IN2014DN05679A - - Google Patents

Info

Publication number
IN2014DN05679A
IN2014DN05679A IN5679DEN2014A IN2014DN05679A IN 2014DN05679 A IN2014DN05679 A IN 2014DN05679A IN 5679DEN2014 A IN5679DEN2014 A IN 5679DEN2014A IN 2014DN05679 A IN2014DN05679 A IN 2014DN05679A
Authority
IN
India
Prior art keywords
heat
cooler
electronic circuit
circuit boards
rack
Prior art date
Application number
Other languages
English (en)
Inventor
Wei Ling
Salvatore Messana
Paul Rominski
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Publication of IN2014DN05679A publication Critical patent/IN2014DN05679A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IN5679DEN2014 2012-01-30 2013-01-28 IN2014DN05679A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/360,997 US8913391B2 (en) 2012-01-30 2012-01-30 Board-level heat transfer apparatus for communication platforms
PCT/US2013/023405 WO2013116143A1 (en) 2012-01-30 2013-01-28 A board-level heat transfer apparatus for communication platforms

Publications (1)

Publication Number Publication Date
IN2014DN05679A true IN2014DN05679A (es) 2015-04-03

Family

ID=48870030

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5679DEN2014 IN2014DN05679A (es) 2012-01-30 2013-01-28

Country Status (7)

Country Link
US (1) US8913391B2 (es)
EP (1) EP2810544A1 (es)
JP (1) JP2015508919A (es)
KR (1) KR20140117462A (es)
CN (1) CN104081887A (es)
IN (1) IN2014DN05679A (es)
WO (1) WO2013116143A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10091911B2 (en) * 2012-12-11 2018-10-02 Infinera Corporation Interface card cooling using heat pipes
US9144178B2 (en) 2013-03-01 2015-09-22 International Business Machines Corporation Selective clamping of electronics card to coolant-cooled structure
GB2512378A (en) * 2013-03-28 2014-10-01 Ibm Device and method for cooling electronic components and for supplying power to the electronic components
US9414524B2 (en) * 2013-09-11 2016-08-09 Artesyn Embedded Computing, Inc. Extended heat frame for printed circuit board
US9603277B2 (en) * 2014-03-06 2017-03-21 Adtran, Inc. Field-reconfigurable backplane system
US9521782B2 (en) * 2014-06-26 2016-12-13 General Electric Company Systems and methods for passive cooling of components within electrical devices
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
US10098241B2 (en) 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
US10884203B2 (en) * 2015-11-16 2021-01-05 Accedian Networks Inc. Cooling apparatus for pluggable modules
US10323868B2 (en) 2016-02-08 2019-06-18 Trane International Inc. Multi-coil microchannel evaporator
US10387278B2 (en) * 2017-03-31 2019-08-20 Cisco Technology, Inc. Method to display real-time module OIR time
US10806056B2 (en) * 2017-07-19 2020-10-13 Hewlett Packard Enterprise Development Lp Cooling system for high-performance computer
US10375863B2 (en) * 2017-11-28 2019-08-06 Dell Products, L.P. Liquid cooled chassis
US10548245B2 (en) 2018-02-12 2020-01-28 Robert J Lipp Liquid cooled open compute project rack insert
CN113347505A (zh) * 2021-04-23 2021-09-03 微网优联科技(成都)有限公司 一种路由器的散热结构
DE102022202015A1 (de) * 2022-02-28 2023-08-31 Robert Bosch Gesellschaft mit beschränkter Haftung Vorrichtung mit austauschbaren Elektronikbaugruppen eines Kraftfahrzeugs

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674004A (en) 1986-07-03 1987-06-16 Burroughs Corporation Parallel-flow air system for cooling electronic equipment
JPH0732218B2 (ja) 1988-06-10 1995-04-10 日本電気株式会社 集積回路用冷却装置
JPH03246997A (ja) * 1990-02-26 1991-11-05 Fujitsu Ltd シェルフ実装の冷却構造
US5036428A (en) * 1990-06-29 1991-07-30 Eg&G Birtcher, Inc. Printed circuit board retainer assembly
JPH07221479A (ja) 1994-02-08 1995-08-18 Mitsubishi Electric Corp 電子機器
JP3608640B2 (ja) * 1997-05-12 2005-01-12 株式会社リコー 半導体装置およびその実装方法
JP2001148451A (ja) * 1999-03-24 2001-05-29 Mitsubishi Materials Corp パワーモジュール用基板
JP3881488B2 (ja) * 1999-12-13 2007-02-14 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する電子機器
US6900984B2 (en) * 2001-04-24 2005-05-31 Apple Computer, Inc. Computer component protection
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US6862180B2 (en) * 2002-05-24 2005-03-01 Adc Dsl Systems, Inc. Housings for circuit cards
US6711021B1 (en) * 2003-01-15 2004-03-23 Hewlett-Packard Development Company, L.P. Systems and methods that use at least one component to remove the heat generated by at least one other component
US20050207134A1 (en) * 2004-03-16 2005-09-22 Belady Christian L Cell board interconnection architecture
US7978476B2 (en) * 2004-09-30 2011-07-12 Amphenol Corporation Electronic system with non-parallel arrays of circuit card assemblies
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
JP2006254591A (ja) * 2005-03-10 2006-09-21 Toshiba Corp 静電アクチュエータおよび撮像装置
JP2006258392A (ja) 2005-03-18 2006-09-28 Hitachi Kokusai Electric Inc 射撃訓練システム
US7289331B2 (en) * 2005-03-30 2007-10-30 International Business Machines Corporation Interposable heat sink for adjacent memory modules
US7365976B2 (en) * 2006-03-24 2008-04-29 Fujitsu Limited Electronic apparatus
US7403392B2 (en) * 2006-05-16 2008-07-22 Hardcore Computer, Inc. Liquid submersion cooling system
US7408776B2 (en) * 2006-10-10 2008-08-05 International Business Machines Corporation Conductive heat transport cooling system and method for a multi-component electronics system
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US7474529B2 (en) * 2006-11-29 2009-01-06 International Business Machines Corporation Folded-sheet-metal heatsinks for closely packaged heat-producing devices
US20080158819A1 (en) * 2007-01-03 2008-07-03 International Business Machines Corporation Heat transfer apparatus containing a compliant fluid film interface and method therefor
JPWO2008126444A1 (ja) * 2007-03-30 2010-07-22 日本電気株式会社 放熱構造、及び携帯機器
JP2008258392A (ja) * 2007-04-05 2008-10-23 Nec Saitama Ltd 電子機器
US20080298021A1 (en) * 2007-05-31 2008-12-04 Ali Ihab A Notebook computer with hybrid diamond heat spreader
US7903409B2 (en) * 2007-07-18 2011-03-08 Hewlett-Packard Development Company, L.P. System and method for cooling an electronic device
JP4898598B2 (ja) * 2007-08-28 2012-03-14 株式会社日立製作所 ラックマウント型制御装置の冷却構造及びラック型記憶制御装置
CN100576982C (zh) * 2007-09-29 2009-12-30 航天东方红卫星有限公司 机电热一体化电子机箱
US20090166065A1 (en) * 2008-01-02 2009-07-02 Clayton James E Thin multi-chip flex module
US7905105B2 (en) * 2008-01-25 2011-03-15 Alcatel-Lucent Usa Inc. Modular in-frame pumped refrigerant distribution and heat removal system
TWI349848B (en) * 2008-06-11 2011-10-01 Asustek Comp Inc Heat-dissipating device for memory module
US7804684B1 (en) * 2008-12-22 2010-09-28 Juniper Networks, Inc. Cooling system for a data processing unit
JP2011137663A (ja) * 2009-12-26 2011-07-14 Nidec-Read Corp 検査用治具、検査用治具の接続体及びその製造方法
FR2956280A1 (fr) * 2010-02-09 2011-08-12 Kontron Modular Computers Sa Dispositif auxiliaire d'evacuation par conduction de la chaleur produite par une carte electronique
US8385069B2 (en) * 2010-05-24 2013-02-26 International Business Machines Corporation Liquid coolant conduit secured in an unused socket for memory module cooling
US8139355B2 (en) * 2010-05-24 2012-03-20 International Business Machines Corporation Memory module connector having memory module cooling structures
KR100998213B1 (ko) 2010-06-03 2010-12-03 엘아이지넥스원 주식회사 Ｐｃｂ 냉각 장치
US8238104B2 (en) * 2010-08-09 2012-08-07 Amazon Technologies, Inc. Data center with fin modules
JP5230759B2 (ja) * 2011-02-17 2013-07-10 第一電子工業株式会社 コネクタ
US8542489B2 (en) * 2011-05-05 2013-09-24 Alcatel Lucent Mechanically-reattachable liquid-cooled cooling apparatus
US9049803B2 (en) * 2011-09-22 2015-06-02 Panduit Corp. Thermal management infrastructure for IT equipment in a cabinet

Also Published As

Publication number Publication date
KR20140117462A (ko) 2014-10-07
US20130194755A1 (en) 2013-08-01
JP2015508919A (ja) 2015-03-23
CN104081887A (zh) 2014-10-01
WO2013116143A1 (en) 2013-08-08
US8913391B2 (en) 2014-12-16
EP2810544A1 (en) 2014-12-10

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