WO2011114759A1 - Procédé pour monter des composants électroniques, et dispositif électronique - Google Patents

Procédé pour monter des composants électroniques, et dispositif électronique Download PDF

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Publication number
WO2011114759A1
WO2011114759A1 PCT/JP2011/050183 JP2011050183W WO2011114759A1 WO 2011114759 A1 WO2011114759 A1 WO 2011114759A1 JP 2011050183 W JP2011050183 W JP 2011050183W WO 2011114759 A1 WO2011114759 A1 WO 2011114759A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
wiring board
resin
electronic
gap
Prior art date
Application number
PCT/JP2011/050183
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English (en)
Japanese (ja)
Inventor
聡和 濱尾
博幸 藤延
Original Assignee
株式会社安川電機
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社安川電機 filed Critical 株式会社安川電機
Priority to JP2012505538A priority Critical patent/JPWO2011114759A1/ja
Publication of WO2011114759A1 publication Critical patent/WO2011114759A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive

Definitions

  • the present invention relates to an electronic component mounting method and an electronic device.
  • a mounting board on which electronic components such as resistors, capacitors, coils, or semiconductor chips are mounted on the wiring board protects the connection parts, improves insulation reliability, and improves the heat dissipation of heat generated from the electronic parts
  • an underfill resin is injected into the connecting portion.
  • a liquid, low-viscosity underfill resin is injected into the mounting substrate on which the electronic component is mounted from the periphery of the electronic component using a dispenser needle, and the gap between the electronic component and the wiring substrate, or the electronic
  • a method of infiltrating and injecting gaps between leads connected to components using a capillary phenomenon or gravity is generally used.
  • an inflow promoting portion is provided in the vicinity of the electronic component in order to promote the inflow of the underfill resin into the gap between the electronic component and the wiring board, and the underfill resin is positively supplied to the gap by the capillary phenomenon. It has been proposed to promote intrusion (see, for example, Patent Document 1 (page 4-6, FIG. 1)).
  • underfill resin When injecting underfill resin into a mounting board mounted with multiple electronic components arranged in multiple rows, if underfill resin is injected from multiple injection parts, it will be sandwiched between other electronic components Underfill resin permeates from a plurality of directions into the gap between the arranged electronic component and the mounting substrate. In such a situation, air enters between the infiltrating underfill resin and there is no escape space, and voids are likely to occur in the gap between the electronic component and the wiring board. On the other hand, with the demand for downsizing of electronic devices, it is required to further reduce the mounting board area. However, for electronic components that are sandwiched between other electronic components, injecting portions are provided on many parts on the mounting board to promote the penetration of the underfill resin into details, and the underfill resin is actively supplied.
  • An object is to provide a mounting method and an electronic device.
  • the present invention is configured as follows. According to a first aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted.
  • An electronic component mounting method comprising: the first electronic component and the wiring board; and a resin injected into a gap between the third electronic component and the wiring board, the first electronic component and the wiring board Connecting each conductive material of the second electronic component to the wiring board by soldering, joining the third electronic component to the wiring board by a bonding material, and connecting the conductive material to the wiring board by solder; And a step of injecting the resin from between the first electronic component and the third electronic component and from between the second electronic component and the third electronic component.
  • the bonding material is a resin composition based on a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, or a solder, a brazing material, or a nano silver paste. .
  • the filler contained in the bonding material is a ceramic powder containing at least one of alumina, silica, boron nitride, silicon nitride, aluminum nitride, and silicon carbide, or gold Metal powder containing at least one of silver, copper, aluminum, or iron, carbon powder, glass fiber, carbon fiber, aromatic polyamide fiber, or whisker It includes at least one or more of fibers.
  • a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted.
  • An electronic component mounting method comprising: the first electronic component and the wiring substrate; the second electronic component and the wiring substrate; and a resin injected into a gap between the third electronic component and the wiring substrate. Connecting the conductive material of the first electronic component and the second electronic component and the conductive material of the third electronic component longer than the conductive material to the wiring board by solder; And inserting the resin into a gap between the three electronic components and the wiring board.
  • a wiring board a single central electronic component disposed in the vicinity of 3 rows and 3 columns on the wiring board, and surrounding the central electronic component.
  • An electronic component group having eight peripheral electronic components mounted thereon, and a resin injected into a gap between the peripheral electronic component and the wiring substrate, wherein the central electronic component is bonded to the wiring substrate by a bonding material It is directly joined to.
  • a wiring board and a single central electronic component disposed in the vicinity of the three rows and three columns on the wiring substrate, and surrounding the central electronic component.
  • the central electronic component and the peripheral electronic component are each connected to the wiring board via a conductive material, the central electronic component and the wiring board, And a resin injected into a gap between the peripheral electronic component and the wiring board, and the conductive material of the central electronic component is longer than the conductive material of the peripheral electronic component, and the central electronic component and the wiring board
  • the nozzle for injecting the resin into the gap is set at an interval in which the nozzle can be inserted.
  • the electronic component includes a coil, a capacitor, and a resistor, and has a line filter function.
  • the electronic component includes a semiconductor chip component.
  • the electronic component disposed between the plurality of electronic components is bonded to the wiring board by the bonding material, and the gap between the electronic component and the wiring board is eliminated. For this reason, it is not necessary to permeate the resin, and a phenomenon in which a void is generated can be prevented.
  • the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
  • a bonding material having good heat conduction it is possible to improve heat dissipation from the electronic parts that generate heat.
  • the electronic component disposed between the plurality of electronic components has a large gap with the wiring board and can insert a nozzle for injecting the resin. Can be easily injected, and the phenomenon of voids can be greatly reduced.
  • the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
  • the fifth aspect of the present invention it is possible to provide a small electronic device in which the generation of voids in the resin is significantly reduced.
  • the sixth aspect of the present invention it is possible to provide a small electronic device in which resin injection is easy and generation of voids in the resin is greatly reduced.
  • the electronic device which has a highly reliable small line filter function can be provided.
  • the electronic device provided with the small semiconductor chip with high reliability can be provided.
  • FIG. 1A is a top view of the electronic component mounting structure showing the first embodiment of the present invention
  • FIG. 1B is a cross-section taken along the line ⁇ - ⁇ ′ in FIG. FIG.
  • 10 is a wiring board having alumina as a base material and a land pattern on the main surface
  • 20 is a case made of polyphenylene sulfide resin filled with glass fibers and the like
  • 21 is glass so as to close the upper part of the case 20.
  • a lid formed of a polyphenylene sulfide resin filled with fibers, 30 is an electronic component, 31 is a lead of a conductive material, and is bonded to a land pattern pad provided on the wiring board 10 by soldering. 30 and the wiring board 10 are electrically and mechanically connected.
  • the conductive material may be formed of a conductive solder such as a solder ball or a conductive material containing other metals.
  • Reference numeral 40 denotes a resin injected into the gap between the electronic component 30 and the main surface of the wiring board 10 and the gap between the leads 31, 50 denotes a bonding material for bonding the electronic component 30 onto the wiring board, and 60 denotes the resin 40. After being injected and cured, the sealing resin is sealed in the entire remaining space in the case 20.
  • the nozzle 70 for injecting the resin 40 uses the needle of a dispenser (SHOTminiSL, Super ⁇ X-V2: not shown) manufactured by Musashi Engineering, and injects the injection pattern I shown in FIG. Resin was injected and cured in two patterns, Pattern II. All resin injection steps were performed at room temperature.
  • injection pattern I Between the electronic components 30X 1 to 3 of the first row 30 and the electronic components 30Y 1 to 3 of the second row, the point A1 ⁇ A2 is moved while discharging the resin 40 from the nozzle 70, and then the electronic component 30Y of the second row between 1-3 and the third column of the electronic component 30Z 1-3 was a point A3 ⁇ A4 is moved while discharging the resin 40 from the nozzle 70.
  • the sealing resin 60 was potted inside the case 20 so as to cover the resin 40 and cured by heating, and the lid 21 was fixed to the upper part of the case 20.
  • the material shown in Table 1 was used for the resin 40, the bonding material 50, and the sealing resin 60 in this example.
  • the viscosities shown in the table are measured values with a 1 ° 34 ' ⁇ R24 rotor or 3 ° ⁇ R9.7 rotor using an E type (EMD type) viscometer manufactured by Toki Sangyo.
  • the length of each lead 31 attached to the electronic component 30 is arbitrarily set, and the lead 31 is manufactured under the condition of being connected to the wiring board 10 by soldering.
  • the material and other conditions are the same as in the embodiment. .
  • “ ⁇ ” indicates that there is no void or no injection failure has been confirmed, and “x” indicates that there is a void or injection failure has been confirmed.
  • the resin 40 shown in Table 3 in addition to Table 1 was also verified in the implantation pattern I by the mounting method of this example, and as a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
  • the materials shown in Table 4 in addition to Table 1 were also verified in the same manner as described above in the implantation pattern I by the mounting method of this example. As a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
  • a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained.
  • a resistor having a large amount of heat generation to the wiring board with a bonding material, heat conduction to the wiring board can be promoted, and heat dissipation can be improved.
  • the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
  • a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the mounting method described above, and the same effects as described above can be obtained. Also, by joining a semiconductor chip with a large calorific value using SiC, GaN, etc. used at high temperature to the wiring board with a bonding material, heat conduction to the wiring board can be promoted and heat dissipation can be improved. . Furthermore, the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
  • an adhesive containing unfilled or various inorganic fillers or glass cloth based on various resins was used, but alkyd resin, phenolic resin, or cellulose Adhesives based on resin may be used, and fillers include various fibers such as carbon fiber or aromatic polyamide fiber, various metal powders such as iron powder or gold powder, boron nitride, silicon nitride, aluminum nitride or silicon carbide. Various ceramic powders such as those filled with various whiskers such as boron nitride whiskers may be used.
  • FIG. 2A is a perspective view of the electronic component mounting structure showing the second embodiment of the present invention
  • FIG. 2B is a cross-sectional view taken along the line ⁇ - ⁇ ′ in FIG. FIG.
  • reference numeral 70 denotes a nozzle for injecting resin. Note that a description of what is common to the first embodiment will be omitted.
  • the mounting method according to the present embodiment will be described for each step of (1) electronic component connection step and (2) resin injection step.
  • the length of 31 is arbitrarily set and connected to the wiring board 10 with solder. II) For the electronic components 30Y 1 to 3 in the second row (center row in the figure), the distance from the main surface of the wiring substrate 10 is 0.4 mm. It was set longer than the length of the lead 31 attached to the other electronic component 30 so that the tip of the nozzle 70 for injecting the resin 40 could be inserted, and connected to the wiring board 10 by soldering.
  • the injected resin 40 penetrates into the peripheral portion of the lead attached to the electronic component 30Y 2 and wets and spreads on the wiring substrate 10 to reach the gap between the peripheral electronic component 30 and the wiring substrate 10 and the lead 31, thereby causing a capillary phenomenon. And infiltrated the details of the parts by gravity.
  • the tip of the nozzle 70 as a source of resin 40, second column near the center of the electronic component 30Y 2 located in the center of (in the figure the center column), i.e. the central portion of the entire electronic component 30 placed Therefore, it spreads evenly to the surrounding electronic components 30 and penetrated into the details.
  • the wiring board 10 was kept at a necessary temperature and time, and the resin 40 was injected and cured.
  • Table 5 shows the material curing conditions of the resin 40 used in this example.
  • the sealing resin 60 shown in Table 5 was injected into the case 20 so as to cover the resin 40. At this time, the remaining space in the gap between the electronic component 30Y 2 and the wiring substrate 10 after the resin 40 was injected was filled with the sealing resin 60. Thereafter, the sealing resin 60 was cured, the lid 21 was attached, and the lid 21 and the case 20 were bonded.
  • Results of verifying the occurrence of voids in the resin injected into the gap between the electronic components 30Y 1 to 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process was as follows.
  • the verification of the present invention was performed by the same method as described above.
  • the comparative example is the same as described above. In this example, no voids and poor injection were observed in the gap between each electronic component 30 and the wiring board 10, and the injection state of the resin 40 was good.
  • the electronic component arranged between the plurality of electronic components has a large gap with the wiring board, and the nozzle is inserted to inject the resin. This prevents the phenomenon that voids are generated in the gap between the electronic component and the wiring board when the resin is injected, and the resin can be injected in a good state.
  • the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed becomes possible, and the mounting substrate area can be reduced as compared with the conventional case.
  • a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained.
  • a capacitor with a small amount of heat generation is disposed as an electronic component having a large distance from the wiring board, and a coil or resistor having a relatively large amount of heat generation is disposed as an electronic component having a small distance from the wiring board, thereby Such an electronic component having a large heat generation generates heat and the heat conducted to the wiring board is not easily transmitted to the electronic component having a small heat generation such as a capacitor.
  • a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the above mounting method, and the same effect as described above can be obtained.
  • other electronic components with a small amount of heat generated in the periphery are electronic components with a large distance from the wiring board.
  • the semiconductor chip having a large calorific value is arranged as an electronic component having a small distance from the wiring board.
  • an alumina wiring board having a uniform material is used to prevent the influence of irregular reflection of ultrasonic waves.
  • the wiring board is made of glass cloth reinforced epoxy resin, phenol resin, polyimide resin, bismaleimide resin, paper base epoxy resin, phenol resin, polyester resin, silicon nitride or nitride
  • Various ceramics such as aluminum and a polyimide or polyester base material which is a flexible base material may be used.
  • a silicone gel, epoxy resin or urethane resin having a viscosity at room temperature of 8 Pa ⁇ s or less was used as the resin.
  • other liquid thermosetting resins may be used.
  • silicone rubber is used as the sealing resin
  • silicone gel epoxy resin, phenol resin, acrylic resin, or other liquid thermosetting resin
  • the sealing resin or the lid may not be omitted when the stress such as vibration, external force, exposure to contaminants is small.
  • the casting of the sealing resin 60 may be a vacuum casting, or in order to increase the fluidity of the sealing resin 60, the casting may be performed by heating within a range that does not adversely affect the resin 40. .
  • solder such as high-temperature solder
  • brazing materials such as nano silver paste bonding material or silver brazing may be used as the solder.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention porte sur un procédé pour monter des composants électroniques dans un processus de scellement hermétique par résine pour une carte de montage sur laquelle sont montés une pluralité de composants électroniques. Selon le procédé pour monter des composants électroniques, les composants électroniques peuvent être montés de façon fiable sur la carte de montage sans l'apparition de vides ni de défauts de remplissage, et la taille de la carte de montage peut être réduite. Le procédé pour monter les composants électroniques comporte une étape dans laquelle des composants électroniques (30) disposés entre des sections d'injection pour une résine (40) sont réunis à une carte de câblage (10) à l'aide d'un matériau de jonction (50).
PCT/JP2011/050183 2010-03-19 2011-01-07 Procédé pour monter des composants électroniques, et dispositif électronique WO2011114759A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012505538A JPWO2011114759A1 (ja) 2010-03-19 2011-01-07 電子部品の実装方法および電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010065082 2010-03-19
JP2010-065082 2010-03-19

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Publication Number Publication Date
WO2011114759A1 true WO2011114759A1 (fr) 2011-09-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021524995A (ja) * 2018-05-30 2021-09-16 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． フレキシブル基板およびその作製方法、フレキシブル電子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021933A (ja) * 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 基板構造および携帯端末
JP2009135479A (ja) * 2007-11-01 2009-06-18 Panasonic Corp 実装構造体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233711A (ja) * 1998-02-06 1999-08-27 Hitachi Ltd 半導体装置およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021933A (ja) * 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 基板構造および携帯端末
JP2009135479A (ja) * 2007-11-01 2009-06-18 Panasonic Corp 実装構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021524995A (ja) * 2018-05-30 2021-09-16 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． フレキシブル基板およびその作製方法、フレキシブル電子装置
JP7335169B2 (ja) 2018-05-30 2023-08-29 京東方科技集團股▲ふん▼有限公司 フレキシブル基板およびその作製方法、フレキシブル電子装置

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