WO2011114882A1 - Panneau électroluminescent organique et procédé de production de panneau électroluminescent organique - Google Patents

Panneau électroluminescent organique et procédé de production de panneau électroluminescent organique Download PDF

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WO2011114882A1
WO2011114882A1 PCT/JP2011/054726 JP2011054726W WO2011114882A1 WO 2011114882 A1 WO2011114882 A1 WO 2011114882A1 JP 2011054726 W JP2011054726 W JP 2011054726W WO 2011114882 A1 WO2011114882 A1 WO 2011114882A1
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organic
substrate
sealing
panel
layer
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PCT/JP2011/054726
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English (en)
Japanese (ja)
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正数 遠西
真人 奥山
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コニカミノルタホールディングス株式会社
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Priority to JP2012505598A priority Critical patent/JPWO2011114882A1/ja
Publication of WO2011114882A1 publication Critical patent/WO2011114882A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements

Definitions

  • the present invention relates to an organic electroluminescence panel and a manufacturing method thereof, and more particularly to an organic electroluminescence panel to which a solid sealing method using a sheet-like sealing material is applied and a manufacturing method thereof.
  • organic electroluminescence devices using organic substances are promising for use as solid light-emitting, inexpensive large-area full-color display devices and writing light source arrays, and are actively researched. Development is in progress.
  • the organic EL device includes a first electrode (anode or cathode) formed on a substrate, an organic compound layer (single layer portion or multilayer portion) containing an organic light emitting material laminated thereon, that is, a light emitting layer, It is a thin film type element having a second electrode (cathode or anode) laminated on the light emitting layer.
  • the organic EL element is a thin film type element, when an organic EL element in which one or a plurality of organic EL elements are formed on a substrate is used as a surface light source such as a backlight, a surface light source. It is possible to easily make the device provided with Further, when an organic electroluminescence display device is configured using an organic electroluminescence panel (hereinafter also referred to as an organic EL panel) in which a predetermined number of organic EL elements as pixels are formed on a substrate, the visibility is improved. There is an advantage that cannot be obtained by a liquid crystal display device, such as being high and having no viewing angle dependency.
  • organic substances such as organic light emitting materials used in organic EL elements are easily affected by moisture, oxygen, etc., and their performance deteriorates when stored in such an environment. In the atmosphere, the characteristics deteriorate rapidly, and a spot-like non-light emitting portion (hereinafter referred to as a dark spot) is generated on the organic EL element.
  • an organic EL element is generally used by providing a sealing layer as the uppermost layer.
  • a metal container-type sealing material is used as a method for preventing the occurrence of these dark spots.
  • a method of covering and sealing an organic EL element through an adhesive layer in a dry nitrogen atmosphere is described.
  • the effect depends mainly on the thickness of the container-type sealing material, and is required in the market. It is not suitable for manufacturing thin organic EL elements. For this reason, the manufacturing method of the thin organic EL element which has the same dark spot prevention effect as a container type sealing material has been examined until now.
  • Patent Document 1 proposes an organic electroluminescence panel using a sealing film that can form a thin organic EL element and has a barrier property.
  • a sealing film instead of a sealing can, a flexible film having a barrier property (hereinafter also referred to as a sealing film) is used as a sealing member, and the organic EL element substrate and an adhesive are bonded together in a vacuum.
  • Patent Document 2 discloses a method for removing organic substances and modifying the surface by performing a dry cleaning process in addition to the dehydrating process of the sealing member. Are listed.
  • Patent Documents 1 and 2 are relatively easy to mass-produce and can produce a thin organic EL element having a high sealing effect. Initial damage to the light emitting element due to (surface adhesion on the organic electroluminescence element) occurs, and the countermeasure is insufficient.
  • an object of the present invention is to provide an organic electroluminescence panel manufacturing method and an organic electroluminescence panel which have excellent initial dark spot resistance and element lifetime of an organic EL element and have a high rectification ratio.
  • the sealing material is a thermosetting resin or an ultraviolet curable resin
  • the organic electroluminescent panel is formed by bonding a sealing substrate on the substrate via the sealing material.
  • the substrate is formed by bonding a sealing substrate on the substrate on which the organic electroluminescence element is formed via the sealing material and bonding the surface to each other, and then performing a process of cooling to 5 ° C. or less within 12 hours.
  • the method for producing an organic electroluminescence panel according to any one of 1 to 4 above.
  • an organic electroluminescence panel having an excellent initial dark spot resistance and device lifetime of an organic EL device and having a high rectification ratio is obtained by using a close-contact type sealing method in which a sealing material is fixed through an adhesive.
  • a method and an organic electroluminescence panel could be provided.
  • the inventor of the present invention on a substrate on which an organic electroluminescence element having at least a first electrode, an organic compound layer including a light emitting layer, and a second electrode is formed via a sealing material.
  • the sealing material is a thermosetting resin or an ultraviolet curable resin
  • the organic electroluminescence panel is After the sealing substrate is bonded onto the substrate via a sealing material and bonded to the surface, the sealing material is subjected to a step of cooling to 5 ° C. or lower, and then the sealing material is cured by applying heat or ultraviolet rays.
  • the organic EL panel manufacturing method is characterized by excellent initial dark spot resistance and device life of organic EL devices, and has a high rectification ratio.
  • Method of producing an organic electroluminescent panel capable of manufacturing an organic electroluminescent panel found that it is possible to realize a completed the invention.
  • a substrate (hereinafter also referred to as a support substrate, a substrate, a base material, or a support) that can be used in the organic EL device according to the present invention, there is no particular limitation on the type, such as glass, plastic, metal, ceramic, etc. It may be transparent or opaque. In the case where light is extracted from the substrate side, the substrate is preferably transparent, and examples of the transparent substrate preferably used include glass, quartz, and a transparent resin film.
  • a particularly preferable substrate is a resin film that can impart flexibility (also referred to as flexibility) to the organic EL element.
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, Cellulose acetate butyrate, cellulose acetate propionate (CAP), cellulose acetate phthalate (TAC), cellulose esters such as cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, Polycarbonate, norbornene resin, polymethylpentene, polyetherketone, polyimide, polyethersulfone ( ES), polyphenylene sulfide, polysulfones, polyether imide, polyether ketone imide, polyamide, fluororesin, nylon, polymethyl methacrylate, acrylic or polyarylates, Arton (trade name, manufactured by JSR
  • an inorganic film, an organic film, or a hybrid film of both may be formed, and the water vapor transmission rate (temperature: measured by a method according to JIS K 7129-1992). 25 ⁇ 0.5 ° C., relative humidity: 90 ⁇ 2% RH) is preferably a barrier film of 1 ⁇ 10 ⁇ 3 g / (m 2 ⁇ 24 h) or less, and further according to JIS K 7126-1987.
  • Oxygen permeability measured by a compliant method is 1 ⁇ 10 ⁇ 3 ml / m 2 ⁇ 24 h ⁇ atm or less, water vapor permeability (temperature: 25 ⁇ 0.5 ° C., relative humidity: 90 ⁇ 2% RH)
  • a high barrier film of 1 ⁇ 10 ⁇ 3 g / (m 2 ⁇ 24 h) or less is preferable.
  • the constituent material of the barrier film formed on the surface of the resin film may be any material that has a function of preventing the ingress of oxygen and moisture that induces deterioration of the organic EL panel.
  • An inorganic film such as silicon oxide, silicon dioxide, or silicon nitride can be used.
  • the method for forming the barrier film is not particularly limited.
  • the vacuum deposition method, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma weight A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method and the like can be used, but a formation method using an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable. preferable.
  • an organic compound layer in this invention has the structure by which the functional layer which consists of various organic compounds, such as a positive hole injection / transport layer / light emitting layer / electron injection / transport layer, was laminated
  • the simplest configuration is a structure consisting only of a light emitting layer.
  • Examples of organic compound materials used for the hole injection / transport layer include phthalocyanine derivatives, heterocyclic azoles, aromatic tertiary amines, polyvinyl carbazole, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT: PSS), and the like.
  • a polymer material such as a representative conductive polymer is used.
  • Examples of the organic compound material used for the light emitting layer include carbazole-based light emitting materials such as 4,4′-dicarbazolylbiphenyl and 1,3-dicarbazolylbenzene, (di) azacarbazoles, 1,3 , 5-tripyrenylbenzene and the like, low molecular light emitting materials typified by pyrene light emitting materials, polyphenylene vinylenes, polyfluorenes, polyvinyl carbazoles and the like polymer light emitting materials. Of these, a low molecular weight light emitting material having a molecular weight of 10,000 or less is preferably used as the light emitting material.
  • the light-emitting material applied to the light-emitting layer may preferably contain about 0.1 to 20% by mass of a dopant.
  • the dopant include known fluorescent dyes such as perylene derivatives and pyrene derivatives, and phosphorescence.
  • Orthometalation represented by dyes such as tris (2-phenylpyridine) iridium, bis (2-phenylpyridine) (acetylacetonato) iridium, bis (2,4-difluorophenylpyridine) (picolinato) iridium, etc.
  • There are complex compounds such as iridium complexes.
  • Electrode injection / transport layer As a constituent material of the electron injecting / transporting layer, there are metal complex compounds such as 8-hydroxyquinolinate lithium and bis (8-hydroxyquinolinato) zinc, and nitrogen-containing five-membered ring derivatives listed below. That is, oxazole, thiazole, oxadiazole, thiadiazole or triazole derivatives are preferred.
  • each functional layer As the organic compound material used for these light emitting layers and each functional layer, a material having a polymerization reactive group such as a vinyl group in the molecule is used, and a cross-linked / polymerized film is formed after film formation to form each functional layer. May be.
  • an injection layer may be formed between the electrode and the organic layer in order to reduce the drive voltage and improve the light emission luminance as necessary.
  • the injection layer includes a hole injection layer (anode buffer layer) and an electron injection layer (cathode buffer layer).
  • a phthalocyanine buffer layer typified by copper phthalocyanine
  • an oxide buffer layer typified by vanadium oxide
  • an amorphous carbon buffer layer a conductive polymer such as polyaniline (emeraldine) or polythiophene
  • Examples of the cathode buffer layer include a metal buffer layer typified by strontium, aluminum, calcium, and magnesium, an alkali metal compound buffer layer typified by lithium fluoride, and an alkali typified by magnesium fluoride. Examples thereof include an earth metal compound buffer layer and an oxide buffer layer typified by aluminum oxide.
  • Each of the buffer layers is desirably a very thin film, and although depending on the material, the film thickness is preferably in the range of 0.1 to 100 nm.
  • the injection layer may be a single layer or a plurality of layers.
  • each functional layer described above may be formed by a vacuum process, a dry process such as a sputtering process, or a wet process such as a coating or printing process. Also good.
  • First electrode, second electrode In the organic EL device according to the present invention, in order to transmit emitted light, at least one of the first electrode and the second electrode constituting the organic EL device needs to be transparent or translucent. Furthermore, an organic EL element in which both the anode and the cathode are transparent can be obtained by using the first electrode as a transparent electrode and further producing a transparent or translucent second electrode.
  • the cathode and the anode are not particularly limited and can be selected depending on the configuration of the organic EL element.
  • the first electrode is an anode using a transparent electrode.
  • a transparent electrode For example, when used as an anode, it is preferably an electrode that transmits light from 380 nm to 800 nm.
  • a material having a work function larger (deep) than 4 eV is suitable as a material, for example, a transparent conductive metal oxide such as indium tin oxide (ITO), SnO 2 , or ZnO, or a metal such as gold, silver, or platinum.
  • ITO indium tin oxide
  • SnO 2 SnO 2
  • ZnO zinc oxide
  • Thin films, metal nanowires, carbon nanotubes, and the like can be used.
  • these electrode materials may be formed into a thin film by a method such as vapor deposition or sputtering, and a pattern having a desired shape may be formed by a photolithography method, or the pattern accuracy is not so required (100 ⁇ m).
  • a pattern may be formed through a mask having a desired shape at the time of vapor deposition or sputtering of the electrode material.
  • wet film forming methods such as a printing system and a coating system, can also be used.
  • the transmittance be greater than 10%
  • the sheet resistance as the first electrode is preferably several hundred ⁇ / ⁇ or less.
  • the film thickness depends on the material used, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.
  • a cathode and an anode are not specifically limited, It can select according to an organic EL element structure.
  • a cathode it is preferable to use a metal, an alloy, an electrically conductive compound having a work function of 4 eV or less (shallow), and a mixture thereof as an electrode material.
  • electrode materials include sodium, sodium-potassium alloy, magnesium, lithium, magnesium / copper mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, aluminum / aluminum oxide (Al 2 O 3 ) Mixtures, indium, lithium / aluminum mixtures, rare earth metals and the like.
  • these metals and the second metal which is a stable metal having a larger (deep) work function value than this
  • Mixtures such as magnesium / silver mixtures, magnesium / aluminum mixtures, magnesium / indium mixtures, aluminum / aluminum oxide (Al 2 O 3 ) mixtures, lithium / aluminum mixtures, aluminum alone and the like are suitable.
  • the second electrode can be produced by forming a thin film of these electrode materials by a method such as vapor deposition or sputtering.
  • the film thickness is usually selected in the range of 10 nm to 5 ⁇ m, preferably 50 nm to 200 nm.
  • organic photovoltaic element organic photovoltaic element, solar cell
  • the effect of increasing the optical path length is obtained by reflecting the light that has passed through the photoelectric conversion layer and returning it to the photoelectric conversion layer again, and in any case, an improvement in external quantum efficiency can be expected.
  • nanoparticle, nanowire, or nanostructure made of metal (eg, gold, silver, copper, platinum, rhodium, ruthenium, aluminum, magnesium, indium, etc.) or carbon.
  • metal eg, gold, silver, copper, platinum, rhodium, ruthenium, aluminum, magnesium, indium, etc.
  • carbon e.g., carbon
  • This highly dispersible paste is preferable because a transparent and highly conductive counter electrode can be formed by a coating method or a printing method.
  • a sealing material used to form an adhesion sealing structure by laminating a substrate of an organic EL element and a sealing substrate and bonding the surfaces.
  • a sealing material also referred to as a sealing adhesive
  • thermosetting resin and the ultraviolet curable resin applicable to the present invention are not particularly limited, but thermosetting resins such as epoxy resins, acrylic resins, and silicone resins are preferable, and moisture resistance and water resistance are more preferable. It is an epoxy thermosetting resin that has excellent properties and has little shrinkage when cured.
  • a coating method such as roll coating, spin coating, screen printing, or spray coating can be used depending on a material to be applied.
  • a desiccant such as barium oxide or calcium oxide may be mixed.
  • the water content of the sealing adhesive according to the present invention is preferably 300 ppm or less, more preferably 0.01 to 200 ppm, and particularly preferably 0.01 to 100 ppm.
  • the moisture content may be measured by any method. For example, a volumetric moisture meter (Karl Fischer), an infrared moisture meter, a microwave transmission moisture meter, a heat-dry weight method, GC / MS, IR, DSC (Differential scanning calorimeter), TDS (Temperature desorption analysis), and other measuring methods. Further, using a precision moisture meter AVM-3000 (manufactured by Omnitech) or the like, the moisture content can be measured from the pressure increase caused by the evaporation of moisture.
  • the water content of the sealing material is, for example, set in a nitrogen atmosphere having a dew point temperature of ⁇ 80 ° C. or lower and an oxygen concentration of 0.8 ppm, and can be changed by changing the time. Can be adjusted to the conditions. Moreover, it can adjust also by placing in a vacuum state of 100 Pa or less and changing the time to dry. Moreover, although the adhesive agent for sealing can dry only an adhesive agent, it can also be dried after previously arrange
  • sealing substrate examples include metals such as stainless steel, aluminum, and magnesium alloys, resin films such as polyethylene terephthalate, polycarbonate, polystyrene, nylon, and polyvinyl chloride, and composite materials thereof, glass, and the like. Can be used as needed.
  • resin films such as polyethylene terephthalate, polycarbonate, polystyrene, nylon, and polyvinyl chloride, and composite materials thereof, glass, and the like.
  • a material obtained by laminating a gas barrier layer composed of aluminum, aluminum oxide, silicon oxide, silicon nitride, or the like can be used as in the case of a resin substrate.
  • the sealing substrate is preferably a metal foil from the viewpoint of flexibility and barrier properties.
  • the metal foil used as the sealing substrate is not particularly limited in the type of metal.
  • copper (Cu) foil aluminum (Al) foil, gold (Au) foil, brass foil, nickel (Ni) foil, titanium (Ti) foil, copper alloy foil, stainless steel foil, tin (Sn) foil, high nickel alloy foil, and the like.
  • a particularly preferred metal foil is an Al foil.
  • the metal foil mainly refers to a metal foil or film formed by rolling metal, etc., but a metal thin film formed by sputtering or vapor deposition on a polymer film, or a flow of conductive paste, etc. It may be a conductive film formed from a conductive electrode material.
  • polyethylene resin polypropylene resin, polyethylene terephthalate resin, polyamide resin, ethylene-vinyl alcohol copolymer resin, ethylene-vinyl acetate copolymer resin, acrylonitrile-butadiene copolymer resin, cellophane resin, vinylon Resin, vinylidene chloride resin and the like.
  • Each resin such as polypropylene resin, polyethylene terephthalate resin, and nylon resin may be stretched and further coated with a vinylidene chloride resin.
  • a polyethylene resin having a low density or a high density can be used.
  • a generally used laminating machine can be used as a method of laminating a polymer film on one side of a metal foil.
  • the adhesive polyurethane-based, polyester-based, epoxy-based, acrylic-based adhesives and the like can be used. You may use a hardening
  • a hot melt lamination method, an extrusion lamination method and a coextrusion lamination method can also be used, but a dry lamination method is preferred.
  • the metal foil when the metal foil is formed by sputtering or vapor deposition and is formed from a fluid electrode material such as a conductive paste, it may be produced by a method of forming a metal foil on a polymer film as a base material. Good.
  • the metal foil used as the sealing substrate preferably has a thickness of 9 to 500 ⁇ m, and a polymer film is laminated thereon, and the thickness of the polymer film is 10 to 100% of the metal foil. Preferably there is.
  • FIG. 1 is a cross-sectional view showing an example of the configuration of the organic EL panel of the present invention.
  • an organic EL element including a first electrode 2, an organic EL layer (organic compound layer) 3 including a light emitting layer, and a second electrode 4 is formed on a resin substrate 1.
  • a sealed organic electroluminescence (EL) panel P having a configuration in which a sealing substrate 5 is sealed at its end by an adhesive layer 6 is shown.
  • the sealing substrate for example, a polyethylene terephthalate film with a thickness of 50 ⁇ m and an aluminum foil laminated with a thickness of 30 ⁇ m, for example, can be used.
  • a sealing adhesive uniformly applied to the aluminum surface using a dispenser is placed in advance, the resin substrate 1 and the sealing substrate 5 are aligned, and then both are crimped together. After bonding (0.1 to 3 MPa), heat curing is performed at a temperature in the range of 80 to 160 ° C., and close sealing (solid sealing) is performed.
  • the pressure-bonding time is appropriately set depending on the type of sealing adhesive, the applied amount, the applied area, etc., but the pressure is temporarily bonded within a range of about 0.1 to 3 MPa. At this time, a heated crimping roll can be used to eliminate voids remaining inside.
  • the solid sealing is a form in which there is no space between the sealing member and the organic EL element substrate and the resin is cured with a cured resin.
  • the heating temperature necessary for curing the adhesive layer can be set as appropriate, but is preferably 50 ° C. or higher and 200 ° C. or lower, more preferably 80 ° C. or higher, It is the range of 160 degrees C or less. Further, by heating for 1 minute or more and 1 hour or less, the curing (crosslinking reaction) proceeds and adheres in the case of a thermosetting resin. Also in the case of a photo-curing adhesive, the curing (adhesion) speed can be increased by heating after light irradiation.
  • the sealing material is a thermosetting resin or It is an ultraviolet curable resin.
  • the adhesive component penetrates into the minute gaps of the second electrode. Therefore, although it is easy to cause micro-peeling at the interface between the second electrode and the organic compound layer by heat curing, penetration of the adhesive component is suppressed by passing through a cooling step before heat curing, and cooling stays. Thus, it is presumed that only the curing in the minute voids progressed, and the minute peeling at the interface between the second electrode and the organic compound layer was suppressed even when heat curing was performed later.
  • the reason for the hardening of the adhesive in the minute gap due to the cooling stay is unknown, but it is possible that the minute defect of the second electrode has a catalytic action for promoting the hardening of the thermosetting adhesive.
  • the time until the process of cooling to 5 ° C. or less according to the present invention is preferably as short as possible, but is preferably within 12 hours, more preferably 10 seconds or more. Further, it is more preferably within 6 hours, particularly preferably within 1 minute and within 4 hours.
  • the residence time of the organic EL panel in the step of cooling to 5 ° C. or less according to the present invention is preferably 1 hour or more, more preferably 2 hours or more and 8 days or less, still more preferably 1 day or more and 8 days or less. is there.
  • the temperature in the cooling step according to the present invention is 5 ° C. or less, preferably 0 ° C. or less, more preferably ⁇ 20 ° C. or more and 0 ° C. or less.
  • Light extraction material In the present invention, it is preferable to have a light extraction member between the flexible substrate and the second electrode or at any location on the light emission side from the flexible substrate.
  • examples of the light extraction member include a prism sheet, a lens sheet, and a diffusion sheet. Further, a diffraction grating or a diffusion structure introduced into an interface or any medium that causes total reflection can be used.
  • an organic electroluminescence element that emits light from a substrate
  • a part of the light emitted from the light emitting layer causes total reflection at the interface between the substrate and air, causing a problem of loss of light.
  • prismatic or lens-like processing is applied to the surface of the substrate, or prism sheets, lens sheets, and diffusion sheets are affixed to the surface of the substrate, thereby suppressing total reflection and light extraction efficiency. To improve.
  • a gas barrier layer having a structure in which an adhesion layer / ceramic layer / adhesion layer / ceramic layer were laminated in this order was formed on one surface of the flexible base material under the atmospheric pressure plasma treatment conditions shown below.
  • Each film thickness is 200 nm for the adhesion layer and 25 nm for the ceramic layer.
  • the holding temperature of the flexible substrate during film formation was 140 ° C.
  • a light emitting layer coating solution having the following composition is further prepared to 1 ml, and spin-coated in a glove box having a moisture concentration of 1 ppm or less, an oxygen concentration of 10 ppm or less, and a temperature of 26 ° C.
  • a light emitting layer having a thickness of about 25 nm was formed.
  • the flexible base material on which the electron transport layer was formed was transferred to a vacuum deposition apparatus, the vacuum chamber was depressurized to 4 ⁇ 10 ⁇ 4 Pa, and 10 nm of lithium fluoride and a cathode as a cathode buffer layer on the electron transport layer.
  • an organic EL element 1 was fabricated by sequentially depositing aluminum 110 nm layers.
  • a 30 ⁇ m thick aluminum foil manufactured by Toyo Aluminum Co., Ltd.
  • a 25 ⁇ m thick polyethylene terephthalate (PET) film is used on this mat surface with an adhesive for dry lamination (two-component reaction type urethane adhesive).
  • the surface roughness Ra of the cut surface (mat surface) of this aluminum foil was 470 nm, and the Ra of the polished surface was 1 nm or less.
  • thermosetting adhesive composed of agent a, agent b and agent c was applied to produce a sealing substrate with a sealing material.
  • thermosetting adhesive composition Epoxy adhesive> Agent a) Bisphenol A diglycidyl ether (DGEBA) b) Dicyandiamide (DICY) c agent) Epoxy adduct type curing accelerator
  • DGEBA diglycidyl ether
  • DIY Dicyandiamide
  • c agent Epoxy adduct type curing accelerator
  • the thermosetting adhesive is uniformly applied along the adhesive surface (shiny surface) of aluminum foil laminated with polyethylene terephthalate using a dispenser, and has a moisture concentration of 1 ppm or less, oxygen
  • the sample was left in a glove box having a concentration of 10 ppm or less and a temperature of 26 ° C. for 12 hours.
  • the thickness of the adhesive layer was 20 ⁇ m, and the water content measured by the Karl Fischer method was 50 ppm or less.
  • the organic EL element 1 is formed so that the extraction electrode is exposed from the thus prepared sealing substrate with adhesive in a glove box having a moisture concentration of 1 ppm or less, an oxygen concentration of 10 ppm or less, and a temperature of 26 ° C.
  • the adhesive surface was placed in close contact with the PET substrate so as to cover it, and the sealing substrate was pressure-bonded (pressure 0.15 MPa, time 30 seconds) to be temporarily bonded.
  • the organic EL panel is immediately moved onto a hot plate, heated (temperature 120 ° C., 30 minutes) to thermally cure the thermosetting adhesive, and the organic EL panel 101 was made.
  • organic EL panels 102 and 103 were produced in the same manner except that the storage time at 26 ° C. after temporary bonding was changed to 24 hours and 120 hours, respectively.
  • A No occurrence of dark spots is observed.
  • O The number of dark spots is 1 or more and less than 5.
  • ⁇ The number of dark spots is 5 or more and less than 20.
  • ⁇ Dark The number of spots generated is 20 or more.
  • Ratio of non-light emitting area is less than 0.1%
  • B Ratio of non-light emitting area is 0.1% or more and less than 1.0%
  • ⁇ Ratio of non-light emitting area is 1.0 %more than. Less than 2.0%
  • the ratio of the non-light emitting area is 2.0% or more. Table 1 shows the results obtained as described above.
  • the production method according to the present invention is performed in the cooling step of 5 ° C. or less specified in the present invention. It can be seen that the organic EL panel has a higher rectification ratio than the comparative example, and is excellent in initial dark spot resistance and panel life.

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Abstract

L'invention concerne un procédé de production d'un panneau EL organique possédant une excellente durée de vie et une excellente résistance contre les points noirs initiaux dans les éléments EL organiques, ainsi qu'un rapport de redressement élevé. L'invention concerne également un panneau EL organique. Le procédé de production de panneau EL organique, dans lequel une structure de scellage par contact est formée en fixant un substrat de scellage sur un substrat comportant un élément EL organique formé sur celui-ci et qui comporte une première électrode, une couche de composé organique comprenant une couche émettrice de lumière et une seconde électrode, et en collant ses surfaces à l'aide d'un matériau de scellage, est caractérisé en ce que ledit matériau de scellage est une résine thermodurcissante ou une résine durcissant aux UV, et en ce que, une fois que le substrat de scellage a été fixé sur le substrat à l'aide du matériau de scellage et que ses surfaces ont été collées, on effectue une étape de refroidissement des substrats à 5° C ou moins, après quoi le matériau de scellage est solidifié en appliquant de la chaleur ou des rayons UV, ceci de manière à produire le panneau EL organique.
PCT/JP2011/054726 2010-03-17 2011-03-02 Panneau électroluminescent organique et procédé de production de panneau électroluminescent organique WO2011114882A1 (fr)

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JP2012505598A JPWO2011114882A1 (ja) 2010-03-17 2011-03-02 有機エレクトロルミネッセンスパネル及び有機エレクトロルミネッセンスパネルの製造方法

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JP2010060551 2010-03-17
JP2010-060551 2010-03-17

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WO2011114882A1 true WO2011114882A1 (fr) 2011-09-22

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KR101377525B1 (ko) 2013-10-08 2014-03-25 남호진 유기 발광 다이오드 디스플레이용 봉지기판 및 그 제조방법
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KR101505772B1 (ko) * 2012-05-31 2015-03-26 주식회사 엘지화학 유기전자장치의 제조방법
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EP2750209A2 (fr) * 2012-12-26 2014-07-02 Nitto Denko Corporation Feuille d'encapsulation
WO2015012239A1 (fr) * 2013-07-24 2015-01-29 コニカミノルタ株式会社 Procédé et dispositif de production d'élément électroluminescent organique
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JP2016514895A (ja) * 2013-08-21 2016-05-23 エルジー・ケム・リミテッド 有機発光素子およびその製造方法
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KR101377525B1 (ko) 2013-10-08 2014-03-25 남호진 유기 발광 다이오드 디스플레이용 봉지기판 및 그 제조방법
WO2016067771A1 (fr) * 2014-10-29 2016-05-06 ソニー株式会社 Ensemble de dispositif électronique et élément de protection
JP2016091595A (ja) * 2014-10-29 2016-05-23 ソニー株式会社 電子デバイス組立体及び保護部材
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