FR3064445A1 - DEVICE FOR CONTROLLING THE POWER SUPPLY FOR A SEMICONDUCTOR LIGHT SOURCE - Google Patents

Abstract

The present invention relates to a device (10) for controlling the power supply for a light source with semiconductor for a light module, the control device (10) comprising: a printed circuit board (3) comprising at least one electronic component (3B) for controlling the power supply; - a protective housing (5) of said printed circuit board (3), said protective housing (5) being made of plastic overmolded on said printed circuit board (3).

Description

TECHNICAL FIELD OF THE INVENTION

The present invention relates to a device for controlling the power supply for a semiconductor light source.

It finds a particular but non-limiting application in light modules for motor vehicles.

TECHNOLOGICAL BACKGROUND OF THE INVENTION

A device for controlling the electrical supply for a semiconductor light source comprises, in a manner known to those skilled in the art:

- a printed circuit board comprising at least one electronic component for controlling the semiconductor light source;

- a protective cover;

- a housing closed by the protective cover, said printed circuit card being housed in said housing;

- two thermal interfaces (adhesive or thermal pastes) disposed respectively between the printed circuit board and the housing, and between the printed circuit board and the protective cover.

A drawback of this prior art is that the manufacture of such a control device requires the production and assembly of many parts, namely two stamped parts (the protective cover and the housing) and the two interfaces. thermal.

In this context, the present invention aims to solve the aforementioned drawback.

GENERAL DESCRIPTION OF THE INVENTION

To this end, the invention proposes a device for controlling the electrical supply for a semiconductor light source for a light module, said light device comprising:

- a printed circuit board comprising at least one electronic component for controlling the power supply;

a protective box for said printed circuit card, said protective box being made of plastic overmolded on said printed circuit board.

Thus, as will be seen in detail below, by molding the protective housing on the printed circuit board, the protective cover and the housing of the state of the prior art are replaced by a single piece. In addition, the overmolded plastic fills the spaces between the various electronic components of the printed circuit board. The heat produced by these various electronic components will then be transferred by the plastic to a heat exchange surface of the protective housing. It is therefore not necessary to provide a specific thermal interface for each electronic component (in particular those which heat) and the protective housing. The method of assembling and manufacturing the device for controlling the power supply for a semiconductor light source is thus facilitated and is also less expensive.

According to non-limiting embodiments, the control device can also include one or more additional characteristics among the following:

According to a nonlimiting embodiment, said protective housing is molded onto all or part of the printed circuit card.

According to a nonlimiting embodiment, said plastic is an electrically insulating plastic.

According to a nonlimiting embodiment, said plastic is a thermally conductive plastic.

According to a nonlimiting embodiment, said plastic is a charged thermal conductive plastic.

According to a nonlimiting embodiment, said protective housing is covered by a metallization layer.

According to a nonlimiting embodiment, said protective housing includes a heat exchange surface.

According to a nonlimiting embodiment, said heat exchange surface is flat or comprises a plurality of fins.

According to a nonlimiting embodiment, said plurality of fins is molded.

According to a nonlimiting embodiment, said molded protective housing is in contact with said at least one electronic component.

According to a nonlimiting embodiment, said protective casing comprises at least one overmolded mechanical interface.

According to a nonlimiting embodiment, said at least one overmolded mechanical interface is adapted to guide a connector in the control device, said connector being adapted to cooperate with said printed circuit board.

According to a nonlimiting embodiment, said at least one overmolded mechanical interface is adapted to fix said control device in the light module.

According to a nonlimiting embodiment, said at least one overmolded mechanical interface comprises at least one fixing lug or a screwing barrel.

According to a nonlimiting embodiment, said semiconductor light source is part of a light emitting diode.

A light module for a motor vehicle is also proposed in which said light module comprises at least one semiconductor light source and a device for controlling the electrical supply for said at least one semiconductor light source according to any one of previous features.

The protective casing surrounds the electronic components of the printed circuit board and keeps them in place thanks to the overmolding.

The overmolding of the protective housing allows a compact and small control device to be obtained.

The light source is controlled by the control device so as to obtain a predetermined photometric function for the light module comprising said at least one light source.

BRIEF DESCRIPTION OF THE FIGURES

The invention and its different applications will be better understood on reading the description which follows and on examining the figures which accompany it.

- Figure 1 shows a perspective view of a device for controlling the power supply for a semiconductor light source according to a non-limiting embodiment of the invention;

- Figure 2 shows an exploded view of the control device of Figure 1 according to a non-limiting embodiment;

- Figure 3 shows a side view of the control device of Figure 1 according to a non-limiting embodiment;

- Figure 4 schematically shows a sectional view along a section A-A of the control device of Figure 1 according to a non-limiting embodiment;

- Figure 5 shows schematically a sectional view along a section B-B of the control device of Figure 1 according to a non-limiting embodiment;

- Figure 6 shows the control device of Figure 1 cooperating with a card edge connector according to a non-limiting embodiment;

- Figure 7 schematically shows a top view of the control device of Figure 1 according to a non-limiting embodiment, said control device comprising a plurality of fins; and FIG. 8 represents a metallization step of the control device of FIG. 1 according to a nonlimiting embodiment.

DESCRIPTION OF EMBODIMENTS OF THE INVENTION

Identical elements, by structure or by function, appearing in different figures keep, unless otherwise specified, the same references.

The control device 10 according to the invention is described with reference to Figures 1 to 8.

The control device 10 is suitable for controlling the power supply of a semiconductor light source for a light module (not shown).

In a nonlimiting embodiment, the light module is a lighting and / or signaling device for a motor vehicle.

By motor vehicle is meant any type of motor vehicle.

This light module comprises the control device 10 as well as at least one semiconductor light source. The light source is controlled by the control device 10 so as to obtain a predetermined photometric function.

In nonlimiting embodiments, the light module is adapted to provide a photometric function:

- called "DRL" to make a daytime running light; and or

- called "Turn Indicator" in English to make a traffic light.

The realization of the photometric functions known as “DRL” and “Turn Indicator” does not require a high power control device. It is thus possible to provide control of the semiconductor light source of the light module with a control device 10 of small power substantially between 10 and 15 Watts in a non-limiting example. This control device 10 has a heat dissipation of the order of 3 to 4 Watts mainly due to the heating of electronic components in said control device 10.

In a nonlimiting embodiment, the semiconductor light source is part of a light emitting diode. By light-emitting diode is meant any type of light-emitting diode, whether in non-limiting examples of LEDs (“Light Emitting Diode”), an OLED (“Organic LED”) or an AMOLED (“Active-MatrixOrganic LED”), or a FOLED ("Flexible OLED").

In a nonlimiting embodiment, the control device 10 comprises a width of 60 mm (millimeters), a length of 75 mm, and a thickness of 15 mm.

As illustrated in FIGS. 1 to 5 and 6, the control device 10 comprises:

- a printed circuit board 3;

- a protective box 5.

These various elements are described in detail below.

• Printed circuit board. .3

The printed circuit board 3 is called “Printed Board Card Assembly” in English or PCBA card.

As illustrated in FIG. 2, the printed circuit card 3 comprises:

- a base plate 3A;

- at least one electronic component 3B;

- at least one 3C connection track.

The printed circuit card 3 is adapted to be completely or partially enveloped by the protective housing 5.

In a nonlimiting embodiment, the base plate 3A consists of a sheet of epoxy resin bonded between layers of copper. It includes copper tracks (not shown) which connect the 3B electronic components to each other.

The base plate 3A includes an upper face and a lower face. The base plate 3A comprises at least one electronic component 3B on one of its faces. Said at least one electronic component 3B is suitable for controlling the electrical supply of a light source.

As illustrated in FIG. 2, in a nonlimiting embodiment, the printed circuit board 3 comprises electronic components 3B on one side, here the upper side.

In a nonlimiting embodiment, the printed circuit card 3 comprises a plurality of electronic components 3B. In nonlimiting embodiments, the electronic components 3B are a MOSFET transistor, a DC / DC converter, etc.

In another nonlimiting embodiment (not illustrated), the printed circuit card 3 comprises electronic components 3B on its two faces. When in operation, the 3B electronic components generate heat. As will be seen below, this heat is removed from the control device 10 by the protective housing 5.

In a nonlimiting embodiment, the printed circuit card 3 comprises a plurality of connection tracks 3C. In a nonlimiting embodiment, a connection track 3C is a metal track. A connection track 3C is suitable for the electrical supply of the printed circuit board 3. The connection track 3C thus comes to cooperate with a connector 7, and the connector 7 comes to cooperate with a supply harness (not illustrated) via connection channels.

It will be recalled that the power supply beam (not illustrated) is adapted to power the control device 10, the latter redistributing the power supply to the semiconductor light sources that it controls.

In a first nonlimiting embodiment, the connector 7 is a card edge connector called in English "cardedge" (illustrated in FIG. 6). It comprises, in a manner known to those skilled in the art, a jaw equipped with at least one contact suitable for coming into contact with the connection track 3C of the printed circuit board 3 so as to connect the latter to a supply harness. . In Figure 6, we can see the connection paths 9 of the connector 7 which are adapted to cooperate with the connection tracks 3C and the power supply. Namely, the connection paths 9 are in contact with the connection tracks 3C and the connection paths 9 are also in contact with the supply harness. More particularly, a connection track 9 is in contact with a connection track 3C.

In a second nonlimiting embodiment (not illustrated), the connector 7 is a connector called "press-fit" in English. It comprises, in a manner known to those skilled in the art, a plurality of pins which have a needle profile and which are driven into a metallized hole in the printed circuit board 3. The contact between the pins and the printed circuit board 3 done radially. In this mode, there are no 3C connection tracks.

In a third nonlimiting embodiment (not illustrated), the connector 7 is a connector called SMD (“Surface Mounting Device” in English). It includes, in a manner known to those skilled in the art:

- A first male-female contact housing part which is welded by reflow by means of solder paste on the printed circuit board 3 and is thus welded on the copper-colored tracks of the printed circuit board 3; and

- a second detachable female-male contact housing part which cooperates with the male part and with the power supply harness. In this mode, there are no 3C connection tracks.

In a fourth nonlimiting embodiment (not illustrated), the connector 7 is a connector called "pin in paste" in English. It comprises, in a manner known to a person skilled in the art, pins which are inserted into a metallized hole in the printed circuit board 3, a solder paste having been previously deposited around the metallized holes. The pins pass through the printed circuit board 3. The pins are then reflow soldered with the printed circuit board 3. The solder paste aggregates by capillary action on the barrel of the metallized hole and the pins. The pins are thus soldered to the copper-colored tracks of the printed circuit board 3. In this mode, there are no 3C connection tracks.

In a fifth nonlimiting embodiment (not illustrated), the connector 7 is a so-called through connector called “through” in English. It comprises, in a manner known to a person skilled in the art, pins which are inserted into a metallized hole in the printed circuit board 3. The pins are soldered under the printed circuit board 3 with a wave of tin. The pins are thus soldered to the copper-colored tracks of the printed circuit board 3. In this mode, there are no 3C connection tracks.

• Protection box.5

As will be seen below, the protective housing 5 is suitable for:

a) electrically isolate the electronic components 3B from the printed circuit board 3;

b) thermally dissipate the heat given off by the electronic components 3B of the printed circuit board 3;

- c) provide EMC shielding for the 3B electronic components;

- d) perform several mechanical functions; and

- e) sealing the control device 10.

The protective case 5 is made of plastic overmolded on the printed circuit board 3.

The protective housing 5 is thus obtained during a manufacturing process by overmolding of a plastic well known to those skilled in the art. It will be recalled that overmolding consists of injecting plastic onto an element, here the printed circuit board 3, while giving a determined shape to the mass of plastic thus injected. The overmolding manufacturing process makes it possible to give the protective housing 5 the desired design.

Furthermore, thanks to the overmolding, as illustrated in the sectional view of FIG. 5, it is possible to obtain a small thickness of plastic which surrounds the printed circuit board 3 and its electronic components 3B, in particular:

- A small thickness E1 of plastic between the external surface of the protective housing 5 and a section of the printed circuit board 3;

- a small thickness E2 of plastic between the external surface of the protective housing 5 and an electronic component 3B;

- a small thickness E3 of plastic between the external surface of the protective housing 5 and the underside of the printed circuit board 3 (in the case where there are no electronic components 3B on this face).

In a nonlimiting embodiment, these thicknesses E1, E2, E3 are substantially equal to 1mm. In a nonlimiting variant, these thicknesses E1, E2, E3 are greater than 0.6 mm. It will be noted that below this value, the plastic does not creep, that is to say, it will not be able in the liquid state to pass through a space smaller than said thicknesses E1, E2, E3.

It will be noted that these small thicknesses E1, E2, E3 make it possible to dissipate the heat given off by the electronic components 3B towards the outside, more quickly. The control device 10 thus has good compactness.

As illustrated in Figures 1-5, 7-8, the control device 10 comprises a basic body 5A. The base body 5A is adapted to cover the printed circuit board 3 so as to cover all the electronic components 3B. The basic body 5A being overmolded, it can have various shapes.

In a nonlimiting embodiment, the protective housing 5 is molded onto all or part of the printed circuit card 3.

Thus, in the first embodiment of the connector 7 on the edge of the card, the protective housing 5 is molded onto a part of the printed circuit card 3. In fact, the connection tracks 3C are not surrounded by plastic, but only protected by a molded 5B mechanical interface, described below.

Thus, in the second embodiment of the connector 7 called "press-fit", in a non-limiting alternative embodiment, the protective housing 5 is molded onto a part of the printed circuit board 3. In fact, the pins do not are not surrounded by plastic, but only protected by a molded mechanical interface (not shown). As in the case of the first embodiment, the overmolded mechanical interface will serve as a guide for the connector 7, in particular for its pins. In another non-limiting variant, the protective housing 5 is molded over the entire printed circuit board 3, namely it covers the connector 7 and its pins.

Thus, in the third nonlimiting embodiment of the connector 7 called SMD, in a nonlimiting variant embodiment, the protective housing 5 is molded over the entire printed circuit board 3. It covers said first male-female contact part . In another non-limiting alternative embodiment, the protective housing 5 is molded onto a part of the printed circuit card 3, namely it does not cover said first male contact-female housing contact part.

Thus, in the fourth nonlimiting embodiment of the connector 7 known as “pin in paste”, in a nonlimiting variant embodiment, the protective housing 5 is molded over the entire printed circuit board 3. It covers the connector 7 and its pins. In another non-limiting variant, the protective housing 5 is molded onto a part of the printed circuit card 3.

Thus, in the fifth nonlimiting embodiment of the connector 7 said to pass through, in a nonlimiting variant embodiment, the protective housing 5 is molded over the entire printed circuit card 3. It covers the connector 7 and its pins. In another non-limiting variant, the protective housing 5 is molded onto a part of the printed circuit card 3.

The different functions of the protective housing 5 are described below as well as the different means for performing these functions,

a) In a nonlimiting embodiment, the plastic is an electrically insulating plastic.

When the protective housing 5 is molded onto the printed circuit board 5, it is in contact with the electronic components 3B, namely the molded plastic which composes it is in contact with the electronic components 3B.

Having an electrically insulating plastic makes it possible to avoid the risks of short circuit between the various electronic components 3B of the printed circuit board 3 and consequently between different potentials on the printed circuit board 3.

b) In a nonlimiting embodiment, the plastic is a thermally conductive plastic.

Having a thermally conductive plastic allows the heat emitted by each electronic component 3B of the printed circuit board 3 to be removed directly from the protective housing 5.

In a nonlimiting embodiment, the thermal conductivity of the overmolded plastic is 4 Watts per meter per Kelvin. This is sufficient to dissipate the heat from a low power control device. Such plastic is inexpensive. Thus, it is possible to manufacture a low-power control device 10 at low cost.

The protective housing 5 has a heat exchange surface 5A ’(illustrated in FIGS. 1 to 8) adapted to promote heat exchange between the printed circuit board 3 and the air outside the control device 10.

The plastic of the protective casing 5 thus conducts the heat given off by the electronic components 3B of the printed circuit board 3 to the heat exchange surface 5A 'of the protective casing 5. The plastic then has an interfacing role between the electronic components 3B and this heat exchange surface 5A ′ of the protective housing 5.

In a first embodiment illustrated in Figures 1-6 and 8, the heat exchange surface 5A ’is flat.

In a second nonlimiting embodiment illustrated in FIG. 7, the heat exchange surface includes a plurality of fins 5A ". The fins 5A "form protuberances on the heat exchange surface 5A". The fins 5A "allow to increase the heat exchange surface 5A" and therefore to increase the heat exchanges of the control device 10 with the outside. In a nonlimiting embodiment, the fins 5A ’” are overmolded.

In a first non-limiting alternative embodiment illustrated in the figure

7, the fins 5A ”are distributed over the entire heat exchange surface 5A of the protective housing 5.

In a second non-limiting alternative embodiment (not shown), the number and the position of the fins 5A ”are determined as a function of the hot spots of the printed circuit board 3. Thus, the fins 5A” are positioned near the electronic components 3B which heat the most.

It will be noted that when the printed circuit card 3 comprises electronic components 3B on its two faces, the protective housing 5 then comprises two opposite heat exchange surfaces and through which the heat of the electronic components 3B on each face of the card printed circuit 3 is evacuated respectively from said protective housing 5.

In a nonlimiting embodiment, the plastic is a charged thermal conductive plastic. The fillers in the plastic improve the thermal conductivity of the plastic. Thus, this improves the thermal conduction of heat to the heat exchange surface 5A ’of the protective housing 5. In a nonlimiting variant, the plastic is loaded with ceramic or metallic particles.

c) In a nonlimiting embodiment, the protective housing 5 is covered with a metallization layer.

In an alternative embodiment, the metallization layer is made of aluminum.

This metallization layer forms an EMC shield. It in fact prevents the control device 10 from emitting electromagnetic radiation called EMC which could disturb the other organs of the motor vehicle (such as the radio, the navigation system etc. in non-limiting examples). This metallization layer also prevents the control device 10 from being disturbed by an external radiated source, such as the other members of the motor vehicle which also emit electromagnetic radiation called EMC. This phenomenon, well known to those skilled in the art, is called the electromagnetic accounting (EMC) problem.

In nonlimiting embodiments, the deposition of the metallization layer on the overmolded protective housing 5 is carried out during a metallization step. In this metallization step, the piloting device 10 is placed in a metallized chamber 15 (after demolding) as illustrated in FIG. 8. Metal particles 110 are then vaporized under vacuum on the piloting device 10 to form a metallization layer on the protective housing 5.

In order to avoid any risk of short circuit between the 3C connection tracks, the latter are protected from metallic particles 110 during the metallization step. Thus, in a nonlimiting embodiment illustrated in FIG. 8, an adhesive 17 obstructs an overmolded mechanical interface 5B (described below) of the protective housing 5 which frames the connection tracks 3C. This adhesive 17 thus prevents the connection tracks 3C from being covered with a metallization layer. This thus avoids having short circuits between said 3C connection tracks. The adhesive is removed between the end of the metallization step and the commissioning of the control device 10.

d) The mechanical functions of the protective housing 5 are as follows:

- i) The protective housing 5 is adapted to protect the printed circuit board 3 against mechanical shock.

The protective housing 5 is in contact with the various electronic components 3B in the control device 10. Each electronic component 3B is thus surrounded by the overmolding of the protective housing 5 which allows good mechanical support of said electronic components 3B, in particular by case of shocks.

- ii) In a non-limiting embodiment, the protective housing 5 comprises at least one overmolded mechanical interface.

In a first non-limiting variant, the protective housing 5 includes a molded mechanical interface 5E (illustrated in FIG. 7) adapted to fix said control device 10 in the light module. In nonlimiting examples, said overmolded mechanical interface comprises at least one fixing lug or a screwing barrel.

In the nonlimiting example illustrated in FIG. 7, said molded interface 5E comprises two fixing lugs. Thus, the overmolded mechanical interface 5E allows good mechanical integration of the control device 10 in the light module.

This is possible because with an overmolding process it is possible to make a large number of shapes.

In a second non-limiting variant, the protective housing 5 comprises a molded mechanical interface 5B (illustrated in FIGS. 1 to 4 and 6 to 8) adapted to guide a connector 7 in the control device 10, said connector 7 being adapted to cooperate with said printed circuit board 3. Thus, the overmolded mechanical interface makes it possible to have a shape complementary to the connector 7 in order to be able to accommodate it in the control device 10. As illustrated in FIGS. 1,2 , and 7 for example, the mechanical interface 5B extends the base body 5A of the protective housing 5.

The mechanical interface 5B frames the part of the printed circuit board 3 which includes the connection tracks 3C. It is adapted to receive and guide the connector 7 (illustrated in FIG. 6), said connector 7 coming to connect to said connection tracks 3C. Thanks to the mechanical interface 5B, the risks of improper positioning of the connector 7 in the control device 10 are limited.

By guiding the connector 7 with the mechanical interface 5B, it is possible to fix this connector 7 to the printed circuit board 3 without forcing. Thus, with the number of connection paths 9 equal, the connector 7 requires less insertion effort on the printed circuit board 3 than when it is not guided. In a nonlimiting example, the insertion force for a connection channel 9 is substantially equal to 3Newton. When there is no guide to guide the connector 7, the insertion force is much greater. Thanks to the guidance of the connector 7, it is thus possible to provide a greater number of connection channels on the connector 7. Thus, in a nonlimiting example, instead of having 10 connection channels, one can have 14 connection channels. connection. This makes it possible to supply more light functions, such as intersection, road, daytime traffic called "DRL" etc. in nonlimiting examples.

Thus, this prevents an operator from having musculoskeletal disorders due to the insertion effort that he must make to position the connector 7 in the mechanical interface 5B. In addition, by reducing the insertion effort, this avoids having a dedicated machine for positioning the connector 7 on the piloting device 10 as is the case when the insertion effort is too great. One operator is enough. This reduces the assembly costs of the connector 7 to the control device 10.

e) The protective housing 5 makes it possible to seal the control device 10 because the electronic components 10 are caught in the plastic. They are enveloped by the protective housing 5 from all sides, namely above, below, right side and left side, as illustrated in FIGS. 4 and 5. It will be noted that in these figures, the protective housing 5 is illustrated by hatching. Thus, the protective box 5 protects the electronic components 3B of the control device 10 against water and dust.

Of course, the description of the invention is not limited to the embodiments described above.

Thus in a nonlimiting embodiment, the thermal conductivity of the plastic used in the protective housing 5 is greater than 4 Watts per meter per Kelvin. It is thus possible to manufacture a control device 10 of greater power, for example of the order of 150 Watts. Such a control device dissipates approximately 30 Watts of heat during operation. The use of a high power control device 10 makes it possible to control a light source to ensure a photometric function:

- called "High Beam" in English to make a high beam; and or

- called "Low Beam" in English to achieve, for example, a low beam.

In another nonlimiting embodiment, the protective housing 5 is a bi-material element formed by two types of plastic. It is obtained by a bi-injection manufacturing process. For example, it is possible to provide a plastic of a first type to produce the base body 5A of the protective housing 5 and a plastic of a second type to produce the mechanical interface (5B for example) of this housing. protection 5. The first type of plastic and the second type of plastic are compatible with each other to form a protective housing 5 in one piece.

Thus, the invention described has in particular the following advantages:

- It eliminates assembly steps and reduces the number of parts used to form the control device 10 compared to the state of the prior art cited;

- It makes the manufacturing and assembly process of the control device 10 less expensive and less complex;

- It limits the risks of deterioration of the printed circuit card 3 during the assembly of the control device 10;

- It protects the electronic components 3B of the control device 10 from contact with the fingers of an operator;

- It provides a control device 10 more compact and smaller than that of the state of the prior art;

- It allows heat dissipation of the electronic components 3B of the control device 10 and to homogenize said heat dissipation, the protective housing 5 enveloping the electronic components 3B;

- with the fins; it improves the heat dissipation of the control device 10;

- it allows electrical insulation of the printed circuit board 3;

- it makes it possible to limit the EMC emissions from the control device 10;

- It protects the control device 10 against EMC emissions from other parts of the motor vehicle;

- It seals the control device 10 unlike the state of the prior art;

- it allows the protection of the steering device against shocks;

- It allows better mechanical interfacing with the connector 7 compared to the state of the prior art;

- It facilitates the mechanical integration of the control device 10 in a light module of the motor vehicle.

Claims (15)

1. Control device (10) for the electrical supply for a semiconductor light source for a light module, the control device comprising: - a printed circuit board (3) comprising at least one electronic component (3B) for controlling the power supply; - a protective case (5) of said printed circuit board (3), said protective case (5) being made of plastic overmolded on said printed circuit board (3). 2. Control device (10) according to claim 1, wherein said protective housing (5) is molded onto all or part of the printed circuit board (3). 3. Control device (10) according to claim 1 or claim 2, wherein said plastic is an electrically insulating plastic. 4. Control device (10) according to any one of claims 1 to 3, wherein said plastic is a thermally conductive plastic. 5. Control device (10) according to any one of claims 1 to 4, wherein said plastic is a thermally conductive plastic, loaded. 6. Control device (10) according to any one of claims 1 to 5, wherein said protective housing (5) is covered by a metallization layer. 7. Control device (10) according to any one of claims 1 to 6, wherein said protective housing (5) has a heat exchange surface (5A ’). 8. Control device (10) according to claim 7, wherein said heat exchange surface (5A ’) is planar or comprises a plurality of fins (5A”). 9. Control device (10) according to claim 8, wherein said plurality of fins (5A ”) is molded. 10. Control device (10) according to one of claims 1 to 9, wherein said protective housing (5) molded is in contact with said at least one electronic component (3B). 11 .A piloting device (10) according to one of claims 1 to 10, wherein said protective housing (5) comprises at least one overmolded mechanical interface. 12. Control device (10) according to claim 11, wherein said at least one overmolded mechanical interface (5B) is adapted to guide a connector (7) in the control device (10), said connector (7) being adapted to cooperate with said printed circuit board (3). 13. Pilot device (10) according to claim 12, wherein said at least one overmolded mechanical interface (5E) is adapted to fix said pilot device (10) in the light module. 14. Control device (10) according to claim 13, wherein said at least one overmolded mechanical interface comprises at least one fixing lug or a screwing barrel. 15. Light module for a motor vehicle in which said light module comprises at least one semiconductor light source and a control device (10) for the electrical supply for said at least one semiconductor light source according to 5 any one of the preceding claims 1 to 14. 3θ64 ^ζ 3064 ' 2/5