WO2011114759A1 - Method for mounting electronic components, and electronic device - Google Patents
Method for mounting electronic components, and electronic device Download PDFInfo
- Publication number
- WO2011114759A1 WO2011114759A1 PCT/JP2011/050183 JP2011050183W WO2011114759A1 WO 2011114759 A1 WO2011114759 A1 WO 2011114759A1 JP 2011050183 W JP2011050183 W JP 2011050183W WO 2011114759 A1 WO2011114759 A1 WO 2011114759A1
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- WIPO (PCT)
- Prior art keywords
- electronic component
- wiring board
- resin
- electronic
- gap
- Prior art date
Links
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
Definitions
- the present invention relates to an electronic component mounting method and an electronic device.
- a mounting board on which electronic components such as resistors, capacitors, coils, or semiconductor chips are mounted on the wiring board protects the connection parts, improves insulation reliability, and improves the heat dissipation of heat generated from the electronic parts
- an underfill resin is injected into the connecting portion.
- a liquid, low-viscosity underfill resin is injected into the mounting substrate on which the electronic component is mounted from the periphery of the electronic component using a dispenser needle, and the gap between the electronic component and the wiring substrate, or the electronic
- a method of infiltrating and injecting gaps between leads connected to components using a capillary phenomenon or gravity is generally used.
- an inflow promoting portion is provided in the vicinity of the electronic component in order to promote the inflow of the underfill resin into the gap between the electronic component and the wiring board, and the underfill resin is positively supplied to the gap by the capillary phenomenon. It has been proposed to promote intrusion (see, for example, Patent Document 1 (page 4-6, FIG. 1)).
- underfill resin When injecting underfill resin into a mounting board mounted with multiple electronic components arranged in multiple rows, if underfill resin is injected from multiple injection parts, it will be sandwiched between other electronic components Underfill resin permeates from a plurality of directions into the gap between the arranged electronic component and the mounting substrate. In such a situation, air enters between the infiltrating underfill resin and there is no escape space, and voids are likely to occur in the gap between the electronic component and the wiring board. On the other hand, with the demand for downsizing of electronic devices, it is required to further reduce the mounting board area. However, for electronic components that are sandwiched between other electronic components, injecting portions are provided on many parts on the mounting board to promote the penetration of the underfill resin into details, and the underfill resin is actively supplied.
- An object is to provide a mounting method and an electronic device.
- the present invention is configured as follows. According to a first aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted.
- An electronic component mounting method comprising: the first electronic component and the wiring board; and a resin injected into a gap between the third electronic component and the wiring board, the first electronic component and the wiring board Connecting each conductive material of the second electronic component to the wiring board by soldering, joining the third electronic component to the wiring board by a bonding material, and connecting the conductive material to the wiring board by solder; And a step of injecting the resin from between the first electronic component and the third electronic component and from between the second electronic component and the third electronic component.
- the bonding material is a resin composition based on a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, or a solder, a brazing material, or a nano silver paste. .
- the filler contained in the bonding material is a ceramic powder containing at least one of alumina, silica, boron nitride, silicon nitride, aluminum nitride, and silicon carbide, or gold Metal powder containing at least one of silver, copper, aluminum, or iron, carbon powder, glass fiber, carbon fiber, aromatic polyamide fiber, or whisker It includes at least one or more of fibers.
- a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted.
- An electronic component mounting method comprising: the first electronic component and the wiring substrate; the second electronic component and the wiring substrate; and a resin injected into a gap between the third electronic component and the wiring substrate. Connecting the conductive material of the first electronic component and the second electronic component and the conductive material of the third electronic component longer than the conductive material to the wiring board by solder; And inserting the resin into a gap between the three electronic components and the wiring board.
- a wiring board a single central electronic component disposed in the vicinity of 3 rows and 3 columns on the wiring board, and surrounding the central electronic component.
- An electronic component group having eight peripheral electronic components mounted thereon, and a resin injected into a gap between the peripheral electronic component and the wiring substrate, wherein the central electronic component is bonded to the wiring substrate by a bonding material It is directly joined to.
- a wiring board and a single central electronic component disposed in the vicinity of the three rows and three columns on the wiring substrate, and surrounding the central electronic component.
- the central electronic component and the peripheral electronic component are each connected to the wiring board via a conductive material, the central electronic component and the wiring board, And a resin injected into a gap between the peripheral electronic component and the wiring board, and the conductive material of the central electronic component is longer than the conductive material of the peripheral electronic component, and the central electronic component and the wiring board
- the nozzle for injecting the resin into the gap is set at an interval in which the nozzle can be inserted.
- the electronic component includes a coil, a capacitor, and a resistor, and has a line filter function.
- the electronic component includes a semiconductor chip component.
- the electronic component disposed between the plurality of electronic components is bonded to the wiring board by the bonding material, and the gap between the electronic component and the wiring board is eliminated. For this reason, it is not necessary to permeate the resin, and a phenomenon in which a void is generated can be prevented.
- the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
- a bonding material having good heat conduction it is possible to improve heat dissipation from the electronic parts that generate heat.
- the electronic component disposed between the plurality of electronic components has a large gap with the wiring board and can insert a nozzle for injecting the resin. Can be easily injected, and the phenomenon of voids can be greatly reduced.
- the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
- the fifth aspect of the present invention it is possible to provide a small electronic device in which the generation of voids in the resin is significantly reduced.
- the sixth aspect of the present invention it is possible to provide a small electronic device in which resin injection is easy and generation of voids in the resin is greatly reduced.
- the electronic device which has a highly reliable small line filter function can be provided.
- the electronic device provided with the small semiconductor chip with high reliability can be provided.
- FIG. 1A is a top view of the electronic component mounting structure showing the first embodiment of the present invention
- FIG. 1B is a cross-section taken along the line ⁇ - ⁇ ′ in FIG. FIG.
- 10 is a wiring board having alumina as a base material and a land pattern on the main surface
- 20 is a case made of polyphenylene sulfide resin filled with glass fibers and the like
- 21 is glass so as to close the upper part of the case 20.
- a lid formed of a polyphenylene sulfide resin filled with fibers, 30 is an electronic component, 31 is a lead of a conductive material, and is bonded to a land pattern pad provided on the wiring board 10 by soldering. 30 and the wiring board 10 are electrically and mechanically connected.
- the conductive material may be formed of a conductive solder such as a solder ball or a conductive material containing other metals.
- Reference numeral 40 denotes a resin injected into the gap between the electronic component 30 and the main surface of the wiring board 10 and the gap between the leads 31, 50 denotes a bonding material for bonding the electronic component 30 onto the wiring board, and 60 denotes the resin 40. After being injected and cured, the sealing resin is sealed in the entire remaining space in the case 20.
- the nozzle 70 for injecting the resin 40 uses the needle of a dispenser (SHOTminiSL, Super ⁇ X-V2: not shown) manufactured by Musashi Engineering, and injects the injection pattern I shown in FIG. Resin was injected and cured in two patterns, Pattern II. All resin injection steps were performed at room temperature.
- injection pattern I Between the electronic components 30X 1 to 3 of the first row 30 and the electronic components 30Y 1 to 3 of the second row, the point A1 ⁇ A2 is moved while discharging the resin 40 from the nozzle 70, and then the electronic component 30Y of the second row between 1-3 and the third column of the electronic component 30Z 1-3 was a point A3 ⁇ A4 is moved while discharging the resin 40 from the nozzle 70.
- the sealing resin 60 was potted inside the case 20 so as to cover the resin 40 and cured by heating, and the lid 21 was fixed to the upper part of the case 20.
- the material shown in Table 1 was used for the resin 40, the bonding material 50, and the sealing resin 60 in this example.
- the viscosities shown in the table are measured values with a 1 ° 34 ' ⁇ R24 rotor or 3 ° ⁇ R9.7 rotor using an E type (EMD type) viscometer manufactured by Toki Sangyo.
- the length of each lead 31 attached to the electronic component 30 is arbitrarily set, and the lead 31 is manufactured under the condition of being connected to the wiring board 10 by soldering.
- the material and other conditions are the same as in the embodiment. .
- “ ⁇ ” indicates that there is no void or no injection failure has been confirmed, and “x” indicates that there is a void or injection failure has been confirmed.
- the resin 40 shown in Table 3 in addition to Table 1 was also verified in the implantation pattern I by the mounting method of this example, and as a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
- the materials shown in Table 4 in addition to Table 1 were also verified in the same manner as described above in the implantation pattern I by the mounting method of this example. As a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
- a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained.
- a resistor having a large amount of heat generation to the wiring board with a bonding material, heat conduction to the wiring board can be promoted, and heat dissipation can be improved.
- the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
- a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the mounting method described above, and the same effects as described above can be obtained. Also, by joining a semiconductor chip with a large calorific value using SiC, GaN, etc. used at high temperature to the wiring board with a bonding material, heat conduction to the wiring board can be promoted and heat dissipation can be improved. . Furthermore, the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
- an adhesive containing unfilled or various inorganic fillers or glass cloth based on various resins was used, but alkyd resin, phenolic resin, or cellulose Adhesives based on resin may be used, and fillers include various fibers such as carbon fiber or aromatic polyamide fiber, various metal powders such as iron powder or gold powder, boron nitride, silicon nitride, aluminum nitride or silicon carbide. Various ceramic powders such as those filled with various whiskers such as boron nitride whiskers may be used.
- FIG. 2A is a perspective view of the electronic component mounting structure showing the second embodiment of the present invention
- FIG. 2B is a cross-sectional view taken along the line ⁇ - ⁇ ′ in FIG. FIG.
- reference numeral 70 denotes a nozzle for injecting resin. Note that a description of what is common to the first embodiment will be omitted.
- the mounting method according to the present embodiment will be described for each step of (1) electronic component connection step and (2) resin injection step.
- the length of 31 is arbitrarily set and connected to the wiring board 10 with solder. II) For the electronic components 30Y 1 to 3 in the second row (center row in the figure), the distance from the main surface of the wiring substrate 10 is 0.4 mm. It was set longer than the length of the lead 31 attached to the other electronic component 30 so that the tip of the nozzle 70 for injecting the resin 40 could be inserted, and connected to the wiring board 10 by soldering.
- the injected resin 40 penetrates into the peripheral portion of the lead attached to the electronic component 30Y 2 and wets and spreads on the wiring substrate 10 to reach the gap between the peripheral electronic component 30 and the wiring substrate 10 and the lead 31, thereby causing a capillary phenomenon. And infiltrated the details of the parts by gravity.
- the tip of the nozzle 70 as a source of resin 40, second column near the center of the electronic component 30Y 2 located in the center of (in the figure the center column), i.e. the central portion of the entire electronic component 30 placed Therefore, it spreads evenly to the surrounding electronic components 30 and penetrated into the details.
- the wiring board 10 was kept at a necessary temperature and time, and the resin 40 was injected and cured.
- Table 5 shows the material curing conditions of the resin 40 used in this example.
- the sealing resin 60 shown in Table 5 was injected into the case 20 so as to cover the resin 40. At this time, the remaining space in the gap between the electronic component 30Y 2 and the wiring substrate 10 after the resin 40 was injected was filled with the sealing resin 60. Thereafter, the sealing resin 60 was cured, the lid 21 was attached, and the lid 21 and the case 20 were bonded.
- Results of verifying the occurrence of voids in the resin injected into the gap between the electronic components 30Y 1 to 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process was as follows.
- the verification of the present invention was performed by the same method as described above.
- the comparative example is the same as described above. In this example, no voids and poor injection were observed in the gap between each electronic component 30 and the wiring board 10, and the injection state of the resin 40 was good.
- the electronic component arranged between the plurality of electronic components has a large gap with the wiring board, and the nozzle is inserted to inject the resin. This prevents the phenomenon that voids are generated in the gap between the electronic component and the wiring board when the resin is injected, and the resin can be injected in a good state.
- the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed becomes possible, and the mounting substrate area can be reduced as compared with the conventional case.
- a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained.
- a capacitor with a small amount of heat generation is disposed as an electronic component having a large distance from the wiring board, and a coil or resistor having a relatively large amount of heat generation is disposed as an electronic component having a small distance from the wiring board, thereby Such an electronic component having a large heat generation generates heat and the heat conducted to the wiring board is not easily transmitted to the electronic component having a small heat generation such as a capacitor.
- a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the above mounting method, and the same effect as described above can be obtained.
- other electronic components with a small amount of heat generated in the periphery are electronic components with a large distance from the wiring board.
- the semiconductor chip having a large calorific value is arranged as an electronic component having a small distance from the wiring board.
- an alumina wiring board having a uniform material is used to prevent the influence of irregular reflection of ultrasonic waves.
- the wiring board is made of glass cloth reinforced epoxy resin, phenol resin, polyimide resin, bismaleimide resin, paper base epoxy resin, phenol resin, polyester resin, silicon nitride or nitride
- Various ceramics such as aluminum and a polyimide or polyester base material which is a flexible base material may be used.
- a silicone gel, epoxy resin or urethane resin having a viscosity at room temperature of 8 Pa ⁇ s or less was used as the resin.
- other liquid thermosetting resins may be used.
- silicone rubber is used as the sealing resin
- silicone gel epoxy resin, phenol resin, acrylic resin, or other liquid thermosetting resin
- the sealing resin or the lid may not be omitted when the stress such as vibration, external force, exposure to contaminants is small.
- the casting of the sealing resin 60 may be a vacuum casting, or in order to increase the fluidity of the sealing resin 60, the casting may be performed by heating within a range that does not adversely affect the resin 40. .
- solder such as high-temperature solder
- brazing materials such as nano silver paste bonding material or silver brazing may be used as the solder.
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Abstract
Provided is a method for mounting electronic components in a resin sealing process for a mounting board on which a plurality of electronic components are mounted. According to the method for mounting electronic components, the electronic components can be reliably mounted on the mounting board without the occurrence of voids and filling defects and the size of the mounting board can be reduced. The method for mounting electronic components includes a step in which electronic components (30) arranged between injection sections for a resin (40) are joined to a wiring board (10) by using a joining material (50).
Description
本発明は、電子部品の実装方法および電子機器に関する。
The present invention relates to an electronic component mounting method and an electronic device.
配線基板に、抵抗、コンデンサ、コイル、あるいは半導体チップのような電子部品が実装される実装基板は、接続部を保護して絶縁信頼性を向上させ、電子部品から発生する熱の放熱性を向上することを目的として、一般的には接続部にアンダーフィル樹脂を注入する。この注入方法としては、電子部品が搭載された実装基板に、液状で低粘度のアンダーフィル樹脂を電子部品の周囲からディスペンサのニードルを用いて注入し、電子部品と配線基板との間隙、あるいは電子部品に接続されるリード間の隙間に毛細間現象や重力を利用して浸透させ、注入する方式が一般にとられている。
また、電子部品の近傍に、電子部品と配線基板との間隙へのアンダーフィル樹脂の流入を促すために流入促進部を設け、アンダーフィル樹脂を積極的に供給して毛細管現象により上記間隙への浸入を促すことが提案されている（例えば、特許文献１（第４－６頁、第１図）参照）。 A mounting board on which electronic components such as resistors, capacitors, coils, or semiconductor chips are mounted on the wiring board protects the connection parts, improves insulation reliability, and improves the heat dissipation of heat generated from the electronic parts For this purpose, generally, an underfill resin is injected into the connecting portion. In this injection method, a liquid, low-viscosity underfill resin is injected into the mounting substrate on which the electronic component is mounted from the periphery of the electronic component using a dispenser needle, and the gap between the electronic component and the wiring substrate, or the electronic In general, a method of infiltrating and injecting gaps between leads connected to components using a capillary phenomenon or gravity is generally used.
In addition, an inflow promoting portion is provided in the vicinity of the electronic component in order to promote the inflow of the underfill resin into the gap between the electronic component and the wiring board, and the underfill resin is positively supplied to the gap by the capillary phenomenon. It has been proposed to promote intrusion (see, for example, Patent Document 1 (page 4-6, FIG. 1)).
また、電子部品の近傍に、電子部品と配線基板との間隙へのアンダーフィル樹脂の流入を促すために流入促進部を設け、アンダーフィル樹脂を積極的に供給して毛細管現象により上記間隙への浸入を促すことが提案されている（例えば、特許文献１（第４－６頁、第１図）参照）。 A mounting board on which electronic components such as resistors, capacitors, coils, or semiconductor chips are mounted on the wiring board protects the connection parts, improves insulation reliability, and improves the heat dissipation of heat generated from the electronic parts For this purpose, generally, an underfill resin is injected into the connecting portion. In this injection method, a liquid, low-viscosity underfill resin is injected into the mounting substrate on which the electronic component is mounted from the periphery of the electronic component using a dispenser needle, and the gap between the electronic component and the wiring substrate, or the electronic In general, a method of infiltrating and injecting gaps between leads connected to components using a capillary phenomenon or gravity is generally used.
In addition, an inflow promoting portion is provided in the vicinity of the electronic component in order to promote the inflow of the underfill resin into the gap between the electronic component and the wiring board, and the underfill resin is positively supplied to the gap by the capillary phenomenon. It has been proposed to promote intrusion (see, for example, Patent Document 1 (page 4-6, FIG. 1)).
複数の電子部品を複数の列に配列して実装された実装基板にアンダーフィル樹脂を注入する際、複数の注入部からアンダーフィル樹脂が注入されると、他の電子部品の間に挟まれて配置された電子部品と実装基板との間隙にはアンダーフィル樹脂が複数の方向から浸入することになる。このような状況では、浸入するアンダーフィル樹脂に空気が挟まれて逃げ場がなくなり、該電子部品と配線基板との間隙にはボイドが生じやすくなる。
一方、電子機器の小型化の要求に伴い、実装基板面積をさらに縮小することが求められている。しかし、他の電子部品の間に挟まれて配置される電子部品は、アンダーフィル樹脂の細部への浸透を促すために実装基板上の多方に注入部を設け、アンダーフィル樹脂を積極的に供給する必要がある。このため、注入部が電子部品と干渉しない程度の間隔をとって電子部品を配列する必要があり、実装基板面積をさらに縮小することは困難となっている。また、多方からアンダーフィル樹脂を注入すると上記のように電子部品と配線基板との間隙にボイドが生じやすくなるといった問題が生じる。
本発明はこのような問題点に鑑みてなされたものであり、電子部品と配線基板との間隙にボイドが残留することを低減するとともに、実装基板面積をさらに縮小することを実現できる電子部品の実装方法および電子機器を提供することを目的とする。 When injecting underfill resin into a mounting board mounted with multiple electronic components arranged in multiple rows, if underfill resin is injected from multiple injection parts, it will be sandwiched between other electronic components Underfill resin permeates from a plurality of directions into the gap between the arranged electronic component and the mounting substrate. In such a situation, air enters between the infiltrating underfill resin and there is no escape space, and voids are likely to occur in the gap between the electronic component and the wiring board.
On the other hand, with the demand for downsizing of electronic devices, it is required to further reduce the mounting board area. However, for electronic components that are sandwiched between other electronic components, injecting portions are provided on many parts on the mounting board to promote the penetration of the underfill resin into details, and the underfill resin is actively supplied. There is a need to. For this reason, it is necessary to arrange the electronic components at intervals such that the injection portion does not interfere with the electronic components, and it is difficult to further reduce the mounting board area. In addition, when underfill resin is injected from many sources, there is a problem that voids are likely to be generated in the gap between the electronic component and the wiring board as described above.
The present invention has been made in view of such problems, and it is possible to reduce the amount of voids remaining in the gap between the electronic component and the wiring board and to further reduce the mounting board area. An object is to provide a mounting method and an electronic device.
一方、電子機器の小型化の要求に伴い、実装基板面積をさらに縮小することが求められている。しかし、他の電子部品の間に挟まれて配置される電子部品は、アンダーフィル樹脂の細部への浸透を促すために実装基板上の多方に注入部を設け、アンダーフィル樹脂を積極的に供給する必要がある。このため、注入部が電子部品と干渉しない程度の間隔をとって電子部品を配列する必要があり、実装基板面積をさらに縮小することは困難となっている。また、多方からアンダーフィル樹脂を注入すると上記のように電子部品と配線基板との間隙にボイドが生じやすくなるといった問題が生じる。
本発明はこのような問題点に鑑みてなされたものであり、電子部品と配線基板との間隙にボイドが残留することを低減するとともに、実装基板面積をさらに縮小することを実現できる電子部品の実装方法および電子機器を提供することを目的とする。 When injecting underfill resin into a mounting board mounted with multiple electronic components arranged in multiple rows, if underfill resin is injected from multiple injection parts, it will be sandwiched between other electronic components Underfill resin permeates from a plurality of directions into the gap between the arranged electronic component and the mounting substrate. In such a situation, air enters between the infiltrating underfill resin and there is no escape space, and voids are likely to occur in the gap between the electronic component and the wiring board.
On the other hand, with the demand for downsizing of electronic devices, it is required to further reduce the mounting board area. However, for electronic components that are sandwiched between other electronic components, injecting portions are provided on many parts on the mounting board to promote the penetration of the underfill resin into details, and the underfill resin is actively supplied. There is a need to. For this reason, it is necessary to arrange the electronic components at intervals such that the injection portion does not interfere with the electronic components, and it is difficult to further reduce the mounting board area. In addition, when underfill resin is injected from many sources, there is a problem that voids are likely to be generated in the gap between the electronic component and the wiring board as described above.
The present invention has been made in view of such problems, and it is possible to reduce the amount of voids remaining in the gap between the electronic component and the wiring board and to further reduce the mounting board area. An object is to provide a mounting method and an electronic device.
上記問題を解決するため、本発明は、次のように構成したのである。
請求項１に記載の発明は、第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、前記第１電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、を備えた電子部品の実装方法であって、前記第１電子部品および前記第２電子部品の各導電材を前記配線基板に半田により接続し、前記第３電子部品を接合材により前記配線基板に接合して、その導電材を前記配線基板に半田により接続する工程と、前記第１電子部品と前記第３電子部品との間、および前記第２電子部品と前記第３電子部品との間から前記樹脂を注入する工程と、を有するものである。
請求項２に記載の発明は、前記接合材は、シリコーン樹脂、エポキシ樹脂、アクリル樹脂、ポリエステル樹脂をベースとした樹脂組成物、または、半田、ロウ材、ナノ銀ペーストのいずれかとするものである。
請求項３に記載の発明は、前記接合材に含まれる充填材は、アルミナ、シリカ、窒化ホウ素、窒化ケイ素、窒化アルミニウム、または炭化ケイ素のいずれか少なくとも１つ以上を含むセラミック粉末、または、金、銀、銅、アルミニウム、または鉄のいずれか少なくとも１つ以上を含む金属粉末、または、炭素粉末、または、ガラス繊維、カーボン繊維、芳香族ポリアミド繊維、またはウイスカのいずれか少なくとも１つ以上を含む繊維のいずれか少なくとも１つ以上を含むものである。
請求項４に記載の発明は、第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、前記第１電子部品と前記配線基板、前記第２電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、を備えた電子部品の実装方法であって、前記第１電子部品および前記第２電子部品の導電材、およびそれらの導電材よりも長い前記第３電子部品の導電材を前記配線基板に半田により接続する工程と、ノズルを前記第３電子部品と前記配線基板との間隙に挿入して、前記樹脂を注入する工程と、を有するものである。
請求項５に記載の発明は、配線基板と、前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有する電子部品群と、前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、前記中央電子部品は、接合材により前記配線基板に直接接合されるものである。
請求項６に記載の発明は、配線基板と、前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有し、前記中央電子部品および周辺電子部品がそれぞれ導電材を介して前記配線基板に接続された電子部品群と、前記中央電子部品と前記配線基板、および前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、前記中央電子部品の導電材は、前記周辺電子部品の導電材よりも長く、前記中央電子部品と前記配線基板との間隙に前記樹脂を注入するノズルを挿入可能な間隔にしたものである。
請求項７に記載の発明は、前記電子部品は、コイル、コンデンサ、および抵抗を有し、ラインフィルタ機能を有するものである。
請求項８に記載の発明は、前記電子部品は、半導体チップ部品を有するものである。 In order to solve the above problem, the present invention is configured as follows.
According to a first aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted. An electronic component mounting method comprising: the first electronic component and the wiring board; and a resin injected into a gap between the third electronic component and the wiring board, the first electronic component and the wiring board Connecting each conductive material of the second electronic component to the wiring board by soldering, joining the third electronic component to the wiring board by a bonding material, and connecting the conductive material to the wiring board by solder; And a step of injecting the resin from between the first electronic component and the third electronic component and from between the second electronic component and the third electronic component.
According to a second aspect of the present invention, the bonding material is a resin composition based on a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, or a solder, a brazing material, or a nano silver paste. .
According to a third aspect of the present invention, the filler contained in the bonding material is a ceramic powder containing at least one of alumina, silica, boron nitride, silicon nitride, aluminum nitride, and silicon carbide, or gold Metal powder containing at least one of silver, copper, aluminum, or iron, carbon powder, glass fiber, carbon fiber, aromatic polyamide fiber, or whisker It includes at least one or more of fibers.
According to a fourth aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted. An electronic component mounting method comprising: the first electronic component and the wiring substrate; the second electronic component and the wiring substrate; and a resin injected into a gap between the third electronic component and the wiring substrate. Connecting the conductive material of the first electronic component and the second electronic component and the conductive material of the third electronic component longer than the conductive material to the wiring board by solder; And inserting the resin into a gap between the three electronic components and the wiring board.
According to a fifth aspect of the present invention, there is provided a wiring board, a single central electronic component disposed in the vicinity of 3 rows and 3 columns on the wiring board, and surrounding the central electronic component. An electronic component group having eight peripheral electronic components mounted thereon, and a resin injected into a gap between the peripheral electronic component and the wiring substrate, wherein the central electronic component is bonded to the wiring substrate by a bonding material It is directly joined to.
According to a sixth aspect of the present invention, there is provided a wiring board, and a single central electronic component disposed in the vicinity of the three rows and three columns on the wiring substrate, and surrounding the central electronic component. An electronic component group in which the central electronic component and the peripheral electronic component are each connected to the wiring board via a conductive material, the central electronic component and the wiring board, And a resin injected into a gap between the peripheral electronic component and the wiring board, and the conductive material of the central electronic component is longer than the conductive material of the peripheral electronic component, and the central electronic component and the wiring board The nozzle for injecting the resin into the gap is set at an interval in which the nozzle can be inserted.
According to a seventh aspect of the present invention, the electronic component includes a coil, a capacitor, and a resistor, and has a line filter function.
According to an eighth aspect of the present invention, the electronic component includes a semiconductor chip component.
請求項１に記載の発明は、第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、前記第１電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、を備えた電子部品の実装方法であって、前記第１電子部品および前記第２電子部品の各導電材を前記配線基板に半田により接続し、前記第３電子部品を接合材により前記配線基板に接合して、その導電材を前記配線基板に半田により接続する工程と、前記第１電子部品と前記第３電子部品との間、および前記第２電子部品と前記第３電子部品との間から前記樹脂を注入する工程と、を有するものである。
請求項２に記載の発明は、前記接合材は、シリコーン樹脂、エポキシ樹脂、アクリル樹脂、ポリエステル樹脂をベースとした樹脂組成物、または、半田、ロウ材、ナノ銀ペーストのいずれかとするものである。
請求項３に記載の発明は、前記接合材に含まれる充填材は、アルミナ、シリカ、窒化ホウ素、窒化ケイ素、窒化アルミニウム、または炭化ケイ素のいずれか少なくとも１つ以上を含むセラミック粉末、または、金、銀、銅、アルミニウム、または鉄のいずれか少なくとも１つ以上を含む金属粉末、または、炭素粉末、または、ガラス繊維、カーボン繊維、芳香族ポリアミド繊維、またはウイスカのいずれか少なくとも１つ以上を含む繊維のいずれか少なくとも１つ以上を含むものである。
請求項４に記載の発明は、第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、前記第１電子部品と前記配線基板、前記第２電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、を備えた電子部品の実装方法であって、前記第１電子部品および前記第２電子部品の導電材、およびそれらの導電材よりも長い前記第３電子部品の導電材を前記配線基板に半田により接続する工程と、ノズルを前記第３電子部品と前記配線基板との間隙に挿入して、前記樹脂を注入する工程と、を有するものである。
請求項５に記載の発明は、配線基板と、前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有する電子部品群と、前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、前記中央電子部品は、接合材により前記配線基板に直接接合されるものである。
請求項６に記載の発明は、配線基板と、前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有し、前記中央電子部品および周辺電子部品がそれぞれ導電材を介して前記配線基板に接続された電子部品群と、前記中央電子部品と前記配線基板、および前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、前記中央電子部品の導電材は、前記周辺電子部品の導電材よりも長く、前記中央電子部品と前記配線基板との間隙に前記樹脂を注入するノズルを挿入可能な間隔にしたものである。
請求項７に記載の発明は、前記電子部品は、コイル、コンデンサ、および抵抗を有し、ラインフィルタ機能を有するものである。
請求項８に記載の発明は、前記電子部品は、半導体チップ部品を有するものである。 In order to solve the above problem, the present invention is configured as follows.
According to a first aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted. An electronic component mounting method comprising: the first electronic component and the wiring board; and a resin injected into a gap between the third electronic component and the wiring board, the first electronic component and the wiring board Connecting each conductive material of the second electronic component to the wiring board by soldering, joining the third electronic component to the wiring board by a bonding material, and connecting the conductive material to the wiring board by solder; And a step of injecting the resin from between the first electronic component and the third electronic component and from between the second electronic component and the third electronic component.
According to a second aspect of the present invention, the bonding material is a resin composition based on a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, or a solder, a brazing material, or a nano silver paste. .
According to a third aspect of the present invention, the filler contained in the bonding material is a ceramic powder containing at least one of alumina, silica, boron nitride, silicon nitride, aluminum nitride, and silicon carbide, or gold Metal powder containing at least one of silver, copper, aluminum, or iron, carbon powder, glass fiber, carbon fiber, aromatic polyamide fiber, or whisker It includes at least one or more of fibers.
According to a fourth aspect of the present invention, there is provided a wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted. An electronic component mounting method comprising: the first electronic component and the wiring substrate; the second electronic component and the wiring substrate; and a resin injected into a gap between the third electronic component and the wiring substrate. Connecting the conductive material of the first electronic component and the second electronic component and the conductive material of the third electronic component longer than the conductive material to the wiring board by solder; And inserting the resin into a gap between the three electronic components and the wiring board.
According to a fifth aspect of the present invention, there is provided a wiring board, a single central electronic component disposed in the vicinity of 3 rows and 3 columns on the wiring board, and surrounding the central electronic component. An electronic component group having eight peripheral electronic components mounted thereon, and a resin injected into a gap between the peripheral electronic component and the wiring substrate, wherein the central electronic component is bonded to the wiring substrate by a bonding material It is directly joined to.
According to a sixth aspect of the present invention, there is provided a wiring board, and a single central electronic component disposed in the vicinity of the three rows and three columns on the wiring substrate, and surrounding the central electronic component. An electronic component group in which the central electronic component and the peripheral electronic component are each connected to the wiring board via a conductive material, the central electronic component and the wiring board, And a resin injected into a gap between the peripheral electronic component and the wiring board, and the conductive material of the central electronic component is longer than the conductive material of the peripheral electronic component, and the central electronic component and the wiring board The nozzle for injecting the resin into the gap is set at an interval in which the nozzle can be inserted.
According to a seventh aspect of the present invention, the electronic component includes a coil, a capacitor, and a resistor, and has a line filter function.
According to an eighth aspect of the present invention, the electronic component includes a semiconductor chip component.
請求項１に記載の発明によれば、複数の電子部品の間に配置される電子部品は、接合材により配線基板に接合され電子部品と配線基板間の間隙がなくなる。このため、樹脂を浸透させる必要がなく、ボイドが生じる現象を防止することができる。また、樹脂の注入部を最小限に抑えることができるようになるため、電子部品間を狭めた配置構成が可能となり、実装基板面積をさらに縮小することができる。
請求項２記載の発明によれば、配線基板に接合される電子部品との接合力を向上することができる。また、熱伝導が良好な接合材を使用することにより、発熱する電子部品からの放熱性を改善することも可能になる。
請求項３記載の発明によれば、請求項２と同様の接合力の向上が期待できるとともに、さらに放熱性を改善する効果が得られる。
請求項４に記載の発明によれば、複数の電子部品の間に配置される電子部品は、配線基板との間隙の間隔が大きくなり、樹脂を注入するノズルを挿入できるようになるため、樹脂の注入が容易になり、ボイドが生じる現象を大幅に低減することができる。また、樹脂の注入部を最小限に抑えることができるようになるため、電子部品間を狭めた配置構成が可能となり、実装基板面積をさらに縮小することができる。
請求項５に記載の発明によれば、樹脂中のボイドの発生を大幅に低減した小型の電子機器を提供することができる。
請求項６に記載の発明によれば、樹脂の注入作業が容易で、樹脂中のボイドの発生を大幅に低減した小型の電子機器を提供することができる。
請求項７に記載の発明によれば、信頼性の高い小型のラインフィルタ機能を有する電子機器を提供することができる。
請求項８に記載の発明によれば、信頼性の高い小型の半導体チップを備えた電子機器を提供することができる。 According to the first aspect of the present invention, the electronic component disposed between the plurality of electronic components is bonded to the wiring board by the bonding material, and the gap between the electronic component and the wiring board is eliminated. For this reason, it is not necessary to permeate the resin, and a phenomenon in which a void is generated can be prevented. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
According to the second aspect of the present invention, it is possible to improve the bonding force with the electronic component bonded to the wiring board. In addition, by using a bonding material having good heat conduction, it is possible to improve heat dissipation from the electronic parts that generate heat.
According to the third aspect of the invention, it is possible to expect an improvement in the joining force similar to that of the second aspect, and it is possible to obtain an effect of further improving the heat dissipation.
According to the fourth aspect of the present invention, the electronic component disposed between the plurality of electronic components has a large gap with the wiring board and can insert a nozzle for injecting the resin. Can be easily injected, and the phenomenon of voids can be greatly reduced. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
According to the fifth aspect of the present invention, it is possible to provide a small electronic device in which the generation of voids in the resin is significantly reduced.
According to the sixth aspect of the present invention, it is possible to provide a small electronic device in which resin injection is easy and generation of voids in the resin is greatly reduced.
According to invention of Claim 7, the electronic device which has a highly reliable small line filter function can be provided.
According to invention of Claim 8, the electronic device provided with the small semiconductor chip with high reliability can be provided.
請求項２記載の発明によれば、配線基板に接合される電子部品との接合力を向上することができる。また、熱伝導が良好な接合材を使用することにより、発熱する電子部品からの放熱性を改善することも可能になる。
請求項３記載の発明によれば、請求項２と同様の接合力の向上が期待できるとともに、さらに放熱性を改善する効果が得られる。
請求項４に記載の発明によれば、複数の電子部品の間に配置される電子部品は、配線基板との間隙の間隔が大きくなり、樹脂を注入するノズルを挿入できるようになるため、樹脂の注入が容易になり、ボイドが生じる現象を大幅に低減することができる。また、樹脂の注入部を最小限に抑えることができるようになるため、電子部品間を狭めた配置構成が可能となり、実装基板面積をさらに縮小することができる。
請求項５に記載の発明によれば、樹脂中のボイドの発生を大幅に低減した小型の電子機器を提供することができる。
請求項６に記載の発明によれば、樹脂の注入作業が容易で、樹脂中のボイドの発生を大幅に低減した小型の電子機器を提供することができる。
請求項７に記載の発明によれば、信頼性の高い小型のラインフィルタ機能を有する電子機器を提供することができる。
請求項８に記載の発明によれば、信頼性の高い小型の半導体チップを備えた電子機器を提供することができる。 According to the first aspect of the present invention, the electronic component disposed between the plurality of electronic components is bonded to the wiring board by the bonding material, and the gap between the electronic component and the wiring board is eliminated. For this reason, it is not necessary to permeate the resin, and a phenomenon in which a void is generated can be prevented. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
According to the second aspect of the present invention, it is possible to improve the bonding force with the electronic component bonded to the wiring board. In addition, by using a bonding material having good heat conduction, it is possible to improve heat dissipation from the electronic parts that generate heat.
According to the third aspect of the invention, it is possible to expect an improvement in the joining force similar to that of the second aspect, and it is possible to obtain an effect of further improving the heat dissipation.
According to the fourth aspect of the present invention, the electronic component disposed between the plurality of electronic components has a large gap with the wiring board and can insert a nozzle for injecting the resin. Can be easily injected, and the phenomenon of voids can be greatly reduced. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed is possible, and the mounting substrate area can be further reduced.
According to the fifth aspect of the present invention, it is possible to provide a small electronic device in which the generation of voids in the resin is significantly reduced.
According to the sixth aspect of the present invention, it is possible to provide a small electronic device in which resin injection is easy and generation of voids in the resin is greatly reduced.
According to invention of Claim 7, the electronic device which has a highly reliable small line filter function can be provided.
According to invention of Claim 8, the electronic device provided with the small semiconductor chip with high reliability can be provided.
以下、本発明の第１の実施形態について図を参照して説明する。
図１（ａ）は、本発明の第１の実施形態を示す電子部品の実装構造の上面図であり、図１（ｂ）は、図１（ａ）のα－α´線に沿った横断面図である。図において、１０はアルミナを基材とし、主面にランドパターンを施した配線基板、２０はガラス繊維等を充填したポリフェニレンスルフィド樹脂で形成されたケース、２１はケース２０の上部を塞ぐようにガラス繊維等を充填したポリフェニレンスルフィド樹脂で形成された蓋、３０は電子部品、３１は導電材のリードであり、配線基板１０に設けられたランドパターンのパッドに半田で接合されることにより、電子部品３０と配線基板１０を電気的にかつ機械的に接続する。なお、導電材としては、半田ボールのような導電性の半田により形成されるもの、またはその他の金属を含む導電性材料で形成されるものであっても良い。また、４０は電子部品３０と配線基板１０の主面との間隙、および各リード３１間の間隙に注入される樹脂、５０は電子部品３０を配線基板上に接合する接合材、６０は樹脂４０を注入・硬化させた後、ケース２０内の残空間全体に封入される封止樹脂である。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is a top view of the electronic component mounting structure showing the first embodiment of the present invention, and FIG. 1B is a cross-section taken along the line α-α ′ in FIG. FIG. In the figure, 10 is a wiring board having alumina as a base material and a land pattern on the main surface, 20 is a case made of polyphenylene sulfide resin filled with glass fibers and the like, and 21 is glass so as to close the upper part of thecase 20. A lid formed of a polyphenylene sulfide resin filled with fibers, 30 is an electronic component, 31 is a lead of a conductive material, and is bonded to a land pattern pad provided on the wiring board 10 by soldering. 30 and the wiring board 10 are electrically and mechanically connected. Note that the conductive material may be formed of a conductive solder such as a solder ball or a conductive material containing other metals. Reference numeral 40 denotes a resin injected into the gap between the electronic component 30 and the main surface of the wiring board 10 and the gap between the leads 31, 50 denotes a bonding material for bonding the electronic component 30 onto the wiring board, and 60 denotes the resin 40. After being injected and cured, the sealing resin is sealed in the entire remaining space in the case 20.
図１（ａ）は、本発明の第１の実施形態を示す電子部品の実装構造の上面図であり、図１（ｂ）は、図１（ａ）のα－α´線に沿った横断面図である。図において、１０はアルミナを基材とし、主面にランドパターンを施した配線基板、２０はガラス繊維等を充填したポリフェニレンスルフィド樹脂で形成されたケース、２１はケース２０の上部を塞ぐようにガラス繊維等を充填したポリフェニレンスルフィド樹脂で形成された蓋、３０は電子部品、３１は導電材のリードであり、配線基板１０に設けられたランドパターンのパッドに半田で接合されることにより、電子部品３０と配線基板１０を電気的にかつ機械的に接続する。なお、導電材としては、半田ボールのような導電性の半田により形成されるもの、またはその他の金属を含む導電性材料で形成されるものであっても良い。また、４０は電子部品３０と配線基板１０の主面との間隙、および各リード３１間の間隙に注入される樹脂、５０は電子部品３０を配線基板上に接合する接合材、６０は樹脂４０を注入・硬化させた後、ケース２０内の残空間全体に封入される封止樹脂である。 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is a top view of the electronic component mounting structure showing the first embodiment of the present invention, and FIG. 1B is a cross-section taken along the line α-α ′ in FIG. FIG. In the figure, 10 is a wiring board having alumina as a base material and a land pattern on the main surface, 20 is a case made of polyphenylene sulfide resin filled with glass fibers and the like, and 21 is glass so as to close the upper part of the
以下、本実施形態における実装方法ついて、（１）電子部品の接続工程、（２）樹脂注入工程を各工程毎に説明する。
Hereinafter, the mounting method according to the present embodiment will be described for each step of (1) an electronic component connection step and (2) a resin injection step.
（１）電子部品の接続工程
厚さ１ｍｍのアルミナを基材とし、主面に銅箔厚さ２００μｍのランドパターンを施した配線基板を用い、図１（ａ）および以下に示すように、９個（３０Ｘ1～3、３０Ｙ1～3、３０Ｚ1～3）の設置面が略矩形形状で、隣合う２辺の寸法が１０～２０ｍｍ程度の電子部品３０を配線基板１０の主面上に３列に各３個ずつ従来よりも狭い１ｍｍ間隔で配置し、各電子部品３０に付属する各リード３１を配線基板１０の主面上に形成された銅のランドパターンに半田を用いて接続した。
・１列目の電子部品（図中左側列）：３０Ｘ1、３０Ｘ2、３０Ｘ3
・２列目の電子部品（図中中央列）：３０Ｙ1、３０Ｙ2、３０Ｙ3
・３列目の電子部品（図中右側列）：３０Ｚ1、３０Ｚ2、３０Ｚ3
また、各列における各電子部品３０と配線基板１０との接続は下記Ｉ）～ＩＩＩ）の条件で行った。ＩＩ）およびＩＩＩ）で使用した接合材５０を表１に示す。なお、Ｉ）～ＩＩＩ）の工程は条件により順番を変更しても特に問題はない。
Ｉ）１列目の電子部品３０Ｘ1～3および３列目の電子部品３０Ｚ1～3について
配線基板１０の主面との間隔が０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する。
ＩＩ）２列目（図中中央列）の中央の電子部品３０Ｙ2について
接合材５０により配線基板１０の主面上に接合部分の厚さが約０．１ｍｍになるように接合し、その後リード３１を配線基板１０と半田で接続する。
ＩＩＩ）２列目（図中中央列）の電子部品３０Ｙ1および３０Ｙ3について
前記Ｉ）と同様に、配線基板１０の主面との間隔を０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続するものと、前記ＩＩ）と同様に、接合材５０により配線基板１０の主面上接合部分の厚さが約０．１ｍｍになるように接合し、その後リード３１を配線基板１０と半田で接続するものの両方を製作する。 (1) Electronic component connection process Using a wiring board having a 1 mm thick alumina as a base material and a land pattern having a copper foil thickness of 200 μm on the main surface, as shown in FIG. On the main surface of thewiring board 10, an electronic component 30 having a substantially rectangular shape on the installation surface (30X 1 to 3 , 30Y 1 to 3 , 30Z 1 to 3 ) and the adjacent two sides of about 10 to 20 mm is provided. Three each in three rows are arranged at 1 mm intervals narrower than before, and each lead 31 attached to each electronic component 30 is connected to a copper land pattern formed on the main surface of the wiring board 10 using solder. .
-Electronic components in the first row (left column in the figure): 30X 1 , 30X 2 , 30X 3
Second-row electronic components (center row in the figure): 30Y 1 , 30Y 2 , 30Y 3
・ Electronic components in the third row (right column in the figure): 30Z 1 , 30Z 2 , 30Z 3
The connection between eachelectronic component 30 and the wiring board 10 in each row was performed under the following conditions I) to III). Table 1 shows the bonding material 50 used in II) and III). Note that there is no particular problem even if the order of steps I) to III) is changed depending on conditions.
I) About the electronic components 30X 1 to 3 in the first row and the electronic components 30Z 1 to 3 in the third row Each lead attached to theelectronic component 30 so that the distance from the main surface of the wiring board 10 is 0.4 mm. The length 31 is arbitrarily set and connected to the wiring board 10 with solder.
II) About the electronic component 30Y 2 in the center of the second row (the center row in the figure), the joiningmaterial 50 is joined to the main surface of the wiring board 10 so that the thickness of the joining portion is about 0.1 mm, and then the lead 31 is connected to the wiring board 10 by soldering.
III) Electronic components 30Y 1 and 30Y 3 in the second row (center row in the figure) As with I), the electronic components 30Y 1 and 30Y 3 are attached to theelectronic component 30 so that the distance from the main surface of the wiring board 10 is 0.4 mm. The length of each lead 31 to be set is arbitrarily set and connected to the wiring board 10 by soldering, and the thickness of the bonding portion on the main surface of the wiring board 10 is about 0 by the bonding material 50, similar to the above II). Bonding is performed to 1 mm, and then both the lead 31 and the wiring board 10 are connected by soldering.
厚さ１ｍｍのアルミナを基材とし、主面に銅箔厚さ２００μｍのランドパターンを施した配線基板を用い、図１（ａ）および以下に示すように、９個（３０Ｘ1～3、３０Ｙ1～3、３０Ｚ1～3）の設置面が略矩形形状で、隣合う２辺の寸法が１０～２０ｍｍ程度の電子部品３０を配線基板１０の主面上に３列に各３個ずつ従来よりも狭い１ｍｍ間隔で配置し、各電子部品３０に付属する各リード３１を配線基板１０の主面上に形成された銅のランドパターンに半田を用いて接続した。
・１列目の電子部品（図中左側列）：３０Ｘ1、３０Ｘ2、３０Ｘ3
・２列目の電子部品（図中中央列）：３０Ｙ1、３０Ｙ2、３０Ｙ3
・３列目の電子部品（図中右側列）：３０Ｚ1、３０Ｚ2、３０Ｚ3
また、各列における各電子部品３０と配線基板１０との接続は下記Ｉ）～ＩＩＩ）の条件で行った。ＩＩ）およびＩＩＩ）で使用した接合材５０を表１に示す。なお、Ｉ）～ＩＩＩ）の工程は条件により順番を変更しても特に問題はない。
Ｉ）１列目の電子部品３０Ｘ1～3および３列目の電子部品３０Ｚ1～3について
配線基板１０の主面との間隔が０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する。
ＩＩ）２列目（図中中央列）の中央の電子部品３０Ｙ2について
接合材５０により配線基板１０の主面上に接合部分の厚さが約０．１ｍｍになるように接合し、その後リード３１を配線基板１０と半田で接続する。
ＩＩＩ）２列目（図中中央列）の電子部品３０Ｙ1および３０Ｙ3について
前記Ｉ）と同様に、配線基板１０の主面との間隔を０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続するものと、前記ＩＩ）と同様に、接合材５０により配線基板１０の主面上接合部分の厚さが約０．１ｍｍになるように接合し、その後リード３１を配線基板１０と半田で接続するものの両方を製作する。 (1) Electronic component connection process Using a wiring board having a 1 mm thick alumina as a base material and a land pattern having a copper foil thickness of 200 μm on the main surface, as shown in FIG. On the main surface of the
-Electronic components in the first row (left column in the figure): 30X 1 , 30X 2 , 30X 3
Second-row electronic components (center row in the figure): 30Y 1 , 30Y 2 , 30Y 3
・ Electronic components in the third row (right column in the figure): 30Z 1 , 30Z 2 , 30Z 3
The connection between each
I) About the electronic components 30X 1 to 3 in the first row and the electronic components 30Z 1 to 3 in the third row Each lead attached to the
II) About the electronic component 30Y 2 in the center of the second row (the center row in the figure), the joining
III) Electronic components 30Y 1 and 30Y 3 in the second row (center row in the figure) As with I), the electronic components 30Y 1 and 30Y 3 are attached to the
（２）樹脂注入工程
樹脂４０を注入するノズル７０は、武蔵エンジニアリング製のディスペンサ（ＳＨＯＴｍｉｎｉＳＬ、ＳｕｐｅｒΣＸ－Ｖ２：図示せず）のニードルを用い、図１（ａ）および以下に示す注入パターンＩと注入パターンＩＩの２通りのパターンにより樹脂を注入して硬化させた。なお、樹脂の注入工程は全て室温下で行った。
〔注入パターンＩ〕
１列目の電子部品３０Ｘ1～3と２列目電子部品３０Ｙ1～3の間をＡ１→Ａ２の地点をノズル７０から樹脂４０を吐出させながら移動させ、次に２列目の電子部品３０Ｙ1～3と３列目の電子部品３０Ｚ1～3の間をＡ３→Ａ４の地点をノズル７０から樹脂４０を吐出させながら移動させた。これを樹脂４０がリード３１を覆う高さに設定された所定の注入量に到達するまで繰り返し、前述のように毛細管現象や重力を利用して各部間に浸透させた。
〔注入パターンＩＩ〕
中央の電子部品３０Ｙ2の周囲をＢ１→Ｂ２→Ｂ３→Ｂ４→Ｂ１の順にノズル７０から樹脂４０を吐出させながら、樹脂４０がリード３１を覆う高さに設定された所定の注入量に到達するまで移動を繰り返し、各電子部品３０と配線基板１０との間隙および各リード３１間に、毛細管現象や重力を利用して細部に浸透させた。 (2) Resin Injecting Step Thenozzle 70 for injecting the resin 40 uses the needle of a dispenser (SHOTminiSL, SuperΣX-V2: not shown) manufactured by Musashi Engineering, and injects the injection pattern I shown in FIG. Resin was injected and cured in two patterns, Pattern II. All resin injection steps were performed at room temperature.
[Injection pattern I]
Between the electronic components 30X 1 to 3 of thefirst row 30 and the electronic components 30Y 1 to 3 of the second row, the point A1 → A2 is moved while discharging the resin 40 from the nozzle 70, and then the electronic component 30Y of the second row between 1-3 and the third column of the electronic component 30Z 1-3 was a point A3 → A4 is moved while discharging the resin 40 from the nozzle 70. This was repeated until the resin 40 reached a predetermined injection amount set at a height covering the lead 31, and as described above, the resin 40 was infiltrated between the respective parts using capillary action or gravity.
[Infusion pattern II]
While discharging theresin 40 from the nozzle 70 around the electronic component 30Y 2 in the center in the order of B1 → B2 → B3 → B4 → B1, the resin 40 reaches a predetermined injection amount set at a height to cover the lead 31 The movement was repeated until the gap between each electronic component 30 and the wiring board 10 and between each lead 31 was infiltrated into details using capillary action or gravity.
樹脂４０を注入するノズル７０は、武蔵エンジニアリング製のディスペンサ（ＳＨＯＴｍｉｎｉＳＬ、ＳｕｐｅｒΣＸ－Ｖ２：図示せず）のニードルを用い、図１（ａ）および以下に示す注入パターンＩと注入パターンＩＩの２通りのパターンにより樹脂を注入して硬化させた。なお、樹脂の注入工程は全て室温下で行った。
〔注入パターンＩ〕
１列目の電子部品３０Ｘ1～3と２列目電子部品３０Ｙ1～3の間をＡ１→Ａ２の地点をノズル７０から樹脂４０を吐出させながら移動させ、次に２列目の電子部品３０Ｙ1～3と３列目の電子部品３０Ｚ1～3の間をＡ３→Ａ４の地点をノズル７０から樹脂４０を吐出させながら移動させた。これを樹脂４０がリード３１を覆う高さに設定された所定の注入量に到達するまで繰り返し、前述のように毛細管現象や重力を利用して各部間に浸透させた。
〔注入パターンＩＩ〕
中央の電子部品３０Ｙ2の周囲をＢ１→Ｂ２→Ｂ３→Ｂ４→Ｂ１の順にノズル７０から樹脂４０を吐出させながら、樹脂４０がリード３１を覆う高さに設定された所定の注入量に到達するまで移動を繰り返し、各電子部品３０と配線基板１０との間隙および各リード３１間に、毛細管現象や重力を利用して細部に浸透させた。 (2) Resin Injecting Step The
[Injection pattern I]
Between the electronic components 30X 1 to 3 of the
[Infusion pattern II]
While discharging the
その後、樹脂４０を覆うように封止樹脂６０をケース２０の内部にポッティングして加熱硬化させ、ケース２０の上部に蓋２１を固定した。
After that, the sealing resin 60 was potted inside the case 20 so as to cover the resin 40 and cured by heating, and the lid 21 was fixed to the upper part of the case 20.
なお、本実施例における樹脂４０、接合材５０、封止樹脂６０は表１に示す材料を使用した。表中に示される粘度は東機産業製のＥ型（ＥＭＤ型）粘度計を使用し、１°３４’×Ｒ２４ロータまたは３°×Ｒ９．７ロータでの測定値である。
In addition, the material shown in Table 1 was used for the resin 40, the bonding material 50, and the sealing resin 60 in this example. The viscosities shown in the table are measured values with a 1 ° 34 '× R24 rotor or 3 ° × R9.7 rotor using an E type (EMD type) viscometer manufactured by Toki Sangyo.
次に、上記工程により作製した実装基板の２列目（図中中央列）に配置された電子部品３０Ｙ1～3について、配線基板との空隙に注入された樹脂中のボイドの発生の有無を検証した結果について説明する。
本検証は、超音波探傷装置を用い、配線基板の実装面の裏側の面から超音波を照射して、その反射波を検知することによりボイドの存在の有無を確認した。なお、超音波周波数は５０ＭＨｚ（焦点１２ｍｍ）とした。
実施例および比較例の検証結果を表２に示す。比較例は、実施例と同様に配線基板１０の主面上に３列に各３個ずつ合計９個配置される電子部品３０を、全て配線基板１０の主面との間隔が０．４ｍｍとなるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する条件で作製したものであり、材質およびその他の条件は実施例と同様である。
表２中の検証結果について、○はボイドが無い、または注入不良が確認されなかったことを示しており、×はボイドが有る、または注入不良が確認されたことを示している。
実施例の検証＃１～＃３について、いずれもボイドおよび注入不良は認められず、樹脂４０の注入状況は良好であった。一方、比較例の検証＃１および＃２では、中央の電子部品３０Ｙ2において、注入パターンＩおよびＩＩのいずれにおいてもボイドが確認された。 Next, with respect to the electronic components 30Y 1 to 30Y 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process, whether or not voids are generated in the resin injected into the gap with the wiring board is checked. The verified result will be described.
In this verification, an ultrasonic flaw detector was used to irradiate ultrasonic waves from the back side of the mounting surface of the wiring board, and the presence of voids was confirmed by detecting the reflected waves. The ultrasonic frequency was 50 MHz (focal point 12 mm).
Table 2 shows the verification results of the examples and comparative examples. In the comparative example, a total of nineelectronic components 30 arranged in three rows in three rows on the main surface of the wiring board 10 in the same manner as in the example, the distance from the main surface of the wiring board 10 is 0.4 mm. As described above, the length of each lead 31 attached to the electronic component 30 is arbitrarily set, and the lead 31 is manufactured under the condition of being connected to the wiring board 10 by soldering. The material and other conditions are the same as in the embodiment. .
Regarding the verification results in Table 2, “◯” indicates that there is no void or no injection failure has been confirmed, and “x” indicates that there is a void or injection failure has been confirmed.
Regarding the verifications # 1 to # 3 of the examples, no voids and poor injection were observed, and the injection state of theresin 40 was good. On the other hand, the verification # 1 and # 2 of the comparative example, in the center of the electronic component 30Y 2, voids in any of injection patterns I and II was confirmed.
本検証は、超音波探傷装置を用い、配線基板の実装面の裏側の面から超音波を照射して、その反射波を検知することによりボイドの存在の有無を確認した。なお、超音波周波数は５０ＭＨｚ（焦点１２ｍｍ）とした。
実施例および比較例の検証結果を表２に示す。比較例は、実施例と同様に配線基板１０の主面上に３列に各３個ずつ合計９個配置される電子部品３０を、全て配線基板１０の主面との間隔が０．４ｍｍとなるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する条件で作製したものであり、材質およびその他の条件は実施例と同様である。
表２中の検証結果について、○はボイドが無い、または注入不良が確認されなかったことを示しており、×はボイドが有る、または注入不良が確認されたことを示している。
実施例の検証＃１～＃３について、いずれもボイドおよび注入不良は認められず、樹脂４０の注入状況は良好であった。一方、比較例の検証＃１および＃２では、中央の電子部品３０Ｙ2において、注入パターンＩおよびＩＩのいずれにおいてもボイドが確認された。 Next, with respect to the electronic components 30Y 1 to 30Y 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process, whether or not voids are generated in the resin injected into the gap with the wiring board is checked. The verified result will be described.
In this verification, an ultrasonic flaw detector was used to irradiate ultrasonic waves from the back side of the mounting surface of the wiring board, and the presence of voids was confirmed by detecting the reflected waves. The ultrasonic frequency was 50 MHz (focal point 12 mm).
Table 2 shows the verification results of the examples and comparative examples. In the comparative example, a total of nine
Regarding the verification results in Table 2, “◯” indicates that there is no void or no injection failure has been confirmed, and “x” indicates that there is a void or injection failure has been confirmed.
Regarding the verifications # 1 to # 3 of the examples, no voids and poor injection were observed, and the injection state of the
また、樹脂４０について、表１以外に表３に示す樹脂４０についても本実施例の実装方法により、注入パターンＩにおいて上記と同様の検証を行ったところ、ボイドが無い、または注入不良が確認されず、良好な注入状況であることを確認した。
Further, with respect to the resin 40, the resin 40 shown in Table 3 in addition to Table 1 was also verified in the implantation pattern I by the mounting method of this example, and as a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
さらに、接合材５０について、表１以外に表４に示す材質についても本実施例の実装方法により、注入パターンＩにおいて上記と同様の検証を行ったところ、ボイドが無い、または注入不良が確認されず、良好な注入状況であることを確認した。
Further, with respect to the bonding material 50, the materials shown in Table 4 in addition to Table 1 were also verified in the same manner as described above in the implantation pattern I by the mounting method of this example. As a result, no voids or poor implantation was confirmed. It was confirmed that the injection situation was good.
このように、複数の電子部品の間に配置される電子部品を接合材で配線基板に接合することにより、樹脂の注入時に電子部品と配線基板との間隙にボイドが生じる現象を防止し、樹脂を良好な状態で注入することができた。また、樹脂の注入部を最小限に抑えることができるようになるため、電子部品間を狭めた配置構成が可能となり、実装基板面積を従来よりも縮小することができた。
In this way, by bonding electronic components arranged between a plurality of electronic components to a wiring board with a bonding material, a phenomenon that voids are generated in the gap between the electronic component and the wiring board at the time of resin injection is prevented. Could be injected in good condition. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed becomes possible, and the mounting substrate area can be reduced as compared with the conventional case.
上記の実装方法により、コイル、コンデンサ、および抵抗を配置してラインフィルタ機能を有する実装基板を構成することもでき、上記と同様の効果が得られる。また、発熱量の大きい抵抗を接合材で配線基板に接合することにより、配線基板への熱伝導を促し、放熱性を向上することができる。さらに、接合材を表４に示す材質またはその他の材質において、熱伝導率の良好な材質を選択することにより、さらに放熱性を改善する効果が期待できる。
By the mounting method described above, a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained. In addition, by bonding a resistor having a large amount of heat generation to the wiring board with a bonding material, heat conduction to the wiring board can be promoted, and heat dissipation can be improved. Furthermore, the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
一方、上記の実装方法により、ベアチップ部品が配線基板に実装された半導体装置を構成することもでき、上記と同様の効果が得られる。また、高温下で使用されるＳｉＣやＧａＮなどを用いた発熱量の大きい半導体チップを接合材で配線基板に接合することにより、配線基板への熱伝導を促し、放熱性を向上することができる。さらに、接合材を表４に示す材質またはその他の材質において、熱伝導率の良好な材質を選択することにより、さらに放熱性を改善する効果が期待できる。
On the other hand, a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the mounting method described above, and the same effects as described above can be obtained. Also, by joining a semiconductor chip with a large calorific value using SiC, GaN, etc. used at high temperature to the wiring board with a bonding material, heat conduction to the wiring board can be promoted and heat dissipation can be improved. . Furthermore, the effect which improves heat dissipation is expectable by selecting a material with favorable thermal conductivity in the material shown in Table 4, or another material as a joining material.
なお、中央の電子部品底面と基板を接合する接合材として、各種樹脂をベースに無充填または各種の無機充填材、あるいはガラスクロスを含む接着剤を用いたが、アルキド樹脂、フェノール樹脂、またはセルロース樹脂をベースとした接着剤を用いても良く、充填材に、炭素繊維または芳香族ポリアミド繊維などの各種繊維、鉄粉または金粉などの各種金属粉、窒化ホウ素、窒化ケイ素、窒化アルミニウムまたは炭化ケイ素などの各種セラミック粉末、窒化ホウ素ウイスカなどの各種ウイスカを充填したものを用いても良い。
In addition, as a bonding material for bonding the bottom surface of the electronic component and the substrate at the center, an adhesive containing unfilled or various inorganic fillers or glass cloth based on various resins was used, but alkyd resin, phenolic resin, or cellulose Adhesives based on resin may be used, and fillers include various fibers such as carbon fiber or aromatic polyamide fiber, various metal powders such as iron powder or gold powder, boron nitride, silicon nitride, aluminum nitride or silicon carbide. Various ceramic powders such as those filled with various whiskers such as boron nitride whiskers may be used.
次に、本発明の第２の実施形態について説明する。図２（ａ）は、本発明の第２の実施形態を示す電子部品の実装構造の斜視図であり、図２（ｂ）は、図２（ａ）のβ－β´線に沿った横断面図である。図において、７０は樹脂を注入するノズルを示している。なお、第１の実施形態と共通するものについては説明を省略する。
以下、本実施形態における実装方法ついて、（１）電子部品の接続工程、（２）樹脂注入工程を各工程毎に説明する。 Next, a second embodiment of the present invention will be described. FIG. 2A is a perspective view of the electronic component mounting structure showing the second embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line β-β ′ in FIG. FIG. In the figure,reference numeral 70 denotes a nozzle for injecting resin. Note that a description of what is common to the first embodiment will be omitted.
Hereinafter, the mounting method according to the present embodiment will be described for each step of (1) electronic component connection step and (2) resin injection step.
以下、本実施形態における実装方法ついて、（１）電子部品の接続工程、（２）樹脂注入工程を各工程毎に説明する。 Next, a second embodiment of the present invention will be described. FIG. 2A is a perspective view of the electronic component mounting structure showing the second embodiment of the present invention, and FIG. 2B is a cross-sectional view taken along the line β-β ′ in FIG. FIG. In the figure,
Hereinafter, the mounting method according to the present embodiment will be described for each step of (1) electronic component connection step and (2) resin injection step.
（１）電子部品の接続工程
厚さ１ｍｍのアルミナを基材とし、主面に銅箔厚さ２００μｍのランドパターンを施した配線基板を用い、図１（ａ）および以下に示すように、９個（３０Ｘ1～3、３０Ｙ1～3、３０Ｚ1～3）の設置面が略矩形形状で、隣合う２辺の寸法が１０～２０ｍｍ程度の電子部品３０を配線基板１０の主面上に３列に各３個ずつ従来よりも狭い１ｍｍ間隔で配置し、各電子部品３０に付属する各リード３１を配線基板１０の主面上に形成された銅のランドパターンに半田を用いて接続した。
・１列目の電子部品（図中左側列）：３０Ｘ1、３０Ｘ2、３０Ｘ3
・２列目の電子部品（図中中央列）：３０Ｙ1、３０Ｙ2、３０Ｙ3
・３列目の電子部品（図中右側列）：３０Ｚ1、３０Ｚ2、３０Ｚ3
また、各列における各電子部品３０と配線基板１０との接続は下記Ｉ）～ＩＩ）の条件で行った。なお、Ｉ）～ＩＩ）の工程は条件により順番を変更しても特に問題はない。
Ｉ）１列目の電子部品３０Ｘ1～3および３列目の電子部品３０Ｚ1～3について
配線基板１０の主面との間隔が０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する
ＩＩ）２列目（図中中央列）の電子部品３０Ｙ1～3について
配線基板１０の主面との間隔を０．４ｍｍよりも長く、樹脂４０を注入するノズル７０の先端部が挿入できるように、他の電子部品３０に付属するリード３１の長さよりも長く設定し、配線基板１０に半田で接続した。 (1) Electronic component connection process Using a wiring board having a 1 mm thick alumina as a base material and a land pattern having a copper foil thickness of 200 μm on the main surface, as shown in FIG. On the main surface of thewiring board 10, an electronic component 30 having a substantially rectangular shape on the installation surface (30X 1 to 3 , 30Y 1 to 3 , 30Z 1 to 3 ) and the adjacent two sides of about 10 to 20 mm is provided. Three each in three rows are arranged at 1 mm intervals narrower than before, and each lead 31 attached to each electronic component 30 is connected to a copper land pattern formed on the main surface of the wiring board 10 using solder. .
-Electronic components in the first row (left column in the figure): 30X 1 , 30X 2 , 30X 3
Second-row electronic components (center row in the figure): 30Y 1 , 30Y 2 , 30Y 3
・ Electronic components in the third row (right column in the figure): 30Z 1 , 30Z 2 , 30Z 3
The connection between eachelectronic component 30 and the wiring board 10 in each row was performed under the following conditions I) to II). Note that there is no particular problem even if the order of steps I) to II) is changed depending on conditions.
I) About the electronic components 30X 1 to 3 in the first row and the electronic components 30Z 1 to 3 in the third row Each lead attached to theelectronic component 30 so that the distance from the main surface of the wiring board 10 is 0.4 mm. The length of 31 is arbitrarily set and connected to the wiring board 10 with solder. II) For the electronic components 30Y 1 to 3 in the second row (center row in the figure), the distance from the main surface of the wiring substrate 10 is 0.4 mm. It was set longer than the length of the lead 31 attached to the other electronic component 30 so that the tip of the nozzle 70 for injecting the resin 40 could be inserted, and connected to the wiring board 10 by soldering.
厚さ１ｍｍのアルミナを基材とし、主面に銅箔厚さ２００μｍのランドパターンを施した配線基板を用い、図１（ａ）および以下に示すように、９個（３０Ｘ1～3、３０Ｙ1～3、３０Ｚ1～3）の設置面が略矩形形状で、隣合う２辺の寸法が１０～２０ｍｍ程度の電子部品３０を配線基板１０の主面上に３列に各３個ずつ従来よりも狭い１ｍｍ間隔で配置し、各電子部品３０に付属する各リード３１を配線基板１０の主面上に形成された銅のランドパターンに半田を用いて接続した。
・１列目の電子部品（図中左側列）：３０Ｘ1、３０Ｘ2、３０Ｘ3
・２列目の電子部品（図中中央列）：３０Ｙ1、３０Ｙ2、３０Ｙ3
・３列目の電子部品（図中右側列）：３０Ｚ1、３０Ｚ2、３０Ｚ3
また、各列における各電子部品３０と配線基板１０との接続は下記Ｉ）～ＩＩ）の条件で行った。なお、Ｉ）～ＩＩ）の工程は条件により順番を変更しても特に問題はない。
Ｉ）１列目の電子部品３０Ｘ1～3および３列目の電子部品３０Ｚ1～3について
配線基板１０の主面との間隔が０．４ｍｍになるように、電子部品３０に付属する各リード３１の長さを任意に設定し、配線基板１０に半田で接続する
ＩＩ）２列目（図中中央列）の電子部品３０Ｙ1～3について
配線基板１０の主面との間隔を０．４ｍｍよりも長く、樹脂４０を注入するノズル７０の先端部が挿入できるように、他の電子部品３０に付属するリード３１の長さよりも長く設定し、配線基板１０に半田で接続した。 (1) Electronic component connection process Using a wiring board having a 1 mm thick alumina as a base material and a land pattern having a copper foil thickness of 200 μm on the main surface, as shown in FIG. On the main surface of the
-Electronic components in the first row (left column in the figure): 30X 1 , 30X 2 , 30X 3
Second-row electronic components (center row in the figure): 30Y 1 , 30Y 2 , 30Y 3
・ Electronic components in the third row (right column in the figure): 30Z 1 , 30Z 2 , 30Z 3
The connection between each
I) About the electronic components 30X 1 to 3 in the first row and the electronic components 30Z 1 to 3 in the third row Each lead attached to the
（２）樹脂注入工程
各電子部品３０を配線基板１０に半田で接続した後、配線基板１０をホットプレートにセットし、基板表面温度が９５℃になったところで、くの字またはＬ字に折り曲げた形状のノズル７０の先端部を、２列目（図中中央列）の中央に位置する電子部品３０Ｙ2と配線基板１０の主面との間隙の中央付近に挿入し、樹脂４０の注入量が所定量に到達するまで注入した。注入された樹脂４０は電子部品３０Ｙ2に付属するリードの周辺部に浸透するとともに、前記配線基板１０上を濡れ広がり、周辺の電子部品３０と配線基板１０の空隙およびリード３１に達し、毛細管現象や重力により部品の細部に浸透させた。このとき、樹脂４０の供給元となるノズル７０の先端部は、２列目（図中中央列）の中央に位置する電子部品３０Ｙ2の中央付近、すなわち配置された全電子部品３０の中央部に位置するため、周囲の電子部品３０に均等に広がって細部に浸透していった。このようにして配線基板１０を必要な温度、時間に保ち、樹脂４０を注入した後硬化させた。
本実施例で使用した樹脂４０の材質硬化条件を表５に示す。 (2) Resin injection step After eachelectronic component 30 is connected to the wiring board 10 by soldering, the wiring board 10 is set on a hot plate, and when the substrate surface temperature reaches 95 ° C., it is bent into a dogleg shape or an L shape. and the tip of the nozzle 70 of the shape, the second column was inserted near the center of the gap between the main surface of the electronic component 30Y 2 and the wiring board 10 located in the center of (in the figure the center column), the injection amount of the resin 40 Was injected until a predetermined amount was reached. The injected resin 40 penetrates into the peripheral portion of the lead attached to the electronic component 30Y 2 and wets and spreads on the wiring substrate 10 to reach the gap between the peripheral electronic component 30 and the wiring substrate 10 and the lead 31, thereby causing a capillary phenomenon. And infiltrated the details of the parts by gravity. At this time, the tip of the nozzle 70 as a source of resin 40, second column near the center of the electronic component 30Y 2 located in the center of (in the figure the center column), i.e. the central portion of the entire electronic component 30 placed Therefore, it spreads evenly to the surrounding electronic components 30 and penetrated into the details. In this way, the wiring board 10 was kept at a necessary temperature and time, and the resin 40 was injected and cured.
Table 5 shows the material curing conditions of theresin 40 used in this example.
各電子部品３０を配線基板１０に半田で接続した後、配線基板１０をホットプレートにセットし、基板表面温度が９５℃になったところで、くの字またはＬ字に折り曲げた形状のノズル７０の先端部を、２列目（図中中央列）の中央に位置する電子部品３０Ｙ2と配線基板１０の主面との間隙の中央付近に挿入し、樹脂４０の注入量が所定量に到達するまで注入した。注入された樹脂４０は電子部品３０Ｙ2に付属するリードの周辺部に浸透するとともに、前記配線基板１０上を濡れ広がり、周辺の電子部品３０と配線基板１０の空隙およびリード３１に達し、毛細管現象や重力により部品の細部に浸透させた。このとき、樹脂４０の供給元となるノズル７０の先端部は、２列目（図中中央列）の中央に位置する電子部品３０Ｙ2の中央付近、すなわち配置された全電子部品３０の中央部に位置するため、周囲の電子部品３０に均等に広がって細部に浸透していった。このようにして配線基板１０を必要な温度、時間に保ち、樹脂４０を注入した後硬化させた。
本実施例で使用した樹脂４０の材質硬化条件を表５に示す。 (2) Resin injection step After each
Table 5 shows the material curing conditions of the
その後、樹脂４０を覆うようにケース２０内に上記表５に示す封止樹脂６０を注入した。このとき、樹脂４０が注入された後の電子部品３０Ｙ2と配線基板１０との間隙の残空間は封止樹脂６０で満たした。その後、封止樹脂６０を硬化させて蓋２１を取り付け、蓋２１とケース２０を接着した。
Thereafter, the sealing resin 60 shown in Table 5 was injected into the case 20 so as to cover the resin 40. At this time, the remaining space in the gap between the electronic component 30Y 2 and the wiring substrate 10 after the resin 40 was injected was filled with the sealing resin 60. Thereafter, the sealing resin 60 was cured, the lid 21 was attached, and the lid 21 and the case 20 were bonded.
上記工程により作製した実装基板の２列目（図中中央列）に配置された電子部品３０Ｙ1～3について、配線基板との空隙に注入された樹脂中のボイドの発生の有無を検証した結果は以下のようであった。なお、本発明の検証は、前述と同様の方法で行った。比較例も前述と同様である。
本実施例では、各電子部品３０と配線基板１０との間隙にボイドおよび注入不良は認められず、樹脂４０の注入状況は良好であった。 Results of verifying the occurrence of voids in the resin injected into the gap between the electronic components 30Y 1 to 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process Was as follows. The verification of the present invention was performed by the same method as described above. The comparative example is the same as described above.
In this example, no voids and poor injection were observed in the gap between eachelectronic component 30 and the wiring board 10, and the injection state of the resin 40 was good.
本実施例では、各電子部品３０と配線基板１０との間隙にボイドおよび注入不良は認められず、樹脂４０の注入状況は良好であった。 Results of verifying the occurrence of voids in the resin injected into the gap between the electronic components 30Y 1 to 3 arranged in the second row (center row in the figure) of the mounting board produced by the above process Was as follows. The verification of the present invention was performed by the same method as described above. The comparative example is the same as described above.
In this example, no voids and poor injection were observed in the gap between each
このように、複数の電子部品の間に配置される電子部品は、配線基板との間隙の間隔を大きくし、ノズルを挿入して樹脂を注入したので、樹脂の注入が容易になるとともに、樹脂の注入時に電子部品と配線基板との間隙にボイドが生じる現象を防止し、樹脂を良好な状態で注入することができた。また、樹脂の注入部を最小限に抑えることができるようになるため、電子部品間を狭めた配置構成が可能となり、実装基板面積を従来よりも縮小することができた。
As described above, the electronic component arranged between the plurality of electronic components has a large gap with the wiring board, and the nozzle is inserted to inject the resin. This prevents the phenomenon that voids are generated in the gap between the electronic component and the wiring board when the resin is injected, and the resin can be injected in a good state. In addition, since the resin injection portion can be minimized, an arrangement configuration in which the electronic components are narrowed becomes possible, and the mounting substrate area can be reduced as compared with the conventional case.
上記の実装方法により、コイル、コンデンサ、および抵抗を配置してラインフィルタ機能を有する実装基板を構成することもでき、上記と同様の効果が得られる。また、発熱量の小さいコンデンサを配線基板との間隔が大きい電子部品として配置し、発熱量の比較的大きいコイルまたは抵抗を配線基板との間隔が小さい電子部品として配置することにより、コイルまたは抵抗のような発熱量の大きい電子部品が発熱して配線基板に伝導した熱がコンデンサのような発熱量の小さい電子部品に伝わりにくくなる。このように、電子部品および実装基板の寿命が延び信頼性の向上に寄与する効果を得ることもできる。
By the mounting method described above, a mounting substrate having a line filter function can be configured by arranging coils, capacitors, and resistors, and the same effects as described above can be obtained. In addition, a capacitor with a small amount of heat generation is disposed as an electronic component having a large distance from the wiring board, and a coil or resistor having a relatively large amount of heat generation is disposed as an electronic component having a small distance from the wiring board, thereby Such an electronic component having a large heat generation generates heat and the heat conducted to the wiring board is not easily transmitted to the electronic component having a small heat generation such as a capacitor. As described above, it is possible to obtain an effect of extending the lifetime of the electronic component and the mounting substrate and contributing to improvement of reliability.
一方、上記の実装方法により、ベアチップ部品が配線基板に実装された半導体装置を構成することもでき、上記と同様の効果が得られる。また、高温下で使用されるＳｉＣやＧａＮなどを用いた発熱量の大きい半導体チップが搭載される場合、周辺に配置されるその他の発熱量の小さい電子部品を配線基板との間隔が大きい電子部品として配置し、発熱量の大きい半導体チップを配線基板との間隔が小さい電子部品として配置する。これにより、半導体チップのような発熱量の大きい電子部品が発熱して配線基板に伝導した熱が発熱量の小さい周辺の電子部品に伝わりにくくなる。このように、電子部品および実装基板の寿命が延び信頼性の向上に寄与する効果を得ることもできる。
On the other hand, a semiconductor device in which bare chip components are mounted on a wiring board can also be configured by the above mounting method, and the same effect as described above can be obtained. In addition, when a semiconductor chip with a large amount of heat generated using SiC, GaN, or the like that is used at high temperatures is mounted, other electronic components with a small amount of heat generated in the periphery are electronic components with a large distance from the wiring board. The semiconductor chip having a large calorific value is arranged as an electronic component having a small distance from the wiring board. As a result, an electronic component having a large calorific value, such as a semiconductor chip, generates heat and the heat conducted to the wiring board is less likely to be transmitted to peripheral electronic components having a small calorific value. As described above, it is possible to obtain an effect of extending the lifetime of the electronic component and the mounting substrate and contributing to improvement of reliability.
以上のように、第１の実施形態および第２の実施形態では、超音波によるボイド観察を行う際、超音波の乱反射などの影響を防止するために材質が均一であるアルミナ製の配線基板を使用したが、配線基板の材質は一般的に使用されているガラスクロス強化のエポキシ樹脂、フェノール樹脂、ポリイミド樹脂、ビスマレイミド樹脂、紙基材のエポキシ樹脂、フェノール樹脂、ポリエステル樹脂、窒化ケイ素または窒化アルミニウムなどの各種セラミック、およびフレキシブルな基材であるポリイミドまたはポリエステル基材でも良い。
As described above, in the first embodiment and the second embodiment, when performing void observation with ultrasonic waves, an alumina wiring board having a uniform material is used to prevent the influence of irregular reflection of ultrasonic waves. Used, but the wiring board is made of glass cloth reinforced epoxy resin, phenol resin, polyimide resin, bismaleimide resin, paper base epoxy resin, phenol resin, polyester resin, silicon nitride or nitride Various ceramics such as aluminum and a polyimide or polyester base material which is a flexible base material may be used.
また、樹脂として室温における粘度が８Ｐａ・ｓ以下の、シリコーンゲルまたはエポキシ樹脂またはウレタン樹脂を用いたが、これは電子部品の底面に浸透する粘度のものであればシリコーンゴム、フェノール樹脂、アクリル樹脂または他の液状の熱硬化性樹脂であっても良い。
Also, a silicone gel, epoxy resin or urethane resin having a viscosity at room temperature of 8 Pa · s or less was used as the resin. Or other liquid thermosetting resins may be used.
また、封止樹脂としてシリコーンゴムを用いたが、シリコーンゲル、エポキシ樹脂、フェノール樹脂、アクリル樹脂または他の液状の熱硬化性樹脂であっても良い。なお、振動、外力、汚染物質への暴露などのストレスが小さい場合など、封止樹脂または蓋を省略することが可能な場合はなくても良い。
Further, although silicone rubber is used as the sealing resin, silicone gel, epoxy resin, phenol resin, acrylic resin, or other liquid thermosetting resin may be used. Note that the sealing resin or the lid may not be omitted when the stress such as vibration, external force, exposure to contaminants is small.
また、封止樹脂６０の注型は真空注型としても良いし、封止樹脂６０の流動性を高めるために、樹脂４０に悪影響を与えない範囲で、加熱して注型を行っても良い。
Moreover, the casting of the sealing resin 60 may be a vacuum casting, or in order to increase the fluidity of the sealing resin 60, the casting may be performed by heating within a range that does not adversely affect the resin 40. .
さらに、半田は高温半田などの各種半田、ナノ銀ペースト接合材または銀ロウなどの各種ロウ材を用いても良いことはいうまでもない。
Furthermore, it goes without saying that various kinds of solder such as high-temperature solder, various kinds of brazing materials such as nano silver paste bonding material or silver brazing may be used as the solder.
以上のように、絶縁封止作業工数の少ない簡素な構造において、小型高出力に対応可能で、電気絶縁特性および熱放散性の良好な信頼性の高い電子部品の実装方法を確立することができた。
As described above, it is possible to establish a highly reliable electronic component mounting method that is compatible with small and high output power with a simple structure with a small number of man-hours for insulation and sealing, and has good electrical insulation characteristics and heat dissipation. It was.
小型かつ大容量が要求される高電圧の電気機器、例えば高電圧インバータにおける高密度実装のフィルタ基板への適用等、幅広い用途に適用できる。
It can be applied to a wide range of applications, such as application to high-voltage electrical equipment that requires small size and large capacity, for example, high-density mounting filter substrates in high-voltage inverters.
１０ 配線基板
２０ ケース
２１ 蓋
３０ 電子部品
３１ リード
４０ 樹脂
５０ 接合材
６０ 封止樹脂
７０ ノズル 10Wiring Board 20 Case 21 Lid 30 Electronic Component 31 Lead 40 Resin 50 Bonding Material 60 Sealing Resin 70 Nozzle
２０ ケース
２１ 蓋
３０ 電子部品
３１ リード
４０ 樹脂
５０ 接合材
６０ 封止樹脂
７０ ノズル 10
Claims (8)
- 第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、
前記第１電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、
を備えた電子部品の実装方法であって、
前記第１電子部品および前記第２電子部品の各導電材を前記配線基板に半田により接続し、前記第３電子部品を接合材により前記配線基板に接合して、その導電材を前記配線基板に半田により接続する工程と、
前記第１電子部品と前記第３電子部品との間、および前記第２電子部品と前記第３電子部品との間から前記樹脂を注入する工程と、
を有することを特徴とする電子部品の実装方法。 A wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted;
A resin injected into a gap between the first electronic component and the wiring board, and the third electronic component and the wiring board;
An electronic component mounting method comprising:
The conductive materials of the first electronic component and the second electronic component are connected to the wiring board by soldering, the third electronic component is bonded to the wiring board by a bonding material, and the conductive material is attached to the wiring board. Connecting with solder;
Injecting the resin from between the first electronic component and the third electronic component and between the second electronic component and the third electronic component;
An electronic component mounting method characterized by comprising: - 前記接合材は、シリコーン樹脂、エポキシ樹脂、アクリル樹脂、ポリエステル樹脂をベースとした樹脂組成物、または、半田、ロウ材、ナノ銀ペーストのいずれかであることを特徴とする請求項１記載の電子部品の実装方法。 2. The electron according to claim 1, wherein the bonding material is a resin composition based on a silicone resin, an epoxy resin, an acrylic resin, or a polyester resin, or a solder, a brazing material, or a nano silver paste. Component mounting method.
- 前記接合材に含まれる充填材は、アルミナ、シリカ、窒化ホウ素、窒化ケイ素、窒化アルミニウム、または炭化ケイ素のいずれか少なくとも１つ以上を含むセラミック粉末、または、金、銀、銅、アルミニウム、または鉄のいずれか少なくとも１つ以上を含む金属粉末、または、炭素粉末、または、ガラス繊維、カーボン繊維、芳香族ポリアミド繊維、またはウイスカのいずれか少なくとも１つ以上を含む繊維のいずれか少なくとも１つ以上を含むことを特徴とする請求項１記載の電子部品の実装方法。 The filler contained in the bonding material is ceramic powder containing at least one of alumina, silica, boron nitride, silicon nitride, aluminum nitride, and silicon carbide, or gold, silver, copper, aluminum, or iron Any one or more of a metal powder containing at least one of the following: or a carbon powder, or a fiber containing at least one of glass fiber, carbon fiber, aromatic polyamide fiber, or whisker. The electronic component mounting method according to claim 1, further comprising:
- 第１電子部品と、第２電子部品と、前記第１部品と前記第２部品との間に近接配置された第３電子部品とが実装された配線基板と、
前記第１電子部品と前記配線基板、前記第２電子部品と前記配線基板、および前記第３電子部品と前記配線基板との間隙に注入された樹脂と、
を備えた電子部品の実装方法であって、
前記第１電子部品および前記第２電子部品の導電材、およびそれらの導電材よりも長い前記第３電子部品の導電材を前記配線基板に半田により接続する工程と、
ノズルを前記第３電子部品と前記配線基板との間隙に挿入して、前記樹脂を注入する工程と、
を有することを特徴とする電子部品の実装方法。 A wiring board on which a first electronic component, a second electronic component, and a third electronic component disposed close to each other between the first component and the second component are mounted;
Resin injected into a gap between the first electronic component and the wiring board, the second electronic component and the wiring board, and the third electronic component and the wiring board;
An electronic component mounting method comprising:
Connecting the conductive material of the first electronic component and the second electronic component, and the conductive material of the third electronic component longer than those conductive materials to the wiring board by soldering;
Inserting a nozzle into a gap between the third electronic component and the wiring board and injecting the resin;
An electronic component mounting method characterized by comprising: - 配線基板と、
前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有する電子部品群と、
前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、
前記中央電子部品は、接合材により前記配線基板に直接接合されたことを特徴とする電子機器。 A wiring board;
An electronic circuit having one central electronic component mounted in the center of the wiring board and arranged in the vicinity of three rows and three columns and eight peripheral electronic components mounted so as to surround the central electronic component. Parts group,
A resin injected into a gap between the peripheral electronic component and the wiring board;
The electronic apparatus, wherein the central electronic component is directly bonded to the wiring board by a bonding material. - 配線基板と、
前記配線基板上に３行３列に近接して配置され、その中央に実装された１個の中央電子部品と前記中央電子部品を包囲して実装された８個の周辺電子部品とを有し、前記中央電子部品および周辺電子部品がそれぞれ導電材を介して前記配線基板に接続された電子部品群と、
前記中央電子部品と前記配線基板、および前記周辺電子部品と前記配線基板との間隙に注入される樹脂と、を備え、
前記中央電子部品の導電材は、前記周辺電子部品の導電材よりも長く、前記中央電子部品と前記配線基板との間隙に前記樹脂を注入するノズルを挿入可能な間隔にしたことを特徴とする電子機器。 A wiring board;
There are one central electronic component mounted in the center of the wiring board in the vicinity of 3 rows and 3 columns, and eight peripheral electronic components mounted so as to surround the central electronic component. A group of electronic components in which the central electronic component and the peripheral electronic component are each connected to the wiring board via a conductive material;
The central electronic component and the wiring board, and the resin injected into the gap between the peripheral electronic component and the wiring board,
The conductive material of the central electronic component is longer than the conductive material of the peripheral electronic component, and has a spacing that allows insertion of the nozzle for injecting the resin into the gap between the central electronic component and the wiring board. Electronics. - 前記電子部品は、コイル、コンデンサ、および抵抗を有し、ラインフィルタ機能を有することを特徴とする請求項５または請求項６記載の電子機器。 The electronic device according to claim 5 or 6, wherein the electronic component includes a coil, a capacitor, and a resistor, and has a line filter function.
- 前記電子部品は、半導体チップ部品を有することを特徴とする請求項５または請求項６記載の電子機器。 The electronic device according to claim 5 or 6, wherein the electronic component includes a semiconductor chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012505538A JPWO2011114759A1 (en) | 2010-03-19 | 2011-01-07 | Electronic component mounting method and electronic apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-065082 | 2010-03-19 | ||
| JP2010065082 | 2010-03-19 |
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| WO2011114759A1 true WO2011114759A1 (en) | 2011-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2011/050183 WO2011114759A1 (en) | 2010-03-19 | 2011-01-07 | Method for mounting electronic components, and electronic device |
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| WO (1) | WO2011114759A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021524995A (en) * | 2018-05-30 | 2021-09-16 | 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． | Flexible substrate and its manufacturing method, flexible electronic device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008021933A (en) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | Board structure, and mobile terminal |
| JP2009135479A (en) * | 2007-11-01 | 2009-06-18 | Panasonic Corp | Mounted structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11233711A (en) * | 1998-02-06 | 1999-08-27 | Hitachi Ltd | Semiconductor device and its manufacture |
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- 2011-01-07 JP JP2012505538A patent/JPWO2011114759A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008021933A (en) * | 2006-07-14 | 2008-01-31 | Matsushita Electric Ind Co Ltd | Board structure, and mobile terminal |
| JP2009135479A (en) * | 2007-11-01 | 2009-06-18 | Panasonic Corp | Mounted structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021524995A (en) * | 2018-05-30 | 2021-09-16 | 京東方科技集團股▲ふん▼有限公司Ｂｏｅ Ｔｅｃｈｎｏｌｏｇｙ Ｇｒｏｕｐ Ｃｏ．，Ｌｔｄ． | Flexible substrate and its manufacturing method, flexible electronic device |
| JP7335169B2 (en) | 2018-05-30 | 2023-08-29 | 京東方科技集團股▲ふん▼有限公司 | FLEXIBLE SUBSTRATE AND MANUFACTURING METHOD THEREOF, FLEXIBLE ELECTRONIC DEVICE |
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