Umspritzprozesses im Steckerbereich (3) der Stecker (2) mit der Gegensteckerkontur gebildet wirdThe invention relates to a method for producing a plug (2), comprising the steps: providing an FR4 multilayer printed circuit board (1), inserting plug pins (4) into a part of the multilayer printed circuit board (1) provided for the plug area (3) and overmolding the Connector area (3) of the multilayer printed circuit board (1) with a thermosetting material (8), the connector (2) with the mating connector contour being formed in the connector area (3) during the extrusion process

Description

Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Herstellung eines Steckers. The present invention relates to a method of manufacturing a connector.

DE 60 2005 000 529 T2 bezieht sich auf die Steuerschaltung eines Motors. Die Schaltung umfasst eine Leiterplatte, auf der eine Vielzahl von elektronischen Bauteilen angebracht ist. Auf der Leiterplatte ist ein Verbinder angebracht, der zur Verbindung der elektronischen Bauteile mit einer externen Schaltung dient. DE 60 2005 000 529 T2 refers to the control circuit of an engine. The circuit comprises a printed circuit board on which a plurality of electronic components is mounted. On the circuit board, a connector is mounted, which serves to connect the electronic components with an external circuit.

Aus DE 10 2006 018 457 A1 ist eine elektronische Schaltungsvorrichtung bekannt. Diese weist ein Gehäuse sowie eine Platine auf, auf welcher elektronisch Glieder und Leistungstransistoren montiert sind. Des Weiteren ist ein Verbinder vorgesehen, zum Verbinden der Platine mit einer externen elektrischen Schaltung. Out DE 10 2006 018 457 A1 An electronic circuit device is known. This has a housing and a circuit board on which electronic links and power transistors are mounted. Furthermore, a connector is provided for connecting the board to an external electrical circuit.

Bei heute gängigen Aufbau- und Verbindungstechniken für Steuergeräte, so zum Beispiel Motorsteuergeräten, findet das Baukastenprinzip Anwendung. Im Wesentlichen werden die elektronischen Bauelemente auf ein Substrat oder eine Leiterplatte aufgelötet und durch elektrische Verbindungen oder Leiterbahnen, die im Substrat verlaufen, verbunden. Steckverbinder zum Kabelbaumstecker werden auf dem Substrat verlötet oder mittels Einpresstechnik auf dem Substrat kontaktiert. Der Schutz der vor Umwelteinflüssen und Medien erfolgt durch ein Gehäuse, welches in der Regel einen Deckel und einen Boden umfasst. Je nach den herrschenden thermischen Anforderungen, sind diese Komponenten, d.h. Deckel und Boden aus Blech oder aus Guss oder aus Kunststoff oder dergleichen gefertigt. In today's common construction and connection techniques for control devices, such as engine control units, the modular principle applies. In essence, the electronic components are soldered onto a substrate or printed circuit board and connected by electrical connections or traces running in the substrate. Connectors to the harness connector are soldered to the substrate or contacted by press-fitting on the substrate. The protection against environmental influences and media takes place by means of a housing, which as a rule comprises a cover and a floor. Depending on the prevailing thermal requirements, these components, i. Lid and bottom made of sheet metal or cast or plastic or the like.

Aus DE 10 2008 043 774 A1 ist ein Leiterplattenmodul für Steuergeräte, insbesondere für Verbrennungskraftmaschinen bekannt. Das Leiterplattenmodul umfasst eine Grundleiterplatte oder ein Substrat, an welchem elektrische oder elektronische Bauelemente angeordnet sind. Die Grundleiterplatte ist an einem Kontaktierungsbereich oder einer Kontaktierung elektrisch kontaktiert. Das Leiterplattenmodul weist zumindest auf einer Seite eine Moldmasse auf. Den elektrischen oder elektronischen Bauelementen sind Moldfenster zur Entwärmung in der Moldmasse zugeordnet, ferner weist die Grundleiterplatte an den Positionen der elektrischen oder elektronischen Bauelemente elektrische Durchkontaktierungen auf. Out DE 10 2008 043 774 A1 is a printed circuit board module for control devices, in particular for internal combustion engines known. The printed circuit board module comprises a base circuit board or a substrate on which electrical or electronic components are arranged. The base circuit board is electrically contacted at a Kontaktierungsbereich or a contact. The printed circuit board module has a molding compound on at least one side. The electrical or electronic components are associated with Moldfenster for cooling in the molding compound, further, the base circuit board at the positions of the electrical or electronic components on electrical vias.

Aufgabe der Erfindung ist es, ein Verfahren anzugeben, mit welchem es möglich ist, einen Stecker mit wenig Aufwand an einer Leiterplatte anzubringen. The object of the invention is to provide a method with which it is possible to attach a connector with little effort to a circuit board.

Diese Aufgabe wird mit dem Verfahren gemäß den Merkmalen des geltenden Patentanspruchs 1 gelöst. Vorteilhafte Ausführungen sind Gegenstand von Unteransprüchen. This object is achieved by the method according to the features of the valid claim 1. Advantageous embodiments are the subject of dependent claims.

Erfindungsgemäß wird in einem ersten Schritt eine FR4-Mehrlagenleiterplatte bereitgestellt. Anschließend werden Steckerpins in einen für den Steckerbereich vorgesehenen Teil der FR4-Mehrlagenleiterplatte eingebracht. In einem weiteren Verfahrensschritt wird der Steckerbereich der FR4-Mehrlagenleiterplatte mit einem duroplastischen Material umspritzt, wobei während des Umspritzprozesses im Steckerbereich der Stecker mit der Gegensteckerkontur gebildet wird. According to the invention, a FR4 multi-layer printed circuit board is provided in a first step. Subsequently, plug pins are inserted into a part of the FR4 multi-layer printed circuit board intended for the plug region. In a further method step, the plug region of the FR4 multi-layer printed circuit board is encapsulated with a thermosetting material, wherein the plug with the mating plug contour is formed during the extrusion process in the plug region.

Zweckmäßig werden die Steckerpins in im Steckerbereich vorgesehene Bohrungen eingesteckt oder eingelötet. Dadurch ist es möglich, einen Stecker mit einer vorgegebenen Anzahl von Anschlüssen (Polen) herzustellen. Zweckmäßig sind die Bohrungen dabei Durchgangsbohrungen oder Sacklöcher. Die Sacklöcher enden dabei auf unterschiedlichen Lagen der Mehrlagenleiterplatte. The plug pins are expediently inserted or soldered into holes provided in the plug region. This makes it possible to produce a plug with a predetermined number of terminals (poles). Appropriately, the holes are through holes or blind holes. The blind holes end up on different layers of the multilayer printed circuit board.

Durch die Umspritzung werden die Steckerpins abgedichtet, so dass z.B. keine Umgebungsfeuchtigkeit in die Bohrungen der Leiterplatte eindringen kann. The encapsulation seals the plug pins so that e.g. no ambient moisture can penetrate into the bores of the printed circuit board.

Zweckmäßig wird nicht nur der für den Stecker vorgesehene Steckerbereich der FR4-Mehrlagenleiterplatte umspritzt, sondern es erfolgt eine vollständige Umspritzung der FR4-Mehrlagenleiterplatte. It is expedient not only to encapsulate the plug region of the FR4 multi-layer printed circuit board provided for the plug, but also to completely overmold the FR4 multi-layer printed circuit board.

Die Erfindung wird anhand Figuren näher erläutert. Es zeigen: The invention will be explained in more detail with reference to figures. Show it:

1 eine Mehrlagenleiterplatte mit einem Stecker, wobei die Mehrlagenleiterplatte im Bereich des Steckers umspritzt ist, 1 a multi-layer printed circuit board with a plug, wherein the multi-layer printed circuit board is encapsulated in the region of the plug,

2 eine Mehrlagenleiterplatte mit einem Stecker, wobei die Mehrlagenleiterplatte vollständig umspritzt ist, 2 a multi-layer printed circuit board with a plug, wherein the multi-layer printed circuit board is completely encapsulated,

3 eine Mehrlagenleiterplatte mit einem Stecker gemäß 1, wobei Steckerpins mit unterschiedlichen Ebenen der Mehrlagenleiterplatte verbunden sind. 3 a multi-layer printed circuit board with a plug according to 1 wherein plug pins are connected to different levels of the multilayer printed circuit board.

1 bis 3 zeigen Mehrlagenleiterplatten 1 mit beispielhaft einem Stecker 2 im Steckerbereich 3. Der Stecker 2 umfasst dabei Steckerpins 4, welche in die Leiterplatte 1 eingebracht sind. 1 to 3 show multi-layer printed circuit boards 1 with an example of a plug 2 in the connector area 3 , The plug 2 includes plug pins 4 which are in the circuit board 1 are introduced.

1 und 2 zeigen Steckerpins 4, die in Durchgangsbohrungen 5, welche in der Leiterplatte 1 vorgesehen sind, eingebracht sind. In 1 ist der Steckerbereich 3 mit dem Stecker 2 von einem Duroplasten 8 umschlossen. Das Duroplast bildet dabei für den Stecker 2 die für den Gegenstecker (nicht dargestellt) nötige Kontur aus. In 2 umschließt das Duroplast die gesamte Mehrlagenleiterplatte 1 sowie auf der Leiterplatte 1 vorgesehene elektronischen Bauelemente 9. 1 and 2 show connector pins 4 in through holes 5 which is in the circuit board 1 are provided are introduced. In 1 is the connector area 3 with the plug 2 from a thermoset 8th enclosed. The thermoset forms for the plug 2 the necessary for the mating connector (not shown) contour. In 2 The thermoset encloses the entire multi-layer PCB 1 as well as on the circuit board 1 provided electronic components 9 ,

3 zeigt Steckerpins 4, welche in Sacklöchern 6 mit definierter Tiefe eingebracht sind. Die Sacklöcher 6 enden dabei auf jeweils unterschiedlichen Lagen 7 der Mehrlagenleiterplatte 1. Selbstverständlich können mehrere Sacklöcher 6 auf identischen Lagen 7 enden. Selbstverständlich können neben Sacklöchern 6 auch Durchgangsbohrungen 5 vorhanden sein. 3 shows connector pins 4 which are in blind holes 6 are introduced with a defined depth. The blind holes 6 end up on different layers 7 the multilayer printed circuit board 1 , Of course, several blind holes 6 on identical positions 7 end up. Of course, in addition to blind holes 6 also through holes 5 to be available.

Der besseren Anschauung halber wird in 3 auf die Darstellung des Steckers 2 verzichtet, so dass lediglich der mit dem Duroplast 8 umspritzte Steckerbereich dar3 gestellt ist. Selbstverständlich kann der in 3 nicht dargestellte Stecker 2 eine ähnliche Kontur aufweisen wie in 1 oder 2 dargestellt. Insbesondere sollen die in 1 oder 2 dargestellte Konturen keine Beschränkung darstellen. Grundsätzlich ist es möglich, dass der Stecker 2 jede mögliche vorgebbare Kontur annehmen kann. For better intuition, in 3 on the appearance of the plug 2 dispensed so that only the with the thermoset 8th overmolded connector area dar3 is set. Of course, the in 3 not shown plug 2 have a similar contour as in 1 or 2 shown. In particular, the in 1 or 2 represented contours represent no limitation. Basically, it is possible that the plug 2 can take any predeterminable contour.

Der Vorteil der in 3 gezeigten Anordnung ist es, dass ein einfacheres Layout der Mehrlagenleiterplatten 1 ermöglicht wird. The advantage of in 3 The arrangement shown is that a simpler layout of the multilayer printed circuit boards 1 is possible.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

1 1
Mehrlagenleiterplatten Multilayer printed circuit boards
2 2
Stecker plug
3 3
Steckerbereich plug area
4 4
Steckerpin Connector pin
5 5
Durchgangsbohrung Through Hole
6 6
Sackloch blind
7 7
Lage location
8 8th
Duroplast thermoset
9 9
elektronischen Bauelemente electronic components

ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • DE 602005000529 T2 [0002] DE 602005000529 T2 [0002]
  • DE 102006018457 A1 [0003] DE 102006018457 A1 [0003]
  • DE 102008043774 A1 [0005] DE 102008043774 A1 [0005]

Claims (4)

Verfahren zur Herstellung eines Steckers (2), umfassend folgende Schritte: (S1) Bereitstellen einer FR4-Mehrlagenleiterplatte (1), (S2) Einbringen von Steckerpins (4) in einen für den Steckerbereich (3) vorgesehenen Teil der FR4-Mehrlagenleiterplatte (1), (S3) Umspritzen des Steckerbereichs (3) der FR4-Mehrlagenleiterplatte (1) mit einem duroplastischen Material (8), wobei während des Umspritzprozesses im Steckerbereich (3) der Stecker (2) mit der Gegensteckerkontur gebildet wird. Method for producing a plug ( 2 comprising the steps of: (S1) providing a FR4 multilayer printed circuit board (S1) 1 ), (S2) inserting connector pins ( 4 ) in one for the connector area ( 3 ) part of the FR4 multilayer printed circuit board ( 1 ), (S3) overmolding the connector area ( 3 ) of the FR4 multilayer printed circuit board ( 1 ) with a thermosetting material ( 8th ), wherein during the extrusion process in the connector area ( 3 ) The plug ( 2 ) is formed with the mating connector contour. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass die Steckerpins (4) in im Steckerbereich (3) vorgesehene Bohrungen (5, 6) eingesteckt oder eingelötet werden. Method according to claim 1, characterized in that the plug pins ( 4 ) in the connector area ( 3 ) provided holes ( 5 . 6 ) or soldered. Verfahren nach Anspruch 2, dadurch gekennzeichnet, dass die Bohrungen (5, 6) Durchgangsbohrungen (5) und/oder Sacklöcher (6) sind. Method according to claim 2, characterized in that the bores ( 5 . 6 ) Through holes ( 5 ) and / or blind holes ( 6 ) are. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass im Schritt (S3) die FR4-Mehrlagenleiterplatte (1) vollständig umspritzt wird. Method according to one of the preceding claims, characterized in that in step (S3) the FR4 multilayer printed circuit board ( 1 ) is completely encapsulated.
DE201310206256 2013-04-10 2013-04-10 Method for producing a plug Pending DE102013206256A1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014207316A1 (en) * 2014-04-16 2015-10-22 Zf Friedrichshafen Ag Pen tray, pen tray assembly, printed circuit board system and method of making a printed circuit board system
WO2018108364A1 (en) * 2016-12-13 2018-06-21 Robert Bosch Gmbh Transmission control device, in particular for a motor vehicle, and method for producing an electrical-connector housing
WO2018114265A1 (en) * 2016-12-21 2018-06-28 Conti Temic Microelectronic Gmbh Method for electrically contacting a printed circuit board with a pin
DE102018204714A1 (en) * 2018-03-28 2019-10-02 Bayerische Motoren Werke Aktiengesellschaft Printed circuit board connection arrangement for a control device and method for producing a printed circuit board connection arrangement

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0641154A1 (en) * 1993-08-30 1995-03-01 TEMIC TELEFUNKEN microelectronic GmbH Housing for electronic components
DE102004011804A1 (en) * 2004-03-11 2005-10-06 Leuze Electronic Gmbh & Co Kg Optical sensor for detecting objects in area to be monitored comprises casing(s) to accommodate optical and electronic components
DE102006018457A1 (en) 2005-04-19 2006-11-02 Denso Corp., Kariya Electronic circuit apparatus, e.g. engine electronic control unit, used to control operation of electrical devices at vehicle, comprises casing that is molded to seal part of connector and whole of circuit board and component in resin
DE602005000529T2 (en) 2004-07-13 2007-11-22 Hitachi, Ltd. Control circuit of an engine
DE102006038373A1 (en) * 2006-08-12 2008-02-14 Robert Bosch Gmbh Electrical device, especially for determining electrical parameters, e.g. battery sensor, has conductive boundary surface between two conductor sections that is offset relative to the central axis
DE102008043774A1 (en) 2008-11-17 2010-05-20 Robert Bosch Gmbh Printed circuit board module for controller for self igniting internal combustion engine of vehicle gearbox, has base printed circuit board comprising electrical through connections at positions of electrical and electronic elements
DE102009026806A1 (en) * 2009-06-08 2010-12-09 Robert Bosch Gmbh Electronic component and method for producing the electronic component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0641154A1 (en) * 1993-08-30 1995-03-01 TEMIC TELEFUNKEN microelectronic GmbH Housing for electronic components
DE102004011804A1 (en) * 2004-03-11 2005-10-06 Leuze Electronic Gmbh & Co Kg Optical sensor for detecting objects in area to be monitored comprises casing(s) to accommodate optical and electronic components
DE602005000529T2 (en) 2004-07-13 2007-11-22 Hitachi, Ltd. Control circuit of an engine
DE102006018457A1 (en) 2005-04-19 2006-11-02 Denso Corp., Kariya Electronic circuit apparatus, e.g. engine electronic control unit, used to control operation of electrical devices at vehicle, comprises casing that is molded to seal part of connector and whole of circuit board and component in resin
DE102006038373A1 (en) * 2006-08-12 2008-02-14 Robert Bosch Gmbh Electrical device, especially for determining electrical parameters, e.g. battery sensor, has conductive boundary surface between two conductor sections that is offset relative to the central axis
DE102008043774A1 (en) 2008-11-17 2010-05-20 Robert Bosch Gmbh Printed circuit board module for controller for self igniting internal combustion engine of vehicle gearbox, has base printed circuit board comprising electrical through connections at positions of electrical and electronic elements
DE102009026806A1 (en) * 2009-06-08 2010-12-09 Robert Bosch Gmbh Electronic component and method for producing the electronic component

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014207316A1 (en) * 2014-04-16 2015-10-22 Zf Friedrichshafen Ag Pen tray, pen tray assembly, printed circuit board system and method of making a printed circuit board system
WO2018108364A1 (en) * 2016-12-13 2018-06-21 Robert Bosch Gmbh Transmission control device, in particular for a motor vehicle, and method for producing an electrical-connector housing
CN110036538A (en) * 2016-12-13 2019-07-19 罗伯特·博世有限公司 Method especially for the transmission control mechanism of motor vehicle and for manufacturing plug casing
CN110036538B (en) * 2016-12-13 2021-02-12 罗伯特·博世有限公司 Transmission control for a motor vehicle and method for producing a plug housing
US10939565B2 (en) 2016-12-13 2021-03-02 Robert Bosch Gmbh Transmission control device, in particular for a motor vehicle, and method for producing an electrical-connector housing
WO2018114265A1 (en) * 2016-12-21 2018-06-28 Conti Temic Microelectronic Gmbh Method for electrically contacting a printed circuit board with a pin
DE102018204714A1 (en) * 2018-03-28 2019-10-02 Bayerische Motoren Werke Aktiengesellschaft Printed circuit board connection arrangement for a control device and method for producing a printed circuit board connection arrangement

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