EP3211293A1 - Heat dissipation device for a lighting device of a motor vehicle - Google Patents

Heat dissipation device for a lighting device of a motor vehicle Download PDF

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Publication number
EP3211293A1
EP3211293A1 EP17156709.2A EP17156709A EP3211293A1 EP 3211293 A1 EP3211293 A1 EP 3211293A1 EP 17156709 A EP17156709 A EP 17156709A EP 3211293 A1 EP3211293 A1 EP 3211293A1
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EP
European Patent Office
Prior art keywords
support
pin
printed circuit
crimping
face
Prior art date
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Granted
Application number
EP17156709.2A
Other languages
German (de)
French (fr)
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EP3211293B1 (en
Inventor
Olivier Badia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
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Valeo Vision SAS
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Publication of EP3211293A1 publication Critical patent/EP3211293A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/50—Waterproofing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/14—Bayonet-type fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of lighting and light signaling of motor vehicles.
  • the invention relates to a heat dissipation device involved in a light device of a motor vehicle, and its mechanical attachment to a printed circuit.
  • LED In the field of lighting and light signaling of motor vehicles, it is becoming more and more common to use LED light-emitting diode-type light sources.
  • An LED is a semiconductor component, which, when traversed by an electric current of a predetermined intensity, emits light rays.
  • a luminous flux of a predetermined intensity generally related to the intensity of the electric current flowing through the LED, can then be measured.
  • LED technology can reduce the electrical energy needs of lighting and / or signaling devices, while at the same time enabling vehicle manufacturers to create interesting and individual optical signatures.
  • a plurality of LEDs may for example be arranged along a curvilinear contour.
  • the LEDs are on a printed circuit which is advantageously connected to LED power supply means.
  • the printed circuit is generally covered with a housing.
  • heat dissipating elements are fashioned from aluminum, which is a relatively expensive material.
  • the use of thick plates in order to obtain by stamping the pins of a height adequate to the strength of a printed circuit thus generates on the one hand a cost and on the other hand a significant weight. Since it is necessary to obtain a pin of a height greater than that of the printed circuit, it requires a large thickness of sheet metal to be able to output a pawn of adequate dimensions by stamping.
  • the invention aims to overcome at least one of the problems posed by the prior art.
  • the invention relates to a heat dissipation device for a light device of a motor vehicle.
  • the heat dissipation device comprises a metal support comprising at least a support portion of generally flat shape and at least one crimping pin for fixing a printed circuit of the light device on said support.
  • the heat dissipation device is remarkable in that said pin is sealingly attached to a first face of the support by soldering.
  • Fixing the pin is preferably performed on the support portion of generally flat shape.
  • the metal support is of generally flat shape.
  • the metal support may have a thickness which is smaller than the height of the peg measured with respect to said first face of the support.
  • the printed circuit may be of mold printed circuit type, MID ("molded interconnect device").
  • the printed circuit may be of the flexible printed circuit board (FPCB) type.
  • FPCB flexible printed circuit board
  • the pin may preferably have a length, corresponding to its height relative to the support to which it is attached, which is greater than the thickness of the printed circuit that is intended to fix the support.
  • the support may preferably have a thickness of less than 2.5 mm.
  • the metal support may preferably be made of aluminum.
  • the support and the pin may be of identical materials.
  • the support and the pin may be of different metallic materials.
  • Cooling fins may preferably be attached to a second side of the support by soldering. Alternatively, cooling fins may be attached to the first face of the support by soldering.
  • a clearance is preserved between the pin and the face of the metal support, to avoid possible degradation of the solder during a subsequent crimping of the pin.
  • the crimping step may preferably comprise a step of electrically contacting at least one electrical track of the printed circuit with the crimping pin, in order to connect said electrical track to the electrical ground potential.
  • the printed circuit may comprise at least one light source of the light device. It may for example be a semiconductor element light source such as a light emitting diode, LED.
  • the printed circuit may alternatively comprise a circuit for controlling the supply of at least one light source of the light device.
  • the numbers 100, 200 describe for example a dissipation device in two different embodiments according to the invention.
  • Brazing of metals is a permanent assembly method known per se in the state of the art, which allows to establish a metallic continuity between the joined parts.
  • the brazing mechanism is the diffusion / atomic migration on both sides of the edges to be assembled, obtained by caloric action. Unlike welding, the assembled edges are not melted during the brazing process.
  • brazing is performed using a filler metal or a solder, whose melting temperature is lower than that of the parts to be assembled. The choice of such a material is within the reach of the skilled person.
  • an alloy of aluminum and silicon may for example be used as a filler metal.
  • the melting temperature of such an alloy is between 570 ° C and 625 ° C.
  • the parts to be assembled can be made of different metals or the same metal.
  • the brazing temperature is lower than the melting temperature of the parts to be assembled, but greater than the melting temperature of the filler metal.
  • Brazing makes it possible to produce tight joints between the assembled parts, the final assembly having a metallurgical and thermal continuity.
  • the assembly of multiple parts can also be performed in parallel in an oven.
  • a local heat input can be used to make a solder assembly.
  • the parts to be assembled must preferably be clean and free of oxides on the surface, in order to guarantee the soldering effect.
  • the figure 1 shows a thermal device 100 according to the invention for a light device of a motor vehicle.
  • the light device further comprises a printed circuit 10 which supports a control circuit for the supply of light sources, for example LEDs.
  • the power control circuit usually involves a converter circuit and produces heat.
  • the figure also shows a housing 12 which covers the printed circuit, and which makes a seal with the edge of the heat dissipating device.
  • the printed circuit comprises an opening through which passes a crimping pin 120 fixed on a portion of the face 112 of the support 110 of the heat dissipating device, said surface portion being generally flat.
  • the crimp pin is fixed to the support 110 by brazing. It serves to maintain the printed circuit in a predetermined position by the location of the / pions and corresponding openings of the printed circuit.
  • the opposite face 114 of the support 110 can accommodate cooling fins 130 in order to increase the surface of the heat dissipating device which is in contact with the ambient air, thus facilitating the heat exchange .
  • the fins are advantageously fixed to the support 110 by brazing.
  • a support 110 with a small thickness, less than 2.5 mm, less than 1.5 mm, or for example 1 mm.
  • the height of the pins 120 on the side 112 is chosen independently of the thickness of the support or the piece of aluminum sheet 110.
  • the height of the pins 120 must be large enough for the pins to pass through the openings provided in the circuit. printed and spring out to allow the fixing of the printed circuit by crimping the pins.
  • the height of the pins 120 may for example be at least 2.5 mm with respect to the face 112 of the support 110.
  • the base thereof In order to be able to perform the crimping, during which a large mechanical stress is applied to the pin, the base thereof must be aligned with the plane of support 110.
  • the figure 2 shows a preferred embodiment of the heat dissipation device 200 according to the invention.
  • the face 212 which supports the printed circuit 20 is shown.
  • Crimp pins 220 have been attached to the generally planar support 210. These pins serve to maintain the printed circuit in a predetermined position, through openings of the printed circuit provided for this purpose, before being crimped.
  • a second set of crimping pins 222 is provided to attach a housing thereon which can cover the printed circuit tightly.
  • the figure 3 shows the same embodiment as the figure 2 however, the opposite face 214 of the device 200 is illustrated. It is apparent that the pins 220, 222 in this embodiment pass through an opening in the support 210 and comprise a shoulder that bears against the face 214 of the support 210.
  • This arrangement facilitates the alignment of the pegs with respect to the plane support 210.
  • Pins having a shoulder at one end are inserted into the openings of the support 210 provided for this purpose until the shoulder comes into contact with the face 214. In this position the pins are oriented perpendicularly. relative to the support and can be brazed to assemble the parts in question.
  • the crimping of the pins may advantageously create an electrical contact between the upper face of the printed circuit, which does not face the support 110, 210 of the device, and the heat dissipation device itself, which represents in general the zero electric potential or the mass.
  • an electrical track of the circuit comprises the edges of an opening of the printed circuit by which one of the crimping pins passes, this contact serves to connect the electrical track in question to the potential of the mass.

Abstract

L'invention propose un dispositif de dissipation thermique (100) pour un dispositif lumineux d'un véhicule automobile, comprenant un support (110) métallique de forme généralement plane et au moins un pion de sertissage (120) destiné à fixer un circuit imprimé (10) dudit dispositif lumineux sur ledit support (110). Selon les mesures de l'invention les dimensions des pions de sertissage (120) sont indépendants de l'épaisseur du support (110) du dispositif de dissipation thermique (100). Des procédés d'assemblage des pions de sertissage (120) au support (110), et d'un circuit imprimé (10) aux pions de sertissage (120), sont également proposés.The invention proposes a heat dissipation device (100) for a light device of a motor vehicle, comprising a metal support (110) of generally flat shape and at least one crimping pin (120) intended to fix a printed circuit ( 10) of said light device on said support (110). According to the measures of the invention the dimensions of the crimping pins (120) are independent of the thickness of the support (110) of the heat dissipating device (100). Methods of assembling the crimp pins (120) to the carrier (110), and a printed circuit (10) to the crimp pins (120), are also provided.

Description

L'invention a trait au domaine de l'éclairage et de la signalisation lumineuse des véhicules automobiles. En particulier, l'invention concerne un dispositif de dissipation thermique impliqué dans un dispositif lumineux d'un véhicule automobile, et sa fixation mécanique à un circuit imprimé.The invention relates to the field of lighting and light signaling of motor vehicles. In particular, the invention relates to a heat dissipation device involved in a light device of a motor vehicle, and its mechanical attachment to a printed circuit.

Dans le domaine de l'éclairage et de la signalisation lumineuse des véhicules automobiles, il devient de plus en plus courant d'avoir recours à des sources lumineuses de type diode électroluminescente, LED. Une LED est un composant semi-conducteur, qui, lorsqu'il est parcouru par un courant électrique d'une intensité prédéterminée, émet des rayons lumineux. Un flux lumineux d'une intensité prédéterminée, généralement en rapport avec l'intensité du courant électrique qui traverse la LED, peut alors être mesuré. La technologie des LEDs permet d'une part de réduire les besoins d'énergie électrique des dispositifs d'éclairage et/ou de signalisation, et d'autre part elle permet aux constructeurs de véhicules de créer des signatures optiques intéressantes et individuelles. Une pluralité de LEDs peut par exemple être disposée le long d'un contour curviligne.In the field of lighting and light signaling of motor vehicles, it is becoming more and more common to use LED light-emitting diode-type light sources. An LED is a semiconductor component, which, when traversed by an electric current of a predetermined intensity, emits light rays. A luminous flux of a predetermined intensity, generally related to the intensity of the electric current flowing through the LED, can then be measured. LED technology can reduce the electrical energy needs of lighting and / or signaling devices, while at the same time enabling vehicle manufacturers to create interesting and individual optical signatures. A plurality of LEDs may for example be arranged along a curvilinear contour.

Il est connu de disposer les LEDs sur un circuit imprimé qui est avantageusement relié à des moyens d'alimentation électrique des LEDs. Afin de protéger les composants du circuit imprimé, le circuit imprimé est généralement recouvert d'un boîtier. Pour pouvoir évacuer la chaleur produite lors du fonctionnement des LEDs, il est également connu de disposer le circuit imprimé qui les supporte, ou un circuit imprimé qui supporte un circuit de pilotage de l'alimentation électrique des LEDs, directement sur un élément dissipateur de chaleur, par exemple un radiateur métallique.It is known to arrange the LEDs on a printed circuit which is advantageously connected to LED power supply means. In order to protect the components of the printed circuit, the printed circuit is generally covered with a housing. In order to be able to evacuate the heat produced during the operation of the LEDs, it is also known to have the printed circuit which supports them, or a printed circuit which supports a circuit for controlling the power supply of the LEDs, directly on a heat sink element for example a metal radiator.

Afin de fixer un circuit imprimé sur une plaque métallique d'un radiateur, il est connu de prévoir des ouvertures ou trous dans le substrat du circuit imprimé. Des pions sur la plaque métallique peuvent traverser les trous afin de maintenir le circuit imprimé dans une position prédéterminée. De manière connue, les pions sont venus de matière avec la plaque métallique du radiateur en question. Ceci est réalisé en utilisant un outil d'emboutissage qui permet de déformer la plaque pour en faire ressortir un pion. Evidemment, la hauteur d'un tel pion ne peut pas être supérieure à l'épaisseur de la plaque de laquelle le pion est ressorti par emboutissage. La hauteur du pion nécessaire à maintenir le circuit imprimé en position est dépendant de la hauteur du circuit imprimé. Elle peut par exemple être d'au moins 2,5 mm. Cette hauteur correspond donc à l'épaisseur minimale que la plaque métallique ou tôle doit présenter avant d'être emboutie. Typiquement, les éléments de dissipation de chaleur sont façonnés en Aluminium, qui est un matériel relativement coûteux. L'utilisation de tôles épaisses dans le but d'obtenir par emboutissage des pions d'une hauteur adéquate à la tenue d'un circuit imprimé engendre donc d'une part un coût et d'autre part un poids importants. Comme il est nécessaire d'obtenir un pion d'une hauteur plus grande que celle du circuit imprimé, il faut une épaisseur de tôle importante pour en pouvoir sortir un pion de dimensions adéquates par emboutissage.In order to fix a circuit board on a metal plate of a radiator, it is known to provide openings or holes in the substrate of the printed circuit. Pieces on the metal plate may pass through the holes to maintain the circuit board in a predetermined position. In known manner, the pins are integral with the metal plate of the radiator in question. This is achieved by using a stamping tool that allows to deform the plate to bring out a pawn. Obviously, the height of such a pin can not be greater than the thickness of the plate from which the pin has emerged by stamping. The height of the pin necessary to maintain the printed circuit in position is dependent on the height of the printed circuit. It may for example be at least 2.5 mm. This height therefore corresponds to the minimum thickness that the plate metal or sheet metal must present before being stamped. Typically, heat dissipating elements are fashioned from aluminum, which is a relatively expensive material. The use of thick plates in order to obtain by stamping the pins of a height adequate to the strength of a printed circuit thus generates on the one hand a cost and on the other hand a significant weight. Since it is necessary to obtain a pin of a height greater than that of the printed circuit, it requires a large thickness of sheet metal to be able to output a pawn of adequate dimensions by stamping.

L'invention a pour objectif de pallier à au moins un des problèmes posés par l'art antérieur.The invention aims to overcome at least one of the problems posed by the prior art.

L'invention a pour objet un dispositif de dissipation thermique pour un dispositif lumineux d'un véhicule automobile. Le dispositif de dissipation thermique comprend un support métallique comprenant au moins une portion de support de forme généralement plane et au moins un pion de sertissage destiné à fixer un circuit imprimé du dispositif lumineux sur ledit support. Le dispositif de dissipation thermique est remarquable en ce que ledit pion est fixé de manière étanche sur une première face du support par brasage.The invention relates to a heat dissipation device for a light device of a motor vehicle. The heat dissipation device comprises a metal support comprising at least a support portion of generally flat shape and at least one crimping pin for fixing a printed circuit of the light device on said support. The heat dissipation device is remarkable in that said pin is sealingly attached to a first face of the support by soldering.

La fixation du pion est de préférence réalisée sur la portion de support de forme généralement plane.Fixing the pin is preferably performed on the support portion of generally flat shape.

De préférence, le support métallique est de forme généralement plane.Preferably, the metal support is of generally flat shape.

De préférence, le support métallique peut avoir une épaisseur qui est inférieure à la hauteur du pion mesurée par rapport à ladite première face du support.Preferably, the metal support may have a thickness which is smaller than the height of the peg measured with respect to said first face of the support.

Le circuit imprimé peut être du type circuit imprimé moule, MID (« moulded interconnect device »).The printed circuit may be of mold printed circuit type, MID ("molded interconnect device").

Le circuit imprimé peut être du type circuit imprimé flexible, FPCB (« Flexible Printed Circuit Board »).The printed circuit may be of the flexible printed circuit board (FPCB) type.

Le pion peut de préférence avoir une longueur, correspondant à sa hauteur par rapport au support auquel il est fixé, qui est supérieure à l'épaisseur du circuit imprimé qu'il est destiné à fixer au support.The pin may preferably have a length, corresponding to its height relative to the support to which it is attached, which is greater than the thickness of the printed circuit that is intended to fix the support.

Le support peut de préférence avoir une épaisseur inférieure à 2.5 mm.The support may preferably have a thickness of less than 2.5 mm.

Le support métallique peut de préférence être en en aluminium.The metal support may preferably be made of aluminum.

De préférence, le support et le pion peuvent être en matériaux identiques. De manière alternative, le support et le pion peuvent être en matériaux métalliques différents.Preferably, the support and the pin may be of identical materials. Alternatively, the support and the pin may be of different metallic materials.

Des ailettes de refroidissement peuvent de préférence être fixées sur une deuxième face du support par brasage. Alternativement, des ailettes de refroidissement peuvent être fixées sur la première face du support par brasage.Cooling fins may preferably be attached to a second side of the support by soldering. Alternatively, cooling fins may be attached to the first face of the support by soldering.

L'invention a également pour objet un procédé pour la fixation d'au moins un pion de sertissage destiné à fixer un circuit imprimé d'un dispositif lumineux d'un véhicule automobile sur un support métallique. Le procédé est remarquable en ce qu'il comprend les étapes suivantes :

  • alignement de manière généralement parallèle de la surface de base du pion avec une face du support métallique ;
  • apport d'un matériau de brasage entre la base du pion et la face du support métallique ;
  • brasage à une température inférieure aux températures de fusion du pion et du support métallique.
The invention also relates to a method for fixing at least one crimping pin for fixing a printed circuit of a light device of a motor vehicle on a metal support. The method is remarkable in that it comprises the following steps:
  • generally parallel alignment of the base surface of the pin with a face of the metal support;
  • supplying a brazing material between the base of the pin and the face of the metal support;
  • brazing at a temperature below the melting temperatures of the pin and the metal support.

De préférence, lors de l'étape d'alignement un jeu est préservé entre le pion et la face du support métallique, afin d'éviter une dégradation éventuelle de la brasure lors d'un sertissage ultérieur du pion.Preferably, during the alignment step a clearance is preserved between the pin and the face of the metal support, to avoid possible degradation of the solder during a subsequent crimping of the pin.

L'invention a également pour objet un procédé d'assemblage d'un circuit imprimé d'un dispositif lumineux pour un véhicule automobile sur un dispositif de dissipation thermique conforme à l'invention. Le procédé d'assemblage est remarquable en ce qu'il comprend les étapes suivantes :

  • alignement d'au moins une ouverture dans le support du circuit imprimé par rapport à au moins un pion de sertissage du dispositif de dissipation thermique ;
  • pose du circuit imprimé sur le support du dispositif de dissipation thermique, de façon à ce que le pion de sertissage perce ladite ouverture ;
  • sertissage du pion pour fixer le circuit imprimé sur le dispositif de dissipation thermique.
The invention also relates to a method of assembling a printed circuit of a light device for a motor vehicle on a heat dissipation device according to the invention. The assembly process is remarkable in that it comprises the following steps:
  • aligning at least one aperture in the printed circuit carrier with respect to at least one crimp pin of the heat dissipating device;
  • placing the circuit board on the support of the heat dissipating device, so that the crimp pin pierces said opening;
  • crimping the pin to fix the circuit board on the heat dissipating device.

L'étape de sertissage peut de préférence comprendre une étape de mise en contact électrique d'au moins une piste électrique du circuit imprimé avec le pion de sertissage, afin de relier ladite piste électrique au potentiel électrique de masse.The crimping step may preferably comprise a step of electrically contacting at least one electrical track of the printed circuit with the crimping pin, in order to connect said electrical track to the electrical ground potential.

De préférence, le circuit imprimé peut comprendre au moins une source lumineuse du dispositif lumineux. Il peut par exemple s'agir d'une source lumineuse à élément semiconducteur telle qu'une diode électroluminescente, LED. Le circuit imprimé peut alternativement comprendre un circuit de pilotage de l'alimentation d'au moins une source lumineuse du dispositif lumineux.Preferably, the printed circuit may comprise at least one light source of the light device. It may for example be a semiconductor element light source such as a light emitting diode, LED. The printed circuit may alternatively comprise a circuit for controlling the supply of at least one light source of the light device.

En utilisant les mesures de l'invention, il devient possible proposer des solutions de fixation d'un circuit imprimé sur une plaque métallique d'un élément dissipateur de chaleur, qui engendrent des tôles amincies par rapport aux solutions connues dans l'état de l'art. En fixant des pions de sertissage à une tôle mince par brasage, il est possible de proposer des pions dont la hauteur est indépendante de l'épaisseur de la tôle, tout en maintenant l'étanchéité du joint entre le pion et la tôle. Il en résulte une réduction conséquente de l'épaisseur de la tôle, ce qui engendre des gains en termes de poids et de coûts. En plus, la fixation par sertissage permet une reprise du potentiel de masse par un circuit électrique du circuit imprimé.By using the measurements of the invention, it becomes possible to propose solutions for fixing a printed circuit on a metal plate of a heat dissipating element, which generate thinned sheets compared to the solutions known in the state of the art. 'art. By fixing crimping pins to a thin sheet by brazing, it is possible to propose pins whose height is independent of the thickness of the sheet, while maintaining the seal of the seal between the pin and the sheet. This results in a consequent reduction in the thickness of the sheet, which generates gains in terms of weight and cost. In addition, the fixing by crimping allows a recovery of the ground potential by an electrical circuit of the printed circuit.

D'autres caractéristiques et avantages de la présente invention seront mieux compris à l'aide de la description exemplaire et des dessins parmi lesquels :

  • la figure 1 est une illustration schématique en perspective d'une coupe latérale à travers un composant d'un dispositif lumineux pour un véhicule automobile, comprenant un dispositif selon l'invention dans un mode de réalisation préférentiel;
  • la figure 2 est une illustration schématique en perspective d'un mode de réalisation préférentiel du dispositif selon l'invention vu d'une première face, montrant également un circuit imprimé;
  • la figure 3 est une illustration schématique en perspective d'un mode de réalisation préférentiel du dispositif selon l'invention vu d'une deuxième face, du côté opposé à la face illustrée par la figure 2.
Other features and advantages of the present invention will be better understood from the exemplary description and the drawings, among which:
  • the figure 1 is a schematic perspective illustration of a lateral section through a component of a light device for a motor vehicle, comprising a device according to the invention in a preferred embodiment;
  • the figure 2 is a schematic perspective illustration of a preferred embodiment of the device according to the invention seen from a first face, also showing a printed circuit;
  • the figure 3 is a schematic perspective illustration of a preferred embodiment of the device according to the invention seen from a second face, the opposite side to the face illustrated by the figure 2 .

Dans la description qui suit, des numéros de référence similaires seront utilisés pour décrire des concepts similaires à travers des modes de réalisation différents de l'invention. Ainsi, les numéros 100, 200 décrivent par exemple un dispositif de dissipation dans deux modes de réalisation différents conformes à l'invention.In the following description, like reference numerals will be used to describe similar concepts through different embodiments of the invention. Thus, the numbers 100, 200 describe for example a dissipation device in two different embodiments according to the invention.

Sauf indication spécifique du contraire, des caractéristiques techniques décrites en détails pour un mode de réalisation donné peuvent être combinés aux caractéristiques techniques décrites dans le contexte d'autres modes de réalisation décrits à titre exemplaire et non limitatif.Unless specifically indicated otherwise, technical features described in detail for a given embodiment may be combined with the technical features described in the context of other embodiments described by way of example and not limitation.

Le brasage des métaux est un procédé d'assemblage permanent connu en soi dans l'état de l'art, qui permet établir une continuité métallique entre les pièces réunies. Le mécanisme du brasage est la diffusion /migration atomique de part et d'autre des bords à assembler, obtenue par action calorique. Contrairement au soudage, les bords assemblés ne sont pas fondus lors du procédé de brasage. Typiquement, le brasage est réalisé à l'aide d'un métal d'apport ou d'un produit de brasage, dont la température de fusion est inférieure à celle des pièces à assembler. Le choix d'un tel matériau est à la portée de l'homme du métier. Pour le brasage de pièces en Aluminium, un alliage d'Aluminium et de Silicium peut par exemple être utilisé comme métal d'apport. La température de fusion d'un tel alliage se situe entre 570°C et 625 °C. Les pièces à assembler peuvent être constitués de métaux différents ou d'un même métal. La température de brasage est inférieure à la température de fusion des pièces à assembler, mais supérieure à la température de fusion du métal d'apport.Brazing of metals is a permanent assembly method known per se in the state of the art, which allows to establish a metallic continuity between the joined parts. The brazing mechanism is the diffusion / atomic migration on both sides of the edges to be assembled, obtained by caloric action. Unlike welding, the assembled edges are not melted during the brazing process. Typically, brazing is performed using a filler metal or a solder, whose melting temperature is lower than that of the parts to be assembled. The choice of such a material is within the reach of the skilled person. For the brazing of aluminum parts, an alloy of aluminum and silicon may for example be used as a filler metal. The melting temperature of such an alloy is between 570 ° C and 625 ° C. The parts to be assembled can be made of different metals or the same metal. The brazing temperature is lower than the melting temperature of the parts to be assembled, but greater than the melting temperature of the filler metal.

Le brasage permet de réaliser des joints étanches entre les pièces assemblées, l'assemblage final présentant une continuité métallurgique et thermique. L'assemblage de pièces multiples peut en outre être réalisé en parallèle dans un four. Alternativement, un apport calorifique local peut être utilisé pour réaliser un assemblage par brasage. De manière connue, les pièces à assembler doivent de préférence être propres et dépourvues d'oxydes en surface, afin de garantir l'effet de brasage.Brazing makes it possible to produce tight joints between the assembled parts, the final assembly having a metallurgical and thermal continuity. The assembly of multiple parts can also be performed in parallel in an oven. Alternatively, a local heat input can be used to make a solder assembly. In known manner, the parts to be assembled must preferably be clean and free of oxides on the surface, in order to guarantee the soldering effect.

La figure 1 montre un dispositif thermique 100 selon l'invention pour un dispositif lumineux d'un véhicule automobile. Le dispositif lumineux comprend en outre un circuit imprimé 10 qui supporte un circuit de pilotage de l'alimentation de sources lumineuses, par exemple de diodes électroluminescentes LED. Le circuit de pilotage de l'alimentation fait en général intervenir un circuit convertisseur et produit de la chaleur. La figure montre également un boîtier 12 qui recouvre le circuit imprimé, et qui réalise un joint étanche avec le bord du dispositif de dissipation thermique. Le circuit imprimé comprend une ouverture à travers de laquelle passe un pion de sertissage 120 fixé sur une portion de la face 112 du support 110 du dispositif de dissipation thermique, ladite portion de surface étant généralement plane. Le pion de sertissage est fixé au support 110 par brasage. Il sert à maintenir le circuit imprimé dans une position prédéterminée par l'emplacement du/des pions et des ouvertures correspondantes du circuit imprimé.The figure 1 shows a thermal device 100 according to the invention for a light device of a motor vehicle. The light device further comprises a printed circuit 10 which supports a control circuit for the supply of light sources, for example LEDs. The power control circuit usually involves a converter circuit and produces heat. The figure also shows a housing 12 which covers the printed circuit, and which makes a seal with the edge of the heat dissipating device. The printed circuit comprises an opening through which passes a crimping pin 120 fixed on a portion of the face 112 of the support 110 of the heat dissipating device, said surface portion being generally flat. The crimp pin is fixed to the support 110 by brazing. It serves to maintain the printed circuit in a predetermined position by the location of the / pions and corresponding openings of the printed circuit.

Comme indiqué sur la figure 1, la face opposée 114 du support 110, ou alternativement la face 112, peut héberger des ailettes de refroidissement 130 afin d'augmenter la surface du dispositif de dissipation thermique qui est au contact avec l'air ambiant, facilitant ainsi l'échange de chaleur. Les ailettes sont avantageusement fixées au support 110 par brasage.As indicated on the figure 1 , the opposite face 114 of the support 110, or alternatively the face 112, can accommodate cooling fins 130 in order to increase the surface of the heat dissipating device which is in contact with the ambient air, thus facilitating the heat exchange . The fins are advantageously fixed to the support 110 by brazing.

Afin de faciliter l'échange thermique de la première face 112 qui dans l'exemple montré supporte la source de chaleur, vers la deuxième face 114 qui supporte les ailettes de refroidissement, il est avantageux de prévoir un support 110 d'une épaisseur faible, soit inférieure à 2.5 mm, inférieure à 1.5 mm, ou par exemple de 1 mm. La hauteur des pions 120 du côté 112 est choisie de manière indépendante de l'épaisseur du support ou du morceau de tôle en Aluminium 110. La hauteur des pions 120 doit être suffisamment importante pour que les pions passent à travers les ouvertures prévues dans le circuit imprimé et ressortent pour permettre la fixation du circuit imprimé par sertissage des pions. La hauteur des pions 120 peut par exemple être d'au moins 2.5 mm par rapport à la face 112 du support 110. Afin de pouvoir réaliser le sertissage, lors duquel une importante contrainte mécanique est appliquée sur le pion, la base de celui-ci doit être alignée au plan du support 110.In order to facilitate the heat exchange of the first face 112 which in the example shown supports the heat source, towards the second face 114 which supports the cooling fins, it is advantageous to provide a support 110 with a small thickness, less than 2.5 mm, less than 1.5 mm, or for example 1 mm. The height of the pins 120 on the side 112 is chosen independently of the thickness of the support or the piece of aluminum sheet 110. The height of the pins 120 must be large enough for the pins to pass through the openings provided in the circuit. printed and spring out to allow the fixing of the printed circuit by crimping the pins. The height of the pins 120 may for example be at least 2.5 mm with respect to the face 112 of the support 110. In order to be able to perform the crimping, during which a large mechanical stress is applied to the pin, the base thereof must be aligned with the plane of support 110.

La figure 2 montre un mode de réalisation préférentiel du dispositif de dissipation thermique 200 selon l'invention. La face 212 qui supporte le circuit imprimé 20 est montrée. Des pions de sertissage 220 ont été fixés au support généralement plan 210. Ces pions servent à maintenir le circuit imprimé dans une position prédéterminée, en passant par des ouvertures du circuit imprimé prévues à cet effet, avant d'être sertis. Dans ce mode de réalisation, un deuxième jeu de pions de sertissage 222 est prévu pour y fixer un boîtier qui peut recouvrir le circuit imprimé de manière étanche. La figure 3 montre le même mode de réalisation que la figure 2, cependant la face opposée 214 du dispositif 200 est illustrée. Il y est apparent que les pions 220, 222 dans ce mode de réalisation traversent une ouverture dans le support 210 et comprennent une épaule qui vient s'appuyer sur a face 214 du support 210. Cet arrangement facilite l'alignement des pions par rapport au support plan 210. Des pions ayant un épaulement à une extrémité sont insérés dans les ouvertures du support 210 prévues à cet effet jusqu'à ce que l'épaulement vienne en contact avec la face 214. Dans cette position les pions sont orientés de manière perpendiculaire par rapport au support et peuvent être brasés pour réaliser l'assemblage des pièces en question.The figure 2 shows a preferred embodiment of the heat dissipation device 200 according to the invention. The face 212 which supports the printed circuit 20 is shown. Crimp pins 220 have been attached to the generally planar support 210. These pins serve to maintain the printed circuit in a predetermined position, through openings of the printed circuit provided for this purpose, before being crimped. In this embodiment, a second set of crimping pins 222 is provided to attach a housing thereon which can cover the printed circuit tightly. The figure 3 shows the same embodiment as the figure 2 however, the opposite face 214 of the device 200 is illustrated. It is apparent that the pins 220, 222 in this embodiment pass through an opening in the support 210 and comprise a shoulder that bears against the face 214 of the support 210. This arrangement facilitates the alignment of the pegs with respect to the plane support 210. Pins having a shoulder at one end are inserted into the openings of the support 210 provided for this purpose until the shoulder comes into contact with the face 214. In this position the pins are oriented perpendicularly. relative to the support and can be brazed to assemble the parts in question.

Il va de soi que la forme et les dimensions des pions et/ou du support du dispositif de dissipation thermique peuvent être adaptées selon les besoins d'une application spécifique visée sans pour autant sortir du cadre de la présente invention.It goes without saying that the shape and dimensions of the pins and / or the support of the heat dissipating device can be adapted according to the needs of a specific application aimed without departing from the scope of the present invention.

Dans tous les modes de réalisation, le sertissage des pions peut avantageusement créer un contact électrique entre la face supérieure du circuit imprimé, qui ne fait pas face au support 110, 210 du dispositif, et le dispositif de dissipation thermique lui-même, qui représente en général le potentiel électrique zéro ou la masse. Lorsqu'une piste électrique du circuit comprend les bords d'une ouverture du circuit imprimé par laquelle un des pions de sertissage passe, ce contact sert à relier la piste électrique en question au potentiel de la masse.In all embodiments, the crimping of the pins may advantageously create an electrical contact between the upper face of the printed circuit, which does not face the support 110, 210 of the device, and the heat dissipation device itself, which represents in general the zero electric potential or the mass. When an electrical track of the circuit comprises the edges of an opening of the printed circuit by which one of the crimping pins passes, this contact serves to connect the electrical track in question to the potential of the mass.

Claims (9)

Dispositif de dissipation thermique pour un dispositif lumineux d'un véhicule automobile, comprenant un support métallique comprenant au moins une portion de support de forme généralement plane et au moins un pion de sertissage destiné à fixer un circuit imprimé dudit dispositif lumineux sur ledit support,
caractérisé en ce que ledit pion est fixé de manière étanche sur une première face du support par brasage.Heat dissipation device for a light device of a motor vehicle, comprising a metal support comprising at least a support portion of generally flat shape and at least one crimping pin for fixing a printed circuit of said light device on said support,
characterized in that said pin is sealingly attached to a first face of the support by soldering. Dispositif selon la revendication 1, caractérisé en ce que le support métallique a une épaisseur qui est inférieure à la hauteur du pion mesurée par rapport à ladite première face du support.Device according to claim 1, characterized in that the metal support has a thickness which is smaller than the height of the pin measured with respect to said first face of the support. Dispositif selon une des revendications 1 ou 2, caractérisé en ce que le support a une épaisseur inférieure à 2.5 mm.Device according to one of claims 1 or 2, characterized in that the support has a thickness of less than 2.5 mm. Dispositif selon une des revendications 1 à 3, caractérisé en ce que le support métallique est en aluminium.Device according to one of Claims 1 to 3, characterized in that the metal support is made of aluminum. Dispositif selon une des revendications 1 à 4, caractérisé en ce que le support et le pion sont en matériaux identiques.Device according to one of claims 1 to 4, characterized in that the support and the pin are made of identical materials. Dispositif selon une des revendications 1 à 5, caractérisé en ce que des ailettes de refroidissement sont fixées sur une deuxième face du support par brasage.Device according to one of claims 1 to 5, characterized in that cooling fins are fixed on a second side of the support by soldering. Procédé pour la fixation d'au moins un pion de sertissage destiné à fixer un circuit imprimé d'un dispositif lumineux d'un véhicule automobile sur un support métallique, caractérisé en ce que le procédé comprend les étapes suivantes : - alignement de manière généralement parallèle de la surface de base du pion avec une face du support métallique ; - apport d'un matériau de brasage entre la base du pion et la face du support métallique ; - brasage à une température inférieure aux températures de fusion du pion et du support métallique. Method for fixing at least one crimping pin for fixing a printed circuit of a light device of a motor vehicle on a metal support, characterized in that the method comprises the following steps: - Generally parallel alignment of the base surface of the pin with one side of the metal support; - Supply of a brazing material between the base of the pin and the face of the metal support; brazing at a temperature below the melting temperatures of the pin and the metal support. Procédé d'assemblage d'un circuit imprimé d'un dispositif lumineux pour un véhicule automobile sur un dispositif de dissipation thermique selon une des revendications 1 à 5, caractérisé en ce que le procédé comprend les étapes suivantes : - alignement d'au moins une ouverture dans le support du circuit imprimé par rapport à au moins un pion de sertissage du dispositif de dissipation thermique ; - pose du circuit imprimé sur le support du dispositif de dissipation thermique, de façon à ce que le pion de sertissage perce ladite ouverture ; - sertissage du pion pour fixer le circuit imprimé sur le dispositif de dissipation thermique. A method of assembling a printed circuit of a light device for a motor vehicle on a heat dissipation device according to one of claims 1 to 5, characterized in that the method comprises the following steps: aligning at least one opening in the support of the printed circuit relative to at least one crimping pin of the heat dissipating device; placing the circuit board on the support of the heat dissipating device, so that the crimping pin pierces said opening; crimping the pin to fix the printed circuit on the heat dissipating device. Procédé selon la revendication 8, caractérisé en ce que l'étape de sertissage comprend l'étape de mise en contact électrique d'au moins une piste électrique du circuit imprimé avec le pion de sertissage, afin de relier ladite piste électrique au potentiel électrique de masse.A method according to claim 8, characterized in that the crimping step comprises the step of electrically contacting at least one electric track of the printed circuit with the crimping pin, to connect said electrical track to the electrical potential of mass.
EP17156709.2A 2016-02-23 2017-02-17 Heat dissipation device for a lighting device of a motor vehicle Active EP3211293B1 (en)

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FR1651471A FR3048062B1 (en) 2016-02-23 2016-02-23 THERMAL DISSIPATION DEVICE FOR A LUMINOUS DEVICE OF A MOTOR VEHICLE

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CN107101179A (en) 2017-08-29
FR3048062A1 (en) 2017-08-25
FR3048062B1 (en) 2018-03-09
CN107101179B (en) 2021-12-03
EP3211293B1 (en) 2023-04-05
US20170241618A1 (en) 2017-08-24

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