EP3211293A1 - Vorrichtung zur wärmeableitung für eine leuchtvorrichtung eines kraftfahrzeugs - Google Patents

Vorrichtung zur wärmeableitung für eine leuchtvorrichtung eines kraftfahrzeugs Download PDF

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Publication number
EP3211293A1
EP3211293A1 EP17156709.2A EP17156709A EP3211293A1 EP 3211293 A1 EP3211293 A1 EP 3211293A1 EP 17156709 A EP17156709 A EP 17156709A EP 3211293 A1 EP3211293 A1 EP 3211293A1
Authority
EP
European Patent Office
Prior art keywords
support
pin
printed circuit
crimping
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17156709.2A
Other languages
English (en)
French (fr)
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EP3211293B1 (de
Inventor
Olivier Badia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Vision SAS
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Valeo Vision SAS
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Filing date
Publication date
Application filed by Valeo Vision SAS filed Critical Valeo Vision SAS
Publication of EP3211293A1 publication Critical patent/EP3211293A1/de
Application granted granted Critical
Publication of EP3211293B1 publication Critical patent/EP3211293B1/de
Active legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/50—Waterproofing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/14—Bayonet-type fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to the field of lighting and light signaling of motor vehicles.
  • the invention relates to a heat dissipation device involved in a light device of a motor vehicle, and its mechanical attachment to a printed circuit.
  • LED In the field of lighting and light signaling of motor vehicles, it is becoming more and more common to use LED light-emitting diode-type light sources.
  • An LED is a semiconductor component, which, when traversed by an electric current of a predetermined intensity, emits light rays.
  • a luminous flux of a predetermined intensity generally related to the intensity of the electric current flowing through the LED, can then be measured.
  • LED technology can reduce the electrical energy needs of lighting and / or signaling devices, while at the same time enabling vehicle manufacturers to create interesting and individual optical signatures.
  • a plurality of LEDs may for example be arranged along a curvilinear contour.
  • the LEDs are on a printed circuit which is advantageously connected to LED power supply means.
  • the printed circuit is generally covered with a housing.
  • heat dissipating elements are fashioned from aluminum, which is a relatively expensive material.
  • the use of thick plates in order to obtain by stamping the pins of a height adequate to the strength of a printed circuit thus generates on the one hand a cost and on the other hand a significant weight. Since it is necessary to obtain a pin of a height greater than that of the printed circuit, it requires a large thickness of sheet metal to be able to output a pawn of adequate dimensions by stamping.
  • the invention aims to overcome at least one of the problems posed by the prior art.
  • the invention relates to a heat dissipation device for a light device of a motor vehicle.
  • the heat dissipation device comprises a metal support comprising at least a support portion of generally flat shape and at least one crimping pin for fixing a printed circuit of the light device on said support.
  • the heat dissipation device is remarkable in that said pin is sealingly attached to a first face of the support by soldering.
  • Fixing the pin is preferably performed on the support portion of generally flat shape.
  • the metal support is of generally flat shape.
  • the metal support may have a thickness which is smaller than the height of the peg measured with respect to said first face of the support.
  • the printed circuit may be of mold printed circuit type, MID ("molded interconnect device").
  • the printed circuit may be of the flexible printed circuit board (FPCB) type.
  • FPCB flexible printed circuit board
  • the pin may preferably have a length, corresponding to its height relative to the support to which it is attached, which is greater than the thickness of the printed circuit that is intended to fix the support.
  • the support may preferably have a thickness of less than 2.5 mm.
  • the metal support may preferably be made of aluminum.
  • the support and the pin may be of identical materials.
  • the support and the pin may be of different metallic materials.
  • Cooling fins may preferably be attached to a second side of the support by soldering. Alternatively, cooling fins may be attached to the first face of the support by soldering.
  • a clearance is preserved between the pin and the face of the metal support, to avoid possible degradation of the solder during a subsequent crimping of the pin.
  • the crimping step may preferably comprise a step of electrically contacting at least one electrical track of the printed circuit with the crimping pin, in order to connect said electrical track to the electrical ground potential.
  • the printed circuit may comprise at least one light source of the light device. It may for example be a semiconductor element light source such as a light emitting diode, LED.
  • the printed circuit may alternatively comprise a circuit for controlling the supply of at least one light source of the light device.
  • the numbers 100, 200 describe for example a dissipation device in two different embodiments according to the invention.
  • Brazing of metals is a permanent assembly method known per se in the state of the art, which allows to establish a metallic continuity between the joined parts.
  • the brazing mechanism is the diffusion / atomic migration on both sides of the edges to be assembled, obtained by caloric action. Unlike welding, the assembled edges are not melted during the brazing process.
  • brazing is performed using a filler metal or a solder, whose melting temperature is lower than that of the parts to be assembled. The choice of such a material is within the reach of the skilled person.
  • an alloy of aluminum and silicon may for example be used as a filler metal.
  • the melting temperature of such an alloy is between 570 ° C and 625 ° C.
  • the parts to be assembled can be made of different metals or the same metal.
  • the brazing temperature is lower than the melting temperature of the parts to be assembled, but greater than the melting temperature of the filler metal.
  • Brazing makes it possible to produce tight joints between the assembled parts, the final assembly having a metallurgical and thermal continuity.
  • the assembly of multiple parts can also be performed in parallel in an oven.
  • a local heat input can be used to make a solder assembly.
  • the parts to be assembled must preferably be clean and free of oxides on the surface, in order to guarantee the soldering effect.
  • the figure 1 shows a thermal device 100 according to the invention for a light device of a motor vehicle.
  • the light device further comprises a printed circuit 10 which supports a control circuit for the supply of light sources, for example LEDs.
  • the power control circuit usually involves a converter circuit and produces heat.
  • the figure also shows a housing 12 which covers the printed circuit, and which makes a seal with the edge of the heat dissipating device.
  • the printed circuit comprises an opening through which passes a crimping pin 120 fixed on a portion of the face 112 of the support 110 of the heat dissipating device, said surface portion being generally flat.
  • the crimp pin is fixed to the support 110 by brazing. It serves to maintain the printed circuit in a predetermined position by the location of the / pions and corresponding openings of the printed circuit.
  • the opposite face 114 of the support 110 can accommodate cooling fins 130 in order to increase the surface of the heat dissipating device which is in contact with the ambient air, thus facilitating the heat exchange .
  • the fins are advantageously fixed to the support 110 by brazing.
  • a support 110 with a small thickness, less than 2.5 mm, less than 1.5 mm, or for example 1 mm.
  • the height of the pins 120 on the side 112 is chosen independently of the thickness of the support or the piece of aluminum sheet 110.
  • the height of the pins 120 must be large enough for the pins to pass through the openings provided in the circuit. printed and spring out to allow the fixing of the printed circuit by crimping the pins.
  • the height of the pins 120 may for example be at least 2.5 mm with respect to the face 112 of the support 110.
  • the base thereof In order to be able to perform the crimping, during which a large mechanical stress is applied to the pin, the base thereof must be aligned with the plane of support 110.
  • the figure 2 shows a preferred embodiment of the heat dissipation device 200 according to the invention.
  • the face 212 which supports the printed circuit 20 is shown.
  • Crimp pins 220 have been attached to the generally planar support 210. These pins serve to maintain the printed circuit in a predetermined position, through openings of the printed circuit provided for this purpose, before being crimped.
  • a second set of crimping pins 222 is provided to attach a housing thereon which can cover the printed circuit tightly.
  • the figure 3 shows the same embodiment as the figure 2 however, the opposite face 214 of the device 200 is illustrated. It is apparent that the pins 220, 222 in this embodiment pass through an opening in the support 210 and comprise a shoulder that bears against the face 214 of the support 210.
  • This arrangement facilitates the alignment of the pegs with respect to the plane support 210.
  • Pins having a shoulder at one end are inserted into the openings of the support 210 provided for this purpose until the shoulder comes into contact with the face 214. In this position the pins are oriented perpendicularly. relative to the support and can be brazed to assemble the parts in question.
  • the crimping of the pins may advantageously create an electrical contact between the upper face of the printed circuit, which does not face the support 110, 210 of the device, and the heat dissipation device itself, which represents in general the zero electric potential or the mass.
  • an electrical track of the circuit comprises the edges of an opening of the printed circuit by which one of the crimping pins passes, this contact serves to connect the electrical track in question to the potential of the mass.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP17156709.2A 2016-02-23 2017-02-17 Vorrichtung zur wärmeableitung für eine leuchtvorrichtung eines kraftfahrzeugs Active EP3211293B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1651471A FR3048062B1 (fr) 2016-02-23 2016-02-23 Dispositif de dissipation thermique pour un dispositif lumineux d'un vehicule automobile

Publications (2)

Publication Number Publication Date
EP3211293A1 true EP3211293A1 (de) 2017-08-30
EP3211293B1 EP3211293B1 (de) 2023-04-05

Family

ID=55953251

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17156709.2A Active EP3211293B1 (de) 2016-02-23 2017-02-17 Vorrichtung zur wärmeableitung für eine leuchtvorrichtung eines kraftfahrzeugs

Country Status (4)

Country Link
US (1) US20170241618A1 (de)
EP (1) EP3211293B1 (de)
CN (1) CN107101179B (de)
FR (1) FR3048062B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021116284A1 (fr) * 2019-12-11 2021-06-17 Valeo Vision Dispositif lumineux d'un véhicule automobile

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3074881A1 (fr) * 2017-12-07 2019-06-14 Valeo Vision Module lumineux pour vehicule automobile
DE102018009292A1 (de) * 2018-11-26 2020-05-28 Harting Ag Elektrooptische Baugruppe mit Wärmeabführung sowie Verfahren zur Herstellung einer solchen Baugruppe

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128652A (ja) * 2004-09-29 2006-05-18 Furukawa Electric Co Ltd:The 発光部品搭載フラットケーブルの固定構造
DE102007002838A1 (de) * 2006-09-08 2008-03-27 Robert Bosch Gmbh LED-Modul mit Montagemittel umfassenden Kühlkörpern
US20110254446A1 (en) * 2010-04-14 2011-10-20 Denso Corporation Headlamp assembly
WO2014056834A1 (de) * 2012-10-11 2014-04-17 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Verfahren zur herstellung einer lichterzeugungseinheit
WO2014170484A1 (fr) * 2013-04-19 2014-10-23 Valeo Vision Organe de refroidissement et dispositif d'éclairage ou de signalisation de véhicule automobile comprenant un tel organe
US20150016136A1 (en) * 2012-05-29 2015-01-15 Ichikoh Industries, Ltd. Vehicular lighting instrument semiconductor light source light source unit and vehicular lighting instrument
FR3022867A1 (fr) * 2014-06-30 2016-01-01 Valeo Vision Dispositif lumineux pour vehicule automobile a moyens d'assemblage perfectionnes

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US5676305A (en) * 1996-04-18 1997-10-14 Motorola, Inc. Method to achieve regulated force contact in pin transfer deposition of liquidus substances
US6749105B2 (en) * 2002-03-21 2004-06-15 Motorola, Inc. Method and apparatus for securing a metallic substrate to a metallic housing
CN201215138Y (zh) * 2008-04-28 2009-04-01 江苏希西维轴承有限公司 无油自润滑轴承
CN101530947B (zh) * 2009-04-08 2012-07-04 西安交通大学 一种搅拌摩擦钎焊制备双金属复合板的方法
CN101907909A (zh) * 2009-06-05 2010-12-08 鸿富锦精密工业（深圳）有限公司 具有固定孔的主板
KR101823677B1 (ko) * 2011-04-21 2018-01-30 엘지이노텍 주식회사 엘이디 조명장치
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US9153886B2 (en) * 2012-10-26 2015-10-06 Continental Automotive Systems, Inc. Pin header assembly and method of forming the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128652A (ja) * 2004-09-29 2006-05-18 Furukawa Electric Co Ltd:The 発光部品搭載フラットケーブルの固定構造
DE102007002838A1 (de) * 2006-09-08 2008-03-27 Robert Bosch Gmbh LED-Modul mit Montagemittel umfassenden Kühlkörpern
US20110254446A1 (en) * 2010-04-14 2011-10-20 Denso Corporation Headlamp assembly
US20150016136A1 (en) * 2012-05-29 2015-01-15 Ichikoh Industries, Ltd. Vehicular lighting instrument semiconductor light source light source unit and vehicular lighting instrument
WO2014056834A1 (de) * 2012-10-11 2014-04-17 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Verfahren zur herstellung einer lichterzeugungseinheit
WO2014170484A1 (fr) * 2013-04-19 2014-10-23 Valeo Vision Organe de refroidissement et dispositif d'éclairage ou de signalisation de véhicule automobile comprenant un tel organe
FR3022867A1 (fr) * 2014-06-30 2016-01-01 Valeo Vision Dispositif lumineux pour vehicule automobile a moyens d'assemblage perfectionnes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021116284A1 (fr) * 2019-12-11 2021-06-17 Valeo Vision Dispositif lumineux d'un véhicule automobile
FR3104678A1 (fr) * 2019-12-11 2021-06-18 Valeo Vision Dispositif lumineux d’un véhicule automobile
US11781740B2 (en) 2019-12-11 2023-10-10 Valeo Vision Lighting device for a motor vehicle

Also Published As

Publication number Publication date
CN107101179A (zh) 2017-08-29
CN107101179B (zh) 2021-12-03
EP3211293B1 (de) 2023-04-05
FR3048062B1 (fr) 2018-03-09
FR3048062A1 (fr) 2017-08-25
US20170241618A1 (en) 2017-08-24

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