MX2012012218A - Cierre de cuña para usarse con una sola computadora de tarjeta, una sola computadora de tarjeta y un metodo para ensamblar el sistema de computadora. - Google Patents

Cierre de cuña para usarse con una sola computadora de tarjeta, una sola computadora de tarjeta y un metodo para ensamblar el sistema de computadora.

Info

Publication number
MX2012012218A
MX2012012218A MX2012012218A MX2012012218A MX2012012218A MX 2012012218 A MX2012012218 A MX 2012012218A MX 2012012218 A MX2012012218 A MX 2012012218A MX 2012012218 A MX2012012218 A MX 2012012218A MX 2012012218 A MX2012012218 A MX 2012012218A
Authority
MX
Mexico
Prior art keywords
single board
board computer
computer
wedge lock
assembling
Prior art date
Application number
MX2012012218A
Other languages
English (en)
Inventor
Bernd Sporer
Robert Ireland
Original Assignee
Ge Intelligent Platforms Embedded Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ge Intelligent Platforms Embedded Systems Inc filed Critical Ge Intelligent Platforms Embedded Systems Inc
Publication of MX2012012218A publication Critical patent/MX2012012218A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un cierre de cuña para usarse en una sola computadora de tarjeta incluye una placa de enfriamiento colocada con respecto a un tablero de circuito impreso (PCB), un dispositivo de sujeción configurado para asegurar la única computadora de tarjeta en un ambiente operativo y una placa de conducción de calor colocada a lo largo de la superficie superior de la placa de enfriamiento y una superficie superior del dispositivo de sujeción para facilitar el enfriamiento por conducción del PCB.
MX2012012218A 2010-04-23 2011-04-21 Cierre de cuña para usarse con una sola computadora de tarjeta, una sola computadora de tarjeta y un metodo para ensamblar el sistema de computadora. MX2012012218A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/766,608 US8270172B2 (en) 2010-04-23 2010-04-23 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system
PCT/US2011/033438 WO2011133777A1 (en) 2010-04-23 2011-04-21 Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system

Publications (1)

Publication Number Publication Date
MX2012012218A true MX2012012218A (es) 2012-12-17

Family

ID=44121019

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2012012218A MX2012012218A (es) 2010-04-23 2011-04-21 Cierre de cuña para usarse con una sola computadora de tarjeta, una sola computadora de tarjeta y un metodo para ensamblar el sistema de computadora.

Country Status (10)

Country Link
US (1) US8270172B2 (es)
EP (1) EP2561733B1 (es)
JP (1) JP2013526040A (es)
KR (1) KR20130098851A (es)
CN (1) CN102845142A (es)
AU (1) AU2011242649A1 (es)
CA (1) CA2796919C (es)
MX (1) MX2012012218A (es)
TW (1) TW201214091A (es)
WO (1) WO2011133777A1 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8456846B2 (en) * 2010-01-20 2013-06-04 Wavetherm Corporation Wedge based circuit board retainer
US9658000B2 (en) 2012-02-15 2017-05-23 Abaco Systems, Inc. Flexible metallic heat connector
EP3425401B1 (en) 2012-10-08 2023-09-27 BL Technologies, Inc. Preloaded test substrates for testing lal-reactive substances, methods of use, and methods of making
US9839116B2 (en) 2013-04-29 2017-12-05 Abaco Systems, Inc. Circuit card assembly with thermal energy removal
EP3205191A1 (en) * 2014-10-06 2017-08-16 GE Intelligent Platforms, Inc. Circuit card assembly with thermal energy removal
AT518126B1 (de) * 2015-12-01 2020-01-15 Melecs Ews Gmbh Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren
DE102017127607A1 (de) * 2017-11-22 2019-05-23 Liebherr-Elektronik Gmbh Fixierungsvorrichtung zur Fixierung ein oder mehrerer Leiterplatten an einer Gehäusewand
US10381760B2 (en) 2018-01-05 2019-08-13 Hamilton Sundstrand Corporation Printed circuit board edge electrical contact pads
JP6828903B2 (ja) * 2018-04-23 2021-02-10 合同会社スイッチオン シングルボードコンピュータ用アダプタ
FR3097978B1 (fr) * 2019-06-28 2021-06-25 Valeo Vision Module optique comprenant une matrice de micro-miroirs
US11997815B2 (en) * 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
DE102022204912A1 (de) 2022-05-18 2023-11-23 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung für eine Arretierung einer Elektronikbaugruppe eines Kraftfahrzeugs

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904933A (en) 1974-10-23 1975-09-09 Control Data Corp Cooling apparatus for electronic modules
US4879634A (en) 1987-11-13 1989-11-07 Plessey Overseas Limited Rack mounted circuit board
US5010444A (en) 1987-11-13 1991-04-23 Radstone Technology Limited Rack mounted circuit board
US5887435A (en) * 1995-12-08 1999-03-30 Litton Systems, Inc. Environmentally protected module
US5859764A (en) * 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock
US6246582B1 (en) * 1998-12-30 2001-06-12 Honeywell Inc. Interchangeable stiffening frame with extended width wedgelock for use in a circuit card module
US6212075B1 (en) * 1998-12-30 2001-04-03 Honeywell Inc. Adapter kit to allow extended width wedgelock for use in a circuit card module
US6239972B1 (en) * 1999-12-13 2001-05-29 Honeywell International Inc. Integrated convection and conduction heat sink for multiple mounting positions
US6873528B2 (en) 2002-05-28 2005-03-29 Dy 4 Systems Ltd. Supplemental heat conduction path for card to chassis heat dissipation
US6721182B1 (en) 2002-10-10 2004-04-13 Harris Corporation Circuit card module including mezzanine card heat sink and related methods
US6678159B1 (en) 2002-12-23 2004-01-13 Eastman Kodak Company Method of transporting heat from a heat dissipating electrical assemblage
US6765798B1 (en) * 2003-06-19 2004-07-20 Curtiss-Wright Controls, Inc. Electronic thermal management utilizing device with deflectable, two-leg conductive member; and with elastic, thermally-conductive material there between
US8317968B2 (en) * 2004-04-30 2012-11-27 Lam Research Corporation Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
US7031167B1 (en) * 2004-11-24 2006-04-18 Elta Systems Ltd. Wedgelock for electronic circuit card module
US7476108B2 (en) * 2004-12-22 2009-01-13 Fci Americas Technology, Inc. Electrical power connectors with cooling features
US7349221B2 (en) * 2006-07-20 2008-03-25 Honeywell International Inc. Device for increased thermal conductivity between a printed wiring assembly and a chassis

Also Published As

Publication number Publication date
CA2796919C (en) 2018-06-26
US20110261537A1 (en) 2011-10-27
TW201214091A (en) 2012-04-01
EP2561733B1 (en) 2019-08-28
CA2796919A1 (en) 2011-10-27
US8270172B2 (en) 2012-09-18
EP2561733A1 (en) 2013-02-27
KR20130098851A (ko) 2013-09-05
AU2011242649A1 (en) 2012-11-08
JP2013526040A (ja) 2013-06-20
CN102845142A (zh) 2012-12-26
WO2011133777A1 (en) 2011-10-27

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