EP3350511B1 - Heat sink device for a motor vehicle lighting module - Google Patents

Heat sink device for a motor vehicle lighting module Download PDF

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Publication number
EP3350511B1
EP3350511B1 EP16763816.2A EP16763816A EP3350511B1 EP 3350511 B1 EP3350511 B1 EP 3350511B1 EP 16763816 A EP16763816 A EP 16763816A EP 3350511 B1 EP3350511 B1 EP 3350511B1
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EP
European Patent Office
Prior art keywords
base
cooling fins
printed circuit
face
motor vehicle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16763816.2A
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German (de)
French (fr)
Other versions
EP3350511A1 (en
Inventor
Olivier-Sébastien LESAFFRE
Eric Stefura
Huy-Cuong NGUYEN
Eddie Sausset
Erwan LE-DEVEHAT
Olivier Badia
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Valeo Vision SAS
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Valeo Vision SAS
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Publication date
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Publication of EP3350511A1 publication Critical patent/EP3350511A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/10—Protection of lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/50—Waterproofing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

Definitions

  • the invention relates to the field of lighting and light signaling, in particular for a motor vehicle.
  • LEDs In the field of lighting and light signaling for motor vehicles, it is becoming more and more common to use light sources with electroluminescent semiconductor components, for example light-emitting diodes, LEDs.
  • An LED component emits light rays when a voltage of a value at least equal to a threshold value called forward voltage is applied to these terminals.
  • one or more LEDs of a light module for a motor vehicle are powered through power control means, which include converter circuits.
  • the power control means are configured to convert an electric current of a first intensity, for example provided by a current source of the motor vehicle, such as a battery, into a charging current having a second intensity, different from the first.
  • the charging current generally has a constant intensity.
  • a heat sink according to the preamble of claim 1 is known from JP 2008 059965 A , CN 203 273 812 U , WO 2012/169569 A1 and EP 2 738 456 A1 .
  • the object of the invention is to propose a solution that overcomes the aforementioned problem.
  • the invention proposes a device for light heat dissipation with a high thermal conductivity and capable, in preferred embodiments, to be installed according to several orientations, while ensuring good dissipation of the heat produced by the electronic components of a light module for a motor vehicle.
  • the invention relates to a heat dissipation device for a light module of a motor vehicle.
  • the device comprises a base intended to receive on a first face a printed circuit and comprising heat dissipation means on a second opposite face.
  • the device is remarkable in that the heat dissipation means comprise cooling fins formed by folds of at least one metal sheet, the cooling fins being secured to the base by means of a connection between at least one of the folds and the base.
  • the base may preferably form a main heat sink of the device.
  • the base may be stamped aluminum.
  • the base may advantageously have a generally flat geometry. Preferably, it may have a generally rectangular outline.
  • the base may preferably be intended to receive a printed circuit on one of its faces.
  • the printed circuit may comprise a circuit for controlling the power supply of the light source of the light module, in particular capable of controlling the power supply of these light sources for the selective production of a plurality of light functions, for example lighting driving lights, dipped lights, daytime running lights, or position lights.
  • the cooling fins may preferably be aluminum.
  • the metal foil may preferably have a thickness of less than 1 mm, preferably 0.6 mm.
  • the cooling fins may be formed by one or more cladded and knurled aluminum sheets.
  • the height of the cooling fins relative to the base may preferably be between 15 mm and 25 mm.
  • the base and / or the cooling fins may have a thermal conductivity between 180 and 230 W / (m ⁇ K).
  • the cooling fins may preferentially extend in at least two different directions parallel to the base.
  • the device may preferably comprise a plurality of cooling fins, at least two groups of fins extend in two directions perpendicular to each other.
  • Said plurality of vanes may comprise a first group of vanes extending peripherally of the base, along two first parallel and opposite edges of the base and a second group of vanes extending peripherally of the base, along two second parallel and opposite edges of the base and in particular perpendicular to the first edges.
  • the plurality of vanes may comprise a third group of vanes extending in a central region of the base and in a direction parallel to that of the first group.
  • the device may comprise a plurality of cooling fins which extend radially in a plurality of directions from a central portion of the base.
  • the device may preferably comprise a thermal interface disposed between the cooling fins and the base, for example silicone.
  • the cooling fins may preferably be glued to the base of the device.
  • the bonding can be carried out using a polymerization adhesive in a polymerization furnace.
  • the glue may be a high thermal conduction glue.
  • cooling fins can be attached to the base by soldering.
  • the brazing may preferably be carried out by means of aluminum oxide.
  • the base may preferably comprise, on its first face, crimping pins for fixing a printed circuit on this face.
  • the crimp pins may preferably be formed by stamping.
  • the device includes a stamped aluminum cover for sealingly attaching to the first face of the base.
  • the thermal conductivity of the lid may preferably be between 180 and 230 W / (m ⁇ K).
  • the lid can be attached to the base by means of a seal.
  • the seal may for example be rubber.
  • the cover may preferably comprise an opening giving access to the interior of the device, that is to say to the space intended to receive a printed circuit.
  • the opening makes it possible for example to make an electrical connection from the outside of the device with the printed circuit
  • the device may preferably comprise a protective grid, preferably made of plastic, for covering the cooling fins.
  • the subject of the invention is also a light module for a motor vehicle comprising at least one light source with a semiconductor element and a printed circuit comprising a circuit for controlling the power supply of the light source or sources.
  • the light module is remarkable in that the printed circuit is fixed on a thermal dissipation device of the module, the device being in accordance with the invention.
  • the base of the device may preferably comprise means for fixing the device in the module.
  • the printed circuit board may preferably be sealed by a cover of the heat dissipating device.
  • the measures of the invention are interesting in that they make it possible to propose a compact and lightweight heat dissipation device, nevertheless having a significant heat dissipation capacity. This is due to the use of high conductivity aluminum which is stamped and / or bent to make the components of the device. Compared to known solutions making use of injected aluminum comprising a large percentage of additives, production cost savings of about 30% and weight gains of about 40% have been observed.
  • the bonding step can be performed together with the bonding of the printed circuit.
  • the arrangement of the fins in a plurality of directions ensures that air can flow between the fins regardless of the orientation and location of the device within a light module for a motor vehicle.
  • the heat dissipation power can be adjusted by adapting the dimensions of the fins, and in particular their height relative to the base of the device.
  • the figure 1 shows a heat dissipation device 100 for a light module of a motor vehicle according to a first exemplary embodiment of the invention.
  • the device comprises a generally planar geometry base 110, which is preferably of substantially pure aluminum, and which has a thermal conductivity between 180 and 230 W / (m ⁇ K).
  • the base has a contour of generally rectangular shape.
  • the base forms a main heat sink element of the device.
  • a first face 112, shown facing downwards, is intended to receive a printed circuit not shown.
  • the printed circuit may for example comprise light sources of the light module. They may be light sources with a semiconductor component, for example light-emitting diodes, LEDs. Alternatively, the printed circuit may comprise a circuit for controlling the power supply of such light sources. Converters of such a circuit, such as light sources, generate in general a significant heat during operation, that the device 100 must be able to dissipate.
  • a second face 114 opposite the first face 112 and illustrated directed upwards, comprises cooling fins 120 which are secured to the base by means of a fastening between at least one of the folds and the base.
  • the fins extend in the example shown and according to a preferred embodiment, along at least two different directions but parallel to the plane of the base 110 to create grooves or channels of air flow. In the example shown, there are two directions A, B generally perpendicular to each other.
  • the fins of cooling 140 are formed by folds of a metal sheet.
  • the sheet preferably has a thin thickness of less than one millimeter, for example 0.6 mm.
  • it is also made of aluminum and has a high thermal conductivity which is between 180 and 230 W / (m ⁇ K).
  • the dissipation fins may be formed by one or more cladded and knurled aluminum sheets.
  • the height of the folds is chosen according to the intended application. A greater height of the folds involves an increased heat exchange surface of the fins relative to the ambient air, and therefore a greater heat dissipation of the device.
  • the height of the folds may, for example, be between 15 and 25 mm.
  • the cooling fins are fixed to the face 114 of the base 110 so as to ensure a good mechanical strength and a good thermal connection between the two elements.
  • the bond is preferably made by bonding with a polymerization adhesive which is cured during a passage of the device in a polymerization furnace.
  • FIG. 1 shows several groups of fins, two in each of the directions A and B, can be folded from the same sheet of aluminum. Alternatively each group, or each of the fins can be folded from a dedicated aluminum sheet.
  • a non-illustrated protective grid preferably made of plastic, may be provided to cover the cooling fins, in order to protect them against possible mechanical shocks.
  • the figure 2 shows the first face 112, which is opposite to the face 114 of the base 110 of the device 100.
  • This face is intended to receive a printed circuit which comprises active electronic elements producing heat.
  • the face 112 comprises crimping pins 113 intended to cooperate with holes provided for this purpose in the substrate of a printed circuit.
  • the crimping pins 113 are preferably drawn out of the aluminum plate which forms the base 110. To ensure this effect, a thickness of the base of at least 3 to 4 mm must be provided.
  • the figure 3 exemplary shows a printed circuit 10, without illustrating the electronic components thereof, retained by the pins 113.
  • the crimping ensures a good mechanical strength and a good thermal contact between the substrate of the printed circuit and the base 110, in order to guarantee the exchange of heat between the two elements.
  • the printed circuit can be glued with a thermal conductivity glue, for example a polymerization glue on the face 112 of the base 110.
  • the heat exchange is first between the printed circuit, on which the heat is produced, and the base 110 of the device 100. Then, through the thermal connection of the base 110 with the cooling fins 120, the heat transits towards them.
  • the cooling fins have a large heat exchange surface with ambient air that dissipates heat.
  • the illustration of the figure 4 takes the device 100 comprising the base 110, on a face 114 of which the cooling fins 120 are fixed.
  • the opposite face 112 of the base 110 is covered by a cover 130.
  • the cover protects the printed circuit that it covers on the face 112 with respect to mechanical shocks, and with respect to possible electromagnetic interference. It can also contribute to the overall heat dissipation capability of the device.
  • the shape of the sheet is obtained by stamping with a suitable tool.
  • the aluminum variant used preferably has a thermal conductivity of between 180 and 230 W / (m ⁇ K).
  • the lower edge of the lid can in known manner cooperate with the edge of the base 110 to bind the two elements.
  • a seal 134 as illustrated on FIG. figure 4 can be installed at the junction.
  • the cover comprises an opening 132 giving access to the interior of the device, that is to say to the printed circuit received on the face 112 of the device.
  • the opening 132 allows for example to make an electrical connection from the outside of the device with the printed circuit.
  • the figure 5 shows another embodiment of the heat dissipation device 200 according to the invention.
  • the device comprises a base 210 with a generally flat geometry, which is preferably made of aluminum and which has a thermal conductivity between 180 and 230 W / (m ⁇ K).
  • a first face 212 shown facing upwards, is intended to receive a printed circuit not shown.
  • a second face 214 opposite the first face 212 and shown facing downwards, comprises cooling fins 220 which extend in at least two different directions but parallel to the plane of the base 210.
  • the face 212 has the particularity that a recessed portion 216 has been made by stamping the base 210.
  • Such a configuration is advantageous when the heat dissipating device 200 is provided to house a printed circuit which comprises electronic components mounted on these two planar surfaces.
  • the electronic components mounted on the face of the printed circuit which faces the face 212 are then housed in the recessed part 216.
  • Alternative geometries can obviously be provided according to the same principle. and made by appropriate stamping, without departing from the scope of the present invention.
  • the figure 6 shows a schematic view from above of a further embodiment of the heat dissipating device 300 according to the invention.
  • the face 314 of the base 310 is shown. This is the face on which the cooling fins 320 are fixed.
  • an alternative arrangement of the cooling fins is exemplarily illustrated.
  • the fins 320 extend radially from a central portion of the base 310 to form a star or circular structure. Each pair whose cooling fins are radially opposite to the center is oriented in one direction. Other geometries of arrangement of the cooling fins are conceivable.
  • a greater plurality of directions in which the cooling fins extend generally implies greater flexibility in the placement and orientation of the device 300 within a light module. With the increasing number of ambient air flow directions, the likelihood of heat exchange between the cooling fins and the ambient air is generally increased.

Description

L'invention a trait au domaine de l'éclairage et de la signalisation lumineuse, notamment pour véhicule automobile.The invention relates to the field of lighting and light signaling, in particular for a motor vehicle.

Dans le domaine de l'éclairage et de la signalisation lumineuse pour véhicules automobiles, il devient de plus en plus courant d'utiliser des sources lumineuses à composants semi-conducteurs électroluminescents, par exemple des diodes électroluminescentes, LED. Un composant LED émet des rayons lumineux lorsqu'une tension d'une valeur au moins égale à une valeur seuil appelée tension directe est appliquée à ces bornes.In the field of lighting and light signaling for motor vehicles, it is becoming more and more common to use light sources with electroluminescent semiconductor components, for example light-emitting diodes, LEDs. An LED component emits light rays when a voltage of a value at least equal to a threshold value called forward voltage is applied to these terminals.

De manière connue, une ou plusieurs LEDs d'un module lumineux pour un véhicule automobile sont alimentées par le biais de moyens de pilotage de l'alimentation, qui comprennent des circuits convertisseurs. Les moyens de pilotage de l'alimentation sont configurés pour convertir un courant électrique d'une première intensité, par exemple fourni par une source de courant du véhicule automobile, telle qu'une batterie, en un courant de charge ayant une deuxième intensité, différente de la première. Le courant de charge a en général une intensité constante.In known manner, one or more LEDs of a light module for a motor vehicle are powered through power control means, which include converter circuits. The power control means are configured to convert an electric current of a first intensity, for example provided by a current source of the motor vehicle, such as a battery, into a charging current having a second intensity, different from the first. The charging current generally has a constant intensity.

Il devient de plus en plus commun d'intégrer plusieurs fonctions lumineuses d'un véhicule automobile, par exemple les fonctions feux diurne (DRL, « daytime running light »), feux de route, ou autres dans un même module lumineux. Par conséquent, le nombre de convertisseurs par module, ainsi que la chaleur que ces composants produisent dans le module, augmentent. Il s'impose donc un besoin de moyens de dissipation thermique efficaces. Vues les contraintes de volumes imposées par l'espace restreint d'un module lumineux pour un véhicule automobile, il est néanmoins important qu'un dissipateur thermique ait des dimensions compactes et un poids léger. Un dissipateur thermique selon la préambule de la revendication 1 est connu de JP 2008 059965 A , CN 203 273 812 U , WO 2012/169569 A1 et EP 2 738 456 A1 .It is becoming more and more common to integrate several light functions of a motor vehicle, for example the daytime running light (DRL), high beam, or other lights in the same module. As a result, the number of converters per module, as well as the heat that these components produce in the module, increases. There is therefore a need for efficient heat dissipation means. Given the volume constraints imposed by the restricted space of a light module for a motor vehicle, it is nevertheless important that a heat sink has compact dimensions and a light weight. A heat sink according to the preamble of claim 1 is known from JP 2008 059965 A , CN 203 273 812 U , WO 2012/169569 A1 and EP 2 738 456 A1 .

L'invention a pour objectif de proposer une solution palliant le problème susmentionné. En particulier, l'invention propose un dispositif de dissipation thermique léger à haute conductivité thermique et capable, dans des modes de réalisations préférés, d'être installé selon plusieurs orientations, tout en assurant une bonne dissipation de la chaleur produite par les composants électroniques d'un module lumineux pour véhicule automobile.The object of the invention is to propose a solution that overcomes the aforementioned problem. In particular, the invention proposes a device for light heat dissipation with a high thermal conductivity and capable, in preferred embodiments, to be installed according to several orientations, while ensuring good dissipation of the heat produced by the electronic components of a light module for a motor vehicle.

L'invention a pour objet un dispositif de dissipation thermique pour un module lumineux de véhicule automobile. Le dispositif comprend une base destinée à recevoir sur une première face un circuit imprimé et comprenant des moyens de dissipation thermique sur une deuxième face opposée. Le dispositif est remarquable en que les moyens de dissipation thermique comprennent des ailettes de refroidissement formées par des plis d'au moins une feuille métallique, les ailettes de refroidissement étant solidarisées à la base au moyen d'une fixation entre au moins un des plis et la base.The invention relates to a heat dissipation device for a light module of a motor vehicle. The device comprises a base intended to receive on a first face a printed circuit and comprising heat dissipation means on a second opposite face. The device is remarkable in that the heat dissipation means comprise cooling fins formed by folds of at least one metal sheet, the cooling fins being secured to the base by means of a connection between at least one of the folds and the base.

La base peut de préférence former un dissipateur principal de chaleur du dispositif.The base may preferably form a main heat sink of the device.

De préférence, la base peut être en Aluminium embouti. La base peut avantageusement avoir une géométrie généralement plane. De préférence, elle peut avoir un contour généralement rectangulaire. La base peut de préférence être destinée à recevoir un circuit imprimé sur une de ses faces. Le circuit imprimé peut comprendre un circuit de pilotage de l'alimentation électrique de sources lumineuses du module lumineux, notamment apte à piloter l'alimentation électrique de ces sources lumineuses pour la réalisation sélective d'une pluralité de fonctions lumineuses, comme par exemple un éclairage de route, un éclairage de croisement, un feu diurne, ou un feu de position.Preferably, the base may be stamped aluminum. The base may advantageously have a generally flat geometry. Preferably, it may have a generally rectangular outline. The base may preferably be intended to receive a printed circuit on one of its faces. The printed circuit may comprise a circuit for controlling the power supply of the light source of the light module, in particular capable of controlling the power supply of these light sources for the selective production of a plurality of light functions, for example lighting driving lights, dipped lights, daytime running lights, or position lights.

Les ailettes de refroidissement peuvent de préférence être en Aluminium.The cooling fins may preferably be aluminum.

La feuille métallique peut de manière préférée avoir une épaisseur inférieure à 1 mm, préférentiellement de 0,6 mm. De préférence, les ailettes de refroidissement peuvent être formées par une ou plusieurs feuilles d'Aluminium cladées et moletées.The metal foil may preferably have a thickness of less than 1 mm, preferably 0.6 mm. Preferably, the cooling fins may be formed by one or more cladded and knurled aluminum sheets.

La hauteur des ailettes de refroidissement par rapport à la base peut de préférence être comprise entre 15 mm et 25 mm.The height of the cooling fins relative to the base may preferably be between 15 mm and 25 mm.

De préférence, la base et/ou les ailettes de refroidissement peuvent présenter une conductivité thermique entre 180 et 230 W/(m·K).Preferably, the base and / or the cooling fins may have a thermal conductivity between 180 and 230 W / (m · K).

Les ailettes de refroidissement peuvent préférentiellement s'étendret suivant au moins deux directions différentes parallèles à la base.The cooling fins may preferentially extend in at least two different directions parallel to the base.

Le dispositif peut de préférence comprendre une pluralité d'ailettes de refroidissement, dont au moins deux groupes d'ailettes s'étendent suivant deux directions perpendiculaires entre elles.The device may preferably comprise a plurality of cooling fins, at least two groups of fins extend in two directions perpendicular to each other.

Ladite pluralité d'ailettes peut comprendre un premier groupe d'ailettes s'étendant en périphérie de la base, le long de deux premiers bords parallèles et opposés de la base et un deuxième groupe d'ailettes s'étendant en périphérie de la base, le long de deux deuxièmes bords parallèles et opposés de la base et notamment perpendiculaires aux premiers bords. Le cas échéant, la pluralité d'ailettes peut comprendre un troisième groupe d'ailettes s'étendant dans une région centrale de la base et suivant une direction parallèle à celle du premier groupe.Said plurality of vanes may comprise a first group of vanes extending peripherally of the base, along two first parallel and opposite edges of the base and a second group of vanes extending peripherally of the base, along two second parallel and opposite edges of the base and in particular perpendicular to the first edges. Where appropriate, the plurality of vanes may comprise a third group of vanes extending in a central region of the base and in a direction parallel to that of the first group.

De préférence, le dispositif peut comprendre une pluralité d'ailettes de refroidissement qui s'étendent de manière radiale suivant une pluralité de directions à partir d'une partie centrale de la base.Preferably, the device may comprise a plurality of cooling fins which extend radially in a plurality of directions from a central portion of the base.

Le dispositif peut de préférence comprendre une interface thermique disposée entre les ailettes de refroidissement et la base, par exemple en silicone.The device may preferably comprise a thermal interface disposed between the cooling fins and the base, for example silicone.

Les ailettes de refroidissement peuvent de manière préférée être collées à la base du dispositif. Le collage peut être réalisé à l'aide d'une colle de polymérisation dans un four de polymérisation. De préférence, la colle peut être une colle à haute conduction thermique.The cooling fins may preferably be glued to the base of the device. The bonding can be carried out using a polymerization adhesive in a polymerization furnace. Preferably, the glue may be a high thermal conduction glue.

Alternativement, les ailettes de refroidissement peuvent être fixées à la base par brasure. La brasure peut préférentiellement être réalisée moyennant de l'oxyde d'Aluminium.Alternatively, the cooling fins can be attached to the base by soldering. The brazing may preferably be carried out by means of aluminum oxide.

La base peut de préférence comprendre, sur sa première face, des pions de sertissage destinés à fixer un circuit imprimé sur cette face. Les pions de sertissage peuvent de préférence être formés par emboutissage.The base may preferably comprise, on its first face, crimping pins for fixing a printed circuit on this face. The crimp pins may preferably be formed by stamping.

Le dispositif comprend un couvercle en Aluminium embouti, destiné à être fixé de manière étanche sur la première face de la base. La conductivité thermique du couvercle peut de préférence être comprise entre180 et 230 W/(m·K). De préférence, le couvercle peut être fixé à la base par l'intermédiaire d'un joint d'étanchéité. Le joint peut par exemple être en caoutchouc.The device includes a stamped aluminum cover for sealingly attaching to the first face of the base. The thermal conductivity of the lid may preferably be between 180 and 230 W / (m · K). Preferably, the lid can be attached to the base by means of a seal. The seal may for example be rubber.

Le couvercle peut de préférence comprendre une ouverture donnant accès à l'intérieur du dispositif, c'est-à-dire à l'espace destiné à recevoir un circuit imprimé. L'ouverture permet par exemple de réaliser une connexion électrique depuis l'extérieur du dispositif avec le circuit impriméThe cover may preferably comprise an opening giving access to the interior of the device, that is to say to the space intended to receive a printed circuit. The opening makes it possible for example to make an electrical connection from the outside of the device with the printed circuit

Le dispositif peut de préférence comprendre une grille de protection, de préférence en matière plastique, pour recouvrir les ailettes de refroidissement.The device may preferably comprise a protective grid, preferably made of plastic, for covering the cooling fins.

L'invention a également pour objet un module lumineux pour un véhicule automobile comprenant au moins une source lumineuse à élément semi-conducteur et un circuit imprimé comprenant un circuit de pilotage de l'alimentation de la ou des sources lumineuses. Le module lumineux est remarquable en ce que le circuit imprimé est fixé sur un dispositif de dissipation thermique du module, le dispositif étant conforme à l'invention.The subject of the invention is also a light module for a motor vehicle comprising at least one light source with a semiconductor element and a printed circuit comprising a circuit for controlling the power supply of the light source or sources. The light module is remarkable in that the printed circuit is fixed on a thermal dissipation device of the module, the device being in accordance with the invention.

La base du dispositif peut de préférence comporter des moyens de fixation du dispositif dans le module.The base of the device may preferably comprise means for fixing the device in the module.

Le circuit imprimé peut de préférence être recouvert de manière étanche par un couvercle du dispositif de dissipation thermique.The printed circuit board may preferably be sealed by a cover of the heat dissipating device.

Les mesures de l'invention sont intéressantes en ce qu'elles permettent de proposer un dispositif de dissipation thermique compact et léger, ayant néanmoins une capacité de dissipation thermique importante. Ceci est dû à l'utilisation d'Aluminium à conductivité élevée qui est embouti et/ou plié pour réaliser les composants du dispositif. Par rapport à des solutions connues faisant usage d'Aluminium injecté comprenant un pourcentage important d'additifs, des gains en coûts de production d'environ 30 % et des gains en poids d'environ 40% ont pu être observés. Lorsque les ailettes sont collées sur la base du dispositif de dissipation thermique à l'aide d'une colle de polymérisation, l'étape de collage peut être réalisée ensemble avec le collage du circuit imprimé. La disposition des ailettes selon une pluralité de directions assure que l'air peut circuler entre les ailettes indépendamment de l'orientation et de l'emplacement du dispositif au sein d'un module lumineux pour véhicule automobile. Ceci augmente la liberté de conception d'un tel module tout en assurant la bonne dissipation de la chaleur produite par les composants actifs du module. Le pouvoir de dissipation thermique peut être ajusté en adaptant les dimensions des ailettes, et notamment leur hauteur par rapport à la base du dispositif.The measures of the invention are interesting in that they make it possible to propose a compact and lightweight heat dissipation device, nevertheless having a significant heat dissipation capacity. This is due to the use of high conductivity aluminum which is stamped and / or bent to make the components of the device. Compared to known solutions making use of injected aluminum comprising a large percentage of additives, production cost savings of about 30% and weight gains of about 40% have been observed. When the fins are glued on the base of the heat dissipating device using a polymerization adhesive, the bonding step can be performed together with the bonding of the printed circuit. The arrangement of the fins in a plurality of directions ensures that air can flow between the fins regardless of the orientation and location of the device within a light module for a motor vehicle. This increases the design freedom of such a module while ensuring the good dissipation of the heat produced by the active components of the module. The heat dissipation power can be adjusted by adapting the dimensions of the fins, and in particular their height relative to the base of the device.

D'autres caractéristiques et avantages de la présente invention seront mieux compris à l'aide de la description et des dessins parmi lesquels :

  • la figure 1 est une représentation en perspective d'en bas d'un dispositif selon un mode de réalisation préférentiel de la présente invention ;
  • la figure 2 est une représentation en perspective d'en haut d'un dispositif selon un mode de réalisation préférentiel de la présente invention ;
  • la figure 3 est une représentation en perspective d'en haut d'un dispositif selon un mode de réalisation préférentiel de la présente invention, y compris un circuit imprimé ;
  • la figure 4 est une représentation en perspective d'en haut d'un dispositif selon un mode de réalisation préférentiel de la présente invention, y compris un couvercle ;
  • la figure 5 est une représentation en perspective d'en haut d'un dispositif selon un mode de réalisation préférentiel de la présente invention ;
  • la figure 6 est une représentation schématique d'une vue d'en bas d'un dispositif selon un mode de réalisation préférentiel de la présente invention.
Other features and advantages of the present invention will be better understood from the description and the drawings, among which:
  • the figure 1 is a perspective view from below of a device according to a preferred embodiment of the present invention;
  • the figure 2 is a perspective view from above of a device according to a preferred embodiment of the present invention;
  • the figure 3 is a perspective view from above of a device according to a preferred embodiment of the present invention, including a printed circuit;
  • the figure 4 is a perspective view from above of a device according to a preferred embodiment of the present invention, including a cover;
  • the figure 5 is a perspective view from above of a device according to a preferred embodiment of the present invention;
  • the figure 6 is a schematic representation of a view from below of a device according to a preferred embodiment of the present invention.

Dans la description qui suit, des numéros de référence similaires seront utilisés pour décrire des concepts similaires à travers des modes de réalisation différents de l'invention. Ainsi, les numéros 100, 200, 300 décrivent un dispositif de dissipation thermique dans trois modes de réalisation différents conformes à l'invention.In the following description, like reference numerals will be used to describe similar concepts through different embodiments of the invention. Thus, the numbers 100, 200, 300 describe a heat dissipation device in three different embodiments according to the invention.

Sauf indication spécifique du contraire, des caractéristiques techniques décrites en détails pour un mode de réalisation donné peuvent être combinées aux caractéristiques techniques décrites dans le contexte d'autres modes de réalisation décrits à titre exemplaire et non limitatif.Unless specifically indicated otherwise, technical features described in detail for a given embodiment may be combined with the technical features described in the context of other embodiments described by way of example and not limitation.

La figure 1 montre un dispositif de dissipation thermique 100 pour un module lumineux d'un véhicule automobile selon un premier mode de réalisation exemplaire de l'invention. Le dispositif comprend une base 110 à géométrie généralement plane, qui est de préférence en Aluminium substantiellement pur, et qui présente une conductivité thermique entre 180 et 230 W/(m·K). Dans l'exemple illustré, la base présente un contour de forme généralement rectangulaire. La base forme un élément de dissipation de chaleur principal du dispositif. Une première face 112, montrée dirigée vers le bas, est destinée à recevoir un circuit imprimé non-illustré. Le circuit imprimé peut par exemple comprendre des sources lumineuses du module lumineux. Il peut s'agir de sources lumineuses à composant semi-conducteur, par exemple de diodes électroluminescentes, LED. Alternativement, le circuit imprimé peut comprendre un circuit de pilotage de l'alimentation électrique de telles sources lumineuses. Les convertisseurs d'un tel circuit, comme les sources lumineuses, génèrent en général une chaleur importante lors de leur fonctionnement, que le dispositif 100 doit pouvoir dissiper.The figure 1 shows a heat dissipation device 100 for a light module of a motor vehicle according to a first exemplary embodiment of the invention. The device comprises a generally planar geometry base 110, which is preferably of substantially pure aluminum, and which has a thermal conductivity between 180 and 230 W / (m · K). In the example shown, the base has a contour of generally rectangular shape. The base forms a main heat sink element of the device. A first face 112, shown facing downwards, is intended to receive a printed circuit not shown. The printed circuit may for example comprise light sources of the light module. They may be light sources with a semiconductor component, for example light-emitting diodes, LEDs. Alternatively, the printed circuit may comprise a circuit for controlling the power supply of such light sources. Converters of such a circuit, such as light sources, generate in general a significant heat during operation, that the device 100 must be able to dissipate.

Une deuxième face 114, opposée à la première face 112 et illustrée dirigée vers le haut, comprend des ailettes de refroidissement 120 qui sont solidarisées à la base au moyen d'une fixation entre au moins un des plis et la base. Les ailettes s'étendent dans l'exemple montré et selon un mode de réalisation préféré, suivant au moins deux directions différentes mais parallèles au plan de la base 110 pour créer des gorges ou canaux de circulation d'air. Dans l'exemple montré, il s'agit de deux directions A, B généralement perpendiculaires entre elles. Les ailettes de refroidissement 140 sont formées par des plis d'une tôle métallique. La tôle a de préférence une épaisseur fine de moins d'un millimètre, par exemple de 0,6 mm. Avantageusement, elle est également en Aluminium et présente une importante conductivité thermique qui se situe entre 180 et 230 W/(m·K). Les ailettes de dissipation peuvent être formées par une ou plusieurs feuilles d'Aluminium cladées et moletées. La hauteur des plis est choisie selon l'application visée. Une hauteur plus importante des plis implique une surface d'échange thermique accrue des ailettes par rapport à l'air ambient, et donc un pouvoir de dissipation thermique plus important du dispositif. La hauteur des plis peut à titre exemplaire être comprise entre 15 et 25 mm. Les ailettes de refroidissement sont fixées à la face 114 de la base 110 de manière à assurer une bonne tenue mécanique ainsi qu'une bonne liaison thermique entre les deux éléments. La liaison est de préférence réalisée par collage à l'aide d'une colle de polymérisation qui est durcie lors d'un passage du dispositif dans un four de polymérisation. Alternativement, d'autres fixations entre les ailettes 120 et la base 110 peuvent être considérées sans pour autant sortir du cadre de la présente invention, notamment une fixation par brasage des deux pièces en question. Comme montré sur la figure 1, plusieurs groupes d'ailettes, deux dans chacune des directions A et B, peuvent être pliés à partir d'une même feuille en Aluminium. Alternativement chacun des groupes, ou chacune des ailettes peut être pliée à partir d'une feuille en Aluminium dédiée. Une grille de protection non-illustrée, de préférence en matière plastique, peut être prévue pour recouvrir les ailettes de refroidissement, afin de protéger celles-ci à l'encontre de chocs mécaniques éventuels.A second face 114, opposite the first face 112 and illustrated directed upwards, comprises cooling fins 120 which are secured to the base by means of a fastening between at least one of the folds and the base. The fins extend in the example shown and according to a preferred embodiment, along at least two different directions but parallel to the plane of the base 110 to create grooves or channels of air flow. In the example shown, there are two directions A, B generally perpendicular to each other. The fins of cooling 140 are formed by folds of a metal sheet. The sheet preferably has a thin thickness of less than one millimeter, for example 0.6 mm. Advantageously, it is also made of aluminum and has a high thermal conductivity which is between 180 and 230 W / (m · K). The dissipation fins may be formed by one or more cladded and knurled aluminum sheets. The height of the folds is chosen according to the intended application. A greater height of the folds involves an increased heat exchange surface of the fins relative to the ambient air, and therefore a greater heat dissipation of the device. The height of the folds may, for example, be between 15 and 25 mm. The cooling fins are fixed to the face 114 of the base 110 so as to ensure a good mechanical strength and a good thermal connection between the two elements. The bond is preferably made by bonding with a polymerization adhesive which is cured during a passage of the device in a polymerization furnace. Alternatively, other fasteners between the fins 120 and the base 110 may be considered without departing from the scope of the present invention, including a solder attachment of the two parts in question. As shown on the figure 1 , several groups of fins, two in each of the directions A and B, can be folded from the same sheet of aluminum. Alternatively each group, or each of the fins can be folded from a dedicated aluminum sheet. A non-illustrated protective grid, preferably made of plastic, may be provided to cover the cooling fins, in order to protect them against possible mechanical shocks.

La figure 2 montre la première face 112, qui est opposée à la face 114 de la base 110 du dispositif 100. Cette face est destinée à recevoir un circuit imprimé qui comprend des éléments électroniques actifs produisant de la chaleur. Dans l'exemple montré, la face 112 comprend des pions de sertissage 113 destinés à coopérer avec des trous prévus à cet effet dans le substrat d'un circuit imprimé. Les pions de sertissage 113 sont de préférence sortis par emboutissage de la plaque en Aluminium qui forme la base 110. Pour garantir cet effet, il faut prévoir une épaisseur de la base d'au moins 3 à 4 mm. La figure 3 montre à titre exemplaire un circuit imprimé 10, sans illustrer les composants électroniques de celui-ci, retenu par les pions 113. Le sertissage permet d'assurer une bonne tenue mécanique et un bon contact thermique entre le substrat du circuit imprimé et la base 110, afin de garantir l'échange de chaleur entre les deux éléments. De manière alternative ou complémentaire au sertissage, le circuit imprimé peut être collé à l'aide d'une colle à conductivité thermique, par exemple une colle de polymérisation sur la face 112 de la base 110.The figure 2 shows the first face 112, which is opposite to the face 114 of the base 110 of the device 100. This face is intended to receive a printed circuit which comprises active electronic elements producing heat. In the example shown, the face 112 comprises crimping pins 113 intended to cooperate with holes provided for this purpose in the substrate of a printed circuit. The crimping pins 113 are preferably drawn out of the aluminum plate which forms the base 110. To ensure this effect, a thickness of the base of at least 3 to 4 mm must be provided. The figure 3 exemplary shows a printed circuit 10, without illustrating the electronic components thereof, retained by the pins 113. The crimping ensures a good mechanical strength and a good thermal contact between the substrate of the printed circuit and the base 110, in order to guarantee the exchange of heat between the two elements. Alternatively or complementary to crimping, the printed circuit can be glued with a thermal conductivity glue, for example a polymerization glue on the face 112 of the base 110.

L'échange thermique se fait d'abord entre le circuit imprimé, sur lequel la chaleur est produite, et la base 110 du dispositif 100. Puis, à travers la liaison thermique de le base 110 avec les ailettes de refroidissement 120, la chaleur transite vers celles-ci. Les ailettes de refroidissement présentent une importante surface d'échange de chaleur avec l'air ambient qui permet de dissiper la chaleur.The heat exchange is first between the printed circuit, on which the heat is produced, and the base 110 of the device 100. Then, through the thermal connection of the base 110 with the cooling fins 120, the heat transits towards them. The cooling fins have a large heat exchange surface with ambient air that dissipates heat.

L'illustration de la figure 4 reprend le dispositif 100 comprenant la base 110, sur une face 114 de laquelle les ailettes de refroidissement 120 sont fixées. La face opposée 112 de la base 110 est recouverte par un couvercle 130. Le couvercle protège le circuit imprimé qu'il recouvre sur la face 112 par rapport à des chocs mécaniques, et par rapport à des interférences électromagnétiques éventuelles. Il peut également contribuer à la capacité de dissipation thermique globale du dispositif. A cet effet, il est avantageux que le couvercle 130 soit formé par une tôle en métal léger comme l'Aluminium. La forme de la tôle est obtenue par emboutissage avec un outil approprié. La variante d'Aluminium utilisée présente de préférence une conductivité thermique qui se situe entre 180 et 230 W/(m·K). Le bord inférieur du couvercle peut de manière connue coopérer avec le bord de la base 110 afin de lier les deux éléments. D'autres moyens de liaison mécanique, comme le sertissage, et de préférence également de liaison thermique sont en soi connus dans l'art et leur réalisation est à la portée de l'homme de l'art. Afin de garantir l'étanchéité de la liaison entre la base 120 et le couvercle 130, un joint d'étanchéité 134 tel qu'il est illustré sur la figure 4, fabriqué par exemple en caoutchouc, peut être installé au niveau de la jonction. Dans l'exemple montré, le couvercle comprend une ouverture 132 donnant accès à l'intérieur du dispositif, c'est-à-dire au circuit imprimé reçu sur la face 112 du dispositif. L'ouverture 132 permet par exemple de réaliser une connexion électrique depuis l'extérieur du dispositif avec le circuit imprimé.The illustration of the figure 4 takes the device 100 comprising the base 110, on a face 114 of which the cooling fins 120 are fixed. The opposite face 112 of the base 110 is covered by a cover 130. The cover protects the printed circuit that it covers on the face 112 with respect to mechanical shocks, and with respect to possible electromagnetic interference. It can also contribute to the overall heat dissipation capability of the device. For this purpose, it is advantageous for the cover 130 to be formed by a sheet of light metal such as aluminum. The shape of the sheet is obtained by stamping with a suitable tool. The aluminum variant used preferably has a thermal conductivity of between 180 and 230 W / (m · K). The lower edge of the lid can in known manner cooperate with the edge of the base 110 to bind the two elements. Other mechanical connection means, such as crimping, and preferably also thermal bonding, are in themselves known in the art and their realization is within the reach of those skilled in the art. In order to guarantee the tightness of the connection between the base 120 and the cover 130, a seal 134 as illustrated on FIG. figure 4 , made for example of rubber, can be installed at the junction. In the example shown, the cover comprises an opening 132 giving access to the interior of the device, that is to say to the printed circuit received on the face 112 of the device. The opening 132 allows for example to make an electrical connection from the outside of the device with the printed circuit.

La figure 5 montre un autre mode de réalisation du dispositif de dissipation thermique 200 selon l'invention. Le dispositif comprend une base 210 à géométrie généralement plane, qui est de préférence en Aluminium et qui présente une conductivité thermique entre 180 et 230 W/(m·K). Une première face 212, montrée dirigée vers le haut, est destinée à recevoir un circuit imprimé non-illustré. Une deuxième face 214, opposée à la première face 212 et illustrée dirigée vers le bas, comprend des ailettes de refroidissement 220 qui s'étendent suivant au moins deux directions différentes mais parallèles au plan de la base 210. La face 212 présente la particularité qu'une partie en retrait 216 a été réalisée par emboutissage de la base 210. Une telle configuration est intéressante lorsque le dispositif de dissipation thermique 200 est prévu pour y loger un circuit imprimé qui comprend des composants électroniques montés sur ces deux surfaces planes. Lorsque le circuit imprimé est reçu sur la face 212, les composants électronique montés sur la face du circuit imprimé qui fait face à la face 212, sont alors logés dans la partie en retrait 216. Des géométries alternatives peuvent évidemment être prévues selon le même principe et réalisées par un emboutissage approprié, sans pour autant sortir du cadre de la présente invention.The figure 5 shows another embodiment of the heat dissipation device 200 according to the invention. The device comprises a base 210 with a generally flat geometry, which is preferably made of aluminum and which has a thermal conductivity between 180 and 230 W / (m · K). A first face 212, shown facing upwards, is intended to receive a printed circuit not shown. A second face 214, opposite the first face 212 and shown facing downwards, comprises cooling fins 220 which extend in at least two different directions but parallel to the plane of the base 210. The face 212 has the particularity that a recessed portion 216 has been made by stamping the base 210. Such a configuration is advantageous when the heat dissipating device 200 is provided to house a printed circuit which comprises electronic components mounted on these two planar surfaces. When the printed circuit is received on the face 212, the electronic components mounted on the face of the printed circuit which faces the face 212, are then housed in the recessed part 216. Alternative geometries can obviously be provided according to the same principle. and made by appropriate stamping, without departing from the scope of the present invention.

La figure 6 montre une vue schématique d'en haut d'un mode de réalisation supplémentaire du dispositif de dissipation thermique 300 selon l'invention. La face 314 de la base 310 est montrée. Il s'agit de la face sur laquelle les ailettes de refroidissement 320 sont fixées. Par rapport aux exemples précédents, un arrangement alternatif des ailettes de refroidissement est illustré à titre exemplaire. Les ailettes 320 s'étendent de manière radiale à partir d'une partie centrale de la base 310 pour former une structure en étoile ou circulaire. Chaque paire dont les ailettes de refroidissement sont radialement opposées par rapport au centre est orientée selon une direction. D'autres géométries de disposition des ailettes de refroidissement sont envisageables. Une pluralité plus importante des directions selon lesquels les ailettes de refroidissement s'étendent implique en général une flexibilité accrue au niveau des possibilités de placement et d'orientation du dispositif 300 au sein d'un module lumineux. Avec le nombre de directions de passage d'air ambient croissant, la probabilité d'un échange thermique entre les ailettes de refroidissement et l'air ambiant est en général accrue.The figure 6 shows a schematic view from above of a further embodiment of the heat dissipating device 300 according to the invention. The face 314 of the base 310 is shown. This is the face on which the cooling fins 320 are fixed. Compared with the previous examples, an alternative arrangement of the cooling fins is exemplarily illustrated. The fins 320 extend radially from a central portion of the base 310 to form a star or circular structure. Each pair whose cooling fins are radially opposite to the center is oriented in one direction. Other geometries of arrangement of the cooling fins are conceivable. A greater plurality of directions in which the cooling fins extend generally implies greater flexibility in the placement and orientation of the device 300 within a light module. With the increasing number of ambient air flow directions, the likelihood of heat exchange between the cooling fins and the ambient air is generally increased.

Claims (12)

  1. Heat sink device (100, 200, 300) for a motor vehicle lighting module, comprising a base (110, 210, 310) intended to receive, on a first face (112, 212), a printed circuit board (10) and comprising heat dissipation means on an opposite second face (114, 214, 314), the heat dissipation means comprising cooling fins (120, 220, 320) that are formed by folds of at least one metal sheet, the cooling fins (120, 220, 320) being joined to the base (110, 210, 310) by way of an attachment between at least one of the folds and the base (110, 210, 310) characterized in that the device (100, 200, 300) comprises a cover (130) made of stamped aluminum and intended to be attached in a sealtight manner to the first face of the base (110).
  2. Device according to Claim 1, characterized in that the base (110, 210, 310) is made of stamped aluminum.
  3. Device according to either of Claims 1 and 2, characterized in that the cooling fins (120, 220, 320) are made of aluminum.
  4. Device according to one of Claims 1 to 3, characterized in that the metal sheet has a thickness of less than 1 mm.
  5. Device according to one of Claims 1 to 4, characterized in that the base (110, 210, 310) and/or the cooling fins (120, 220, 320) have a thermal conductivity of between 180 and 230 W/(m·K).
  6. Device according to one of Claims 1 to 5, characterized in that the cooling fins extend in at least two different directions that are parallel to the base.
  7. Device according to Claim 6, characterized in that the device comprises a plurality of cooling fins (120, 220), of which at least two groups of fins extend in two directions that are perpendicular to one another.
  8. Device according to either of Claims 6 and 7, characterized in that the device comprises a plurality of cooling fins (320) that extend radially in a plurality of directions starting from a central portion of the base (310) .
  9. Device according to one of Claims 1 to 8, characterized in that it includes a thermal interface positioned between the cooling fins and the base.
  10. Device according to one of Claims 1 to 9, characterized in that the base (110) comprises, on its first face (112), crimping studs (113) that are intended for attaching a printed circuit board to this face.
  11. Lighting module for a motor vehicle, comprising at least one semiconductor element-based light source and a printed circuit board comprising a circuit for controlling the supply of power to the light source(s), characterized in that the printed circuit board is attached to a heat sink device (100, 200, 300) of the module, the device being in accordance with one of Claims 1 to 10.
  12. Lighting module according to Claim 11, characterized in that the printed circuit board is covered in a sealtight manner by the cover of the heat sink device.
EP16763816.2A 2015-09-14 2016-09-09 Heat sink device for a motor vehicle lighting module Active EP3350511B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1558520A FR3041080B1 (en) 2015-09-14 2015-09-14 THERMAL DISSIPATION DEVICE FOR A LIGHT MODULE OF A MOTOR VEHICLE
PCT/EP2016/071379 WO2017046016A1 (en) 2015-09-14 2016-09-09 Heat sink device for a motor vehicle lighting module

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EP3350511A1 EP3350511A1 (en) 2018-07-25
EP3350511B1 true EP3350511B1 (en) 2019-08-28

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FR3041080A1 (en) 2017-03-17
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EP3350511A1 (en) 2018-07-25
CN108139070A (en) 2018-06-08

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