WO2016177629A1 - Composant électronique et son procédé de fabrication - Google Patents

Composant électronique et son procédé de fabrication Download PDF

Info

Publication number
WO2016177629A1
WO2016177629A1 PCT/EP2016/059540 EP2016059540W WO2016177629A1 WO 2016177629 A1 WO2016177629 A1 WO 2016177629A1 EP 2016059540 W EP2016059540 W EP 2016059540W WO 2016177629 A1 WO2016177629 A1 WO 2016177629A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
electronic component
intermediate element
cover
Prior art date
Application number
PCT/EP2016/059540
Other languages
German (de)
English (en)
Inventor
Tilo Liebl
Jürgen SAUERBIER
Bernhard Schuch
Nikolaus Taschner
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Publication of WO2016177629A1 publication Critical patent/WO2016177629A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention relates to a method for producing an electronic component according to the preamble of claim 1.
  • the invention further relates to an electronic component produced by such a method.
  • Electronic components in the form of integrated circuits usually comprise electronic assemblies, which are brought together on a printed circuit board to an electrical circuit arrangement.
  • Such electronic components are used for example in control units for motor vehicles, eg. B. in transmission control units used.
  • the printed circuit board for example, on a metallic support, for.
  • a metallic support for.
  • aluminum support laminated.
  • adhesive compounds are produced by pressure and / or temperature.
  • the modules on the circuit board may take the form of so-called “bare die” or as a soldered electronic components with a plastic cover on the flat side of the printed circuit board to ⁇ arranged.
  • bare die refers to integrated electronic components, which are further processed without a cover.
  • These electronic assemblies are applied directly to the circuit board and by means of electrical connection elements, such. As bonding wires, stamped grid, flexible films, etc., connected to other arranged on the circuit board electronic components or modules.
  • the electronic component by means of one or more housings against external influences, eg. As transmission oil, protected.
  • the housing surrounds at least a portion of the populated flat side of the circuit board.
  • the housing is advantageously formed from an electrically iso ⁇ lierenden material and is connected to the printed circuit board for example by means of frictional and form closure, z. B. the housing is riveted or screwed to the circuit board.
  • a potting compound for the cohesive connection of the housing
  • a potting compound for example, silicone rubber used
  • a thixotropic adhesive is additionally required because low molecular weight siloxanes can escape from the silicone rubber, resulting in leaks and / or detachment of the housing may result from the circuit board.
  • the invention is based on the object to provide an improved method for producing an electronic component and an improved electronic component.
  • the object is achieved according to the invention with the features specified in claim 1.
  • the object is achieved according to the invention with the features specified in claim 7.
  • the printed circuit board connected to a carrier body, -
  • the printed circuit board equipped with a number of electronic components and
  • the circuit board with at least one cover, which covers the number of electronic components on the circuit board at least partially.
  • the at least one cover is connected via a thermoplas ⁇ tical intermediate element with the circuit board.
  • thermoplastic intermediate member thereby protects the electronic component to be concealed from a temperature which acts on the environment during assembly of the cover.
  • An embodiment of the invention provides that the thermoplastic intermediate element is laminated to a populated flat side of the printed circuit board.
  • the laminate composite between the printed circuit board and the thermoplastic intermediate element enables a media-tight and mechanically stable connection between these two components.
  • thermoplastic intermediate element to the printed circuit board to be produced simultaneously with the connection of the printed circuit board to the carrier body.
  • costs and effort for the production of the electronic component can be optimized.
  • thermoplastic Zvi ⁇ rule element is to, for example, of polyamide 6.6, which represents a low-temperature-stable thermoplastic material, which when exposed to high temperatures at least in regions on ⁇ melts and thereby joins a material fit with the circuit board.
  • polyamide 6.6 represents a low-temperature-stable thermoplastic material, which when exposed to high temperatures at least in regions on ⁇ melts and thereby joins a material fit with the circuit board.
  • a region with a plurality of electronic components which are combined to form an integrated circuit arrangement - can alternatively be a high-temperature-turstabiler thermoplastic such.
  • polyphthalamide polyphenylene sulfide or polyethersulfone, be used as a material for the thermoplastic intermediate element.
  • an embodiment of the invention provides that at least one electronic component to be covered is provided with an electrically insulating potting compound.
  • the potting compound consists for example of silicone rubber and forms after curing a positive and cohesive bond with the electronic component, so that it is additionally protected from external influences.
  • the invention further provides an electronic component which is produced by the method according to the invention.
  • the electronic component comprises a circuit board having a number of electronic components, a carrier body, which is connected to the circuit board, and at least one covering element ⁇ which the number of electronic components on the circuit board at least partially obscured.
  • the cover is connected via an intermediate element to the circuit board.
  • the electronic component is for arrangement in one
  • Control unit for a motor vehicle for example in one Gearbox control unit, provided.
  • the cover protects the number of electronic components from external influences, such. As chips, transmission oil.
  • thermoplastic intermediate ⁇ elements By means of the thermoplastic intermediate ⁇ elements while a media-tight, cohesive connection of the cover is possible on the circuit board, in the production of high temperatures act on the environment, such. B. welding.
  • thermoplastic intermediate element at least partially encloses a region of the printed circuit board to be covered.
  • thermoplastic intermediate element is annular and encloses an electronic component on the circuit board.
  • the cover is arranged on the open end of the thermoplastic intermediate element and connected thereto.
  • a further embodiment of the invention provides that the at least one cover element has at least one groove for receiving an adhesive.
  • the groove serves to receive an adhesive in the event that the cohesive connection between the cover and the thermoplastic intermediate element is damaged.
  • the adhesive By means of the adhesive, a repair of the cohesive connection is possible, so that, furthermore, a media-tight bond between the cover element and the thermoplastic intermediate element is si ⁇ cheregi.
  • the circuit board may have a groove for receiving an adhesive so that the laminate bond between said thermoplastic intermediate element and the circuit board gege ⁇ appropriate, can be repaired.
  • the circuit board is mechanically flexible.
  • the circuit board comprises at least one mechanically flexible section, which z. B. made of polyamide.
  • FIG. 1 shows schematically a sectional view of an electronic component with a populated printed circuit board and a carrier body according to the prior art
  • FIG. 2 shows schematically a sectional view of an inventive embodiment of an electronic component.
  • Figure 1 shows an electronic component E according to the prior art in a perspective view.
  • the electronic component E comprises a printed circuit board 1, which has a plurality of electronic components 2 on a flat side in the exemplary embodiment shown, as well as a carrier body 3.
  • the electronic component E is thus as a control unit, z. B. as a transmission control unit, can be used.
  • the printed circuit board 1 comprises as a substrate, for example, impregnated in epoxy resin glass fibers and is thus rigid.
  • the circuit board 1 also mechanically flexible be formed and comprises at least one mechanically flexible portion which z. B. is made of polyamide, on the one or both sides conductor tracks for the electrical connection of the electronic components 2 are applied.
  • the printed circuit board 1 is further connected to another flat side, in this case a side remote from the electronic components 2 flat side, materially connected to the support body 3, z. B. by means of a laminate composite V.
  • the laminate composite V here is an adhesive connection between the circuit board 1 and the carrier body 3, which is produced by means of pressure and optionally by means of temperature.
  • the carrier body 3 also referred to as a leadframe or (copper) stamped grid / carrier body, has an electrically conductive carrier structure.
  • the Trä ⁇ ger entrepreneurial 3 is formed of aluminum and is manufactured as a stamped grid, wherein the support body 3 contact pins (not shown) for electrically contacting the electronic components 2 has.
  • speed sensors ⁇ and / or Hall sensors are arranged on the circuit board 1, which are provided in the present embodiment with a laminated plastic cover. Furthermore, a cover 5 is arranged on the circuit board 1, which is fastened by means of rivets frictionally to the circuit board 1. In addition, the cover 5 may be materially connected to the circuit board 1, z. B. by means of a solid material seal. 4
  • the cover 5 is used in particular to cover a number not shown in detail so-called bare Dies, which are glued or soldered to the flat side of the circuit board 1. An electrical contact between the Bare Dies and the circuit board 1.
  • the cover 5 is to protect the electronic components 2 from external influences, such.
  • As gear oil, chips, etc. formed from a mechanically and chemically resistant and electrically insulating material.
  • the cover element 5 is formed from a duroplastic material.
  • the cover member 5 is usually laminated on the circuit board 1.
  • the printed circuit board 1 is laminated onto the carrier body 3.
  • the laminate composite V is prepared by means of an adhesive, for. As acrylic adhesive, prepared, which produces a cohesive bond between the circuit board 1 and the carrier body 3 under the action of pressure and temperature. In this case, the printed circuit board 1 is still unpopulated in a first step and thus not provided with electronic components 2.
  • the circuit board 1 is equipped with a number or plurality of electronic components 2.
  • sensors and / or bare dies are glued or soldered to the printed circuit board 1 and electrically connected to the circuit board 1, z. B. by means of bonding wire connections and / or by means of solder joints.
  • the cover 5 is placed on the circuit board 1 on ⁇ , wherein alternatively also a plurality of cover 5 are conceivable.
  • 1 shows the electronic component E after a second production step, in which the cover 5 is laminated to the circuit board 1.
  • the laminate composite V between cover 5 and circuit board 1 is hereby similar to the first manufacturing step by means of an adhesive, for.
  • thermoplastic intermediate element 6 As described in the following Figure 2.
  • FIG. 2 shows a sectional view of an embodiment according to the invention of an electronic component E with a thermoplastic intermediate element 6.
  • thermoplastic intermediate element 6 is of annular design and surrounds the electronic component 2 to be covered.
  • thermoplastic intermediate element 6 is also possible, with a media-tight closure of the electronic component 2 or the region to be covered closed circumferential course is advantageous.
  • a height of the thermoplastic intermediate element 6 is expediently greater than a height of the electronic component 2 or region to be covered.
  • thermoplastic intermediate element 6 is made of a low-temperature-stable thermoplastic, such as. B. Polyamid6.6, which melts at least partially when exposed to high temperatures and thereby materially connects to the circuit board 1.
  • the thermoplastic embele ⁇ ment 6 is thus laminated to the circuit board 1.
  • thermoplastic intermediate element 6 may alternatively also be made of a high-temperature-stable thermoplastic, such as, for example.
  • a high-temperature-stable thermoplastic such as, for example.
  • polyphthalamide, polyphenylene sulfide or polyethersulfone be formed.
  • thermoplastic intermediate elements 6 which corresponds to a number of cover elements 5.
  • thermoplastic intermediate element 6 is preferably laminated during the first production step by ⁇ feasible, in which the circuit board 1 to the carrier body. 3
  • the production of the electronic component E can be time and cost optimized.
  • the required in the prior art solid seal 4 can be omitted.
  • FIG. 2 shows the electronic component E in an exploded view with cover element 5 not yet fastened for better illustration of the shape and configuration of the thermoplastic intermediate element 6 before attachment of the cover element 5 to the printed circuit board 1, but after attachment to the Circuit board 1.
  • the cover 5 is welded to the thermoplastic intermediate element 6.
  • ultrasonic welding ⁇ or laser welding is.
  • thermoplastic intermediate element 6 By means of the thermoplastic intermediate element 6 is thus a media-tight closure of a region on the circuit board 1 is possible, which is long-term mechanically reliable and stable.
  • thermoplastic intermediate element 6 the use of a low-cost potting or sealing compound, such.
  • silicone rubber for additional protection against residual dirt before attachment of the cover 5 possible.
  • the silicone rubber or silgel is very liquid in the uncured state.
  • the intermediate element 6 and / or the cover element 5 additionally has at least one groove for receiving an adhesive.
  • the intermediate element 6 has such a receiving groove N.
  • the groove serves to receive the adhesive in the event that the welded joint between the cover 5 and the thermoplastic intermediate element 6 is damaged.
  • the adhesive repair is possible, so that the elec ⁇ ronic component 2 or the area of the circuit board 1 is still closed media-tight.
  • the circuit board 1 may have a groove for receiving an adhesive, so that the laminate natverbund V between the thermoplastic intermediate element 6 and the circuit board 1 can also be repaired.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un composant électronique (E), consistant à assembler une carte de circuit imprimé (E) et un corps de support (3), - équiper la carte de circuit imprimé (1) d'une pluralité de composants électroniques (2) et - munir la carte de circuit imprimé (1) d'au moins un élément de recouvrement (5) qui recouvre au moins partiellement la pluralité de composants électroniques (2) sur la carte de circuit imprimé (1). Selon l'invention, ledit au moins un élément de recouvrement (5) et la carte de circuit imprimé (1) sont assemblés au moyen d'un élément intermédiaire thermoplastique (6). L'invention concerne en outre un composant électronique (E) fabriqué selon un tel procédé.
PCT/EP2016/059540 2015-05-07 2016-04-28 Composant électronique et son procédé de fabrication WO2016177629A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015208486.8 2015-05-07
DE102015208486.8A DE102015208486A1 (de) 2015-05-07 2015-05-07 Elektronische Komponente und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
WO2016177629A1 true WO2016177629A1 (fr) 2016-11-10

Family

ID=55910240

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/059540 WO2016177629A1 (fr) 2015-05-07 2016-04-28 Composant électronique et son procédé de fabrication

Country Status (2)

Country Link
DE (1) DE102015208486A1 (fr)
WO (1) WO2016177629A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019072690A1 (fr) * 2017-10-11 2019-04-18 Continental Automotive Gmbh Composant électrique et procédé de fabrication associé

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017123553A1 (de) * 2017-10-10 2019-04-11 Sick Ag Optoelektronischer Sensor
DE102021125881A1 (de) 2021-10-06 2023-04-06 Endress+Hauser SE+Co. KG Leiterplatte für ein Feldgerät der Automatisierungstechnik
DE102022113498B3 (de) 2022-05-30 2023-09-14 Lisa Dräxlmaier GmbH Leiterplattenbaugruppe mit einer eine ausbuchtung aufweisenden elektrisch isolierenden decklage und verfahren zum herstellen einer leitplattenbaugruppe

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300566B1 (en) * 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
US20030114022A1 (en) * 2000-07-28 2003-06-19 Frank Franzen Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
US20060023431A1 (en) * 2003-09-05 2006-02-02 Gerhard Wetzel Control unit and method for producing the same
US20080108478A1 (en) * 2004-12-22 2008-05-08 Gerhard Wetzel Control Module
US20090002959A1 (en) * 2004-07-28 2009-01-01 Siemens Aktiengesellschaft Control Apparatus, in Particular a Mechatronic Transmission Control Device or Engine Control Device
DE102011085054A1 (de) * 2011-10-21 2013-05-08 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug
DE102012200914A1 (de) * 2012-01-23 2013-07-25 Robert Bosch Gmbh Gehäuseaufbau eines Elektronikmoduls für ein Fahrzeug
US20130314878A1 (en) * 2010-12-08 2013-11-28 Robert Bosch Gmbh Control module and method for producing same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300566B1 (en) * 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
US20030114022A1 (en) * 2000-07-28 2003-06-19 Frank Franzen Method for contacting a flexible circuit board with a contact partner and arrangement comprising flexible circuit board and contact partner
US20060023431A1 (en) * 2003-09-05 2006-02-02 Gerhard Wetzel Control unit and method for producing the same
US20090002959A1 (en) * 2004-07-28 2009-01-01 Siemens Aktiengesellschaft Control Apparatus, in Particular a Mechatronic Transmission Control Device or Engine Control Device
US20080108478A1 (en) * 2004-12-22 2008-05-08 Gerhard Wetzel Control Module
US20130314878A1 (en) * 2010-12-08 2013-11-28 Robert Bosch Gmbh Control module and method for producing same
DE102011085054A1 (de) * 2011-10-21 2013-05-08 Robert Bosch Gmbh Steuergerät für ein Kraftfahrzeug
DE102012200914A1 (de) * 2012-01-23 2013-07-25 Robert Bosch Gmbh Gehäuseaufbau eines Elektronikmoduls für ein Fahrzeug

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019072690A1 (fr) * 2017-10-11 2019-04-18 Continental Automotive Gmbh Composant électrique et procédé de fabrication associé
CN111295932A (zh) * 2017-10-11 2020-06-16 维特思科科技有限责任公司 电气部件及其制造方法
US11503719B2 (en) 2017-10-11 2022-11-15 Vitesco Technologies GmbH Electrical component and method for the production thereof
CN111295932B (zh) * 2017-10-11 2023-06-13 维特思科科技有限责任公司 电气部件及其制造方法

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