WO2011117775A1 - Dispositif d'éclairage doté d'une enveloppe - Google Patents

Dispositif d'éclairage doté d'une enveloppe Download PDF

Info

Publication number
WO2011117775A1
WO2011117775A1 PCT/IB2011/051075 IB2011051075W WO2011117775A1 WO 2011117775 A1 WO2011117775 A1 WO 2011117775A1 IB 2011051075 W IB2011051075 W IB 2011051075W WO 2011117775 A1 WO2011117775 A1 WO 2011117775A1
Authority
WO
WIPO (PCT)
Prior art keywords
illumination device
ring
carrier
led module
shaped element
Prior art date
Application number
PCT/IB2011/051075
Other languages
English (en)
Inventor
Ralph Kurt
Mark Eduard Johan Sipkes
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Publication of WO2011117775A1 publication Critical patent/WO2011117775A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/18—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array annular; polygonal other than square or rectangular, e.g. for spotlights or for generating an axially symmetrical light beam
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an illumination device comprising a carrier, a LED module with a substrate supporting a plurality of LEDs, and an enclosure covering the LED array, the enclosure including a ring-shaped element arranged surrounding the LED array and in contact with the carrier, the sides of the ring-shaped element facing the LEDs being reflective.
  • colored light sources eliminates the need for filtering, and thus increases efficiency and color consistency (replaced filter might introduce variation). Further, the emitted color can be changed by electronic control, and all accessible colors are always available without any hardware replacements. The market for these systems is quickly growing as LED performance improves.
  • the densely packed LED arrays are typically mounted on a carrier, such as a PCB, and enclosed by a suitabel enclosure.
  • the LED array and its critical components such as wire bonds need to be protected against damage (non-intentional use) while still maintaining or even improving the light output.
  • Document US 2009/0311811 discloses an example of such an enclosure, comprising a ring-shaped part surrounding the LED package, having a reflective inside, and a transmissive compound covering the LEDs inside the ring- shaped part.
  • the inner edge of the ring-shaped part is tapered towards the carrier.
  • an illumination device as disclosed in the introduction, wherein the ring-shaped element has a first proximal portion arranged closest to said carrier and defining an opening to surround the LED module, and a second, distal portion arranged outside the proximal portion with respect to the carrier and defining an exit aperture of the illumination device, and wherein the exit aperture is smaller than the opening in the proximal portion, so that the distal portion covers a portion of the opening in the proximal portion.
  • the inner edge of the second portion thus forms an overhang along portions of the ring-shaped element, and along these portions covers an area immediately inside the proximal portion.
  • parts of a relatively large LED module can be housed and be protected by the distal portion.
  • Such parts of the LED module will thus be effectively outside the optical exit aperture of the device.
  • sensitive components such as wirebonds or sensors (optical / thermal sensors) may be placed in the "shadow" of the distal portion.
  • the overhang may be formed all along the inside of the ring-shaped element, or be formed only along some portions.
  • the ring-shaped element can be formed as a single piece, or be formed as two separate parts joined together to form an integral part.
  • the illumination device may further comprise a transmissive cover structure disposed within the ring-shaped element arranged to cover each LED while allowing light from each LED to be emitted from the illumination device.
  • a transmissive cover structure can be adapted to protect the LEDs from the environment, and may also be adapted to provide an optical function. In the latter case, the transmissive cover structure should be in optical contact with the LEDs.
  • a transmissive cover structure may be divided into a plurality of individual elements, each adapted to cover one or several of said plurality of LEDs.
  • the transmissive structure can be formed by a transmissive material filling a void inside said ring- shaped element.
  • the illumination device may further comprise a collimating/mixing element arranged to receive light from the LEDs, wherein the ring-shaped element is adapted to serve as a mechanical interface between the carrier and the collimating/mixing element.
  • a collimating/mixing element may be adapted to collimate light from the LEDs, and/or to provide color mixing of light from differently colored LEDs.
  • said collimating / mixing element is a tubular reflector with a reflective inner surface, the tubular reflector having an entrance aperture and an exit aperture being larger than the entrance aperture; wherein the LED module is arranged to emit light (preferably of different spectral content / different colors) into said tubular reflector at the entrance aperture thereof.
  • the exit aperture preferably has a cross section adapted to match the cross section of a collimating/mixing element mounted to the illumination device.
  • the exit aperture has a polygonal cross section, preferably a rectangular, a square, a pentagonal, hexagonal, heptagonal, or octagonal cross section.
  • the cross section of the exit aperture does not necessarily match the cross section of the opening defined by the first portion, closest to the carrier.
  • the first portion can define a circular opening
  • the second portion defines a polygonal opening.
  • the opening in the second portion may lie entirely within the opening in the first portion, or it may coincide with the opening in the first portion in certain points or along certain segments.
  • Figure 1 is a perspective exploded view of an illumination device according to a first embodiment of the present invention.
  • Figure 2 is a perspective, sectional view of the illumination device in figure 1.
  • Figure 3 is a perspective view of an illumination device according to a first embodiment of the present invention.
  • the illumination device in figure 1-2 comprises a carrier 1, on which a LED module 2 is mounted.
  • the LED module comprises a plurality of LEDs 3, here mounted in groups on rectangular sub-mounts 4.
  • the LED module further comprises driver and control circuitry 5, arranged in between the LED sub-mounts, and wiring to interconnect the circuitry and the LEDs.
  • the LED module may further include sensors, such as temperature and/or light sensors, connected to the control circuitry.
  • a plurality of submounts are mounted on a substrate, such as an IMS (insulated metal substrate) or a FR4 substrate.
  • the LED module may comprise between 5 and 250 LEDs, and typically between 70 and 150 LEDs.
  • the LED module 2 may include a high densely packed LED array characterized by a high EPI density, preferably between 5 and 70%, more preferably between 15 and 50%.
  • Each array may further comprise several, for example 2-8, sets of light sources that emit different colors, for example one set of red LEDs, one set of blue LEDs, and one set of green LEDs.
  • the light source arrays include LEDs with white (W), red (R), green (G), blue (B) or amber (A), cyan (C), deep red (dR) and/or deep blue (dB) emission spectrum. By combination thereof, any desired light spectrum is obtainable that falls within the color space made up by the color coordinates of the
  • WRGBAdRdB starting LEDs are also possible, such as neutral white and warm white (NW + WW), combinations with cold white (e.g. CW + WW), (RGBA), (RGB AW), (RGBW), (RGB AC), (RGBAdR), (RGBACdR) and (RGBACdRW).
  • the illumination device further comprises a ring-shaped element 6, mounted on the carrier 1 so as to surround the LED module 2.
  • the ring 6 has a first proximal portion 7, closest to the carrier 1, and a second distal portion 8 further away from the carrier.
  • the proximal portion 7 defines a first opening, here a circular opening, having a first effective inner diameter dl .
  • This opening is formed to surround the LED module, so that the entire substrate fits within the opening.
  • the distal portion 8 defines a second opening, here a heptagonal opening, having an effective inner diameter d2 which is smaller than the first effective diameter.
  • the distal portion 8 extends inside the edge of the first opening, at least along some sections of the inner edge of the first opening 7.
  • the distal portion forms an overhang that extends inside the inner edge of the first portion, so as to cover an area 9 immediately inside the first portion 7.
  • the second, heptagonal, opening is formed so that its seven corners coincide with the inner edge of the first, circular, opening.
  • the ring 6 can be mounted so that peripheral parts of the LED module 2 are located in the area 9, so as to be covered, and protected, by the second portion 8 of the ring 6.
  • the inner diameter d2 of the second portion 8 is selected such that all LEDs of the LED module are located inside the second portion 8 of the ring 6.
  • the second portion 8 defines an exit aperture 10 of the illumination device.
  • the ring 6 should have a thickness, in a direction normal to the carrier surface, sufficient to exceed the height of the components of the LED module. At the same time, a relatively flat ring 6 is desirable, in order to minimize shear forces on the ring. Depending on the type of LED module, a suitable thickness may be between 0.5 mm and 10 mm, preferably between 0.7 mm and 5 mm, and most preferably between 0.8 mm and 2 mm. Preferably, the ring is mechanically attached onto the carrier 1.
  • the inside 11 of the ring 6 is reflective, in order to enhance light emission from the illumination device.
  • the entire ring 6 is made of a reflective material, for example a material comprising Titanium oxide.
  • a suitable material could be a polymeric matrix, or a ceramic (e.g. A1203 or the like).
  • the ring 6 can be in thermal contact with a heat sink (not shown), so as to enhance thermal dissipation from the LEDs.
  • the heat sink may be mounted on the reverse side of the carrier 1.
  • the LEDs are further, in the illustrated case, covered by a transmissive cover structure, here in the form of individual semi- spherical lenses 12 arranged on each LED 3.
  • the transmissive cover structure may also comprise one or several more complex optical structure(s) with lens shape on the surface such as a microlens array.
  • the transmissive cover structure may comprise one or several of a transmissive ceramic material, a substantially transmissive glass or polymeric foil material, and a transmissive silicon layer.
  • the transmissive cover structure is preferably in direct contact with the LEDs, for improved optical light outcoupling.
  • the entire space 13 within the ring 6 is filled with an encapsulant, such as a transparent silicon.
  • an encapsulant such as a transparent silicon.
  • the illumination device further comprises a mixing element in the form of a trumpet shaped parabolic reflector 20 to mix the colors.
  • a mixing element in the form of a trumpet shaped parabolic reflector 20 to mix the colors.
  • the ring 61 serves as a mechanical and optical interface between the LED module on the carrier and the mixing element.
  • the ring 61 has a broader base 62 that is in contact with the carrier 1, so as to provide a more secure attachment.
  • the ring 61 comprises a reflective sleeve 63 facing the LEDs, which sleeve serves as an interface to the trumpet shaped reflector.
  • the ring 61 is attached to the carrier 1 by means of fastening elements 64, which also serve to attach the reflector 20 to the ring 61.
  • This provides an integrated unit, comprising the carrier 1, the ring 61 and the reflector 20.
  • the LED module 2 is located inside the ring 61, with parts of its peripheral edges covered by the overhang of the ring 61.
  • the present invention by no means is limited to the preferred embodiments described above. On the contrary, many modifications and variations are possible within the scope of the appended claims.
  • the geometry of the ring 6 may be varied, and have different cross section, relative inner diameters, thickness, etc.
  • the LED module may take on a variety of different forms.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention a trait à un dispositif d'éclairage qui comprend un support (1), un module à diodes électroluminescentes (2) agencé sur le support, le module à diodes électroluminescentes comprenant une pluralité de diodes électroluminescentes (3), et un élément en forme d'anneau (6) entourant le module à diodes électroluminescentes (2) et en contact avec le support (1), les côtés de l'élément en forme d'anneau (6) qui font face aux diodes électroluminescentes (3) étant réfléchissants. L'élément en forme d'anneau (6) est pourvu d'une première partie proximale (7) agencée à proximité étroite du support et définissant une ouverture de manière à entourer le module à diodes électroluminescentes, et d'une seconde partie distale (8) agencée à l'extérieur de la partie proximale par rapport au support et définissant une ouverture de sortie du dispositif d'éclairage. L'ouverture de sortie est plus petite que l'ouverture de la partie proximale, de sorte que la partie distale recouvre une partie (9) de l'ouverture de la partie proximale. Le bord intérieur de la seconde partie forme ainsi un surplomb le long de parties de l'élément en forme d'anneau et recouvre le long de ces parties une zone immédiatement à l'intérieur de la partie proximale. Dans ces parties de zone protégée, un module à diodes électroluminescentes relativement grand peut être logé et protégé par la partie distale.
PCT/IB2011/051075 2010-03-22 2011-03-15 Dispositif d'éclairage doté d'une enveloppe WO2011117775A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP10157186 2010-03-22
EP10157186.7 2010-03-22

Publications (1)

Publication Number Publication Date
WO2011117775A1 true WO2011117775A1 (fr) 2011-09-29

Family

ID=44022009

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2011/051075 WO2011117775A1 (fr) 2010-03-22 2011-03-15 Dispositif d'éclairage doté d'une enveloppe

Country Status (1)

Country Link
WO (1) WO2011117775A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014173850A1 (fr) * 2013-04-25 2014-10-30 Koninklijke Philips N.V. Module de diodes électroluminescentes

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6200002B1 (en) 1999-03-26 2001-03-13 Philips Electronics North America Corp. Luminaire having a reflector for mixing light from a multi-color array of leds
US20050194601A1 (en) * 2001-04-17 2005-09-08 Ryoma Suenaga Light emitting device
EP1768193A2 (fr) * 2005-09-27 2007-03-28 Nichia Corporation Diode électroluminescente
US20080042151A1 (en) * 2006-07-10 2008-02-21 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package and method of producing the same
US20090103296A1 (en) * 2007-10-17 2009-04-23 Xicato, Inc. Illumination Device with Light Emitting Diodes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6200002B1 (en) 1999-03-26 2001-03-13 Philips Electronics North America Corp. Luminaire having a reflector for mixing light from a multi-color array of leds
US20050194601A1 (en) * 2001-04-17 2005-09-08 Ryoma Suenaga Light emitting device
EP1768193A2 (fr) * 2005-09-27 2007-03-28 Nichia Corporation Diode électroluminescente
US20080042151A1 (en) * 2006-07-10 2008-02-21 Samsung Electro-Mechanics Co., Ltd. High power light emitting diode package and method of producing the same
US20090311811A1 (en) 2006-07-10 2009-12-17 Samsung Electro-Mechanics Co., Ltd High power light emitting diode package and method of producing the same
US20090103296A1 (en) * 2007-10-17 2009-04-23 Xicato, Inc. Illumination Device with Light Emitting Diodes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014173850A1 (fr) * 2013-04-25 2014-10-30 Koninklijke Philips N.V. Module de diodes électroluminescentes
CN105143763A (zh) * 2013-04-25 2015-12-09 皇家飞利浦有限公司 发光二极管模块
US9791141B2 (en) 2013-04-25 2017-10-17 Philips Lighting Holding B.V. Light emitting diode module
CN105143763B (zh) * 2013-04-25 2019-05-14 飞利浦照明控股有限公司 发光二极管模块

Similar Documents

Publication Publication Date Title
JP5705612B2 (ja) 照明装置
US8585253B2 (en) System and method for color mixing lens array
JP5813362B2 (ja) 発光素子パッケージを利用した照明装置
JP5999391B2 (ja) 発光装置、照明用光源及び照明装置
US20130188354A1 (en) Phosphor coating films and lighting apparatuses using the same
JP2002261333A (ja) 発光装置
KR20140045347A (ko) Ｌｅｄ 기반 조명 모듈용 색 변환 캐비티
JP2013219340A (ja) 発光装置、並びにそれを用いた照明装置及び照明器具
JP2014146661A (ja) 発光モジュール、照明装置および照明器具
EP2672513B1 (fr) Structure de boîtier multipuce pour générer une source de mélange lumineux symétrique et uniforme
US9746145B2 (en) Light-emitting device with non-successive placement of light-emitting elements of one color, illumination light source having the same, and illumination device having the same
JP6233750B2 (ja) 発光装置およびその製造方法、照明用光源、並びに照明装置
JP6179854B2 (ja) 照明器具
JP2006278309A (ja) 照明装置
JP2016167518A (ja) 発光装置、及び、照明装置
JP6277510B2 (ja) 発光モジュール、照明装置および照明器具
US20120319143A1 (en) Light emitting device and illumination apparatus including same
JP2015082550A (ja) 発光モジュール、照明装置および照明器具
JP5459744B2 (ja) 照明装置
JP6583671B2 (ja) 照明装置
WO2011117775A1 (fr) Dispositif d'éclairage doté d'une enveloppe
JP2006245080A (ja) 照明装置
JP2018121032A (ja) 発光装置及び照明装置
JP2020141027A (ja) 発光装置、及び、照明装置
JP5884022B2 (ja) Ｌｅｄ照明器具

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11713087

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11713087

Country of ref document: EP

Kind code of ref document: A1