WO2011142233A1 - Cleanroom - Google Patents

Cleanroom Download PDF

Info

Publication number
WO2011142233A1
WO2011142233A1 PCT/JP2011/059922 JP2011059922W WO2011142233A1 WO 2011142233 A1 WO2011142233 A1 WO 2011142233A1 JP 2011059922 W JP2011059922 W JP 2011059922W WO 2011142233 A1 WO2011142233 A1 WO 2011142233A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
clean room
rectifying
opening
air
Prior art date
Application number
PCT/JP2011/059922
Other languages
French (fr)
Japanese (ja)
Inventor
仁志 遠藤
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2011142233A1 publication Critical patent/WO2011142233A1/en

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/16Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
    • F24F3/163Clean air work stations, i.e. selected areas within a space which filtered air is passed
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00Control or safety arrangements
    • F24F11/0001Control or safety arrangements for ventilation
    • F24F2011/0002Control or safety arrangements for ventilation for admittance of outside air
    • F24F2011/0004Control or safety arrangements for ventilation for admittance of outside air to create overpressure in a room

Definitions

  • the present invention relates to a clean room, and more particularly to a clean room in which the inside is kept at a positive pressure.
  • Patent Document 1 is a prior art document that discloses a clean room in which a positive pressure is maintained at a higher atmospheric pressure than the outside in order to suppress the entry of foreign matter from the outside.
  • the atmospheric pressure in the clean room is always detected, and the rotational speed of the blower fan of the external air conditioner is changed so that the atmospheric pressure is higher than the outside.
  • the internal pressure is controlled so that the positive pressure state is higher by a certain value.
  • FIG. 6 is a partial cross-sectional view showing the configuration of a conventional clean room. As shown in FIG. 6, in the conventional clean room, the cleanliness 100 with a cleanliness of 10 and a relatively high cleanliness of the air, and a cleanroom with a cleanliness of 5000 and a cleanliness of the cleanliness of the interior. A relatively low clean room 500 is provided adjacent to the clean room 500.
  • a room space is formed by the ceiling portion 110, the floor portion 120, and the wall portion 130 that connects the ceiling portion 110 and the floor portion 120.
  • a room space is formed by the ceiling portion 510, the floor portion 520, and the wall portion 130 that connects the ceiling portion 510 and the floor portion 520.
  • the clean room 100 and the clean room 500 are separated by a wall 130.
  • One end of the pipe 150 is connected to the ceiling part 110 of the clean room 100, and the other end of the pipe 150 is connected to the air adjustment unit 160.
  • the air adjuster 160 adjusts the cleanliness of the clean room 100 so that the cleanliness of the air is 10.
  • One end of the pipe 550 is connected to the ceiling 510 of the clean room 500, and the other end of the pipe 550 is connected to the air adjustment unit 560.
  • the air adjuster 560 adjusts the cleanliness of the clean room 500 so that the cleanliness is 5000.
  • the air adjusting unit 160 and the air adjusting unit 560 are adjusted so that the pressure inside the clean room 100 is higher than the pressure inside the clean room 500.
  • An opening 140 is provided in the wall 130. Due to the difference in atmospheric pressure between the inside of the clean room 100 and the inside of the clean room 500, an air flow 170 is generated near the opening 140 from the clean room 100 side to the clean room 500 side.
  • a cassette 300 that horizontally accommodates a plurality of substrates 400 is placed on the cassette base 200.
  • the cassette stand 200 can move the cassette 300 up and down.
  • the cassette 300 is placed on the cassette base 200.
  • a transfer conveyor 600 is arranged inside the clean room 500 and inside the clean room 100 with the wall portion 130 interposed therebetween so that the substrate 400 is transferred from the clean room 500 to the clean room 100 through the opening 140.
  • the transport conveyor 600 transports the substrate 400 in the direction indicated by the white arrow in FIG. 6 while placing the substrate 400 on the roller.
  • the substrate 400 is taken out in order from the lower side of the cassette 300. Therefore, the height of the cassette base 200 in the clean room 500 is adjusted so that the substrate 400 accommodated at the lowermost side in the cassette 300 is placed on the rollers of the transport conveyor 600.
  • the substrates 400 transferred into the clean room 100 by the transfer conveyor 600 are accommodated in order from the upper side of the cassette 300. Therefore, the height of the cassette table 200 in the clean room 100 is adjusted so that the substrate 400 being transferred is accommodated in the uppermost stage of the position where the substrate 400 is accommodated in the cassette 300.
  • the lowermost substrate 400 in the cassette 300 is placed on the rollers of the transfer conveyor 600. To descend.
  • the cassette table 200 in the clean room 100 has a substrate accommodation position where the substrate 400 to be transported next does not yet accommodate the substrate 400 in the cassette 300. Ascend so that it is housed in the uppermost position.
  • the substrate 400 is transferred from the cassette 300 in the clean room 500 to the cassette 300 in the clean room 100.
  • the substrate 400 transferred to the cassette 300 in the clean room 100 is processed in a substrate processing apparatus (not shown) in the clean room 100.
  • the air pressure in the clean room with the higher air cleanliness is made higher than the air pressure in the clean room with the lower air cleanliness, so that the clean room with the higher air cleanliness.
  • the air flow toward the clean room with the lower air cleanliness is generated to suppress the decrease in the air cleanliness in the clean room with the higher air cleanliness.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a clean room that can suppress a decrease in air cleanliness in a clean room when a substrate is received from the outside.
  • the clean room according to the present invention is a clean room in which a substrate is received from the outside and the substrate is processed inside.
  • the clean room includes a wall portion, an air adjustment portion, an opening portion, a substrate transfer portion, and a rectifying portion.
  • the wall section separates the outside and the inside of the clean room.
  • the air adjusting unit makes the air cleanliness inside the clean room higher than the external air cleanliness, and makes the internal air pressure higher than the external air pressure.
  • the opening is located at a part of the wall.
  • the substrate transport unit is disposed outside and inside the clean room with the wall portion interposed therebetween so as to transport the substrate through the opening.
  • the rectifying unit is arranged at the edge of the opening facing the main surface of at least one of the substrates conveyed by the substrate conveying unit on the inner side of the clean room in the wall, and the air pressure between the inside and the outside of the clean room by the air adjusting unit The flow velocity of the air flow generated by the difference is increased.
  • the rectification unit has a rectification surface extending along the edge of the opening facing at least one main surface of the substrate conveyed by the substrate conveyance unit and facing the main surface.
  • the rectifying surface has an inclination angle of greater than 0 ° and 60 ° or less with respect to the main surface.
  • the rectifying surface is a curved surface in which the central portion of the rectifying surface in the substrate transport direction is curved convexly toward the substrate side from both ends.
  • the length of the substrate in the transport direction is twice or more the thickness of the wall.
  • the width in the direction orthogonal to the substrate transport direction is equal to or greater than the width of the substrate in this direction.
  • the rectifying unit is attached to the wall so that the inclination angle of the rectifying surface can be adjusted.
  • FIG. 1 is a partial cross-sectional view showing a configuration of a clean room according to Embodiment 1 of the present invention.
  • the clean room 101 having an internal air cleanliness level of 10 and a relatively high air cleanliness level, and the internal air cleanliness level of 5000 cleanliness.
  • a clean room 500 having a relatively low air cleanliness is provided adjacent to each other.
  • a room space is formed by the ceiling portion 110, the floor portion 120, and the wall portion 131 that connects the ceiling portion 110 and the floor portion 120.
  • a room space is formed by the ceiling portion 510, the floor portion 520, and the wall portion 131 that connects the ceiling portion 510 and the floor portion 520.
  • the clean room 101 and the clean room 500 are separated by a wall 131.
  • One end of the pipe 150 is connected to the ceiling part 110 of the clean room 101, and the other end of the pipe 150 is connected to the air adjustment unit 160.
  • the air adjuster 160 adjusts the cleanliness of the clean room 101 so that the cleanliness is 10.
  • One end of the pipe 550 is connected to the ceiling 510 of the clean room 500, and the other end of the pipe 550 is connected to the air adjustment unit 560.
  • the air adjuster 560 adjusts the cleanliness of the clean room 500 so that the cleanliness is 5000.
  • the air adjusting unit 160 and the air adjusting unit 560 are adjusted so that the air pressure inside the clean room 101 is higher than the air pressure inside the clean room 500.
  • An opening 141 is provided in the wall 131. Due to the pressure difference between the inside of the clean room 101 and the inside of the clean room 500, an air flow 171 and an air flow 172 from the clean room 101 side toward the clean room 500 side are generated in the vicinity of the opening 141.
  • the airflow 171 is an airflow generated on the upper surface side of the substrate 400
  • the airflow 172 is an airflow generated on the lower surface side of the substrate 400.
  • a cassette 300 that horizontally accommodates a plurality of substrates 400 is placed on the cassette base 200.
  • the cassette stand 200 can move the cassette 300 up and down.
  • the cassette 300 is placed on the cassette base 200.
  • a transfer conveyer 600 which is a substrate transfer unit, is arranged inside the clean room 500 and inside the clean room 101 with the wall 131 interposed therebetween so that the substrate 400 is transferred from the clean room 500 to the clean room 101 through the opening 141.
  • the transport conveyor 600 transports the substrate 400 in the direction indicated by the white arrow in FIG. 1 while placing the substrate 400 on the roller.
  • the substrate 400 is taken out in order from the lower side of the cassette 300. Therefore, the height of the cassette base 200 in the clean room 500 is adjusted so that the substrate 400 accommodated at the lowermost side in the cassette 300 is placed on the rollers of the transport conveyor 600.
  • the substrates 400 transferred into the clean room 101 by the transfer conveyor 600 are accommodated in order from the upper side of the cassette 300. Therefore, the height of the cassette table 200 in the clean room 101 is adjusted so that the substrate 400 being transferred is accommodated in the uppermost stage of the position where the substrate 400 in the cassette 300 is accommodated.
  • the lowermost substrate 400 in the cassette 300 is placed on the rollers of the transfer conveyor 600. To descend.
  • the cassette table 200 in the clean room 100 has a substrate accommodation position where the substrate 400 to be transported next does not yet accommodate the substrate 400 in the cassette 300. Ascend so that it is housed in the uppermost position.
  • the substrate 400 is transferred from the cassette 300 in the clean room 500 to the cassette 300 in the clean room 101.
  • the substrate 400 transferred to the cassette 300 in the clean room 101 is processed in a substrate processing apparatus (not shown) in the clean room 101.
  • the opening 141 located at a part of the wall 131 is provided in a minimum size necessary for transporting the substrate 400 by the transport conveyor 600.
  • the vertical length of the opening 141 was about 50 mm.
  • a rectifying unit 700 is arranged at the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveyor 600. Further, a rectifying unit 710 is disposed on the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveyor 600.
  • the rectifying unit 700 has a rectifying surface 701 facing the main surface on the upper surface side of the substrate 400.
  • the rectifying surface 701 is formed so that the flow path of the airflow 171 becomes narrower in the flow direction of the airflow 171 in order to increase the flow velocity of the airflow 171 toward the opening 141.
  • the rectifying unit 700 increases the flow velocity of the airflow 171 generated by the air pressure difference between the clean room 101 and the clean room 500 by the air adjusting unit 160 and the air adjusting unit 560.
  • the rectifying unit 710 has a rectifying surface 711 facing the main surface on the lower surface side of the substrate 400.
  • the rectifying surface 711 is formed so that the flow path of the airflow 172 becomes narrower in the flow direction of the airflow 172 in order to increase the flow velocity of the airflow 172 toward the opening 141.
  • the rectifying unit 710 increases the flow velocity of the airflow 172 generated by the pressure difference between the clean room 101 and the clean room 500 by the air adjusting unit 160 and the air adjusting unit 560.
  • the rectifying unit 700 and the rectifying unit 710 are arranged. However, if the rectifying unit is arranged on the edge of the opening facing at least one main surface of the substrate 400 conveyed by the conveying conveyor 600, the rectifying unit 700 and the rectifying unit 710 are arranged. Good. For this reason, only one of the rectifying unit 700 and the rectifying unit 710 may be arranged. Preferably, a rectifying unit is arranged at the edge of the opening facing the main surface on the side where the substrate processing is performed.
  • FIG. 2 is a side view of the vicinity of the opening of the clean room according to the present embodiment as viewed from the clean room 101 side.
  • the rectifying unit 700 of the present embodiment extends along the edge of the opening 141 that faces the main surface on the upper surface side of the substrate 400 that is transported by the transport conveyor 600. Further, the rectifying unit 700 is formed so that the width L 0 in the direction orthogonal to the transport direction of the substrate 400 is equal to or larger than the width L S of the substrate 400. With this configuration, it is possible to generate an airflow 171 having an increased flow velocity over the entire top surface of the substrate.
  • the rectifying unit 710 of the present embodiment extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveyance conveyor 600. Further, the rectifying unit 710 is formed such that the width L 0 in the direction orthogonal to the transport direction of the substrate 400 is equal to or greater than the width L S of the substrate 400. With this configuration, an airflow 172 having an increased flow velocity can be generated on the entire lower surface of the substrate.
  • the width of the rectifying unit 700 and the width of the rectifying unit 710 are the same, but they are not necessarily the same.
  • FIG. 3 is a cross-sectional view showing the vicinity of the opening of the clean room according to the present embodiment.
  • the rectifying unit 700 is arranged at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying surface 701 facing the main surface of the substrate 400 of the rectifying unit 700 has an inclination angle ⁇ with respect to the main surface of the substrate 400.
  • the inclination angle ⁇ is preferably greater than 0 ° and 60 ° or less.
  • the inclination angle ⁇ As the inclination angle ⁇ increases, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle ⁇ increases, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases. Therefore, it is desirable that the inclination angle ⁇ is appropriately set within the range of 0 ° ⁇ ⁇ 60 ° depending on the substrate 400 to be processed.
  • the length L 1 in the conveyance direction of the substrate 400 is preferably at least twice the thickness H of the wall 131. If the length L 1 is less than twice the thickness H, it is impossible to secure a sufficient contact length between the regulating surfaces 701 and airflow 171, can not be obtained rectification effect of the air flow 171 by rectifier 700 .
  • the rectification effect refers to sufficiently suppressing the airflow from becoming turbulent.
  • the rectifying unit 700 By the length L 1 of the rectifying unit 700 and more than twice the thickness H of the wall portion 131, it established a stream 171, such as stable and dust removed from the lower air and substrate 400 of cleanliness, clean room It can be discharged to the 500 side.
  • the rectifying unit 710 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying surface 711 facing the main surface of the substrate 400 of the rectifying unit 710 has an inclination angle ⁇ with respect to the main surface of the substrate 400.
  • the inclination angle ⁇ is preferably greater than 0 ° and 60 ° or less.
  • the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases.
  • the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases.
  • a transport roller 610 included in the transport conveyor 600 and a shaft portion 620 that supports the transport roller 610 are disposed.
  • the inclination angle ⁇ is reduced, it is preferable to secure the contact length between the rectifying surface 711 and the airflow 172 by increasing the length L 2 of the rectifying unit 710 in the transport direction of the substrate 400 as described later.
  • the conveying roller 610 and the shaft portion 620 are provided so as not to interfere with the rectifying unit 710, so that the conveying roller 610 disposed closest to the wall 131 in the clean room 500. And the distance between the conveyance roller 610 disposed closest to the wall 131 in the clean room 101 is increased.
  • the substrate 400 is transported from the clean room 500 into the clean room 101.
  • the fluttering becomes large, which is not preferable.
  • the top side in the transport direction of the substrate 400 that has passed over the transport roller 610 in the clean room 500 bends downward due to gravity.
  • the distance to the transport roller 610 in the clean room 100 is long, the amount of deflection becomes large, so that an impact when the top side in the transport direction of the substrate 400 rides on the transport roller 610 in the clean room 100 increases.
  • the inclination angle ⁇ is appropriately set within the range of 0 ° ⁇ ⁇ 60 ° in consideration of the balance between the substrate 400 to be processed and the length L 2 of the rectifying unit 710.
  • the length L 2 in the transport direction of the substrate 400 is preferably not less than twice the thickness H of the wall 131. If the length L 2 is less than twice the thickness H, it is impossible to secure a sufficient contact length between the regulating surfaces 711 and airflow 172, can not be obtained rectification effect of the air flow 172 by rectifier 710 .
  • the length L 2 of the rectifying section 710 be at least twice the thickness H of the wall portion 131, it established a stream 172, such as stable and dust removed from the lower air and substrate 400 of cleanliness, clean room It can be discharged to the 500 side.
  • the rectifying unit 700 By arranging the rectifying unit 700, the air flow 173 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • the air flow 174 immediately after passing through the opening 141 has a flow velocity increased compared to that before passing through the opening 141 and is rectified.
  • a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • the outside of the clean room 101 may be a normal room or outdoors.
  • FIG. 4 is a cross-sectional view showing the vicinity of the opening of a clean room according to Embodiment 2 of the present invention.
  • the rectifying surface of the rectifying unit is curved so that the central portion of the rectifying surface in the substrate transport direction is convex toward the substrate side from both ends. It is a curved surface. Since other configurations are the same as those of the clean room of the first embodiment, description thereof will not be repeated.
  • the rectifying unit 720 is disposed at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying unit 720 extends along the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveyor 600.
  • the rectifying unit 720 has a rectifying surface 721 that faces the main surface on the upper surface side of the substrate 400.
  • the rectifying surface 721 is formed so that the flow path of the airflow 175 becomes narrow in the flow direction of the airflow 175 in order to increase the flow velocity of the airflow 175 toward the opening 141.
  • the rectifying unit 720 increases the flow velocity of the airflow 175 generated by the pressure difference between the clean room 101 and the clean room 500.
  • the rectifying surface 721 is curved so that the central portion 722 of the rectifying surface 721 in the conveyance direction of the substrate 400 is convex toward the substrate 400 from both ends.
  • the rectifying unit 730 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying unit 730 extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveying conveyor 600.
  • the rectifying unit 730 has a rectifying surface 731 facing the main surface on the lower surface side of the substrate 400.
  • the rectifying surface 731 is formed so that the flow path of the airflow 176 becomes narrower in the flow direction of the airflow 176 in order to increase the flow velocity of the airflow 176 toward the opening 141.
  • the rectifying unit 730 increases the flow velocity of the airflow 176 generated by the pressure difference between the clean room 101 and the clean room 500.
  • the rectifying surface 731 is curved so that the central portion 732 of the rectifying surface 731 in the conveyance direction of the substrate 400 is convex toward the substrate 400 side from both ends.
  • the air existing in the range of the distance A between the end of the rectifying unit 720 and the end of the rectifying unit 730 in the vertical direction is rectified. It can be made to flow along the rectifying surface 721 of the part 720 or the rectifying surface 731 of the rectifying part 730. That is, air can be collected from a wide range and flow toward the opening 141.
  • the length of the air flow path in the vertical direction is equal to the distance B between the central part 722 of the rectifying unit 720 and the central part 732 of the rectifying unit 730. Become. This distance B is preferably smaller than the length of the opening 141 in the vertical direction. In this case, since the flow path of the airflow passing between the rectifying unit 720 and the rectifying unit 730 can be further narrowed, the flow velocity of the airflow can be further increased.
  • the rectifying unit 720 By arranging the rectifying unit 720, the airflow 177 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • the air flow 178 immediately after passing through the opening 141 has a flow velocity increased and rectified compared with that before passing through the opening 141.
  • a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • FIG. 5 is a cross-sectional view showing the vicinity of an opening of a clean room according to Embodiment 3 of the present invention.
  • the rectifying unit is attached to the wall so that the inclination angle of the rectifying surface can be adjusted. Since other configurations are the same as those of the clean room of the first embodiment, description thereof will not be repeated.
  • the rectifying unit 740 is disposed at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying unit 740 extends along the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveying conveyor 600.
  • the rectifying unit 740 has a rectifying surface 741 that faces the main surface on the upper surface side of the substrate 400.
  • the rectifying surface 741 is formed so that the flow path of the airflow 180 becomes narrower in the flow direction of the airflow 180 in order to increase the flow velocity of the airflow 180 toward the opening 141.
  • the rectifying unit 740 increases the flow velocity of the airflow 180 generated by the pressure difference between the clean room 101 and the clean room 500.
  • the rectifying unit 740 is attached to the wall part 132 via the attaching part 133.
  • the attachment portion 133 holds the rectifying unit 740 so that the inclination angle ⁇ with respect to the rectifying surface 741 and the main surface of the substrate 400 can be adjusted.
  • the attachment portion 133 and the rectifying portion 740 are connected by a ball joint.
  • the inclination angle ⁇ As the inclination angle ⁇ is increased, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle ⁇ is increased, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases. Therefore, it is desirable that the inclination angle ⁇ is appropriately adjusted within the range of 0 ° ⁇ ⁇ 60 ° depending on the substrate 400 to be processed.
  • the rectifying unit 750 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600.
  • the rectifying unit 750 extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveying conveyor 600.
  • the rectifying unit 750 has a rectifying surface 751 facing the main surface on the lower surface side of the substrate 400.
  • the rectifying surface 751 is formed so that the flow path of the airflow 181 becomes narrower in the flow direction of the airflow 181 in order to increase the flow velocity of the airflow 181 toward the opening 141.
  • the rectifying unit 750 increases the flow velocity of the airflow 181 generated by the pressure difference between the clean room 101 and the clean room 500.
  • the rectifying unit 750 is attached to the wall part 132 via the attaching part 134.
  • the attachment portion 134 holds the rectifying unit 750 so that the inclination angle ⁇ with respect to the rectifying surface 751 and the main surface of the substrate 400 can be adjusted.
  • the attachment part 134 and the rectifying part 750 are connected by a ball joint.
  • the tilt angle ⁇ is appropriately adjusted within the range of 0 ° ⁇ ⁇ 60 ° depending on the substrate 400 to be processed.
  • the rectifying unit 740 By arranging the rectifying unit 740, the airflow 182 immediately after passing through the opening 141 has a flow velocity increased compared to that before passing through the opening 141 and is rectified. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • the rectifying unit 750 by arranging the rectifying unit 750, the airflow 183 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
  • the inclination angles of the rectifying surface 741 and the rectifying surface 751 are adjustable, the inclination angle is changed depending on the type of the substrate 400 to be processed, and the air cleanliness in the clean room is maintained.
  • the substrate can be transferred under optimum conditions.
  • 101,500 clean room 110,510 ceiling, 120,520 floor, 131,132 wall, 133,134 mounting, 141 opening, 150,550 piping, 160,560 air conditioning, 171,172,173 , 174, 175, 176, 177, 178, 180, 181, 182, 183 Airflow, 200 cassette stand, 300 cassette, 400 substrate, 600 transport conveyor, 610 transport roller, 620 shaft, 700, 710, 720, 730, 740, 750, rectifying unit, 701, 711, 721, 731, 741, 751, rectifying surface, 722, 732, central part.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ventilation (AREA)

Abstract

A wall unit (131) separates the outside and the inside of a cleanroom (101). An air conditioning unit (160) conditions the air to be cleaner inside than outside of the cleanroom (101), and to have an air pressure higher inside than outside thereof. An opening (141) is positioned in a portion of the wall unit (131). A conveyer (600) is positioned outside and inside of the cleanroom (101) on either side of the wall unit (131) so as to convey a substrate (400) through the opening (141). Inside of the cleanroom (101) on the wall unit (131), a rectifier (700, 710), which is disposed at the edge of the opening (141) facing at least one main surface of the substrate (400) conveyed by the conveyor (600), increases the velocity of the airflow (171, 172) generated by the air pressure difference between the inside and outside of the cleanroom (101) caused by the air conditioning unit (160).

Description

クリーンルームClean room
 本発明は、クリーンルームに関し、特に、内部が陽圧に保たれているクリーンルームに関する。 The present invention relates to a clean room, and more particularly to a clean room in which the inside is kept at a positive pressure.
 外部からの異物の浸入を抑制するために、外部より気圧が高い陽圧状態を保持したクリーンルームを開示した先行文献として、特開平10-96333号公報(特許文献1)がある。特開平10-96333号公報(特許文献1)に記載されたクリーンルームにおいては、常時、クリーンルーム内の気圧を検出し、外調機の送風ファンの回転数を変化させることにより、外部よりも気圧が一定値だけ高い陽圧状態になるように内部の気圧をコントロールしている。 Japanese Patent Laid-Open No. 10-96333 (Patent Document 1) is a prior art document that discloses a clean room in which a positive pressure is maintained at a higher atmospheric pressure than the outside in order to suppress the entry of foreign matter from the outside. In the clean room described in Japanese Patent Laid-Open No. 10-96333 (Patent Document 1), the atmospheric pressure in the clean room is always detected, and the rotational speed of the blower fan of the external air conditioner is changed so that the atmospheric pressure is higher than the outside. The internal pressure is controlled so that the positive pressure state is higher by a certain value.
 内部の空気清浄度が異なる複数のクリーンルームが、互いに隣接して設けられる場合がある。この場合、空気清浄度が高い方のクリーンルーム内の気圧が、空気清浄度が低い方のクリーンルーム内の気圧より高くすることにより、空気清浄度が高い方のクリーンルーム内の空気清浄度が低下することを抑制している。 There are cases where multiple clean rooms with different internal air cleanliness are provided adjacent to each other. In this case, when the air pressure in the clean room with the higher air cleanliness is higher than the air pressure in the clean room with the lower air cleanliness, the air cleanliness in the clean room with the higher air cleanliness decreases. Is suppressed.
 図6は、従来のクリーンルームの構成を示す一部断面図である。図6に示すように、従来のクリーンルームにおいては、内部の空気清浄度がクリーン度10であり空気清浄度の比較的高いクリーンルーム100と、内部の空気清浄度がクリーン度5000であり空気清浄度の比較的低いクリーンルーム500とが隣接して設けられている。 FIG. 6 is a partial cross-sectional view showing the configuration of a conventional clean room. As shown in FIG. 6, in the conventional clean room, the cleanliness 100 with a cleanliness of 10 and a relatively high cleanliness of the air, and a cleanroom with a cleanliness of 5000 and a cleanliness of the cleanliness of the interior. A relatively low clean room 500 is provided adjacent to the clean room 500.
 クリーンルーム100においては、天井部110、床部120、および、天井部110と床部120とを繋ぐ壁部130により部屋空間が形成されている。クリーンルーム500においては、天井部510、床部520、および、天井部510と床部520とを繋ぐ壁部130により部屋空間が形成されている。クリーンルーム100とクリーンルーム500とは、壁部130により区切られている。 In the clean room 100, a room space is formed by the ceiling portion 110, the floor portion 120, and the wall portion 130 that connects the ceiling portion 110 and the floor portion 120. In the clean room 500, a room space is formed by the ceiling portion 510, the floor portion 520, and the wall portion 130 that connects the ceiling portion 510 and the floor portion 520. The clean room 100 and the clean room 500 are separated by a wall 130.
 クリーンルーム100の天井部110には配管150の一端が接続され、配管150の他端が空気調整部160に接続されている。空気調整部160によりクリーンルーム100の内部の空気清浄度がクリーン度10になるように調整されている。 One end of the pipe 150 is connected to the ceiling part 110 of the clean room 100, and the other end of the pipe 150 is connected to the air adjustment unit 160. The air adjuster 160 adjusts the cleanliness of the clean room 100 so that the cleanliness of the air is 10.
 クリーンルーム500の天井部510には配管550の一端が接続され、配管550の他端が空気調整部560に接続されている。空気調整部560によりクリーンルーム500の内部の空気清浄度がクリーン度5000になるように調整されている。 One end of the pipe 550 is connected to the ceiling 510 of the clean room 500, and the other end of the pipe 550 is connected to the air adjustment unit 560. The air adjuster 560 adjusts the cleanliness of the clean room 500 so that the cleanliness is 5000.
 空気調整部160と空気調整部560とは、クリーンルーム100の内部の気圧がクリーンルーム500の内部の気圧より高くなるように調節されている。壁部130には、開口部140が設けられている。上記のクリーンルーム100の内部とクリーンルーム500の内部との気圧差により、開口部140の近傍において、クリーンルーム100側からクリーンルーム500側に向かう気流170が発生する。 The air adjusting unit 160 and the air adjusting unit 560 are adjusted so that the pressure inside the clean room 100 is higher than the pressure inside the clean room 500. An opening 140 is provided in the wall 130. Due to the difference in atmospheric pressure between the inside of the clean room 100 and the inside of the clean room 500, an air flow 170 is generated near the opening 140 from the clean room 100 side to the clean room 500 side.
 クリーンルーム100の内部においては、複数の基板400を水平に収容するカセット300が、カセット台200に載置されている。カセット台200は、カセット300を上下に移動させることができる。クリーンルーム500の内部においては、カセット300がカセット台200に載置されている。 Inside the clean room 100, a cassette 300 that horizontally accommodates a plurality of substrates 400 is placed on the cassette base 200. The cassette stand 200 can move the cassette 300 up and down. Inside the clean room 500, the cassette 300 is placed on the cassette base 200.
 クリーンルーム500からクリーンルーム100に開口部140を通じて基板400を搬送するように、壁部130を挟んで、クリーンルーム500の内部およびクリーンルーム100の内部に搬送コンベア600が配置されている。搬送コンベア600は、ローラ上に基板400を載置しつつ、図6中における白抜きの矢印で示す向きに基板400を搬送する。 A transfer conveyor 600 is arranged inside the clean room 500 and inside the clean room 100 with the wall portion 130 interposed therebetween so that the substrate 400 is transferred from the clean room 500 to the clean room 100 through the opening 140. The transport conveyor 600 transports the substrate 400 in the direction indicated by the white arrow in FIG. 6 while placing the substrate 400 on the roller.
 クリーンルーム500内のカセット300においては、カセット300の下側から順に基板400が取出される。そのため、カセット300内において最も下側に収容されている基板400が、搬送コンベア600のローラ上に載置されるように、クリーンルーム500内のカセット台200の高さが調節される。 In the cassette 300 in the clean room 500, the substrate 400 is taken out in order from the lower side of the cassette 300. Therefore, the height of the cassette base 200 in the clean room 500 is adjusted so that the substrate 400 accommodated at the lowermost side in the cassette 300 is placed on the rollers of the transport conveyor 600.
 搬送コンベア600により、クリーンルーム100内に搬送された基板400は、カセット300の上側から順に収容される。そのため、搬送されてくる基板400が、カセット300内の基板400を収容する位置の最上段に収容されるように、クリーンルーム100内のカセット台200の高さが調節される。 The substrates 400 transferred into the clean room 100 by the transfer conveyor 600 are accommodated in order from the upper side of the cassette 300. Therefore, the height of the cassette table 200 in the clean room 100 is adjusted so that the substrate 400 being transferred is accommodated in the uppermost stage of the position where the substrate 400 is accommodated in the cassette 300.
 クリーンルーム500内のカセット台200は、カセット300内から基板400が1枚取出される度に、カセット300内において最も下側に収容されている基板400が、搬送コンベア600のローラ上に載置されるように下降する。 In the cassette table 200 in the clean room 500, every time one substrate 400 is taken out from the cassette 300, the lowermost substrate 400 in the cassette 300 is placed on the rollers of the transfer conveyor 600. To descend.
 一方、クリーンルーム100内のカセット台200は、カセット300内に基板が1枚収容される度に、次に搬送されてくる基板400がカセット300内において基板400をまだ収容していない基板収容位置のうち最も上段の位置に収容されるように上昇する。 On the other hand, every time a substrate is accommodated in the cassette 300, the cassette table 200 in the clean room 100 has a substrate accommodation position where the substrate 400 to be transported next does not yet accommodate the substrate 400 in the cassette 300. Ascend so that it is housed in the uppermost position.
 上記のように、基板400がクリーンルーム500内のカセット300から、クリーンルーム100内のカセット300に移送される。クリーンルーム100内のカセット300に移送された基板400は、クリーンルーム100内において、図示しない基板処理装置において処理される。 As described above, the substrate 400 is transferred from the cassette 300 in the clean room 500 to the cassette 300 in the clean room 100. The substrate 400 transferred to the cassette 300 in the clean room 100 is processed in a substrate processing apparatus (not shown) in the clean room 100.
特開平10-96333号公報Japanese Patent Laid-Open No. 10-96333
 図6に示すような従来のクリーンルームにおいては、空気清浄度の高い方のクリーンルーム内の気圧が、空気清浄度が低い方のクリーンルーム内の気圧より高くすることにより、空気清浄度の高い方のクリーンルームから空気清浄度の低い方のクリーンルームに向かう気流を発生させて、空気清浄度が高い方のクリーンルーム内の空気清浄度が低下することを抑制している。 In the conventional clean room as shown in FIG. 6, the air pressure in the clean room with the higher air cleanliness is made higher than the air pressure in the clean room with the lower air cleanliness, so that the clean room with the higher air cleanliness. The air flow toward the clean room with the lower air cleanliness is generated to suppress the decrease in the air cleanliness in the clean room with the higher air cleanliness.
 しかし、空気清浄度の低い方のクリーンルームから空気清浄度の高い方のクリーンルームに基板を搬送する際に、基板とともに清浄度の低い空気および基板に付着しているダストなどが空気清浄度の高い方のクリーンルームに流入する。その結果、空気清浄度の高い方のクリーンルームの空気清浄度が低下する問題があった。 However, when transporting a board from a clean room with a lower air cleanliness to a clean room with a higher air cleanliness, the air with low cleanliness and dust adhering to the board with high cleanliness. Flows into the clean room. As a result, there is a problem that the air cleanliness of the clean room having the higher air cleanliness is lowered.
 本発明は上記の問題点に鑑みてなされたものであって、外部から基板を受け入れる際に、クリーンルーム内の空気清浄度の低下を抑制することができるクリーンルームを提供することを目的とする。 The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a clean room that can suppress a decrease in air cleanliness in a clean room when a substrate is received from the outside.
 本発明に基づくクリーンルームは、外部から基板を受け入れて内部で基板が処理されるクリーンルームである。クリーンルームは、壁部と空気調整部と開口部と基板搬送部と整流部とを備えている。壁部は、クリーンルームの外部と内部とを区切っている。空気調整部は、クリーンルームの内部の空気清浄度を外部の空気清浄度より高くし、かつ、内部の気圧を外部の気圧より高くしている。開口部は、壁部の一部に位置している。基板搬送部は、開口部を通じて基板を搬送するように、壁部を挟んでクリーンルームの外部および内部に配置されている。整流部は、壁部におけるクリーンルームの内部側において、基板搬送部により搬送される基板の少なくとも一方の主面に対向する開口部の縁に配置され、空気調整部によるクリーンルームの内部と外部との気圧差により発生する気流の流速を増加させている。 The clean room according to the present invention is a clean room in which a substrate is received from the outside and the substrate is processed inside. The clean room includes a wall portion, an air adjustment portion, an opening portion, a substrate transfer portion, and a rectifying portion. The wall section separates the outside and the inside of the clean room. The air adjusting unit makes the air cleanliness inside the clean room higher than the external air cleanliness, and makes the internal air pressure higher than the external air pressure. The opening is located at a part of the wall. The substrate transport unit is disposed outside and inside the clean room with the wall portion interposed therebetween so as to transport the substrate through the opening. The rectifying unit is arranged at the edge of the opening facing the main surface of at least one of the substrates conveyed by the substrate conveying unit on the inner side of the clean room in the wall, and the air pressure between the inside and the outside of the clean room by the air adjusting unit The flow velocity of the air flow generated by the difference is increased.
 好ましくは、整流部は、基板搬送部により搬送される基板の少なくとも一方の主面に対向する開口部の縁に沿って延設され、主面に対面する整流面を有している。 Preferably, the rectification unit has a rectification surface extending along the edge of the opening facing at least one main surface of the substrate conveyed by the substrate conveyance unit and facing the main surface.
 本発明の一形態においては、整流面は、上記主面に対して、0°より大きく60°以下の傾斜角を有している。 In one embodiment of the present invention, the rectifying surface has an inclination angle of greater than 0 ° and 60 ° or less with respect to the main surface.
 本発明の一形態においては、整流面は、基板の搬送方向における整流面の中央部の方が両端部より基板側に凸状に湾曲した湾曲面である。 In one embodiment of the present invention, the rectifying surface is a curved surface in which the central portion of the rectifying surface in the substrate transport direction is curved convexly toward the substrate side from both ends.
 好ましくは、整流部においては、基板の搬送方向における長さが壁部の厚さの2倍以上である。 Preferably, in the rectifying unit, the length of the substrate in the transport direction is twice or more the thickness of the wall.
 好ましくは、整流部においては、基板の搬送方向と直交する方向における幅がこの方向の基板の幅以上である。 Preferably, in the rectifying unit, the width in the direction orthogonal to the substrate transport direction is equal to or greater than the width of the substrate in this direction.
 本発明の一形態においては、整流部は、整流面の上記傾斜角を調節可能なように壁部に取付けられている。 In one embodiment of the present invention, the rectifying unit is attached to the wall so that the inclination angle of the rectifying surface can be adjusted.
 本発明によれば、外部から基板を受け入れる際に、クリーンルーム内の空気清浄度の低下を抑制することができる。 According to the present invention, it is possible to suppress a decrease in air cleanliness in a clean room when a substrate is received from the outside.
本発明の実施形態1に係るクリーンルームの構成を示す一部断面図である。It is a partial cross section figure which shows the structure of the clean room which concerns on Embodiment 1 of this invention. 同実施形態に係るクリーンルームの開口部周辺をクリーンルーム101側から見た側面図である。It is the side view which looked at the opening part periphery of the clean room which concerns on the embodiment from the clean room 101 side. 同実施形態に係るクリーンルームの開口部周辺を示す断面図である。It is sectional drawing which shows the opening part periphery of the clean room which concerns on the same embodiment. 本発明の実施形態2に係るクリーンルームの開口部周辺を示す断面図である。It is sectional drawing which shows the opening part periphery of the clean room which concerns on Embodiment 2 of this invention. 本発明の実施形態3に係るクリーンルームの開口部周辺を示す断面図である。It is sectional drawing which shows the opening part periphery of the clean room which concerns on Embodiment 3 of this invention. 従来のクリーンルームの構成を示す一部断面図である。It is a partial cross section figure which shows the structure of the conventional clean room.
 以下、本発明に係るクリーンルームの実施形態1について図面を参照して説明する。以下の実施形態の説明においては、図中の同一または相当部分には同一符号を付して、その説明は繰返さない。 Hereinafter, a clean room according to a first embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiments, the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.
 (実施形態1)
 図1は、本発明の実施形態1に係るクリーンルームの構成を示す一部断面図である。図1に示すように、本発明の実施形態1に係るクリーンルームにおいては、内部の空気清浄度がクリーン度10であり空気清浄度の比較的高いクリーンルーム101と、内部の空気清浄度がクリーン度5000であり空気清浄度の比較的低いクリーンルーム500とが隣接して設けられている。
(Embodiment 1)
FIG. 1 is a partial cross-sectional view showing a configuration of a clean room according to Embodiment 1 of the present invention. As shown in FIG. 1, in the clean room according to the first embodiment of the present invention, the clean room 101 having an internal air cleanliness level of 10 and a relatively high air cleanliness level, and the internal air cleanliness level of 5000 cleanliness. And a clean room 500 having a relatively low air cleanliness is provided adjacent to each other.
 クリーンルーム101においては、天井部110、床部120、および、天井部110と床部120とを繋ぐ壁部131により部屋空間が形成されている。クリーンルーム500においては、天井部510、床部520、および、天井部510と床部520とを繋ぐ壁部131により部屋空間が形成されている。クリーンルーム101とクリーンルーム500とは、壁部131により区切られている。 In the clean room 101, a room space is formed by the ceiling portion 110, the floor portion 120, and the wall portion 131 that connects the ceiling portion 110 and the floor portion 120. In the clean room 500, a room space is formed by the ceiling portion 510, the floor portion 520, and the wall portion 131 that connects the ceiling portion 510 and the floor portion 520. The clean room 101 and the clean room 500 are separated by a wall 131.
 クリーンルーム101の天井部110には配管150の一端が接続され、配管150の他端が空気調整部160に接続されている。空気調整部160によりクリーンルーム101の内部の空気清浄度がクリーン度10になるように調整されている。 One end of the pipe 150 is connected to the ceiling part 110 of the clean room 101, and the other end of the pipe 150 is connected to the air adjustment unit 160. The air adjuster 160 adjusts the cleanliness of the clean room 101 so that the cleanliness is 10.
 クリーンルーム500の天井部510には配管550の一端が接続され、配管550の他端が空気調整部560に接続されている。空気調整部560によりクリーンルーム500の内部の空気清浄度がクリーン度5000になるように調整されている。 One end of the pipe 550 is connected to the ceiling 510 of the clean room 500, and the other end of the pipe 550 is connected to the air adjustment unit 560. The air adjuster 560 adjusts the cleanliness of the clean room 500 so that the cleanliness is 5000.
 空気調整部160と空気調整部560とは、クリーンルーム101の内部の気圧がクリーンルーム500の内部の気圧より高くなるように調節されている。壁部131には、開口部141が設けられている。上記のクリーンルーム101の内部とクリーンルーム500の内部との気圧差により、開口部141の近傍において、クリーンルーム101側からクリーンルーム500側に向かう気流171および気流172が発生する。気流171は、基板400の上面側に発生する気流であり、気流172は、基板400の下面側に発生する気流である。 The air adjusting unit 160 and the air adjusting unit 560 are adjusted so that the air pressure inside the clean room 101 is higher than the air pressure inside the clean room 500. An opening 141 is provided in the wall 131. Due to the pressure difference between the inside of the clean room 101 and the inside of the clean room 500, an air flow 171 and an air flow 172 from the clean room 101 side toward the clean room 500 side are generated in the vicinity of the opening 141. The airflow 171 is an airflow generated on the upper surface side of the substrate 400, and the airflow 172 is an airflow generated on the lower surface side of the substrate 400.
 クリーンルーム101の内部においては、複数の基板400を水平に収容するカセット300が、カセット台200に載置されている。カセット台200は、カセット300を上下に移動させることができる。クリーンルーム500の内部においては、カセット300がカセット台200に載置されている。 Inside the clean room 101, a cassette 300 that horizontally accommodates a plurality of substrates 400 is placed on the cassette base 200. The cassette stand 200 can move the cassette 300 up and down. Inside the clean room 500, the cassette 300 is placed on the cassette base 200.
 クリーンルーム500からクリーンルーム101に開口部141を通じて基板400を搬送するように、壁部131を挟んで、クリーンルーム500の内部およびクリーンルーム101の内部に基板搬送部である搬送コンベア600が配置されている。搬送コンベア600は、ローラ上に基板400を載置しつつ、図1中における白抜きの矢印で示す向きに基板400を搬送する。 A transfer conveyer 600, which is a substrate transfer unit, is arranged inside the clean room 500 and inside the clean room 101 with the wall 131 interposed therebetween so that the substrate 400 is transferred from the clean room 500 to the clean room 101 through the opening 141. The transport conveyor 600 transports the substrate 400 in the direction indicated by the white arrow in FIG. 1 while placing the substrate 400 on the roller.
 クリーンルーム500内のカセット300においては、カセット300の下側から順に基板400が取出される。そのため、カセット300内において最も下側に収容されている基板400が、搬送コンベア600のローラ上に載置されるように、クリーンルーム500内のカセット台200の高さが調節される。 In the cassette 300 in the clean room 500, the substrate 400 is taken out in order from the lower side of the cassette 300. Therefore, the height of the cassette base 200 in the clean room 500 is adjusted so that the substrate 400 accommodated at the lowermost side in the cassette 300 is placed on the rollers of the transport conveyor 600.
 搬送コンベア600により、クリーンルーム101内に搬送された基板400は、カセット300の上側から順に収容される。そのため、搬送されてくる基板400が、カセット300内の基板400を収容する位置の最上段に収容されるように、クリーンルーム101内のカセット台200の高さが調節される。 The substrates 400 transferred into the clean room 101 by the transfer conveyor 600 are accommodated in order from the upper side of the cassette 300. Therefore, the height of the cassette table 200 in the clean room 101 is adjusted so that the substrate 400 being transferred is accommodated in the uppermost stage of the position where the substrate 400 in the cassette 300 is accommodated.
 クリーンルーム500内のカセット台200は、カセット300内から基板400が1枚取出される度に、カセット300内において最も下側に収容されている基板400が、搬送コンベア600のローラ上に載置されるように下降する。 In the cassette table 200 in the clean room 500, every time one substrate 400 is taken out from the cassette 300, the lowermost substrate 400 in the cassette 300 is placed on the rollers of the transfer conveyor 600. To descend.
 一方、クリーンルーム100内のカセット台200は、カセット300内に基板が1枚収容される度に、次に搬送されてくる基板400がカセット300内において基板400をまだ収容していない基板収容位置のうち最も上段の位置に収容されるように上昇する。 On the other hand, every time a substrate is accommodated in the cassette 300, the cassette table 200 in the clean room 100 has a substrate accommodation position where the substrate 400 to be transported next does not yet accommodate the substrate 400 in the cassette 300. Ascend so that it is housed in the uppermost position.
 上記のように、基板400がクリーンルーム500内のカセット300から、クリーンルーム101内のカセット300に移送される。クリーンルーム101内のカセット300に移送された基板400は、クリーンルーム101内において、図示しない基板処理装置において処理される。 As described above, the substrate 400 is transferred from the cassette 300 in the clean room 500 to the cassette 300 in the clean room 101. The substrate 400 transferred to the cassette 300 in the clean room 101 is processed in a substrate processing apparatus (not shown) in the clean room 101.
 本実施形態においては、壁部131の一部に位置する開口部141は、基板400を搬送コンベア600で搬送するために最低限必要な大きさで設けられている。具体的には、開口部141の上下方向の長さは約50mmとした。開口部141の大きさを小さくすることにより、開口部141を通過する際の気流171の流速を大きくすることができる。また、空気清浄度の低い空気およびダストなどがクリーンルーム101内に流入可能な開口部141の面積を減少させることができる。 In the present embodiment, the opening 141 located at a part of the wall 131 is provided in a minimum size necessary for transporting the substrate 400 by the transport conveyor 600. Specifically, the vertical length of the opening 141 was about 50 mm. By reducing the size of the opening 141, the flow velocity of the airflow 171 when passing through the opening 141 can be increased. Further, the area of the opening 141 through which air with low air cleanliness and dust can flow into the clean room 101 can be reduced.
 また、壁部131におけるクリーンルーム101の内部側に、搬送コンベア600により搬送される基板400の上面側の主面に対向する開口部141の縁に整流部700が配置されている。また、搬送コンベア600により搬送される基板400の下面側の主面に対向する開口部141の縁に整流部710が配置されている。 Further, on the inner side of the clean room 101 in the wall 131, a rectifying unit 700 is arranged at the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveyor 600. Further, a rectifying unit 710 is disposed on the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveyor 600.
 整流部700は、基板400の上面側の主面に対面する整流面701を有している。整流面701は、開口部141に向かって気流171の流速を増加させるために、気流171の流動方向において気流171の流路が狭くなるように形成されている。整流部700は、空気調整部160および空気調整部560によるクリーンルーム101内とクリーンルーム500内との気圧差により発生する気流171の流速を増加させる。 The rectifying unit 700 has a rectifying surface 701 facing the main surface on the upper surface side of the substrate 400. The rectifying surface 701 is formed so that the flow path of the airflow 171 becomes narrower in the flow direction of the airflow 171 in order to increase the flow velocity of the airflow 171 toward the opening 141. The rectifying unit 700 increases the flow velocity of the airflow 171 generated by the air pressure difference between the clean room 101 and the clean room 500 by the air adjusting unit 160 and the air adjusting unit 560.
 整流部710は、基板400の下面側の主面に対面する整流面711を有している。整流面711は、開口部141に向かって気流172の流速を増加させるために、気流172の流動方向において気流172の流路が狭くなるように形成されている。整流部710は、空気調整部160および空気調整部560によるクリーンルーム101内とクリーンルーム500内との気圧差により発生する気流172の流速を増加させる。 The rectifying unit 710 has a rectifying surface 711 facing the main surface on the lower surface side of the substrate 400. The rectifying surface 711 is formed so that the flow path of the airflow 172 becomes narrower in the flow direction of the airflow 172 in order to increase the flow velocity of the airflow 172 toward the opening 141. The rectifying unit 710 increases the flow velocity of the airflow 172 generated by the pressure difference between the clean room 101 and the clean room 500 by the air adjusting unit 160 and the air adjusting unit 560.
 このように、クリーンルーム101からクリーンルーム500に向かう気流171,172の流速を増加させることにより、開口部141にいわゆるエアーカーテンを形成することができる。その結果、搬送されてくる基板400とともに清浄度の低い空気および基板に付着しているダストなどがクリーンルーム101に流入することを抑制することができる。 Thus, by increasing the flow velocity of the airflows 171 and 172 from the clean room 101 to the clean room 500, a so-called air curtain can be formed in the opening 141. As a result, air with low cleanliness and dust attached to the substrate together with the substrate 400 being conveyed can be prevented from flowing into the clean room 101.
 本実施形態においては、整流部700と整流部710とを配置したが、搬送コンベア600により搬送される基板400の少なくとも一方の主面に対向する開口部の縁に整流部が配置されていればよい。そのため、整流部700または整流部710のどちらか一方のみを配置するようにしてもよい。好ましくは、基板処理が行なわれる側の主面に対向する開口部の縁に整流部が配置されている。 In the present embodiment, the rectifying unit 700 and the rectifying unit 710 are arranged. However, if the rectifying unit is arranged on the edge of the opening facing at least one main surface of the substrate 400 conveyed by the conveying conveyor 600, the rectifying unit 700 and the rectifying unit 710 are arranged. Good. For this reason, only one of the rectifying unit 700 and the rectifying unit 710 may be arranged. Preferably, a rectifying unit is arranged at the edge of the opening facing the main surface on the side where the substrate processing is performed.
 図2は、本実施形態に係るクリーンルームの開口部周辺をクリーンルーム101側から見た側面図である。図2に示すように、本実施形態の整流部700は、搬送コンベア600により搬送される基板400の上面側の主面に対向する開口部141の縁に沿って延設されている。また、整流部700においては、基板400の搬送方向と直交する方向における幅L0が基板400の幅LS以上となるように形成されている。この構成により、基板の上面の全体において流速が増加された気流171を発生させることができる。 FIG. 2 is a side view of the vicinity of the opening of the clean room according to the present embodiment as viewed from the clean room 101 side. As shown in FIG. 2, the rectifying unit 700 of the present embodiment extends along the edge of the opening 141 that faces the main surface on the upper surface side of the substrate 400 that is transported by the transport conveyor 600. Further, the rectifying unit 700 is formed so that the width L 0 in the direction orthogonal to the transport direction of the substrate 400 is equal to or larger than the width L S of the substrate 400. With this configuration, it is possible to generate an airflow 171 having an increased flow velocity over the entire top surface of the substrate.
 本実施形態の整流部710は、搬送コンベア600により搬送される基板400の下面側の主面に対向する開口部141の縁に沿って延設されている。また、整流部710においては、基板400の搬送方向と直交する方向における幅L0が基板400の幅LS以上となるように形成されている。この構成により、基板の下面の全体において流速が増加された気流172を発生させることができる。 The rectifying unit 710 of the present embodiment extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveyance conveyor 600. Further, the rectifying unit 710 is formed such that the width L 0 in the direction orthogonal to the transport direction of the substrate 400 is equal to or greater than the width L S of the substrate 400. With this configuration, an airflow 172 having an increased flow velocity can be generated on the entire lower surface of the substrate.
 本実施形態においては、整流部700の上記幅と整流部710の上記幅とを同一としたが、必ずしも同一でなくてもよい。 In the present embodiment, the width of the rectifying unit 700 and the width of the rectifying unit 710 are the same, but they are not necessarily the same.
 図3は、本実施形態に係るクリーンルームの開口部周辺を示す断面図である。図3に示すように、本実施形態に係るクリーンルームにおいては、搬送コンベア600により搬送される基板400の上方の主面に対向する開口部141の縁に整流部700が配置されている。 FIG. 3 is a cross-sectional view showing the vicinity of the opening of the clean room according to the present embodiment. As shown in FIG. 3, in the clean room according to the present embodiment, the rectifying unit 700 is arranged at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600.
 整流部700の基板400の主面に対面する整流面701は、基板400の主面に対して傾斜角αを有している。傾斜角αは、0°より大きく60°以下であることが好ましい。 The rectifying surface 701 facing the main surface of the substrate 400 of the rectifying unit 700 has an inclination angle α with respect to the main surface of the substrate 400. The inclination angle α is preferably greater than 0 ° and 60 ° or less.
 傾斜角αが大きくなるに従って、基板400の主面に対して垂直方向に流れる気流成分が大きくなり、基板400に付着したダストの除去力が大きくなる。ただし、傾斜角αが大きくなるに従って、基板400の主面に対して水平方向に流れる気流成分が小さくなり、基板400の主面から除去したダストをクリーンルーム500側に排除する排出力が小さくなる。よって、傾斜角αは、処理される基板400によって、適宜、0°<α≦60°の範囲内において設定されることが望ましい。 As the inclination angle α increases, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle α increases, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases. Therefore, it is desirable that the inclination angle α is appropriately set within the range of 0 ° <α ≦ 60 ° depending on the substrate 400 to be processed.
 整流部700においては、基板400の搬送方向における長さL1が、壁部131の厚さHの2倍以上であることが好ましい。長さL1が厚さHの2倍より小さい場合、整流面701と気流171との接触長さを十分に確保することができないため、整流部700による気流171の整流効果を得ることができない。ここで、整流効果とは、気流が乱流になることを十分に抑制することをいう。 In the rectifying unit 700, the length L 1 in the conveyance direction of the substrate 400 is preferably at least twice the thickness H of the wall 131. If the length L 1 is less than twice the thickness H, it is impossible to secure a sufficient contact length between the regulating surfaces 701 and airflow 171, can not be obtained rectification effect of the air flow 171 by rectifier 700 . Here, the rectification effect refers to sufficiently suppressing the airflow from becoming turbulent.
 整流部700の長さL1を壁部131の厚さHの2倍以上とすることにより、気流171を整えて、清浄度の低い空気および基板400から除去したダストなどを安定して、クリーンルーム500側に排出することができる。 By the length L 1 of the rectifying unit 700 and more than twice the thickness H of the wall portion 131, it established a stream 171, such as stable and dust removed from the lower air and substrate 400 of cleanliness, clean room It can be discharged to the 500 side.
 本実施形態に係るクリーンルームにおいては、搬送コンベア600により搬送される基板400の下方の主面に対向する開口部141の縁に整流部710が配置されている。 In the clean room according to the present embodiment, the rectifying unit 710 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600.
 整流部710の基板400の主面に対面する整流面711は、基板400の主面に対して傾斜角βを有している。傾斜角βは、0°より大きく60°以下であることが好ましい。 The rectifying surface 711 facing the main surface of the substrate 400 of the rectifying unit 710 has an inclination angle β with respect to the main surface of the substrate 400. The inclination angle β is preferably greater than 0 ° and 60 ° or less.
 傾斜角βが大きくなるに従って、基板400の主面に対して垂直方向に流れる気流成分が大きくなり、基板400に付着したダストの除去力が大きくなる。ただし、傾斜角βが大きくなるに従って、基板400の主面に対して水平方向に流れる気流成分が小さくなり、基板400の主面から除去したダストをクリーンルーム500側に排除する排出力が小さくなる。 As the inclination angle β increases, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle β increases, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases.
 整流部710が配置される基板400の下面側においては、搬送コンベア600に含まれる搬送ローラ610と搬送ローラ610を支持する軸部620が配置されている。傾斜角βが小さくした場合、後述するように基板400の搬送方向における整流部710の長さL2を長くして、整流面711と気流172との接触長さを確保することが好ましい。 On the lower surface side of the substrate 400 on which the rectifying unit 710 is disposed, a transport roller 610 included in the transport conveyor 600 and a shaft portion 620 that supports the transport roller 610 are disposed. When the inclination angle β is reduced, it is preferable to secure the contact length between the rectifying surface 711 and the airflow 172 by increasing the length L 2 of the rectifying unit 710 in the transport direction of the substrate 400 as described later.
 整流部710の長さL2が長くした場合、整流部710と干渉しないように搬送ローラ610および軸部620を設けるために、クリーンルーム500内において壁部131の最も近傍に配置された搬送ローラ610と、クリーンルーム101内において壁部131の最も近傍に配置された搬送ローラ610との間の距離が長くなる。 When the length L 2 of the rectifying unit 710 is increased, the conveying roller 610 and the shaft portion 620 are provided so as not to interfere with the rectifying unit 710, so that the conveying roller 610 disposed closest to the wall 131 in the clean room 500. And the distance between the conveyance roller 610 disposed closest to the wall 131 in the clean room 101 is increased.
 上記のようにクリーンルーム500内の搬送ローラ610と、クリーンルーム101内の搬送ローラ610との間の距離が長くなった場合、基板400がクリーンルーム500からクリーンルーム101内に搬送される際に、基板400のバタツキが大きくなり好ましくない。 When the distance between the transport roller 610 in the clean room 500 and the transport roller 610 in the clean room 101 is increased as described above, the substrate 400 is transported from the clean room 500 into the clean room 101. The fluttering becomes large, which is not preferable.
 具体的には、クリーンルーム500内の搬送ローラ610上を通過した基板400の搬送方向の先頭側は、重力により下方にたわむ。クリーンルーム100内の搬送ローラ610までの距離が長くなっている場合、このたわみ量が大きくなるため、クリーンルーム100内の搬送ローラ610上に基板400の搬送方向先頭側が乗り上げる際の衝撃が大きくなる。 Specifically, the top side in the transport direction of the substrate 400 that has passed over the transport roller 610 in the clean room 500 bends downward due to gravity. When the distance to the transport roller 610 in the clean room 100 is long, the amount of deflection becomes large, so that an impact when the top side in the transport direction of the substrate 400 rides on the transport roller 610 in the clean room 100 increases.
 そのため、傾斜角βは、処理される基板400および整流部710の長さL2との兼ね合いを考慮して、適宜、0°<β≦60°の範囲内において設定されることが望ましい。 Therefore, it is desirable that the inclination angle β is appropriately set within the range of 0 ° <β ≦ 60 ° in consideration of the balance between the substrate 400 to be processed and the length L 2 of the rectifying unit 710.
 整流部710においては、基板400の搬送方向における長さL2が、壁部131の厚さHの2倍以上であることが好ましい。長さL2が厚さHの2倍より小さい場合、整流面711と気流172との接触長さを十分に確保することができないため、整流部710による気流172の整流効果を得ることができない。 In the rectifying unit 710, the length L 2 in the transport direction of the substrate 400 is preferably not less than twice the thickness H of the wall 131. If the length L 2 is less than twice the thickness H, it is impossible to secure a sufficient contact length between the regulating surfaces 711 and airflow 172, can not be obtained rectification effect of the air flow 172 by rectifier 710 .
 整流部710の長さL2を壁部131の厚さHの2倍以上とすることにより、気流172を整えて、清浄度の低い空気および基板400から除去したダストなどを安定して、クリーンルーム500側に排出することができる。 The length L 2 of the rectifying section 710 be at least twice the thickness H of the wall portion 131, it established a stream 172, such as stable and dust removed from the lower air and substrate 400 of cleanliness, clean room It can be discharged to the 500 side.
 整流部700を配置したことにより、開口部141を通過直後の気流173は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400上に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 By arranging the rectifying unit 700, the air flow 173 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 同様に、整流部710を配置したことにより、開口部141を通過直後の気流174は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400の下側に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 Similarly, by arranging the rectifying unit 710, the air flow 174 immediately after passing through the opening 141 has a flow velocity increased compared to that before passing through the opening 141 and is rectified. As a result, a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 本実施形態においては、空気清浄度が異なるクリーンルームが隣接して設けられている場合について説明したが、クリーンルームの101の外部が通常の部屋または屋外であってもよい。 In this embodiment, the case where clean rooms with different air cleanliness are provided adjacent to each other has been described, but the outside of the clean room 101 may be a normal room or outdoors.
 以下、本発明に係るクリーンルームの実施形態2について図面を参照して説明する。
 (実施形態2)
 図4は、本発明の実施形態2に係るクリーンルームの開口部周辺を示す断面図である。図4に示すように、本発明の実施形態2に係るクリーンルームにおいては、整流部の整流面が、基板の搬送方向における整流面の中央部の方が両端部より基板側に凸状に湾曲した湾曲面である。その他の構成については、実施形態1のクリーンルームと同様であるため説明を繰返さない。
Hereinafter, a clean room according to a second embodiment of the present invention will be described with reference to the drawings.
(Embodiment 2)
FIG. 4 is a cross-sectional view showing the vicinity of the opening of a clean room according to Embodiment 2 of the present invention. As shown in FIG. 4, in the clean room according to the second embodiment of the present invention, the rectifying surface of the rectifying unit is curved so that the central portion of the rectifying surface in the substrate transport direction is convex toward the substrate side from both ends. It is a curved surface. Since other configurations are the same as those of the clean room of the first embodiment, description thereof will not be repeated.
 本実施形態のクリーンルームにおいては、搬送コンベア600により搬送される基板400の上方の主面に対向する開口部141の縁に整流部720が配置されている。整流部720は、搬送コンベア600により搬送される基板400の上面側の主面に対向する開口部141の縁に沿って延設されている。 In the clean room of the present embodiment, the rectifying unit 720 is disposed at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600. The rectifying unit 720 extends along the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveyor 600.
 整流部720は、基板400の上面側の主面に対面する整流面721を有している。整流面721は、開口部141に向かって気流175の流速を増加させるために、気流175の流動方向において気流175の流路が狭くなるように形成されている。整流部720は、クリーンルーム101内とクリーンルーム500内との気圧差により発生する気流175の流速を増加させる。 The rectifying unit 720 has a rectifying surface 721 that faces the main surface on the upper surface side of the substrate 400. The rectifying surface 721 is formed so that the flow path of the airflow 175 becomes narrow in the flow direction of the airflow 175 in order to increase the flow velocity of the airflow 175 toward the opening 141. The rectifying unit 720 increases the flow velocity of the airflow 175 generated by the pressure difference between the clean room 101 and the clean room 500.
 具体的には、整流面721は、基板400の搬送方向における整流面721の中央部722の方が両端部より基板400側に凸状に湾曲している。 Specifically, the rectifying surface 721 is curved so that the central portion 722 of the rectifying surface 721 in the conveyance direction of the substrate 400 is convex toward the substrate 400 from both ends.
 本実施形態のクリーンルームにおいては、搬送コンベア600により搬送される基板400の下方の主面に対向する開口部141の縁に整流部730が配置されている。整流部730は、搬送コンベア600により搬送される基板400の下面側の主面に対向する開口部141の縁に沿って延設されている。 In the clean room of the present embodiment, the rectifying unit 730 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600. The rectifying unit 730 extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveying conveyor 600.
 整流部730は、基板400の下面側の主面に対面する整流面731を有している。整流面731は、開口部141に向かって気流176の流速を増加させるために、気流176の流動方向において気流176の流路が狭くなるように形成されている。整流部730は、クリーンルーム101内とクリーンルーム500内との気圧差により発生する気流176の流速を増加させる。 The rectifying unit 730 has a rectifying surface 731 facing the main surface on the lower surface side of the substrate 400. The rectifying surface 731 is formed so that the flow path of the airflow 176 becomes narrower in the flow direction of the airflow 176 in order to increase the flow velocity of the airflow 176 toward the opening 141. The rectifying unit 730 increases the flow velocity of the airflow 176 generated by the pressure difference between the clean room 101 and the clean room 500.
 具体的には、整流面731は、基板400の搬送方向における整流面731の中央部732の方が両端部より基板400側に凸状に湾曲している。 Specifically, the rectifying surface 731 is curved so that the central portion 732 of the rectifying surface 731 in the conveyance direction of the substrate 400 is convex toward the substrate 400 side from both ends.
 上記のように、整流部720と整流部730とを配置することにより、上下方向における整流部720の端部と整流部730の端部との間の距離Aの範囲に存在する空気を、整流部720の整流面721または整流部730の整流面731に沿って流動させることができる。つまり、広い範囲から空気を集めて、開口部141に向けて流動させることが可能となる。 As described above, by arranging the rectifying unit 720 and the rectifying unit 730, the air existing in the range of the distance A between the end of the rectifying unit 720 and the end of the rectifying unit 730 in the vertical direction is rectified. It can be made to flow along the rectifying surface 721 of the part 720 or the rectifying surface 731 of the rectifying part 730. That is, air can be collected from a wide range and flow toward the opening 141.
 また、整流部720と整流部730とを配置することにより、上下方向における気流の流路の長さは、整流部720の中央部722と整流部730の中央部732との間の距離Bとなる。この距離Bは、開口部141の上下方向の長さより小さいことが好ましい。この場合、整流部720と整流部730との間を通過する気流の流路をより狭くすることができるため、さらに気流の流速を増加させることができる。 In addition, by arranging the rectifying unit 720 and the rectifying unit 730, the length of the air flow path in the vertical direction is equal to the distance B between the central part 722 of the rectifying unit 720 and the central part 732 of the rectifying unit 730. Become. This distance B is preferably smaller than the length of the opening 141 in the vertical direction. In this case, since the flow path of the airflow passing between the rectifying unit 720 and the rectifying unit 730 can be further narrowed, the flow velocity of the airflow can be further increased.
 整流部720を配置したことにより、開口部141を通過直後の気流177は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400上に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 By arranging the rectifying unit 720, the airflow 177 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 同様に、整流部730を配置したことにより、開口部141を通過直後の気流178は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400の下側に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 Similarly, by arranging the rectifying unit 730, the air flow 178 immediately after passing through the opening 141 has a flow velocity increased and rectified compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 以下、本発明に係るクリーンルームの実施形態3について図面を参照して説明する。
 (実施形態3)
 図5は、本発明の実施形態3に係るクリーンルームの開口部周辺を示す断面図である。図5に示すように、本発明の実施形態3に係るクリーンルームにおいては、整流部は、整流面の傾斜角を調節可能なように壁部に取付けられている。その他の構成については、実施形態1のクリーンルームと同様であるため説明を繰返さない。
Hereinafter, a clean room according to a third embodiment of the present invention will be described with reference to the drawings.
(Embodiment 3)
FIG. 5 is a cross-sectional view showing the vicinity of an opening of a clean room according to Embodiment 3 of the present invention. As shown in FIG. 5, in the clean room according to Embodiment 3 of the present invention, the rectifying unit is attached to the wall so that the inclination angle of the rectifying surface can be adjusted. Since other configurations are the same as those of the clean room of the first embodiment, description thereof will not be repeated.
 本実施形態のクリーンルームにおいては、搬送コンベア600により搬送される基板400の上方の主面に対向する開口部141の縁に整流部740が配置されている。整流部740は、搬送コンベア600により搬送される基板400の上面側の主面に対向する開口部141の縁に沿って延設されている。 In the clean room of the present embodiment, the rectifying unit 740 is disposed at the edge of the opening 141 facing the main surface above the substrate 400 conveyed by the conveyance conveyor 600. The rectifying unit 740 extends along the edge of the opening 141 facing the main surface on the upper surface side of the substrate 400 conveyed by the conveying conveyor 600.
 整流部740は、基板400の上面側の主面に対面する整流面741を有している。整流面741は、開口部141に向かって気流180の流速を増加させるために、気流180の流動方向において気流180の流路が狭くなるように形成されている。整流部740は、クリーンルーム101内とクリーンルーム500内との気圧差により発生する気流180の流速を増加させる。 The rectifying unit 740 has a rectifying surface 741 that faces the main surface on the upper surface side of the substrate 400. The rectifying surface 741 is formed so that the flow path of the airflow 180 becomes narrower in the flow direction of the airflow 180 in order to increase the flow velocity of the airflow 180 toward the opening 141. The rectifying unit 740 increases the flow velocity of the airflow 180 generated by the pressure difference between the clean room 101 and the clean room 500.
 整流部740は、取付部133を介して壁部132に取付けられている。取付部133は、整流面741と基板400の主面に対する傾斜角γが調節可能なように、整流部740を保持している。たとえば、取付部133と整流部740とが、ボールジョイントにより接続されている。 The rectifying unit 740 is attached to the wall part 132 via the attaching part 133. The attachment portion 133 holds the rectifying unit 740 so that the inclination angle γ with respect to the rectifying surface 741 and the main surface of the substrate 400 can be adjusted. For example, the attachment portion 133 and the rectifying portion 740 are connected by a ball joint.
 傾斜角γを大きくするに従って、基板400の主面に対して垂直方向に流れる気流成分が大きくなり、基板400に付着したダストの除去力が大きくなる。ただし、傾斜角γを大きくするに従って、基板400の主面に対して水平方向に流れる気流成分が小さくなり、基板400の主面から除去したダストをクリーンルーム500側に排除する排出力が小さくなる。よって、傾斜角γは、処理される基板400によって、適宜、0°<γ≦60°の範囲内において調節されることが望ましい。 As the inclination angle γ is increased, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle γ is increased, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases. Therefore, it is desirable that the inclination angle γ is appropriately adjusted within the range of 0 ° <γ ≦ 60 ° depending on the substrate 400 to be processed.
 本実施形態のクリーンルームにおいては、搬送コンベア600により搬送される基板400の下方の主面に対向する開口部141の縁に整流部750が配置されている。整流部750は、搬送コンベア600により搬送される基板400の下面側の主面に対向する開口部141の縁に沿って延設されている。 In the clean room of the present embodiment, the rectifying unit 750 is disposed at the edge of the opening 141 facing the main surface below the substrate 400 conveyed by the conveyance conveyor 600. The rectifying unit 750 extends along the edge of the opening 141 facing the main surface on the lower surface side of the substrate 400 conveyed by the conveying conveyor 600.
 整流部750は、基板400の下面側の主面に対面する整流面751を有している。整流面751は、開口部141に向かって気流181の流速を増加させるために、気流181の流動方向において気流181の流路が狭くなるように形成されている。整流部750は、クリーンルーム101内とクリーンルーム500内との気圧差により発生する気流181の流速を増加させる。 The rectifying unit 750 has a rectifying surface 751 facing the main surface on the lower surface side of the substrate 400. The rectifying surface 751 is formed so that the flow path of the airflow 181 becomes narrower in the flow direction of the airflow 181 in order to increase the flow velocity of the airflow 181 toward the opening 141. The rectifying unit 750 increases the flow velocity of the airflow 181 generated by the pressure difference between the clean room 101 and the clean room 500.
 整流部750は、取付部134を介して壁部132に取付けられている。取付部134は、整流面751と基板400の主面に対する傾斜角ωが調節可能なように、整流部750を保持している。たとえば、取付部134と整流部750とが、ボールジョイントにより接続されている。 The rectifying unit 750 is attached to the wall part 132 via the attaching part 134. The attachment portion 134 holds the rectifying unit 750 so that the inclination angle ω with respect to the rectifying surface 751 and the main surface of the substrate 400 can be adjusted. For example, the attachment part 134 and the rectifying part 750 are connected by a ball joint.
 傾斜角ωが大きくするに従って、基板400の主面に対して垂直方向に流れる気流成分が大きくなり、基板400に付着したダストの除去力が大きくなる。ただし、傾斜角ωを大きくするに従って、基板400の主面に対して水平方向に流れる気流成分が小さくなり、基板400の主面から除去したダストをクリーンルーム500側に排除する排出力が小さくなる。よって、傾斜角ωは、処理される基板400によって、適宜、0°<ω≦60°の範囲内において調節されることが望ましい。 As the inclination angle ω increases, the airflow component flowing in the direction perpendicular to the main surface of the substrate 400 increases, and the removal force of dust attached to the substrate 400 increases. However, as the inclination angle ω is increased, the airflow component flowing in the horizontal direction with respect to the main surface of the substrate 400 decreases, and the discharge force for removing dust removed from the main surface of the substrate 400 to the clean room 500 side decreases. Therefore, it is desirable that the tilt angle ω is appropriately adjusted within the range of 0 ° <ω ≦ 60 ° depending on the substrate 400 to be processed.
 整流部740を配置したことにより、開口部141を通過直後の気流182は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400上に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 By arranging the rectifying unit 740, the airflow 182 immediately after passing through the opening 141 has a flow velocity increased compared to that before passing through the opening 141 and is rectified. As a result, a strong air curtain with high uniformity is formed on the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 同様に、整流部750を配置したことにより、開口部141を通過直後の気流183は、開口部141を通過する前に比べて流速が増加され、かつ、整流にされている。その結果、開口部141において基板400の下側に均一性の高い強力なエアーカーテンが形成される。そのため、基板400の搬送に伴ってクリーンルーム500側から空気清浄度の低い空気および基板400上に付着したダストなどが、クリーンルーム101内に流入することを抑制することができる。よって、クリーンルーム101内の空気清浄度が低下することを抑制できる。 Similarly, by arranging the rectifying unit 750, the airflow 183 immediately after passing through the opening 141 has a flow velocity increased and rectified as compared with that before passing through the opening 141. As a result, a strong air curtain with high uniformity is formed below the substrate 400 in the opening 141. Therefore, it is possible to suppress the flow of air having low air cleanliness and dust adhering to the substrate 400 from the clean room 500 side into the clean room 101 as the substrate 400 is transported. Therefore, it can suppress that the air cleanliness in the clean room 101 falls.
 本実施形態においては、整流面741および整流面751の傾斜角を調節可能にしているため、処理される基板400の種類によって傾斜角を変更して、クリーンルーム内の空気清浄度を維持するために最適な条件で基板搬送を行なうことができる。 In this embodiment, since the inclination angles of the rectifying surface 741 and the rectifying surface 751 are adjustable, the inclination angle is changed depending on the type of the substrate 400 to be processed, and the air cleanliness in the clean room is maintained. The substrate can be transferred under optimum conditions.
 なお、今回開示した上記実施形態はすべての点で例示であって、限定的な解釈の根拠となるものではない。したがって、本発明の技術的範囲は、上記した実施形態のみによって解釈されるものではなく、請求の範囲の記載に基づいて画定される。また、請求の範囲と均等の意味および範囲内でのすべての変更が含まれる。 In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of a limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiments, but is defined based on the description of the scope of claims. In addition, meanings equivalent to the claims and all modifications within the scope are included.
 101,500 クリーンルーム、110,510 天井部、120,520 床部、131,132 壁部、133,134 取付部、141 開口部、150,550 配管、160,560 空気調整部、171,172,173,174,175,176,177,178,180,181,182,183 気流、200 カセット台、300 カセット、400 基板、600 搬送コンベア、610 搬送ローラ、620 軸部、700,710,720,730,740,750 整流部、701,711,721,731,741,751 整流面、722,732 中央部。 101,500 clean room, 110,510 ceiling, 120,520 floor, 131,132 wall, 133,134 mounting, 141 opening, 150,550 piping, 160,560 air conditioning, 171,172,173 , 174, 175, 176, 177, 178, 180, 181, 182, 183 Airflow, 200 cassette stand, 300 cassette, 400 substrate, 600 transport conveyor, 610 transport roller, 620 shaft, 700, 710, 720, 730, 740, 750, rectifying unit, 701, 711, 721, 731, 741, 751, rectifying surface, 722, 732, central part.

Claims (7)

  1.  外部から基板(400)を受け入れて内部で基板(400)が処理されるクリーンルーム(101)であって、
     外部と内部とを区切る壁部(131,132)と、
     内部の空気清浄度を外部の空気清浄度より高くし、かつ、内部の気圧を外部の気圧より高くする、空気調整部(160)と、
     前記壁部(131,132)の一部に位置する開口部(141)と、
     前記開口部(141)を通じて基板(400)を搬送するように、前記壁部(131,132)を挟んで外部および内部に配置された基板搬送部(600)と、
     前記壁部(131,132)の内部側において、前記基板搬送部(600)により搬送される基板(400)の少なくとも一方の主面に対向する前記開口部(141)の縁に配置され、前記空気調整部(160)による内部と外部との気圧差により発生する気流の流速を増加させる整流部(700,710,720,730,740,750)と
    を備えた、クリーンルーム(101)。
    A clean room (101) in which a substrate (400) is received from outside and the substrate (400) is processed inside;
    Walls (131, 132) separating the outside and the inside;
    An air adjusting unit (160) for making the internal air cleanliness higher than the external air cleanliness and making the internal air pressure higher than the external air pressure;
    An opening (141) located in a part of the wall (131, 132);
    A substrate transfer unit (600) disposed outside and inside the wall (131, 132) so as to transfer the substrate (400) through the opening (141);
    On the inner side of the walls (131, 132), disposed on the edge of the opening (141) facing at least one main surface of the substrate (400) conveyed by the substrate conveyance unit (600), A clean room (101) comprising a rectifying unit (700, 710, 720, 730, 740, 750) for increasing the flow velocity of the air flow generated by the air pressure difference between the inside and the outside by the air adjusting unit (160).
  2.  前記整流部(700,710,720,730,740,750)は、前記基板搬送部(600)により搬送される基板(400)の少なくとも一方の主面に対向する前記開口部(141)の縁に沿って延設され、前記主面に対面する整流面(701,711,721,731,741,751)を有する、請求項1に記載のクリーンルーム。 The rectifying unit (700, 710, 720, 730, 740, 750) is an edge of the opening (141) facing at least one main surface of the substrate (400) conveyed by the substrate conveying unit (600). The clean room according to claim 1, further comprising a rectifying surface (701, 711, 721, 731, 741, 751) extending along the main surface and facing the main surface.
  3.  前記整流面(701,711,741,751)は、前記主面に対して、0°より大きく60°以下の傾斜角を有する、請求項2に記載のクリーンルーム。 The clean room according to claim 2, wherein the rectifying surface (701, 711, 741, 751) has an inclination angle greater than 0 ° and 60 ° or less with respect to the main surface.
  4.  前記整流面(721,731)は、基板(400)の搬送方向における該整流面(721,731)の中央部の方が両端部より基板(400)側に凸状に湾曲した湾曲面である、請求項2に記載のクリーンルーム。 The rectifying surfaces (721, 731) are curved surfaces in which the central portion of the rectifying surfaces (721, 731) in the conveyance direction of the substrate (400) is curved in a convex manner toward the substrate (400) side from both ends. The clean room according to claim 2.
  5.  前記整流部(700,710,720,730,740,750)においては、基板(400)の搬送方向における長さが前記壁部(131,132)の厚さの2倍以上である、請求項1から4のいずれかに記載のクリーンルーム。 In the rectifying section (700, 710, 720, 730, 740, 750), the length of the substrate (400) in the transport direction is twice or more the thickness of the wall section (131, 132). Clean room in any one of 1-4.
  6.  前記整流部(700,710,720,730,740,750)においては、基板(400)の搬送方向と直交する方向における幅が、該方向の基板(400)の幅以上である、請求項1から5のいずれかに記載のクリーンルーム。 2. In the rectifying unit (700, 710, 720, 730, 740, 750), a width in a direction orthogonal to the transport direction of the substrate (400) is equal to or greater than the width of the substrate (400) in the direction. To 5. The clean room according to any one of 5.
  7.  前記整流部(740,750)は、前記整流面(741,751)の前記傾斜角を調節可能なように前記壁部(132)に取付けられている、請求項3に記載のクリーンルーム。 The clean room according to claim 3, wherein the rectifying part (740, 750) is attached to the wall part (132) so that the inclination angle of the rectifying surface (741, 751) can be adjusted.
PCT/JP2011/059922 2010-05-11 2011-04-22 Cleanroom WO2011142233A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010109396A JP2013148221A (en) 2010-05-11 2010-05-11 Cleanroom
JP2010-109396 2010-05-11

Publications (1)

Publication Number Publication Date
WO2011142233A1 true WO2011142233A1 (en) 2011-11-17

Family

ID=44914289

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/059922 WO2011142233A1 (en) 2010-05-11 2011-04-22 Cleanroom

Country Status (2)

Country Link
JP (1) JP2013148221A (en)
WO (1) WO2011142233A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259372B2 (en) * 2014-07-31 2018-01-10 AvanStrate株式会社 Glass substrate manufacturing method and glass substrate manufacturing apparatus
KR102166790B1 (en) * 2019-07-25 2020-10-16 김동영 Air clean apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166520A (en) * 1987-10-20 1989-06-30 Soc Gen Tech Nouv (Sgn) Method of isolating surrounded element from external contamination
JPH05253550A (en) * 1992-03-09 1993-10-05 Sanpo Denki Kk Article cleaning apparatus
JP2000257909A (en) * 1999-03-09 2000-09-22 Daikin Plant Kk Air conditioning facility
JP2002333182A (en) * 2001-05-11 2002-11-22 Hitachi Electronics Eng Co Ltd Gate device
JP2006300409A (en) * 2005-04-20 2006-11-02 Kyowa Kako Kk Dryer
JP2010087079A (en) * 2008-09-30 2010-04-15 Sekisui Chem Co Ltd Surface processing apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01166520A (en) * 1987-10-20 1989-06-30 Soc Gen Tech Nouv (Sgn) Method of isolating surrounded element from external contamination
JPH05253550A (en) * 1992-03-09 1993-10-05 Sanpo Denki Kk Article cleaning apparatus
JP2000257909A (en) * 1999-03-09 2000-09-22 Daikin Plant Kk Air conditioning facility
JP2002333182A (en) * 2001-05-11 2002-11-22 Hitachi Electronics Eng Co Ltd Gate device
JP2006300409A (en) * 2005-04-20 2006-11-02 Kyowa Kako Kk Dryer
JP2010087079A (en) * 2008-09-30 2010-04-15 Sekisui Chem Co Ltd Surface processing apparatus

Also Published As

Publication number Publication date
JP2013148221A (en) 2013-08-01

Similar Documents

Publication Publication Date Title
TWI385115B (en) A pneumatic table for conveying a sheet-like material, and a sheet-like material transport device
US20150219348A1 (en) Air conditioning apparatus
WO2011142233A1 (en) Cleanroom
JP4392692B2 (en) Semiconductor wafer and liquid crystal glass air levitation transfer device
JP2010080456A (en) Electronic unit
JP6495986B2 (en) Substrate processing equipment
JP2010260715A (en) Levitation unit and levitation device
JP2004123254A (en) Method of carrying large sheet material and its device
WO2012066613A1 (en) Gas-permeable conveyance table
US10236191B2 (en) Wafer drying apparatus and method for drying a wafer
JP5510785B2 (en) Coating apparatus and coating method
JP4509613B2 (en) Substrate processing equipment
EP3096092A1 (en) Air-conditioning device
CN105632986B (en) Substrate conveyance system and the annealing device for using the substrate conveyance system
JP2010112646A (en) Clean room
JP6411726B2 (en) Foreign matter prevention device
US11946858B2 (en) Examination device
JP2005311260A (en) Storage chamber for liquid crystal substrate
JP6106988B2 (en) Transport device
KR101317731B1 (en) Transport device for plate-shaped objects
WO2009125558A1 (en) Dust collector
JP4858309B2 (en) Clean booth and clean booth ventilation method
JP2024035309A (en) Blower device
JP2005280883A (en) Filled vessel transporting device
JP5207754B2 (en) Pollutant diffusion prevention device and diffusion prevention system

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11780490

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11780490

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP