WO2011158396A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
WO2011158396A1
WO2011158396A1 PCT/JP2010/070869 JP2010070869W WO2011158396A1 WO 2011158396 A1 WO2011158396 A1 WO 2011158396A1 JP 2010070869 W JP2010070869 W JP 2010070869W WO 2011158396 A1 WO2011158396 A1 WO 2011158396A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
main body
radiator
plate
heat
Prior art date
Application number
PCT/JP2010/070869
Other languages
English (en)
Japanese (ja)
Inventor
隆泰 佐藤
大鳳 河
Original Assignee
Satoh Takayasu
Ha Dae Bong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Satoh Takayasu, Ha Dae Bong filed Critical Satoh Takayasu
Publication of WO2011158396A1 publication Critical patent/WO2011158396A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an illumination device using an LED element having a positive electrode terminal and a negative electrode terminal in a light emitting body.
  • ⁇ Lighting devices using LED elements are roughly classified into direct current drive or alternating current drive.
  • DC-driven LED elements require a separate drive circuit consisting of an AC-DC converter IC that converts the supplied commercial AC voltage to DC voltage, LED element drive ICs, etc. Since the drive circuit is not necessary, it is expected to be used for a lighting device.
  • the amount of light emitted from the LED element must be increased. In this case, heat generated in the light emitting body of the LED element cannot be ignored.
  • LED elements when the heat of the light emitting body increases, not only the luminous efficiency (light emission ratio to the supplied power) decreases, but also the life of the LED element itself is shortened. Is required.
  • Patent Document 1 discloses a conventional lighting device that uses LED elements to attach LED elements to a metal substrate (PCB) in consideration of heat dissipation, and further attaches a heat sink to the metal substrate (Patent Document 1). [0008] to [0011] and [FIG. 11]), and a lighting device (Patent Document 1 [Claim 1]) to which a water cooling means (water cooling jacket) is further added is proposed.
  • the light emitting body of the LED element transfers heat to the heat medium (refrigerant liquid) of the water cooling means, and the heat medium is cooled by the radiator and repeatedly dissipated to cool the heat body of the LED element (Patent Document 1). [0026]).
  • a decrease in the luminous efficiency of the LED element is suppressed, and the lifetime can be extended, and higher output can be realized as a lighting device (Patent Document 1 [0027]).
  • the heat sink is not preferable because it increases the size and weight of the lighting device using the LED element, and the increase in the number of parts increases the manufacturing cost and the assembly cost. Furthermore, if the heat dissipation from the heat sink further to the outside is insufficient, there may be a problem that heat accumulates on the metal substrate or the heat sink.
  • a lighting device that uses LED elements with a positive terminal and a negative terminal on the light-emitting body, and connects the heat-dissipating body with the light-emitting body and a normal substrate or metal with a power supply line.
  • a terminal radiator is thermally and electrically connected to the positive terminal and the negative terminal interposed between the substrate, the positive terminal, and the negative terminal, and the main body radiator includes a flat body connecting plate,
  • the illumination device includes a cylindrical main body diffusion plate extending from the outer peripheral edge of the main body connection plate, and the light emitting main body of the LED element is mounted on the main body connection plate.
  • a metal substrate is omitted, a terminal radiator is interposed between a normal substrate (which may be a separate metal substrate) provided with a power supply line, and a positive electrode terminal and a negative electrode terminal. It is the structure which connected the heat radiator.
  • the positive electrode terminal and the negative electrode terminal of the LED element are thermally and electrically connected to the terminal radiator, and the heat generated in the light emitting body of the LED element is transferred from the positive electrode terminal and the negative electrode terminal to the terminal radiator. And indirectly radiating heat, and the light emitting body is thermally connected to the main body heat radiator, and the heat generated in the light emitting main body is directly radiated from the main body heat radiator.
  • the entire LED element is thermally connected to either the terminal heat sink or the main body heat sink, realizing high heat dissipation and increasing the temperature of the LED element even when the output of the lighting device is increased. Can be suppressed or prevented.
  • thermally connected means a connection form in which heat is transferred indirectly from the light emitting body through the positive electrode terminal and the negative electrode terminal or directly from the light emitting body, and “electrically” is connected. It means a connection form in which driving power can be supplied through a power supply line. From this, the terminal radiator is thermally connected to the positive electrode terminal and the negative electrode terminal, and from the relationship of connecting the positive electrode terminal and the negative electrode terminal to the power supply line, a metal body, preferably a metal plate, specifically a copper plate or a silver plate.
  • the main body heat radiator does not need to be electrically connected to the light emitting main body, for example, a ceramic body having a high thermal conductivity may be used, but a metal body, preferably a metal plate, according to the terminal heat radiator, Specifically, a copper plate or a silver plate is used.
  • the diamond layer may be formed by depositing diamond powder. Specifically, diamond powder is directly deposited on the surface of the main body heat sink to form a diamond layer, or diamond powder is mixed into a ceramic having excellent thermal conductivity, and the ceramic is applied to the surface of the main body heat sink. By curing, a ceramic layer mixed with diamond powder is formed as a diamond layer.
  • the main body radiator is composed of a main body connection plate that thermally connects the light emitting main body and a main body diffusion plate that is thermally connected to the main body connection plate.
  • the main body heat sink is configured as a plate material, the specific surface area (the ratio of the surface area per unit mass) increases, and heat dissipation becomes easier.
  • the main body heat sink is composed of a main body connection plate and a main body diffusion plate so that the main body connection plate can easily support the light emitting main body, and the main body diffusion plate is suitable for heat dissipation (for example, exposed to the outside).
  • the structure can be easily fixed to the illuminating device main body. This means that the light emitting main body is supported by the lighting device main body via the main body diffusion plate and the main body connection plate, and eliminates the possibility of contact with the terminal radiator (to ensure insulation).
  • the terminal radiator is composed of a flat terminal connection plate smaller than the opening provided in the main body connection plate and a flat terminal diffusion plate extending from the terminal connection plate to the inside of the main body diffusion plate.
  • a positive electrode terminal and a negative electrode terminal of the LED element are connected to a terminal connection plate viewed through the formed opening, an insulating member is interposed in an insulating slit formed between the opening and the terminal connection plate, and a power supply line is provided.
  • the terminal diffusion plate may be connected to a normal substrate or a metal substrate.
  • the terminal connection plate can be easily connected to the positive electrode terminal and the negative electrode terminal, the terminal diffusion plate is suitable for heat dissipation, and the lighting device
  • the structure can be easily fixed to the body. This means that the positive electrode terminal and the negative electrode terminal are supported by the illuminating device main body via the terminal diffusing plate and the terminal connection plate, thereby eliminating the possibility of contacting the main body heat dissipating member (ensuring insulation).
  • the illuminating device of the present invention has a conventional structure in which heat generated in the LED element is easily radiated from the heat sink via the metal substrate by directly radiating heat from the LED element through the main body radiator and the terminal radiator. In comparison, the temperature rise of the LED element can be suppressed or prevented.
  • the diamond layer interposed between the light emitting body and the main body heat sink facilitates heat transfer from the light emitting main body to the main body heat sink, and further promotes the diffusion of heat in the main body heat sink to suppress the temperature rise of the light emitting main body. Or it can be prevented.
  • the illuminating device of the present invention prevents a reduction in luminous efficiency and lifetime of the LED element due to heat generation, enables a higher output of the illuminating device using the LED element, and an illuminating device using the LED element. Expand the range of use.
  • the main body heatsink and terminal heatsink directly receive heat from the LED element and dissipate it, so that the LED element can be cooled sufficiently even if it is smaller than the heatsink in the same type of lighting device.
  • the device can be reduced in size and weight. To reduce the size and weight of lighting devices, increase the specific surface area by using plate materials, and reduce the size of the main body heatsink and terminal heatsink by providing the role of connecting plate and diffuser, or interpose a diamond layer. In addition, it is also realized by reducing the size of the main body heat sink by facilitating heat dissipation from the main body heat sink.
  • the main body heatsink and terminal heatsink are made of metal plates, specifically copper plates or silver plates, heat transfer and heat dissipation will be improved, and the amount of material required for molding will be reduced and processing will be facilitated. Therefore, material cost and manufacturing cost can be suppressed. Furthermore, even when viewed as a whole lighting device, the fact that the metal substrate can be omitted brings about reduction of material cost and manufacturing cost. In this manner, the lighting device of the present invention brings about the effects of reducing the size and weight of the lighting device, and suppressing the cost increase or reducing the cost.
  • FIG. 1 It is a perspective view showing an example of the illuminating device to which this invention is applied. It is a vertical sectional view of the illumination device of this example. It is a disassembled perspective view of the illuminating device of this example. It is a perspective view before the assembly
  • the present invention can be applied to an illuminating device 1 driven by alternating current.
  • the illumination device 1 of this example includes a cover module 11, a light guide module 12, a radiator holding module 13, a main body radiator 14, and a terminal radiator. 15, 15, a normal module 17 having a socket module 16 and a power supply line, the LED element 2 is held by the radiator holding module 13, and the light emitting body 21 is thermally applied to the body connecting plate 141 of the body radiator 14.
  • the positive terminal 22 and the negative terminal 23 are thermally and electrically connected to the respective terminal connection plates 151 of the separate terminal radiators 15, respectively.
  • the cover module 11 is a resin member that covers and protects the light guide module 12, and is formed using, for example, polybutylene terephthalate (PBT).
  • PBT polybutylene terephthalate
  • the front end opening 111 makes the periphery contact the upper surface of the hemispherical light guide 121 of the light guide module 12, and the fitting periphery 112 serving as the lower end is fitted to the outer peripheral surface of the holding base 131 of the radiator holding module 12.
  • the tip opening 111 is made of a translucent material (glass or transparent resin plate). A translucent plate or lens is attached.
  • the light guide module 12 guides the LED light emitted from the light emitting body 21 of the LED element 2 and irradiates it from the front end opening 111 of the cover module 11, and the hemispherical light guide 121.
  • PBT polybutylene terephthalate
  • the hemispherical light guide 121 inserts the light emitting body 21 of the LED element 2 into a light introducing hole 123 provided through the support base 122, and diffuses the LED light toward the upper surface while refracting or reflecting the LED light.
  • the light guide module 12 of this example is positioned with a part of the peripheral surface of the support base 122 inscribed in a reinforcing rib 136 provided on the holding base 131 of the radiator holding module 13, and the holding base 131 and the cover module 11 are positioned. The position is fixed by being sandwiched between the peripheral edge forming the front end opening 111 of the front end.
  • the radiator holding module 13 is a resin member that holds the main body radiator 14 and the terminal radiator 15 in an insulating state, and is formed using, for example, polybutylene terephthalate (PBT).
  • PBT polybutylene terephthalate
  • the holding base 131 having a slightly smaller planar view on the main body connection plate 141 that is circular in plan view of the main body radiator 14 and a pair of assembly posts 132 and 132 that are lowered downward from the bottom surface of the holding base 131. It consists of.
  • the assembly post 132 is screwed to the post screw fixing portion 162 of the socket module 16 to integrate the heat radiator holding module 13 to the socket module 16, and the post engagement notches 143 and 153 of the main body connection plate 141 and the terminal connection plate 151. To prevent contact between the main body radiator 14 and the terminal radiator 15 and to position them.
  • the holding base 131 is a disk provided with an annular reinforcing rib 136 on the periphery of the upper surface, and is provided with a light emitting main body opening 133 having a rectangular shape in plan view similar to the bridging portion of the main body connecting plate 141 in the center in plan view.
  • a pair of terminal insertion holes 135, 135 are provided across the opening 133.
  • Insulating beams 134 and 134 are provided on the bottom side along the longitudinal side edge of the light emitting main body opening 133 (see FIGS. 4 and 5.
  • FIG. 5 shows the main body diffusion plate 142 and the terminal diffusion plate 152 for convenience of explanation. (Not shown).
  • the insulating beam 134 is inserted into an insulating slit 18 formed between the main body connection plate 141 and the terminal connection plate 151, and prevents and positions the main body heat radiator 14 and the terminal heat radiator 15 from contacting each other.
  • the main body radiator 14 includes a main body connection plate 141 and a main body diffusion plate 142 made of copper (or silver) having a thickness of 0.1 mm to 0.5 mm.
  • the main body connection plate 141 is a plate material provided with an opening that is larger than the terminal connection plate 151 of the terminal radiator 15 by the width of the insulating slit 18 from the circular copper plate that contacts the back surface of the reference plate 131 of the radiator holding module 13.
  • a post-engagement notch 143 that abuts the assembly post 132 extending from the body holding module 13 from the outside of the radius is provided at the center of the arc portion of the opening.
  • the main body connecting plate 141 is positioned by pressing the insulating beam 134 inserted into the insulating slit 18 in the linear portion of the opening and the assembly post 132 from the inside of the opening, and the holding base 131 of the radiator holding module 13 is positioned.
  • the main body connection plate 141 is brought into contact with the back surface, and the lower end of the main body diffusion plate 142 is externally fitted to the main body diffusion plate fitting rib 161 of the socket module 16 to fix the position.
  • the main body connection plate 141 of this example is thermally connected to the light emitting body 21 of the LED element 2, a ceramic paste (for example, titanium oxide (TiO 2 ) 9 wt. % To 15wt%, Ceramic beads (Ceramic bead, Porosity 12% to 20%) 10wt% to 15wt%, Diamond powder 0.5wt% to 1wt%, Other kerosene (White sprit) or Mineral oil ) Is applied and sintered to form the diamond layer 144.
  • a ceramic paste for example, titanium oxide (TiO 2 ) 9 wt. % To 15wt%, Ceramic beads (Ceramic bead, Porosity 12% to 20%) 10wt% to 15wt%, Diamond powder 0.5wt% to 1wt%, Other kerosene (White sprit) or Mineral oil
  • the main body diffusion plate 142 is a cylinder extending downward from the outer peripheral edge of the main body connection plate 141, and is positioned and fixed by being externally fitted to the main body diffusion plate fitting rib 161 of the socket module 16.
  • the main body diffusion plate 142 of this example is exposed to the outside (see FIGS. 1 and 2), and smoothly dissipates the heat transmitted from the light emitting main body 21 to the outside.
  • the thermal conductivity is improved from the light emitting body 21 to the body connecting plate 141, and the specific surface area is large because the body diffusion plate 142 is cylindrical. Because it is exposed to the outside, heat dissipation is excellent. Thus, the cooling efficiency of the light emitting body 21 is increased.
  • the terminal radiator 15 includes a copper (or silver) terminal connection plate 151 and a terminal diffusion plate 152 having a thickness of 0.1 mm to 0.5 mm.
  • the terminal connection plate 151 is a semi-arc-shaped plate material that is smaller by the groove width of the insulating slit 18 than the opening provided in the main body connection plate 141, and is paired with a post hooking notch 143 provided in the main body connection plate 141.
  • a post-engagement notch 153 that abuts the assembly post 132 extending from the radiator holding module 13 from the inside of the radius is provided at the center of the arc portion.
  • the terminal connecting plate 151 is positioned by being sandwiched between the insulating beam 134 inserted into the insulating slit 18 in the straight portion and the assembly post 132 in a state where the terminal connecting plate 151 is viewed from the opening provided in the main body connecting plate 141, and heat is dissipated.
  • the terminal connection plate 151 is brought into contact with the back surface of the holding base 131 of the body holding module 13, and the positioning is fixed by inserting the positioning protrusion 154 of the terminal diffusion plate 152 into the insertion hole 171 of the normal board 17 positioned in the socket module 16. Is done.
  • the terminal diffusion plate 152 is a plate surface that is bent downward and extends from a straight portion located inside the radius of the terminal connection plate 151.
  • the heat released from the terminal diffusion plate 152 is once released into the internal space of the cylindrical main body diffusion plate 142, absorbed by the main body diffusion plate 142, and released again from the main body diffusion plate 142 to the outside. There is no problem because the heat transmitted through the positive terminal 22 and the negative terminal 23 is small.
  • the terminal dissipating plate 152 of this example is provided with a positioning projection 154 at the center of the lower edge to be inserted into the insertion hole 164 provided in the normal substrate 17 that is fixed to the socket module 16 by the assembly post 132.
  • the terminal radiating plate 152 is fixed at the upper edge by the terminal connecting plate 151 sandwiched between the assembly post 132 and the insulating beam 134 of the radiator holding module 13, and the positioning protrusion 154 is inserted into the normal board 17.
  • the lower edge is fixed in position by being inserted into the hole 171, and does not come into contact with the main body radiator 14.
  • the socket module 16 is a member provided with a male screw-shaped socket 163.
  • the socket 16 alone is formed of a metal member while being entirely formed of polybutylene terephthalate (PBT).
  • PBT polybutylene terephthalate
  • the socket module 16 of the present example is configured so that the main body heat dissipation plate 142 is fitted to the main body heat dissipating plate fitting rib 161 formed on the periphery of the upper end to position the main body heat dissipating body 14 and assembled to the post screw fixing portion 162.
  • the radiator holding module 13 is positioned by screwing the post 132, and the main body radiator 14 and the terminal radiator 15 are positioned and fixed in position via the radiator holding module 13.
  • the normal substrate 17 is a substrate (PCB) or a metal substrate (metal PCB) provided with a power supply line (not shown).
  • the normal board 17 of this example connects a feeding line to the insertion hole 171 and electrically connects the positioning protrusion 154 of the terminal diffusion plate 152 inserted into the insertion hole 171 and the feeding line.
  • the power supply line is connected to the socket 163 via the lead wire 172.
  • the normal board 17 of the present example is designed to fix the position of the normal board 17 itself so that the terminal dissipating plate 152 can be fixed via the positioning protrusion 154 inserted into the insertion hole 171.
  • An assembly post 132 screwed to 162 is fitted into the post through hole 173.
  • the AC voltage supplied through the socket 163 of the socket module 16 is applied to the positive electrode terminal 22 and the negative electrode terminal 23 of the LED element 2 through the lead wire 172, the power supply line, and the terminal radiators 15 and 15.
  • the main body radiator 14 and terminal heat dissipation are achieved by the assembly post 132 and insulating beam 134 of the radiator holder module 13, the main body radiation plate fitting rib 161 of the socket module 16, and the normal substrate 17.
  • the body 15 is positioned and fixed in a state of being insulated from each other. Thereby, as seen in FIG.
  • the LED element 2 presses the light emitting body 21 against the body connecting plate 21 and thermally connects the above-
  • the positive electrode terminal 22 and the negative electrode terminal 23 projecting from the light emitting main body 21 are brought into contact with the terminal connection plate 151 seen through the opening provided in the main body connection plate 141, and are electrically and thermally connected, for example, by soldering.
  • the specific surface area can be extremely large, and it can be regarded as a heat sink directly connected to the LED element 2 from a thermal viewpoint.
  • the main body connection plate 141 and The terminal connection plate 151 can be configured to easily connect the light emitting body 21, the positive electrode terminal 22, and the negative electrode terminal 23, and the main body diffusion plate 142 and the terminal diffusion plate 152 can be configured to be suitable for heat dissipation, positioning, and position fixing.
  • the main body radiator 14 and the terminal radiator 15 in the present invention are also excellent as a heat sink for the LED element 2.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention se rapporte à un dispositif d'éclairage qui utilise un élément LED, comporte un nouveau moyen de refroidissement ajouté à celui-ci, et qui permet une sortie augmentée, une taille réduite, un poids réduit, et un coût réduit. L'invention décrit spécifiquement un dispositif d'éclairage (1) qui utilise un élément LED (2) qui est pourvu d'une borne cathode (22) et d'une borne anode (23) sur un corps luminescent (21). La borne cathode (22) et la borne anode (23) sont reliées thermiquement et électriquement à un corps de dissipation de chaleur de borne (15) ; le corps de dissipation de chaleur de borne (15) est relié à une ligne d'alimentation ; le corps luminescent (21) est thermiquement relié à un corps de dissipation de chaleur de corps principal (14), qui est électriquement isolé vis-à-vis du corps de dissipation de chaleur de borne (15) ; et le dispositif d'éclairage (1) est supporté par le corps de dissipation de chaleur de corps principal (14).
PCT/JP2010/070869 2010-06-16 2010-11-24 Dispositif d'éclairage WO2011158396A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-137478 2010-06-16
JP2010137478A JP4602477B1 (ja) 2010-06-16 2010-06-16 照明装置

Publications (1)

Publication Number Publication Date
WO2011158396A1 true WO2011158396A1 (fr) 2011-12-22

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PCT/JP2010/070869 WO2011158396A1 (fr) 2010-06-16 2010-11-24 Dispositif d'éclairage

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Country Link
JP (1) JP4602477B1 (fr)
KR (1) KR101071665B1 (fr)
TW (1) TW201213719A (fr)
WO (1) WO2011158396A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097416B2 (en) * 2011-01-20 2015-08-04 Koninklijke Philips N.V. Multi-functional heat sink for lighting products
JP5908673B2 (ja) * 2011-03-11 2016-04-26 ローム株式会社 Ｌｅｄ電球
JP5178930B1 (ja) * 2011-03-11 2013-04-10 株式会社東芝 照明装置
JP5670936B2 (ja) 2012-02-27 2015-02-18 株式会社東芝 照明装置
US9625111B2 (en) * 2012-07-23 2017-04-18 Guizhou Gzgps Co., Ltd. Method for forming LED bulb with high interchangeability and universality and integrated LED bulb and lamp
JP6055458B2 (ja) * 2014-12-16 2016-12-27 株式会社東芝 照明装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006313727A (ja) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ
JP3144055U (ja) * 2008-06-03 2008-08-14 陳鴻文 発光ダイオードランプ
JP2009129934A (ja) * 2007-11-20 2009-06-11 Panasonic Corp 光半導体装置用ステム
JP3152951U (ja) * 2008-06-09 2009-08-20 立徳瑞科技股▲ふん▼有限公司 照明装置
JP2010050472A (ja) * 2001-12-29 2010-03-04 Hangzhou Fuyang Xinying Electronics Co Ltd 発光ダイオード・ランプ及び発光ダイオード交通灯

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050472A (ja) * 2001-12-29 2010-03-04 Hangzhou Fuyang Xinying Electronics Co Ltd 発光ダイオード・ランプ及び発光ダイオード交通灯
JP2006313727A (ja) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp 電球型ランプ
JP2009129934A (ja) * 2007-11-20 2009-06-11 Panasonic Corp 光半導体装置用ステム
JP3144055U (ja) * 2008-06-03 2008-08-14 陳鴻文 発光ダイオードランプ
JP3152951U (ja) * 2008-06-09 2009-08-20 立徳瑞科技股▲ふん▼有限公司 照明装置

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TW201213719A (en) 2012-04-01
KR101071665B1 (ko) 2011-10-11
JP4602477B1 (ja) 2010-12-22
JP2012003932A (ja) 2012-01-05

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