WO2012006820A1 - 侧入式背光模块及其背板散热构造 - Google Patents

侧入式背光模块及其背板散热构造 Download PDF

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Publication number
WO2012006820A1
WO2012006820A1 PCT/CN2010/077550 CN2010077550W WO2012006820A1 WO 2012006820 A1 WO2012006820 A1 WO 2012006820A1 CN 2010077550 W CN2010077550 W CN 2010077550W WO 2012006820 A1 WO2012006820 A1 WO 2012006820A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
side wall
dissipation structure
wall portion
backlight module
Prior art date
Application number
PCT/CN2010/077550
Other languages
English (en)
French (fr)
Inventor
贺成明
唐国富
Original Assignee
深圳市华星光电技术有限公司
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Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US12/991,494 priority Critical patent/US8419256B2/en
Publication of WO2012006820A1 publication Critical patent/WO2012006820A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package

Definitions

  • the invention relates to a side-entry backlight module and a heat dissipation structure thereof, and particularly relates to a side-entry backlight module capable of improving heat dissipation efficiency and a heat dissipation structure thereof.
  • FIG. 1 is a side cross-sectional view of a conventional side-lit backlight module.
  • the one-side backlight module 90 includes a backplane heat dissipation structure 91.
  • the side wall portion 911 is disposed on both sides of the backplane heat dissipation structure 91, and a light guide plate 92 is disposed at the center of the backplane heat dissipation structure 91.
  • An optical film set 93 is disposed on the light guide plate 92, and another plastic frame 94 is wrapped around the outer edge of the heat dissipation structure 91 of the back plate, and the optical film set 93 and the above are fixed from above to below.
  • the light guide plate 92 is formed to form the side-entry backlight module 90.
  • a liquid crystal panel 80 is further disposed on the side-lit backlight module 90, and the liquid crystal panel 80 and the side-entry backlight module 90 are covered and fixed by a casing 70 to form a liquid crystal display.
  • the side wall portion 911 of the backplane heat dissipation structure 91 of the side-entry backlight module 90 is respectively provided with a light source group 95 on the inner surface, and the light source group 95 has a plurality of light-emitting devices. 951.
  • the light emitting device 951 can be an LED light emitting device, and a light source direction thereof is directed to the light guide plate 92.
  • the light-emitting device 951 is generally fixed to the side wall portion 911 by screwing or thermal tape bonding. Due to the thermal energy generated during the operation of the light source group 95, the thermal energy is conducted downwardly and inwardly from the side wall portion 911 to the back plate heat dissipation structure 91 in the direction of the arrow in the figure.
  • FIG. 2 is a partial side cross-sectional view of another conventional side-lit backlight module.
  • the side-entry backlight module 90 of FIG. 2 is similar to the side-entry backlight module 90 of FIG. 1 except that the side-entry backlight module 90 of FIG. 2 is in the light source group 95 and the backplane heat dissipation structure 91.
  • a heat conducting block 96 is further disposed, and the heat conducting block 96 is approximately L-shaped and attached to the back plate heat dissipating structure 91 and the side wall portion 911 thereof, and the heat conducting block 96 is generally selected from aluminum ( A1)
  • the material is produced by an extrusion molding process.
  • the contact area of the aluminum heat conductive block 96 with the back plate heat dissipation structure 91 is larger. Therefore, the thermal energy generated by the light source group 95 can be quickly conducted by the side wall portion 911 to the center of the back plate heat dissipation structure 91 to perform heat dissipation.
  • the above two existing edge-lit backlight modules still have a problem that the side wall portion 911 of the backplane heat dissipation structure 91 is not extended, and therefore the heat dissipation path of the heat energy generated by the light source group 95 is It can be conducted only in the direction of the arrow in the figure, that is, the lower end of the side wall portion 911 is conducted in a single direction toward the center position of the back plate heat dissipation structure 91, and the back plate heat dissipation structure cannot be improved. 91 heat dissipation efficiency.
  • a main object of the present invention is to provide a backplane heat dissipation structure of a side-entry backlight module, wherein an extension portion is further extended outward from an upper end portion of a side wall portion of the heat dissipation structure of the backplane, and at least one light source group is disposed at a side wall portion.
  • the side wall portion can conduct bidirectional conduction heat energy to the extension portion of the upper end and the bottom portion of the lower end thereof, so as to effectively improve the heat dissipation efficiency of the heat dissipation structure of the back plate.
  • the present invention provides a backplane heat dissipation structure of a side-entry backlight module, comprising: a bottom portion, a body forming the heat dissipation structure of the backplane;
  • At least one side wall portion is formed by extending at least one side edge of the bottom portion, wherein a light source group is attached to the inner surface of the at least one side wall portion;
  • the heat dissipation structure of the back plate further includes an extending portion, wherein the extending portion is formed by extending outwardly from an upper end of the side wall portion, wherein the at least one light source group is generated at the position of the side wall portion The thermal energy is transferred to the extension through the upper end of the side wall portion and to the bottom portion through the lower end of the side wall portion.
  • the present invention provides a side-entry backlight module, including:
  • a backplane heat dissipation structure comprising: a bottom portion and at least one side wall portion, wherein the bottom portion is a main body of the back plate heat dissipation structure, and the at least one side wall portion is upward from at least one side edge of the bottom portion Formed by extension;
  • At least one light source group is disposed on an inner surface of the side wall portion and located between the side wall portion and the light guide plate;
  • the backplane heat dissipation structure of the side-entry backlight module further includes an extension portion, and the extension portion is formed by extending an upper end of the sidewall portion of the backplane heat dissipation structure, wherein the Thermal energy generated by the at least one light source group at the position of the side wall portion is transmitted to the extension portion through the upper end of the side wall portion, and is transmitted to the bottom portion through the lower end of the side wall portion.
  • the extending portion includes: a first horizontal extending portion formed by extending horizontally outward from an upper end of the side wall portion; and a first vertical extending portion The outer end of the first horizontal extending portion is formed to extend vertically downward, and the first vertical extending portion and the side wall portion have a distance therebetween.
  • At least one heat conducting material or at least one heat pipe is disposed between the side wall portion and the first vertical extending portion.
  • the side wall portion and the first vertical extending portion are provided with a plurality of through holes for penetrating the back surface of a circuit substrate of the at least one light source group.
  • the extension further comprises: a second horizontal extension, which is The lower end of the first vertical extension is formed to extend horizontally outward; and a second vertical extension is formed by the outer end of the second horizontal extension extending vertically upward.
  • At least one heat conducting material or at least one heat pipe is disposed between the first vertical extending portion and the second vertical extending portion.
  • the sidewall portion, the first vertical extension portion and the second vertical extension portion are provided with a plurality of through holes for exposing the back surface of a circuit substrate of the at least one light source group .
  • the extension portion further includes: a second horizontal extension portion formed by extending a lower end of the first vertical extension portion inwardly and below the bottom portion.
  • At least one heat conductive material or at least one heat pipe is disposed between the bottom portion and the second horizontal extending portion.
  • the extension portion further includes: a third horizontal extension portion formed by extending horizontally outward from an upper end of the second vertical extension portion; and a third vertical extension portion, Formed by the outer end of the third horizontal extension extending vertically downward.
  • At least one heat conductive material or at least one heat pipe is disposed between the second and third vertical extending portions.
  • the sidewall portion, the first vertical extension portion, the second vertical extension portion and the third vertical extension portion are provided with a plurality of through holes for exposing the at least one light source group The back side of a circuit board.
  • the at least one light source group includes a circuit substrate and a light emitting device, the circuit substrate is attached to an inner surface of the side wall portion, and a light source direction of the light emitting device is directed to the Light guide plate.
  • Figure 1 A side cross-sectional view of a prior art side-lit backlight module.
  • Figure 2 A partial side cross-sectional view of another prior art side-lit backlight module.
  • Figure 3 is a side cross-sectional view showing a side-lit backlight module of a first embodiment of the present invention.
  • Fig. 4 is a partial side cross-sectional view showing the heat dissipation structure of the back plate of the side-entry backlight module of the first embodiment of the present invention.
  • Fig. 5 is a partial side cross-sectional view showing the heat dissipation structure of the back plate of the side-entry backlight module of the second embodiment of the present invention.
  • Figure 6 is a partial side cross-sectional view showing the heat dissipation structure of the back plate of the side-entry backlight module of the third embodiment of the present invention.
  • Figure ⁇ is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a fourth embodiment of the present invention.
  • Fig. 8 is a partial side cross-sectional view showing the heat dissipation structure of the back plate of the side-entry backlight module of the fifth embodiment of the present invention.
  • Figure 9 is a partial side cross-sectional view showing the heat dissipation structure of the backplane of the side-entry backlight module of the sixth embodiment of the present invention.
  • Figure 10 is a partial side cross-sectional view showing the heat dissipation structure of the back plate of the side-entry backlight module of the seventh embodiment of the present invention. detailed description
  • FIG. 3 is a side cross-sectional view showing a side-lit backlight module according to a first embodiment of the present invention.
  • a side-lit backlight module 10 includes a backplane heat dissipation structure 11 , a light guide panel 12 , an optical film assembly 13 , a plastic frame 14 , and at least one light source group 15 .
  • the backplane heat dissipation structure 11 includes a bottom portion 111 and at least one side wall portion 112.
  • the bottom portion 111 is a main body of the back plate heat dissipation structure having a rectangular shape, and at least one side edge of the bottom portion 111 extends upward.
  • the at least one side wall portion 112 is taken out.
  • the light guide plate 12 is disposed on the back plate heat dissipation structure 11; the optical film group 13 Is disposed on the light guide plate 12; the plastic frame 14 is wrapped around the outer edge of the heat dissipation structure 11 of the back plate, and the optical film group 13 and the light guide plate 12 are fixed on the back plate.
  • the heat dissipation structure 11 is on.
  • the at least one light source group 15 is provided on an inner side surface of the side wall portion 112.
  • the at least one light source group 15 includes a circuit board 151 and a light emitting device 152.
  • the circuit board 151 is attached to the inner surface of the side wall portion 112, and the light source direction of the light emitting device 152 is directed to the light guide plate 12. .
  • FIG. 4 is a partial side cross-sectional view showing the heat dissipation structure of the backplane of the side-entry backlight module according to the first embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the side-entry backlight module 10 further includes an extension portion 113, and the extension portion 113 is a portion extending outward from the upper end of the sidewall portion 112 of the backplane heat dissipation structure 11.
  • the extending portion 113 includes a first horizontal extending portion 113a and a first vertical extending portion 113b.
  • the first horizontal extending portion 113a extends horizontally outward from an upper end of the side wall portion 112; the first vertical extending portion 113b is vertically extended downward from an outer end of the first horizontal extending portion 113a. There is a distance between the first vertical extension 113b and the side wall portion 112.
  • the light-emitting device 152 of the light source group 15 is preferably an LED light-emitting device 152, and its light source direction is directed to the light guide plate 12.
  • the light source group 15 is generally fixed to the inner surface of the side wall portion 112 by screwing or thermal tape bonding.
  • the bottom portion 111, the side wall portion 112, and the extending portion 113 of the back plate heat dissipation structure 11 are preferably integrally formed sheet metal members, and therefore, the heat energy generated by the light emitting device 152 Conducted to the side wall portion 112 through the circuit board 151, and the thermal energy located at the lower end of the side wall portion 112 is conducted to the center of the back plate heat dissipation structure 11 as shown by the arrow in FIG. At the same time, thermal energy located at the upper end of the side wall portion 112 is transmitted to the first horizontal extension portion 113a and the first vertical extension portion 113b of the extension portion 113.
  • the thermal energy generated by the light-emitting device 152 is conducted out in two paths, and since the first vertical extending portion 113b has a distance from the side wall portion 112, the The thermal energy of the upper end of the side wall portion 112 can also dissipate heat through the air in this space.
  • the extending portion 113 formed by the first horizontal extending portion 113a and the first vertical extending portion 113b can conduct heat generated by the at least one light source group 15 at the upper end of the side wall portion 112. To improve the heat dissipation efficiency of the side-entry backlight module 10.
  • FIG. 5 is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a second embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the second embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the first embodiment of the present invention, and therefore the same component symbols and names are used, but the difference is: in the second embodiment of the present invention In the extending portion 113 of the back plate heat dissipation structure 11, substantially the first vertical extending portion 113b is in contact with the side wall portion 112.
  • the thermal energy (including the thermal energy at the upper end) of the side wall portion 112 can be conducted through the first vertical extending portion 113b, which can improve the heat dissipation efficiency of the edge-lit backlight module 10, and is applicable.
  • the side-lit backlight module 10 having a narrower side.
  • FIG. 6 is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a third embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the third embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the second embodiment of the present invention, and therefore the same component symbols and names are used, but the difference is: the third embodiment of the present invention
  • the extending portion 113 of the back plate heat dissipation structure 11 further includes a second horizontal extending portion 113c formed by horizontally extending from a lower end of the first vertical extending portion 113b; and a second vertical extending portion 113d.
  • the extending portion 113 may further include a third horizontal extending portion 113e formed by horizontally extending from an upper end of the second vertical extending portion 113d; and a third vertical extending portion 113f.
  • the outer end of the third horizontal extending portion 113e is formed to extend vertically downward.
  • the first vertical extending portion 113b is in contact with the side wall portion 112, and the second vertical extending portion 113d is in contact with the first vertical extending portion 113b.
  • the vertical extending portion 113f is in contact with the second vertical extending portion 113d.
  • the heat conduction area can be increased by the first vertical extending portion 113b, the second vertical extending portion 113d, and the third vertical extending portion 113f, and the heat energy of the side wall portion 112 can be conducted (including the upper side)
  • the thermal energy of the end in addition to improving the heat dissipation efficiency of the side-entry backlight module, and reducing the material compared to the existing method of increasing the heat dissipation area by the aluminum heat conduction block (as shown in FIG. 2 of the background art) cost.
  • FIG. 7 is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a fourth embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the fourth embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the second embodiment of the present invention, and thus the same component symbols and names are used, but the difference is: the fourth embodiment of the present invention
  • the extension portion 113 of the back plate heat dissipation structure 11 further includes a second horizontal extension portion 113c extending horizontally inward or outward from the lower end of the first vertical extension portion 113b. As shown in FIG.
  • the second horizontal extending portion 113c is inwardly extended by the lower end of the first vertical extending portion 113b, and the second horizontal extending portion 113c is located at the main body of the backplane heat dissipating structure 11 (
  • the bottom portion 111) is below and is in contact with the main body (bottom portion 111) of the back sheet heat dissipation structure 11. Therefore, the thermal energy (including the thermal energy from the upper end) of the sidewall portion 112 can be conducted to the center of the backplane heat dissipation structure 11 through the first vertical extension portion 113b and the second horizontal extension portion 113c.
  • the purpose of improving the heat dissipation efficiency of the side-entry backlight module 10 is achieved.
  • FIG. 8 is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a fifth embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the fifth embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the fourth embodiment of the present invention, and therefore the same component symbols and names are used, but the difference is that the fifth embodiment of the present invention
  • the first vertical extension lib of the backplane heat dissipation structure 11 has a distance from the sidewall portion 112; in addition, the second horizontal extension 113c also has a distance from the bottom portion 111, That is, there is a distance between each of the side wall portions and/or between the bottom portions.
  • FIG. 9 is a partial side cross-sectional view showing a heat dissipation structure of a backplane of a side-entry backlight module according to a sixth embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the sixth embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the second embodiment of the present invention, and therefore the same component symbols and names are used, but the difference is that the sixth embodiment of the present invention
  • a plurality of through holes 17 are formed in the first vertical extending portion 113b of the back plate heat dissipation structure 11.
  • the present invention is not limited to the size and number of the heat dissipation holes 17, and the heat dissipation holes 17 may be selectively disposed on the vertical and/or the bottom portions to improve the side-entry backlight.
  • FIG. 10 is a partial side cross-sectional view showing a backplane heat dissipation structure of a side-entry backlight module according to a seventh embodiment of the present invention.
  • the backplane heat dissipation structure 11 of the seventh embodiment of the present invention is similar to the backplane heat dissipation structure 11 of the fourth embodiment of the present invention, and therefore the same component symbols and names are used, but the difference is that the seventh embodiment of the present invention
  • the second horizontal extending portion 113c of the back plate heat dissipating structure 11 is horizontally extended outwardly from the lower end of the second vertical portion 113b, and the second horizontal extending portion 113c is further connected to the second vertical extending portion 113d.
  • At least one heat pipe 18 is further disposed between the first vertical extending portion 113b and the second vertical extending portion 113d, and a gap between the heat pipe 18 and the side wall portions and the bottom portion can fill the Heat conductive material 16.
  • the heat pipe 18 can directly derive the thermal energy of the extending portion 113 according to actual needs, and can further improve the heat dissipation efficiency of the edge-lit backlight module 10.
  • the present invention is not limited to the position at which the heat pipe 18 is mounted, and may be mounted between any of the side wall portions or the respective bottom portions.
  • the heat dissipation path of the light source group of the existing side-entry backlight module can only be transmitted to the center of the heat dissipation structure of the backplane in a single direction, and the heat dissipation efficiency of the heat dissipation structure of the backplane cannot be improved.
  • the present invention can conduct heat generated by the at least one light source group 15 from the side wall portion 112 by the extending portion 113 extending outward from the upper end of the side wall portion 112 of the back plate heat dissipation structure 11 ( The thermal energy of the upper end is included to improve the heat dissipation efficiency of the integrated side-lit backlight module 10.

Abstract

提供了一种侧入式背光模块及其背板散热构造。所述侧入式背光模块的背板散热构造包含一底部、至少一侧壁部及一延伸部，所述底部形成所述背板散热构造的主体，所述至少一侧壁部是由所述底部的至少一侧缘向上延伸而形成的，并可供至少一光源组贴设于其内表面。所述延伸部是由所述侧壁部的上端向外延伸而形成的。至少一光源组于所述侧壁部位置所产生的热能通过所述侧壁部的上端传递到所述延伸部，以及通过所述侧壁部的下端传递到所述底部，以利用双向散热模式来提高整体所述侧入式背光模块的散热效率。

Description

侧入式背光模块及其背板散热构造
技术领域
本发明涉及一种侧入式背光模块及其背板散热构造， 特别是涉及一种能 提高散热效率的侧入式背光模块及其背板散热构造。 背景技术
在液晶显示器面板 (LCD panel)领域， 以发光二极管 (LED)做为背光光源 比冷阴极荧光管 (CCFL)具有节能环保等优势， 因此以 LED取代 CCFL将是 背光发展的趋势， 但 LED的散热问题仍是影响其发展的重要因素。请参照图 1所示， 图 1是一种现有侧入式背光模块的侧剖视图。 一侧入式背光模块 90 包含一背板散热构造 91， 所述背板散热构造 91的两侧缘上设有侧壁部 911， 且所述背板散热构造 91中央承载一导光板 92。所述导光板 92上设有一光学 膜片组 93， 另有一胶框 94包覆于所述背板散热构造 91的外缘， 且由上而下 的固定所述光学膜片组 93及所述导光板 92，以形成所述侧入式背光模块 90。 另外， 于所述侧入式背光模块 90上再迭设一液晶面板 80， 并且以一外壳 70 包覆及固定所述液晶面板 80及所述侧入式背光模块 90， 即组成一液晶显示 器。
如图 1所示， 所述侧入式背光模块 90的所述背板散热构造 91的所述侧 壁部 911在内表面上分别设有一光源组 95， 所述光源组 95具有数个发光装 置 951， 所述发光装置 951可以是 LED发光装置， 且其光源方向指向所述导 光板 92。所述发光装置 951—般通过螺丝锁附或导热胶带粘贴等方式来固定 于所述侧壁部 911上。 由于所述光源组 95运作的过程中会所产生的热能， 这 些热能会沿着图示中箭头的方向， 由所述侧壁部 911先向下再向内传导至所 述背板散热构造 91的中心位置， 以进行散热。 请再参考图 2所示，图 2是另一种现有侧入式背光模块的局部侧剖视图。 图 2的侧入式背光模块 90相似于图 1的侧入式背光模块 90，不同之处在于: 图 2的侧入式背光模块 90在所述光源组 95与所述背板散热构造 91之间另设 有一导热块 96，且所述导热块 96约呈 L型的贴设于所述背板散热构造 91及 其侧壁部 911上， 而所述导热块 96—般是选自铝 (A1)质的材料， 以挤出成型 的工艺来制作。 由于铝质的导热块 96具有更好的导热特性，并且所述铝质的 导热块 96与所述背板散热构造 91的接触面积更加大了。 因此， 所述光源组 95所产生的热能能更快的由所述侧壁部 911传导至所述背板散热构造 91中 心的方向， 以进行散热的作用。
然而， 上述的两种现有侧入式背光模块仍存在一问题， 也就是在所述背 板散热构造 91的侧壁部 911未再延伸， 因此所述光源组 95所产生的热能的 散热路径， 只能够沿着图示中箭头的方向来传导， 也就是由所述侧壁部 911 的下端单方向的往所述背板散热构造 91的中心位置来传导，无法提高所述背 板散热构造 91的散热效率。
因此， 有必要提供一种侧入式背光模块及其背板散热构造， 以解决现有 技术所存在的问题。 发明内容
本发明的主要目的是提供一种侧入式背光模块的背板散热构造， 通过自 背板散热构造的侧壁部上端进一步向外延伸形成的延伸部， 当至少一光源组 在侧壁部位置产生热能时， 侧壁部可往其上端的延伸部及其下端的底部来进 行双向传导热能， 以有效的提高所述背板散热构造的散热效率。
为达上述目的，本发明提供一种侧入式背光模块的背板散热构造，包含: 一底部， 形成所述背板散热构造的主体； 及
至少一侧壁部， 是由所述底部的至少一侧缘向上延伸而形成的， 其中至 少一光源组贴设于所述至少一侧壁部的内表面；
其中， 所述背板散热构造另包含一延伸部， 所述延伸部是由所述侧壁部 的上端向外延伸而形成的， 其中所述至少一光源组于所述侧壁部位置所产生 的热能通过所述侧壁部的上端传递到所述延伸部， 以及通过所述侧壁部的下 端传递到所述底部。
为达上述另一目的， 本发明提供一种侧入式背光模块， 包含：
一背板散热构造， 包含： 一底部及至少一侧壁部， 所述底部是所述背板 散热构造的主体， 及所述至少一侧壁部是由所述底部的至少一侧缘上向上延 伸而形成的；
一导光板， 设于所述背板散热构造上； 及
至少一光源组， 设于所述侧壁部的内表面， 并位于所述侧壁部及导光板 之间；
其中， 所述侧入式背光模块的所述背板散热构造另包含一延伸部， 所述 延伸部是由所述背板散热构造的侧壁部的上端向外延伸而形成的， 其中所述 至少一光源组于所述侧壁部位置所产生的热能通过所述侧壁部的上端传递到 所述延伸部， 以及通过所述侧壁部的下端传递到所述底部。
在本发明的一实施例中， 所述延伸部包含： 一第一水平延伸部， 是由所 述侧壁部的上端向外水平延伸而形成的； 及一第一垂直延伸部， 是由所述第 一水平延伸部的外端向下垂直延伸而形成的， 所述第一垂直延伸部与所述侧 壁部之间具有一距离。
在本发明的一实施例中， 所述侧壁部及第一垂直延伸部之间设有至少一 导热材或至少一热管。
在本发明的一实施例中， 所述侧壁部及第一垂直延伸部上设有多个贯穿 的散热孔， 以暴露所述至少一光源组的一电路基板的背面。
在本发明的一实施例中， 所述延伸部另包含： 一第二水平延伸部， 是由 所述第一垂直延伸部的下端向外水平延伸而形成的； 及一第二垂直延伸部， 由所述第二水平延伸部的外端向上垂直延伸而形成的。
在本发明的一实施例中， 所述第一垂直延伸部及第二垂直延伸部之间设 有至少一导热材或至少一热管。
在本发明的一实施例中， 所述侧壁部、 第一垂直延伸部及第二垂直延伸 部上设有多个贯穿的散热孔，以暴露所述至少一光源组的一电路基板的背面。
在本发明的一实施例中， 所述延伸部另包含： 一第二水平延伸部， 是由 所述第一垂直延伸部的下端向内水平延伸而形成的， 并位于所述底部下方。
在本发明的一实施例中， 所述底部及第二水平延伸部之间设有至少一导 热材或至少一热管。
在本发明的一实施例中， 所述延伸部另包含： 一第三水平延伸部， 是由 所述第二垂直延伸部的上端向外水平延伸而形成的； 及一第三垂直延伸部， 由所述第三水平延伸部的外端向下垂直延伸而形成的。
在本发明的一实施例中， 所述第二及第三垂直延伸部之间设有至少一导 热材或至少一热管。
在本发明的一实施例中， 所述侧壁部、 第一垂直延伸部、 第二垂直延伸 部及第三垂直延伸部上设有多个贯穿的散热孔， 以暴露所述至少一光源组的 一电路基板的背面。
在本发明的一实施例中， 所述至少一光源组包含一电路基板及一发光装 置， 所述电路基板贴设于所述侧壁部的内表面， 所述发光装置的光源方向指 向所述导光板。 附图说明
图 1 : 一种现有侧入式背光模块的侧剖视图。
图 2: 另一种现有侧入式背光模块的局部侧剖视图。 图 3 : 本发明第一实施例的侧入式背光模块的侧剖视图。
图 4: 本发明第一实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 5 : 本发明第二实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 6: 本发明第三实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 Ί : 本发明第四实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 8 : 本发明第五实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 9: 本发明第六实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。
图 10:本发明第七实施例的侧入式背光模块的背板散热构造的局部侧剖 视图。 具体实施方式
为让本发明上述目的、 特征及优点更明显易懂， 下文特举本发明较佳实 施例， 并配合附图， 作详细说明如下：
请参照图 3及所示， 图 3揭示本发明第一实施例的一种侧入式背光模块 的侧剖视图。一种侧入式背光模块 10包含一背板散热构造 11、一导光板 12、 一光学膜片组 13、一胶框 14及至少一光源组 15。所述背板散热构造 11包含 一底部 111及至少一侧壁部 112， 所述底部 111是一约呈长方形的所述背板 散热构造的主体， 所述底部 111的至少一侧缘上向上延伸出所述至少一侧壁 部 112。 所述导光板 12是设于所述背板散热构造 11上； 所述光学膜片组 13 是设于所述导光板 12上;所述胶框 14是包覆于所述背板散热构造 11的外缘， 且固定所述光学膜片组 13及所述导光板 12于所述背板散热构造 11上。另外， 所述至少一光源组 15是设于所述侧壁部 112的内侧面。 所述至少一光源组 15包含一电路基板 151及一发光装置 152， 所述电路基板 151贴设于所述侧 壁部 112的内表面， 所述发光装置 152的光源方向指向所述导光板 12。
请同时参照图 3及图 4所示， 图 4揭示本发明第一实施例的一种侧入式 背光模块的背板散热构造的局部侧剖视图。所述侧入式背光模块 10的所述背 板散热构造 11另包含一延伸部 113， 所述延伸部 113是由所述背板散热构造 11的侧壁部 112上端向外延伸的部份， 在本发明的第一实施例中， 所述延伸 部 113包含一第一水平延伸部 113a及一第一垂直延伸部 113b。 所述第一水 平延伸部 113a是由所述侧壁部 112的上端向外水平延伸；所述第一垂直延伸 部 113b是由所述第一水平延伸部 113a的外端向下垂直延伸， 所述第一垂直 延伸部 113b与所述侧壁部 112之间具有一距离。
另外， 所述光源组 15的所述发光装置 152优选是一 LED发光装置 152， 且其光源方向指向所述导光板 12。 并且， 所述光源组 15—般是通过螺丝锁 附或导热胶带粘贴等方式， 使所述电路板 151固定于所述侧壁部 112的内表 面上。 在本发明中， 所述背板散热构造 11的所述底部 111、 所述侧壁部 112 及所述延伸部 113优选为一体成型的钣金件， 因此， 所述发光装置 152所产 生的热能， 会通过所述电路板 151传导至所述侧壁部 112， 并且如图 4箭头 所示的方向， 位于所述侧壁部 112靠下端的热能会被传导至所述背板散热构 造 11中心的方向； 同时， 位于所述侧壁部 112靠上端的热能会被传导至所述 延伸部 113的所述第一水平延伸部 113a及所述第一垂直延伸部 113b。
如上所述， 所述发光装置 152所产生的热能是分成两个路径向外传导出 去， 并由于所述第一垂直延伸部 113b与所述侧壁部 112之间具有一距离， 因 此， 所述侧壁部 112靠上端的热能还可通过此空间内的空气来进行散热。 因 此， 所述第一水平延伸部 113a及所述第一垂直延伸部 113b所形成的所述延 伸部 113，可传导所述至少一光源组 15产生于所述侧壁部 112靠上端的热能， 以提高所述侧入式背光模块 10的散热效率。
请参照图 5所示， 图 5揭示本发明第二实施例的一种侧入式背光模块的 背板散热构造的局部侧剖视图。本发明第二实施例的背板散热构造 11相似于 本发明第一实施例的背板散热构造 11， 因此沿用相同的组件符号与名称， 但 其不同之处在于： 在本发明第二实施例的背板散热构造 11的所述延伸部 113 中， 实质上所述第一垂直延伸部 113b与所述侧壁部 112是接触贴齐的。 因此 位于所述侧壁部 112 的热能 (包含靠上端的热能)可透通过所述第一垂直延伸 部 113b传导出去， 其一样可提高所述侧入式背光模块 10的散热效率， 并且 可适用于具有较窄的所述侧入式背光模块 10的设计中。
请参照图 6所示， 图 6揭示本发明第三实施例的一种侧入式背光模块的 背板散热构造的局部侧剖视图。本发明第三实施例的背板散热构造 11相似于 本发明第二实施例的背板散热构造 11， 因此沿用相同的组件符号与名称， 但 其不同之处在于： 本发明第三实施例的背板散热构造 11 的所述延伸部 113 另包含一第二水平延伸部 113c， 是由所述第一垂直延伸部 113b 的下端向外 水平延伸而形成的； 及一第二垂直延伸部 113d， 由所述第二水平延伸部 113c 的外端向上垂直延伸而形成的。 或者， 所述延伸部 113还可再包含一第三水 平延伸部 113e， 是由所述第二垂直延伸部 113d的上端向外水平延伸而形成 的； 及一第三垂直延伸部 113f， 由所述第三水平延伸部 113e的外端向下垂直 延伸而形成的。实质上所述第一垂直延伸部 113b与所述侧壁部 112是接触贴 齐的，所述第二垂直延伸部 113d与所述第一垂直延伸部 113b是接触贴齐的， 所述第三垂直延伸部 113f与所述第二垂直延伸部 113d是接触贴齐的。因此， 可通过所述第一垂直延伸部 113b、 所述第二垂直延伸部 113d及所述第三垂 直延伸部 113f 增加导热的面积， 并传导出所述侧壁部 112的热能 (包含靠上 端的热能)， 除了达到提高所述侧入式背光模块的散热效率外， 并且相较于现 有以铝质导热块 (如背景技术的图 2 )加大散热面积的方式， 相较可减少材料 成本。
请参照图 7所示， 图 7揭示本发明第四实施例的一种侧入式背光模块的 背板散热构造的局部侧剖视图。本发明第四实施例的背板散热构造 11相似于 本发明第二实施例的背板散热构造 11， 因此沿用相同的组件符号与名称， 但 其不同之处在于： 本发明第四实施例的背板散热构造 11 的所述延伸部 113 另包含一第二水平延伸部 113c， 所述第二水平延伸部 113c是由所述第一垂 直延伸部 113b的下端向内或向外水平延伸。如图 7所示，所述第二水平延伸 部 113c是由所述第一垂直延伸部 113b的下端向内延伸， 并且所述第二水平 延伸部 113c位于所述背板散热构造 11的主体 (底部 111)的下方， 并且与所述 背板散热构造 11 的主体 (底部 111)是接触贴齐的。 因此， 可通过所述第一垂 直延伸部 113b及所述第二水平延伸部 113c传导出所述所述侧壁部 112的热 能 (包含靠上端的热能)至所述背板散热构造 11中心， 达到提高所述侧入式背 光模块 10的散热效率的目的。
请参照图 8所示， 图 8揭示本发明第五实施例的一种侧入式背光模块的 背板散热构造的局部侧剖视图。本发明第五实施例的背板散热构造 11相似于 本发明第四实施例的背板散热构造 11， 因此沿用相同的组件符号与名称， 但 其不同之处在于：本发明第五实施例的背板散热构造 11的所述第一垂直延伸 部 lib与所述侧壁部 112之间具有一距离； 另外， 所述第二水平延伸部 113c 与所述底部 111之间也具有一距离， 也就是说， 所述各侧壁部之间及 /或所述 各底部之间具有一距离。 并且， 如图 8所示， 可选择性的于所述各侧壁部与 所述各底部之间设置至少一导热材 16， 所述导热材 16可以选自具有良好的 导热特性的材质， 例如导热膏或导热胶带， 但本发明并不限于此。 通过所述 导热材 16的辅助可更加速所述侧入式背光模块 10的散热效率。 请参照图 9所示， 图 9揭示本发明第六实施例的一种侧入式背光模块的 背板散热构造的局部侧剖视图。本发明第六实施例的背板散热构造 11相似于 本发明第二实施例的背板散热构造 11， 因此沿用相同的组件符号与名称， 但 其不同之处在于：本发明第六实施例的背板散热构造 11的所述第一垂直延伸 部 113b上设有多个贯穿的散热孔 17。本发明并不限所述散热孔 17的形式大 小与数量， 并且所述散热孔 17也可以选择性的设在所述各垂直及 /或所述各 底部上， 以提高所述侧入式背光模块 10的散热效率。
请再参照图 10所示， 图 10揭示本发明第七实施例的一种侧入式背光模 块的背板散热构造的局部侧剖视图。 本发明第七实施例的背板散热构造 11 相似于本发明第四实施例的背板散热构造 11， 因此沿用相同的组件符号与名 称，但其不同之处在于：本发明第七实施例的背板散热构造 11的第二水平延 伸部 113c是由所述第二垂直 113b部的下端向外水平延伸而出， 所述第二水 平延伸部 113c后还向上接设一第二垂直延伸部 113d， 并且所述第一垂直延 伸部 113b与所述第二垂直延伸部 113d之间另设有至少一热管 18， 所述热管 18与所述各侧壁部及底部之间的空隙可填补所述导热材 16。 所述热管 18可 将所述延伸部 113的热能依实际的需要直接导出， 能更提高所述侧入式背光 模块 10的散热效率。 在此， 本发明并不限至所述热管 18所安装的位置， 其 可以是安装于任何所述各侧壁部或所述各底部之间。
综上所述， 相较于现有的侧入式背光模块的光源组的散热路径只能单方 向的往背板散热构造的中心来传导， 无法提高背板散热构造的散热效率。 本 发明通过由所述背板散热构造 11的所述侧壁部 112上端向外延伸设置的一述 延伸部 113， 可传导所述至少一光源组 15产生于所述侧壁部 112的热能 (包 含靠上端的热能)， 以提高整体所述侧入式背光模块 10的散热效率。
本发明已由上述相关实施例加以描述， 然而上述实施例仅为实施本发明 的范例。 必需指出的是， 已公开的实施例并未限制本发明的范围。 相反地， 包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围 内。

Claims

权 利 要 求
1. 一种侧入式背光模块， 包含：
一背板散热构造， 包含： 一底部及至少一侧壁部， 所述底部是所述背板 散热构造的主体， 及所述至少一侧壁部是由所述底部的至少一侧缘上向 上延伸而形成的；
一导光板， 设于所述背板散热构造上； 及
至少一光源组， 设于所述侧壁部的内表面， 并位于所述侧壁部及导光板 之间；
其特征在于： 所述侧入式背光模块的所述背板散热构造另包含一延伸部， 所述延伸部包含： 一第一水平延伸部， 是由所述侧壁部的上端向外水平 延伸而形成的； 及一第一垂直延伸部， 是由所述第一水平延伸部的外端 向下垂直延伸而形成的， 其中所述至少一光源组于所述侧壁部位置所产 生的热能通过所述侧壁部的上端传递到所述延伸部， 以及通过所述侧壁 部的下端传递到所述底部。
2. 一种侧入式背光模块， 包含：
一背板散热构造， 包含： 一底部及至少一侧壁部， 所述底部是所述背板 散热构造的主体， 及所述至少一侧壁部是由所述底部的至少一侧缘上向 上延伸而形成的；
一导光板， 设于所述背板散热构造上； 及
至少一光源组， 设于所述侧壁部的内表面， 并位于所述侧壁部及导光板 之间；
其特征在于： 所述侧入式背光模块的所述背板散热构造另包含一延伸部， 所述延伸部是由所述背板散热构造的侧壁部的上端向外延伸而形成的，其 中所述至少一光源组于所述侧壁部位置所产生的热能通过所述侧壁部的 上端传递到所述延伸部， 以及通过所述侧壁部的下端传递到所述底部。
3. 如权利要求 2所述的侧入式背光模块，其特征在于：所述至少一光源组包 含一电路基板及一发光装置， 所述电路基板贴设于所述侧壁部的内表面， 所述发光装置的光源方向指向所述导光板。
4. 一种侧入式背光模块的背板散热构造， 包含：
一底部， 形成所述背板散热构造的主体； 及
至少一侧壁部，是由所述底部的至少一侧缘向上延伸而形成的，其中至少 一光源组贴设于所述至少一侧壁部的内表面；
其特征在于：所述背板散热构造另包含一延伸部，所述延伸部是由所述侧 壁部的上端向外延伸而形成的，其中所述至少一光源组于所述侧壁部位置 所产生的热能通过所述侧壁部的上端传递到所述延伸部，以及通过所述侧 壁部的下端传递到所述底部。
5. 如权利要求 4所述的侧入式背光模块的背板散热构造，其特征在于：所述 延伸部包含：
一第一水平延伸部， 是由所述侧壁部的上端向外水平延伸而形成的； 及 一第一垂直延伸部，是由所述第一水平延伸部的外端向下垂直延伸而形成 的， 所述第一垂直延伸部与所述侧壁部之间具有一距离。
6. 如权利要求 5所述的侧入式背光模块的背板散热构造，其特征在于：所述 侧壁部及第一垂直延伸部之间设有至少一导热材或至少一热管。
7. 如权利要求 5所述的侧入式背光模块的背板散热构造，其特征在于：所述 侧壁部及第一垂直延伸部上设有多个贯穿的散热孔，以暴露所述至少一光 源组的一电路基板的背面。
8. 如权利要求 5所述的侧入式背光模块的背板散热构造，其特征在于：所述 延伸部另包含：
一第二水平延伸部，是由所述第一垂直延伸部的下端向外水平延伸而形成 的； 及 一第二垂直延伸部， 由所述第二水平延伸部的外端向上垂直延伸而形成 的。
9. 如权利要求 8所述的侧入式背光模块的背板散热构造，其特征在于：所述 第一及第二垂直延伸部之间设有至少一导热材或至少一热管。
10.如权利要求 8所述的侧入式背光模块的背板散热构造，其特征在于：所述 侧壁部、第一垂直延伸部及第二垂直延伸部上设有多个贯穿的散热孔， 以 暴露所述至少一光源组的一电路基板的背面。
11.如权利要求 5所述的侧入式背光模块的背板散热构造，其特征在于：所述 延伸部另包含：
一第二水平延伸部，是由所述第一垂直延伸部的下端向内水平延伸而形成 的， 并位于所述底部下方。
12.如权利要求 11所述的侧入式背光模块的背板散热构造， 其特征在于： 所 述底部及第二水平延伸部之间设有至少一导热材或至少一热管。
13.如权利要求 8所述的侧入式背光模块的背板散热构造，其特征在于：所述 延伸部另包含：
一第三水平延伸部，是由所述第二垂直延伸部的上端向外水平延伸而形成 的； 及
一第三垂直延伸部， 由所述第三水平延伸部的外端向下垂直延伸而形成 的。
14.如权利要求 13所述的侧入式背光模块的背板散热构造， 其特征在于： 所 述第二及第三垂直延伸部之间设有至少一导热材或至少一热管。
15.如权利要求 13所述的侧入式背光模块的背板散热构造， 其特征在于： 所 述侧壁部、第一垂直延伸部、第二垂直延伸部及第三垂直延伸部上设有多 个贯穿的散热孔， 以暴露所述至少一光源组的一电路基板的背面。
PCT/CN2010/077550 2010-07-12 2010-09-30 侧入式背光模块及其背板散热构造 WO2012006820A1 (zh)

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