WO2017055042A1 - Composant électronique, en particulier pour un module de commande de transmission - Google Patents

Composant électronique, en particulier pour un module de commande de transmission Download PDF

Info

Publication number
WO2017055042A1
WO2017055042A1 PCT/EP2016/071113 EP2016071113W WO2017055042A1 WO 2017055042 A1 WO2017055042 A1 WO 2017055042A1 EP 2016071113 W EP2016071113 W EP 2016071113W WO 2017055042 A1 WO2017055042 A1 WO 2017055042A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
heat
printed circuit
flowable
heat sink
Prior art date
Application number
PCT/EP2016/071113
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017055042A1 publication Critical patent/WO2017055042A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1433—Application-specific integrated circuit [ASIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate

Definitions

  • the invention relates to an electronic assembly, in particular for a
  • control modules installed on the transmission are used for transmission control.
  • the control modules may include actuators, sensors, connectors, at least one encapsulated control unit (TCU) and other components.
  • TCU encapsulated control unit
  • the encapsulated control unit forms an electronic module.
  • DE 10 2014 201 032 A1 shows an electronic subassembly comprising a printed circuit board, heat generating components arranged on the printed circuit board and a heat sink.
  • the heat-generating components have different height and the heat sink is so to the different heights of the
  • an electronic assembly in particular for a
  • Transmission control module proposed. This comprises a printed circuit board having a first side and a second side facing away from the first side and a first heat-generating component arranged on the second side of the printed circuit board and at least one arranged on the second side of the circuit board further
  • the electronic assembly further includes a heat sink that is one of the second side of the circuit board
  • the inside of the heat sink is at least partially spaced from the circuit board by a gap and the first heat-generating component and the at least one further heat-generating component are arranged in the space and wherein the gap at least partially with at least one flowable and curable protective composition so is filled, that the flowable and curable protective material is in direct contact with the circuit board and the heat sink, wherein the heat sink is at least partially provided with a matched to the different heights step-like structure, so that facing on the inside of the heat sink one of the second side of the circuit board first contact surface is formed, at which the first
  • the heat sink is designed as a sheet-like structure extending in two extension directions, which has a thickness perpendicular to the two extension directions, and the heat sink has the same constant thickness at the first contact surface perpendicular to the first contact surface and at the other contact surface perpendicular to the further contact surface on.
  • the heat sink lies directly or with the interposition of a heat-conducting layer on the heat-generating component and between the heat sink and the
  • heat generating component is arranged no molding compound. That's how it stands
  • the heat sink is the heat-generating components of different height adjusted so that all heat-generating components can be in direct contact with the heat sink.
  • the electronic assembly with the features of the independent claim has the advantage that the heat sink is formed as extending in two directions extending sheet-like structure having perpendicular to the two directions of extension a thickness perpendicular to the contact surfaces is equal to the contact surface.
  • the heat sink can advantageously be easily adapted to components of different heights and the heat can advantageously be effectively and constantly derived from the heat-generating components to the heat sink.
  • the heat sink can be advantageously designed, for example, as a bent metal sheet or as a bent film. Such a
  • trained heat sink can be made very easy and particularly easy and well adapted to the different heights of the heat-generating components.
  • the thickness of the heat sink at the contact surfaces perpendicular to the contact surfaces can be at most two millimeters, in particular at most six hundred microns.
  • the heat sink may for example also be flexible and, for example, also advantageously compensate for tolerances or deformations.
  • the heat sink can therefore also advantageously be designed to be flexible and, for example, compensate for tolerances or deformations in the electronic assembly in a particularly advantageous manner.
  • Is the electronic assembly for example, mechanical loads or
  • the flowable and curable composition may advantageously surround the at least one heat-generating component cohesively on the second side of the printed circuit board and on the inside of the printed circuit board Cling to the heat sink.
  • the at least one heat-generating component can advantageously be protected against mechanical loads or the attack of fluid media such as gear oil. If the overall stability of the electronic assembly is to be increased, it can prove to be an advantage to form the heat-conducting layer as an adhesive application, which adheres to the heat-generating component and / or to a contact surface in a material-locking manner.
  • the heat-generating component advantageously stable and fixed to the contact surface of the heat sink.
  • a heat sink made of these materials derives the heat generated by the at least one heat-generating component particularly advantageous effectively.
  • At least one electrical or electronic component is arranged on the first side of the printed circuit board, which is at least partially of a
  • Sealing region of the flowable and curable protective composition is covered, wherein the sealing region of the flowable and curable protective composition is at least partially disposed on the first side of the circuit board and the flowable and curable
  • the sealing region adheres to both the first side of the circuit board and to the electrical or electronic component.
  • the electronic assembly can be made advantageous compact by the arrangement of electrical or electronic components on the first side of the circuit board.
  • the electrical and electronic components can advantageously by the flowable and curable
  • a filling region of the flowable and curable protective composition which in the
  • Interspace is arranged, can be particularly advantageous with the arranged on the first side of the circuit board sealing region of the flowable and curable
  • Protective composition be formed in one piece.
  • the sealing region of the flowable and curable protective composition arranged on the first side of the printed circuit board can be connected to the filling region of the flowable and curable material Protective ground, which is arranged in the intermediate space, particularly advantageously over at least one formed in the circuit board and the first side of the circuit board with the second side of the circuit board interconnecting breakthrough in one piece.
  • the filling area and the sealing area of the flowable and hardenable mass can be connected to one another in a particularly advantageous manner.
  • the filling area and the sealing area can be particularly advantageously applied in one production step, and areas in the intermediate space which are difficult to access can also be advantageously filled by the opening with the flowable and hardenable protective compound.
  • the heat sink can advantageously be easily attached to the circuit board.
  • the electronic assembly can advantageously be simply placed on flat surfaces and thus advantageous be installed stable and space-saving.
  • FIG. 1 shows a schematic cross section through an embodiment of the invention
  • FIG. 1 shows a schematic cross section through an embodiment of the electronic assembly according to the invention, which, for example, part of a
  • Transmission control module may be, for example, on one or in one
  • Motor vehicle transmission can be installed.
  • the electronic subassembly comprises a printed circuit board 2 with a first side 3 and a second side 4 facing away from the first side 3.
  • the printed circuit board 2 is, for example, a printed circuit board in FR4 design or higher, ie for example a printed circuit board made of glass fiber reinforced
  • the printed circuit board 2 can also be an HDI PCB (High Density
  • FPC Flexible Printed Circuit Board
  • heat generating components 5 may be based on the second page 4 of
  • PCB 2 have different heights. Components with different heights are shown in the embodiment shown in FIG. 1 by way of example for a first component 5 with height H1 and another heat-generating component 5 with height H2. In principle, however, any number of heat-generating components 5 can be arranged at least partially with different heights on the second side 4 of the printed circuit board 2. On the second side 4 of the printed circuit board 2, a single heat-generating component 5 or more electrically connected via printed conductors of the printed circuit board 2 and forming a control circuit
  • heat generating components 5 may be arranged. At the heat-producing
  • Components 5 may be electrical and / or electronic components, in particular active components such as IC chips, transistors or ASICs.
  • active components such as IC chips, transistors or ASICs.
  • Printed circuit board 2 are in this embodiment on the first side 3 of the circuit board. 2 arranged electrical or electronic components 13. In this embodiment, by way of example, four electrical or electronic components 13 are shown. Also on the second side 4 of the printed circuit board 2, in addition to the heat-generating components 5 further electrical or electronic components 13 may be arranged. The electrical or electronic components 13 may be connected via interconnects on the circuit board 2 with each other and / or with the heat-generating components 5 and
  • the electrical or electronic components 13 may, for example, not be heat-generating and be, for example, passive components.
  • the electronic module 1 further comprises a heat sink 6, which has an inner side 7 facing the second side 4 of the printed circuit board 2.
  • the inner side 7 of the heat sink 6 is spaced in this embodiment of the circuit board 2 by a gap 8 and the three heat-generating components 5 are arranged in the intermediate space 8 in this embodiment.
  • At these contact surfaces 12 are the heat-generating components 5, for example, directly.
  • the heat-generating components 5 can also rest, for example, with the interposition of varnishleit Mrsen 1 1 to the contact surfaces 12 of the heat sink 6.
  • the leit Mrsen 1 1 may be formed, for example, as an adhesive application. This adhesive application, for example, to the heat-generating
  • the heat conducting layers 1 1 can, for example, at least partially as
  • Heat conducting layers 1 1 can be arranged between the heat-generating components 5 and the contact surfaces 12 of the heat sink 5 in order to improve the heat dissipation from the heat-generating components 5 to the heat sink 5. Is a good heat dissipation, for example, by a arranged in the gap 8 flowable and curable protective material 9, which is characterized for example by a high thermal conductivity, ensured so can be dispensed with heat conducting 1 1, for example, and the heat-generating components 5, for example, directly to the
  • the heat sink 6 is in this embodiment as a in two
  • Extension directions x and y extending planar-like structure formed, the perpendicular to the two directions of extension x and y has a thickness D.
  • the directions of extension x and y are shown in FIG. 1 on the basis of a three-dimensional view
  • Cartesian coordinate system together with a third direction z illustrates.
  • the extension direction x and the direction z lie in the plane of the drawing, the direction y is perpendicular to the plane of the drawing.
  • the heat sink 6 has in this
  • the heat sink is in this case
  • Heatsink 6, for example, as shown in this embodiment, is made without cutting as a forming part, so be formed for example as a bent sheet metal.
  • the heat sink may, for example, also be formed as a curved foil.
  • the metal sheet or foil is then bent, for example, in such a way that contact surfaces 12 for the heat-generating components 5 of different overall height, for example H1 and H2, are formed on the heat sink 6.
  • the thickness D of the contact surfaces 12 perpendicular to the contact surfaces 12 are thus the same and in this embodiment
  • each contact surface 12 also constant.
  • the thickness D may for example be advantageously at most two millimeters, in particular at most six hundred micrometers.
  • the heat sink 6 is formed, for example, as a bent sheet metal or as a bent film, the thickness of the sheet or film before bending the thickness D of the contact surfaces 12 correspond, so for example advantageously also be at most two millimeters, in particular at most six hundred microns.
  • the heat sink 6 may be made of metal, for example, for example, aluminum, copper or steel, for example. Of the
  • Heatsink 6 but may for example be made of thermally conductive plastic, in particular, for example, plastic with heat-conductive fillers. If the heat sink 6, for example, electrically conductive, for example, advantageously an electrically insulating heat conducting layer 1 1 can be used. On the other hand, if the heat sink 6 is electrically insulating, the heat conducting layer 1 1 can also be electrically conductive, for example. The heat sink 6, for example, due to the
  • consistently small thickness also be flexible and bendable.
  • tolerances will be compensated.
  • the heat sink 6 can, for example, continue to adapt more precisely to the different heights of the heat-generating components 5, so that For example, all contact surfaces 12 can rest securely against the heat-generating components 5 in a planar manner.
  • the gap 8 is in the embodiment with a flowable and
  • the flowable and curable protective compound 9 surrounds in this embodiment in the intermediate space 8, the at least one heat-generating component 5 circumferentially.
  • the flowable and hardenable mass 9 in the cured state for example, also adheres, at least one
  • Embodiment example be protected against mechanical stress or the attack of fluid media such as gear oil advantageous.
  • Under a flowable and hardenable protective mass 9 is in the context of
  • the present application understood a flowable and liquid substance that solidifies by a curing process.
  • the flowable and curable protective compound 9 may be, for example, a polymeric protection system and be applied, for example by encapsulation or potting. In particular, it may be a thermoset.
  • the flowable and curable protective compound 9 is in this embodiment in direct contact with the printed circuit board 2 and the heat sink 6.
  • the flowable and curable protective composition 9 may be integrally or multi-piece and arranged at different locations in the electronic module 1. In the present
  • Registration includes the flowable and curable protective compound 9 while a
  • Sealing region 20 of the flowable and curable protective compound 9 is thereby arranged on the first side 3 of the printed circuit board 2 flowable and curable
  • Protective mass 9 understood. Under the filling region 21 of the flowable and curable protective compound 9 is arranged in the gap 8 part of the flowable and curable protective compound 9 understood and under cover 22 of the flowable and curable protective composition 9 is in the context of the present application at the from the inside 7 of the heat sink 6 remote from the outer side 14 of the heat sink 6 arranged part of the flowable and curable protective mass 9 understood.
  • the sealing region 20, the filling region 21 and the covering region 22 may be formed in one piece or in several pieces. In the embodiment shown in FIG. 1, for example, four are arranged on the first side 3 of the circuit board 2 electrical or electronic components 13 of which is also arranged on the first side 3 of the circuit board 2
  • the flowable and curable protective compound 9 adheres in this embodiment in the sealing region 20 both on the first side 3 of the printed circuit board 2 and on the electrical or electronic component 13.
  • Sealing 20 of the flowable and curable protective material 9 sealingly covered and thus protected, for example, against mechanical stress or the attack of fluid media such as gear oil.
  • the filling region 21 of the flowable and hardenable protective compound 9, which is arranged in the intermediate space 8, is integrally formed with the sealing region 20 of the flowable and hardenable protective compound 9 arranged on the first side 3 of the printed circuit board 2.
  • the filling region 21 of the flowable and hardenable protective compound 9 is in this embodiment, for example via an opening formed in the printed circuit board 2 15 which connects the first side 3 of the circuit board 2 with the second side 4 of the circuit board 2, with the sealing region 20 of the flowable and curable protective compound 9 connected and thus formed integrally therewith.
  • One or more apertures 15 may be formed in the printed circuit board 2.
  • the openings 15 may for example also be open vias of the printed circuit boards.
  • the sealing region 20 and the filling region 21 of the flowable and hardenable protective compound 9 can, for example, however, also be connected to one another via flowable and curable protective compound 9 arranged at the edges of the printed circuit board 2.
  • the cover region 22 of the flowable and hardenable protective compound 9 is arranged on an outer side 14 of the heat sink 6 facing away from the inner side 7 of the heat sink 6.
  • the covering region 22 can also be formed in one piece, for example, with the filling region 21 of the flowable and hardenable protective compound 9 arranged in the intermediate space 8.
  • a surface 17 facing away from the printed circuit board 2 and parallel to the printed circuit board 2 is formed on the cover region 22 of the flowable and curable protective compound 9 and on the sealing region 20 of the flowable and curable protective compound 9 in the hardened state.
  • the electronic module 1 for example, be placed flat on other, arranged outside the electronic assembly 1 surfaces.
  • the surfaces 17 form an outer boundary of the electronic module 1 in the exemplary embodiment.
  • the formed on the cover 22 surface 17 terminates in this embodiment, as shown in Fig. 1, flush with a heat sink 6 formed on the surface 25 from.
  • the surface 17 formed on the covering region 22 can also be formed further away from the printed circuit board 2, for example, so that, for example, the cooling body 6 is completely surrounded by the flowable and curable protective composition 9 and enclosed therein.

Abstract

L'invention concerne un composant électronique (1), en particulier un module de commande de transmission, comportant une carte de circuit imprimé (2) sur laquelle sont disposés un premier composant dégageant de la chaleur (5) et un autre composant dégageant de la chaleur (5), qui présentent différentes hauteurs de montage (H1, H2) par rapport à la carte de circuit imprimé (2), et comportant un corps de refroidissement (6) dont la face interne (7) est séparée, au moins par secteurs, de la carte de circuit imprimé (2), par un espace intermédiaire (8) dans lequel sont disposés le premier composant dégageant de la chaleur (5) et le second composant dégageant de la chaleur (5), l'espace intermédiaire (8) étant rempli par au moins une masse de protection coulante et durcissable (9) tandis que le corps de refroidissement (6) présente au moins par zones une structure en forme de paliers adaptée aux différentes hauteurs de montage (H1, H2) de sorte qu'une première surface d'appui (12) pour le premier composant (5) et une autre surface d'appui (12) pour le second composant (5) sont formées contre la face interne (7) du corps de refroidissement (6). Selon l'invention, le corps de refroidissement (6) est conçu en tant que produit plan, s'étendant dans deux directions d'extension (x, y), qui présente une épaisseur (D) perpendiculairement aux deux directions d'extension (x, y) et le corps de refroidissement (6) présente la même épaisseur constante (D) contre la première surface d'appui (12) perpendiculairement à la première surface d'appui (12) et contre l'autre surface d'appui (12) perpendiculairement à l'autre surface d'appui (12).
PCT/EP2016/071113 2015-09-30 2016-09-07 Composant électronique, en particulier pour un module de commande de transmission WO2017055042A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015218973.2A DE102015218973A1 (de) 2015-09-30 2015-09-30 Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
DE102015218973.2 2015-09-30

Publications (1)

Publication Number Publication Date
WO2017055042A1 true WO2017055042A1 (fr) 2017-04-06

Family

ID=56883801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/071113 WO2017055042A1 (fr) 2015-09-30 2016-09-07 Composant électronique, en particulier pour un module de commande de transmission

Country Status (2)

Country Link
DE (1) DE102015218973A1 (fr)
WO (1) WO2017055042A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110505785A (zh) * 2018-05-17 2019-11-26 光宝电子(广州)有限公司 适用不同尺寸功率元件的功率转换器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019218209B4 (de) * 2019-11-25 2022-05-19 Lenze Swiss Ag Stromrichter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999007197A1 (fr) * 1997-07-30 1999-02-11 Energy Savings, Inc. Diffuseur de chaleur pour ballast electronique
US20040099944A1 (en) * 2002-11-21 2004-05-27 Nec Electronics Corporation Semiconductor device
DE102006045415A1 (de) * 2006-09-26 2008-04-03 Infineon Technologies Ag Bauelementanordnung mit einem Träger
JP2010245373A (ja) * 2009-04-08 2010-10-28 Panasonic Corp 半導体装置及びその製造方法
DE102010001958A1 (de) * 2010-02-16 2011-08-18 Robert Bosch GmbH, 70469 Elektronisches Steuergerät
DE102014201032A1 (de) 2014-01-21 2015-07-23 Zf Friedrichshafen Ag Elektrisches Steuergerät, Getriebe mit einem elektrischen Steuergerät und Verfahren zur Herstellung eines elektrischen Steuergeräts

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999007197A1 (fr) * 1997-07-30 1999-02-11 Energy Savings, Inc. Diffuseur de chaleur pour ballast electronique
US20040099944A1 (en) * 2002-11-21 2004-05-27 Nec Electronics Corporation Semiconductor device
DE102006045415A1 (de) * 2006-09-26 2008-04-03 Infineon Technologies Ag Bauelementanordnung mit einem Träger
JP2010245373A (ja) * 2009-04-08 2010-10-28 Panasonic Corp 半導体装置及びその製造方法
DE102010001958A1 (de) * 2010-02-16 2011-08-18 Robert Bosch GmbH, 70469 Elektronisches Steuergerät
DE102014201032A1 (de) 2014-01-21 2015-07-23 Zf Friedrichshafen Ag Elektrisches Steuergerät, Getriebe mit einem elektrischen Steuergerät und Verfahren zur Herstellung eines elektrischen Steuergeräts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110505785A (zh) * 2018-05-17 2019-11-26 光宝电子(广州)有限公司 适用不同尺寸功率元件的功率转换器
CN110505785B (zh) * 2018-05-17 2021-01-12 光宝电子(广州)有限公司 适用不同尺寸功率元件的功率转换器

Also Published As

Publication number Publication date
DE102015218973A1 (de) 2017-03-30

Similar Documents

Publication Publication Date Title
EP3257339B1 (fr) Composant mécatronique et son procédé de fabrication
DE19855389C2 (de) Elektronische Vorrichtung
DE102015207893B3 (de) Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul
WO2012019822A2 (fr) Dispositif électrique
EP3289839B1 (fr) Module électronique, en particulier pour un module de commande de transmission
DE102007038331B4 (de) Elektronisches Bauteil und Verfahren zur Herstellung eines elektronischen Bauteils
DE102010062761B4 (de) Elektronisches Schaltungsmodul
WO2016169711A1 (fr) Module électronique et procédé pour encapsuler ledit module
WO2017055042A1 (fr) Composant électronique, en particulier pour un module de commande de transmission
EP3479663B1 (fr) Unité appareil de commande, en particulier pour un véhicule automobile
DE102014224033A1 (de) Elektronikmodul, insbesondere für Kfz-Getriebesteuergerät, mit Presskontakt-Sandwich-Modul-Technik
DE102008039921B4 (de) Verfahren zur Herstellung eines elektronischen Geräts mit diskretem Bauelement
DE102010005303B4 (de) Integriertes Steuergerät mit Kunststoffgehäuse
EP3053192B1 (fr) Dispositif avec un circuit et procédé de fabrication du dispositif
EP2691981A1 (fr) Module électronique ainsi que son procédé de fabrication
EP3479664B1 (fr) Procédé de fabrication d'une unité appareil de commande, en particulier pour un véhicule, et unité appareil de commande, en particulier pour un véhicule
DE102007039618B4 (de) Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau
EP2671431B1 (fr) Ensemble carte de circuit imprimé
DE102010005305B4 (de) Integriertes Steuergerät mit vereinfachter Wärmeabführung
WO2018141641A1 (fr) Appareil de commande et procédé de fabrication dudit appareil
WO2018019499A1 (fr) Ensemble carte de circuit imprimé
DE102016217554A1 (de) Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul, und Verfahren zum Herstellen einer elektronischen Baugruppe
DE102012209033A1 (de) Elektronikmodul sowie Verfahren zur Herstellung eines solchen Elektronikmoduls, sowie elektronisches Steuergerät mit einem solchen Elektronikmodul
DE102017205216A1 (de) Elektronikmodul für eine Getriebesteuereinheit und Getriebesteuereinheit
DE102017201800A1 (de) Verfahren zur Herstellung einer Elektronikeinheit und Elektronikeinheit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16762809

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16762809

Country of ref document: EP

Kind code of ref document: A1