WO2011133777A1 - Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system - Google Patents

Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system Download PDF

Info

Publication number
WO2011133777A1
WO2011133777A1 PCT/US2011/033438 US2011033438W WO2011133777A1 WO 2011133777 A1 WO2011133777 A1 WO 2011133777A1 US 2011033438 W US2011033438 W US 2011033438W WO 2011133777 A1 WO2011133777 A1 WO 2011133777A1
Authority
WO
WIPO (PCT)
Prior art keywords
single board
board computer
wedge lock
accordance
clamp device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2011/033438
Other languages
English (en)
French (fr)
Inventor
Bernd Sporer
Robert Ireland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Abaco Systems Inc
Original Assignee
GE Fanuc Embedded Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Fanuc Embedded Systems Inc filed Critical GE Fanuc Embedded Systems Inc
Priority to EP11718579.3A priority Critical patent/EP2561733B1/en
Priority to KR1020127027434A priority patent/KR20130098851A/ko
Priority to CA2796919A priority patent/CA2796919C/en
Priority to CN2011800202830A priority patent/CN102845142A/zh
Priority to AU2011242649A priority patent/AU2011242649A1/en
Priority to MX2012012218A priority patent/MX2012012218A/es
Priority to JP2013506306A priority patent/JP2013526040A/ja
Publication of WO2011133777A1 publication Critical patent/WO2011133777A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

  • Heat generated by PCB 102 is conducted by cooling plate 106 to side bar 104 and wedge lock 108.
  • the heat is then dissipated such that approximately one third of the heat follows a thermal path through wedge lock 108, and approximately two thirds of the heat follows a thermal path through side bar 104.
  • the heat management layer of computer 100 has a lower thermal resistance to.
  • the length of the main thermal path limits the amount of heat that may be dissipated from computer 100. Accordingly, an apparatus and method is desirable for increasing the amount of heat that may be dissipated by a computer using conduction cooling.
  • Figure 3 is a schematic partial cross-sectional view of the wedge lock shown in Figure 2 while in a clamped state.
  • wedge lock 200 secures the single board computer within an operating system, such as a rack. Moreover, wedge lock 200 facilitates greater conduction cooling of the single board computer and/or PCB 202 by creating a pressure at a thermal reference surface (not shown) in the operating system in order to provide a low thermal resistance. More specifically, holding plate 210 is positioned along at least a portion of a top surface 260 of heat conductance plate 208 such that an end 262 of heat conductance plate 208 extends beyond an end 264 of holding plate 210. As shown in Figure 4, a screw 266 may then be rotated. The torque created by rotating screw 266 induces a force, F Y , in a first direction 268 on first sawtooth portion 238.
  • single board computer 300 is positioned 402 with respect to a thermal reference surface of the computer system. Then clamp device 212 is adjusted 404 in order to secure single board computer 300. More specifically, clamp device 212 is adjusted in order to secure single board computer 300 to the thermal reference surface.
  • adjusting clamp device 212 includes rotating screw 266 such that movement of first sawtooth portion 238 in first direction 268 imparts a force, Fz, on second sawtooth portion 240 in second direction 270 perpendicular to first direction 268. Force, F z , secures single board computer 300 within the computer system to provide protection against, for example, shock and vibration forces.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
PCT/US2011/033438 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system Ceased WO2011133777A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP11718579.3A EP2561733B1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
KR1020127027434A KR20130098851A (ko) 2010-04-23 2011-04-21 단일 보드 컴퓨터에 사용되는 웨지 락, 단일 보드 컴퓨터 및 컴퓨터 시스템 조립 방법
CA2796919A CA2796919C (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
CN2011800202830A CN102845142A (zh) 2010-04-23 2011-04-21 供单板计算机使用的楔锁、单板计算机以及装配计算机系统的方法
AU2011242649A AU2011242649A1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
MX2012012218A MX2012012218A (es) 2010-04-23 2011-04-21 Cierre de cuña para usarse con una sola computadora de tarjeta, una sola computadora de tarjeta y un metodo para ensamblar el sistema de computadora.
JP2013506306A JP2013526040A (ja) 2010-04-23 2011-04-21 シングルボードコンピュータと共に使用する楔形ロック部、シングルボードコンピュータ、及びコンピュータシステムの組立方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/766,608 US8270172B2 (en) 2010-04-23 2010-04-23 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
US12/766,608 2010-04-23

Publications (1)

Publication Number Publication Date
WO2011133777A1 true WO2011133777A1 (en) 2011-10-27

Family

ID=44121019

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2011/033438 Ceased WO2011133777A1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system

Country Status (10)

Country Link
US (1) US8270172B2 (https=)
EP (1) EP2561733B1 (https=)
JP (1) JP2013526040A (https=)
KR (1) KR20130098851A (https=)
CN (1) CN102845142A (https=)
AU (1) AU2011242649A1 (https=)
CA (1) CA2796919C (https=)
MX (1) MX2012012218A (https=)
TW (1) TW201214091A (https=)
WO (1) WO2011133777A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10656687B2 (en) 2018-04-23 2020-05-19 Switch On LLC Adapter and housing dock for single board computer
DE102022204912A1 (de) 2022-05-18 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für eine Arretierung einer Elektronikbaugruppe eines Kraftfahrzeugs

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
CA2886777C (en) 2012-10-08 2021-07-13 General Electric Company Preloaded test substrates for testing lal-reactive substances, methods of use, and methods of making
WO2014178817A1 (en) 2013-04-29 2014-11-06 GE Intelligent Platforms Embedded Systems, Inc. Circuit card assembly with thermal energy removal
RU2551838C1 (ru) * 2014-01-28 2015-05-27 Федеральное государственное казенное военное образовательное учреждение высшего профессионального образования "Военная академия войсковой противовоздушной обороны Вооруженных Сил Российской Федерации имени Маршала Советского Союза А.М. Василевского" Министерства Обороны Российской Федерации Многослойная печатная плата с двухслойным защитным покрытием
EP3205191A1 (en) * 2014-10-06 2017-08-16 GE Intelligent Platforms, Inc. Circuit card assembly with thermal energy removal
AT518126B1 (de) * 2015-12-01 2020-01-15 Melecs Ews Gmbh Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren
DE102017127607A1 (de) * 2017-11-22 2019-05-23 Liebherr-Elektronik Gmbh Fixierungsvorrichtung zur Fixierung ein oder mehrerer Leiterplatten an einer Gehäusewand
US10381760B2 (en) 2018-01-05 2019-08-13 Hamilton Sundstrand Corporation Printed circuit board edge electrical contact pads
FR3097978B1 (fr) * 2019-06-28 2021-06-25 Valeo Vision Module optique comprenant une matrice de micro-miroirs
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
US12557231B2 (en) * 2023-12-12 2026-02-17 Bae Systems Information And Electronic Systems Integration Inc. Two-piece separable wedge clamp for thermal mechanical interface
US12610490B2 (en) 2024-02-12 2026-04-21 Wavetherm Corporation Wedge based circuit board retainer with dual end drivescrew
KR20250164935A (ko) 2024-05-17 2025-11-25 주식회사 에이투마인드 보드 홀더 어셈블리

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US20030223197A1 (en) * 2002-05-28 2003-12-04 Dy-04 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US20040070944A1 (en) * 2002-10-10 2004-04-15 Harris Corporation Circuit card module including mezzanine card heat sink and related methods

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Publication number Priority date Publication date Assignee Title
US5010444A (en) 1987-11-13 1991-04-23 Radstone Technology Limited Rack mounted circuit board
US4879634A (en) 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US5887435A (en) * 1995-12-08 1999-03-30 Litton Systems, Inc. Environmentally protected module
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6246582B1 (en) * 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US8317968B2 (en) * 2004-04-30 2012-11-27 Lam Research Corporation Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7476108B2 (en) * 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) * 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US20030223197A1 (en) * 2002-05-28 2003-12-04 Dy-04 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US20040070944A1 (en) * 2002-10-10 2004-04-15 Harris Corporation Circuit card module including mezzanine card heat sink and related methods

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10656687B2 (en) 2018-04-23 2020-05-19 Switch On LLC Adapter and housing dock for single board computer
DE102022204912A1 (de) 2022-05-18 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für eine Arretierung einer Elektronikbaugruppe eines Kraftfahrzeugs

Also Published As

Publication number Publication date
EP2561733B1 (en) 2019-08-28
US8270172B2 (en) 2012-09-18
KR20130098851A (ko) 2013-09-05
JP2013526040A (ja) 2013-06-20
EP2561733A1 (en) 2013-02-27
AU2011242649A1 (en) 2012-11-08
TW201214091A (en) 2012-04-01
MX2012012218A (es) 2012-12-17
US20110261537A1 (en) 2011-10-27
CA2796919A1 (en) 2011-10-27
CA2796919C (en) 2018-06-26
CN102845142A (zh) 2012-12-26

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