Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
  • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/851—Dispositions of multiple connectors or interconnections
  • H10W72/874—On different surfaces
  • H10W72/884—Die-attach connectors and bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/20—Configurations of stacked chips
  • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
  • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
  • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
  • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

• This invention relates to the field of semiconductor device assembly and, more particularly, to a semiconductor device method and structure which can be used to attach and electrically connect different types of devices together.
• a "package on package” or “PoP” device can include a memory die connected with bond wires to a first substrate, and a logic die connected with bond wires to a second substrate.
• the first substrate can provide circuit routings (i.e. electrical traces or trace routings) and a low-density ball grid array (BGA) for connection of the memory die to the logic die
• BGA ball grid array
• the BGA of the first substrate is attached to landing pads on an upper side of the second substrate.
• the memory die can be stacked on, and electrically connected to, the logic die with short electrical connections which decreases signal delay between the two dies. Further, each die can be tested prior to assembly to insure functionality, thereby reducing scrap and rework.
• a microprocessor can require the use of memory having a high speed, low density serial input/output (I/O) data architecture such as a serial interface memory, and memory having a data architecture with a lower speed and a wider data width I/O.
• I/O serial input/output
• Packaging these devices separately requires a large area of a receiving substrate, while a single device which includes all three could provide a highly functional package with a small footprint. Combining three devices into a single package with a small footprint is difficult, however, as a large number of electrical connections must be made within a small area. Further, electrical connections between the processor and the slow, wide data width memory would be preferably short to minimize signal delay.
• the high speed, low density serial I/O memory is affected less than the wide memory by longer electrical connections, and thus longer connections are sufficient for serial memory.
• the inventors have developed a semiconductor package which can include three or more different die types, for example two different memory types and a processor, which can provide electrical connections between two different memory types and the processor using different types of electrical connections.
• the device can be formed to provide a package within a chip scale device footprint.
• Embodiments of the present teachings include a dense package having a small footprint.
• An embodiment of a device can include a first memory die type, such as a high speed serial I/O memory die, physically connected to a front surface of a first substrate, and electrically connected to routings on and within the first substrate, for example using bond wires or a flip chip connection.
• the routings can be electrically connected to pads on a back surface of the first substrate.
• the device can further include a processor formed with through substrate vias (TSVs) which pass data between a front (circuit) side and a back (non-circuit) side of the processor.
• TSVs through substrate vias
• the processor can be physically connected to a front surface of a second substrate using a flip chip connection, and electrically connected to routings within the second substrate using, for example, copper pillars. Routings on the second substrate can electrically connected to pads on a front surface of the second substrate, which are in turn connected to pads on a back surface of the second substrate with routings through the second substrate.
• the device can also include a second memory die type such as a low speed, wide bus memory die, physically connected to the back side of the processor, with a front side of the second memory die facing the back side of the processor.
• the second memory die can be electrically connected to the processor through the TSVs.
• the pads on the back surface of the first substrate can be connected to the pads on the front surface of the second substrate with solder connections such as a ball grid array, through conductive paste, etc.
• a data path from the first memory die to the processor can thus be from the die through a bond wire or flip chip connection to the routings of the first substrate, to pads on the back surface of the first substrate, through solder or conductive paste to the pads on the front surface of the second substrate, through trace routings in the second substrate, and through the copper pillars to the processor.
• a data path from the second memory die to the processor can be through the TSVs from the back side to the front side of the processor.
• the semiconductor device can include a first memory die with a first memory type, a second memory die with a second memory type, and a third die which can be a processor.
• the first memory die can be electrically connected to the processor using a first connection type and the second memory die can be electrically connected to the processor using a second connection type which is different than the first connection type.
• the device can be electrically connected with a receiving substrate such as a printed circuit board, motherboard, system board, ceramic substrate, etc. through BGA connections to the pads on the back surface of the second substrate.
• a receiving substrate such as a printed circuit board, motherboard, system board, ceramic substrate, etc.
• the package is suitable for three different die types, the package can also be used to connect dies of the same type together, or a combination of same die types with different die types.
• FIG. 1 is a cross section of an example embodiment of the present teachings.
• FIG. 2 is a cross section of a structure similar to FIG. 1 after attachment to a receiving substrate.
• FIG. 1 depicts a device 10 in accordance with an embodiment of the present teachings which can include two memory dies, each providing different memory types, and a logic die which are packaged together. It is contemplated that more than two memory types and more than one logic die can be packaged together in other embodiments. Also, while the package is useful to for packaging three or more different types of semiconductor dies, it is contemplated that in other embodiments two or more (or all) of the semiconductor dies can be of the same type.
• Device 10 can include one (or more) first memory die 12, one (or more) second memory die 14, and (one or) more logic die 16.
• the first memory die 12 can include a memory type having a high speed, low-density serial input/output (I/O) data architecture, such as a serial interface memory.
• the second memory die 14 can include a memory type having a data architecture which has a lower speed and a wider data width (i.e. a high-density, wide bus) I/O.
• the logic die 16 can include a semiconductor die such as a microprocessor.
• a back (non-circuit) side of the first memory die 12 can be physically attached to a front surface of a first substrate 18 using a die attach material (not individually depicted).
• the first substrate can include a printed circuit board (PCB), a semiconductor substrate, a ceramic substrate, a tape automated bonding (TAB) tape structure, or another workable substrate having circuit routings on and through the substrate. Bond pads (not individually depicted) on a front (circuit) side of the first memory die 12 can then be electrically connected to landing pads (not individually depicted) connected to circuit routings on the front surface of the first substrate 18 with bond wires 20.
• PCB printed circuit board
• TAB tape automated bonding
• the first memory die 12 can be electrically connected to circuit routings on the front of the first substrate using a flip- chip attachment.
• Encapsulation material 22 can be formed to protect the circuitry of the first memory die 12 and first substrate 18.
• the first substrate 18 further includes a plurality of pads 24 on the back surface which are electrically connected to the circuit routings on the front surface of the substrate 18 through wiring within the substrate 18, and to circuitry on the first memory die 12 through the bond wires 20.
• Device 10 further includes a second substrate 26 having circuit routings on a front surface which is connected to a plurality of pads 28 on the front surface of the second substrate.
• a front (circuit) side of the logic die 16 is adjacent (i.e.
• a front (circuit) side of the second memory die 14 is physically attached to a back (non-circuit) side of the logic die 16 using a material 34 such as a dielectric material as a die attach material.
• Circuitry on the front side of the second memory die 14 can be electrically connected with circuitry on the front side of the logic die 16 using through silicon vias (TSVs) 36 formed within the logic die 16.
• TSVs through silicon vias
• the physical connection, as well as the electrical connection can be performed using a Z-axis conductor. The TSVs thus extend from the back of the logic die 16 and through the logic die to electrically connect with circuitry on the front side of the logic die.
• the first substrate 18 can further include a ball grid array (BGA) 38 electrically connected to pads 24 on the back surface of the first substrate 18.
• the pads 28 on the front surface of the second substrate 26 can be electrically connected to the pads 24 on the back surface of the first substrate 18 using a conductors 38, 40 such as solder or a conductive paste.
• FIG. 1 depicts the use of a solder for conductor 40 and for BGA 38 prior to performing a reflow process to electrically connect first substrate pads 24 with the second substrate pads 28. Once the reflow process is complete, the solder will flow to fill the opening between pads 24, 28 and form a continuous conductor.
• the second substrate pads 28 can be electrically routed to circuitry on the front surface of substrate 26 and to a plurality of high-density BGA connections 42 on the back surface of the second substrate 26.
• the BGA connections 42 can connect the completed device to a receiving substrate, such as a printed circuit board, motherboard, system board, ceramic substrate, etc.
• a preformed mold compound 44 which can be formed prior to reflowing solder 38, 40, can prevent the flow of solder away from the desired area when the solder is in its molten state.
• circuitry on a first memory die 12 is connected to circuit routings on and within the first substrate 18 using bond wires 20.
• the circuit routings of the first substrate are electrically connected to the pads 24 on the back surface of the first substrate 18.
• BGA connections 38, and electrical connections 40 electrically connect pads 24 on the back surface of the first substrate to pads 28 on the front surface of the second substrate 26.
• the pads 28 can be electrically connected to circuitry on the front surface of the second substrate 26 and to BGA connections 42 using circuit routings on and within the second substrate 26.
• this conductive data pathway data can be passed between the first memory die 12, the logic die 16, and to external package locations 42.
• this conductive data pathway between the first memory die 12 and the logic die 16 does not include the TSV connections 36.
• circuitry on the front side of the second memory die 14 is connected to circuitry on the front side of the logic die 16, for example using TSV connections 36.
• Circuitry from the front side of the logic die 16 is electrically connected to circuitry on the front side of the second substrate 26 using, for example, copper pillars 30.
• Circuit routings on and in the second substrate 26 electrically connect to BGA connections 42 and to pads 28. Using this conductive pathway, data can be passed between the second memory die 14, the logic die 16, and to external package locations 42.
• the first memory die 12 can include a die having low-density, high-speed serial I/O
• the second memory die 14 can include a die having high-density, low speed wide I/O.
• the BGA connections 38 would facilitate the low-density, high-speed electrical connection between the first memory die 12 and the logic die 16, while the TSV connections 36 would facilitate the high-density, low- speed electrical connections between the second memory die 14 and the logic die 16.
• Copper pillars 30 can be formed with a small pitch and would thus facilitate the high- density electrical connections between the logic die 16 and the second substrate 26, and to external package locations 42.
• first memory die can be electrically connected to the logic die using a first type of electrical connection preferred for the first memory type
• second memory die can be electrically connected to the logic die using a second type of electrical connection different from the first type of electrical connection which is preferred for the second memory type.
• the device can provide the three dies within a chip scale package footprint.
• FIG. 2 depicts the device of FIG. 1 subsequent to attachment to a receiving substrate 50 such as a printed circuit board, system board, motherboard, system board, etc.
• the BGA connections 42 provide electrical connection to pads 52 on the receiving substrate 50.
• FIG. 2 further depicts a plurality of continuous electrical connections 54 formed from the FIG. 1 BGA connections 38, 40 subsequent to a solder reflow process.
• Electrical connections 54 electrically connect pads 24 on the back surface of the first substrate 18 to pads 28 on the front surface of the second substrate 26.
• BGA connections 38, 40 of FIG. 1 can also be formed using another electrically conductive material such as a conductive paste.
• the BGA connections 42 are adapted to be connected to the receiving substrate as depicted, and to transfer data from/to the first die 12, the second die 14, and the third die 16 to the receiving substrate 50.
• all dies may be of the same type, or two or more may be of the same type with one or more being a different type.

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• Semiconductor Integrated Circuits (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Microcomputers (AREA)
• Semiconductor Memories (AREA)
• Dram (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (2)

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• 2010
  • 2010-05-07 US US12/776,302 patent/US8288849B2/en active Active
• 2011
  • 2011-05-09 WO PCT/US2011/035753 patent/WO2011140552A2/en not_active Ceased
  • 2011-05-09 CN CN201180021433.XA patent/CN102859686B/zh active Active
  • 2011-05-09 JP JP2013509319A patent/JP2013526770A/ja active Pending
• 2012
  • 2012-05-17 US US13/473,822 patent/US8597978B2/en active Active

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