WO2012008306A1 - Phosphor composite member, led device and method for manufacturing phosphor composite member - Google Patents
Phosphor composite member, led device and method for manufacturing phosphor composite member Download PDFInfo
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- WO2012008306A1 WO2012008306A1 PCT/JP2011/064922 JP2011064922W WO2012008306A1 WO 2012008306 A1 WO2012008306 A1 WO 2012008306A1 JP 2011064922 W JP2011064922 W JP 2011064922W WO 2012008306 A1 WO2012008306 A1 WO 2012008306A1
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- powder
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- composite member
- phosphor
- sintered body
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 219
- 239000002131 composite material Substances 0.000 title claims abstract description 156
- 238000004519 manufacturing process Methods 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 38
- 239000000843 powder Substances 0.000 claims abstract description 357
- 239000011521 glass Substances 0.000 claims abstract description 177
- 239000000919 ceramic Substances 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 230000005284 excitation Effects 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims description 47
- 239000011256 inorganic filler Substances 0.000 claims description 44
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 44
- 239000011812 mixed powder Substances 0.000 claims description 32
- 239000013078 crystal Substances 0.000 claims description 30
- 238000003825 pressing Methods 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 23
- 150000007529 inorganic bases Chemical class 0.000 claims description 22
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 239000012298 atmosphere Substances 0.000 claims description 10
- 229910052791 calcium Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000002223 garnet Substances 0.000 claims description 8
- 229910052749 magnesium Inorganic materials 0.000 claims description 8
- 229910052708 sodium Inorganic materials 0.000 claims description 8
- 229910052712 strontium Inorganic materials 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 8
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 7
- 229910052788 barium Inorganic materials 0.000 claims description 6
- 239000006104 solid solution Substances 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052700 potassium Inorganic materials 0.000 claims description 5
- 150000004820 halides Chemical class 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 claims description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 3
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 claims description 3
- 150000004645 aluminates Chemical class 0.000 claims description 3
- 239000003086 colorant Substances 0.000 abstract description 7
- 238000009877 rendering Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 130
- 230000007423 decrease Effects 0.000 description 32
- 239000000126 substance Substances 0.000 description 18
- 239000011230 binding agent Substances 0.000 description 16
- 239000002904 solvent Substances 0.000 description 15
- 238000000149 argon plasma sintering Methods 0.000 description 14
- 238000000295 emission spectrum Methods 0.000 description 14
- 230000004907 flux Effects 0.000 description 13
- 239000002994 raw material Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 239000012299 nitrogen atmosphere Substances 0.000 description 11
- 238000005245 sintering Methods 0.000 description 11
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 8
- 239000004014 plasticizer Substances 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 7
- 230000009849 deactivation Effects 0.000 description 6
- 229910052733 gallium Inorganic materials 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 229910052688 Gadolinium Inorganic materials 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910052706 scandium Inorganic materials 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 229910052727 yttrium Inorganic materials 0.000 description 5
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 229910018068 Li 2 O Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000004031 devitrification Methods 0.000 description 4
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 4
- -1 etc. are prepared Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 229910052863 mullite Inorganic materials 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 4
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 239000000156 glass melt Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- 229910003668 SrAl Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000004925 denaturation Methods 0.000 description 2
- 230000036425 denaturation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000003805 vibration mixing Methods 0.000 description 2
- 238000004017 vitrification Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- SIXWIUJQBBANGK-UHFFFAOYSA-N 4-(4-fluorophenyl)-1h-pyrazol-5-amine Chemical compound N1N=CC(C=2C=CC(F)=CC=2)=C1N SIXWIUJQBBANGK-UHFFFAOYSA-N 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- 101100476480 Mus musculus S100a8 gene Proteins 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- RLRMXWDXPLINPJ-UHFFFAOYSA-N dioctan-2-yl benzene-1,2-dicarboxylate Chemical compound CCCCCCC(C)OC(=O)C1=CC=CC=C1C(=O)OC(C)CCCCCC RLRMXWDXPLINPJ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 125000001905 inorganic group Chemical group 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
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- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
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- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
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Definitions
- the present invention relates to a phosphor composite member, an LED device, and a method for manufacturing a phosphor composite member for emitting fluorescence by irradiating excitation light and obtaining white light by synthesizing transmitted excitation light and fluorescence.
- LEDs Light Emitting Diodes
- RGB red, G: green, B: blue
- RGB red, G: green, B: blue
- Technology has been proposed.
- the light emission outputs of three color LEDs are usually different, it is difficult to obtain white light by adjusting the characteristics of each color LED.
- a uniform white light source cannot be obtained when the LEDs are viewed at close positions, for example, as a liquid crystal backlight. .
- the color deterioration speed of each color LED is different, there is a problem in the long-term stability of white light.
- an LED that combines a blue LED and a YAG phosphor (Y 3 A 15 O 12 ) that emits yellow fluorescence by blue light emitted from the blue LED has been developed (for example, , See Patent Document 1).
- white light can be obtained by synthesizing the yellow light emitted from the YAG phosphor and the transmitted light of the blue LED.
- the cost is low and the long-term stability of white light is excellent.
- the white LED has advantages such as long life, high efficiency, high stability, low power consumption, high response speed, and no environmental load substances compared to conventional light sources such as lighting devices. It has been applied to the LCD backlight of most mobile phones. In recent years, it has been rapidly spreading as a light source for liquid crystal backlights of televisions. In the future, in addition to this, it is expected that the application will be advanced to general lighting.
- the white LED disclosed in Patent Document 1 has a configuration in which the light emitting surface of an LED chip is molded with a phosphor powder dispersed in an organic binder resin.
- the organic binder resin deteriorates and causes discoloration due to high-output short-wavelength light in the blue to ultraviolet region, heat generation of the phosphor, or heat of the LED chip.
- the emission intensity is lowered and the color shift occurs and the life is shortened.
- the obtained white light is blue and yellow combined light, white light having a high color temperature (daylight color) can be obtained, but white light having a low color temperature (bulb color) cannot be obtained. There is also a problem. Furthermore, since the combined light is composed of two colors, the color rendering properties are low and it is not suitable for lighting applications.
- a phosphor composite member in which a glass sintered body layer containing an inorganic phosphor powder is formed on the surface of a ceramic substrate that emits fluorescence (see, for example, Patent Document 2). Since the phosphor composite member does not use an organic binder resin with poor heat resistance, it can suppress a decrease in light emission intensity over time, has high color rendering properties, and has various color temperatures from daylight to light bulb color. Corresponding white light can be obtained.
- SiO 2 —B 2 O 3 -based glass is used as the glass powder contained in the glass sintered body layer, and the ceramic substrate contains YAG crystals. A substrate is used. Since SiO 2 —B 2 O 3 based glass generally has a high melting point, a high firing temperature is required to form a glass sintered body layer (for example, 850 ° C. or higher). For this reason, depending on the phosphor used, the emission intensity may decrease due to thermal degradation during firing. Since the SiO 2 —B 2 O 3 glass has a low refractive index of about 1.6, the refractive index difference with the YAG substrate exceeding the refractive index of 1.8 is large, and light scattering loss tends to occur at the interface. As a result, the emission intensity of the white light obtained tends to decrease.
- an object of the present invention is to provide a phosphor composite member having excellent heat resistance, high color rendering properties, various chromaticity control properties from daylight colors to light bulb colors, and high emission intensity.
- the present inventors have a specific composition in a phosphor composite member formed by forming an inorganic powder sintered body layer containing glass powder and inorganic phosphor powder on the surface of a ceramic substrate that emits fluorescence.
- the present inventors have found that the above problems can be solved by using glass powder, and propose as the present invention.
- the first phosphor composite member according to the present invention is a phosphor in which an inorganic powder sintered body layer containing SnO—P 2 O 5 glass and inorganic phosphor powder is formed on the surface of a ceramic substrate.
- the ceramic composite member is characterized in that when the excitation light is irradiated, the ceramic substrate and the inorganic powder sintered body layer emit fluorescence having different wavelengths.
- the ceramic base material and the inorganic powder sintered body layer emit fluorescence having different wavelengths, and these lights are synthesized with the excitation light transmitted through the phosphor composite member. It has high color rendering properties and can emit white light corresponding to various color temperatures from daylight to light bulb.
- SnO—P 2 O 5 glass is used as a glass component constituting the inorganic powder sintered body layer.
- SnO—P 2 O 5 glass can be easily lowered in softening point by optimizing the composition, and the sintering temperature can be lowered. For this reason, deterioration of the inorganic fluorescent substance powder by the heat
- SnO—P 2 O 5 glass can achieve a refractive index as high as about 1.8 by optimizing the composition.
- a YAG ceramic substrate when used as the ceramic substrate, it is possible to substantially match the refractive index of the YAG ceramic substrate, and light scattering loss at the interface between the ceramic substrate and the inorganic powder sintered body layer is reduced. Can be reduced. As a result, since it can be set as the fluorescent substance composite member with high light emission intensity
- to glass refers to glass containing an explicit component as an essential component.
- the first phosphor composite member of the present invention may be characterized in that the ceramic substrate absorbs excitation light having a wavelength of 400 to 500 nm and emits fluorescence having a wavelength of 450 to 780 nm.
- the first phosphor composite member of the present invention may be characterized in that the ceramic base material absorbs blue excitation light and emits yellow fluorescence.
- the first phosphor composite member of the present invention may be characterized in that the ceramic substrate is made of a garnet crystal containing Ce 3+ in the crystal.
- the first phosphor composite member of the present invention may be characterized in that the garnet crystal is a YAG crystal or a YAG crystal solid solution.
- the first phosphor composite member of the present invention may be characterized in that the inorganic powder sintered body layer absorbs excitation light having a wavelength of 400 to 500 nm and emits fluorescence having a wavelength of 500 to 780 nm.
- the first phosphor composite member of the present invention may be characterized in that the inorganic powder sintered body layer absorbs blue excitation light and emits red and / or green fluorescence.
- blue light means light having a central wavelength at a wavelength of 430 to 480 nm
- green light means light having a central wavelength at a wavelength of 500 to 535 nm
- yellow light means light having a wavelength of 535 to 590 nm.
- the light having a central wavelength and the red light mean light having a central wavelength at a wavelength of 610 to 780 nm.
- the first phosphor composite member of the present invention is characterized in that the fluorescent light emitted from the ceramic base material and the inorganic powder sintered body layer and the excitation light transmitted through the phosphor composite member are combined to emit white light. It may be.
- the first phosphor composite member of the present invention may be characterized in that the inorganic powder sintered body layer contains 0.01 to 30% by mass of the inorganic phosphor powder.
- SnO—P 2 O 5 based glass is composed of SnO 35-80%, P 2 O 5 5-40%, and B 2 O 3 0- It may be characterized by containing 30%.
- the first phosphor composite member of the present invention may be characterized in that the inorganic powder sintered body layer has a surface roughness Ra of 0.5 ⁇ m or less.
- the first phosphor composite member of the present invention may be characterized by the scattering coefficient is 1 ⁇ 500 cm -1.
- the LED device according to the present invention is characterized by using any one of the phosphor composite members.
- a first method for producing a phosphor composite member according to the present invention is a method for producing any one of the above phosphor composite members, wherein a mixture of SnO—P 2 O 5 glass and inorganic phosphor powder is used.
- the manufacturing method is referred to as a “thermocompression pressing method” in distinction from the paste method and the green sheet method.
- thermocompression pressing method the inorganic powder sintered body layer is easily joined firmly to the ceramic substrate, and peeling at the interface can be suppressed.
- SnO-P 2 O 5 based glass mechanical strength is relatively weak, brittle. For this reason, it is difficult to form a very thin (for example, about 0.1 mm) inorganic powder sintered body layer by a general polishing method. On the other hand, when the thermocompression pressing method is used, a very thin inorganic powder sintered body layer can be easily formed.
- thermocompression pressing method can form an inorganic powder sintered body layer on a ceramic substrate without using an organic compound such as a solvent or a binder. It is possible to prevent the emission intensity from decreasing.
- the manufacturing method of the 2nd fluorescent substance composite member which concerns on this invention is the process of mounting the mixed powder containing glass powder and inorganic fluorescent substance powder on an inorganic base material, and heating using a metal mold
- the second method for producing a phosphor composite member according to the present invention an inorganic group is directly added to a mixed powder containing glass powder and inorganic phosphor powder without adding an organic resin, an organic solvent, or the like. Since it can be press-bonded to the surface of the material, there is no problem of a decrease in light emission intensity caused by a carbon component caused by an organic resin or an organic solvent. Therefore, it is possible to obtain a light emission color conversion member having excellent light emission intensity.
- the mixed powder can be used for press molding as it is, so that the manufacturing process can be simplified. It is also easy to form a very thin inorganic powder sintered body layer on the inorganic substrate surface.
- the inorganic base material is preferably YAG-based ceramics, crystallized glass, glass, metal, or a composite of metal and ceramics.
- the thickness of the inorganic powder sintered body layer is preferably 0.3 mm or less.
- the inorganic powder sintered body layer By thinning the inorganic powder sintered body layer, light scattering loss in the inorganic powder sintered body layer can be reduced, and as a result, the emission intensity of the phosphor composite member can be improved.
- the inorganic powder sintered body layer preferably has a surface roughness (Ra) of 0.5 ⁇ m or less.
- the average particle diameter of the glass powder (D 50) is 100 ⁇ m or less.
- the dispersed state of the inorganic phosphor powder in the phosphor composite member becomes favorable, and it becomes possible to suppress variations in the emission color.
- the ratio of the inorganic phosphor powder in the inorganic powder sintered body layer is preferably 0.01 to 90% by mass.
- the inorganic powder sintered body layer preferably contains 0 to 30% by mass of an inorganic filler.
- the glass powder is SiO 2 —B 2 O 3 —RO glass powder (R is one or more selected from Mg, Ca, Sr and Ba), SiO 2— TiO 2 —Nb 2 O 5 —R ′ 2 O glass powder (R ′ is one or more selected from Li, Na, K), SnO—P 2 O 5 glass powder, or ZnO—B 2 O 3 It is preferably —SiO 2 glass powder.
- SnO—P 2 O 5 based glass powder has a glass composition of mol%, SnO 35 to 80%, P 2 O 5 5 to 40% and B 2. It is preferable to contain 0 to 30% of O 3 .
- the inorganic phosphor powder is an oxide, nitride, oxynitride, sulfide, oxysulfide, oxyfluoride, halide, aluminate or halophosphorus.
- An acid chloride is preferred.
- the temperature during press molding is 900 ° C. or lower.
- the atmosphere during press molding is air, vacuum, nitrogen or argon.
- the phosphor composite member preferably has a plate shape, a hemispherical shape, or a hemispherical dome shape.
- the second phosphor composite member of the present invention is manufactured by any one of the manufacturing methods described above.
- FIG. 1 is a schematic view showing the phosphor composite member of the first embodiment.
- FIG. 2 is a schematic view showing a method for manufacturing the phosphor composite member of the second embodiment.
- FIG. 1 the schematic diagram of the fluorescent substance composite member of this embodiment is shown.
- an inorganic powder sintered body layer 11 containing SnO—P 2 O 5 glass and inorganic phosphor powder is formed on the surface of a ceramic substrate 12.
- the ceramic substrate 12 and the inorganic powder sintered body layer 11 emit fluorescence having different wavelengths when irradiated with excitation light.
- the ceramic substrate 12 absorbs light having a wavelength of 400 to 500 nm (preferably, blue light) when irradiated with excitation light, and has a wavelength of 450 to 780 nm. It is preferable to emit fluorescence of light (preferably yellow light).
- the inorganic powder sintered body layer 11 absorbs light having a wavelength of 400 to 500 nm (preferably, blue light) and emits light having a wavelength of 500 to 780 nm (preferably, red and / or green). preferable.
- white light (bulb color) having a low color temperature is easily obtained.
- Ce 2 O 3 in the ceramic substrate 12 is 0.001 to 1 mol%, 0.002 to 0.5 mol%, particularly 0.005 to It is preferable to use a garnet crystal containing 0.2 mol%.
- Ce 3+ becomes the emission center in the garnet crystal, absorbs blue excitation light, and easily emits yellow fluorescence. If the content of Ce 2 O 3 in the ceramic substrate 12 is too small, the yellow emission intensity tends to decrease, and as a result, it becomes difficult to obtain white light. On the other hand, when the content of Ce 2 O 3 is too large, yellow fluorescence becomes strong, and as a result, it becomes difficult to obtain white light.
- a YAG (Y 3 Al 5 O 12 ) crystal or a YAG crystal solid solution is particularly preferable because it emits a desired yellow fluorescence.
- YAG crystal solid solution a part of Y is substituted with at least one element selected from the group consisting of Gd, Sc, Ca and Mg, and / or a part of Al is Ga, Si, Ge and And those substituted with at least one element selected from the group consisting of Sc.
- the ceramic substrate 12 is preferably a plate having a thickness of 0.01 to 2 mm, 0.05 to 1 mm, particularly 0.1 to 0.5 mm.
- the inorganic powder sintered body layer 11 can be easily formed on the ceramic substrate 12. If the thickness of the ceramic substrate 12 becomes too thin, the amount of crystals in the ceramic substrate 12 will decrease, and sufficient yellow fluorescence will not be emitted, resulting in difficulty in obtaining white light. On the other hand, when the thickness of the ceramic substrate 12 becomes too thick, yellow light emission becomes strong, and as a result, it becomes difficult to obtain white light.
- the ceramic substrate 12 in the present embodiment can be produced, for example, by the following method.
- the oxide raw materials of A, B, and C are weighed so that the stoichiometric composition is as follows, and Ce 2 O 3 is added thereto in an amount of 0.001 to 1 mol%.
- the obtained powder is press-molded into a desired shape (for example, a plate shape) at a pressure of 100 to 300 MPa.
- the obtained press-molded body is fired at a temperature of 1500 to 1800 ° C. to obtain a ceramic substrate 12.
- a homogeneous ceramic base material 12 can be easily obtained by using a high-purity powder having a particle size of about several ⁇ m or less.
- the SnO—P 2 O 5 glass powder used for the inorganic powder sintered body layer 11 has a role as a medium for stably holding the inorganic phosphor powder. Since the SnO—P 2 O 5 glass powder has a low melting point and can be sintered at a low temperature, thermal deterioration of the inorganic phosphor powder during firing can be suppressed. Examples of the SnO—P 2 O 5 glass powder include SnO—P 2 O 5 —B 2 O 3 glass, SnO—P 2 O 5 —ZnO glass, and the like.
- the SnO—P 2 O 5 glass preferably contains SnO 35 to 80%, P 2 O 5 5 to 40% and B 2 O 3 0 to 30% in terms of mol% as a composition. .
- the reason for limiting the glass composition in this way will be described below.
- SnO is a component that forms a glass skeleton and lowers the softening point.
- the SnO content is preferably 35 to 80%, 40 to 70%, 50 to 70%, particularly 55 to 65%.
- the softening point of the glass tends to increase, and the weather resistance tends to deteriorate.
- the content of SnO exceeds 80%, devitrification bumps due to Sn are precipitated in the glass, and the transmittance of the glass tends to decrease, and as a result, the fluorescence intensity decreases. Moreover, it becomes difficult to vitrify.
- P 2 O 5 is a component that forms a glass skeleton.
- the content of P 2 O 5 is preferably 5 to 40%, 10 to 30%, particularly preferably 15 to 24%.
- the content of P 2 O 5 is less than 5%, vitrification becomes difficult.
- the content of P 2 O 5 exceeds 40%, the softening point of the glass tends to increase, and the weather resistance tends to decrease remarkably.
- the value of SnO / P 2 O 5 is 0.9 to 16, 1.5 to 16, 1.5 to 10, particularly in molar ratio. It is preferably 2 to 5.
- the value of SnO / P 2 O 5 is smaller than 0.9, the glass softening point tends to increase, and the sintering temperature tends to increase.
- the inorganic phosphor powder is likely to be deteriorated by heat treatment when forming the inorganic phosphor powder layer.
- B 2 O 3 is a component that improves the weather resistance of the glass and suppresses the reaction between the glass powder and the inorganic phosphor powder. It is also a component that stabilizes the glass. B 2 O content of 3 0-30%, 1-25%, 2-20%, it is preferred that particular from 4 to 18%. If the content of B 2 O 3 exceeds 30%, the weather resistance tends to decrease. Moreover, there exists a tendency for the softening point of glass to rise.
- SnO-P 2 O 5 based glass powder can be added the following components to other.
- Al 2 O 3 is a component that stabilizes the glass.
- the content of Al 2 O 3 is preferably 0 to 10%, 0 to 7%, particularly 1 to 5%.
- the content of Al 2 O 3 exceeds 10%, the glass softening point tends to increase, and the sintering temperature tends to increase.
- the inorganic phosphor powder is likely to be deteriorated by heat treatment when forming the inorganic phosphor powder layer.
- SiO 2 is a component that stabilizes the glass in the same manner as Al 2 O 3 .
- the content of SiO 2 is preferably 0 to 10%, 0 to 7%, particularly preferably 0.1 to 5%.
- the content of SiO 2 exceeds 10%, the softening point of the glass tends to increase, and the sintering temperature tends to increase.
- the inorganic phosphor powder is likely to be deteriorated by heat treatment when forming the inorganic phosphor powder layer. Moreover, it becomes easy to phase-separate glass.
- Li 2 O, Na 2 O and K 2 O is a component to lower the softening point of the glass.
- Their contents are preferably 0 to 10%, 0 to 7%, particularly preferably 0.1 to 5%, respectively. If the content of each of these components exceeds 10%, the glass becomes extremely unstable and becomes difficult to vitrify.
- the total amount of Li 2 O, Na 2 O and K 2 O is 0 to 10%, 0 to 7%, particularly preferably 1 to 5%. If the total amount of these components is more than 10%, the glass becomes unstable and it is difficult to vitrify.
- MgO, CaO, SrO, and BaO are components that stabilize glass and facilitate vitrification. Their contents are preferably 0 to 10%, 0 to 7%, particularly preferably 0.1 to 5%, respectively. If the content of these components exceeds 10%, the glass tends to devitrify and the transmittance tends to decrease. As a result, the emission intensity tends to decrease.
- the total amount of MgO, CaO, SrO and BaO is preferably 0 to 10%, 0 to 7%, particularly 1 to 5%. If the total amount of these components exceeds 10%, the glass tends to devitrify and the transmittance tends to decrease. As a result, the emission intensity tends to decrease.
- ZnO, Ta 2 O 5 , TiO 2 , Nb 2 O 5 , Gd 2 O 3 , and La 2 O 3 may be added up to 10% in total.
- the refractive index (nd) of the SnO—P 2 O 5 glass powder is 1.5 or more, 1.7 or more from the viewpoint of suppressing light scattering loss at the interface between the ceramic substrate and the inorganic powder sintered body layer 11. In particular, it is preferably 1.8 or more.
- the softening point of SnO—P 2 O 5 glass powder is preferably 500 ° C. or lower, 450 ° C. or lower, and particularly preferably 400 ° C. or lower.
- the softening point exceeds 500 ° C., the sintering temperature becomes high, and the inorganic phosphor powder tends to be deteriorated by heat treatment when forming the inorganic phosphor powder layer.
- the average particle diameter D 50 of the SnO—P 2 O 5 glass powder is preferably 100 ⁇ m or less, particularly preferably 50 ⁇ m or less.
- the lower limit is not particularly limited, but if the average particle diameter D 50 of the SnO—P 2 O 5 glass powder becomes too small, the cost is likely to rise, so it is 0.1 ⁇ m or more, particularly 1 ⁇ m or more. Is preferred.
- the inorganic phosphor powder contained in the inorganic powder sintered body layer 11 can be used as long as it is generally available in the market, and can be used as an oxide, nitride, oxynitride, sulfide, oxysulfide, oxyfluoride. , Halides, halophosphates, and the like. Of these, those having an excitation band at a wavelength of 300 to 500 nm and having an emission peak at a wavelength of 500 to 780 nm, particularly those emitting light in red and / or green are preferably used.
- inorganic phosphor powder that emits red fluorescence when irradiated with blue excitation light
- CaS Eu 2+ , ZnS: Mn 2+ , Te 2+ , Mg 2 TiO 4 : Mn 4+ , K 2 SiF 6 : Mn 4+
- SrS Eu 2+ , Na 1.23 K 0.42 Eu 0.12 TiSi4 4 O 11 , Na 1.23 K 0.42 Eu 0.12 TiSi 5 O 13 : Eu 3+
- CdS In, Te
- CaAlSiN 3 Eu 2+
- CaSiN 3 Eu 2+
- (Ca, Sr) 2 Si 5 N 8 Eu 2+ , Eu 2 W 2 O 7 .
- an inorganic phosphor powder that emits green fluorescence when irradiated with blue excitation light SrAl 2 O 4 : Eu 2+ , SrGa 2 S 4 : Eu 2+ , SrBaSiO 4 : Eu 2+ , CdS: In, CaS: Ce 3+ , Y 3 (Al, Gd) 5 O 12 : Ce 2+ , Ca 3 Sc 2 Si 3 O 12 : Ce 3+ , SrSiO N : Eu 2+ .
- the content of the inorganic phosphor powder in the inorganic powder sintered body layer 11 is preferably 0.01 to 30% by mass, 0.05 to 20% by mass, and particularly preferably 0.08 to 15%.
- the inorganic powder sintered body layer 11 preferably has a thickness of 0.01 to 1 mm, 0.02 to 0.8 mm, particularly 0.1 to 0.8 mm.
- the thickness of the inorganic powder sintered body layer 11 is less than 0.01 mm, the fluorescence emitted from the inorganic powder sintered body layer 11 becomes insufficient, and it becomes difficult to obtain white light.
- the thickness of the inorganic powder sintered body layer 11 exceeds 1 mm, excitation light and fluorescence emitted from the ceramic substrate are difficult to transmit, and as a result, white light is hardly obtained.
- the inorganic powder sintered compact layer 11 may be formed only in the single side
- the scattering coefficient is preferably 1 to 500 cm ⁇ 1 , 2 to 250 cm ⁇ 1 , particularly 10 to 200 cm ⁇ 1 .
- the scattering coefficient is less than 1 cm ⁇ 1 , excitation light is not sufficiently scattered in the phosphor composite member, and most of it is transmitted. As a result, sufficient fluorescence is not emitted in the ceramic substrate and the inorganic powder sintered body layer 11 and the excitation efficiency is lowered, so that the emission intensity is likely to be lowered.
- the scattering coefficient is increased, the excitation light is scattered in the phosphor composite member to increase the amount of fluorescence generated and the excitation efficiency is improved.
- the scattering coefficient exceeds 500 cm ⁇ 1 , the light scattering loss increases. Too much, the emission intensity tends to decrease.
- the surface roughness Ra of the inorganic powder sintered body layer 11 is preferably 0.5 ⁇ m or less, 0.2 ⁇ m or less, and particularly preferably 0.1 ⁇ m or less.
- the surface roughness of the inorganic powder sintered body layer 11 exceeds 0.5 ⁇ m, the light scattering loss increases, the transmittance of excitation light and fluorescence tends to decrease, and the emission intensity tends to decrease.
- the inorganic powder sintered body layer 11 is not formed between the ceramic base 12 and the inorganic powder sintered body layer 11 without interposing an adhesive layer or a space layer. It is preferable that they are brought into close contact by being fused and integrated on the material 12.
- the light reflection loss at the interface between the ceramic substrate 12 and the inorganic powder sintered body layer 11 is reduced. A decrease in emission intensity can be suppressed, and mechanical strength can be improved.
- this makes it possible to produce the phosphor composite member of this embodiment without using an organic resin adhesive that causes discoloration due to heat.
- ⁇ It is preferable that 5 ppm / ° C. ⁇ ⁇ 1 ⁇ 2 ⁇ 5 ppm / ° C., particularly ⁇ 1 ppm / ° C. ⁇ ⁇ 1 ⁇ 2 ⁇ 1 ppm / ° C.
- ⁇ 1- ⁇ 2 is out of the above range, the inorganic powder sintered body layer 11 is easily peeled off from the ceramic substrate 12.
- the inorganic powder sintered body layer 11 preferably contains an inorganic filler powder.
- the inorganic filler powder include zirconium phosphate, zirconium phosphate tungstate, zirconium tungstate, NZP type crystals and solid solutions thereof having low expansion characteristics, and these can be used alone or in combination.
- the “NZP type crystal” includes, for example, a crystal having a basic structure of NbZr (PO 4 ) 3 or [AB 2 (MO 4 ) 3 ].
- A Li, Na, K, Mg, Ca, Sr, Ba, Zn, Cu, Ni, Mn, etc.
- B Zr, Ti, Sn, Nb, Al, Sc, Y, etc.
- M P, Si, W, Mo, etc.
- inorganic filler powder containing a Zr component it is preferable to use the inorganic filler powder containing a Zr component.
- the thermal expansion coefficient of the inorganic filler powder is preferably 50 ⁇ 10 ⁇ 7 / ° C. or lower, particularly 30 ⁇ 10 ⁇ 7 / ° C. or lower in the temperature range of 30 to 380 ° C.
- the thermal expansion coefficient of the inorganic filler powder is larger than 50 ⁇ 10 ⁇ 7 / ° C., it is difficult to obtain the effect of reducing the thermal expansion coefficient of the inorganic powder sintered body layer 11.
- the lower limit of the thermal expansion coefficient of the inorganic filler powder is not particularly limited, but in reality, it is ⁇ 100 ⁇ 10 ⁇ 7 / ° C. or higher.
- the content of the inorganic filler powder in the inorganic powder sintered body layer 11 is preferably 1 to 30% by mass, 1.5 to 25% by mass, and particularly preferably 2 to 20% by mass.
- the said effect is hard to be acquired as content of an inorganic filler powder is less than 1 mass%.
- the content of the inorganic filler powder exceeds 30% by mass, the content of the glass powder that softens and flows at the time of firing becomes relatively small, so that the fusion strength with respect to the ceramic substrate 12 tends to decrease.
- the light scattering loss at the interface between the glass matrix and the inorganic filler powder in the inorganic powder sintered body layer 11 tends to increase, and the light emission intensity tends to decrease.
- the average particle diameter D 50 of the inorganic filler powder is preferably 0.1 to 50 ⁇ m, particularly 3 to 20 ⁇ m.
- the average particle diameter D 50 of the inorganic filler powder is smaller than 0.1 ⁇ m, the effect of reducing the thermal expansion coefficient tends to be inferior. Alternatively, it may be dissolved in the glass during firing and no longer serve as a filler. If the average particle diameter D 50 of the inorganic filler powder is larger than 50 ⁇ m, cracks are likely to occur at the boundary between the SnO—P 2 O 5 glass powder and the inorganic filler powder.
- the difference between the refractive index of the inorganic filler powder and the SnO—P 2 O 5 glass powder is preferably 0.2 or less, particularly preferably 0.1 or less.
- the refractive index of the inorganic filler powder is preferably 1.6 to 2, particularly 1.7 to 1.9.
- the inorganic powder sintered body layer 11 was kneaded by adding a binder, a plasticizer, a solvent, etc. to a mixture containing SnO—P 2 O 5 glass powder and inorganic phosphor powder, and further, if necessary, an inorganic filler.
- a thing can be produced by baking in the form of a paste, for example.
- the ratio of the glass powder and the inorganic phosphor powder in the entire paste is generally about 30 to 90% by mass.
- the binder is a component that increases the film strength after drying and imparts flexibility, and its content is generally about 0.1 to 20% by mass.
- the binder include polybutyl methacrylate, polyvinyl butyral, polymethyl methacrylate, polyethyl methacrylate, ethyl cellulose, nitrocellulose, and the like, and these can be used alone or in combination.
- the plasticizer is a component that controls the drying speed of the film and imparts flexibility to the dried film, and the content thereof is generally about 0 to 10% by mass.
- the plasticizer include dibutyl phthalate, butyl benzyl phthalate, dioctyl phthalate, diisooctyl phthalate, dicapryl phthalate, and dibutyl phthalate, and these can be used alone or in combination.
- Solvent is a component for pasting raw material powder, and its content is generally about 10 to 50% by mass.
- Solvents include terpineol, isoamyl acetate, toluene, methyl ethyl ketone, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate, 2,4-diethyl-1,5-pentanediol, etc. These can be used alone or in combination.
- a paste is applied on the ceramic substrate 12 using a screen printing method, a batch coating method, a dispensing method, etc., a coating layer having a predetermined thickness is formed, dried, and then fired to obtain a predetermined inorganic powder firing.
- the consolidated layer 11 can be obtained.
- the inorganic powder sintered body layer 11 may be formed by pressing and pressing a heating plate over the paste.
- the firing temperature is preferably 250 to 600 ° C., particularly 300 to 500 ° C.
- the firing temperature is less than 250 ° C.
- the inorganic powder sintered body layer 11 is easily peeled off from the ceramic substrate 12.
- the firing temperature exceeds 600 ° C., the inorganic phosphor powder reacts with the glass powder and deteriorates, making it difficult to obtain a phosphor composite member that emits desired light.
- the firing atmosphere is preferably a reduced pressure or vacuum or an inert gas atmosphere such as nitrogen or argon in order to suppress oxidation in the glass powder, particularly oxidation of the Sn component.
- an inert gas atmosphere such as nitrogen or argon
- the inorganic powder sintered body layer 11 can also be produced using a green sheet.
- a green sheet As a general method for producing a green sheet, the above glass powder, inorganic phosphor powder, binder, plasticizer, etc. are prepared, and a solvent is added to these to form a slurry. This slurry is obtained by a doctor blade method. Then, a sheet is formed on a film of polyethylene terephthalate (PET) or the like. Subsequently, after forming the sheet, the organic solvent or the like is removed by drying to obtain a green sheet.
- PET polyethylene terephthalate
- the proportion of glass powder and inorganic phosphor powder in the green sheet is generally about 50 to 80% by mass.
- the mixing ratio of the binder is generally about 0.1 to 30% by mass
- the mixing ratio of the plasticizer is about 0 to 10% by mass
- the mixing ratio of the solvent is generally about 1 to 40% by mass.
- the inorganic powder sintered body layer 11 can be obtained by laminating the green sheet obtained as described above on the ceramic substrate 12 and thermocompression bonding, followed by firing in the same manner as in the case of the paste described above.
- a sintered body is prepared in advance by firing a mixture of SnO—P 2 O 5 glass and inorganic phosphor powder, and the sintered body is pressed onto the ceramic substrate 12 by thermocompression bonding. It is also possible to form the combined layer 11.
- the thermocompression pressing is performed, for example, by sandwiching the ceramic substrate 12 and the sintered body between heated dies. You may perform a thermocompression-bonding press in the state which inserted mold release materials, such as a glass substrate, between a metal mold
- the press temperature may be a temperature at which SnO—P 2 O 5 glass can be sufficiently softened and fixed to the surface of the ceramic substrate 12. Specifically, it is preferably 200 ° C. or higher, particularly 250 ° C. or higher.
- the upper limit is not particularly limited, but is preferably 900 ° C. or lower, 700 ° C. or lower, particularly 500 ° C. or lower from the viewpoint of preventing the deactivation of the inorganic phosphor powder and the modification of SnO—P 2 O 5 glass.
- the pressing pressure is appropriately adjusted in the range of 30 kPa / cm 2 or more and 50 kPa / cm 2 or more depending on the thickness of the target inorganic powder sintered body layer 11.
- the upper limit is not particularly limited, to prevent damage to the phosphor composite member, 400 kPa / cm 2 or less, it is preferable that the particular 300 kPa / cm 2 or less.
- the pressing time is not particularly limited, but is suitably adjusted in 0.1 to 30 minutes, 0.5 to 10 minutes, particularly 1 to 5 minutes so that the inorganic powder sintered body layer 11 is sufficiently fixed to the surface of the ceramic substrate 12. do it.
- the atmosphere at the time of thermocompression pressing considers the inert gas atmosphere, especially the running cost, in order to suppress the deactivation of the inorganic phosphor powder, the modification of SnO—P 2 O 5 glass, and the deterioration due to the oxidation of the press device.
- a nitrogen atmosphere is preferable.
- the phosphor composite member of this embodiment may be produced by fusing and integrating.
- the phosphor composite member produced as described above may be cut and polished to be processed into an arbitrary shape, for example, a disc shape, a column shape, a rod shape, or the like. (Example)
- Example 1 (1) Preparation of ceramic substrate First, using a raw material having a high purity and a particle size of 2 ⁇ m or less, Y 2 O in mol% so as to have a stoichiometric composition of YAG (Y 3 Al 5 O 12 ). 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid. Next, using a ball mill, the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried under reduced pressure to obtain a powder.
- YAG Y 3 Al 5 O 12
- 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid.
- the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried
- the obtained powder was press-molded at a pressure of 200 MPa to produce a press-molded body having a diameter of 10 mm ⁇ and a thickness of 3 mm, and this was fired at 1750 ° C. for 10 hours in a vacuum atmosphere to obtain a fired body. It was. Then, the ceramic base material was obtained by carrying out double-side polishing of the fired body so that it might become a thickness of 0.1 mm.
- the emission spectrum was measured as follows. Inside the calibrated integrating sphere, the ceramic substrate is excited by a blue LED lit at a current of 600 mA, the emitted light is taken into a small spectroscope (Ocean Optics USB-4000) through an optical fiber, and the emission spectrum (on the control PC) Energy distribution curve).
- a blue LED lit at a current of 600 mA the emitted light is taken into a small spectroscope (Ocean Optics USB-4000) through an optical fiber, and the emission spectrum (on the control PC) Energy distribution curve).
- CaS: Eu 2+ as an inorganic phosphor powder and NbZr (PO 4 ) 3 as an inorganic filler powder are added at a mass ratio of 80:10:10 to the produced glass powder, and vibration mixing is performed.
- a paste is obtained by adding 50 parts by mass of 2,4-diethyl-1,5-pentanediol (MARS manufactured by Nippon Kayaku Yakuhin Co., Ltd.) as a solvent to 100 parts by mass of the obtained mixed powder. It was.
- An inorganic powder sintered body layer was prepared using the above paste, and the emission spectrum was measured. As a result, red fluorescence having a center near a wavelength of 650 nm and a peak due to blue excitation light having a center near a wavelength of 465 nm were observed. .
- the inorganic powder sintered compact layer for light emission spectrum measurement was produced as follows. First, it apply
- the paste for the inorganic powder sintered body layer obtained in (2) is about 50 ⁇ m thick by the dispensing method. It was applied as follows. Next, the solvent was removed by heat treatment on a hot plate at about 250 ° C. Then, it baked at 430 degreeC for 10 minute (s) in nitrogen atmosphere, and also hot-pressed from on the inorganic powder sintered compact layer, the surface shape was adjusted, and the fluorescent substance composite member was obtained. The thickness of the inorganic powder sintered body layer was about 20 ⁇ m.
- the emission spectrum of the phosphor composite member thus obtained was measured by the above method. Using control software (OP Wave manufactured by Ocean Photonics), a total luminous flux value (lm) and chromaticity were calculated from the emission spectrum. The results are shown in Table 1.
- Example 2 (1) Production of Green Sheet for Inorganic Powder Sintered Body Layer
- SrS: Eu 2+ (average particle size: 8 ⁇ m) and SrBaSiO 4 : Eu 2+ (average particle) (Diameter: 8 ⁇ m) was added at a mass ratio of 94: 3: 3 and mixed to prepare a mixed powder.
- 12 parts by mass of polyvinyl butyral resin as a binder, 3 parts by mass of dibutyl phthalate as a plasticizer, and 40 parts by mass of toluene as a solvent are added to 100 parts by mass of the prepared mixed powder, and the slurry is mixed. Produced. Subsequently, the slurry was formed into a sheet on a PET film by a doctor blade method and dried to obtain a green sheet having a thickness of 50 ⁇ m.
- the inorganic powder sintered compact layer for light emission spectrum measurement was produced as follows. First, the green sheet produced by the above method was laminated on a porous mullite ceramic substrate and integrated by thermocompression bonding to produce a laminate, and then degreased at 300 ° C. for 1 hour. Subsequently, after baking at 400 degreeC for 30 minutes, it cooled and the mullite board
- Example 3 (1) Production of sintered body for inorganic powder sintered body layer
- CaAlSiN 3 : Eu 2+ was used as the inorganic phosphor powder
- NbZr (PO 4 ) 3 was used as the inorganic filler powder.
- the mixed powder was press-molded and fired at 400 ° C. in a vacuum to obtain a sintered body.
- red fluorescence having a center near a wavelength of 650 nm and a peak due to blue excitation light having a center near a wavelength of 465 nm were observed.
- the sample for measuring the emission spectrum was prepared by grinding the sintered body to 8 mm square, cutting it to a thickness of 1 mm, and mirror polishing both sides.
- CaS: Eu 2+ as an inorganic phosphor powder and NbZr (PO 4 ) 3 as an inorganic filler powder are added at a mass ratio of 80:10:10 to the produced glass powder, and vibration mixing is performed.
- a paste is obtained by adding 50 parts by mass of 2,4-diethyl-1,5-pentanediol (MARS manufactured by Nippon Kayaku Yakuhin Co., Ltd.) as a solvent to 100 parts by mass of the obtained mixed powder. It was.
- the phosphor composite members of Examples 1 and 2 are capable of obtaining light bulb-colored white light and a high emission intensity of 18.3 lm or more.
- the emission intensity was as low as 10.4 lm.
- the white LED disclosed in Patent Document 3 has a configuration in which a light emitting surface of an LED chip is coated with a mold in which an inorganic phosphor powder is dispersed in an organic binder resin.
- the organic binder resin deteriorates and causes discoloration due to high-output short-wavelength light in the blue to ultraviolet region, heat generation of the inorganic phosphor powder, or heat of the LED chip. As a result, there is a problem in that the emission intensity is lowered and the color shift occurs and the life is shortened.
- Patent Document 4 a phosphor composite member obtained by mixing and sintering inorganic phosphor powder and glass powder has been proposed (see, for example, Patent Document 4). Since the phosphor composite member is formed by dispersing the inorganic phosphor powder in an inorganic glass powder having high heat resistance, it is possible to suppress a decrease in emission intensity over time.
- Patent Document 4 in order to obtain a phosphor composite member having a desired size, a cutting and polishing process is required. For example, in order to obtain a thin phosphor composite member, the inorganic phosphor powder and the glass powder are once sintered to produce a relatively thick member, and then the member is cut and polished to reduce the thickness. There is a need. Therefore, in this production method, the material yield of the inorganic phosphor powder and the glass powder is poor, and as a result, the production cost of the phosphor composite member tends to increase.
- a phosphor composite member has been proposed in which a glass sintered body layer containing an inorganic phosphor powder is formed on the surface of an inorganic substrate (see, for example, Patent Document 5 or 6).
- the phosphor composite member is formed by forming a sintered body layer containing an inorganic phosphor powder on an inorganic substrate by a paste method or a green sheet method. Therefore, a thin phosphor composite member can be produced without going through steps such as cutting and polishing.
- a light emitting color conversion member having a desired shape can be manufactured with a high yield, but there is a problem that the light emission intensity of the member is low.
- the manufacturing process of the paste and the green sheet is required, there is a problem that the manufacturing process is complicated.
- an object of the present embodiment is to provide a method for easily manufacturing a phosphor composite member having higher emission intensity than the conventional one.
- FIG. 1 the schematic diagram of the manufacturing method of the fluorescent substance composite member of 2nd Embodiment is shown.
- the inorganic base material 2 is allowed to stand on the lower mold 3b, and a predetermined amount of the mixed powder 1 containing the inorganic phosphor powder and the glass powder is placed on the inorganic base material 2. To do.
- the mixed powder 1 is heated using the upper mold 3 a while being pressed to sinter the mixed powder 1.
- the fluorescent substance composite member 5 by which the inorganic powder sintered compact layer 4 was formed on the inorganic base material 2 is obtained.
- the heating method is not particularly limited, and pressing may be performed using a mold heated to a predetermined temperature, or pressing may be performed in an atmosphere set at a predetermined temperature (for example, in an electric furnace).
- SiO 2 —B 2 O 3 —RO-based glass powder (R is one or more selected from Mg, Ca, Sr and Ba), SiO 2 —TiO 2 —Nb 2 O 5 —R ′ 2 O glass powder (R ′ is one or more selected from Li, Na, K), SnO—P 2 O 5 glass powder, or ZnO—B 2 O 3 —SiO 2 glass powder.
- R is one or more selected from Mg, Ca, Sr and Ba
- SiO 2 —TiO 2 —Nb 2 O 5 —R ′ 2 O glass powder (R ′ is one or more selected from Li, Na, K)
- SnO—P 2 O 5 glass powder or ZnO—B 2 O 3 —SiO 2 glass powder.
- SnO—P 2 O 5 glass powder having a relatively low softening point is preferable because the press molding temperature is lowered and the deactivation of the inorganic phosphor powder can be suppressed.
- the SnO—P 2 O 5 glass powder preferably contains SnO 35 to 80%, P 2 O 5 5 to 40%, and B 2 O 3 0 to 30% in terms of glass composition. The reason for limiting the glass composition in this way will be described below.
- SnO is a component that forms a glass skeleton and lowers the softening point.
- the SnO content is preferably 35 to 80%, 40 to 70%, 50 to 70%, particularly 55 to 65%.
- SnO When there is too little content of SnO, it exists in the tendency for the softening point of glass to rise, and there exists a tendency for a weather resistance to deteriorate.
- the content of SnO is too large, devitrification bumps resulting from Sn are deposited in the glass and the transmittance tends to decrease, and as a result, the emission intensity of the phosphor composite member 5 tends to decrease. . Moreover, it becomes difficult to vitrify.
- P 2 O 5 is a component that forms a glass skeleton.
- the content of P 2 O 5 is preferably 5 to 40%, 10 to 30%, particularly preferably 15 to 24%.
- the content of P 2 O 5 is too small, it is difficult to vitrify.
- the content of P 2 O 5 is too large, or the softening point rises, there is a tendency that weather resistance is significantly lowered.
- B 2 O 3 is a component that improves the weather resistance and suppresses the reaction between the glass powder and the inorganic phosphor powder. It is also a component that stabilizes the glass.
- the content of B 2 O 3 is preferably 0 to 30%, 1 to 25%, 2 to 20%, particularly 4 to 18%. If the B 2 O 3 content is too large, the weather resistance tends to lower. Also, the softening point tends to increase.
- the glass composition is mass%, SiO 2 30 to 70%, B 2 O 3 1 to 15%, MgO 0 to 10%, CaO 0 to 25%, Preferred are those containing SrO 0-10%, BaO 8-40%, MgO + CaO + SrO + BaO 10-45%, Al 2 O 3 0-20% and ZnO 0-10%.
- the SiO 2 —TiO 2 —Nb 2 O 5 —R ′ 2 O-based glass powder includes, as a mass percentage, SiO 2 20 to 50%, Li 2 O 0 to 10%, Na 2 O 0 to 15%, K 2. O 0-20%, Li 2 O + Na 2 O + K 2 O 1-30%, B 2 O 3 1-20%, MgO 0-10%, CaO 0-20%, SrO 0-20%, BaO 0-15% Al 2 O 3 0-20%, ZnO 0-15%, TiO 2 0.01-20%, Nb 2 O 5 0.01-20%, La 2 O 3 0-15% and TiO 2 + Nb 2 O 5 + La 2 O 3 1-30% is preferred.
- the ZnO—B 2 O 3 —SiO 2 -based glass powder preferably contains ZnO 5 to 60%, B 2 O 3 5 to 50% and SiO 2 2 to 30% by mass% as a glass composition.
- the average particle diameter (D 50 ) of the glass powder is preferably 100 ⁇ m or less, particularly preferably 50 ⁇ m or less.
- the lower limit is not particularly limited, but if the average particle size of the glass powder is too small, the production cost is likely to increase, so that it is preferably 0.1 ⁇ m or more, particularly 1 ⁇ m or more.
- average particle diameter (D 50 ) refers to a value measured by a laser diffraction method.
- the difference in refractive index between the two is small.
- the refractive index (nd) of the glass powder is preferably 1.5 or more, 1.7 or more, particularly 1.8 or more.
- the softening point of the glass powder is preferably 500 ° C. or lower, 450 ° C. or lower, and particularly preferably 400 ° C. or lower. If the softening point is too high, the sintering temperature becomes high and the inorganic phosphor powder tends to deteriorate.
- Examples of the inorganic phosphor powder include oxides, nitrides, oxynitrides, sulfides, oxysulfides, oxyfluorides, halides, aluminates, and halophosphates. Of these, those having an excitation band at a wavelength of 300 to 500 nm and having an emission peak at a wavelength of 500 to 780 nm, particularly those emitting light in red, yellow or green are preferably used.
- CaS: Eu 2+ , SrS: Eu 2+ , CaAlSiN 3 : Eu 2+ , CaSiN 3 : Eu 2+ , (Ca, Sr) 2 Si 5 N 8 : Eu 2+ and the like can be mentioned.
- the content of the inorganic phosphor powder in the inorganic powder sintered body layer 4 is preferably 0.01 to 90% by mass, 0.05 to 30% by mass, and particularly preferably 0.08 to 15%.
- content of glass powder there exists a tendency for content of glass powder to decrease relatively and for porosity to become large.
- the strength of the inorganic powder sintered body layer 4 decreases and the light scattering loss increases.
- an inorganic filler powder may be added to the mixed powder 1 (inorganic powder sintered body layer 4).
- a glass powder having a large thermal expansion coefficient such as SnO—P 2 O 5 glass powder
- the difference in thermal expansion coefficient between the inorganic base material 2 and the inorganic powder sintered body layer 4 is increased, resulting in an inorganic Since the surface of the powder sintered body layer 4 is easily cracked or peeled off, it is effective to add an inorganic filler powder having low expansion characteristics.
- the inorganic filler powder examples include zirconium phosphate, zirconium phosphate tungstate, zirconium tungstate, NZP type crystals and solid solutions thereof having low expansion characteristics, and these may be used alone or in combination. it can.
- the “NZP type crystal” includes, for example, a crystal having a basic structure of NbZr (PO 4 ) 3 or [AB 2 (MO 4 ) 3 ].
- A Li, Na, K, Mg, Ca, Sr, Ba, Zn, Cu, Ni, Mn, etc.
- B Zr, Ti, Sn, Nb, Al, Sc, Y, etc.
- M P, Si, W, Mo, etc.
- the inorganic filler powder containing a Zr component it is preferable to use the inorganic filler powder containing a Zr component.
- Inorganic filler powder containing Zr component compatibility with SnO-P 2 O 5 based glass is satisfactory, i.e. low reactivity with the SnO-P 2 O 5 based glass, a glass powder was devitrification during press molding This is because it has difficult properties.
- the content of the inorganic filler powder in the sintered inorganic powder layer 4 is preferably 0 to 30% by mass, 1.5 to 25% by mass, and particularly preferably 2 to 20% by mass.
- content of glass powder will decrease relatively and it will become easy to reduce mechanical strength.
- light scattering loss at the interface between the glass matrix and the inorganic filler powder increases, and the light emission intensity tends to decrease.
- the thermal expansion coefficient of the inorganic filler powder is preferably 50 ⁇ 10 ⁇ 7 / ° C. or lower, particularly 30 ⁇ 10 ⁇ 7 / ° C. or lower in the temperature range of 30 to 380 ° C. If the thermal expansion coefficient of the inorganic filler powder is too large, it is difficult to obtain the effect of reducing the thermal expansion coefficient of the inorganic powder sintered body layer 4.
- the lower limit of the thermal expansion coefficient of the inorganic filler powder is not particularly limited, but in reality, it is ⁇ 100 ⁇ 10 ⁇ 7 / ° C. or higher.
- the average particle diameter (D 50 ) of the inorganic filler powder is preferably 0.1 to 50 ⁇ m, particularly 3 to 20 ⁇ m. If the average particle size of the inorganic filler powder is too small, the effect of reducing the thermal expansion coefficient of the inorganic powder sintered body layer 4 tends to be inferior. Alternatively, it may be dissolved in the glass powder at the time of press molding and may not serve as a filler. If the average particle size of the inorganic filler powder is too large, cracks are likely to occur at the boundary between the glass powder and the inorganic filler powder.
- the thermal expansion coefficient of the inorganic base material 2 is ⁇ 1, and the thermal expansion coefficient of the inorganic powder sintered body layer 4 is ⁇ 2.
- Examples of the inorganic substrate 2 include YAG-based ceramics, crystallized glass, glass, metal, or a composite of metal and ceramic.
- the YAG ceramics can be used regardless of whether they are transparent or translucent.
- white light can be obtained by a combination of transmitted light of excitation light and fluorescence emitted from the inorganic phosphor powder. Is possible.
- a reflective phosphor composite member can be obtained as the inorganic base material 2, by using a metal or a composite of metal and ceramics.
- the metal include Al, Cu, and Ag.
- the composite of metal and ceramic include a composite (sintered body) of Al and SiC or AlN.
- a reflective layer (not shown) such as Ag or Al may be provided on the interface between the inorganic base material 2 and the inorganic powder sintered body 4 as necessary.
- Metals and composites of metals and ceramics are excellent in thermal conductivity, so it is possible to efficiently dissipate heat generated from phosphors when exposed to high-intensity excitation light such as blue LD. Temperature quenching of the phosphor powder can be reduced.
- the thickness of the inorganic substrate 2 is not particularly limited, but is preferably 0.1 to 10.0 mm, for example. If the thickness of the inorganic substrate 2 is too small, the mechanical strength tends to be insufficient. On the other hand, when the thickness of the inorganic base material 2 is too large, the excitation light is difficult to transmit, and the light emission efficiency tends to decrease, or the weight of the phosphor composite member 5 tends to be unreasonably large.
- the press temperature is preferably 900 ° C. or lower, 700 ° C. or lower, particularly 500 ° C. or lower, from the viewpoint of preventing the deactivation of the inorganic phosphor powder and the glass denaturation.
- the lower limit is preferably 200 ° C. or higher, particularly 250 ° C. or higher.
- Pressing pressure depending on the thickness of the inorganic powder sintered body layer 4 for the purpose, 1N / mm 2 or more, particularly suitably adjusted 3N / mm 2 or more.
- an upper limit is not specifically limited, In order to prevent the damage of the inorganic base material 2, it is preferable to set it as 100 N / mm ⁇ 2 > or less, especially 50 N / mm ⁇ 2 > or less.
- the pressing time is not particularly limited, but is appropriately adjusted for 0.1 to 30 minutes, 0.5 to 10 minutes, particularly 1 to 5 minutes so that the inorganic powder sintered body layer 4 is sufficiently fixed to the surface of the inorganic substrate 2. do it.
- the atmosphere at the time of press molding includes air, vacuum, nitrogen or argon.
- air in order to suppress the deactivation of the inorganic phosphor powder, the modification of the glass powder, and the deterioration due to the oxidation of the press mold, it should be an inert gas such as nitrogen or argon, especially considering the running cost. Is preferred.
- the thickness of the inorganic powder sintered body layer 4 is preferably 0.3 mm or less, 0.25 mm or less, particularly preferably 0.2 mm or less.
- the thickness of the inorganic powder sintered body layer 4 is too large, the excitation light is hardly transmitted, and it becomes difficult to obtain light having a desired color.
- the thickness of the inorganic powder sintered body layer 4 is too small, the mechanical durability tends to be insufficient, so the lower limit is 0.01 mm or more, 0.03 mm or more, particularly 0.05 mm or more. Is preferred.
- the surface roughness (Ra) of the inorganic powder sintered body layer 4 is preferably 0.5 ⁇ m or less, 0.2 ⁇ m or less, particularly preferably 0.1 ⁇ m or less.
- the surface roughness of the inorganic powder sintered body layer 4 is too large, the light scattering loss increases, and the transmittance of excitation light and fluorescence tends to decrease and the emission intensity tends to decrease.
- the shape of the phosphor composite member 5 is not particularly limited, and examples thereof include a plate shape, a hemispherical shape, and a hemispherical dome shape. (Example)
- Example 4 (1) Preparation of ceramic substrate First, using a raw material having a high purity and a particle size of 2 ⁇ m or less, Y 2 O in mol% so as to have a stoichiometric composition of YAG (Y 3 Al 5 O 12 ). 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid. Next, using a ball mill, the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried under reduced pressure to obtain a powder.
- YAG Y 3 Al 5 O 12
- 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid.
- the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried
- the obtained powder was press-molded at a pressure of 200 MPa to produce a press-molded body having a diameter of 10 mm and a thickness of 3 mm, and this was fired at 1750 ° C. in a vacuum atmosphere for 10 hours to obtain a sintered body. Obtained.
- the ceramic base material was obtained by carrying out double-side polish so that the sintered compact might be set to 0.12 mm in thickness.
- the glass powder was produced as follows. First, glass raw materials prepared so as to have the compositions shown in Table 2 were put into an alumina crucible and melted in an electric furnace at 950 ° C. in a nitrogen atmosphere for 1 hour. Thereafter, the glass melt was formed into a film and pulverized with a rough machine to obtain glass powder. The average particle diameter (D 50 ) of the obtained powder was 32 ⁇ m.
- the YAG ceramic substrate obtained in (1) was allowed to stand on a hot plate, and a predetermined amount of the mixed powder was further placed thereon. Next, a metal mold is pressed against the mixed powder, and press molding is performed for 3 minutes in a nitrogen atmosphere at the pressing pressure and pressing temperature shown in Table 2, so that an inorganic powder sintered body layer is formed on the surface of the YAG ceramic substrate. To obtain a phosphor composite member.
- the paste for the inorganic powder sintered body layer obtained in (1) is about 300 ⁇ m thick by the dispensing method. It was applied as follows. Next, the solvent was removed by heat treatment on a hot plate at about 250 ° C. Then, it baked for 10 minutes at 430 degreeC in nitrogen atmosphere, and also hot-pressed by the pressure of 1 N / mm ⁇ 2 >, and surface shape was adjusted, and the fluorescent substance composite member was obtained.
- the total luminous flux and chromaticity of the phosphor composite member thus obtained were measured by the same method as in Example 4. The results are shown in Table 2. As is clear from Table 2, the total luminous flux value of the phosphor composite member obtained in Comparative Example 2 was inferior to that of Example 4.
- the total luminous flux and chromaticity of the phosphor composite member thus obtained were measured by the same method as in Example 4. The results are shown in Table 2. As is clear from Table 2, as in Comparative Example 2, the phosphor composite member obtained in Comparative Example 3 was inferior to Example 4 in total luminous flux value.
- Example 5 The glass powder, inorganic phosphor powder and inorganic filler powder listed in Table 2 were mixed at a predetermined ratio to obtain a mixed powder.
- the glass powder was produced as follows. First, a glass raw material prepared so as to have a composition containing 72% SnO and 28% P 2 O 5 in mol% was put into an alumina crucible and melted in an electric furnace at 950 ° C. in a nitrogen atmosphere for 1 hour. Thereafter, the glass melt was formed into a film and pulverized with a rough machine to obtain glass powder. The average particle diameter (D 50 ) of the obtained powder was 36 ⁇ m.
- the YAG ceramic substrate obtained in Example 4 was allowed to stand on a hot plate, and a predetermined amount of the mixed powder was further placed thereon. Next, a metal mold is pressed against the mixed powder, and press molding is performed for 3 minutes in a nitrogen atmosphere at the pressing pressure and pressing temperature shown in Table 2, so that an inorganic powder sintered body layer is formed on the surface of the YAG ceramic substrate. To obtain a phosphor composite member.
- Example 6 Glass powder, inorganic phosphor powder, and inorganic filler powder listed in Table 3 were mixed at a predetermined ratio to obtain a mixed powder.
- a cover glass substrate (manufactured by Matsunami Glass Co., Ltd.) having a thickness of 0.15 mm was placed on a hot plate, and a predetermined amount of the mixed powder was placed thereon. Next, a metal mold is pressed against the mixed powder, and press molding and press temperature shown in Table 3 are performed in a nitrogen atmosphere for 3 minutes to form an inorganic powder sintered body layer on the surface of the cover glass substrate. To obtain a phosphor composite member.
- the sintered inorganic powder layer was very fragile and was damaged when removed from the hot plate, so the total luminous flux and chromaticity could not be measured.
- the phosphor composite member of the present invention is not limited to an LED application, and can also be used as a wavelength conversion member in an LED device that emits high-power excitation light such as a laser diode.
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Abstract
Description
本発明に係る第2の蛍光体複合部材の製造方法は、無機基材上に、ガラス粉末および無機蛍光体粉末を含有する混合粉末を載置する工程、および、金型を用いて加熱しながら混合粉末をプレス成型し、無機基材表面上に無機粉末焼結体層を形成する工程、を含むことを特徴とする。 In addition, when forming a sintered compact layer by a paste method or a green sheet method, the carbon component resulting from a solvent, a binder, etc. remains in a sintered compact, and it may become a cause of emitted light intensity fall. In contrast, the thermocompression pressing method can form an inorganic powder sintered body layer on a ceramic substrate without using an organic compound such as a solvent or a binder. It is possible to prevent the emission intensity from decreasing.
The manufacturing method of the 2nd fluorescent substance composite member which concerns on this invention is the process of mounting the mixed powder containing glass powder and inorganic fluorescent substance powder on an inorganic base material, and heating using a metal mold | die. A step of pressing the mixed powder to form an inorganic powder sintered body layer on the surface of the inorganic base material.
図1に、本実施形態の蛍光体複合部材の模式図を示す。図1に示すように、本実施形態の蛍光体複合部材は、セラミックス基材12の表面に、SnO-P2O5系ガラスおよび無機蛍光体粉末を含有する無機粉末焼結体層11が形成されてなるものであり、励起光が照射されたときに、セラミック基材12および無機粉末焼結体層11が互いに異なる波長の蛍光を発することを特徴とする。 (First embodiment)
In FIG. 1, the schematic diagram of the fluorescent substance composite member of this embodiment is shown. As shown in FIG. 1, in the phosphor composite member of this embodiment, an inorganic powder sintered body layer 11 containing SnO—P 2 O 5 glass and inorganic phosphor powder is formed on the surface of a ceramic substrate 12. The ceramic substrate 12 and the inorganic powder sintered body layer 11 emit fluorescence having different wavelengths when irradiated with excitation light.
B:Zr、Ti、Sn、Nb、Al、Sc、Y等
M:P、Si、W、Mo等 A: Li, Na, K, Mg, Ca, Sr, Ba, Zn, Cu, Ni, Mn, etc. B: Zr, Ti, Sn, Nb, Al, Sc, Y, etc. M: P, Si, W, Mo, etc.
(実施例) The phosphor composite member produced as described above may be cut and polished to be processed into an arbitrary shape, for example, a disc shape, a column shape, a rod shape, or the like.
(Example)
(1)セラミック基材の作製
まず、高純度かつ2μm以下の粒経を有する原料を用いて、YAG(Y3Al5O12)の量論組成となるように、モル%で、Y2O3 37.4625%、Al2O3 62.5%、Ce2O3 0.0375%を秤量し、これに対し焼結助剤としてテトラエトキシシランを0.6質量%添加した。次に、ボールミルを用いて、調合した原料をエタノール中で17時間攪拌混合した後、減圧乾燥して粉体を得た。続いて、得られた粉体を200MPaの圧力でプレス成型して直径10mmφ、厚さ3mmのプレス成型体を作製し、これを真空雰囲気中1750℃で10時間焼成を行うことで焼成体を得た。その後、その焼成体を0.1mmの厚さとなるように両面研磨することでセラミック基材を得た。 Example 1
(1) Preparation of ceramic substrate First, using a raw material having a high purity and a particle size of 2 μm or less, Y 2 O in mol% so as to have a stoichiometric composition of YAG (Y 3 Al 5 O 12 ). 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid. Next, using a ball mill, the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried under reduced pressure to obtain a powder. Subsequently, the obtained powder was press-molded at a pressure of 200 MPa to produce a press-molded body having a diameter of 10 mmφ and a thickness of 3 mm, and this was fired at 1750 ° C. for 10 hours in a vacuum atmosphere to obtain a fired body. It was. Then, the ceramic base material was obtained by carrying out double-side polishing of the fired body so that it might become a thickness of 0.1 mm.
モル%で、SnO 62%、P2O5 21.5%、B2O3 11%、MgO 3%、Al2O3 2.5%を含有する組成になるように調合したガラス原料をアルミナ坩堝に投入し、電気炉内950℃で窒素雰囲気にて1時間溶融した。その後、ガラス融液をフィルム成形し、らいかい機で粉砕することによりガラス粉末を得た。 (2) Preparation of inorganic powder sintered body layer paste In mol%, SnO 62%, P 2 O 5 21.5%, B 2 O 3 11%, MgO 3%, Al 2 O 3 2.5% The glass raw material prepared so as to have the contained composition was put into an alumina crucible and melted in an electric furnace at 950 ° C. in a nitrogen atmosphere for 1 hour. Thereafter, the glass melt was formed into a film and pulverized with a rough machine to obtain glass powder.
上記(1)で得られたセラミック基材の表面に、上記(2)で得られた無機粉末焼結体層用ペーストをディスペンス法で厚さ約50μmとなるように塗布した。次いで、約250℃のホットプレート上で熱処理することによって脱溶媒を行った。その後、窒素雰囲気中にて430℃で10分間焼成し、さらに無機粉末焼結体層の上からホットプレスして表面形状を整え、蛍光体複合部材を得た。無機粉末焼結体層の厚みは約20μmであった。 (3) Production of phosphor composite member On the surface of the ceramic substrate obtained in (1) above, the paste for the inorganic powder sintered body layer obtained in (2) is about 50 μm thick by the dispensing method. It was applied as follows. Next, the solvent was removed by heat treatment on a hot plate at about 250 ° C. Then, it baked at 430 degreeC for 10 minute (s) in nitrogen atmosphere, and also hot-pressed from on the inorganic powder sintered compact layer, the surface shape was adjusted, and the fluorescent substance composite member was obtained. The thickness of the inorganic powder sintered body layer was about 20 μm.
(1)無機粉末焼結体層用グリーンシートの作製
実施例1で作製したガラス粉末に、無機蛍光体粉末として、SrS:Eu2+(平均粒径:8μm)およびSrBaSiO4:Eu2+(平均粒径:8μm)を、質量比で94:3:3の割合で添加し、混合して混合粉末を作製した。次いで、作製した混合粉末100質量部に対して、結合剤としてポリビニルブチラール樹脂を12質量部、可塑剤としてフタル酸ジブチルを3質量部、溶剤としてトルエンを40質量部添加し、混合してスラリーを作製した。続けて、上記スラリーをドクターブレード法によって、PETフィルム上にシート成形し、乾燥して、厚さ50μmのグリーンシートを得た。 (Example 2)
(1) Production of Green Sheet for Inorganic Powder Sintered Body Layer To the glass powder produced in Example 1, as the inorganic phosphor powder, SrS: Eu 2+ (average particle size: 8 μm) and SrBaSiO 4 : Eu 2+ (average particle) (Diameter: 8 μm) was added at a mass ratio of 94: 3: 3 and mixed to prepare a mixed powder. Next, 12 parts by mass of polyvinyl butyral resin as a binder, 3 parts by mass of dibutyl phthalate as a plasticizer, and 40 parts by mass of toluene as a solvent are added to 100 parts by mass of the prepared mixed powder, and the slurry is mixed. Produced. Subsequently, the slurry was formed into a sheet on a PET film by a doctor blade method and dried to obtain a green sheet having a thickness of 50 μm.
上記(1)で作製したグリーンシートを、実施例1で得られたセラミック基材の表面に積層し、熱圧着によって一体化して積層体を作製し、350℃で1時間脱脂した。次いで、400℃で20分焼成した後、冷却して蛍光体複合部材を得た。 (2) Production of phosphor composite member The green sheet produced in (1) above is laminated on the surface of the ceramic substrate obtained in Example 1, and is integrated by thermocompression bonding to produce a laminate, at 350 ° C. For 1 hour. Subsequently, after baking for 20 minutes at 400 degreeC, it cooled and the fluorescent substance composite member was obtained.
(1)無機粉末焼結体層用焼結体の作製
実施例1で得られたガラス粉末に対し、無機蛍光体粉末としてCaAlSiN3:Eu2+を、また無機フィラー粉末としてNbZr(PO4)3を、質量比で80:10:10の割合で添加し、振動混合機で混合した。混合粉末をプレス成型し、真空中400℃で焼成して焼結体を得た。 (Example 3)
(1) Production of sintered body for inorganic powder sintered body layer For the glass powder obtained in Example 1, CaAlSiN 3 : Eu 2+ was used as the inorganic phosphor powder, and NbZr (PO 4 ) 3 was used as the inorganic filler powder. Was added at a mass ratio of 80:10:10 and mixed with a vibration mixer. The mixed powder was press-molded and fired at 400 ° C. in a vacuum to obtain a sintered body.
実施例1で得られたセラミック基材の表面に、上記(1)で得られた無機粉末焼結体層用焼結体を載置し、約400℃のホットプレート上で、窒素雰囲気中、100kPa/cm2の圧力で3分間プレスすることにより、蛍光体複合部材を得た。無機粉末焼結体層の厚みは約50μmであった。 (2) Production of phosphor composite member The inorganic powder sintered body layer sintered body obtained in (1) above was placed on the surface of the ceramic base material obtained in Example 1, and the temperature was about 400 ° C. A phosphor composite member was obtained by pressing on a hot plate in a nitrogen atmosphere at a pressure of 100 kPa / cm 2 for 3 minutes. The thickness of the inorganic powder sintered body layer was about 50 μm.
(1)無機粉末焼結体層用ペーストの作製
モル%で、SiO2 60%、B2O3 5%、CaO 10%、BaO 15%、Al2O3 5%、ZnO 5%含有する組成になるように調合したガラス原料を白金坩堝に投入し、1400℃で2時間溶融して均一なガラスを得た。次いで、これをアルミナボールで粉砕し、分級して平均粒径が2.5μmのSiO2-B2O3系ガラス粉末を得た。 (Comparative Example 1)
(1) Preparation of inorganic powder sintered body layer paste Composition containing, in mol%, SiO 2 60%, B 2 O 3 5%, CaO 10%, BaO 15%, Al 2 O 3 5%, ZnO 5%. The glass raw material thus prepared was put into a platinum crucible and melted at 1400 ° C. for 2 hours to obtain a uniform glass. Next, this was pulverized with alumina balls and classified to obtain SiO 2 —B 2 O 3 glass powder having an average particle diameter of 2.5 μm.
実施例1で得られたセラミック基材の表面に、上記(1)で作製したペーストをディスペンス法で厚さ約50μmとなるように塗布し、300℃で1時間脱脂した。次いで、850℃で20分焼成して蛍光体複合部材を作製した。 (2) Production of phosphor composite member The paste produced in (1) above was applied to the surface of the ceramic base material obtained in Example 1 to a thickness of about 50 μm by a dispensing method, and 1 at 300 ° C. Degreased for hours. Subsequently, it baked at 850 degreeC for 20 minutes, and produced the fluorescent substance composite member.
白色LEDは、近年、高効率、高信頼性の白色光源として注目され、既に実用化されている。白色LEDは、従来の照明装置等の光源に比べ、長寿命、高効率、高安定性、低消費電力、高応答速度、環境負荷物質を含まない等の利点を有しているため、携帯電話やテレビの液晶バックライト用光源として急速に普及が広まってきている。今後は、これに加えて一般照明にも応用が進むと期待されている。
ところで、特許文献3に開示されている白色LEDは、LEDチップの発光面を有機系バインダー樹脂に無機蛍光体粉末を分散したものをモールド被覆してなる構成を有している。そのため、青色~紫外線領域の高出力の短波長の光や、無機蛍光体粉末の発熱、あるいはLEDチップの熱によって、上記有機系バインダー樹脂が劣化し、変色を引き起こす。その結果、発光強度の低下や色ずれが起こり、寿命が短くなるという問題がある。 (Second Embodiment)
In recent years, white LEDs have attracted attention as a highly efficient and highly reliable white light source and have already been put into practical use. White LEDs have advantages such as long life, high efficiency, high stability, low power consumption, high response speed, and no environmental load substances compared to conventional light sources such as lighting devices. As a light source for liquid crystal backlights for TVs and TVs, it is rapidly spreading. In the future, in addition to this, it is expected that the application will be advanced to general lighting.
By the way, the white LED disclosed in Patent Document 3 has a configuration in which a light emitting surface of an LED chip is coated with a mold in which an inorganic phosphor powder is dispersed in an organic binder resin. Therefore, the organic binder resin deteriorates and causes discoloration due to high-output short-wavelength light in the blue to ultraviolet region, heat generation of the inorganic phosphor powder, or heat of the LED chip. As a result, there is a problem in that the emission intensity is lowered and the color shift occurs and the life is shortened.
特許文献5または6に記載の方法では、所望の形状を有する発光色変換部材を歩留まりよく製造することができるが、部材の発光強度が低いという問題があった。また、ペーストやグリーンシートの作製工程が必要であるため、製造工程が煩雑であるという問題があった。 Therefore, a phosphor composite member has been proposed in which a glass sintered body layer containing an inorganic phosphor powder is formed on the surface of an inorganic substrate (see, for example, Patent Document 5 or 6). The phosphor composite member is formed by forming a sintered body layer containing an inorganic phosphor powder on an inorganic substrate by a paste method or a green sheet method. Therefore, a thin phosphor composite member can be produced without going through steps such as cutting and polishing.
In the method described in Patent Document 5 or 6, a light emitting color conversion member having a desired shape can be manufactured with a high yield, but there is a problem that the light emission intensity of the member is low. Moreover, since the manufacturing process of the paste and the green sheet is required, there is a problem that the manufacturing process is complicated.
図1に、第2の実施形態の蛍光体複合部材の製造方法の模式図を示す。 In view of such a situation, an object of the present embodiment is to provide a method for easily manufacturing a phosphor composite member having higher emission intensity than the conventional one.
In FIG. 1, the schematic diagram of the manufacturing method of the fluorescent substance composite member of 2nd Embodiment is shown.
A:Li、Na、K、Mg、Ca、Sr、Ba、Zn、Cu、Ni、Mn等
B:Zr、Ti、Sn、Nb、Al、Sc、Y等
M:P、Si、W、Mo等 Examples of the inorganic filler powder include zirconium phosphate, zirconium phosphate tungstate, zirconium tungstate, NZP type crystals and solid solutions thereof having low expansion characteristics, and these may be used alone or in combination. it can. Here, the “NZP type crystal” includes, for example, a crystal having a basic structure of NbZr (PO 4 ) 3 or [AB 2 (MO 4 ) 3 ].
A: Li, Na, K, Mg, Ca, Sr, Ba, Zn, Cu, Ni, Mn, etc. B: Zr, Ti, Sn, Nb, Al, Sc, Y, etc. M: P, Si, W, Mo, etc.
また、ガラスマトリクスと無機フィラー粉末の界面における光散乱損失が大きくなり、発光強度が低下する傾向がある。 The content of the inorganic filler powder in the sintered inorganic powder layer 4 is preferably 0 to 30% by mass, 1.5 to 25% by mass, and particularly preferably 2 to 20% by mass. When there is too much content of an inorganic filler powder, content of glass powder will decrease relatively and it will become easy to reduce mechanical strength.
In addition, light scattering loss at the interface between the glass matrix and the inorganic filler powder increases, and the light emission intensity tends to decrease.
(実施例) The shape of the phosphor composite member 5 is not particularly limited, and examples thereof include a plate shape, a hemispherical shape, and a hemispherical dome shape.
(Example)
(1)セラミック基材の作製
まず、高純度かつ2μm以下の粒経を有する原料を用いて、YAG(Y3Al5O12)の量論組成となるように、モル%で、Y2O3 37.4625%、Al2O3 62.5%、Ce2O3 0.0375%を秤量し、これに対し焼結助剤としてテトラエトキシシランを0.6質量%添加した。次に、ボールミルを用いて、調合した原料をエタノール中で17時間攪拌混合した後、減圧乾燥して粉体を得た。続いて、得られた粉体を200MPaの圧力でプレス成型して直径10mm、厚さ3mmのプレス成型体を作製し、これを真空雰囲気中1750℃で10時間焼成を行うことで焼結体を得た。その後、その焼結体を0.12mmの厚さとなるように両面研磨することでセラミック基材を得た。 Example 4
(1) Preparation of ceramic substrate First, using a raw material having a high purity and a particle size of 2 μm or less, Y 2 O in mol% so as to have a stoichiometric composition of YAG (Y 3 Al 5 O 12 ). 3 37.4625%, Al 2 O 3 62.5%, Ce 2 O 3 0.0375% were weighed, and 0.6% by mass of tetraethoxysilane was added thereto as a sintering aid. Next, using a ball mill, the prepared raw materials were stirred and mixed in ethanol for 17 hours, and then dried under reduced pressure to obtain a powder. Subsequently, the obtained powder was press-molded at a pressure of 200 MPa to produce a press-molded body having a diameter of 10 mm and a thickness of 3 mm, and this was fired at 1750 ° C. in a vacuum atmosphere for 10 hours to obtain a sintered body. Obtained. Then, the ceramic base material was obtained by carrying out double-side polish so that the sintered compact might be set to 0.12 mm in thickness.
表2に記載のガラス粉末、無機蛍光体粉末および無機フィラー粉末を所定の割合で混合して混合粉末とした。 (2) Production of phosphor composite member Glass powder, inorganic phosphor powder and inorganic filler powder described in Table 2 were mixed at a predetermined ratio to obtain a mixed powder.
得られた蛍光体複合部材について、発光スペクトルを次のようにして測定した。校正された積分球内で、200mAの電流で点灯した青色LEDによって蛍光体複合部材を励起し、光ファイバーを通じてその発光を小型分光器(オーシャンオプティクス製 USB-4000)に取り込み、制御PC上に発光スペクトル(エネルギー分布曲線)を得た。得られた発光スペクトルから全光束および色度を算出した。結果を表2に示す。 (3) Measurement of total luminous flux and chromaticity The emission spectrum of the obtained phosphor composite member was measured as follows. Inside the calibrated integrating sphere, the phosphor composite member is excited by a blue LED that is lit at a current of 200 mA, and the emitted light is taken into a small spectroscope (USB-4000 manufactured by Ocean Optics) through an optical fiber. (Energy distribution curve) was obtained. Total luminous flux and chromaticity were calculated from the obtained emission spectrum. The results are shown in Table 2.
(1)無機粉末焼結体層用ペーストの作製
表2に記載のガラス粉末、無機蛍光体粉末および無機フィラー粉末を所定の割合で混合して混合粉末を作製した。次に、得られた混合粉末100質量部に対して、溶媒として50質量部の2,4-ジエチル-1,5-ペンタンジオール(日本香料薬品株式会社製 MARS)を添加して混合することでペーストを得た。 (Comparative Example 2)
(1) Preparation of inorganic powder sintered body layer paste A glass powder, an inorganic phosphor powder and an inorganic filler powder described in Table 2 were mixed at a predetermined ratio to prepare a mixed powder. Next, 50 parts by mass of 2,4-diethyl-1,5-pentanediol (MARS manufactured by Nippon Kayaku Yakuhin Co., Ltd.) as a solvent was added to and mixed with 100 parts by mass of the obtained mixed powder. A paste was obtained.
実施例4で得られたYAGセラミック基材の表面に、上記(1)で得られた無機粉末焼結体層用ペーストをディスペンス法で厚さ約300μmとなるように塗布した。次に、約250℃のホットプレート上で熱処理することによって脱溶媒を行った。その後、窒素雰囲気中にて430℃で10分間焼成し、さらに1N/mm2の圧力でホットプレスして表面形状を整え、蛍光体複合部材を得た。 (2) Production of phosphor composite member On the surface of the YAG ceramic substrate obtained in Example 4, the paste for the inorganic powder sintered body layer obtained in (1) is about 300 μm thick by the dispensing method. It was applied as follows. Next, the solvent was removed by heat treatment on a hot plate at about 250 ° C. Then, it baked for 10 minutes at 430 degreeC in nitrogen atmosphere, and also hot-pressed by the pressure of 1 N / mm < 2 >, and surface shape was adjusted, and the fluorescent substance composite member was obtained.
(1)無機粉末焼結体層用グリーンシートの作製
表2に記載のガラス粉末、無機蛍光体粉末を所定の割合で混合して混合粉末を作製した。次に、混合粉末100質量部に対して、結合剤としてポリビニルブチラール樹脂を12質量部、可塑剤としてフタル酸ジブチルを3質量部、溶剤としてトルエンを40質量部添加し、混合してスラリーを作製した。続けて、上記スラリーをドクターブレード法によって、PETフィルム上にシート成形し、乾燥して、厚さ250μmのグリーンシートを得た。 (Comparative Example 3)
(1) Production of Green Sheet for Inorganic Powder Sintered Body Layer Glass powder and inorganic phosphor powder shown in Table 2 were mixed at a predetermined ratio to produce a mixed powder. Next, 12 parts by mass of polyvinyl butyral resin as a binder, 3 parts by mass of dibutyl phthalate as a plasticizer, and 40 parts by mass of toluene as a solvent are added to 100 parts by mass of the mixed powder, and mixed to prepare a slurry. did. Subsequently, the slurry was formed into a sheet on a PET film by a doctor blade method and dried to obtain a green sheet having a thickness of 250 μm.
上記(1)で作製したグリーンシートを、実施例4で得られたYAGセラミック基材の表面に積層し、熱圧着によって一体化して積層体を作製し、350℃で1時間脱脂した。次に、400℃で20分焼成した後、冷却して蛍光体複合部材を得た。 (2) Production of phosphor composite member The green sheet produced in (1) above is laminated on the surface of the YAG ceramic substrate obtained in Example 4 and integrated by thermocompression bonding to produce a laminate. Degreased for 1 hour at ° C. Next, after baking at 400 degreeC for 20 minutes, it cooled and the fluorescent substance composite member was obtained.
表2に記載のガラス粉末、無機蛍光体粉末および無機フィラー粉末を所定の割合で混合して混合粉末とした。 (Example 5)
The glass powder, inorganic phosphor powder and inorganic filler powder listed in Table 2 were mixed at a predetermined ratio to obtain a mixed powder.
表3に記載のガラス粉末、無機蛍光体粉末、無機フィラー粉末を所定の割合で混合し、混合粉末を得た。 (Examples 6 to 9)
Glass powder, inorganic phosphor powder, and inorganic filler powder listed in Table 3 were mixed at a predetermined ratio to obtain a mixed powder.
表4に記載のガラス粉末および無機蛍光体粉末を所定の割合で混合し、混合粉末を得た。 (Comparative Example 4)
The glass powder and inorganic phosphor powder described in Table 4 were mixed at a predetermined ratio to obtain a mixed powder.
2…無機基材
3a…上金型
3b…下金型
4…無機粉末焼結体層
5…蛍光体複合部材
P…加圧方向
11…無機粉末焼結体層
12…セラミック基材 DESCRIPTION OF SYMBOLS 1 ... Mixed powder 2 ... Inorganic base material 3a ... Upper metal mold 3b ... Lower metal mold 4 ... Inorganic powder sintered compact layer 5 ... Phosphor composite member P ... Pressure direction 11 ... Inorganic powder sintered compact layer 12 ... Ceramic base Material
Claims (28)
- セラミック基材の表面に、SnO-P2O5系ガラスおよび無機蛍光体粉末を含有する無機粉末焼結体層が形成されてなる蛍光体複合部材であって、励起光が照射されたときに、前記セラミック基材および前記無機粉末焼結体層が互いに異なる波長の蛍光を発することを特徴とする蛍光体複合部材。 A phosphor composite member in which an inorganic powder sintered body layer containing SnO—P 2 O 5 glass and inorganic phosphor powder is formed on the surface of a ceramic base material, and when irradiated with excitation light The phosphor composite member, wherein the ceramic substrate and the inorganic powder sintered body layer emit fluorescence having different wavelengths.
- 前記セラミック基材が、波長400~500nmの励起光を吸収し、波長450~780nmの蛍光を発することを特徴とする請求項1に記載の蛍光体複合部材。 The phosphor composite member according to claim 1, wherein the ceramic base material absorbs excitation light having a wavelength of 400 to 500 nm and emits fluorescence having a wavelength of 450 to 780 nm.
- 前記セラミック基材が、青色の励起光を吸収し、黄色の蛍光を発することを特徴とする請求項2に記載の蛍光体複合部材。 The phosphor composite member according to claim 2, wherein the ceramic base material absorbs blue excitation light and emits yellow fluorescence.
- 前記セラミック基材が、結晶中にCe3+を含むガーネット結晶からなることを特徴とする請求項1~3のいずれかに記載の蛍光体複合部材。 4. The phosphor composite member according to claim 1, wherein the ceramic substrate is made of a garnet crystal containing Ce 3+ in the crystal.
- 前記ガーネット結晶が、YAG結晶またはYAG結晶固溶体であることを特徴とする請求項4に記載の蛍光体複合部材。 The phosphor composite member according to claim 4, wherein the garnet crystal is a YAG crystal or a YAG crystal solid solution.
- 前記無機粉末焼結体層が、波長400~500nmの励起光を吸収し、波長500~780nmの蛍光を発することを特徴とする請求項1~5のいずれかに記載の蛍光体複合部材。 The phosphor composite member according to any one of claims 1 to 5, wherein the inorganic powder sintered body layer absorbs excitation light having a wavelength of 400 to 500 nm and emits fluorescence having a wavelength of 500 to 780 nm.
- 前記無機粉末焼結体層が、青色の励起光を吸収し、赤色および/または緑色の蛍光を発することを特徴とする請求項6に記載の蛍光体複合部材。 The phosphor composite member according to claim 6, wherein the inorganic powder sintered body layer absorbs blue excitation light and emits red and / or green fluorescence.
- 前記セラミック基材および前記無機粉末焼結体層から発せられる蛍光と、前記蛍光体複合部材中を透過する励起光とが合成されて白色光を発することを特徴とする請求項1~7のいずれかに記載の蛍光体複合部材。 The white light is emitted by combining the fluorescence emitted from the ceramic base material and the inorganic powder sintered body layer and the excitation light transmitted through the phosphor composite member. The phosphor composite member according to claim 1.
- 無機粉末焼結体層が、前記無機蛍光体粉末を0.01~30質量%含有することを特徴とする請求項1~8のいずれかに記載の蛍光体複合部材。 9. The phosphor composite member according to claim 1, wherein the inorganic powder sintered body layer contains 0.01 to 30% by mass of the inorganic phosphor powder.
- 前記SnO-P2O5系ガラスが、組成としてモル%表示で、SnO 35~80%、P2O5 5~40%及びB2O3 0~30%を含有することを特徴とする請求項1~9のいずれかに記載の蛍光体複合部材。 The SnO—P 2 O 5 glass contains SnO 35 to 80%, P 2 O 5 5 to 40%, and B 2 O 3 0 to 30% in terms of mol% as a composition. Item 10. The phosphor composite member according to any one of Items 1 to 9.
- 前記無機粉末焼結体層の表面粗さRaが0.5μm以下であることを特徴とする請求項1~10のいずれかに記載の蛍光体複合部材。 11. The phosphor composite member according to claim 1, wherein the inorganic powder sintered body layer has a surface roughness Ra of 0.5 μm or less.
- 散乱係数が1~500cm-1であることを特徴とする請求項1~11のいずれかに記載の蛍光体複合部材。 12. The phosphor composite member according to claim 1 , wherein the scattering coefficient is 1 to 500 cm −1 .
- 請求項1~12のいずれかに記載の蛍光体複合部材を用いたことを特徴とするLEDデバイス。 An LED device comprising the phosphor composite member according to any one of claims 1 to 12.
- 請求項1~12のいずれかに記載の蛍光体複合部材を製造するための方法であって、SnO-P2O5系ガラスおよび無機蛍光体粉末の混合物を焼成して焼結体を得る工程、セラミック基材上に前記焼結体を熱圧着プレスすることにより、無機粉末焼結体層を形成する工程、を含むことを特徴とする蛍光体複合部材の製造方法。 A method for producing the phosphor composite member according to any one of claims 1 to 12, wherein a sintered body is obtained by firing a mixture of SnO-P 2 O 5 glass and inorganic phosphor powder. And a step of forming an inorganic powder sintered body layer by thermocompression-pressing the sintered body on a ceramic substrate.
- 無機基材上に、ガラス粉末および無機蛍光体粉末を含有する混合粉末を載置する工程、および、金型を用いて加熱しながら前記混合粉末をプレス成型し、前記無機基材表面上に無機粉末焼結体層を形成する工程、を含むことを特徴とする蛍光体複合部材の製造方法。 A step of placing a mixed powder containing glass powder and an inorganic phosphor powder on an inorganic base material, and press-molding the mixed powder while heating using a mold, and an inorganic surface on the surface of the inorganic base material And a step of forming a powder sintered body layer.
- 前記無機基材が、YAG系セラミックス、結晶化ガラス、ガラス、金属または金属とセラミックスの複合体であることを特徴とする請求項15に記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to claim 15, wherein the inorganic base material is YAG ceramic, crystallized glass, glass, metal, or a composite of metal and ceramic.
- 前記無機粉末焼結体層の厚みが0.3mm以下であることを特徴とする請求項15または16に記載の蛍光体複合部材の製造方法。 The method for manufacturing a phosphor composite member according to claim 15 or 16, wherein the inorganic powder sintered body layer has a thickness of 0.3 mm or less.
- 前記無機粉末焼結体層の表面粗さ(Ra)が0.5μm以下であることを特徴とする請求項15~17のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 17, wherein the inorganic powder sintered body layer has a surface roughness (Ra) of 0.5 µm or less.
- 前記ガラス粉末の平均粒径(D50)が100μm以下であることを特徴とする請求項15~18のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 18, wherein an average particle size (D 50 ) of the glass powder is 100 µm or less.
- 無機粉末焼結体層における前記無機蛍光体粉末の割合が0.01~90質量%であることを特徴とする請求項15~19のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 19, wherein a ratio of the inorganic phosphor powder in the inorganic powder sintered body layer is 0.01 to 90 mass%.
- 前記無機粉末焼結体層が、無機フィラーを0~30質量%含有することを特徴とする請求項15~20のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 20, wherein the inorganic powder sintered body layer contains 0 to 30% by mass of an inorganic filler.
- 前記ガラス粉末が、SiO2-B2O3-RO系ガラス粉末(RはMg、Ca、SrおよびBaから選ばれる1種以上)、SiO2-TiO2-Nb2O5-R’2O系ガラス粉末(R’はLi、Na、Kから選ばれる1種以上)、SnO-P2O5系ガラス粉末またはZnO-B2O3-SiO2系ガラス粉末であることを特徴とする請求項15~21のいずれかに記載の蛍光体複合部材の製造方法。 The glass powder is SiO 2 —B 2 O 3 —RO based glass powder (R is one or more selected from Mg, Ca, Sr and Ba), SiO 2 —TiO 2 —Nb 2 O 5 —R ′ 2 O. A glass powder (R ′ is at least one selected from Li, Na, and K), SnO—P 2 O 5 glass powder, or ZnO—B 2 O 3 —SiO 2 glass powder. Item 22. The method for producing a phosphor composite member according to any one of Items 15 to 21.
- 前記SnO-P2O5系ガラス粉末が、ガラス組成としてモル%で、SnO 35~80%、P2O5 5~40%及びB2O3 0~30%を含有することを特徴とする請求項22に記載の蛍光体複合部材の製造方法。 The SnO—P 2 O 5 glass powder contains, as a glass composition, mol%, SnO 35 to 80%, P 2 O 5 5 to 40%, and B 2 O 3 0 to 30%. The method for producing a phosphor composite member according to claim 22.
- 前記無機蛍光体粉末が、酸化物、窒化物、酸窒化物、硫化物、酸硫化物、酸フッ化物、ハロゲン化物、アルミン酸塩またはハロリン酸塩化物であることを特徴とする請求項15~23のいずれかに記載の蛍光体複合部材の製造方法。 The inorganic phosphor powder is an oxide, nitride, oxynitride, sulfide, oxysulfide, oxyfluoride, halide, aluminate or halophosphate. 24. The method for producing a phosphor composite member according to any one of 23.
- プレス成型時の温度が900℃以下であることを特徴とする請求項15~24のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 24, wherein the temperature at the time of press molding is 900 ° C or lower.
- プレス成型時の雰囲気が空気、真空、窒素またはアルゴンであることを特徴とする請求項15~25のいずれかに記載の蛍光体複合部材の製造方法。 The method for producing a phosphor composite member according to any one of claims 15 to 25, wherein the atmosphere during press molding is air, vacuum, nitrogen or argon.
- 前記蛍光体複合部材の形状が、板状、半球状、半球ドーム状であることを特徴とする請求項15~26に記載の蛍光体複合部材の製造方法。 The method for manufacturing a phosphor composite member according to any one of claims 15 to 26, wherein the phosphor composite member has a plate shape, a hemispherical shape, or a hemispherical dome shape.
- 請求項15~27に記載の製造方法により作製されたことを特徴とする蛍光体複合部材。 A phosphor composite member produced by the manufacturing method according to claims 15 to 27.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452736B (en) * | 2012-02-17 | 2014-09-11 | Jau Sheng Wang | Color conversion layer producing method of a led module |
JP2015514144A (en) * | 2012-03-29 | 2015-05-18 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | Composite ceramic containing conversion phosphor and material with negative coefficient of thermal expansion |
JP2016050265A (en) * | 2014-09-01 | 2016-04-11 | 日本電気硝子株式会社 | Wavelength conversion member production method and wavelength conversion member |
CN106186678A (en) * | 2015-05-26 | 2016-12-07 | 台湾彩光科技股份有限公司 | Method for producing glass phosphor sheet |
CN115991593A (en) * | 2018-06-20 | 2023-04-21 | 日亚化学工业株式会社 | Ceramic composite, light-emitting device using same, and method for manufacturing ceramic composite |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008019421A (en) * | 2006-06-14 | 2008-01-31 | Nippon Electric Glass Co Ltd | Phosphor composite material and phosphor composite member |
JP2008169348A (en) * | 2007-01-15 | 2008-07-24 | Nippon Electric Glass Co Ltd | Phosphor composite material |
JP2010108965A (en) * | 2008-10-28 | 2010-05-13 | Nippon Electric Glass Co Ltd | Wavelength conversion member |
-
2011
- 2011-06-29 WO PCT/JP2011/064922 patent/WO2012008306A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008019421A (en) * | 2006-06-14 | 2008-01-31 | Nippon Electric Glass Co Ltd | Phosphor composite material and phosphor composite member |
JP2008169348A (en) * | 2007-01-15 | 2008-07-24 | Nippon Electric Glass Co Ltd | Phosphor composite material |
JP2010108965A (en) * | 2008-10-28 | 2010-05-13 | Nippon Electric Glass Co Ltd | Wavelength conversion member |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452736B (en) * | 2012-02-17 | 2014-09-11 | Jau Sheng Wang | Color conversion layer producing method of a led module |
JP2015514144A (en) * | 2012-03-29 | 2015-05-18 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | Composite ceramic containing conversion phosphor and material with negative coefficient of thermal expansion |
US9567519B2 (en) | 2012-03-29 | 2017-02-14 | Merck Patent Gmbh | Composite ceramic which comprises a conversion phosphor and a material having a negative coefficient of thermal expansion |
JP2016050265A (en) * | 2014-09-01 | 2016-04-11 | 日本電気硝子株式会社 | Wavelength conversion member production method and wavelength conversion member |
CN106186678A (en) * | 2015-05-26 | 2016-12-07 | 台湾彩光科技股份有限公司 | Method for producing glass phosphor sheet |
CN115991593A (en) * | 2018-06-20 | 2023-04-21 | 日亚化学工业株式会社 | Ceramic composite, light-emitting device using same, and method for manufacturing ceramic composite |
CN115991593B (en) * | 2018-06-20 | 2023-12-19 | 日亚化学工业株式会社 | Ceramic composite, light-emitting device using same, and method for manufacturing ceramic composite |
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