WO2018141641A1 - Appareil de commande et procédé de fabrication dudit appareil - Google Patents

Appareil de commande et procédé de fabrication dudit appareil Download PDF

Info

Publication number
WO2018141641A1
WO2018141641A1 PCT/EP2018/051911 EP2018051911W WO2018141641A1 WO 2018141641 A1 WO2018141641 A1 WO 2018141641A1 EP 2018051911 W EP2018051911 W EP 2018051911W WO 2018141641 A1 WO2018141641 A1 WO 2018141641A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
control device
cooling element
carrier
plastic
Prior art date
Application number
PCT/EP2018/051911
Other languages
German (de)
English (en)
Inventor
Simon Green
Thomas Fellner
Udo Hennel
Matthias Lausmann
Stefan Doehren
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to EP18702221.5A priority Critical patent/EP3578017A1/fr
Publication of WO2018141641A1 publication Critical patent/WO2018141641A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10606—Permanent holder for component or auxiliary PCB mounted on a PCB

Definitions

  • the invention relates to a control device according to the preamble of claim 1. Furthermore, the invention relates to a method for producing a
  • a control device with the features of the preamble of claim 1 is known from DE 10 2010 030 170 A1 of the applicant.
  • the known control unit is characterized by a circuit carrier, on the upper side of which a plurality of (electronic) components are arranged.
  • the circuit carrier is in turn connected to a wiring carrier in the form of coated flex films or a printed circuit board.
  • the circuit carrier is from a
  • Wiring carrier is connected.
  • a plastic mass is arranged, which surrounds the circuit substrate with its components or covers and thereby protects.
  • the control device described so far can be connected to a heat sink as a cooling element, which is arranged in operative connection or in contact with the plastic compound and the frame member. Further details regarding the coupling of the controller to the
  • Heat sink and the formation of the heat sink can not be removed from the cited document.
  • control unit with the features of claim 1 has the advantage that the control unit in a particularly simple and elegant way to a
  • Carrier element can be attached.
  • the cooling element not only serves to dissipate heat of at least one heat-generating component, but additionally at least indirectly as a fastening element for attaching the control device to a
  • the support member may also be configured to form another heat path for dissipating heat, i. be thermally conductively connected to the cooling element. This is the case, for example, when the carrier element is part of a vehicle body.
  • Coupling of the cooling element to a support element itself must absorb or transmit no forces or mechanical stresses during attachment to a support member, but only has to be ensured that a sufficiently strong connection between the control unit and the cooling element is present. This is therefore particularly advantageous because a standing for discussion cooling element, for example in the form of a
  • Aluminum existing, produced by extrusion profile section may be formed and thus has a relatively high strength or rigidity.
  • the circuit carrier in the form of a flexible conductor foil or a flexible printed circuit board o.ä. is formed, so that a direct connection of the circuit substrate, for example, with a carrier element to a
  • Vehicle body requires additional, the construction cost, the size or the cost of the circuit board causing measures.
  • the invention should also include the case in which the cooling element with a plug connection body or a plug connection element
  • a mechanically particularly good or firm connection of the control device to a carrier element is achieved when the cooling element laterally engages over the circuit carrier and in the out-of-cover with the circuit carrier sections has several attachment points for attachment to the support element.
  • Such a design is therefore also useful or advantageous because then the cooling element has a relatively large extent (since it surmounted the lateral edge regions of the circuit substrate) and thus also allows a particularly good or effective heat dissipation.
  • the cooling element is formed in cross section in approximately U-shaped, so that the circuit carrier can be arranged in the region between the short legs of the profile. From these short legs can in turn from the circuit carrier wegragende
  • Circuit carrier which also allows the exact adjustment or positioning of the cooling element to the circuit carrier, provides that the
  • Cooling element by means of at least one spacer element with the
  • This spacer element may, for example, in the form of an injection molded part
  • Plastic consist of the one hand by its shape the defined or
  • the at least one spacer element consists of conductive material and is connected to the circuit carrier with low resistance.
  • the cooling element is used in addition to EMC shielding.
  • at least the intermediate space between the at least one heat-generating component and the cooling element is filled with the plastic compound.
  • the transmission of the heat generated by the component via the plastic compound to the cooling element is ensured. Furthermore, a mechanical decoupling between the cooling element and the component is achieved.
  • the cooling element is surrounded not only on the side facing the component of the plastic mass or is arranged in operative connection, but also on the side facing away from the component. As a result, an optimization of the heat input is effected in the cooling element and at the same time the cooling element against the influence of external media, such as moisture or the like, protected by the plastic compound.
  • a further preferred embodiment of the control device described so far provides that the plastic mass consists of several plastic layers.
  • the material of the plastic layers differs in their physical and / or chemical properties and / or their layer thicknesses.
  • a (first) plastic layer made of low-viscosity material is in operative connection with the
  • Circuit board or the components is arranged to fill any existing gap or take an underfill function on the components and at the same time electrical insulation of the components or the
  • this first plastic layer is surrounded by a second layer of plastic consisting of highly viscous material, this plastic layer, for example, serving, in particular, to effect a mechanically good protection of the control device against external influences.
  • this plastic layer for example, serving, in particular, to effect a mechanically good protection of the control device against external influences.
  • the plastic material of the second layer fillers or similar materials are added, either to increase the strength or other
  • the plastic mass is colored to increase the thermal radiation of heat.
  • the coating with the Plastic mass may be locally limited, so that in particular (only) a thermal connection with the cooling element is achieved. In this case, it may be advantageous for the circuit carrier by a separate
  • a first type of control device provides that the circuit carrier is designed in the form of a printed circuit board, and that contact pins of the
  • Plug connection element are connected by press-fitting and / or cohesive connections with electrically conductive areas of the circuit board (conductors).
  • Such a cohesive connection consists in particular in the formation of solder joints.
  • the circuit carrier is designed in the form of a flexible conductor foil, and that electrically conductive surface regions of the conductor foil are electrically conductively connected to connection elements of the plug connection element.
  • the invention also includes a method for producing a control device according to the invention described so far.
  • the method provides that the plastic mass is applied to the circuit carrier in the dipping process.
  • the use of a dipping method has the particular advantage that, in contrast to the prior art mentioned in the introduction according to DE 10 2010 030 170 A1, a frame element connected to the circuit carrier or wiring carrier can be dispensed with, so that the control unit in the area of the circuit carrier has a particularly compact design Design has.
  • it allows the dipping process in a particularly simple and elegant way, for example, at the same time to provide or cover the bottom and top of the circuit substrate with the plastic mass.
  • Plastic compound is applied by forming a plurality of plastic layers each in the dipping process with the interposition of at least one physical intermediate treatment on the circuit substrate.
  • This physical intermediate treatment can be in the form of a
  • FIG. 1 shows a perspective view of a plug connection element of a control device connected to a circuit carrier in a pre-assembly step
  • FIG. 2 shows the arrangement according to FIG. 1 in a cooling element mounted to the circuit carrier, likewise in perspective view, FIG.
  • Fig. 3 is a perspective view of a mounted on a printed circuit board
  • Fig. 4 is a longitudinal section of a fastening between the
  • Fig. 5 shows the arrangement of FIG. 2 after wrapping the
  • FIG. 6 is a perspective view of a control unit, wherein the
  • Circuit carrier is designed in the form of a flexible conductor foil.
  • the controller 10 preferably, but not by way of limitation, is for use in a motor vehicle.
  • the circuit carrier 1 1 is in the form of a known circuit board 14, and has on at least one side a number of components 15, wherein at least one of the components 15, during operation of the control unit 10 gives off heat from the area of
  • Control unit 10 is to be derived.
  • the plug connection element 12 is mechanically firmly connected to the circuit carrier 11 or the circuit board 14 by means of technologies known per se, for example by means of a latching connection.
  • the plug connection element 12 also in a known manner, not shown electrical connection elements in the form of connector pins, which is the at least indirect electrical
  • connection pins are connected, for example via press-fit technology and / or integral connections with electrically conductive regions or conductor tracks of the circuit substrate 11.
  • latching hooks 18 project beyond the respective side edge 16, 17 of the printed circuit board 14 with a latching hook section 19.
  • circuit carrier 11 or the printed circuit board 14 is connected by way of example to eight spacer elements 20.
  • the circuit carrier 11 or the printed circuit board 14 is connected by way of example to eight spacer elements 20.
  • the circuit carrier 11 or the printed circuit board 14 is connected by way of example to eight spacer elements 20.
  • Spacer elements 20 arranged approximately in the region of the heat-emitting components 15.
  • the spacer elements 20 are components produced in the plastic injection molding process, which may be electrically conductive.
  • the spacer elements 20 each have two elastically deflectable snap hooks 21, 22 (FIG. 3) projecting away from the printed circuit board 14.
  • the spacer elements 20 serve to form a latching connection 24 with a cooling element 25.
  • the cooling element 25, which can be seen particularly well in FIG. 2, is preferably designed as a section of an extruded profile and consists in particular of aluminum.
  • the cooling element 25 engages over the printed circuit board 14 on the
  • the cooling element 25 has in the area between two side legs
  • a mechanically rigid or fixed connection in particular a latching connection, is formed between the plug connection element 12 and the cooling element 25.
  • a mechanically rigid or fixed connection in particular a latching connection
  • Plug connection element 12 of the attachment of the control unit 10 to a
  • Carrier element 40 is used.
  • the cooling element 25 has a base portion 29 which in the area or in overlap with the
  • Spacer elements 20 each in cross section in approximately U-shaped, groove-like recesses 31 has.
  • the cooling element 25 cooperates with the snap hooks 21, 22 of the spacer elements 20 to form the latching connection 24.
  • the snap hooks 21, 22 cooperate with undercuts 32 in the region of the depressions 31.
  • the base section
  • the cooling element 25 each have a protruding from the circuit board 14 mounting portion 34, 35, for example, two through holes 36 for attachment of the cooling element 25 and thus also of the control unit 10 to a only symbolically represented surface of the
  • Carrier element 40 (Fig. 4).
  • the attachment is preferably via mounting screws (not shown)
  • this is at least partially surrounded by a plastic mass 42 in the region of the circuit substrate 1 1 together with the pre-assembled cooling element 25.
  • Plastic compound 42 consists of at least one, preferably a plurality of layers 43, 44 of plastic material, wherein the material of the individual layers 43, 44, in particular with regard to their viscosity, their chemical composition and other physical properties differs.
  • the first applied layer 43 may be made of epoxy resin.
  • the circuit carrier 11 is provided with the plastic compound 42 or layers 43, 44 together with the cooling element 25 in at least one method step. It may be provided that the cooling element 25 is arranged either in direct contact with the at least one heat-emitting component 15, or preferably that between the heat-emitting component 15 and the heat-emitting component 15 side facing the
  • Cooling element 25 a gap 48 is formed (Fig. 3).
  • the application of the layers 43,44 preferably takes place under a defined atmosphere
  • Circuit board 1 1 located gaps or gaps and fills these, for example, to the cooling element 25, so that this example, on the side facing away from the components 15 side is also at least partially covered by plastic material 42.
  • intermediate treatment steps in particular (pre-) curing steps can be provided.
  • Such curing steps consist for example in the application of UV light for curing according to suitable plastic materials.
  • the Plastic compound 42 and the layers 43, 44 effect in particular a mechanical protection of the circuit substrate 1 1 and a protection against ingress of media such as moisture in the region of the components 15, which affect the functioning of the control unit 10.
  • Applying the layers 43, 44 may be followed by a final curing in an oven.
  • Fig. 5 it is shown that the plastic mass 42 with a high-viscosity layer 44, the circuit substrate 1 1 on the base portion 29 of the
  • Cooling element 25 opposite side partially surrounds, so that in particular can be dispensed with a separate housing.
  • a low-viscosity layer 43 completely surrounds the circuit carrier 11.
  • FIG. 6 shows the case in which the circuit carrier 11 is designed in the form of a flexible conductor foil 45, on which the components 15 are arranged.
  • the components 15 are not only components 15 on the cooling element 25 and the base portion 29 facing side of the conductor foil 45, but also on the
  • a portion 46 of the conductor foil 45 is deformed approximately at right angles from the other regions of the conductor foil 45.
  • electrically conductive surface regions 47 in the form of contact points which are electrically contacted with the connection pins arranged in the plug connection element 12 and not visible in FIG.
  • plastic compound 42 is on the in the
  • control unit 10 described so far can be modified or modified in many ways, without departing from the spirit of the invention.
  • it may be provided to use a flexible printed circuit board 14 instead of a flexible conductor web foil 45.
  • it is also conceivable, for example, to apply only the (first) layer 43 by means of a dipping method, and possibly a further layer 44 in other methods.
  • the invention is generally not on exchange method for applying individual
  • Layers 43, 44 be limited. Rather, methods such as dipping,

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un appareil de commande (10) comportant un support de circuit (11) sur lequel est agencé au moins un composant (15) générant de la chaleur, le support de circuit (11) étant recouvert au moins sur une partie d'une masse de matière plastique (42) sur la face tournée vers le ou les composants (15), un élément de raccordement enfichable (12) servant à la mise en contact électrique du support de circuit (11), et un élément de refroidissement (25) qui est agencé en liaison fonctionnelle au moins indirecte avec le ou les composants (15) générant de la chaleur.
PCT/EP2018/051911 2017-02-01 2018-01-26 Appareil de commande et procédé de fabrication dudit appareil WO2018141641A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP18702221.5A EP3578017A1 (fr) 2017-02-01 2018-01-26 Appareil de commande et procédé de fabrication dudit appareil

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017201582.9A DE102017201582A1 (de) 2017-02-01 2017-02-01 Steuergerät und Verfahren zu dessen Herstellung
DE102017201582.9 2017-02-01

Publications (1)

Publication Number Publication Date
WO2018141641A1 true WO2018141641A1 (fr) 2018-08-09

Family

ID=61094500

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/051911 WO2018141641A1 (fr) 2017-02-01 2018-01-26 Appareil de commande et procédé de fabrication dudit appareil

Country Status (3)

Country Link
EP (1) EP3578017A1 (fr)
DE (1) DE102017201582A1 (fr)
WO (1) WO2018141641A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4057485A2 (fr) 2021-03-12 2022-09-14 Robert Bosch GmbH Dispositif d'entraînement électrique pour un véhicule et module électronique pour un dispositif d'entraînement électrique

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003012302A1 (fr) * 2001-07-27 2003-02-13 Siemens Ag Österreich Structure d'appareil
DE10206271A1 (de) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Wärmeableitvorrichtung
EP1677583B1 (fr) 2005-01-04 2009-06-17 Hitachi, Ltd. Unité électronique de contrôle et procédé de fabrication de celle-ci
DE102010030170A1 (de) 2010-06-16 2011-12-22 Robert Bosch Gmbh Steuergerät
DE102015200868A1 (de) * 2015-01-20 2016-07-21 Zf Friedrichshafen Ag Steuerelektronik

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003012302A1 (fr) * 2001-07-27 2003-02-13 Siemens Ag Österreich Structure d'appareil
DE10206271A1 (de) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Wärmeableitvorrichtung
EP1677583B1 (fr) 2005-01-04 2009-06-17 Hitachi, Ltd. Unité électronique de contrôle et procédé de fabrication de celle-ci
DE102010030170A1 (de) 2010-06-16 2011-12-22 Robert Bosch Gmbh Steuergerät
DE102015200868A1 (de) * 2015-01-20 2016-07-21 Zf Friedrichshafen Ag Steuerelektronik

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4057485A2 (fr) 2021-03-12 2022-09-14 Robert Bosch GmbH Dispositif d'entraînement électrique pour un véhicule et module électronique pour un dispositif d'entraînement électrique
DE102021202450A1 (de) 2021-03-12 2022-09-15 Robert Bosch Gesellschaft mit beschränkter Haftung Elektrische Antriebsvorrichtung für ein Fahrzeug und Elektronikbaugruppe für eine elektrische Antriebsvorrichtung

Also Published As

Publication number Publication date
EP3578017A1 (fr) 2019-12-11
DE102017201582A1 (de) 2018-08-02

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