DE102010036910A1 - Elektrische Vorrichtung - Google Patents

Elektrische Vorrichtung Download PDF

Info

Publication number
DE102010036910A1
DE102010036910A1 DE102010036910A DE102010036910A DE102010036910A1 DE 102010036910 A1 DE102010036910 A1 DE 102010036910A1 DE 102010036910 A DE102010036910 A DE 102010036910A DE 102010036910 A DE102010036910 A DE 102010036910A DE 102010036910 A1 DE102010036910 A1 DE 102010036910A1
Authority
DE
Germany
Prior art keywords
protective body
components
intermediate layer
assembly
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102010036910A
Other languages
German (de)
English (en)
Inventor
Dr. Bertolotti Fabio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SSB Wind Systems GmbH and Co KG
Original Assignee
SSB Wind Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SSB Wind Systems GmbH and Co KG filed Critical SSB Wind Systems GmbH and Co KG
Priority to DE102010036910A priority Critical patent/DE102010036910A1/de
Priority to DE202010018233.6U priority patent/DE202010018233U1/de
Priority to PCT/EP2011/060780 priority patent/WO2012019822A2/fr
Priority to CN2011102246676A priority patent/CN102378525A/zh
Priority to CN2011202824794U priority patent/CN202310380U/zh
Publication of DE102010036910A1 publication Critical patent/DE102010036910A1/de
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62K—CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDE-CARS, FORECARS, OR THE LIKE
    • B62K19/00—Cycle frames
    • B62K19/30—Frame parts shaped to receive other cycle parts or accessories
    • B62K19/34—Bottom brackets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
    • B62M6/00—Rider propulsion of wheeled vehicles with additional source of power, e.g. combustion engine or electric motor
    • B62M6/40—Rider propelled cycles with auxiliary electric motor
    • B62M6/45—Control or actuating devices therefor
    • B62M6/50—Control or actuating devices therefor characterised by detectors or sensors, or arrangement thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Manufacturing & Machinery (AREA)
  • Transportation (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE102010036910A 2010-08-08 2010-08-08 Elektrische Vorrichtung Ceased DE102010036910A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE102010036910A DE102010036910A1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung
DE202010018233.6U DE202010018233U1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung
PCT/EP2011/060780 WO2012019822A2 (fr) 2010-08-08 2011-06-28 Dispositif électrique
CN2011102246676A CN102378525A (zh) 2010-08-08 2011-08-05 电气装置
CN2011202824794U CN202310380U (zh) 2010-08-08 2011-08-05 电气装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102010036910A DE102010036910A1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung

Publications (1)

Publication Number Publication Date
DE102010036910A1 true DE102010036910A1 (de) 2012-02-09

Family

ID=44629985

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102010036910A Ceased DE102010036910A1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung
DE202010018233.6U Expired - Lifetime DE202010018233U1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE202010018233.6U Expired - Lifetime DE202010018233U1 (de) 2010-08-08 2010-08-08 Elektrische Vorrichtung

Country Status (3)

Country Link
CN (2) CN202310380U (fr)
DE (2) DE102010036910A1 (fr)
WO (1) WO2012019822A2 (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2819826A4 (fr) * 2012-02-28 2015-11-25 Dialight Corp Procédé et appareil d'enrobage de silhouette
DE102015118498A1 (de) * 2015-10-29 2017-05-04 Endress+Hauser Conducta Gmbh+Co. Kg Verfahren zum Vergießen einer Leiterplatte mit Bauteilen
DE102016100479A1 (de) * 2016-01-13 2017-07-13 Asm Automation Sensorik Messtechnik Gmbh Elektrisches Bauteil, insbesondere Sensor, sowie Herstellverfahren hierfür
EP2884817B1 (fr) * 2013-12-13 2017-08-30 Eberspächer catem GmbH & Co. KG Dispositif de chauffage électrique et son procédé de fabrication
DE102014014012B4 (de) * 2014-09-26 2017-09-28 Paul Voinea Vorrichtungen und Verfahren zur teilweisen Beschichtung der Oberfläche eines Werkstückes durch Vergießen
DE102018218783A1 (de) * 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
US11013119B2 (en) 2019-05-03 2021-05-18 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with deformed layer for accommodating component
WO2021175664A1 (fr) * 2020-03-04 2021-09-10 Atlas Elektronik Gmbh Dispositif amortisseur pour élément électronique
DE102020115066B3 (de) 2020-06-05 2021-10-14 Pollmann International Gmbh Vibrationsrobuste Elektronikkomponente
CN114718719A (zh) * 2022-06-07 2022-07-08 宁德市卓力电机有限公司 一种具备防水底座结构的柴油发电机组

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010036910A1 (de) * 2010-08-08 2012-02-09 Ssb Wind Systems Gmbh & Co. Kg Elektrische Vorrichtung
CN102647863A (zh) * 2012-04-10 2012-08-22 苏州达方电子有限公司 电子装置
DE102012110683A1 (de) * 2012-11-08 2014-05-08 Conti Temic Microelectronic Gmbh LC-Modul zum Einbau in einem Kraftfahrzeugsteuergerät
DE102014216518A1 (de) * 2014-08-20 2016-02-25 Robert Bosch Gmbh Elektronische Steuereinheit sowie Moldwerkzeug und Verfahren zum Herstellen einer elektronischen Steuereinheit
JP6817843B2 (ja) * 2017-02-17 2021-01-20 日信工業株式会社 電気部品組立体及び車両用ブレーキ制御装置
DE102017209179A1 (de) * 2017-05-31 2018-12-06 Conti Temic Microelectronic Gmbh Elektronikanordnung
DE102017209175A1 (de) * 2017-05-31 2018-12-06 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer Elektronikanordnung und Elektronikanordnung
DE102018206977A1 (de) * 2018-05-04 2019-11-07 Robert Bosch Gmbh Steuergehäuse für ein Steuergerät

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224122A1 (de) 1992-07-22 1994-01-27 Turck Werner Kg In einem Gehäuse eingegossene elektronische Schaltunng
DE19715573A1 (de) * 1997-04-15 1998-10-22 Telefunken Microelectron Gehäuse
US6035524A (en) 1995-02-21 2000-03-14 Thomson-Csf Method for fabricating an electronics board with thermal-conduction cooling
US6583355B2 (en) 1999-11-30 2003-06-24 Bombardier Motor Corporation Of America Bladder insert for encapsulant displacement

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
EP0650315A3 (fr) * 1993-10-23 1995-06-21 Leonische Drahtwerke Ag Appareil de commande électrique à installer dans une automobile en particulier.
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
DE102004057493A1 (de) * 2004-11-29 2006-06-01 Siemens Ag Umhüllung von auf einem Substrat angeordneten Bauelementen
DE502006006395D1 (de) * 2006-07-11 2010-04-22 Balluff Gmbh Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts
US7742309B2 (en) * 2006-12-29 2010-06-22 Nokia Corporation Electronic device and method of assembling an electronic device
DE102010036910A1 (de) * 2010-08-08 2012-02-09 Ssb Wind Systems Gmbh & Co. Kg Elektrische Vorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4224122A1 (de) 1992-07-22 1994-01-27 Turck Werner Kg In einem Gehäuse eingegossene elektronische Schaltunng
US6035524A (en) 1995-02-21 2000-03-14 Thomson-Csf Method for fabricating an electronics board with thermal-conduction cooling
DE19715573A1 (de) * 1997-04-15 1998-10-22 Telefunken Microelectron Gehäuse
US6583355B2 (en) 1999-11-30 2003-06-24 Bombardier Motor Corporation Of America Bladder insert for encapsulant displacement

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2819826A4 (fr) * 2012-02-28 2015-11-25 Dialight Corp Procédé et appareil d'enrobage de silhouette
EP2884817B1 (fr) * 2013-12-13 2017-08-30 Eberspächer catem GmbH & Co. KG Dispositif de chauffage électrique et son procédé de fabrication
DE102014014012B4 (de) * 2014-09-26 2017-09-28 Paul Voinea Vorrichtungen und Verfahren zur teilweisen Beschichtung der Oberfläche eines Werkstückes durch Vergießen
DE102015118498A1 (de) * 2015-10-29 2017-05-04 Endress+Hauser Conducta Gmbh+Co. Kg Verfahren zum Vergießen einer Leiterplatte mit Bauteilen
DE102016100479B4 (de) * 2016-01-13 2019-02-14 Asm Automation Sensorik Messtechnik Gmbh Sensor, sowie Herstellverfahren hierfür
CN107027260A (zh) * 2016-01-13 2017-08-08 Asm自动化传感器测量技术有限公司 电气构件及其制造方法
DE102016100479A1 (de) * 2016-01-13 2017-07-13 Asm Automation Sensorik Messtechnik Gmbh Elektrisches Bauteil, insbesondere Sensor, sowie Herstellverfahren hierfür
CN107027260B (zh) * 2016-01-13 2020-03-03 Asm自动化传感器测量技术有限公司 电气构件及其制造方法
US10663328B2 (en) 2016-01-13 2020-05-26 Asm Automation Sensorik Messtechnik Gmbh Electrical component, in particular sensor, as well as manufacturing methods therefor
DE102018218783A1 (de) * 2018-11-05 2020-05-07 Zf Friedrichshafen Ag Elektronische Einheit mit elektronischen Bauelementen und einer Anordnung zum Schutz derselben vor Druckbeaufschlagung
US11013119B2 (en) 2019-05-03 2021-05-18 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with deformed layer for accommodating component
WO2021175664A1 (fr) * 2020-03-04 2021-09-10 Atlas Elektronik Gmbh Dispositif amortisseur pour élément électronique
DE102020115066B3 (de) 2020-06-05 2021-10-14 Pollmann International Gmbh Vibrationsrobuste Elektronikkomponente
CN114718719A (zh) * 2022-06-07 2022-07-08 宁德市卓力电机有限公司 一种具备防水底座结构的柴油发电机组

Also Published As

Publication number Publication date
WO2012019822A3 (fr) 2012-04-05
CN202310380U (zh) 2012-07-04
CN102378525A (zh) 2012-03-14
WO2012019822A2 (fr) 2012-02-16
DE202010018233U1 (de) 2015-01-21

Similar Documents

Publication Publication Date Title
DE102010036910A1 (de) Elektrische Vorrichtung
EP3257339B1 (fr) Composant mécatronique et son procédé de fabrication
EP3381246B1 (fr) Module électronique et procédé de fabrication d'un module électronique avec un boîtier étanche aux fluides
DE102008043774A1 (de) AVT-Technik mit Transfermolding
DE102018207532A1 (de) Halbleitereinrichtung
EP3467854A1 (fr) Module électrique dans le boîtier de différents matériaux
EP0398108A1 (fr) Boîtier en plastique et module semi-conducteur de puissance comprenant ce boîtier
DE102011085172A1 (de) Getriebesteuermodul mit Lötbrücken oder Kaltkontakten zwischen eingesetztem Schaltungsträger und umgebendem Schaltungsträger
EP3468320A2 (fr) Module électrique dans le boîtier de différents matériaux
DE102013215227A1 (de) Verkapseltes Elektronikmodul mit Flexfolienanbindung, insbesondere für ein Kfz-Getriebesteuermodul
WO2008046401A1 (fr) Appareil de commande pour véhicule automobile
DE102015221062B4 (de) Halbleiterschaltungsanordnung mit gepresstem gel und montageverfahren
DE102017218131B4 (de) Elektrische Komponente und Verfahren zu deren Herstellung
EP3479663B1 (fr) Unité appareil de commande, en particulier pour un véhicule automobile
WO2016177629A1 (fr) Composant électronique et son procédé de fabrication
DE102012222180A1 (de) Superflaches Getriebesteuermodul
EP1565937B1 (fr) Module semi-conducteur de puissance
DE102012209034A1 (de) Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul
EP3479664B1 (fr) Procédé de fabrication d'une unité appareil de commande, en particulier pour un véhicule, et unité appareil de commande, en particulier pour un véhicule
WO2017055042A1 (fr) Composant électronique, en particulier pour un module de commande de transmission
EP3351061A1 (fr) Bloc électronique, en particulier pour module de commande de transmission et procédé de fabrication d'un tel bloc électronique
DE10300175B4 (de) Elektronische Baugruppe mit Wärme ableitendem Gehäuseteil
DE102012209033A1 (de) Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul
DE102016213694A1 (de) Leiterplattenanordnung
DE102008034068A1 (de) Leistungshalbleitermodul

Legal Events

Date Code Title Description
R016 Response to examination communication
R082 Change of representative
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R003 Refusal decision now final

Effective date: 20141209