WO2011152215A1 - 光走査素子およびそれを用いた画像表示装置 - Google Patents
光走査素子およびそれを用いた画像表示装置 Download PDFInfo
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- WO2011152215A1 WO2011152215A1 PCT/JP2011/061417 JP2011061417W WO2011152215A1 WO 2011152215 A1 WO2011152215 A1 WO 2011152215A1 JP 2011061417 W JP2011061417 W JP 2011061417W WO 2011152215 A1 WO2011152215 A1 WO 2011152215A1
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- optical scanning
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
- G02B5/0825—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only
- G02B5/0833—Multilayer mirrors, i.e. having two or more reflecting layers the reflecting layers comprising dielectric materials only comprising inorganic materials only
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0858—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by piezoelectric means
Definitions
- the present invention relates to an optical scanning element that scans a screen with a light beam, and more particularly to an optical scanning element that includes a rotatable mirror.
- Japanese Patent Application Laid-Open No. 2004-228561 discloses a vibrating body including a mirror portion and a torsion spring portion that rotatably supports the mirror portion, a fixing portion to which the vibrating body is fixed, and a torsion spring portion having a resonance frequency. Describes an optical deflector having a drive unit that reciprocally vibrates the mirror unit by deforming the lens.
- the mirror part includes a base part made of silicon, and a reflective film made of metal (Al, Au, etc.) is formed on the base part.
- the rigidity of the torsion spring portion changes due to the temperature rise, and the resonance frequency of the torsion spring portion changes accordingly.
- the resonance frequency of the torsion spring portion changes, the deflection angle changes accordingly, making it difficult to accurately scan the light beam.
- Patent Document 1 describes an optical deflector having a heat dissipation structure.
- This optical deflector includes a solid heat transfer body that covers the vibrating body in addition to the above-described vibrating body, fixed portion, and driving portion.
- the solid heat transfer body is made of a metal such as Al. The heat generated by the light absorption is radiated to the outside from the reflective film through the solid heat transfer body.
- Patent Document 2 discloses that a light source, a MEMS mirror that scans a screen with a light beam from the light source, an auxiliary light source that irradiates the MEMS mirror with a light beam, and a constant temperature of the MEMS mirror.
- the MEMS mirror includes a mirror portion made of a dielectric multilayer film, a first substrate on which the mirror portion is mounted, two beams that rotatably support the first substrate, and first beams on which the beams are fixed. 2 substrates. These beams and the second substrate correspond to the torsion spring portion.
- the MEMS mirror part of incident light from the light source is reflected by the dielectric multilayer film, and the remaining light is absorbed by the dielectric multilayer film or the first substrate.
- the reflectance of the dielectric multilayer film in the wavelength range of light from the light source is 98% or more.
- the light from the auxiliary light source is also irradiated to the mirror part of the MEMS mirror.
- the wavelength range of the auxiliary light source is different from the wavelength range of the light source. Since the dielectric multilayer film has a reflectance of several percent in the wavelength range of the auxiliary light source, most of the light from the auxiliary light source is absorbed by the dielectric multilayer film or the first substrate.
- control unit is configured so that the total amount of the energy amount of light from the light source absorbed by the mirror unit and the energy amount of light from the auxiliary light source absorbed by the mirror unit is constant. Controls the amount of light emitted from the auxiliary light source.
- the optical deflector having the heat dissipation structure described in Patent Document 1 has a structure in which the mirror portion is in contact with the solid heat transfer body, it is necessary to reciprocate the mirror portion together with the solid heat transfer body.
- the resonance frequency is lower than that in the case of reciprocating vibration by the mirror unit alone.
- the scanning speed is lowered and the deflection angle is changed, so that it is difficult to scan the light beam at high speed and accurately.
- the output of the light source that irradiates the beam tends to increase.
- a light source of several tens to several tens of W may be used. It is difficult to suppress the temperature rise of the mirror portion only by the heat radiation effect by the solid heat transfer body when such a high output light source is used.
- the base portion and the reflection film are made of a material that absorbs incident light, they are easily affected by a temperature rise due to an increase in the output of the light source.
- the MEMS mirror 98% of the total incident light is reflected by the dielectric multilayer film, but the remaining light (2%) is absorbed by the dielectric multilayer film or the first substrate.
- the above-mentioned high-power light source even if 2% of light is absorbed, the temperature of the dielectric multilayer film or the first substrate rises, and the mirror portion as described above causes strain and changes in torsion spring stiffness.
- An object of the present invention is to provide an optical scanning element capable of solving the above-described problems and suppressing a temperature rise of a mirror part and an image display device using the same.
- the optical scanning element of the present invention comprises: A dielectric multilayer that reflects part of the incident light and transmits the remaining light; A first substrate on which the dielectric multilayer film is formed on one surface and transmits the remaining light transmitted through the dielectric multilayer film; A mounting portion on which the first substrate is mounted, and the mounting portion is configured to be rotatable.
- the mounting portion has a through hole in a portion facing the dielectric multilayer film.
- the image display device of the present invention is A light source; A first light scanning element that scans a light beam from the light source in a first direction on a screen; A second optical scanning element that scans a light beam from the first optical scanning element in a second direction that intersects the first direction on the screen; A control unit for controlling the first and second optical scanning elements based on an input video signal and controlling the irradiation timing of the laser light source;
- the first and second optical scanning elements are the above-described optical scanning elements of the present invention.
- FIG. 1 It is a perspective view which shows typically the structure of the optical scanning element which is the 1st Embodiment of this invention. It is the disassembled perspective view which decomposed
- FIG. 1 is a perspective view schematically showing the configuration of the optical scanning element according to the first embodiment of the present invention
- FIG. 2 is an exploded perspective view in which the optical scanning element is disassembled into main components.
- the optical scanning element is used in a projection display device that scans a screen with a laser beam to form an image, and includes a mirror unit 1, a movable unit 2, a base 3, and The absorbent member 4 is included.
- FIG. 3 is a schematic diagram illustrating an example of the mirror unit 1.
- the mirror unit 1 includes a dielectric multilayer film 5 that reflects a part of incident light and transmits the remaining light, and the dielectric multilayer film 5 are formed on one surface. And a mirror substrate 6 that transmits the remaining light transmitted through the mirror.
- the dielectric multilayer film 5 has a high reflectance in the wavelength band of the laser light to be used, and the light absorptance of the wavelength band is almost 0%.
- FIG. 4 is a schematic diagram showing an example of the dielectric multilayer film 5.
- the dielectric multilayer film 5 has a structure in which ZnS—SiO 2 layers 5a and SiO 2 layers 5b are alternately stacked.
- the film thickness tz of the ZnS—SiO 2 layer 5a is, for example, 47.1 nm.
- the film thickness ts of the SiO 2 layer 5b is, for example, 69.1 nm.
- a reflectivity of about 99% can be achieved in the wavelength band of 405 nm, and the light absorptance in the wavelength band is almost 0%. be able to.
- a dielectric multilayer film has an incident angle dependency in which the reflectivity changes depending on the incident angle of light.
- the influence of the incident angle dependency is limited by limiting the use wavelength band (the wavelength band of incident light). Can be suppressed.
- FIG. 5 is a characteristic diagram showing an example of spectral reflection characteristics of the dielectric multilayer film.
- the vertical axis represents reflectance (%), and the horizontal axis represents wavelength (nm).
- the curve indicated by symbol A indicates the spectral reflection characteristics when light is incident on the film surface obliquely (for example, an incident angle of 25 °), and the curve indicated by symbol B indicates the film surface.
- the spectral reflection characteristic when light is incident vertically is shown.
- the dielectric multilayer film 5 when the dielectric multilayer film 5 is irradiated with laser light having a wavelength of 405 nm, a reflectivity of about 99% can be achieved for both oblique incidence and normal incidence. In both cases of oblique incidence and perpendicular incidence, the absorption rate of laser light is approximately 0%, and about 1% of light is transmitted through the dielectric multilayer film 5.
- the mirror substrate 6 is a plate-like material having a spectral transmission characteristic that is transparent to the laser light applied to the dielectric multilayer film 5 (specifically, in the wavelength band of the laser light).
- materials having spectral transmission characteristics that are transparent to light in the wavelength band of 405 nm include SiO 2 , CaF 2 , and MgF 2 .
- the movable part 2 includes a mounting part 7 on which the mirror substrate 6 is mounted, and the mounting part 7 is configured to be rotatable.
- the mounting portion 7 has a through hole 7a, and the transmitted beam that has passed through the dielectric multilayer film 5 and the mirror substrate 6 out of the laser light irradiated to the mirror portion 1 passes through the through hole 7a.
- the position and size of the through hole 7 a are designed so that the transmitted beam is not blocked by the mounting portion 7.
- FIG. 6 is a top view of the movable part 2.
- the movable part 2 has two torsion beams 11a and 11b that support the mounting part 7 so as to be rotatable, and a frame-like substrate 10 to which the torsion beams 11a and 11b are fixed.
- the mounting portion 7, the torsion beams 11a and 11b, and the substrate 10 are made of, for example, Si, and may be integrally formed.
- the length and width of the torsion beam 11a are substantially the same as the length and width of the torsion beam 11b.
- the mounting portion 7 When viewed from a direction perpendicular to the surface of the substrate 10, the mounting portion 7 is located at substantially the center of the opening (inside the frame) of the substrate 10.
- the mounting portion 7 has a frame shape and includes first and second side portions 71a and 71b facing each other.
- the central part (specifically, the center of gravity position) of the first side part 71a is fixed to the substrate 10 via the torsion beam 11a, and the central part (specifically, the center of gravity position) of the second side part 71b. Is fixed to the substrate 10 via a torsion beam 11b.
- the substrate 10 has first and second arm portions facing each other. One end of the torsion beam 11a is fixed to the center portion of the first arm portion, and one end of the torsion beam 11b is fixed to the center portion of the second arm portion.
- the length and width of the first arm are substantially the same as the length and width of the second arm.
- the first arm portion has an arm portion 10a extending from the central portion in one direction and an arm portion 10b extending in the other side direction.
- the piezoelectric element 12a is provided on the arm portion 10a, and the piezoelectric element 12b is provided on the arm portion 10b.
- the second arm portion has an arm portion 10c extending in the direction of one side from the central portion and an arm portion 10d extending in the direction of the other side.
- the piezoelectric element 12c is provided on the arm portion 10c, and the piezoelectric element 12d is provided on the arm portion 10d.
- the substrate 10 of the movable portion 2 is fixed to a base 3 having a U-shaped cross section.
- the base 3 has first and second convex portions that face each other.
- the substrate 10 includes first and second fixing portions extending in a direction intersecting with the first and second arm portions.
- the first fixing portion faces the second fixing portion, the first fixing portion is fixed to the first convex portion, and the second fixing portion is fixed to the second convex portion.
- the absorbing member 4 is made of a material that absorbs light in a specific wavelength band including the wavelength band of the laser light irradiated onto the mirror unit 1, and the dielectric multilayer film 5 of the laser light irradiated onto the mirror unit 1 and The transmitted beam that has passed through the mirror substrate 6 is absorbed.
- the absorbing member 4 is a region facing the dielectric multilayer film 5 in the concave portion of the base 3 and is provided in the entire region irradiated with the transmitted beam.
- the base 3 may be made of a material and a structure that can dissipate heat generated by light absorption by the absorbing member 4.
- the voltage based on the first drive signal is supplied to the piezoelectric elements 12a and 12c and the voltage based on the second drive signal is supplied to the piezoelectric elements 12b and 12d, so that the mirror unit 1 is reciprocally oscillated.
- the first drive signal is a drive signal having a phase opposite to that of the second drive signal.
- FIG. 7A shows the deformed state of the arms 10a and 10b of the substrate 10 when a voltage based on the first drive signal is supplied to the piezoelectric element 12a and a voltage based on the second drive signal is supplied to the piezoelectric element 12b. It is a schematic diagram shown.
- FIG. 7B shows the deformation state of the arms 10c and 10d of the substrate 10 when a voltage based on the first drive signal is supplied to the piezoelectric element 12c and a voltage based on the second drive signal is supplied to the piezoelectric element 12d. It is a schematic diagram shown.
- the arms 10a and 10b are in the deformed state shown in FIG. 7A, and the arms 10c and 10d are in the deformed state shown in FIG. 7B.
- the portions on the arm portions 10a and 10c side of the mounting portion 7 (hereinafter referred to as the first end portion side) are higher than the surface of the substrate 10, and the portions of the mounting portion 7 on the arm portions 10b and 10d side. (Hereinafter referred to as the second end side) becomes lower than the surface of the substrate 10.
- the states of the arm portions 10a and 10b and the states of the arm portions 10c and 10d are opposite to each other. That is, the arms 10a and 10b are in the deformed state shown in FIG. 7B, and the arms 10c and 10d are in the deformed state shown in FIG. 7A. In this state, the first end portion side of the mounting portion 7 is lower than the surface of the substrate 10, and the second end portion side is higher than the surface of the substrate 10.
- the torsion beams 11a and 11b can be deformed at the resonance frequency, thereby mounting.
- the mirror part 1 mounted on the part 7 is reciprocally vibrated. By this reciprocating vibration, the incident laser beam can be spatially scanned.
- FIG. 8 is a schematic diagram for explaining the principle of suppressing the temperature rise. As shown in FIG. 8, when the irradiation beam (laser light) 100 is irradiated onto the dielectric multilayer film 5, a part of the irradiation beam (laser light) 100 is reflected by the dielectric multilayer film 5, and the rest Light passes through the dielectric multilayer film 5.
- the irradiation beam 100 In the wavelength band of the irradiation beam 100, the light absorptance of the dielectric multilayer film 5 is almost 0, so that the temperature of the dielectric multilayer film 5 does not increase due to light absorption.
- the irradiation beam 100 is separated into a reflected beam 101 and a transmitted beam 102 by the dielectric multilayer film 5.
- the transmitted beam 102 is transmitted through the mirror substrate 6.
- the light absorption rate of the mirror substrate 6 is almost 0, so that the temperature of the mirror substrate 6 does not increase due to light absorption.
- the transmitted beam 102 transmitted through the mirror substrate 6 passes through the through hole 7 a of the mounting portion 7 and then reaches the absorbing member 4.
- the transmitted beam 102 is absorbed by the absorbing member 4.
- the absorbing member 4 light energy is converted into thermal energy, and the temperature of the absorbing member 4 rises. Thermal energy is conducted from the absorbing member 4 to the base 3 and radiated from the outer surface of the base 3 to the outside (heat radiation).
- the position and size of the through hole 7a are designed so that the transmitted beam 102 is not blocked by a part of the mounting portion 7 in the state of reciprocal vibration of the mirror portion 1 described above. Therefore, the transmitted beam 102 always passes through the through hole 7 a and is not absorbed by the mounting portion 7.
- the mirror substrate 6 is provided with fitting portions 6a and 6b having a hook-like cross section at portions fixed to the mounting portions 7 at both ends thereof.
- the cross-sectional shape of the first and second side portions 71a and 71b of the mounting portion 7 is a square shape.
- the shape of the fitting portion 6a matches the shape of the corner portion of the first side portion 71a
- the shape of the fitting portion 6b matches the shape of the corner portion of the second side portion 71b.
- the fitting structure as described above by fitting the fitting portions 6a and 6b of the mirror substrate 6 into the corners of the first and second side portions 71a and 71b of the mounting portion 7,
- the mounting portion 7 can be positioned easily and accurately.
- the concave portion may be provided on the surface opposite to the surface on which the dielectric multilayer film 5 of the mirror substrate 6 is formed.
- FIG. 10 shows an example of the structure of the mirror substrate 6 for weight reduction.
- four concave portions 60a are provided on the surface (back surface) opposite to the surface on which the dielectric multilayer film 5 of the mirror substrate 6 is formed.
- Each recessed part 60a is the same size, and the shape when it sees from a direction perpendicular
- the cross-sectional shape of each recess 60a is rectangular.
- each recess 60a is partitioned by a lattice-like rib 60b.
- the rib 60b ensures the rigidity of the mirror substrate 6.
- FIG. 11 shows another example of the structure of the mirror substrate 6 for weight reduction.
- a plurality of concave portions 61 a arranged regularly are provided on the surface (back surface) opposite to the surface on which the dielectric multilayer film 5 of the mirror substrate 6 is formed.
- the size of each recess 61a is the same.
- the shape of the recess 61a when viewed from the direction perpendicular to the back surface is circular.
- the cross-sectional shape of the recess 61a is rectangular.
- the arrangement of the concave portions 61a is a periodic arrangement (arrangement of 2 rows and 5 columns), the rigidity of the mirror substrate 6 is secured by the portion where the concave portions 61a are not formed.
- the mounting portion 7 is not limited to a rectangular shape.
- the mounting portion 7 may have another shape such as a circle.
- the mounting portion 7 is preferably a square shape.
- the mounting portion 7, the torsion beams 11a and 11b, and the substrate 10 are formed of, for example, Si. In that case, there is an advantage that the element can be made cheaper than Si.
- the optical scanning element is used in a projection display device that scans a screen with a laser beam to form an image, and its main part includes a mirror part 1 and a movable part 20. .
- the mirror unit 1 is the same as that of the first embodiment (including the modified example).
- the movable unit 20 includes a mounting unit 21 on which the mirror unit 1 is mounted, and a shaft 22 that is supported so that the mounting unit 21 can rotate.
- the mounting portion 21 has a through hole 21a, and the transmitted beam that has passed through the dielectric multilayer film 5 and the mirror substrate 6 out of the laser light irradiated on the mirror portion 1 passes through the through hole 21a.
- the position and size of the through hole 21 a are designed so that the transmitted beam is not blocked by the mounting portion 21.
- the mirror unit 1 rotates around the shaft 22 by driving the motor. Thereby, the incident laser beam can be spatially scanned.
- the temperature rise of the mirror part 1 and the mounting part 21 is suppressed by the same principle as the suppression of the temperature rise described in the first embodiment (FIG. 8).
- the irradiation beam (laser light) 100 is separated into a reflected beam 101 and a transmitted beam 102 by the dielectric multilayer film 5.
- the transmitted beam 102 passes through the mirror substrate 6 and then passes through the through hole 21 a of the mounting portion 21.
- the light absorptance of the dielectric multilayer film 5 and the mirror substrate 6 is almost 0, so that the temperature of the dielectric multilayer film 5 and the mirror substrate 6 does not increase due to light absorption.
- the transmitted beam 102 transmitted through the mirror substrate 6 passes through the through hole 21a of the mounting portion 21, the temperature of the mounting portion 21 does not increase.
- an absorbing member for absorbing the transmitted beam 102 that has passed through the through hole 21a of the mounting portion 21 may be provided at a position facing the dielectric multilayer film 5.
- FIG. 13 is a perspective view schematically showing the configuration of the optical scanning element according to the third embodiment of the present invention.
- the optical scanning element of this embodiment is the same as that of the first embodiment except that the mounting portion is different.
- FIG. 13 the same components as those in the first embodiment are denoted by the same reference numerals. In order to avoid duplication of description, detailed description of the same configuration is omitted.
- the mirror unit 1 includes the dielectric multilayer film 5 and the mirror substrate 6 shown in FIG. 3, and the transmitted beam transmitted through the mirror unit 1 passes through each through hole 31 of the mounting unit 30. pass. For this reason, it can suppress that the temperature of the dielectric multilayer film 5, the mirror substrate 6, and the mounting part 30 rises.
- a part of the transmitted beam is absorbed by the lattice-shaped portion of the mounting portion 30, but compared with a mounting portion that does not have a through hole as follows. It has a great effect.
- the optical scanning element of the present embodiment a part of the transmitted beam is absorbed by the lattice-shaped portion of the mounting portion 30, but the remaining transmitted beam passes through each through hole 31 of the mounting portion 30. Therefore, the amount of light absorption in the mounting portion 30 is smaller than that of the mounting portion that does not have the through hole. Therefore, a higher-output light source can be used as compared with the mounting portion that does not have the through hole.
- the mounting part 30 has a lattice shape, so that the rigidity of the mounting part 30 is higher than that of the mounting part 7 of the optical scanning element of the first and second embodiments.
- the grid-like frame portion of the mounting portion 30 can also be applied to the optical scanning element mounting portion 21 of the above-described second embodiment. Thereby, the rigidity of the mounting portion 21 of the optical scanning element of the second embodiment can be increased.
- optical scanning element of each embodiment described above can be used in a projection display device that forms an image by scanning a screen with a laser beam.
- FIG. 14 is a schematic diagram showing a configuration of a projection display device including the optical scanning element of the present invention.
- the projection display device includes a laser light source 100, a horizontal light scanning element 101, a vertical light scanning element 102, a screen 103, and a control unit 104.
- the display surface of the screen 103 is a two-dimensional plane of the XZ axis, and the horizontal direction and the vertical direction on the display surface are an X axis direction and a Z axis direction, respectively.
- the horizontal direction optical scanning element 101 and the vertical direction optical scanning element 102 are configured by any of the optical scanning elements of the first to third embodiments described above.
- the horizontal light scanning element 101 is arranged in the traveling direction of the laser light emitted from the laser light source 100 and reflects the laser light from the laser light source 100 in the direction of the vertical light scanning element 102.
- the vertical light scanning element 102 is arranged in the traveling direction of the laser light reflected by the horizontal light scanning element 101, and reflects the laser light from the horizontal light scanning element 101 in the direction of the screen 103.
- the control unit 104 controls the light emission timing of the laser light source 100 based on an input video signal from the outside, and also controls the rotation of each mirror unit of the horizontal direction light scanning element 101 and the vertical direction light scanning element 102.
- a horizontal scanning is performed by the horizontal light scanning element 101 and simultaneously a vertical scanning is performed by the vertical light scanning element 102, and a two-dimensional image is formed on the screen 103.
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Abstract
Description
入射光の一部が反射され、残りの光を透過する誘電体多層膜と、
前記誘電体多層膜が一面に形成され、前記誘電体多層膜を透過した前記残りの光を透過する第1の基板と、
前記第1の基板が搭載される搭載部を備え、該搭載部が回転可能に構成された可動部と、を有し、
前記搭載部は、前記誘電体多層膜と対向する部分に貫通穴を有する。
光源と、
前記光源からの光ビームを、スクリーン上の第1の方向に走査する第1の光走査素子と、
前記第1の光走査素子からの光ビームを、前記スクリーン上の前記第1の方向と交差する第2の方向に走査する第2の光走査素子と、
入力映像信号に基づいて、前記第1および第2の光走査素子を制御するとともに前記レーザー光源の照射タイミングを制御する制御部と、を有し、
前記第1および第2の光走査素子は、上記の本発明の光走査素子よりなる。
2 可動部
3 ベース
4 吸収部材
5 誘電体多層膜
6 ミラー基板
7 搭載部
図1は、本発明の第1の実施形態である光走査素子の構成を模式的に示す斜視図であり、図2は、その光走査素子を主要な構成に分解した分解斜視図である。
図12は、本発明の第2の実施形態である光走査素子の構成を模式的に示す斜視図である。
図13は、本発明の第3の実施形態である光走査素子の構成を模式的に示す斜視図である。
Claims (11)
- 入射光の一部が反射され、残りの光を透過する誘電体多層膜と、
前記誘電体多層膜が一面に形成され、前記誘電体多層膜を透過した前記残りの光を透過する第1の基板と、
前記第1の基板が搭載される搭載部を備え、該搭載部が回転可能に構成された可動部と、を有し、
前記搭載部は、前記誘電体多層膜と対向する部分に貫通穴を有する、光走査素子。 - 前記第1の基板は、前記一面とは反対側の他面に凹部を有する、請求項1に記載の光走査素子。
- 前記凹部は複数あり、
前記第1の基板は、前記他面に複数の前記凹部を区画するリブを有する、請求項2に記載の光走査素子。 - 前記第1の基板は、前記搭載部の所定の部位と嵌合する嵌合部を有する、請求項1から3のいずれか1項に記載の光走査素子。
- 前記搭載部は格子状の枠部よりなる、請求項1から4のいずれか1項に記載の光走査素子。
- 前記入射光は所定の波長帯域のレーザー光であり、
前記第1の基板は、前記レーザー光の波長帯域で透明な材料よりなる、請求項1から5のいずれか1項に記載の光走査素子。 - 前記第1の基板は、SiO2、CaF2、MgF2のいずれかにより形成されている、請求項1から6のいずれか1項に記載の光走査素子。
- 前記可動部は、
前記搭載部を前記誘電体多層膜の膜面に平行な軸の周りに回転可能に支持する第1および第2の捻り梁と、
前記第1および第2の捻り梁が固定される枠状の第2の基板と、を有し、
前記第2の基板の面に垂直な方向から見た場合に、前記搭載部は前記第2の基板の開口した部分の中央に位置し、前記第1および第2の捻り梁は前記搭載部の両側に対向して設けられている、請求項1から7のいずれか1項に記載の光走査素子。 - 前記可動部は、前記搭載部を回転可能に支持する軸部を有し、前記誘電体多層膜の膜面に垂直な方向から見た場合に、前記軸部の断面の中心を通る線が前記誘電体多層膜の膜面の重心を通る、請求項1から7のいずれか1項に記載の光走査素子。
- 前記誘電体多層膜および第1の基板を透過して前記搭載部の前記貫通穴を通過した前記残りの光を吸収する吸収部材を、さらに有する、請求項1から9のいずれか1項に記載の光走査素子。
- 光源と、
前記光源からの光ビームを、スクリーン上の第1の方向に走査する第1の光走査素子と、
前記第1の光走査素子からの光ビームを、前記スクリーン上の前記第1の方向と交差する第2の方向に走査する第2の光走査素子と、
入力映像信号に基づいて、前記第1および第2の光走査素子を制御するとともに前記レーザー光源の照射タイミングを制御する制御部と、を有し、
前記第1および第2の光走査素子は、請求項1から10のいずれか1項に記載の光走査素子よりなる、画像表示装置。
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US13/700,919 US9046643B2 (en) | 2010-06-02 | 2011-05-18 | Optical scanning element and image display device using the same |
JP2012518322A JPWO2011152215A1 (ja) | 2010-06-02 | 2011-05-18 | 光走査素子およびそれを用いた画像表示装置 |
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CN103969827A (zh) * | 2013-02-05 | 2014-08-06 | 精工爱普生株式会社 | 光扫描仪及其制造方法、图像显示装置、头戴式显示器 |
JP2014164168A (ja) * | 2013-02-26 | 2014-09-08 | Canon Inc | 走査光学装置及び画像形成装置 |
JP2014235244A (ja) * | 2013-05-31 | 2014-12-15 | 京セラドキュメントソリューションズ株式会社 | 光偏向器、その製造方法及び光走査装置 |
US9575312B2 (en) | 2014-11-17 | 2017-02-21 | Ricoh Company, Ltd. | Light deflector, and devices incorporating the same |
WO2020110747A1 (ja) * | 2018-11-30 | 2020-06-04 | パイオニア株式会社 | 駆動装置 |
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JPWO2020110747A1 (ja) * | 2018-11-30 | 2021-09-27 | パイオニア株式会社 | 駆動装置 |
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JP2022074090A (ja) * | 2020-10-30 | 2022-05-17 | オプトチューン アーゲー | 光学装置及びレーザー加工装置 |
CN114523194A (zh) * | 2020-10-30 | 2022-05-24 | 奥普托图尼股份公司 | 光学设备及激光加工设备 |
JP7368435B2 (ja) | 2020-10-30 | 2023-10-24 | オプトチューン アーゲー | 光学装置及びレーザー加工装置 |
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Also Published As
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US9046643B2 (en) | 2015-06-02 |
US20130070167A1 (en) | 2013-03-21 |
JPWO2011152215A1 (ja) | 2013-07-25 |
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