WO2012005101A1 - Icタグ及びその製造方法 - Google Patents
Icタグ及びその製造方法 Download PDFInfo
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- WO2012005101A1 WO2012005101A1 PCT/JP2011/063923 JP2011063923W WO2012005101A1 WO 2012005101 A1 WO2012005101 A1 WO 2012005101A1 JP 2011063923 W JP2011063923 W JP 2011063923W WO 2012005101 A1 WO2012005101 A1 WO 2012005101A1
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- tag
- chip
- sheet
- covering portion
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
Definitions
- the present invention relates to an IC tag having a covering portion made of a resin material or a rubber material and a method of manufacturing the same.
- RFID technology is widely used to perform product management.
- a linen product such as a uniform or a sheet used in a hotel
- the IC tag is provided for cleaning along with the linen product. Therefore, an IC tag attached to such a product needs to be resistant to external force and resistant to a solution used for cleaning. Therefore, as an IC tag attached to a linen product, there is known one provided with a covering portion made of a resin material or a rubber material so as to cover the IC tag main body.
- FIG. 11 is a plan view of an IC tag according to a conventional example.
- FIG. 12 is a schematic cross-sectional view of an IC tag according to a conventional example.
- FIG. 12 corresponds to the CC cross section in FIG.
- the IC tag 100 includes a sheet 110 such as a resin film, an antenna unit 120 provided on the sheet 110, and an IC chip 130 electrically connected to the antenna unit 120.
- the IC tag main body including the sheet 110, the antenna unit 120, and the IC chip 130 is entirely covered with a covering portion 140 made of a resin material or a rubber material.
- the IC tag main body is covered by the covering portion 140, the IC chip 130 is protected against an external force and a cleaning solution.
- coated part 140 consists of a resin material and a rubber material, it has flexibility and pliability also in IC tag 100 whole, and it can use it suitably for linen products, such as a uniform and a sheet.
- the IC tag 100 is also used for clothes such as uniforms, further weight reduction, downsizing and improvement in flexibility are required.
- FIG. 13 is an explanatory view for explaining problems of the IC tag according to the conventional example.
- the covering portion 140 is formed by insert molding using the IC tag main body as an insert component.
- the covering portion 140 has a property of being swelled by the cleaning solution, and swells to about three times the original volume by swelling.
- the covering portions 140 on both sides swell by the same amount because they swell by the same amount. 110 does not deform. However, if the thickness on both sides is different, the amount of expansion is different, so the sheet 110 is deformed to bend.
- the present invention adopts the following means in order to solve the above problems.
- the IC tag of the present invention is A flexible sheet, An antenna unit formed on the sheet; An IC chip electrically connected to the antenna unit; A covering portion which is made of a material made of at least one of resin and rubber, and covers the IC chip; In the IC tag equipped with The covering portion is provided only on the side of the sheet on which the IC chip is provided.
- the covering portion is provided only on the side of the sheet on which the IC chip is provided, the weight and size can be reduced as compared with the configuration in which the entire IC tag body is covered with the covering portion. Flexibility can be improved. Further, the amount of material used for the covering portion can be reduced, which leads to cost reduction. Then, when the covering portion swells and the like, the sheet is bent so that the side of the sheet on which the IC chip is provided is convex even when the IC tag is deformed. There is no such thing as cracking.
- the covering portion may be provided so as to locally cover an area where the IC chip is provided.
- the method for producing an IC tag of the present invention is A flexible sheet, An antenna unit formed on the sheet; An IC chip electrically connected to the antenna unit; And a covering portion made of a material comprising at least one of resin and rubber, and covering the IC chip,
- the covering portion is a method of manufacturing an IC tag provided only on the side of the sheet on which the IC chip is provided, Forming a plurality of antenna portions on a flexible sheet material; Mounting an IC chip on each of the antenna units formed in the sheet material;
- a sheet material on which a plurality of IC chips are mounted is an insert part, and insert molding is performed using a material made of at least one of resin and rubber, and a surface on which the plurality of IC chips in the sheet material is provided Forming a covering on the side; Forming a plurality of IC tags by punching the insert-molded product; It is characterized by including.
- the insert part in the present invention is a sheet material on which a plurality of IC chips are mounted, the number of positioning operations of the insert part in the mold can be reduced with respect to the desired number of IC tags produced. it can. That is, assuming that the number of IC tags produced is m and the number of IC chips mounted on the sheet material (the number of antenna parts is also the same) is n, the number of positioning operations of insert parts in the mold is ( m / n)
- a plurality of ICs on the sheet material are locally covered so as to locally cover the region where the IC chip is provided in the region where the IC tag is formed by the punching process.
- the covering portion may be formed to collectively cover the chip.
- the material used for the insert molding may be an adhesive rubber in which the sheet material and the cover adhere to each other without applying an adhesive to the sheet material on which the IC chip is mounted.
- the step of applying the adhesive to the sheet material becomes unnecessary before the insert molding in order to bond the sheet material and the covering portion, and the productivity can be further enhanced.
- FIG. 1 is a plan view of an IC tag according to a first embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view (AA cross-sectional view in FIG. 1) of the IC tag according to the first embodiment of the present invention.
- FIG. 3 is a plan view showing an intermediate product in the manufacturing process in the method for manufacturing an IC tag according to the first embodiment of the present invention.
- FIG. 4 is a plan view showing an intermediate product in the manufacturing process of the method for manufacturing an IC tag according to the first embodiment of the present invention.
- FIG. 5 is a plan view showing an intermediate product in the manufacturing process of the method for manufacturing an IC tag according to the first embodiment of the present invention.
- FIG. 1 is a plan view of an IC tag according to a first embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view (AA cross-sectional view in FIG. 1) of the IC tag according to the first embodiment of the present invention.
- FIG. 3 is a plan view showing an intermediate
- FIG. 6 is a view showing a state in which the final step of the manufacturing process in the method for manufacturing an IC tag according to the first embodiment of the present invention is completed.
- FIG. 7 is a plan view of an IC tag according to a second embodiment of the present invention.
- FIG. 8 is a schematic cross-sectional view (cross-sectional view BB in FIG. 7) of the IC tag according to the second embodiment of the present invention.
- FIG. 9 is a plan view showing an intermediate product in the manufacturing process of the method for manufacturing an IC tag according to the second embodiment of the present invention.
- FIG. 10 is a view showing a state in which the final step of the manufacturing process in the method for manufacturing an IC tag according to the second embodiment of the present invention is completed.
- FIG. 10 is a view showing a state in which the final step of the manufacturing process in the method for manufacturing an IC tag according to the second embodiment of the present invention is completed.
- FIG. 11 is a plan view of an IC tag according to a conventional example.
- FIG. 12 is a schematic cross-sectional view (cross-sectional view CC in FIG. 11) of the IC tag according to the conventional example.
- FIG. 13 is an explanatory view for explaining problems of the IC tag according to the conventional example.
- Example 1 An IC tag according to a first embodiment of the present invention and a method of manufacturing the same will be described with reference to FIGS. 1 to 6.
- the IC tag which concerns on a present Example is used for RFID, and, in particular, is suitably used as an IC tag attached to a linen product.
- the IC tag 10 includes a sheet 11 having flexibility (flexibility), an antenna unit 12 formed on the sheet 11, and an IC chip 13 electrically connected to the antenna unit 12. There is.
- the IC tag 10 is provided with a covering portion 14 that covers the IC chip 13.
- the covering portion 14 is made of a material made of at least one of resin and rubber. Further, the covering portion 14 is provided only on the side of the sheet 11 on which the IC chip 13 is provided. Moreover, in the present embodiment, the covering portion 14 is provided so as to locally cover the region where the IC chip 13 is provided. That is, most of the area of the antenna unit 12 is not covered.
- the plurality of antenna portions 12 are formed on a sheet material 11 a having flexibility (flexibility) such as a resin film.
- a sheet material 11 a having flexibility such as a resin film.
- polyethylene terephthalate, polyethylene naphthalate or polyimide can be mentioned.
- a general FPC (flexible printed circuit) manufacturing technique may be used for this process. Since such a technique is known, the detailed description thereof is omitted, but for the formation of the antenna portion 12, for example, the copper foil is etched on the resin film or the screen printing is performed on the resin film.
- the part 12 can be formed.
- FIG. 3 shows a plan view of the intermediate product obtained by this process.
- the intermediate product has a configuration in which a base film and a cover film, which are sheet materials, are provided on both sides of the antenna unit 12 on both sides.
- the thickness of this intermediate product is, for example, about 0.2 mm.
- Step 2 The IC chip 13 is mounted on each of the antenna units 12 formed on the sheet material 11 a with respect to the intermediate product obtained in the step 1.
- FIG. 4 shows a plan view of the intermediate product obtained by this process.
- Step 3 The intermediate product obtained in step 2 is used as an insert part for insert molding.
- a molding material resin, rubber, or a mixed material of resin and rubber can be used.
- the material of the adhesive has resistance to the solution used for cleaning.
- fluororubber is used as a molding material, it is preferable to use a fluorocarbon adhesive.
- step 2 when using an adhesive rubber (for example, adhesive silicone rubber (Shin-Etsu Chemical X-34-1277 A / B (trade name) etc.) as a molding material, the intermediate product obtained in step 2 is used as it is. Place in the mold. In this case, the step of applying the adhesive can be omitted.
- adhesive rubber for example, adhesive silicone rubber (Shin-Etsu Chemical X-34-1277 A / B (trade name) etc.
- the covering portion 14a is formed on the side of the sheet material 11a on which the plurality of IC chips 13 are provided.
- FIG. 5 shows a plan view of the intermediate product obtained by this process.
- the maximum thickness of the covering portion 14a (the thickness of the portion where the IC chip 13 is provided) may be about 1 mm.
- the area where the IC chip 13 is provided in the area where the IC tag 10 is formed by the punching process, which is the next process, is locally covered, and on the sheet material 11a.
- a covering portion 14 a is formed to collectively cover the plurality of IC chips 13.
- Step 4 The intermediate product obtained in step 3 is punched using a Thomson blade or the like.
- a thick line L in FIG. 6 indicates a punching line. As shown in the drawing, punching is performed so as to respectively surround the plurality of antenna units 12 on which the IC chip 13 is mounted.
- IC tags 10 By this punching process, a plurality (12 in the case of this embodiment) of IC tags 10 can be obtained. 6 also shows a plan view of the IC tag 10 obtained by punching.
- the adhesive material is one that is resistant to the solution used for cleaning.
- the IC tag 10 according to the present embodiment, most of it is constituted by the thin sheet 11, and the covering portion 14 is provided only in the vicinity where the IC chip 13 is provided. And this coating
- the IC tag 10 according to the present embodiment may be used for various products as well as linen products.
- the IC chip 13 and the like are preferably selected by selecting the material of the covering portion 14 and the material of the adhesive in the case of applying the adhesive to the intermediate product obtained in Step 2. Can be protected.
- the covering portion 14 is provided only on the side of the sheet 11 on which the IC chip 13 is provided, the weight is reduced as compared with the conventional configuration in which the entire IC tag main body is covered with the covering portion. , Can be made more compact and flexible. In addition, the amount of material used for the covering portion 14 can be reduced, which leads to cost reduction.
- the covering portion 14 swells and the like, and even if the IC tag 10 is deformed, the sheet 11 is bent so that the side on which the IC chip 13 is provided is convex, In the vicinity, there is no case where the covering portion 14 is cracked.
- the covering portion 14 is provided so as to locally cover the region where the IC chip 13 is provided, the amount of the material used for the covering portion 14 is reduced as much as possible. be able to. Therefore, weight reduction, compactness and flexibility can be effectively improved. Moreover, the deformation of the sheet 11 due to the swelling of the covering portion 14 can be effectively suppressed.
- the covering unit 14 most of the area of the antenna unit 12 is not covered by the covering unit 14, so the influence of the dielectric constant of the covering unit 14 on the antenna unit 12 can be suppressed. . Therefore, it is possible to suppress the influence on the reading accuracy of the antenna unit 12 caused by the variation in the thickness of the covering unit 14 due to molding.
- a plurality of IC tags 10 in which the covering portion 14 is formed on the side on which the IC chip 13 is provided can be obtained by the manufacturing process of one cycle.
- the insert component according to the present embodiment is the sheet material 11a on which the plurality of IC chips 13 are mounted, it is possible to position the insert component in the mold with respect to the desired number of IC tags 10 produced. You can reduce the number of times. That is, when the number of IC tags 10 produced is m, and the number of IC chips 13 mounted on the sheet 11a (the number of antenna portions 12 is the same) is n, the work of positioning the insert part in the mold The number of times can be (m / n).
- a plurality of regions on the sheet material 11 a may be provided to locally cover the region where the IC chip 13 is provided in the region where the IC tag 10 is formed by punching.
- a method is employed in which the covering portion 14 is formed to cover the IC chip 13 collectively. Therefore, the number of mold gates can be reduced as compared with the case where the covering portion is individually formed for each IC chip, so that the structure of the mold can be simplified and waste material (gate The amount of remaining material can be reduced.
- Example 2 shows a second embodiment of the present invention.
- the covering portion is provided to locally cover the area where the IC chip is provided.
- the covering portion is a sheet The structure in the case of being provided over the whole surface side by which the IC chip is provided is shown.
- the IC tag 20 includes a sheet 21 having flexibility (flexibility), an antenna unit 22 formed on the sheet 21, and an antenna unit 22. And an IC chip 23 electrically connected.
- the covering part 24 which covers the IC chip 23 is provided also in the IC tag 20 which concerns on a present Example.
- the covering portion 24 is made of a material made of at least one of resin and rubber. Further, the covering portion 24 is provided only on the side of the sheet 21 on which the IC chip 23 is provided. In the present embodiment, the covering portion 24 is provided to cover the entire surface of the sheet 21 on which the IC chip 23 is provided.
- step 3 The steps up to mounting the IC chip 23, that is, the steps 1 and 2 in the first embodiment, are the same as those in the first embodiment, and thus the description thereof is omitted.
- step 3 the step of performing insert molding
- Step 3 The intermediate product obtained in step 2 is used as an insert part for insert molding.
- the presence or absence of the molding material, the adhesive, and the adhesive is as described in the first embodiment, and thus the description thereof is omitted.
- the covering portion 24a is formed on the side of the sheet material 21a on which the plurality of IC chips 23 are provided.
- FIG. 9 shows a plan view of the intermediate product obtained by this process.
- the thickness of the IC chip 23 is about 0.5 mm
- the thickness of the covering portion 24 a may be about 1 mm.
- the covering portion 24 a is formed so as to cover the entire surface of one side of the sheet material 21 a (the side on which the IC chip 23 is mounted).
- Step 4 The intermediate product obtained in step 3 is punched using a Thomson blade or the like.
- a thick line L in FIG. 10 indicates a punching line. As shown in the drawing, punching is performed so as to respectively surround the plurality of antenna units 22 on which the IC chip 23 is mounted.
- FIG. 10 also shows a plan view of the IC tag 20 obtained by punching.
- the adhesive material used is one that is resistant to the solution used for cleaning.
- the same effect as that of the first embodiment can be obtained.
- the configuration in which the entire surface on one side of the sheet 21 is covered with the covering portion 24 is adopted, weight reduction, downsizing and flexibility are inferior as compared with the case of the first embodiment. ing.
- the amount of deformation of the IC tag 20 when the covering portion 24 expands due to swelling or the like also becomes larger than that of the first embodiment.
- the dielectric constant of the covering portion 24 may affect the antenna portion 22.
- the structure of the mold used for insert molding can be simplified as compared with the case of the first embodiment.
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Abstract
Description
可撓性を有するシートと、
該シートに形成されたアンテナ部と、
該アンテナ部と電気的に接続するICチップと、
樹脂及びゴムのうちの少なくともいずれか一方からなる材料により構成され、前記ICチップを覆う被覆部と、
を備えたICタグにおいて、
前記被覆部は、前記シートにおける前記ICチップが備えられている面側にのみ設けられていることを特徴とする。
可撓性を有するシートと、
該シートに形成されたアンテナ部と、
該アンテナ部と電気的に接続するICチップと、
樹脂及びゴムのうちの少なくともいずれか一方からなる材料により構成され、前記ICチップを覆う被覆部と、を備え、
前記被覆部は、前記シートにおける前記ICチップが備えられている面側にのみ設けられているICタグを製造する方法であって、
可撓性を有するシート材に複数のアンテナ部を形成する工程と、
前記シート材に形成された各アンテナ部に対して、それぞれICチップを実装する工程と、
複数のICチップが実装されたシート材をインサート部品として、樹脂及びゴムのうちの少なくともいずれか一方からなる材料を用いてインサート成形を行い、前記シート材における複数のICチップが備えられている面側に被覆部を形成する工程と、
インサート成形品に打ち抜き加工を施すことによって、複数のICタグを形成する工程と、
を含むことを特徴とする。
図1~図6を参照して、本発明の実施例1に係るICタグ及びその製造方法について説明する。なお、本実施例に係るICタグは、RFIDに用いられるもので、特に、リネン製品に取付けられるICタグとして、好適に用いられる。
図1及び図2を参照して、本発明の実施例1に係るICタグについて説明する。本実施例に係るICタグ10は、可撓性(柔軟性)を有するシート11と、シート11に形成されたアンテナ部12と、アンテナ部12と電気的に接続するICチップ13とを備えている。
特に、図3~図6を参照して、本発明の実施例1に係るICタグの製造方法について説明する。
樹脂フィルムなどの可撓性(柔軟性)を有するシート材11aに複数のアンテナ部12を形成する。シート材11aに用いる材料の例としては、ポリエチレンテレフタレート、ポリエチレンナフタレートまたはポリイミドを挙げることができる。なお、この工程については、一般的なFPC(フレキシブルプリント回路)の製造技術を用いれば良い。かかる技術は公知であるので、その詳細な説明は省略するが、アンテナ部12の形成については、例えば、樹脂フィルムに銅箔をエッチングしたり、樹脂フィルムにスクリーン印刷を行ったりすることで、アンテナ部12を形成することができる。
工程1で得られた中間製品に対して、シート材11aに形成された各アンテナ部12に対して、それぞれICチップ13を実装する。図4はこの工程によって得られた中間製品の平面図を示している。
工程2で得られた中間製品をインサート部品として、インサート成形を行う。成形材料としては、樹脂,ゴム、または樹脂とゴムの混合材料を用いることができる。より具体的な例としては、シリコーンゴム、フッ素ゴム、ニトリルゴム、ブチルゴム及びEPDM等を挙げることができる。なお、これらの材料を用いる場合には、工程2で得られた中間製品の表面と裏面にそれぞれ接着剤を塗布した後に、金型内に配置する。本実施例に係る製造方法によって製造されるICタグ10においては、接着剤による層も露出するため、当該接着剤の材料には、クリーニングに使用される溶液に対する耐性を有するものを用いる。なお、例えば、成形材料としてフッ素ゴムを用いた場合には、フッ素系の接着剤を用いるとよい。
工程3で得られた中間製品に対して、トムソン刃などを用いて打ち抜き加工を行う。図6中の太線Lは打ち抜く線を示している。図示のように、それぞれICチップ13が実装された複数のアンテナ部12の周囲をそれぞれ取り囲むように、打ち抜く。
本実施例に係るICタグ10においては、シート11と被覆部14とは密着した状態であるので、クリーニングに用いる溶液などがICタグ10の内部に浸入してしまうことはない。従って、外力やクリーニング溶液からICチップ13及びICチップ13とアンテナ部12との接続部(通常、半田による接続部)を保護することができる。
図7~図10には、本発明の実施例2が示されている。上記実施例1においては、被覆部が、ICチップが備えられている領域を局所的に覆うように設けられている場合の構成を示したが、本実施例においては、被覆部が、シートにおけるICチップが備えられている面側の全面に亘って設けられる場合の構成を示す。
図7及び図8を参照して、本発明の実施例2に係るICタグについて説明する。本実施例に係るICタグ20は、上記実施例1のICタグ10と同様に、可撓性(柔軟性)を有するシート21と、シート21に形成されたアンテナ部22と、アンテナ部22と電気的に接続するICチップ23とを備えている。
特に、図9及び図10を参照して、本発明の実施例2に係るICタグの製造方法について説明する。
工程2で得られた中間製品をインサート部品として、インサート成形を行う。成形材料や接着剤、及び接着剤の有無に関しては、上記実施例1で説明した通りであるので、その説明は省略する。
工程3で得られた中間製品に対して、トムソン刃などを用いて打ち抜き加工を行う。図10中の太線Lは打ち抜く線を示している。図示のように、それぞれICチップ23が実装された複数のアンテナ部22の周囲をそれぞれ取り囲むように、打ち抜く。
11,21 シート
11a,21a シート材
12,22 アンテナ部
13,23 ICチップ
14,14a,24,24a 被覆部
Claims (5)
- 可撓性を有するシートと、
該シートに形成されたアンテナ部と、
該アンテナ部と電気的に接続するICチップと、
樹脂及びゴムのうちの少なくともいずれか一方からなる材料により構成され、前記ICチップを覆う被覆部と、
を備えたICタグにおいて、
前記被覆部は、前記シートにおける前記ICチップが備えられている面側にのみ設けられていることを特徴とするICタグ。 - 前記被覆部は、前記ICチップが備えられている領域を局所的に覆うように設けられていることを特徴とする請求項1に記載のICタグ。
- 可撓性を有するシートと、
該シートに形成されたアンテナ部と、
該アンテナ部と電気的に接続するICチップと、
樹脂及びゴムのうちの少なくともいずれか一方からなる材料により構成され、前記ICチップを覆う被覆部と、を備え、
前記被覆部は、前記シートにおける前記ICチップが備えられている面側にのみ設けられているICタグを製造する方法であって、
可撓性を有するシート材に複数のアンテナ部を形成する工程と、
前記シート材に形成された各アンテナ部に対して、それぞれICチップを実装する工程と、
複数のICチップが実装されたシート材をインサート部品として、樹脂及びゴムのうちの少なくともいずれか一方からなる材料を用いてインサート成形を行い、前記シート材における複数のICチップが備えられている面側に被覆部を形成する工程と、
インサート成形品に打ち抜き加工を施すことによって、複数のICタグを形成する工程と、
を含むことを特徴とするICタグの製造方法。 - 前記被覆部を形成する工程においては、前記打ち抜き加工によってICタグが形成される領域のうち、前記ICチップが備えられている領域を局所的に覆うように、かつ前記シート材上の複数のICチップをまとめて覆うように、前記被覆部を形成することを特徴とする請求項3に記載のICタグの製造方法。
- 前記インサート成形に用いる材料は、前記ICチップが実装されたシート材に接着剤を塗布することなく該シート材と被覆部が接着する接着ゴムであることを特徴とする請求項3または4に記載のICタグの製造方法。
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CN104106084A (zh) * | 2012-02-09 | 2014-10-15 | Nok株式会社 | Ic标签 |
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JP2015125566A (ja) | 2013-12-26 | 2015-07-06 | Nok株式会社 | Icタグ |
JP6504338B2 (ja) * | 2014-01-27 | 2019-04-24 | Nok株式会社 | 対象物管理システムに使用するrfidタグ及び対象物管理システム |
CN204650569U (zh) | 2014-04-22 | 2015-09-16 | 株式会社村田制作所 | 无线通信标签 |
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JP2005036324A (ja) * | 2003-07-15 | 2005-02-10 | Toray Ind Inc | 複合繊維シート |
JP2005338956A (ja) * | 2004-05-24 | 2005-12-08 | Maxell Seiki Kk | 無線icタグの製造方法 |
JP2007108983A (ja) * | 2005-10-13 | 2007-04-26 | Matsushita Electric Ind Co Ltd | Ic実装モジュールとその製造方法および製造装置 |
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JP2005056362A (ja) | 2003-08-07 | 2005-03-03 | Seiko Precision Inc | Icタグ |
JP2008299465A (ja) * | 2007-05-30 | 2008-12-11 | Dainippon Printing Co Ltd | 非接触型icタグ及び非接触型icタグの製造方法 |
JP5139239B2 (ja) * | 2008-11-17 | 2013-02-06 | 富士通株式会社 | Rfidタグ |
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JP2005036324A (ja) * | 2003-07-15 | 2005-02-10 | Toray Ind Inc | 複合繊維シート |
JP2005338956A (ja) * | 2004-05-24 | 2005-12-08 | Maxell Seiki Kk | 無線icタグの製造方法 |
JP2007108983A (ja) * | 2005-10-13 | 2007-04-26 | Matsushita Electric Ind Co Ltd | Ic実装モジュールとその製造方法および製造装置 |
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CN104106084A (zh) * | 2012-02-09 | 2014-10-15 | Nok株式会社 | Ic标签 |
US9324019B2 (en) | 2012-02-09 | 2016-04-26 | Nok Corporation | IC tag |
CN104106084B (zh) * | 2012-02-09 | 2017-02-22 | Nok株式会社 | Ic标签 |
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DE212011100117U1 (de) | 2013-02-20 |
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