WO2011159251A1 - Thermosiphon pour refroidir des composants électroniques - Google Patents

Thermosiphon pour refroidir des composants électroniques Download PDF

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Publication number
WO2011159251A1
WO2011159251A1 PCT/SG2010/000229 SG2010000229W WO2011159251A1 WO 2011159251 A1 WO2011159251 A1 WO 2011159251A1 SG 2010000229 W SG2010000229 W SG 2010000229W WO 2011159251 A1 WO2011159251 A1 WO 2011159251A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermosyphon
evaporator section
section
condensate
working fluid
Prior art date
Application number
PCT/SG2010/000229
Other languages
English (en)
Inventor
Kim Choon Ng
Christopher R. Yap
Su Hui Joseph Ng
Mark Aaron Chan
Original Assignee
Gatekeeper Laboratories Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gatekeeper Laboratories Pte Ltd filed Critical Gatekeeper Laboratories Pte Ltd
Priority to US13/139,869 priority Critical patent/US20120024500A1/en
Priority to PCT/SG2010/000229 priority patent/WO2011159251A1/fr
Priority to SG2011040565A priority patent/SG177233A1/en
Publication of WO2011159251A1 publication Critical patent/WO2011159251A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • thermosyphons and more particularly to thermosyphons for cooling electronic components such as, for example, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
  • CPUs central processing units
  • GPUs graphics processing units
  • concentrating solar cells concentrating solar cells.
  • Thermal management is an important aspect in the design of electronic packaging. Proper thermal management of electronic devices ensures that operating temperatures remain within a reliable operating range. Operating at temperatures beyond the set boundary is undesirable as it leads to lower device performance, an increased probability of failure and a reduced lifespan.
  • the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a condensate guide lining an inner portion of the evaporator section and inner surfaces of the condenser section.
  • the condensate guide defines a vapour core in the evaporator and condenser sections and is configured to return condensate to the evaporator section regardless of an orientation of the thermosyphon.
  • this allows operation of the thermosyphon at various physical orientations with minimal or no performance degradation.
  • the condensate guide includes a plurality of pores, the pores of the condensate guide being sized to allow vapour to pass through and prevent condensate flow through.
  • this aids in returning the condensate to the evaporator section.
  • a boiling enhancement structure may be coupled to the evaporator section.
  • the boiling enhancement structure enhances nucleate boiling at the evaporator section and thereby increases the boiling heat transfer coefficient.
  • the boiling enhancement structure may include a plurality of pin fins. Preferably, a separation between adjacent ones of the pin fins is less than a bubble characteristic length of a working fluid in the evaporator section.
  • the bubble confinement effect enhances nucleate boiling of the working fluid and consequently increases heat transfer away from the heat source.
  • the boiling enhancement structure is configured to draw the condensate back to the evaporator section. Advantageously, this enhances the heat transfer process.
  • the boiling enhancement structure is integrally formed with a heat receiving portion of the evaporator section.
  • this reduces the heat transfer resistance.
  • a thermal interface material is coupled to the heat receiving portion of the evaporator section.
  • this further reduces the heat transfer resistance.
  • a working fluid is provided in the evaporator section in an amount sufficient to submerge the boiling enhancement structure.
  • the working fluid is preferably in a saturated state.
  • One of a plurality of grooves and a plurality of knurls may be formed on the inner surfaces of the condenser section for condensation enhancement.
  • a port is provided for charging the evaporation section with a working fluid and for deaerating the thermosyphon.
  • the present invention provides a thermosyphon including an evaporator section, a condenser section coupled to the evaporator section, and a boiling enhancement structure coupled to the evaporator section.
  • the boiling enhancement structure includes a plurality of pin fins.
  • the boiling enhancement structure enhances nucleate boiling at the evaporator section and increases both the boiling heat transfer coefficient and critical heat flux.
  • FIG. 1 is an enlarged cross-sectional view of a thermosyphon in accordance with one embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view of a boiling enhancement structure for the thermosyphon of FIG. 1.
  • thermosyphon 10 for cooling electronic components such as, for example, central processing units (CPUs) and graphics processing units (GPUs) is shown.
  • the thermosyphon 10 includes an evaporator section 12, a condenser section 14 coupled to the evaporator section 12, and a condensate guide 16 lining an inner portion of the evaporator section 12 and inner surfaces of the condenser section 14.
  • a vapour core 18 is defined in the evaporator and condenser sections 12 and 14 by the condensate guide 16.
  • a boiling enhancement structure 20 is coupled to the evaporator section 12.
  • a working fluid 22 is provided in the evaporator section 12 in an amount sufficient to submerge the boiling enhancement structure 20.
  • the boiling enhancement structure 20 is integrally formed with a heat receiving portion 24 of the evaporator section 12.
  • a thermal interface material 26 is coupled to the heat receiving portion 24 of the evaporator section 12.
  • a port 28 is provided for deaerating the thermosyphon 10 and for charging the evaporation section 12 with the working fluid 22.
  • a plurality of fins 30 is coupled to the condenser section 14.
  • the thermosyphon 10 is hermetically-sealed and is configured to receive heat from a heat source (not shown).
  • the heat source may have a high heat flux and examples of the heat source include, but are not limited to, central processing units (CPUs), graphics processing units (GPUs) and concentrating solar cells.
  • the heat receiving portion 24 of the evaporator section 12 includes a base plate 32.
  • the base plate 32 may be mounted or attached to the heat source.
  • the base plate 32 is preferably fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite.
  • the condenser section 14 is connected to and in fluid communication with the evaporator section 12.
  • the condenser section 14 includes a tube 34 and a top cover 36, the top cover 36 sealing one end of the tube 34.
  • the tube 34 and the top cover 36 are bonded via a bonding process such as welding, soldering or diffusion.
  • the tube 34 is preferably made of a thermally conductive material such as, for example, aluminium, copper, silver or graphite.
  • the condenser section 14 is provided with an external means of heat exchange in the form of the cooling fins 30 extending from the tube 34 of the condenser section 14.
  • the fins 30 are attached to the tube 34 with a degree of interference in order to have proper contact and thereby avoid the presence of gaps that could deteriorate the heat transfer performance of the fins 30.
  • the fins 30 are preferably made of a thermally conductive material such as, for example, copper or aluminium.
  • the condenser section 14 may be cooled by other well known methods of cooling such as, for example, evaporative cooling, liquid cooling, spray cooling and impinging jet. Further, for condensation enhancement, an inner surface of the tube 34 of the condenser section 14 may be formed with a plurality of grooves or a knurled surface.
  • the condensate guide 16 is configured to return condensate to the evaporator section 12 regardless of an orientation of the thermosyphon 10.
  • the condensate guide 16 is porous and the pores of the condensate guide 16 are sized to allow vapour to pass through and prevent condensate flow through. More particularly, the pores of the condensate guide 16 are designed small enough such that liquid is held by surface tension against liquid flow.
  • the condensate guide 16 lines the boiling enhancement structure 20, the inner walls of the tube 34 and an inner surface of the top cover 36.
  • the condensate guide 16 guides the flow of the condensate back to the evaporator section 12. Orientation independence of the thermosyphon 10 is thus achieved with the condensate guide 16.
  • the condensate guide 16 may be made from a perforated sheet, a metallic wire mesh for structural integrity, or other porous medium. In one embodiment, the pores of the condensate guide 16 have a diameter of between about 0.1 millimetre (mm) and about 2 mm.
  • the vapour core 18 serves as a conduit for vapour generated from the evaporator section 12 to flow into the condenser section 14 and is therefore designed in a manner such that vapour flow is not constricted so as to prevent pressure build up in the evaporator section 12.
  • the boiling enhancement structure 20 is employed within the evaporator section 12 and forms a part of the internal surface of the evaporator section 12.
  • the boiling enhancement structure 20 of the thermosyphon 10 of FIG. 1 is shown.
  • the boiling enhancement structure 20 comprises a plurality of pin fins 38 integrally formed or mounted on an interior surface of the base plate 32.
  • a circular groove 40 is formed in the base plate 32 for receiving the tube 34 of the condenser section 14.
  • the boiling enhancement structure 20 improves the boiling heat transfer coefficient by increasing the number of nucleation sites and the heat transfer surface area. Additionally, the boiling enhancement structure 20 also improves the critical heat flux by effectively minimizing the build-up of vapour film in the evaporator section 12 which causes dry out.
  • a separation between adjacent ones of the pin fins 38 is less than a bubble characteristic length of the working fluid 22 in the evaporator section 12.
  • ⁇ represents surface tension
  • g gravitational acceleration
  • p liquid density
  • p vapour density
  • the boiling enhancement structure 20 is configured to draw the condensate back to the evaporator section 12. More particularly, the boiling enhancement structure 20 serves as a thermally activated pumping unit that absorbs condensate from the condenser section 12.
  • the boiling enhancement structure 20 and the base plate 32 may be fabricated from a thermally conductive material such as, for example, aluminium, copper, silver or graphite.
  • the pin fins 38 may be bonded to the base plate 32 via known bonding methods such as, for example, soldering, brazing or diffusion.
  • each of the pin fins 38 has a square profile. In one embodiment, each of the pin fins 38 has a height of between about 2 mm and about 20 mm and a thickness of between about 0.5 mm and about 5 mm. However, it should be understood that the pin fins 38 are not limited to these geometric parameters as optimization of the geometric parameters such as fin profile, fin thickness and fin height is determined based on the thermal properties of the material from which the boiling enhancement structure 20 and the base plate 32 are made and the boiling heat transfer coefficient of the working fluid 22 for a specific geometry. In alternative embodiments, the boiling enhancement structure 20 may be other forms of fins, grooves or an open-cell metal foam.
  • the working fluid 22 is preferably in a saturated state.
  • the working fluid 22 undergoes phase change instantaneously at any temperature within the component operating range.
  • the working fluid 22 include, for example, water, a refrigerant or a dielectric fluid.
  • the boiling enhancement structure 20 is fully immersed in the working fluid 22.
  • this maximizes the boiling heat transfer.
  • the thermal interface material 26 serves to reduce thermal interface resistance between the heat receiving portion 24 and the heat source.
  • the port 28 functions as an evacuation port that is sealed subsequent to liquid charging and deaeration.
  • the port 28 is provided in the form of a tube and is located on the top cover 36.
  • thermosyphon 10 The operation of the thermosyphon 10 will now be described with reference to FIG. 1.
  • an electronic component In use, an electronic component generates heat. Heat from the electronic component is absorbed by the base plate 32 and spreads from the base plate 32 to the boiling enhancement structure 20 where nucleate boiling of the working fluid 22 occurs and the working fluid 22 changes from a liquid to a vapour. Vapour bubbles are formed on the heated surface of the boiling enhancement structure 20 creating a higher pressure region in the evaporator section 12. The higher pressure at the evaporator section 12 drives the vapour through the vapour core 18 to the condenser section 14 where pressure is lower. As the walls of the condenser section 14 are at a lower temperature compared to the vapour, the vapour condenses into a liquid condensate on the walls of the condenser section 14 and releases latent heat of vaporization in the process. The heat released from the condensation process is rejected to an external medium via the fins 30 coupled to the condenser section 14.
  • the liquid condensate is enclosed by the walls of the condenser section 14 and the condensate guide 16 and is forced to flow between the walls of the condenser section 14 and the condensate guide 16 back to the evaporator section 12 by gravity and the capillary force provided by the boiling enhancement structure 20.
  • the present invention provides an orientation-free, two-phase thermosyphon that effectively transfers heat from a heat dissipating component to a colder medium.
  • the thermosyphon of the present invention can be operated at various physical orientations with minimal or no performance degradation.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

L'invention porte sur un thermosiphon, qui comprend une section d'évaporateur, une section de condenseur couplée à la section d'évaporateur, et un guide de condensat chemisant une partie interne de la section d'évaporateur et des surfaces internes de la section de condenseur. Le guide de condensat définit un cœur de vapeur dans les sections d'évaporateur et de condenseur, et est configuré de façon à renvoyer le condensat à la section d'évaporateur quelle que soit une orientation du thermosiphon.
PCT/SG2010/000229 2010-06-18 2010-06-18 Thermosiphon pour refroidir des composants électroniques WO2011159251A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US13/139,869 US20120024500A1 (en) 2010-06-18 2010-06-18 Thermosyphon for cooling electronic components
PCT/SG2010/000229 WO2011159251A1 (fr) 2010-06-18 2010-06-18 Thermosiphon pour refroidir des composants électroniques
SG2011040565A SG177233A1 (en) 2010-06-18 2010-06-18 Thermosyphon for cooling electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2010/000229 WO2011159251A1 (fr) 2010-06-18 2010-06-18 Thermosiphon pour refroidir des composants électroniques

Publications (1)

Publication Number Publication Date
WO2011159251A1 true WO2011159251A1 (fr) 2011-12-22

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PCT/SG2010/000229 WO2011159251A1 (fr) 2010-06-18 2010-06-18 Thermosiphon pour refroidir des composants électroniques

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US (1) US20120024500A1 (fr)
SG (1) SG177233A1 (fr)
WO (1) WO2011159251A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2503108A (en) * 2013-06-10 2013-12-18 Gert Pille Cooling Photo-Voltaic Cells Using Thermosyphon Cooling Circuit
US10638648B2 (en) 2016-04-28 2020-04-28 Ge Energy Power Conversion Technology Ltd. Cooling system with pressure regulation
US9894815B1 (en) 2016-08-08 2018-02-13 General Electric Company Heat removal assembly for use with a power converter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1481787A (en) * 1974-10-10 1977-08-03 Secretary Industry Brit Two-phase thermosyphons
US20020195242A1 (en) * 2001-06-20 2002-12-26 Garner Scott D. Porous vapor valve for improved loop thermosiphon performance
US20030151896A1 (en) * 2002-02-12 2003-08-14 Roy Zeighami Loop thermosyphon using microchannel etched semiconductor die as evaporator
US20040070941A1 (en) * 2002-10-15 2004-04-15 Debashis Ghosh Compact thermosiphon with enhanced condenser for electronics cooling
US20050024831A1 (en) * 2003-07-28 2005-02-03 Phillips Alfred L. Flexible loop thermosyphon
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629840A (en) * 1992-05-15 1997-05-13 Digital Equipment Corporation High powered die with bus bars
US6907918B2 (en) * 2002-02-13 2005-06-21 Thermal Corp. Deformable end cap for heat pipe
US6793009B1 (en) * 2003-06-10 2004-09-21 Thermal Corp. CTE-matched heat pipe
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
TWI307399B (en) * 2005-09-09 2009-03-11 Delta Electronics Inc Heat dissipation module and heat pipe thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1481787A (en) * 1974-10-10 1977-08-03 Secretary Industry Brit Two-phase thermosyphons
US20020195242A1 (en) * 2001-06-20 2002-12-26 Garner Scott D. Porous vapor valve for improved loop thermosiphon performance
US20030151896A1 (en) * 2002-02-12 2003-08-14 Roy Zeighami Loop thermosyphon using microchannel etched semiconductor die as evaporator
US20040070941A1 (en) * 2002-10-15 2004-04-15 Debashis Ghosh Compact thermosiphon with enhanced condenser for electronics cooling
US20050024831A1 (en) * 2003-07-28 2005-02-03 Phillips Alfred L. Flexible loop thermosyphon
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices

Also Published As

Publication number Publication date
SG177233A1 (en) 2012-02-28
US20120024500A1 (en) 2012-02-02

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