WO2011129165A1 - Méthode de traitement de surface et dispositif pour substrat de microtas et masque pour traitement de surface d'un substrat de microtas - Google Patents

Méthode de traitement de surface et dispositif pour substrat de microtas et masque pour traitement de surface d'un substrat de microtas Download PDF

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Publication number
WO2011129165A1
WO2011129165A1 PCT/JP2011/055474 JP2011055474W WO2011129165A1 WO 2011129165 A1 WO2011129165 A1 WO 2011129165A1 JP 2011055474 W JP2011055474 W JP 2011055474W WO 2011129165 A1 WO2011129165 A1 WO 2011129165A1
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Prior art keywords
substrate
mask
light
ultraviolet light
workpiece
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PCT/JP2011/055474
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English (en)
Japanese (ja)
Inventor
信二 鈴木
匡平 関
英樹 藤次
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ウシオ電機株式会社
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Publication of WO2011129165A1 publication Critical patent/WO2011129165A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/16—Surface properties and coatings
    • B01L2300/161—Control and use of surface tension forces, e.g. hydrophobic, hydrophilic

Definitions

  • the present invention relates to a surface treatment method, a surface treatment apparatus, and a mask for surface treatment, and more particularly to a method and apparatus for performing surface treatment by irradiating a microTAS substrate with light and a mask used for surface treatment of microTAS. .
  • microTAS micro total analysis system
  • a chip suitable for various applications can be configured by providing a region having various functions such as a reaction region in which a reagent is arranged in a flow path also called a micro channel.
  • Typical applications of microchips include chemical analysis such as genetic analysis, clinical diagnosis, and drug screening, biochemistry, pharmacy, medicine, veterinary analysis, compound synthesis, and environmental measurement.
  • a microchip typically has a structure in which a pair of substrates are bonded to face each other, and has a fine channel (for example, a width of 10 to several hundreds ⁇ m and a depth of 10 to several tens of ⁇ m on the surface of at least one of the substrates. Degree) is formed.
  • a glass substrate is mainly used for a microchip because it can be easily manufactured and optically detected. Recently, development of a microchip using a resin substrate, which is light in weight but is less likely to be damaged than a glass substrate and inexpensive.
  • a method using an adhesive or a method using heat fusion may be considered.
  • both are not preferable for the following reasons.
  • the adhesive oozes out into the micro flow path and the flow path is blocked, a part of the micro flow path becomes narrow and the flow path becomes non-uniform, or the flow path wall surface is homogeneous. Problems such as the occurrence of disturbances in characteristics occur.
  • heat fusion if fusion is performed at a temperature higher than the heat melting temperature, the flow path may be collapsed in the heating stage, or the flow path may not be maintained in a predetermined cross-sectional shape. It becomes difficult to increase the functionality of the microchip.
  • Patent Document 1 when a microchip substrate is bonded, a substrate made of silicone such as polydimethylsiloxane (PDMS) is irradiated with light from an excimer lamp having an emission line at a wavelength of 172 nm to the surface.
  • PDMS polydimethylsiloxane
  • a modification process oxygen process
  • a substrate for example, a glass substrate
  • a hydroxyl group on the surface thereof is brought into close contact with the surface to be modified of the silicone substrate, and both the substrates are bonded.
  • a resin substrate and a glass substrate are used as the microchip substrate, even when two resin substrates are used, light from an excimer lamp having a bright line at a wavelength of 172 nm, for example, is irradiated on at least one substrate surface. Then, a method of joining both substrates is known. For example, when laminating the resin substrate and the resin substrate, by irradiating the resin surface with light having a wavelength of 300 nm or less (for example, wavelength 172 nm), the polymer main chain on the resin surface is cut to generate radicals, By generating highly reactive functional groups on the surface, the resin surface itself is likely to cause a chemical reaction, and two resins are laminated.
  • the detailed mechanism is not necessarily clear, but some bonds via the functional groups are generated and bonded between the irradiated surfaces of the respective resins.
  • the resin substrate is irradiated with vacuum ultraviolet light having a wavelength of 200 nm or less, such as light having a wavelength of 172 nm, in the atmosphere, oxygen atoms are generated from oxygen in the atmosphere, and pollutants such as organic substances existing on the resin surface. The chemical bond of is broken. The contaminants are removed from the resin substrate by combining such contaminants with oxygen atoms. That is, the resin substrate is cleaned, and thereafter, the resin surface is oxidized, functional groups are generated, and the like.
  • the surface of the microchip substrate is activated so that it can be joined to another microchip substrate (for example, cleaning, oxidation, polymer main chain Cleavage, generation of functional groups, etc.).
  • the microchip is configured by bonding a pair of substrates.
  • a specimen eg, saliva, blood, (cancer) cell, antibody, etc.
  • Patent Document 2 discloses a technique for fixing cells by forming a hydrophobic resin pattern for cell fixation on a substrate.
  • JP 2006-187730 A Japanese Patent No. 4247737
  • the surface of at least one of the two substrates is irradiated with ultraviolet light that activates the surface, and then the two are stacked. Then, the method of bonding is effective.
  • an inspection body for example, an antibody or a cell
  • the substrate is also irradiated with ultraviolet light and activated. There is.
  • the inspection object is irradiated with ultraviolet light
  • the inspection object is deteriorated and it becomes difficult to perform a desired analysis on the inspection object.
  • the antibody is irradiated with ultraviolet light
  • the antibody is inactivated (inactivated) and does not cause a binding reaction with the antigen even if a specimen containing the antigen reaches the antibody.
  • the inspection body installed on the microchip substrate so as not to be irradiated with ultraviolet light. That is, as shown in FIG. 8, it is conceivable to arrange a mask between a light source that emits ultraviolet light and a microchip substrate on which an inspection object is placed.
  • a mask between a light source that emits ultraviolet light and a microchip substrate on which an inspection object is placed.
  • FIG. 8 as an example, a case where gold plating 101 is applied to a part of the surface of the microchip substrate 100 (work) and the antibody 103 is arranged on the gold plating portion is shown.
  • the mask 104 is patterned so as to prevent the test body from being irradiated with ultraviolet light, corresponding to the installation pattern of the test body (in this case, the antibody 103) on the microchip substrate 100. That is, the ultraviolet light is irradiated to the substrate surface where no antibody exists without irradiating the antibody 103 on the microchip substrate 100 by the light shielding means 105 of the mask 104, and as a
  • the microchip substrate may be placed in an atmosphere in which oxygen does not exist and irradiated with ultraviolet light. To realize such an atmosphere, the microchip is used. It is necessary to install the substrate for use in a dedicated chamber in which oxygen does not exist, which is a large scale.
  • the present invention has been made in view of the circumstances as described above, and the problem is that ultraviolet light is applied to a microchip substrate on which a test object is placed on the surface in the atmosphere in order to bond the microchip substrate.
  • ultraviolet light is applied to a microchip substrate on which a test object is placed on the surface in the atmosphere in order to bond the microchip substrate.
  • irradiation it is an object to provide a method and apparatus capable of satisfactorily modifying the surface of a microchip substrate without altering the specimen.
  • a specimen such as a specimen derived from a living body such as blood, a cell, or a tissue
  • a specimen such as an antibiotic or an agrochemical is altered by ultraviolet light or ozone (for example, inactivation, decomposition, death).
  • ultraviolet light or ozone for example, inactivation, decomposition, death.
  • a mask having a light shielding part is disposed at least in part between the light irradiation unit for irradiating ultraviolet light and the inspection body, and the inspection body is formed by the mask and the substrate on which the inspection body is placed.
  • An enclosed space is formed, and the substrate is irradiated with ultraviolet light while being shielded from being irradiated with ultraviolet light by the light shielding portion or by the light shielding portion and the substrate.
  • the surface of the microchip substrate can be activated without altering the specimen. That is, in the present invention, the above problem is solved as follows.
  • the substrate surface is activated by light irradiation while shielding the inside of the closed space where the inspection object is placed.
  • a recess is formed in the mask, and a light shielding film is formed on the inner surface of the recess.
  • the light is vacuum ultraviolet light having a wavelength of 200 nm or less.
  • a stage that holds the substrate on which the inspection body is placed, and a surface for activating the substrate surface
  • a mask having a light shielding member formed at least in part, and transporting the mask onto the substrate, and arranging the inspection object in a closed space
  • a surface processing apparatus for a microchip substrate is configured from the mask transport mechanism.
  • the light is vacuum ultraviolet light having a wavelength of 200 nm or less.
  • the mask is at least one A concave portion is formed in the portion, and when the mask is placed on the substrate, a closed space is formed by the concave portion of the mask and the substrate, and a light shielding means is formed on the inner surface of the concave portion. .
  • the recessed part of a mask is comprised by the wall part protruded from the flat member.
  • a closed space in which the inspection body is accommodated is formed by the mask and the substrate on which the inspection body is placed, and vacuum ultraviolet light is applied to the inspection body by the light shielding portion formed on the mask or by the light shielding portion and the substrate. Since the UV light such as light is shielded from being irradiated, vacuum UV light is not irradiated to the inspection object, and vacuum UV light is applied to the work even if the work is held in the atmosphere. The test object is not exposed to ozone or oxygen atoms generated during irradiation.
  • the inspection object installed in the workpiece does not suffer from problems such as deterioration due to irradiation with vacuum ultraviolet light or exposure to ozone or oxygen atoms.
  • the work is held in the atmosphere, and ozone and oxygen atoms generated by irradiation with vacuum ultraviolet light are generated in a region outside the closed space in which the specimen is contained. Therefore, the area outside the closed space of the workpiece can be cleaned, and the area outside the closed space on the workpiece surface can be activated (surface modification).
  • FIG. 1 shows the structural example of the optical processing apparatus which is embodiment of this invention. It is the figure which expanded and showed the workpiece
  • FIG. 1A is a diagram illustrating a configuration example of an optical processing apparatus according to an embodiment of the present invention.
  • the work 30 is a microchip substrate, and is made of, for example, a COC resin.
  • An inspection body 31 is placed on the workpiece 30 in advance and is omitted in the figure, but the other workpiece is bonded to form a microchip.
  • the light irradiation unit 10 is for modifying the surface of the work 30 by irradiating the surface of the work 30 with ultraviolet light (UV light) having a wavelength of 300 nm or less.
  • the light irradiation unit 10 includes at least one lamp 11a, a reflection mirror 11b that reflects ultraviolet light emitted from the lamp 11a toward the work 30 (downward in FIG.
  • the lamp 11a is preferably one that emits vacuum ultraviolet light (VUV light) having a wavelength of 200 nm or less among ultraviolet light.
  • VUV light vacuum ultraviolet light
  • a xenon excimer lamp that emits monochromatic light having a wavelength of 172 nm is employed.
  • Lighting control of each lamp 11 a of the light irradiation unit 10 is performed by the lamp lighting device 12. That is, the lamp lighting device 12 has a function of adjusting the intensity of 172 nm light emitted from the lamp 11a by controlling lighting / extinguishing of the lamp and adjusting the value of the power supplied to the lamp 11a.
  • a work 30 (microchip substrate) is placed on the work stage 40.
  • the ultraviolet light particularly vacuum ultraviolet light
  • irradiated from the light irradiation unit 10 to the work 30 is significantly attenuated in the atmosphere. Therefore, in the atmosphere, the light irradiation unit 10 and the surface of the work 30 need to be close to some extent.
  • the work stage 40 is provided with a positioning mechanism (not shown) that determines the position of the work 30.
  • the work stage 40 also has a mechanism that can move not only in the vertical direction but also in the horizontal direction and the rotational direction.
  • the mask 20 is transferred onto the work 30 by the mask transfer mechanism 21.
  • the mask transport mechanism 21 is a well-known one.
  • the mask 20 is held and transported by the vacuum chuck unit 22, and after the mask 20 is set on the work 30, the vacuum chuck of the vacuum chuck unit 22 is released and ultraviolet light is released.
  • a mask transport mechanism 20 is configured to be movable by the mask transport mechanism driving unit 23 and to be able to supply a vacuum to the vacuum chuck unit 22.
  • the driving of the mask transport mechanism drive unit 23 is controlled by the mask transport mechanism drive control unit 24.
  • a known work conveyance mechanism (not shown) is used.
  • the well-known work transport mechanism has a function of reversing the work after capturing the work, a function of transporting the reversed work, and placing the work at a predetermined position.
  • FIG. 2 is an enlarged view of the work 30 and the mask 20 on the work stage 40.
  • the mask 20 has a recess that can surround an inspection body 31 placed on a work 30 (hereinafter also referred to as a microchip substrate 30).
  • a wall portion 20a having a protruding structure is provided on the back surface (the surface facing the workpiece 30) of the flat plate portion 20b that receives ultraviolet light, and the inspection body 31 is placed on the mask 20.
  • the installed work 30 and the wall portion 20a are placed in contact with each other.
  • a closed space including the flat plate portion 20 b of the mask 20, the wall portion 20 a of the mask 20, and the workpiece 30 is formed between the mask 20 and the workpiece 30. All of the inspection bodies 31 installed on the work 30 are included in this closed space.
  • the mask 20 is a material that transmits ultraviolet light, and does not react with the inspection body 31 and is easily subjected to light shielding means. For example, quartz glass is used.
  • An ultraviolet light shielding means 20c is formed in a concave portion (a portion surrounded by the flat plate portion 20b and the wall portion 20a) of the mask 20 constituting the closed space. Specifically, for example, a light shielding film such as chrome is applied to the concave portion (flat plate portion, wall portion) of the mask 20 constituting the closed space.
  • the light shielding means 20c is not necessarily provided on the entire surface of the mask recess that forms the closed space. In short, the light shielding means 20c may be shielded so that ultraviolet light does not reach the closed space. With the above configuration, the ultraviolet light does not reach the closed space containing the inspection body 31 placed on the work 30.
  • FIG. 2B is a cross-sectional view taken along the line AA in FIG.
  • the mask 20 is formed with a wall portion 20a, for example, in a U shape so as to surround a region where the gold plating 32 on which the inspection body 31 is placed is formed, and light shielding means is provided on the inner surface of the wall portion 20a. 20c is provided. Although not shown in FIG. 2B, a light shielding unit is also provided on the surface of the mask 20 facing the light irradiation unit 10.
  • FIG. 3 is a view showing a state in which a microchip 60 is configured by bonding a second microchip substrate (second work 50) to the microchip substrate (first work 30).
  • the first workpiece 30 is, for example, a glass substrate.
  • a pattern of gold plating 32 having four regions is applied.
  • an antibody 31 a is installed on the pattern of the gold plating 32 as the inspection body 31.
  • the second workpiece (second microchip substrate to be bonded to the first workpiece 30) 50 is, for example, a resin substrate made of COC resin.
  • a flow path composed of fine groove portions 51 having a width of about 10 to several hundreds ⁇ m and a depth of about 10 to 100 ⁇ m is formed on one surface of the second workpiece 50.
  • the antibody 31 a is formed inside by bonding the surface of the first work 30 on which the inspection body 31 is installed and the surface on which the groove 51 of the second work 50 is formed.
  • a microchip 60 having a fine flow path arranged is formed.
  • a sample (or reagent) inflow port 52 and a sample (or reagent) outflow port 53 are provided on the surface of the second work (second microchip substrate) 50 opposite to the surface on which the flow path is provided. It has been.
  • the inflow port 52 and the outflow port 53 communicate with the groove 51.
  • the flow path is formed to be U-shaped, and the inflow port 52 and the outflow port 53 communicate with the end portion of the U-shaped flow path 51.
  • the specimen flowing in from the inflow port 52 passes through the flow path 51 and is discharged from the outflow port 53 after contacting the four antibodies 31a placed on the gold plating.
  • the surface of the microchip substrate 30 is formed by covering the first work 30 (microchip substrate) on which the antibody 31a is placed with the mask 20 as described above and irradiating the surface with ultraviolet light. Can be activated to be able to be joined, and the second work 50 (second microchip substrate) is put on this to cover the first work 30 and the first work 30 with the antibody 31a installed.
  • work 50 can be bonded together and the microchip 60 can be formed.
  • Example of this invention which performs the optical process with respect to the 1st workpiece
  • FIG. 4 is a diagram for explaining the operation of the apparatus shown in FIG. 1
  • FIG. 5 is a diagram for explaining the bonding process of this embodiment.
  • an antibody 31a (antigen receptor) is immobilized.
  • the mask 20 is placed on the first work 30 to which the antibody 31a is fixed.
  • the mask 20 has a structure in which a closed space is formed by the flat plate portion 20 b of the mask 20, the wall portion 20 a of the mask, and the first workpiece 30.
  • the mask 20 is placed on the first work 30 after positioning so that the antibodies 31a installed on the first work 30 are all contained in the closed space. That is, as shown in FIG.
  • the light irradiation unit drive control unit 14 drives the light irradiation unit drive unit 13 to retract the light irradiation unit 10, and the mask 20 is moved by the vacuum chuck 22 of the mask transport mechanism 21. Is transferred onto the first work 30 placed on the work stage 40. Then, the work stage 40 is moved (or the mask is moved by the mask transport mechanism 21), the mask 20 and the first work 30 are aligned, and the mask 20 is moved as shown in FIG. Place on the first workpiece 30.
  • the mask portion (flat plate portion 20b, wall portion 20a) constituting the closed space is provided with a light blocking means 20c (for example, a light blocking film such as chrome) that blocks vacuum ultraviolet light, so that it is included in the closed space.
  • a light blocking means 20c for example, a light blocking film such as chrome
  • the specimen (antibody 31a) is not irradiated with the vacuum ultraviolet light, and ozone and oxygen atoms are not generated even if the atmosphere exists in the closed space. Furthermore, by irradiating the first work 30 with vacuum ultraviolet light in the atmosphere, ozone and oxygen atoms generated between the mask 20 and the first work 30 cannot enter the closed space. Therefore, the antibody 31a in the closed space is not exposed to ozone or oxygen atoms.
  • the region outside the closed space in the first work 30 is irradiated with vacuum ultraviolet light.
  • ozone and oxygen atoms are generated in the region irradiated with the vacuum ultraviolet light, and the region outside the closed space in the ozone and oxygen atoms and the first workpiece 30 is generated.
  • the above contaminants react to remove the contaminants. For example, antibody residues remaining after dipping in the above antibody solution are also removed. That is, when the first workpiece 30 is irradiated with vacuum ultraviolet light using the mask of the present invention, the specimen (antibody 31a) is not irradiated with vacuum ultraviolet light, and the first workpiece 30 is held in the atmosphere.
  • the test body (antibody 31a) installed on the first workpiece 30 does not suffer from problems such as deterioration due to irradiation with vacuum ultraviolet light or exposure to ozone or oxygen atoms.
  • the test body (antibody 31a) installed on the first workpiece 30 does not suffer from problems such as deterioration due to irradiation with vacuum ultraviolet light or exposure to ozone or oxygen atoms.
  • ozone and oxygen atoms generated by irradiation with vacuum ultraviolet light are generated in a region outside the closed space in which the specimen is contained. Then, the area outside the closed space in the first work 30 is cleaned. Furthermore, after the cleaning is completed, the region outside the closed space on the surface of the first workpiece 30 is activated (surface modification) by irradiating with vacuum ultraviolet light.
  • the step of irradiating the first workpiece 30 with the vacuum ultraviolet light emitted from the light irradiation unit described above is specifically performed as follows. That is, after installing the mask 20 on the first work 30, the lamp 11 a of the light irradiation unit 10 is turned on by the lamp lighting device 12, and vacuum ultraviolet light having a wavelength of 172 nm is applied to the first work 30 through the mask 20. Is done.
  • the irradiance in the light irradiation region (region other than the closed space) on the surface of the first workpiece 30 is sufficient to clean and activate the light irradiation region. Value) to control the power supplied to the lamp 11a.
  • the lamp lighting device 12 After a predetermined irradiation time has elapsed, the lamp lighting device 12 turns off the excimer lamp 11a.
  • the lamp lighting device 12 can also set the lamp lighting time.
  • the above-mentioned predetermined irradiation time means that the excimer lamp 11a is turned on and the light irradiation region on the surface of the first workpiece 30 is irradiated with vacuum ultraviolet light, and then the light irradiation region is cleaned with oxygen atoms. , The time until activation. Thus, the optical processing for the first workpiece 30 is completed.
  • the other substrate (second workpiece 50) constituting the microchip is also irradiated with light
  • the surface of the workpiece 50 is activated. This step may be performed prior to the light irradiation on the first workpiece 30 on which the antibody 31a is installed, or the light irradiation unit 10 may be added to irradiate both substrates simultaneously.
  • the mask 20 is retracted from the first workpiece 30. The retraction of the mask 20 can also be performed after the light irradiation to the first workpiece 30 is completed and before the light irradiation to the second workpiece 50 is performed.
  • the groove 51 (flow path) formed in the second workpiece 50 is designed in advance so as to enclose the antibody 31a installed in the first workpiece 30 when the two are bonded together. Therefore, when both the workpieces 30 and 50 are stacked, alignment is necessary so that the positions of the flow path and the antibody do not shift.
  • a specimen such as a bacterium, a virus, or a cell infected with a microorganism is injected into an internal flow path.
  • the antibody recognizes and binds to the specimen as an antigen.
  • a characteristic analysis of an antibody for example, such a binding characteristic is evaluated.
  • a surface plasmon resonance method is used. That is, electromagnetic waves are applied to the gold plating 32 from the surface of the microchip on which the gold plating 32 has been applied (the back surface of the workpiece 30 to which the gold plating has been applied). Then, the surface plasmon resonance is generated by the evanescent wave (near field) generated when the electromagnetic wave is totally reflected and the surface plasmon, and the resonance condition (the incident angle of the electromagnetic wave) is observed. Evaluate binding properties.
  • a second embodiment of the optical processing method of the present invention will be described. Specifically, the present invention will be described by taking as an example a work bonding process in which a hydrophobic resin pattern for cell fixation is formed.
  • a hydrophobic resin pattern 30a for cell fixation is formed on a microchip substrate (first work 30).
  • the first work 30 employs a hydrophobic resin such as polystyrene, and a hydrophilic polymer material made of a monomer such as acrylamide is applied to the hydrophobic resin to form the hydrophilic resin layer 30b.
  • the hydrophilic polymer material is patterned to expose a part of the hydrophobic resin, thereby forming the hydrophobic resin pattern 30a.
  • This forming method is disclosed in, for example, Patent Document 2.
  • cells 31b are fixed to the hydrophobic resin pattern 30a by a method such as dropping.
  • the first workpiece 30 on which the test body 31 (cell 31b) is placed is prepared by the process as described above.
  • the mask 20 of the present invention is placed on the first work 30.
  • FIG. 6C the cells 31 b fixed to the first workpiece 30 are enclosed in a closed space created by the mask 20 and the first workpiece 30.
  • the light irradiation unit 10 is moved onto the mask 20 as shown in FIG. 4C, and the lamp of the light irradiation unit 10 is turned on as shown in FIG. 6D.
  • vacuum ultraviolet light having a wavelength of 172 nm is irradiated to the first workpiece 30 through the mask 20.
  • the irradiance in the light irradiation region (region other than the closed space) on the surface of the first work 30 is set to a predetermined value (a value sufficient to activate the light irradiation region). In this way, the power supplied to the lamp is controlled. After a predetermined irradiation time has elapsed, the lamp lighting device 12 turns off the lamp.
  • the predetermined irradiation time described above is the time from when the lamp is turned on and the light irradiation region on the surface of the first workpiece 30 is irradiated with vacuum ultraviolet light until the light irradiation region is activated. .
  • the cell body is fixed to the first work 30 by dripping in the case of bonding the first work 30 for cell examination, when the first work 30 is washed before cell fixation, It is not necessary to clean the first work 30 by irradiating the first work 30 with vacuum ultraviolet light.
  • the light irradiation unit 10 irradiates the second workpiece 50 with vacuum ultraviolet light to activate (surface reform) the surface of the second workpiece.
  • the mask 20 is removed from the first workpiece 30.
  • work 50 is laminated
  • the reagent is injected into the groove 51 (flow path) inside the microchip thus produced.
  • the reagent is, for example, a fluorescent stain. Then, the state of the stained cell is analyzed by a technique such as fluorescence analysis.
  • a xenon excimer lamp that emits vacuum ultraviolet light is used as a light source.
  • other lamps such as a low-pressure mercury lamp may be used as a lamp that emits vacuum ultraviolet light.
  • a lamp that emits ultraviolet light such as a high-pressure mercury lamp or a metal halide lamp can also be used.
  • the said Example demonstrated the Example which forms a recessed part in a mask, a recessed part can also be formed in the board
  • the mask has a flat plate shape, and the area on which the inspection object is placed can be set as a closed space by covering the mask with a work having a recess.
  • FIG. 7 shows an embodiment in which a concave space is provided on the microchip substrate (work) side on which the inspection object is placed as described above, and a closed space is formed by combining with a mask.
  • FIG. 5A shows a state before the mask and the workpiece are combined
  • FIG. 5B shows a state where both are combined.
  • a recess 301 is formed in the workpiece 300, a gold plating 32 is applied to the bottom surface of the recess 301, and an antibody 31a is placed thereon.
  • the mask 200 has a flat plate shape, and the light shielding means 20 c is provided so as to cover the entire area of the recess 301.
  • the light shielding member 20c can be provided on both the mask 200 and the workpiece 300, it is usually accompanied by manufacturing difficulties to provide the light shielding means on the workpiece 300. Therefore, as shown in FIG. 7, the mask 200 can be provided with a light shielding means 20 c larger than the closed space formed by the recesses 301 so that obliquely incident light does not reach the closed space.
  • the workpiece 300 is preferably made of a material that absorbs vacuum ultraviolet light, such as borosilicate glass, instead of a material that transmits vacuum ultraviolet light, such as quartz glass.
  • the concave portion is U-shaped.
  • the shape and dimensions of the concave portion are not particularly limited.
  • the size of the closed space be the same as or slightly larger than the inspection object.
  • the light shielding film made of chromium is described as the light shielding means.
  • the present invention is not limited to this, and for example, black resin, molybdenum, tungsten, or the like can be applied.

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Abstract

Afin de permettre un bon reformage de la surface d'un substrat de puce sans modification de la qualité d'un objet à inspecter en exposant le substrat à un rayonnement ultraviolet, un substrat (pièce de travail) (30) sur lequel est monté un objet à inspecter (31) est maintenu sur une platine (40), un masque (20) est monté dessus, et un rayonnement ultraviolet est projeté à partir d'une unité d'éclairage (10) afin d'activer la surface du substrat. Une partie évidée est formée dans le masque (20), un dispositif de blocage de la lumière (20c) est placé sur la surface intérieure de celle-ci, un espace fermé est formé par la partie évidée et le substrat (30) et l'objet à inspecter (31) est placé dans l'espace fermé. De ce fait, le rayonnement ultraviolet n'atteint pas l'objet à inspecter (31) et l'objet à inspecter (31) n'est pas exposé à l'ozone et aux atomes d'oxygène produits lorsque le rayonnement ultraviolet illumine la pièce de travail (30). De ce fait, cela ne produit pas de défauts, tel qu'un changement de qualité, dans l'objet à inspecter (31).
PCT/JP2011/055474 2010-04-14 2011-03-09 Méthode de traitement de surface et dispositif pour substrat de microtas et masque pour traitement de surface d'un substrat de microtas WO2011129165A1 (fr)

Applications Claiming Priority (2)

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JP2010-093112 2010-04-14
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JP2008058132A (ja) * 2006-08-31 2008-03-13 Ushio Inc マイクロチップの製造方法
WO2008059848A1 (fr) * 2006-11-14 2008-05-22 Japan Science And Technology Agency Structure de micro/nanostructure, puce de bioinspection utilisant celle-ci et procédé de fabrication correspondant

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008058132A (ja) * 2006-08-31 2008-03-13 Ushio Inc マイクロチップの製造方法
WO2008059848A1 (fr) * 2006-11-14 2008-05-22 Japan Science And Technology Agency Structure de micro/nanostructure, puce de bioinspection utilisant celle-ci et procédé de fabrication correspondant

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