Classifications

• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
  • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
  • F16C33/02—Parts of sliding-contact bearings
  • F16C33/04—Brasses; Bushes; Linings
  • F16C33/06—Sliding surface mainly made of metal
  • F16C33/12—Structural composition; Use of special materials or surface treatments, e.g. for rust-proofing
  • F16C33/122—Multilayer structures of sleeves, washers or liners
  • F16C33/125—Details of bearing layers, i.e. the lining
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/01—Alloys based on copper with aluminium as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/02—Alloys based on copper with tin as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/04—Alloys based on copper with zinc as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/08—Alloys based on copper with lead as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
  • C22C—ALLOYS
  • C22C9/00—Alloys based on copper
  • C22C9/10—Alloys based on copper with silicon as the next major constituent
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
  • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
  • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D3/00—Electroplating: Baths therefor
  • C25D3/02—Electroplating: Baths therefor from solutions
  • C25D3/56—Electroplating: Baths therefor from solutions of alloys
  • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D7/00—Electroplating characterised by the article coated
  • C25D7/10—Bearings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
  • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
  • F16C33/02—Parts of sliding-contact bearings
  • F16C33/04—Brasses; Bushes; Linings
  • F16C33/06—Sliding surface mainly made of metal
  • F16C33/12—Structural composition; Use of special materials or surface treatments, e.g. for rust-proofing
  • F16C33/121—Use of special materials
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
  • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
  • F16C33/02—Parts of sliding-contact bearings
  • F16C33/04—Brasses; Bushes; Linings
  • F16C33/06—Sliding surface mainly made of metal
  • F16C33/12—Structural composition; Use of special materials or surface treatments, e.g. for rust-proofing
  • F16C33/122—Multilayer structures of sleeves, washers or liners
  • F16C33/124—Details of overlays
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
  • F16C2204/00—Metallic materials; Alloys
  • F16C2204/10—Alloys based on copper
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
  • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
  • F16C2204/00—Metallic materials; Alloys
  • F16C2204/10—Alloys based on copper
  • F16C2204/12—Alloys based on copper with tin as the next major constituent

Definitions

• the invention relates to a multi-layer sliding bearing having a front side facing the bearing element and a rear side facing the same, comprising a support layer, a sliding layer arranged on the front side and an antifretting layer arranged on the rear side, wherein the antifretting layer comprises a copper-base alloy with copper mixed crystal grains consists.
• the back coating of a sliding bearing with an anti-fretting layer is already known from the prior art.
• This coating is intended to prevent friction welding or fretting corrosion and thus the "seizure" of the sliding bearing in the bearing housing due to unwanted relative movements of the components relative to one another
• Hard-faced components are more prone to erosion by fretting corrosion than soft materials that tend to seize, in which case the relative movement is prevented, but damage is also possible the technology already very different
• a corrosion protection layer made of a Sn alloy is known.
• Ni, Cr or Co alloys for antifretting layers are known from GB 2315301 AI.
• a tin bronze is used as antifretting layer.
• a Cu-Sn alloy deposited galvanically on steel as an antifretting layer with a tin content of between 10% and 15% is known from GB 556,248 A and GB 554,355 A, respectively.
• the object of the invention to provide an improved multi-layer sliding bearing, in particular an improved antifretting layer based on copper.
• the copper-based alloy of the antifretting layer contains an alloying element from the group consisting of aluminum, zinc, indium, silicon, germanium, antimony or an alloying element from the group consisting of aluminum, zinc , Indium, silicon, germanium, tin, antimony and at least one further element from this group and / or a second group comprising or consisting of nickel, cobalt, iron, manganese, bismuth, lead, silver, phosphorus and unavoidable impurities derived from the preparation contains, wherein the sum of these alloying elements is at least 1 wt .-% and at most 30 wt .-%.
• the Applicant has examined copper base alloys in addition to the above-mentioned silver alloy layers and surprisingly found that the abovementioned copper-base alloys significantly better wear properties and / or a much higher fatigue strength, but in any case an improved protection against damage Fretting than others, so that the stock so equipped bearings are particularly suitable for highly stressed bearings.
• the strength of the antifretting layer is improved by silicon.
• Zinc, nickel and cobalt improve the corrosion resistance of the antifretting layer. Zinc also improves the cold workability of the antifretting layer.
• a lubricious soft phase may be present in the matrix, in particular by lead, bismuth or at least a solid lubricant such as MoS 2 , graphite, WS 2 etc is formed.
• Germanium, indium, tin, bismuth, lead and antimony enhance the conformability and / or corrosion resistance of the antifretting layer to the sleeve bearing housing.
• Coating material and vice versa and thus reduces a material transfer, the corrosion resistance and mechanical resistance to wear and fatigue by forming a substitution mixed crystal improves and that facilitates the formation of thin adherent, the surfaces of mutually separating, oxide layers and / or reaction layers with oil additives by the alloying partners becomes.
• the properties of the coating can be adjusted specifically or tailored to the particular application. It has been observed that, under some content, the effect is too low, above a certain level, and especially above the sum of 30% by weight, large amounts of hard, brittle intermetallic phases are formed which have an adverse effect on the antifretting layer.
• a Cu-Sn or Cu-Ge alloy by the addition of 1 wt .-% to 25 wt .-% Zn or 1 wt .-% to 20 wt .-% indium significantly less sensitive to corrosive attack, especially sulfur-containing, oil additives.
• a Cu-Al alloy is significantly more resistant to wear by the addition of 0.2 wt .-% to 15 wt .-% antimony, since a part of the alloying elements is precipitated as finely dispersed AlSb hard phase.
• the mechanical strength of the coating and its corrosion resistance can be greatly increased.
• the deformability is improved by nickel.
• these elements increase the tendency to weld with the housing material. This effect was observed especially at levels above 5% by weight, in particular above 10% by weight.
• Me stands for a metal from the above-mentioned group manganese, iron, nickel, cobalt.
• Me stands for a metal from the above-mentioned group manganese, iron, nickel, cobalt.
• Lead, bismuth and solid lubricants are particularly soft materials that could potentially weaken the load bearing capacity of the coating, therefore their content must be limited to the top.
• Silver is heavily attacked by many, especially sulfur-containing oil additives. This undesirable effect is particularly pronounced at levels above 20% by weight.
• the tin content is between 5% by weight and 25% by weight, preferably between 8% by weight and 19% by weight, in particular between 10% by weight and 16% by weight, is.
• the proportion of aluminum in the copper-based alloy is between 2 wt .-% and 12 wt .-%, preferably between 4 wt .-% and 8 wt .-%.
• the proportion of silicon in the copper-based alloy is between 2 wt .-% and 10 wt .-%, preferably between 3 wt .-% and 5 wt .-%.
• the proportion of germanium in the copper-based alloy is between 3 wt .-% and 15 wt .-%, preferably between 4 wt .-% and 10 wt .-%.
• the proportion of indium in the copper-base alloy is between 0.2% by weight and 20% by weight, preferably between 1% by weight and 5% by weight, in particular between 2% by weight and 4% by weight ,
• the proportion of zinc in the copper-base alloy is between 0.5% by weight and 25% by weight, preferably between 1% by weight and 5% by weight. Above 15% by weight, the antifretting layer becomes too "brittle.” Below 0.5% by weight, no substantial improvement in the properties of the copper alloy could be observed.
• the proportion of manganese in the copper-based alloy is between 0.2 wt .-% and 5 wt .-%, preferably between 0.2 wt .-% and 2 wt .-%, in particular between 0.3 wt .-% and 1% by weight.
• the proportion of iron in the copper-based alloy is between 0.2 wt .-% and 5% by weight, preferably between 0.2 wt .-% and 2 wt .-%, in particular between 0.3 wt .-% and 1% by weight.
• the proportion of nickel in the copper-base alloy is between 0.2% by weight and 8% by weight, preferably between 0.5% by weight and 5% by weight, in particular between 1% by weight and 3
• the proportion of cobalt in the copper-based alloy is between 0.2 wt .-% and 8 wt%, preferably between 0.5 wt .-% and 5 wt .-%, in particular between 1 wt .-% and 3 wt .-%.
• the sum of manganese, iron, nickel and cobalt is not more than 10 wt .-%, preferably at most 6 wt .-%.
• the proportion of bismuth in the copper-base alloy is between 1% by weight and 25% by weight, preferably between 2% by weight and 15% by weight, in particular between 5% by weight and 10% by weight.
• the proportion of lead in the copper-based alloy is between 1 wt .-% and 25 wt .-%, preferably between 2 wt .-% and 15 wt .-%, in particular between 5 wt .-% and 10
• the proportion of silver in the copper-based alloy is between 1 wt .-% and 20 wt%, preferably between 2 wt .-% and 10 wt .-%.
• the proportion of antimony in the copper-based alloy is between 0.2 wt .-% and 15 wt .-%, preferably between 0.2 wt .-% and 10 wt .-%, in particular between 1 wt .-% and 5 wt .-%.
• the proportion of phosphorus is between 0.01 wt .-% and 3 wt .-, preferably between 0.05 wt .-% and 0.3 wt .-% or at a sum alloying content of Mn, Fe, Ni and Co of more than 0.6% by weight, preferably between 2% and 50%, more preferably between 10% and 30%, this value of 0.05% by weight and 0.3% by weight.
• the proportion of rare earths, chromium, zirconium, titanium and beryllium is in total between 0.001 wt .-% and 0.5 wt .-%, preferably between 0.01 wt .-% and 0.2 wt .-%.
• These elements may be alloyed with at least two main alloying elements for grain refining or hardening.
• the proportion of selenium is at most 0.1 wt .-%, preferably between 0.0001 wt .-% and 0.01 wt .-%.
• Selenium acts as a brightener in cyanide copper electrolytes, and micro-scattering and micro-leveling can be improved. Higher selenium content, however, embrittle the layer.
• Sulfur or tellurium can be used instead of selenium.
• the Antifretting Mrs contains a content of one or more of the elements silicon, germanium, indium, zinc, nickel, cobalt, bismuth, lead and antimony, wherein the sum of between 0.2 wt .-% and 20 wt. - is. It is thus possible to further adapt the antifretting layer to highly stressed bearings.
• the antifretting layer has a layer thickness between 2 ⁇ and 100 ⁇ , preferably between 3 ⁇ and 30 ⁇ , in particular between see 4 ⁇ and 15 ⁇ .
• a layer thickness between 2 ⁇ and 100 ⁇ , preferably between 3 ⁇ and 30 ⁇ , in particular between see 4 ⁇ and 15 ⁇ .
• the antifretting layer preferably has a Vickers microhardness at a test load of 3 Pond between HV 200 and HV 500, preferably between HV 230 and HV 400, in particular between HV 250 and HV 350, as a result of which the abrasion due to micro movements of the Slide bearing can be reduced in the housing and thus the fretting corrosion of Antifretting Mrs can be further reduced.
• plastic deformability is usually so low that forces acting locally lead to crack formation and breaks in the layer. Under 200 HV, the wear resistance is not achieved to the desired extent.
• the copper mixed crystal grains in the antifretting layer preferably have a particle size of greater than 5 nm, preferably greater than 10 nm, in particular greater than 50 nm.
• the crystalline character of the copper-base alloy is more pronounced, as a result of which the properties dependent on the above-described orientation are also more strongly expressed.
• the antifretting layer is preferably essentially free of intermetallic phases and appears in the XRD measurement as a mixed crystal with copper crystal lattice, according to a preferred embodiment variant of copper mixed crystals with a lattice constant between 0.3630 nm and 0.3750 nm consists.
• the formation of the preferred alignment of the copper mixed crystal grains in the layer of the copper-base alloy is supported or at least not impeded, so that the antifretting layer has a more homogeneous property profile.
• the antifretting layer has a layer thickness of at least 50%, in particular at least 150%, and at most 1000%, preferably at most 300%, of the roughness Rz of the support layer or of an interlayer optionally arranged between the support layer and the antifretting layer having. It is thus achieved a "leveling effect" of lying under the antifretting layer, at the same time by the existing roughness better adhesion between this
• the antifretting layer has a coating that is softer than the antifretting layer.
• this consists Coating consists of a material which is selected from a group comprising tin, lead, bismuth, polymer-based low-friction coatings.
• Fig. 1 is a multi-layer plain bearing in the form of a plain bearing half shell in
• Fig. 1 shows a multi-layer sliding bearing 1 in the form of a plain bearing half shell. Shown is a three-layer variant of the multi-layer plain bearing 1, consisting of a support layer 2, a sliding layer 3, on a front side 4 of the multi-layer sliding bearing 2, which is zuwendbar a component to be supported, and an Antifretting für 5, on a back 6 of the multi-layer plain bearing 1 and is arranged on the support layer 2.
• a bearing metal layer 7 between the sliding layer 4 and the support layer 2 may be arranged, as indicated by dashed lines in Fig. 1.
• multilayer plain bearings 1 As used for example in internal combustion engines, is known from the prior art, so that further explanations are unnecessary. It should, however, be mentioned that further layers can be arranged, that is, for example, between the sliding layer 4 and the bearing metal layer 3 and / or between antifretting layer 5 and the supporting layer 2, an adhesion promoter layer and / or a diffusion barrier layer, likewise between the bearing metal layer 3 and the support layer 2, an adhesive layer can be arranged.
• the multi-layer sliding bearing 1 can also be designed differently, for example as a bearing bush, as indicated by dashed lines in Fig. 1. Likewise, embodiments such as thrust rings, axially running sliding shoes, or the like are possible.
• the bearing metal layer 3 be dispensed with so that the sliding layer 4 can be applied to the support layer 2 either directly or with the interposition of an adhesion promoter and / or a diffusion barrier layer.
• the support metal layer 2 is preferably made of steel, but may also consist of a material that gives the multi-layer sliding bearing 1 the required structural strength. Such materials are known from the prior art.
• the bearing metal layer 3 or the sliding layer 3 and the intermediate layers the alloys or materials known from the relevant prior art can be used, and reference is made in this regard.
• the antifretting layer 5 consists of a copper-based alloy which contains, in addition to Cu, an alloying element from the group consisting of aluminum, zinc, indium, silicon, germanium, antimony or an alloying element from the group comprising or consisting of aluminum, zinc, indium, silicon , Germanium, tin, antimony and at least one further element from this group and / or a second group comprising or consisting of nickel, cobalt, iron, manganese, bismuth, lead, silver, phosphorus and unavoidable impurities derived from the manufacture, wherein the Sum proportions of these alloying elements at least 1 wt .-% and at most 30 wt .-% is, and wherein in the copper alloy of copper and the elements formed copper solid solution grains are present.
• an alloying element from the group consisting of aluminum, zinc, indium, silicon, germanium, antimony or an alloying element from the group comprising or consisting of aluminum, zinc, indium, silicon , Germanium, tin, antimony
• the proportion of aluminum in the copper-base alloy may be between 2% by weight and 12% by weight, preferably between 4% by weight and 8% by weight.
• the tin content may be between 5 wt% and 25 wt%, preferably between 8 wt% and 19 wt%, in particular between 10 wt% and 16 wt%.
• the zinc content may be between 0.5% by weight and 25% by weight, preferably between 1% by weight and 5% by weight.
• the proportion of manganese can be between 0.2% and 5% by weight, preferably between 0.2% by weight and 2% by weight, in particular between 0.3 and 1% by weight.
• the proportion of iron can be between 0.2% by weight and 5% by weight, preferably between 0.2% by weight and 2% by weight, in particular between 0.3% by weight and 1% by weight. %.
• the content of silicon may be between 2% by weight and 10% by weight, preferably between 3% by weight and 5% by weight.
• the content of germanium may be between 3% by weight and 15% by weight, preferably between 4% by weight and 10% by weight.
• the content of indium may be between 0.2 wt .-% and 20 wt .-%, preferably between 1 wt .-% and 5 wt .-%, in particular between 2 wt .-% and 4 wt .-%, amount.
• the content of nickel may be between 0.2% and 8% by weight, preferably between 0.5% by weight and 5% by weight, in particular between 1% by weight and 3% by weight ,
• the content of cobalt may be between 0.2% by weight and 8% by weight, preferably between 0.5% by weight and 5% by weight, in particular between 1% by weight and 3% by weight, be.
• the content of bismuth can be between 1% by weight and 25% by weight, preferably between 2% by weight and 15% by weight, in particular between 5% by weight and 10% by weight.
• the content of lead may be between 1 wt .-% and 25 wt .-%, preferably between 2 wt .-% and 15 wt .-%, in particular between 5 wt .-% and 10 wt .-%, amount.
• the proportion of silver can be between 1% by weight and 20% by weight, preferably between 2% by weight and 10% by weight.
• the content of antimony may be between 0.2% by weight and 15% by weight, preferably between 0.2% by weight and 10% by weight, in particular between 1% by weight and 5% by weight, be.
• the proportion of phosphorus may be between 0.01% by weight and 3% by weight, preferably between 0.05% by weight and 0.3% by weight or with a sum alloying content of Fe, Ni and Co of above 0.2% by weight, preferably between 10% and 200%, more preferably between 50% and 150%, this value.
• the proportion of rare earths, chromium, zirconium, titanium and beryllium can see in total between 0.001% by weight and 0.5% by weight, preferably between 0.01% by weight and 0.2% by weight, be.
• the proportion of selenium may be at most 0.1% by weight, in particular between 0.0001% by weight and 0.01% by weight.
• Sulfur or tellurium can be used instead of selenium.
• the content of one or more of the elements silicon, germanium, indium, zinc, nickel, cobalt, bismuth, lead and antimony in total between 0.2 wt .-% and 20 wt .-%.
• copper-base alloys are preferably deposited galvanically on the rear side 6 on the respective substrate, that is to say, for example, the support layer 2.
• the electrolyte for this purpose can be eyanid-containing or preferably eyelid-free.
• Preferred deposition parameters as well as preferred bathing compositions are given in the following examples.
• Example 1 Eyanid-containing electrolyte for depositing a Cu-Sn-Zn alloy
• Example 2 Cyanide-containing electrolyte for depositing a Cu-Ge-Zn alloy copper (I) 0.25 mol / 1 - 0.35 mol / 1
• Example 4 tetrafluoroboric acid-based cyanide-free electrolyte for depositing a Cu-Sn-Sb-Pb alloy
• Example 5 Cyanide-free pyrophosphate or phosphonate-based electrolyte for depositing a Cu-Sn-In alloy
• this contains in addition to the salts for the metals to be deposited and organic compounds.
• these are in particular polycarboxylic acid salts such as citrate or tartrate, in the case of the non-cyanide acidic electrolytes naphthol or naphthol derivatives or thio compounds. It is thereby achieved that the alignment according to the invention is obtained over a wider range of bath parameters.
• the following salts can be used for the deposition of the metals:
• Copper can be prepared as copper (H) tetrafluoroborate, copper (II) methanesulfonate, copper (II) sulfate, copper (II) pyrophosphate, copper (I) cyanide, copper salts of hydroxy and / or aminophosphonate. acids are used.
• concentration of copper in the electrolyte can be between 0.05 mol / l and 1 mol / l.
• Tin can be used as tin (H) tetrafluoroborate, tin (II) methanesulfonate, tin (II) sulfate,
• Tin (II) pyrophosphate, sodium stannate, potassium stannate, tin (II) salts of hydroxy and / or aminophosphonic acids are used.
• concentration of tin in the electrolyte can be up to 0.5 mol / 1.
• Zinc can be used as zinc (II) tetrafluoroborate, zinc (n) methanesulfonate, zinc (II) sulfate,
• Zinc (n) pyrophosphate, zinc oxide, zinc cyanide, zinc (II) salts of hydroxy and / or aminophosphonic acids are used.
• concentration of zinc in the electrolyte can be up to 0.5 mol / l.
• Silicon can be added to the electrolyte as a powder or, for example, in the form of silicon carbide in order to form dispersion layers therewith.
• Germanium can be used as germanium dioxide or sodium or potassium germanate. In general, the concentration of germanium in the electrolyte can be up to 0.5 mol / l. Indium can be used as indium oxide, indium cyanide, indium sulfate, indium fluoroborate, indium methane sulfonate. In general, the concentration of indium in the electrolyte can be up to 0.5 mol / l.
• Nickel can be used as nickel (II) tetrafluoroborate, nickel (II) methanesulfonate, nickel (II) sulfate, ammonium-nickel sulfate, nickel (H) chloride, nickel (II) pyrophosphate, nickel (II) oxide.
• concentration of nickel in the electrolyte can be up to 1 mol / 1.
• Manganese, cobalt and iron can be used in the same form and concentration as nickel.
• Bismuth can be used as bismuth trifluoride, bismuth (IH) methanesulfonate, bismuth (III) sulfate, bismuth (in) pyrophosphate, bismuth oxide, sodium or potassium bismuthate.
• concentration of bismuth in the electrolyte can be up to 0.5 mol / 1.
• Lead can be used as lead (II) tetrafluoroborate, lead (II) methanesulfonate, lead (II) pyrophosphate, lead acetate, lead (II) oxide, sodium or potassium plumbate.
• the concentration of lead in the electrolyte can be up to 0.3 mol / 1.
• Antimony can be used as antimony (UI) tetrafluoroborate, antimony trifluoride, antimony (III) oxide, potassium antimony tartrate.
• concentration of antimony in the electrolyte can be up to 0.2 mol / 1.
• Silver can be used as cyanide, alkali metal cyanide, silver methanesulfonate, silver nitrate.
• concentration of antimony in the electrolyte can be up to 0.5 mol / 1.
• Phosphorus can be used as phosphorous acid, alkali phosphite, alkali hypophosphite. Generally, the concentration can be up to 2 mol / L.
• Selenium can be used as selenium dioxide, alkali metal selenate or Alkaliselenit. In general, the concentration of selenium in the electrolyte can be between 0.05 mmol / l and 5 mmol / l.
• Possible stabilizers or base electrolytes, conducting salts or complexing agents are: alkali metal cyanides, alkali metal hydroxides, tetrafluoroboric acid, hydrofluoric acid, methanesulfonic acid, tartaric acid and their alkali metal salts and ammonium salts, citric acid and its alkali metal and ammonium salts, ammonium and alkali metal pyrophosphates, phosphonic acid and their alkali metals and ammonium salts Ammonium salts, 2,2-Ethylendithiodiethanol, hydantione and its derivatives, succinimide and its derivatives, phenolic and cresolsulfonic acids, in a total concentration between 0.1 mol / 1 and 2 mol 1.
• Possible oxidation inhibitors in cyanide-free electrolytes are: resorcinol, hydroquinone, catechol, pyrogallol, formaldehyde, methanol, in a total concentration of between 0.03 mol / l and 0.3 mol / l.
• Possible additives are: phenolphthalein, thio compounds and their derivatives, thiourea and its derivatives, alpha- or beta-naphthol and their ethoxylates, alpha- and beta- naphtholsulphonic acid and their ethoxylates, o-toluidine, hydroxyquinoline, ligninsulfonate, butynediol, all in one Total concentration between 0.0005 mol / 1 and 0.05 mol / 1, preferred 0.002 mol / l and 0.02 mol / l and gelatin, glue, nonionic and cationic surfactants, amino compounds, for example C8-C20-amidopropylamines and their derivatives, polyethyleneglycol and its functionalized derivatives, peptone, glycine, in a total concentration between 0 g / 1 - 50 g / 1.
• mixtures of the abovementioned constituents of the electrolytes that is to say e.g. at least two salts of one or the respective metal and / or at least two stabilizers and / or at least two oxidation inhibitors and / or at least two additives.
• cyanide-containing electrolytes may only be prepared from alkaline salts or premixes.
• the alloying elements can be added in the form of the abovementioned, soluble compounds or complexes to a corresponding electrolyte and be deposited therefrom. Likewise, alloy formation by diffusion of the elements into the layer or co-deposition of particles suspended in the electrolyte is possible.
• the copper-based alloy can be cast and a strip of it rolled onto the substrate. But it is also a direct casting on the substrate possible, whereby the additional manufacturing step of banding can be omitted. These methods are known in principle from the prior art, so reference should be made in this context.
• PVD methods such as sputtering, vapor deposition, CVD method, ion implantation method, flame and plasma spraying method, casting method, sintering method or plating method for producing the Antifretting Mrs 5 or for their modification, e.g. by ion implantation method, etc. possible.
• the deposition of the respective antifretting layer 5 can take place on an already preformed multilayer sliding bearing 1, that is, for example, on a plain bearing half shell.
• the antifretting layer 5 it is possible within the scope of the invention for the antifretting layer 5 to be coated on a flat substrate stripe. fen, for example, a steel strip is deposited, and the mechanical deformation of the finished multi-layer plain bearing 1, for example by pressing, etc., is carried out only in a subsequent manufacturing step.
• Antifretting layers 5 of the following compositions in Table 1 were prepared in this way.
• the information on the composition refers to wt .-%.
• the remainder to 100 wt .-% each forms copper.
• the tests were carried out with different stamping materials (eg steel cast iron, aluminum, titanium) and surface conditions (ground, shot-peened, ets.) And also with plates without coating and with different surface states. the results shown above were confirmed.
• the experimental parameters such as pressure, amplitude, temperature, lubricating oil were also varied. The results were correlated with results from engine tests and test results on parts of the field.
• this has a layer thickness between 2 ⁇ and 100 ⁇ , preferably between 3 ⁇ and 30 ⁇ , in particular between 4 ⁇ and 15 ⁇ , as has already been stated above.
• the anti-fretting layer 5 has a layer thickness of at least 50%, in particular at least 150%, and at most 1000%, preferably at most 300%, of the roughness Rz of the support layer or of an interlayer optionally arranged between the support layer and the antifretting layer on.
• the antifretting layer 5 preferably has a Vickers microhardness at a test load of 3 pounds between HV 200 and HV 500, preferably between HV 230 and HV 400, in particular between HV 250 and HV 350, for reasons mentioned above.
• the antifretting layer 5 may also, for the foregoing reasons, have a coating which is softer than the antifretting layer 5, the coating preferably consisting of a material selected from a group comprising tin, lead, bismuth, polymer-based antifriction coatings. In principle, all bonded coatings are usable, which are known in the field of plain bearings.
• an antifriction lacquer which, in a dry state, comprises 40% by weight to 45% by weight of MoS 2, 20% by weight to 25% by weight of graphite and 30% by weight to 40% by weight.
• % Polyamideimide, optionally with hard particles, such as oxides, nitrides or carbides, in the bonded coating in a proportion of not more than 20 wt .-% may be included, which replace a proportion of solid lubricants.

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