WO2017045854A1 - Appareil de commande étanche aux substances pour véhicule à moteur et procédé de réalisation de l'appareil de commande - Google Patents

Appareil de commande étanche aux substances pour véhicule à moteur et procédé de réalisation de l'appareil de commande Download PDF

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Publication number
WO2017045854A1
WO2017045854A1 PCT/EP2016/069397 EP2016069397W WO2017045854A1 WO 2017045854 A1 WO2017045854 A1 WO 2017045854A1 EP 2016069397 W EP2016069397 W EP 2016069397W WO 2017045854 A1 WO2017045854 A1 WO 2017045854A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing cover
control device
circuit board
edge region
cavity
Prior art date
Application number
PCT/EP2016/069397
Other languages
German (de)
English (en)
Inventor
Frieder Wittmann
Karin Beart
Johannes Bock
Thomas Schmidt
Bernhard Schuch
Original Assignee
Conti Temic Microelectronic Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic Gmbh filed Critical Conti Temic Microelectronic Gmbh
Priority to EP16758106.5A priority Critical patent/EP3351068B1/fr
Priority to CN201680050585.5A priority patent/CN108029208B/zh
Priority to JP2018513450A priority patent/JP6611920B2/ja
Publication of WO2017045854A1 publication Critical patent/WO2017045854A1/fr
Priority to US15/921,383 priority patent/US10506732B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0052—Shielding other than Faraday cages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0071—Active shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Definitions

  • the invention relates to a control device for a motor vehicle and a method for its production according to the preamble of the independent claims.
  • components such as transmission, engine or brake systems are increasingly being primarily electronically controlled.
  • integrated mechatronic controls ie the integration of control electronics and the associated electronic components such as sensors or valves in the transmission, the engine or the brake system.
  • Control units thus generally have a plurality of electronic components, which are in connection with other components outside of the control unit.
  • these controls are no longer housed in a separate protected electronics compartment and, therefore, must withstand environmental, mechanical, thermal, and chemical stresses, and are typically used in special enclosures for this purpose.
  • the circuit carrier for such controls are usually constructed, introduced into a housing and then this housing is closed.
  • An example of this is described in DE 10 2007 038 331 AI.
  • This housing construction guarantees however, no absolute tightness against diffusion or permeation. Harmful gases can get to the circuit carrier over time and lead to metal corrosion.
  • In an alternative concept of complete scarf ⁇ processing building is completely cast around for protection of the circuit board with molding compound.
  • An example of this is described in DE 10 2011 082537 AI.
  • the process control of the molding process must be strictly adhered to. Otherwise, when using unhoused electronic components, so-called bare dies, which are electrically connected to the circuit carrier by means of gold-wire connections, so-called bonding wire drifts may occur.
  • the thermal expansion coefficient of the molding material must be exactly matched to that of the overall structure consisting of carrier substrate, components, etc. Otherwise, it may come at temperature loads to gap formation between molding compound and structure.
  • Housing interior arise, difficult to be discharged again.
  • the invention is based on the object to provide a control device for a motor vehicle, which provides complete protection of circuit and circuit board against noxious gases and against aggressive media such as gear oil and at the same time leads to a reduction in manufacturing costs compared to previously known control devices.
  • This object is achieved by a control unit with the features of claim 1.
  • a control device which comprises a housing cover with a circumferential, in particular planar, edge region and a planar electrical connection device with integrated conductor tracks, wherein the housing cover is connected in the edge region with the connection device to form a connecting seam at least partially cohesively and with the Connecting device includes a cavity.
  • the cohesive connection between the housing cover and the connecting device is produced in particular by means of gluing, laminating or soldering.
  • an electronic component is at least disposed within the cavity and the Verbin ⁇ extension device connects this electronic component with electronic components outside the hollow space electrically.
  • the housing cover is overmolded with a polymer over its entire surface and beyond the circumferential edge region with a polymer, wherein the housing cover is preferably made of plastic or metal and the polymer is designed primarily as a molding material, as an adhesive or as a resin.
  • the electronic components include, for example, capacitors, coils or a microprocessor. As a rule, the electronic components are electrically connected to one another via conductor tracks of the connecting device and / or by means of bonded gold wires.
  • the housing cover protects the electronic components inside the control unit housing from oils, especially aggressive oils, as well as harmful gases and chemicals. Furthermore, the electronic components are before salts or processing back protected. The oils, gases, salts and / or residues are present, for example, in a transmission on which or within which the control unit is arranged. The corresponding printed conductors are also protected by the housing cover.
  • the lid as already mentioned, in
  • the housing cover is encapsulated over the peripheral edge region, in particular completely media-tightly with a polymer.
  • this can also be a housing cover of non-media-tight material, which is thus also usually cheaper, are used.
  • the controller assembly is hermetically sealed against the environment.
  • the chemicals or gases include sulfur compounds, which may cause sulfides.
  • Sulfides are at least partially current-conducting and would be deposited on unshielded electronic components, the interconnects of the interconnect device, and / or the gold wires. This can lead to chemical reactions with the sulfides. For example, oxidize the conductor tracks of the connection ⁇ device, in particular silver conductor tracks, with the sulfur n
  • Line resistances and / or functions of the electronic components may change and, for example, negatively influence the switching behavior of a transmission. Furthermore, such gases can cause signal changes, so that, for example, faulty evaluations by the control device device occur.
  • control unit described as a prefabricated module for an application on-site such as in the transmission or as an attachment control unit feasible.
  • the connecting device is designed as a printed circuit board with at least one layer.
  • the printed circuit board is for example a fiber-reinforced plastic or a ceramic printed circuit board. But it could also be a so-called HDI printed circuit board (high-density interconnect) can be used, which is designed very compact.
  • the continuous printed circuit board protrudes here over the entire umlau ⁇ fenden edge region of the housing cover and at the same time forms the bottom of the housing. As a result, in particular a flat structure of the control unit is achieved.
  • the side of the printed circuit board facing away from the housing cover may additionally be sprayed with polymer in the region corresponding to the connecting seam.
  • the peripheral edge region of the mold extends. Housing cover advantageously in a corresponding circumferential groove in the circuit board. As a result, the risk of a gap formation in the encapsulation in the region of the joint is reduced.
  • connection device is arranged partly as a separate circuit carrier in the interior of the cavity, wherein the at least one electronic component such as capacitor, coil or microprocessor is arranged on the separate circuit carrier.
  • the electronic components are in particular electrically interconnected via conductor tracks of the circuit carrier and / or by means of bonded gold wires.
  • the separate circuit carrier is for example a fiber-reinforced plastic or a ceramic circuit board with one or more layers. Alternatively, however, a so-called HDI printed circuit board (High Density Interconnect) ver ⁇ turns could be, which is very compact from ⁇ designed by design.
  • the at least one electronic component on the separate circuit carrier is preferably electrically connected by means of a separate printed circuit board with electronic components outside the cavity.
  • a separate circuit board is in particular ⁇ special a flexible circuit board, the entire surface, with a recess for receiving the separate circuit substrate, or strip-shaped, used.
  • the cavity in the control unit is essentially enclosed by the housing cover and the carrier plate.
  • the support plate is made of metal because of their requirements in terms of stiffness and politiciansableitcol of particular aluminum. Is used as Separate printed circuit board uses a flex foil, so this is preferably laminated to the support plate.
  • the flexible printed circuit board is designed with a recess for receiving the circuit carrier over its entire area, it is substantially completely encircled by the edge region of the housing cover. If the flexible circuit board is designed strip-shaped, it is naturally only partially covered by the peripheral edge region of the housing cover, usually transverse to the conductor tracks.
  • Edge region of the housing cover advantageously in a corresponding circumferential groove in the support plate.
  • an opening is arranged in the housing cover, through which a protective gel can be introduced into the cavity before encapsulation, which covers at least the electronic components on the connecting device. It would also be possible to shed the entire cavity with the protective gel.
  • the opening of the housing cover is sealed by means of an adhesive, a ball-like closure device or a polymer material.
  • the protection gel means additional protection of the electronics in the control unit.
  • connection device on which the electronic components are arranged
  • Housing cover extends.
  • a protective gel is introduced into the cavity before the encapsulation of the housing cover with a polymer through an opening in the housing cover, which covers at least the electronic components ⁇ construction on the connecting device. It would also be possible to shed the entire cavity with the protective gel. After inserting the protective gel, the opening of the
  • Housing cover by means of an adhesive, a ball-like closure device or a polymer material sealed.
  • FIG. 1 shows a section through a control unit with a continuous circuit board as a connecting device
  • Fig. 2 is a control device as in the figure 1, with both sides
  • 3 shows a section through a control unit with a separate circuit carrier and a separate circuit board
  • Fig. 4 is a control device as in the figure 3, but with a
  • Fig. 5 is a control device as in Figure 3, but with protective gel in the cavity.
  • Figures 1 and 2, and 3 to 5 show schematic sectional views of a control device according to two different execution principles, wherein Fig. 1 and Fig. 2, the first and Fig. 3 to 5 reproduce the second embodiment. First, common features of the two design principles will be described before discussing the differences.
  • control unit of an automatic transmission of a motor vehicle.
  • the control unit can evaluate as Hall sensors and control circuitry of the automatic transmission in From ⁇ dependence of the measured values, for example, readings from sensors.
  • the controller may also be provided for other purposes such as in an engine of a motor vehicle.
  • Each control unit has a connection device 2, 3.
  • On the connecting device 2, 3 a plurality of electronic components 7 is arranged. These include, for example, capacitors, coils, at least one microprocessor and / or other components.
  • the electronic components 7 are electrically connected to each other, in particular via bonded
  • a housing cover 4 is connected cohesively in its peripheral edge region 8 to the connecting device 2, 3 to form a peripheral connecting seam 6. The cohesive connection between the
  • Housing cover 4 and the connecting device 2, 3 is made by gluing. However, this connection can also be realized for example by lamination or soldering.
  • the housing cover 4 and the connecting device 2, 3 is made by gluing. However, this connection can also be realized for example by lamination or soldering.
  • the housing cover 4 encloses with the connecting device 2, 3 a closed cavity 9.
  • the cohesive connecting seam 6 is integrally formed between the housing cover 4 and the connecting device 2, 3 to the electronic components 7.
  • the connecting device 2, 3 connects the electronic components 7 in the interior of the control device with electronic components not shown here outside the cavity 9 or
  • Control unit electrically.
  • the housing cover 4 is completely encapsulated in a media-tight manner over its peripheral edge region 8 with a polymer 5. As a result, it is also possible to use a housing cover 4 made of material which is not media-tight, which as a rule is therefore more cost-effective.
  • the encircling edge region 8 of the housing cover 4 is at least in the region of the connecting seam 6 between the housing cover 4 and the connecting device 2, 3 with a polymer 5 in particular so encapsulated that the polymer
  • the edge region 8 and the connecting device 2, 3 can each be made flush.
  • the edge region 8 and the connecting device 2, 3 can each have a corresponding structure which, in the assembled state, can produce improved strength and tightness of the connection, in particular over the service life.
  • the polymer 5 is designed as a molding material, alternatively as an adhesive or as a resin.
  • the balletsvor ⁇ direction is designed as a printed circuit board 2 with at least one layer.
  • the printed circuit board 2 is for example a fiber-reinforced plastic, a ceramic circuit board or a
  • the continuous printed circuit board 2 protrudes here over the entire peripheral edge region 8 of the housing cover 4 and at the same time forms the bottom of the Steuer réellege ⁇ housing. As a result, in particular a flat structure of the control unit is achieved.
  • the connection device 2, 3 comprises a separate circuit carrier 2, on which all electronic components 7 are arranged, and a separate circuit board 3, by means of the electronic components 7 in the interior of the control unit, with electronic components, not shown, outside the control unit are electrically connected.
  • the separate circuit carrier 2 and the separate circuit board 3 are connected here by means of bonding wires.
  • the separate circuit carrier 2 and the separate circuit board 3 are arranged on a common, over the entire peripheral edge region 8 of the housing cover 4 also protruding support plate 1.
  • the cavity 9 is enclosed by the housing cover 4 and the support plate 1 substantially.
  • the separate circuit carrier 2 is as a fiber reinforced plastic circuit board or alternatively as a
  • Ceramic printed circuit board or HDI printed circuit board each with one or more layers.
  • other embodiments of a circuit substrate may be used.
  • the electronic components 7 are electrically connected to one another, in particular via bonded gold wires and / or printed conductors of the separate circuit carrier 2.
  • a flexible printed circuit board made of polyimide is preferably used as a separate circuit board 3.
  • This flexible printed circuit board 3 is either a closed surface, with a recess for receiving the circuit substrate 2, or strip- ⁇ out.
  • the support plate is made of metal because of its stiffness and heat dissipation requirements. especially made of aluminum.
  • the separate scarf ⁇ carrier 2 and the separate circuit board 3 are usually glued or laminated to the support plate 1. If the flexible printed circuit board 3 is embodied over the whole area, it is essentially covered completely peripherally by the edge region 8 of the housing cover 4.
  • the flexible printed circuit board 3 is designed strip-shaped, this is the construction of the peripheral edge portion 8 of the housing cover 4 only partially, usually covered transversely to the tracks of the circuit board 3.
  • the Verbin ⁇ dung seam 6 thus extends on one side over the peripheral edge region 8 and on the other side on the strips of the printed circuit board 3 and the support plate. 1
  • Fig. 4 shows a control device as shown in Fig. 3, however, the circumferential edge portion 8 of the housing cover 4 in a ent ⁇ speaking circumferential groove 11 extends in the carrier plate 1.
  • the difference in level between the edge region 8 and the support plate 1 in the region of the overmolding 5 reduced or equalized and thus reduces the risk of a gap formation in the polymer 5 in the region of the connecting seam 6.
  • FIG. 5 shows a control device as in FIG. 3, but an opening 12 is arranged in the housing cover 4, through which a protective gel 13 has been introduced into the cavity 9 prior to encapsulation with polymer 5, which as a rule comprises at least the electronic components 7 covered on the connecting device 2.
  • a protective gel 13 has been introduced into the cavity 9 prior to encapsulation with polymer 5, which as a rule comprises at least the electronic components 7 covered on the connecting device 2.
  • the entire cavity 9 is shed with the protective gel 13.
  • the opening 12 of the housing cover 4 by means of an adhesive, a spherical Closure device or a polymer material has been sealed.
  • the protection gel 13 means additional protection of the electronics in the control unit.
  • Such introduction of a protective gel 13 would also be conceivable in the first embodiment according to FIGS. 1 and 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

L'invention concerne un appareil de commande dans un véhicule à moteur, comprenant : un couvercle de boîtier (4) présentant une zone marginale (8) périphérique ; un dispositif de connexion électrique (2, 3) plan doté de pistes conductrices intégrées, le couvercle de boîtier (4) étant relié dans la zone marginale (8) par liaison de matière au moins au dispositif de connexion (2, 3) et formant une cavité (9) avec le dispositif de connexion (2, 3) ; au moins un composant électronique (7) disposé dans la cavité (9), le dispositif de connexion (2, 3) connectant électriquement l'au moins un composant électronique (7) à des composants électroniques situés à l'extérieur de la cavité (9), le couvercle de boîtier (4) étant rendu étanche aux substances par injection sur son pourtour d'un polymère (5) au-delà de la zone marginale (8) périphérique.
PCT/EP2016/069397 2015-09-15 2016-08-16 Appareil de commande étanche aux substances pour véhicule à moteur et procédé de réalisation de l'appareil de commande WO2017045854A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP16758106.5A EP3351068B1 (fr) 2015-09-15 2016-08-16 Appareil de commande étanche aux substances pour véhicule à moteur et procédé de réalisation de l'appareil de commande
CN201680050585.5A CN108029208B (zh) 2015-09-15 2016-08-16 用于机动车辆的对介质密封的控制装置和用于制造控制装置的方法
JP2018513450A JP6611920B2 (ja) 2015-09-15 2016-08-16 媒体に対して密閉された自動車用制御装置および制御装置の製造方法
US15/921,383 US10506732B2 (en) 2015-09-15 2018-03-14 Media-tight control device for a motor vehicle and method for producing the control device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015217576.6A DE102015217576B4 (de) 2015-09-15 2015-09-15 Mediendichtes Steuergerät für ein Kraftfahrzeug und Verfahren zur Herstellung des Steuergerätes
DE102015217576.6 2015-09-15

Related Child Applications (1)

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US15/921,383 Continuation US10506732B2 (en) 2015-09-15 2018-03-14 Media-tight control device for a motor vehicle and method for producing the control device

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WO2017045854A1 true WO2017045854A1 (fr) 2017-03-23

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US (1) US10506732B2 (fr)
EP (1) EP3351068B1 (fr)
JP (1) JP6611920B2 (fr)
CN (1) CN108029208B (fr)
DE (1) DE102015217576B4 (fr)
WO (1) WO2017045854A1 (fr)

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DE102016224352B4 (de) 2016-12-07 2024-01-25 Vitesco Technologies Germany Gmbh Gehäuse zur Aufnahme von elektronischen Komponenten
DE102018215711A1 (de) * 2018-09-14 2020-03-19 Robert Bosch Gmbh Steuergeräteeinheit und Verfahren zum Herstellen einer Steuergeräteeinheit
CN110213952A (zh) * 2019-05-28 2019-09-06 青岛歌尔微电子研究院有限公司 一种电磁屏蔽结构及其制造方法及电子设备
US11935799B2 (en) * 2019-06-25 2024-03-19 Intel Corporation Integrated circuit package lids with polymer features
DE102019215659B4 (de) * 2019-10-11 2021-08-12 Continental Automotive Gmbh Schaltungsbaugruppe
US10893604B1 (en) 2020-03-03 2021-01-12 Goodrich Corporation Potted printed circuit board module and methods thereof
DE102020122428A1 (de) 2020-08-27 2022-03-03 Bayerische Motoren Werke Aktiengesellschaft Metall-Kunststoff-Hybridgehäuse sowie Verfahren zur Herstellung eines Metall-Kunststoff-Hybridgehäuses
DE102021202853B4 (de) 2021-03-24 2022-10-06 Vitesco Technologies Germany Gmbh Elektronische Baugruppe mit verbessertem Sicherungskonzept

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US20180206355A1 (en) 2018-07-19
JP6611920B2 (ja) 2019-11-27
US10506732B2 (en) 2019-12-10
DE102015217576B4 (de) 2017-03-30
DE102015217576A1 (de) 2017-03-16
CN108029208A (zh) 2018-05-11
CN108029208B (zh) 2020-10-30
EP3351068B1 (fr) 2021-10-13
JP2018530295A (ja) 2018-10-11
EP3351068A1 (fr) 2018-07-25

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